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MMBD4448HTM_08

MMBD4448HTM_08

  • 厂商:

    DIODES

  • 封装:

  • 描述:

    MMBD4448HTM_08 - SURFACE MOUNT FAST SWITCHING DIODE ARRAY - Diodes Incorporated

  • 数据手册
  • 价格&库存
MMBD4448HTM_08 数据手册
MMBD4448HTM SURFACE MOUNT FAST SWITCHING DIODE ARRAY Please click here to visit our online spice models database. Features • • • • • • Fast Switching Speed Ultra-Small Surface Mount Package For General Purpose Switching Applications High Conductance Lead Free/RoHS Compliant (Note 3) "Green" Device (Notes 4 and 5) Mechanical Data • • • • • • • • • SOT-26 Case: SOT-26 Case Material: Molded Plastic, "Green" Molding Compound, Note 5. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Copper leadframe). Orientation: See Diagram Marking Information: See Page 2 Ordering Information: See Page 2 Weight: 0.016 grams (approximate) TOP VIEW TOP VIEW Internal Schematic Maximum Ratings @TA = 25°C unless otherwise specified Symbol VRM VRRM VRWM VR VR(RMS) IFM IO @ t = 1.0μs @ t = 1.0s IFSM Value 100 80 57 500 250 4.0 2.0 Unit V V V mA mA A Characteristic Non-Repetitive Peak Reverse Voltage Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 1) Average Rectified Output Current (Note 1) Non-Repetitive Peak Forward Surge Current Thermal Characteristics Characteristic Power Dissipation (Note 1) Thermal Resistance Junction to Ambient Air (Note 1) Operating and Storage Temperature Range Symbol PD RθJA TJ , TSTG Value 350 357 -65 to +150 Unit mW °C/W °C Electrical Characteristics Characteristic Reverse Breakdown Voltage (Note 2) Forward Voltage @TA = 25°C unless otherwise specified Symbol V(BR)R VF Min 80 0.62 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Max ⎯ 0.72 0.855 1.0 1.25 100 50 30 25 3.5 4.0 Unit V V Test Condition IR = 2.5μA IF = 5.0mA IF = 10mA IF = 100mA IF = 150mA VR = 70V VR = 75V, TJ = 150°C VR = 25V, TJ = 150°C VR = 20V VR = 6, f = 1.0MHz VR = 6V, IF = 5mA Reverse Current (Note 2) Total Capacitance Reverse Recovery Time Notes: IR CT trr nA μA μA nA pF ns 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Short duration pulse test used to minimize self-heating effect. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants MMBD4448HTM Document number: DS30302 Rev. 7 - 2 1 of 3 www.diodes.com March 2008 © Diodes Incorporated MMBD4448HTM 300 1,000 IF, INSTANTANEOUS FORWARD CURRENT (mA) PD, POWER DISSIPATION (mW) 250 100 200 150 10 TA = -40ºC T A = 0ºC 100 1 TA = 25ºC T A = 75ºC TA = 125ºC 50 0 0 25 50 75 100 125 150 0.1 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve, Total Package 10,000 IR, INSTANTANEOUS REVERSE CURRENT (nA) 0.4 0.8 1.2 1.6 0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element 3 f = 1MHz 1,000 CT, TOTAL CAPACITANCE (pF) 2.5 2 100 1.5 10 1 1 0.5 0.1 0 60 80 100 20 40 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element 0 0 10 20 30 40 50 VR, DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element Ordering Information Part Number MMBD4448HTM-7-F Notes: (Notes 5 & 6) Case SOT-26 Packaging 3000/Tape & Reel 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information KAD = Product Type Marking Code YM = Date Code Marking Y =Year ex: T = 2006 M = Month ex: 9 = September KAD Date Code Key Year Code Month Code 2002 N Jan 1 2003 P Feb 2 2004 R Mar 3 2005 S Apr 4 YM 2006 T May 5 2007 U Jun 6 Jul 7 2008 V Aug 8 2009 W Sep 9 2010 X Oct O 2011 Y Nov N 2012 Z Dec D March 2008 MMBD4448HTM Document number: DS30302 Rev. 7 - 2 2 of 3 www.diodes.com © Diodes Incorporated MMBD4448HTM Package Outline Dimensions A TOP VIEW BC H K M J D F L SOT-26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D ⎯ ⎯ 0.95 F ⎯ ⎯ 0.55 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 0° 8° α ⎯ All Dimensions in mm Suggested Pad Layout E E Z G C Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C Y X E 2.40 0.95 IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. MMBD4448HTM Document number: DS30302 Rev. 7 - 2 3 of 3 www.diodes.com March 2008 © Diodes Incorporated
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