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S2J

S2J

  • 厂商:

    DIODES

  • 封装:

  • 描述:

    S2J - 1.5A SURFACE MOUNT GLASS PASSIVATED RECTIFIER - Diodes Incorporated

  • 详情介绍
  • 数据手册
  • 价格&库存
S2J 数据手册
S2A/A - S2M/A 1.5A SURFACE MOUNT GLASS PASSIVATED RECTIFIER Features · · · · Glass Passivated Die Construction Low Forward Voltage Drop and High Current Capability Surge Overload Rating to 50A Peak Ideally Suited for Automated Assembly A SMA SMB Min 3.30 4.06 1.96 0.15 5.00 0.10 0.76 2.00 Max 3.94 4.57 2.21 0.31 5.59 0.20 1.52 2.62 B Dim A B Min 2.29 4.00 1.27 0.15 4.80 0.10 0.76 2.01 Max 2.92 4.60 1.63 0.31 5.59 0.20 1.52 2.62 Mechanical Data · · · · · · · Case: Molded Plastic Case Material - UL Flammability Rating Classification 94V-0 Terminals: Solder Plated Terminal Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Approx. Weight: SMA 0.064 grams SMB 0.093 grams Marking: Type Number, See Page 2 Ordering Information: See Page 2 C C D E D J G H J H G E All Dimensions in mm A Suffix Designates SMA Package No Suffix Designates SMB Package Maximum Ratings and Electrical Characteristics Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current @ TT = 100°C Non-Repetitive Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Forward Voltage Peak Reverse Current at Rated DC Blocking Voltage Typical Total Capacitance (Note 1) Typical Thermal Resistance, Junction to Terminal (Note 2) Operating and Storage Temperature Range Notes: @ IF = 1.5A @TA = 25°C @TA = 125°C Symbol VRRM VRWM VR VR(RMS) I(AV) IFSM VFM IRM CT RqJT Tj, TSTG S2 A/AA 50 35 @TA = 25°C unless otherwise specified S2 B/BA 100 70 S2 D/DA 200 140 S2 G/GA 400 280 1.5 50 1.15 5.0 125 20 20 -65 to +150 S2 J/JA 600 420 S2 K/KA 800 560 S2 M/MA 1000 700 Unit V V A A V µA pF °C/W °C 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC. 2. Thermal Resistance Junction to Terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink. DS16004 Rev. 7 - 2 1 of 2 S2A/A - S2M/A Ordering Information Device* S2xA-7 S2x-7 (Note 3) Packaging SMA SMB Shipping 5000/Tape & Reel 3000/Tape & Reel Notes: 3. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. * x = Device type, e.g. S2AA-7 (SMA package); S2A-7 (SMB package). Marking Information YWW XXX(X) XXX = Product type marking code, ex: S2A (SMB package) XXXX = Product type marking code, ex: S2AA (SMA package) = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year ex: 2 for 2002 WW = Week code 01 to 52 1.5 IF, INSTANTANEOUS FORWARD CURRENT (A) 10 IAV, AVERAGE FORWARD CURRENT (A) 1.2 0.9 1.0 0.6 0.1 0.3 Resistive or inductive load Tj = 25°C IF PULSE WIDTH = 300 µS 0 0.01 0.5 0.7 0.9 1.1 1.3 1.5 20 40 60 80 100 120 140 160 TT, TERMINAL TEMPERATURE (ºC) Fig. 1 Forward Current Derating Curve VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics IR, INSTANTANEOUS REVERSE CURRENT (µA) 1000 IFSM, PEAK FORWARD SURGE CURRENT (A) 60 Single Half-Sine-Wave JEDEC Method 50 100 Tj = 125°C 40 10 30 1.0 20 0.1 Tj = 25°C 10 0 1 10 100 0.01 0 20 40 60 80 100 120 140 NUMBER OF CYCLES AT 60 Hz Fig. 3 Forward Surge Current Derating Curve DS16004 Rev. 7 - 2 2 of 2 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 4 Typical Reverse Characteristics S2A/A - S2M/A
S2J
1. 物料型号: - S2A/A - S2M/A - 器件型号如:S2AA-7(SMA封装),S2A-7(SMB封装)

2. 器件简介: - 1.5A表面贴装玻璃钝化整流器 - 特点包括玻璃钝化芯片结构、低正向电压降和高电流能力、承受50A峰值的浪涌过载能力、适合自动化装配。

3. 引脚分配: - 极性:阴极带或阴极缺口

4. 参数特性: - 峰值重复反向电压:50V至1000V不等 - 工作峰值反向电压:50V至1000V不等 - 直流阻断电压:50V至1000V不等 - 均方根反向电压:35V至700V不等 - 平均整流输出电流:1.5A - 非重复峰值正向浪涌电流:50A - 正向电压@I=1.5A:1.15V - 25°C时额定直流阻断电压下的峰值反向电流:5.0A - 典型总电容:20pF - 典型热阻,结到终端:20°C/W - 工作和存储温度范围:-65至+150°C

5. 功能详解: - 单相、半波、60Hz、电阻性或感性负载。 - 对于容性负载,电流需降低20%。

6. 应用信息: - 适用于需要高电流能力和低正向电压降的应用场合,如电源整流等。

7. 封装信息: - 封装类型:SMA和SMB - 重量:SMA约0.064克,SMB约0.093克 - 尺寸数据详细列出了SMA和SMB封装的各个维度。

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