SBR3M30P1

SBR3M30P1 3.0A SBR® Surface Mount Super Barrier Rectifier PowerDI™123 Features • • • • • • • • • • • • Ultra Low Leakage Current Excellent High Temperature Stability Superior Reverse Avalanche Capability Patented Interlocking Clip Design for High Surge Current Capacity Patented Super Barrier Rectifier Technology Soft, Fast Switching Capability 175ºC Operating Junction Temperature ±16KV ESD Protection (HBM, 3B) ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge) Lead Free Finish, RoHS Compliant (Note 1) “Green” Molding Compound (No Br, Sb) Qualified to AEC-Q 101 Standards for High Reliability Mechanical Data • • • • • • • Case: PowerDI™123 Case Material: Molded Plastic, “Green” Molding compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Polarity Indicator: Cathode Band Terminals: Matte Tin Finish annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 Marking Information: See Page 4 Ordering Information: See Page 4 Maximum Ratings @ TA = 25ºC unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current (See Figure 1) Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load Non-Repetitive Avalanche Energy (TJ = 25°C, IAS = 5A, L = 8.5 mH) Repetitive Peak Avalanche Energy (1µs, 25°C) Maximum Thermal Resistance Thermal Resistance Junction to Soldering (Note 2) Thermal Resistance Junction to Ambient (Note 3) Thermal Resistance Junction to Ambient (Note 4) Operating and Storage Temperature Range Notes: Symbol VRRM VRWM VRM VR(RMS) IO IFSM EAS PARM RӨJS RӨJA TJ, TSTG Value 30 21 3.0 75 105 1100 5 183 125 -65 to +175 Unit V V A A mJ W °C/W ºC 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7. 2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction. 3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. 4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf __________ SBR is a registered trademark of Diodes Incorporated. PowerDI is a trademark of Diodes Incorporated. SBR3M30P1 Rev. 4 - 2 1 of 4 www.diodes.com January 2007 © Diodes Incorporated . SBR3M30P1 Electrical Characteristics @ TA = 25ºC unless otherwise specified Characteristic Reverse Breakdown Voltage (Note 5) Symbol V(BR)R Min 30 Typ 0.26 0.37 0.46 0.16 0.29 0.42 8.5 19 1.7 3.1 Max 0.30 0.41 0.50 0.19 0.32 0.45 100 200 15 20 Unit V Test Condition IR = 250 µA IF = 0.1A, TJ = 25ºC IF = 1.0A,TJ = 25ºC IF = 3.0A,TJ = 25ºC IF = 0.1A, TJ = 125ºC IF = 1.0A,TJ = 125ºC IF = 3.0A,TJ = 125ºC VR = 5V, TJ = 25 ºC VR = 30V, TJ = 25 ºC VR = 5V, TJ = 125 ºC VR = 30V, TJ = 125 ºC Forward Voltage Drop VF V Leakage Current (Note 5) IR - µA µA mA mA Notes: 5. Short duration pulse test used to minimize self-heating effect. SBR3M30P1 Rev. 4 - 2 2 of 4 www.diodes.com January 2007 © Diodes Incorporated SBR3M30P1 Package Outline Drawings PowerDI™123 PowerDI™123 Dim A B C D E H L L1 L2 L3 L4 Min 3.65 Max 3.75 Typ 3.70 2.80 2.775 2.825 1.750 1.800 1.775 0.955 1.000 0.95 0.15 0.60 — — — 0.95 1.05 0.25 0.70 — — — 1.25 0.98 1.00 0.20 0.65 1.36 1.10 0.20 1.05 All Dimensions in mm SBR3M30P1 Rev. 4 - 2 3 of 4 www.diodes.com January 2007 © Diodes Incorporated SBR3M30P1 Marking, Polarity, Weight & Ordering Information Case Style Marking Weight SBR3M30P1 3M3 Top View Back View 0.096g (approx.) Ordering Information SBR3M30P1-7 3000/Tape & Reel Date Code 3M3 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September) Date Code Key 2006 Year T Code Month Code Jan 1 2007 U Feb 2 Mar 3 2008 V Apr 4 May 5 2009 W Jun 6 Jul 7 2010 X Aug 8 Sep 9 2011 Y Oct O Nov N 2012 Z Dec D IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. SBR3M30P1 Rev. 4 - 2 4 of 4 www.diodes.com January 2007 © Diodes Incorporated