SUGGESTED PAD LAYOUT
Based on IPC-7351A
DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC
C
X
Y
G Z
Dimensions Z G X Y C
DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5
MELF 6.3 3.3 2.7 1.5 4.8
SOD-123 4.9 2.5 0.7 1.2 3.7
SOD-323 3.75 1.05 0.65 1.35 2.40
SOD-523 2.3 1.1 0.8 0.6 1.7
SMA 6.5 1.5 1.7 2.5 4.0
SMB 6.8 1.8 2.3 2.5 4.3
SMC 9.4 4.4 3.3 2.5 6.8
DFN1006-3 / DFN1006H4-3
C X1 X G2
G1 Y Z
Dimensions Z G1 G2 X X1 Y C
Value (in mm) 1.1 0.3 0.2 0.7 0.25 0.4 0.7
DFN1411-3
C
X2 X1 G2 X
Y Z
G1
Dimensions Z G1 G2 X X1 X2 Y C
Value (in mm) 1.38 0.15 0.15 0.95 0.75 0.40 0.75 0.76
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 1 of 12 www.diodes.com Suggested Pad Layout
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DFN1612-6 / DFN1310H4-6
G2 X2 Y2 G1 b Y1
G3
a
X1
Dimensions G1 G2 G3 X1 X2 Y1 Y2 a b
DFN1612-6 0.15 0.175 0.15 0.60 0.25 0.65 0.45 0.10 0.15
DFN1310H4-6 0.16 0.17 0.15 0.52 0.20 0.52 0.375 0.09 0.06
DFN1616-6
Y X2 G X1 C X2 a G2
DFN1616-8
Dimensions Value (in mm) Z 1.3 G 0.175 X1 0.50 X2 0.525 Y 0.30 C 0.50
Y2
Y1
G1
Dimensions Value (in mm) G1 0.15 G2 0.20 X1 0.65 X2 0.25 Y1 1.25 Y2 0.50 C 0.40 a 0.10
Z
X1
C
DFN2018-6
X Y C
Y1
G
Dimensions C G X X1 Y Y1
Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 2 of 12 www.diodes.com Suggested Pad Layout
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DFN2020-3 Dimensions C G X X1 X2 X3 Y Y1 Y2 Y3 Y4 R1 R2 R3 Value (in mm) 1.00 0.15 1.40 0.35 0.45 0.322 1.10 0.60 0.45 0.45 0.698 0.225 0.05 0.20
DFN2020B-3
X X2 Y3 Y4 R3 G Y1 X1 C Y2 X3 R2 Y R1
X Y1
Y
G
X1 Y2 C
Dimensions C G X X1 Y Y1 Y2
Value (in mm) 1.30 0.24 0.35 1.52 1.09 0.47 0.50
DFN2020-6
Y X2 C G Y C
DFN2020B-6
X1
G Y Z
Dimensions Value (in mm) Z 1.67 G 0.15 X1 0.90 X2 0.45 Y 0.37 C 0.65
X2 G1
G
X1
G Y1 Z
Dimensions Value (in mm) Z 1.67 G 0.20 G1 0.40 X1 1.0 X2 0.45 Y 0.37 Y1 0.70 C 0.65
DFN3020B-8
C X Y1 G Y2 Y G1
X1
Dimensions C G G1 X X1 Y Y1 Y2
Value (in mm) 0.650 0.285 0.090 0.400 1.120 0.730 0.500 0.365
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 3 of 12 www.diodes.com Suggested Pad Layout
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DFN3030-4 Dimensions C G1 G2 G3 G4 G5 G6 G7 G8 R X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 1.300 0.100 0.150 0.830 0.115 0.135 0.170 0.500 0.500 0.150 0.500 1.375 1.225 1.175 1.980 1.015 0.715 0.650
DFN3030-8
C Y3 (2x) G4 X3
G6 G1 R Y G2
Z
Y2
G3
X1
Y1 G7
G5 X2 X1 G8
X2 Y C
Dimensions Value (in mm) Z 2.59 G 0.11 X1 2.49 X2 0.65 Y 0.39 C 0.65
G
X (4x)
DFN3030E-8
X (x8) Y (x8) C
Y1
Y2
Dimensions C C1 X Y Y1 Y2
Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75
C1
DFN3030-10
Y C X1 G
Y C
DFN3030-12
X
G Z
Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.30 C 0.50
X1 G
X
G
Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.28 C 0.45
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 4 of 12 www.diodes.com Suggested Pad Layout
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DFN5020-6
Y X X1 C Y2 Y3 X2 G
Dimensions Value (in mm) C 0.50 G 0.35 X 0.35 X1 0.90 X2 1.80 Y 0.70 Y2 1.60 Y3 3.20
DF-S / MiniDIP
X
X
MSOP-8L
Z
Dimensions DF-S MiniDIP Z 10.26 6.91 X 1.2 0.60 Y 1.52 0.76 C 5.2 2.67
Y
C1 C2
Dimensions Value (in mm) X 0.45 Y 1.4 C1 4.4 C2 0.65
Y C
MSOP-8L-EP
MSOP-10L
X X1 Y1 C1
C2 Y
Dimensions Value (in mm) C1 4.2 C2 0.65 X 0.32 X1 1.95 Y 0.8 Y1 1.65
Y
X
C1
Dimensions X Y C1 C2
Value (in mm) 0.30 1.4 4.4 0.50
C2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 5 of 12 www.diodes.com Suggested Pad Layout
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PowerDI 5
X
®
PowerDI 123 / PowerDI 323
®
®
Y
X1
G
X2
Y2
X1 (2x) Y1 (2x) C
Y1
G
Dimensions C G X X1 Y Y1
Value (in mm) 1.840 0.852 3.360 1.390 4.860 1.400
Dimensions G X1 X2 Y1 Y2
PowerDI 123 1.0 2.2 0.9 1.4 1.4
®
PowerDI 323 0.5 2.0 0.8 0.8 1.1
®
PowerDI3333-8
X G
PowerDI5060-8
X Y2
8 Y2 G1
5 Y1 Y
Y1 Y
X1
1 Y3 X2 C
4
G1 C Y3 (4x) X2 (8x) G
Dimensions C G G1 Y Y1 Y2 Y3 X X2
Value (in mm) 0.650 0.230 0.420 3.700 2.250 1.850 0.700 2.370 0.420
Dimensions C G G1 X X1 X2 Y Y1 Y2 Y3
Value (in mm) 1.270 0.660 0.820 4.420 4.100 0.610 6.610 3.810 1.020 1.270
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 6 of 12 www.diodes.com Suggested Pad Layout
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SM-8
X
Y (8x) C1 Y1
SO-8
Dimensions C C1 X Y Y1
C
Value (in mm) 1.52 4.6 0.95 2.80 6.80
Y
C1 C2
Dimensions Value (in mm) X 0.60 Y 1.55 C1 5.4 C2 1.27
X (8x)
SOD-323F
X1
Y (2x)
Dimensions Value (in mm) X 0.710 X1 2.700 Y 0.403
X (2x)
SOP-14L
X
C1 C2 Y
Dimensions Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27
SOP-16L
X
C1 C2 Y
Dimensions X Y C1 C2
Value (in mm) 0.60 1.50 5.4 1.27
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 7 of 12 www.diodes.com Suggested Pad Layout
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SOT-143
X
SOT-223
X1 Y1
X2 Y G
Z
C
C1
Y2
X1 X2
C2 X2
Dimensions Z G X X1 X2 Y C
Value (in mm) 2.70 1.30 2.50 1.0 0.60 0.70 2.0
Dimensions X1 X2 Y1 Y2 C1 C2
Value (in mm) 3.3 1.2 1.6 1.6 6.4 2.3
SOT-523 / SOT-323 / SOT23 / SC-59
Y
Z
C
X
E
Dimensions Z X Y C E
SOT-523 1.8 0.4 0.51 1.3 0.7
SOT-323 2.8 0.7 0.9 1.9 1.0
SOT23 2.9 0.8 0.9 2.0 1.35
SC-59 3.4 0.8 1.0 2.4 1.35
SOT-23F
C
Y1
Y (3x)
Dimensions Value (in mm) C 0.95 X 0.60 Y 0.80 Y1 1.80
X (3x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 8 of 12 www.diodes.com Suggested Pad Layout
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SC-74R / SOT-26 / SOT-363 / SOT-563
C2 C2
SOT-25 / SOT-353
C2 C2
Z
G
C1
Z
G
C1
Y X
Y X
Dimensions Z G X Y C1 C2
SC-74R / SOT-26 3.20 1.60 0.55 0.80 2.40 0.95
SOT-363 2.5 1.3 0.42 0.6 1.9 0.65
SOT-563 2.2 1.2 0.375 0.5 1.7 0.5
Dimensions Z G X Y C1 C2
SOT-25 3.20 1.60 0.55 0.80 2.40 0.95
SOT-353 2.5 1.3 0.42 0.6 1.9 0.65
SOT-666
C Y (6x)
G
Dimensions Value (in mm) C 0.50 G 0.80 X 0.35 Y 0.50
X (6x)
SOT-953
C C
Y1
Y (5X)
Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100
X (5X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 9 of 12 www.diodes.com Suggested Pad Layout
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SOT-963
C C
Y1
Y (6X)
Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100
X (6X)
SOT89-3L
X1
SOT89-5L
X1
X2 (2x) Y1 Y3 Y Y2 C X (3x) Y4
Dimensions Value (in mm) X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500
Y4
Y1 X2 Y2 X3 C Y3
Dimensions Value (in mm) X1 1.7 X2 0.55 X3 0.4 Y1 4.6 Y2 1.2 Y3 0.5 Y4 1.1 C 3.0
TO252-3L (DPAK) / TO263-3L (D PAK)
X2
2
Dimensions
Y2 C Y1 Z
Z X1 X2 Y1 Y2 C E1
TO252-3L / DPAK 11.6 1.5 7.0 2.5 7.0 6.9 2.3
TO263-3L / 2 D PAK 16.9 1.1 10.8 3.5 11.4 9.5 2.5
X1
E1
TO252-4L
X1
Y1 Y2 c1 Y3 Y X (4x) c
Dimensions c c1 X X1 Y Y1 Y2 Y3
Value (in mm) 1.27 2.54 1.00 5.73 2.00 6.17 1.64 2.66
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 10 of 12 www.diodes.com Suggested Pad Layout
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TO252-5L
X
TO263-5L
X
Y1 Y Y C1
Y1
Y2 X1 C2
Y2 X1 C
Dimensions X X1 Y Y1 Y2 C1 C2
Value (in mm) 5.6 0.6 11.0 5.6 2.0 7.2 1.27
Dimensions X X1 Y Y1 Y2 C
Value (in mm) 10.9 1.05 15.7 9.1 2.5 1.7
TSOT23-5
C C
Y1
Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199
Y (5x) X (5x)
TSOT23-6
C C
Y1
Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199
Y (6x) X (6x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 11 of 12 www.diodes.com Suggested Pad Layout
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TSSOP-14L
X
C1 C2 Y
Dimensions Value (in mm) X 0.45 Y 1.45 C1 5.9 C2 0.65
WL-CSD1010H6-4
ØD
C
Dimensions C D
Value (in mm) 0.50 0.25
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 38 12 of 12 www.diodes.com Suggested Pad Layout
© Diodes Incorporated
