SUGGESTED PAD LAYOUT
Based on IPC-7351A
X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC
C
X
Y
G Z
Dimensions Z G X Y C
X1-DFN1006-2 / MiniMELF X2-DFN1006-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5
MELF 6.3 3.3 2.7 1.5 4.8
SOD123 4.9 2.5 0.7 1.2 3.7
SOD323 3.75 1.05 0.65 1.35 2.40
SOD523 2.3 1.1 0.8 0.6 1.7
SMA 6.5 1.5 1.7 2.5 4.0
SMB 6.8 1.8 2.3 2.5 4.3
SMC 9.4 4.4 3.3 2.5 6.8
X3-DFN0603-2
Z C
X1-DFN1006-3 / X2-DFN1006-3
C X1 X G2
Y (2x)
Dimensions Value (in mm) C 0.355 X 0.230 Y 0.300 Z 0.610
G1 Y
X (2x)
Dimensions Value (in mm) Z 1.1 G1 0.3 G2 0.2 X 0.7 X1 0.25 Y 0.4 C 0.7
Z
X1-DFN1212-3
X Y
Y2 Y1 (2x) C
X1 (2x)
Dimensions C X X1 Y Y1 Y2
Value (in mm) 0.80 0.42 0.32 0.50 0.50 1.50
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 1 of 14 www.diodes.com Suggested Pad Layout
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X1-DFN1212-3 Type B
X Y X2 Y3 Y2 X1(2x) Y1 (2x) C
Dimensions C X X1 X2 Y Y1 Y2 Y3
Value (in mm) 0.80 0.42 0.32 0.90 0.50 0.50 0.20 1.50
X1-DFN1411-3
C
X2 X1 G2 X
Y Z
G1
Dimensions Z G1 G2 X X1 X2 Y C
Value (in mm) 1.38 0.15 0.15 0.95 0.75 0.40 0.75 0.76
X1-DFN1612-6 / X2-DFN1310-6
G2 X2 Y2 G1 b Y1
G3
a
X1
Dimensions X1-DFN1612-6 X2- DFN1310-6 G1 0.15 0.16 G2 0.175 0.17 G3 0.15 0.15 X1 0.60 0.52 X2 0.25 0.20 Y1 0.65 0.52 Y2 0.45 0.375 a 0.10 0.09 b 0.15 0.06
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 2 of 14 www.diodes.com Suggested Pad Layout
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U-DFN1616-6
Y X2 G X1 C X2 a G2
U-DFN1616-8
Dimensions Value (in mm) Z 1.3 G 0.175 X1 0.50 X2 0.525 Y 0.30 C 0.50
Y2
Y1
G1
Dimensions Value (in mm) G1 0.15 G2 0.20 X1 0.65 X2 0.25 Y1 1.25 Y2 0.50 C 0.40 a 0.10
Z
X1
C
U-DFN2018-6
X Y C
Y1
G
Dimensions C G X X1 Y Y1
Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20
X1
U-DFN2020-3
X X2 X4 Y3 Y4 R3 G Y1 X1 C Y2 Y5 X3 R2 Y R1
Dimensions C G X X1 X2 X3 X4 Y
Value Value Dimensions (in mm) (in mm) 1.00 Y1 0.60 0.15 Y2 0.45 1.40 Y3 0.45 0.35 Y4 0.698 0.45 Y5 0.313 0.322 R1 0.225 0.60 R2 0.05 1.10 R3 0.20
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 3 of 14 www.diodes.com Suggested Pad Layout
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U-DFN2020-3 Type B
X Y1
U-DFN2020-6
Y
C G
Dimensions C G X X1 Y Y1 Y2
Y
G
X1 Y2 C
Value (in mm) 1.30 0.24 0.35 1.52 1.09 0.47 0.50
X2
Dimensions Z G X1 X2 Y C
X1
G Y Z
Value (in mm) 1.67 0.15 0.90 0.45 0.37 0.65
U-DFN2020-6 Type B
Y X2 G1 X1 C
U-DFN2020-6 Type E Value (in mm) 1.67 0.20 0.40 1.0 0.45 0.37 0.70 0.65
Dimensions
G
Dimensions C X X1 X2 Y Y1 Y2 Y3
G Y1 Z
Z G G1 X1 X2 Y Y1 C
Y3 Y2
X2
Y1
X1
Value (in mm) 0.650 0.400 0.285 1.050 0.500 0.920 1.600 2.300
X (6x)
C
Y (2x)
U-DFN2510-8
X1
X X1
U-DFN2523-6
Dimensions
Y Y1 G
c c1
c c1 G X X1 Y Y1
Value (in mm) 0.5 1.0 0.2 0.2 0.4 0.6 1.4
Y1 Y2 Y3
Y C X
Dimensions Value (in mm) C 0.650 X 0.400 X1 1.700 Y 0.650 Y1 0.450 Y2 1.830 Y3 2.700
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 4 of 14 www.diodes.com Suggested Pad Layout
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W-DFN3020-8 Type B
C X Y1 G Y2 Y G1
X1
Dimensions Value (in mm) C 0.650 G 0.285 G1 0.090 X 0.400 X1 1.120 Y 0.730 Y1 0.500 Y2 0.365
U-DFN3030-4 Dimensions C G1 G2 G3 G4 G5 G6 G7 G8 R X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 1.300 0.100 0.150 0.830 0.115 0.135 0.170 0.500 0.500 0.150 0.500 1.375 1.225 1.175 1.980 1.015 0.715 0.650
U-DFN3030-8
C Y3 (2x) G4 X3
G6 G1 R Y G2
Z
Y2
G3
X1
Y1 G7
G5 X2 X1 G8
X2 Y C
Dimensions Value (in mm) Z 2.59 G 0.11 X1 2.49 X2 0.65 Y 0.39 C 0.65
G
X (4x)
U-DFN3030-8 Type E
X (x8) Y (x8) C
Y1
Y2
Dimensions C C1 X Y Y1 Y2
Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75
C1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 5 of 14 www.diodes.com Suggested Pad Layout
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U-DFN3030-10
Y C X1 G
Y C
U-DFN3030-12
X
G Z
Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.30 C 0.50
X1 G
X
G
Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.28 C 0.45
Z
DFN322
C C X (3x) Y (2x) G Y4 Y3 Y2 X1 Y1
Dimensions C G X X1 Y Y1 Y2 Y3 Y4
Value (in mm) 0.65 0.20 0.35 1.52 0.55 0.98 0.47 0.63 2.20
W-DFN5020-6
Z
Y X X1 C Y2 Y3 X2 G
W-DFN5060-4
C
Dimensions Value (in mm) C 0.50 G 0.35 X 0.35 X1 0.90 X2 1.80 Y 0.70 Y2 1.60 Y3 3.20
Y1
Dimensions Value (in mm) C 4.00 X 0.75 Y 0.95 Y1 6.20 Z 4.75
X (4x) Y (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 6 of 14 www.diodes.com Suggested Pad Layout
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DF-S / MiniDIP
X
MSOP-8
Z
Dimensions DF-S MiniDIP Z 10.26 6.91 X 1.2 0.60 Y 1.52 0.76 C 5.2 2.67
Y
X
C1 C2
Dimensions Value (in mm) X 0.45 Y 1.4 C1 4.4 C2 0.65
Y C
MSOP-8L-EP
MSOP-10
X X1 Y1 C1
C2 Y
Dimensions Value (in mm) C1 4.2 C2 0.65 X 0.32 X1 1.95 Y 0.8 Y1 1.65
Y
X
C1
Dimensions X Y C1 C2
Value (in mm) 0.30 1.4 4.4 0.50
C2
POWERDI 5
X
®
POWERDI 123 / POWERDI 323
®
®
Y
X1
G
X2
Y2
X1 (2x) Y1 (2x) C
Y1
G
Dimensions C G X X1 Y Y1
Value (in mm) 1.840 0.852 3.360 1.390 4.860 1.400
Dimensions POWERDI®123 POWERDI®323 G 1.0 0.5 X1 2.2 2.0 X2 0.9 0.8 Y1 1.4 0.8 Y2 1.4 1.1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 7 of 14 www.diodes.com Suggested Pad Layout
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POWERDI 123 Type B
X
®
Y
Dimensions G X X1 Y
G X1
Value (in mm) 2.000 1.050 4.100 1.500
POWERDI 3333-8
X G
®
POWERDI 5060-8
X Y2
®
8 Y2 G1
5 Y1 Y
Y1 Y X1
1 Y3 X2 C
4
G1 C Y3 (4x) X2 (8x) G
Dimensions C G G1 Y Y1 Y2 Y3 X X2
Value (in mm) 0.650 0.230 0.420 3.700 2.250 1.850 0.700 2.370 0.420
Dimensions C G G1 X X1 X2 Y Y1 Y2 Y3
Value (in mm) 1.270 0.660 0.820 4.420 4.100 0.610 6.610 3.810 1.020 1.270
SM-8
X
SO-8
Y (8x) C1 Y1
Dimensions C C1 X Y Y1
C
Value (in mm) 1.52 4.6 0.95 2.80 6.80
Y
C1 C2
Dimensions Value (in mm) X 0.60 Y 1.55 C1 5.4 C2 1.27
X (8x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 8 of 14 www.diodes.com Suggested Pad Layout
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SOD323F
X1
Y (2x)
Dimensions Value (in mm) X 0.710 X1 2.700 Y 0.403
X (2x)
SOP-14
X
C1 C2 Y
Dimensions Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27
SOP-16
X
C1 C2 Y
Dimensions X Y C1 C2
Value (in mm) 0.60 1.50 5.4 1.27
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 9 of 14 www.diodes.com Suggested Pad Layout
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SOT143
X
Y1
SOT223
X1
X2 Y G
Z
C
C1
Y2
X1
X2
C2 X2
Dimensions Z G X X1 X2 Y C
Value (in mm) 2.70 1.30 2.50 1.0 0.60 0.70 2.0
Dimensions X1 X2 Y1 Y2 C1 C2
Value (in mm) 3.3 1.2 1.6 1.6 6.4 2.3
SOT523 / SOT323 / SOT23 / SC59
Y
Z
C
X
E
Dimensions Z X Y C E
SOT523 1.8 0.4 0.51 1.3 0.7
SOT323 2.8 0.7 0.9 1.9 1.0
SOT23 2.9 0.8 0.9 2.0 1.35
SC59 3.4 0.8 1.0 2.4 1.35
SOT23F
C
Y1
Y (3x)
Dimensions Value (in mm) C 0.95 X 0.60 Y 0.80 Y1 1.80
X (3x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 10 of 14 www.diodes.com Suggested Pad Layout
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SC74R / SOT26 / SOT363 / SOT563
C2 C2
SOT25 / SOT353 / SOT553
C2 C2
Z
G
C1
Z
G
C1
Y X
Y X
Dimensions Z G X Y C1 C2
SC74R / SOT26 3.20 1.60 0.55 0.80 2.40 0.95
SOT363 2.5 1.3 0.42 0.6 1.9 0.65
SOT563 2.2 1.2 0.375 0.5 1.7 0.5
Dimensions Z G X Y C1 C2
SOT25 3.20 1.60 0.55 0.80 2.40 0.95
SOT353 2.5 1.3 0.42 0.6 1.9 0.65
SOT553 2.2 1.2 0.375 0.5 1.7 0.5
SOT666
C Y (6x)
G
Dimensions Value (in mm) C 0.50 G 0.80 X 0.35 Y 0.50
X (6x)
SOT953
C C
Y1
Y (5X)
Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100
X (5X)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 11 of 14 www.diodes.com Suggested Pad Layout
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SOT963
C C
Y1
Y (6X)
Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100
X (6X)
SOT89-3
X1
X1
SOT89-5
X2 (2x) Y1 Y3 Y Y2 C X (3x) Y4
Dimensions Value (in mm) X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500
Y4
Y1 X2 Y2 X3 C Y3
Dimensions Value (in mm) X1 1.7 X2 0.55 X3 0.4 Y1 4.6 Y2 1.2 Y3 0.5 Y4 1.1 C 3.0
TO252 (DPAK) / TO263 (D PAK)
X2
2
Y2 C Y1 Z
Dimensions Z X1 X2 Y1 Y2 C E1
TO252 / DPAK TO263 / D PAK 11.6 16.9 1.5 1.1 7.0 10.8 2.5 3.5 7.0 11.4 6.9 9.5 2.3 2.5
2
X1
E1
TO252-4
X1
Y1 Y2 c1 Y3 Y X (4x) c
Dimensions c c1 X X1 Y Y1 Y2 Y3
Value (in mm) 1.27 2.54 1.00 5.73 2.00 6.17 1.64 2.66
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 12 of 14 www.diodes.com Suggested Pad Layout
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TO252-5
X
TO263-5
X
Y1 Y Y C1
Y1
Y2 X1 C2
Y2 X1 C
Dimensions X X1 Y Y1 Y2 C1 C2
Value (in mm) 5.6 0.6 11.0 5.6 2.0 7.2 1.27
Dimensions X X1 Y Y1 Y2 C
Value (in mm) 10.9 1.05 15.7 9.1 2.5 1.7
TSOT25
C C
Y1
Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199
Y (5x) X (5x)
TSOT26
C C
Y1
Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199
Y (6x) X (6x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 13 of 14 www.diodes.com Suggested Pad Layout
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TSSOP-14
X
C1 C2 Y
Dimensions Value (in mm) X 0.45 Y 1.45 C1 5.9 C2 0.65
U-WLB1010-4
ØD
C
Dimensions C D
Value (in mm) 0.50 0.25
C
U-WLB1510-6
D
Dimensions
C1 C
C C1 D
Value (in mm) 0.50 1.00 0.25
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 14 of 14 www.diodes.com Suggested Pad Layout
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