SDM10K45_10

SDM10K45 SURFACE MOUNT SCHOTTKY BARRIER DIODE Features • • • • • • Fast Switching Speed Ultra-Small Surface Mount Package For General Purpose Switching Applications High Conductance Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 3 and 4) Qualified to AEC-Q101 Standards for High Reliability Mechanical Data • • • • • • • • Case: SOD-323 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating).Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Marking Information: See Page 2 Ordering Information: See Page 2 Weight: 0.006 grams (approximate) Top View Maximum Ratings @TA = 25°C unless otherwise specified Symbol VRRM VRWM VR VR(RMS) IFM IFSM Value 45 40 100 1.0 Unit V V mA A Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 1) Forward Surge Current @ t < 8.3ms Thermal Characteristics Characteristic Power Dissipation (Note 1) Thermal Resistance Junction to Ambient Air (Note 1) Operating and Storage Temperature Range (Note 5) Symbol PD RθJA TJ, TSTG Value 200 500 -40 to +150 Unit mW °C/W °C Electrical Characteristics Characteristic Reverse Breakdown Voltage (Note 2) Forward Voltage Reverse Leakage Current (Note 2) Total Capacitance Notes: @TA = 25°C unless otherwise specified Symbol V(BR)R VF IR CT Min 45 ⎯ ⎯ ⎯ Typ ⎯ 370 0.07 6.0 Max ⎯ 450 1.0 ⎯ Unit ⎯ mV μA pF Test Condition IR = 100μA IF = 10mA VR = 10V VR = 10V, f = 1.0MHz 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf 2. Short duration pulse test used to minimize self-heating effect. 3. No purposefully added lead. Halogen and Antimony Free. 4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RθJA SDM10K45 Document number: DS30256 Rev. 15 - 2 1 of 4 www.diodes.com June 2010 © Diodes Incorporated SDM10K45 IF, INSTANTANEOUS FORWARD CURRENT (mA) 100 IO, AVERAGE RECTIFIED CURRENT (mA) 100 TA = 125ºC 80 TA = 75ºC 10 TA = 25ºC 60 40 1.0 TA = -25ºC 20 TJ = 150° C 0 0.1 0 200 400 600 800 1.0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (° C) Fig. 1 Forward Current Derating Curve 1000 100 100 10 CT, TOTAL CAPACITANCE (pF) 0 10 20 30 40 10 1.0 0.1 0.01 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics 1.0 0 5.0 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage Ordering Information (Note 6) Part Number SDM10K45-7-F Notes: Case SOD-323 Packaging 3000/Tape & Reel 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information LG LG = Product Type Marking Code Cathode band denotes polarity SDM10K45 Document number: DS30256 Rev. 15 - 2 2 of 4 www.diodes.com June 2010 © Diodes Incorporated SDM10K45 Package Outline Dimensions C H B A M L K J SOD-323 Dim Min Max A 0.25 0.35 B 1.20 1.40 C 2.30 2.70 H 1.60 1.80 J 0.00 0.10 K 1.0 1.1 L 0.20 0.40 M 0.10 0.15 0° 8° α All Dimensions in mm Suggested Pad Layout C X Dimensions Value (in mm) Z 3.75 G 1.05 X 0.65 Y 1.35 C 2.40 Y G Z SDM10K45 Document number: DS30256 Rev. 15 - 2 3 of 4 www.diodes.com June 2010 © Diodes Incorporated SDM10K45 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2010, Diodes Incorporated www.diodes.com SDM10K45 Document number: DS30256 Rev. 15 - 2 4 of 4 www.diodes.com June 2010 © Diodes Incorporated