MMBD5004S-7

MMBD5004S HIGH VOLTAGE DUAL SWITCHING DIODE Features • • • • • Fast Switching Speed: 50ns Surface Mount Package Ideally Suited for Automated Insertion High Reverse Breakdown Voltage Rating: 400V Lead Free by Design/RoHS Compliant (Note 1) "Green" Device (Note 2) Mechanical Data • • • • • • Case: SOT23 Case Material: Molded Plastic. "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe. Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Weight: 0.008 grams (approximate) NEW PRODUCT SOT23 Top View Top View Internal Schematic Ordering Information (Note 3) Part Number MMBD5004S-7 Notes: Case SOT23 Packaging 3000/Tape & Reel 1. No purposefully added lead. 2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information KJB KJB = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September) Date Code Key Year Code Month Code 2010 X Jan 1 Feb 2 2011 Y Mar 3 2012 Z Apr 4 May 5 YW 2013 A Jun 6 2014 B Jul 7 Aug 8 2015 C Sep 9 2016 D Oct O Nov N 2017 E Dec D MMBD5004S Document number: DS30832 Rev. 8 - 2 1 of 4 www.diodes.com May 2011 © Diodes Incorporated MMBD5004S Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Repetitive Peak Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 4) Peak Repetitive Forward Current (Note 4) Non-Repetitive Peak Forward Surge Current Symbol VRRM VRWM VR VR(RMS) IF IFRM @ t = 1.0μs @ t = 1.0ms IFSM Value 400 350 247 300 625 5 3 Unit V V V mA mA A NEW PRODUCT Thermal Characteristics Characteristic Power Dissipation (Note 4) (See figure 1) Thermal Resistance Junction to Ambient Air (Note 4) Operating and Storage Temperature Range Symbol PD RθJA TJ , TSTG Value 350 357 -55 to +150 Unit mW °C/W °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Reverse Breakdown Voltage (Note 5) Forward Voltage Reverse Current (Note 5) Total Capacitance Reverse Recovery Time Notes: Symbol V(BR)R VF IR CT trr Min 400 ⎯ ⎯ ⎯ ⎯ Typ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 0.65 ⎯ Max ⎯ 0.9 1.05 1.275 150 5 Unit V V nA μA 2.0 50 pF ns Test Condition IR = 150μA IF = 20mA IF = 100mA IF = 200mA VR = 240V VR = 360V VR = 0V, f = 1.0MHz IF = IR = 30mA, Irr = 3.0mA, RL = 100Ω 4. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com. 5. Short duration pulse test used to minimize self-heating effect. 400 IF, INSTANTANEOUS FORWARD CURRENT (mA) 500 1,000 PD, POWER DISSIPATION (mW) 100 300 T J = 150° C 10 TJ = 125° C TJ = 85° C 200 1 TJ = 25° C TJ = -55° C 100 0 0 30 60 90 120 150 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve, Total Package 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element MMBD5004S Document number: DS30832 Rev. 8 - 2 2 of 4 www.diodes.com May 2011 © Diodes Incorporated MMBD5004S IR, INSTANTANEOUS REVERSE CURRENT (µA) 1,000 0.62 100 CT, TOTAL CAPACITANCE (pF) TJ = 150° C 0.59 10 TJ = 125° C 1 TJ = 85° C 0.56 NEW PRODUCT 0.1 TJ = 25° C 0.53 0.01 0.001 TJ = -55° C 0 50 100 150 200 250 300 350 400 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element 0.50 0.1 1 10 VR, DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element 100 Package Outline Dimensions A BC H K D J F G L M K1 SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.903 1.10 1.00 K1 0.400 L 0.45 0.61 0.55 M 0.085 0.18 0.11 0° 8° α All Dimensions in mm Suggested Pad Layout Y Z C Dimensions Value (in mm) Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35 X E MMBD5004S Document number: DS30832 Rev. 8 - 2 3 of 4 www.diodes.com May 2011 © Diodes Incorporated MMBD5004S IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com NEW PRODUCT MMBD5004S Document number: DS30832 Rev. 8 - 2 4 of 4 www.diodes.com May 2011 © Diodes Incorporated