S3J

S3A/B - S3M/B 3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER Features · · · · · · · · · · · · Glass Passivated Die Construction Low Forward Voltage Drop and High Current Capability Surge Overload Rating to 100A Peak Ideally Suited for Automatic Assembly A B Dim A SMB Min 3.30 4.06 1.96 0.15 5.00 0.10 0.76 2.00 Max 3.94 4.57 2.21 0.31 5.59 0.20 1.52 2.62 SMC Min 5.59 6.60 2.75 0.15 7.75 0.10 0.76 2.00 Max 6.22 7.11 3.18 0.31 8.13 0.20 1.52 2.62 Mechanical Data Case: Molded Plastic Case Material - UL Flammability Rating Classification 94V-0 Moisture sensitivity: Level 1 per J-STD-020A Terminals: Solder Plated Terminal - Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Weight: SMB 0.093 grams (approx) SMC 0.21 grams (approx) Marking: Type Number & Date Code, See Page 2 Ordering Information: See Page 2 C B C D D J E G H H G E J All Dimensions in mm AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package A, B, D, G, J, K, M Designates SMC Package Maximum Ratings and Electrical Characteristics Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. S3 A/AB 50 30 @ TA = 25°C unless otherwise specified Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current @TT = 75°C Non-Repetitive Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Forward Voltage Peak Reverse Current at Rated DC Blocking Voltage Typical Total Capacitance (Note 1) Typical Thermal Resistance Junction to Terminal (Note 2) Operating and Storage Temperature Range @ IF = 3.0A @TA = 25°C @ TA = 125 °C Symbo VRRM VRWM VR VR(RMS) IO IFSM VFM IRM CT RqJT Tj, TSTG S3 B/BB 100 70 S3 D/DB 200 140 S3 G/GB 400 280 3.0 100 1.15 10 250 40 10 -65 to +150 S3 J/JB 600 420 S3 K/KB 800 560 S3 M/MB 1000 700 Unit V V A A V µA pF °C/W °C Notes: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC. 2. Thermal resistance: Junction to Terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink. DS16005 Rev. 8 - 2 1 of 2 S3A/B-S3M/B Ordering Information Device* S3xB-13 S3x-13 (Note 3) Packaging SMB SMC Shipping 3000/Tape & Reel Notes: 3. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. *x = Device type, e.g. S3AB-13 (SMB package); S3A-13 (SMC Package). Marking Information YWW XXXX 3 .0 XXXX = Product type marking code, ex. ES1A = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year ex: 2 for 2002 WW = Week code 01 to 52 IF, INSTANTANEOUS FORWARD CURRENT (A) IAV, AVERAGE FORWARD CURRENT (A) Resistive or Inductive Load 10 2.5 2.0 1.0 1.5 1.0 0.1 0.5 0 25 50 75 100 125 150 IF PULSE WIDTH = 300 µS 0.01 0 0.4 0.8 1.2 1.6 2.0 TT, TERMINAL TEMPERATURE (ºC) Fig. 1 Forward Current Derating Curve VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics IR, INSTANTANEOUS REVERSE CURRENT (µA) 1000 120 IFSM, PEAK FORWARD SURGE CURRENT (A) Single Half-Sine-Wave JEDEC Method 100 100 Tj = 125°C 80 10 60 1.0 Tj = 25°C 40 20 0.1 0.01 0 20 40 60 80 100 120 140 0 1 10 NUMBER OF CYCLES AT 60 Hz Fig. 3 Forward Surge Current Derating Curve 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 4 Typical Reverse Characteristics DS16005 Rev. 8 - 2 2 of 2 S3A/B-S3M/B