ABS2

ABS1 THRU ABS10 MINI SILICON SURFACE MOUNT BRIDGE RECTIFIER Reverse Voltage - 100 to 1000 Volts Forward Current - 1.0 Ampere FEATURES Ideal for printed circuit board Reliable low cost construction technique results in inexpensive product ● High temperature soldering guaranteed : 260 °C / 10 seconds / 0.375” ( 9.5mm ) lead length at 5 lbs., ( 2.3 kg ) tension ● ● 0.136(3.45) 0.128(3.25) 0.161(4.1) 0.154(3.9) ABS 0.177(4.5) 0.169(4.3) 0.252(6.4) 0.236(6.0) 0.010(0.25) 0.006(0.15) 0.002(0.05) 0.006(0.15) 0.028(0.7) 0.024(0.6) 0.028(0.7) 0.012(0.3) 0.006(0.15) 0.002(0.05) MECHANICAL DATA Case : Molded Plastic Epoxy : Device has UL flammability classification 94V-0 ● Mounting Position : Any ● Marking : Type Number ● ● 0.059(1.50) MAX. DETAIL "A", SCALE=20/1 0.056(1.42) 0.048(1.22) 0.20(5.1) 0.193(4.9) A 0.033(0.85) 0.026(0.65) 0~10 O 1 2 3 4 D imensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current -On glass-epoxy P.C.B. -On aluminum substrate Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) I2t Rating for Fusing (t < 8.3ms) Forward Voltage per element Peak Reverse Current At Rated DC Blocking Voltage @IF = 0.4A @TA = 25°C @TA = 125°C Symbol VRRM VRWM VR VR(RMS) IO ABS1 ABS2 ABS4 ABS6 ABS8 ABS10 Unit 100 70 200 140 400 280 0.8 1.0 30 10 0.95 10 150 25 62.5 25 600 420 800 560 1000 700 V V A IFSM I2t VF M IRM Cj R R JA JL A A 2s V µA pF °C/W °C Typical Junction Capacitance per leg (Note 2) Typical Thermal Resistance per leg (Note 1) Operating and Storage Temperature Range Tj, TSTG -55 to +150 Note: 1. On aluminum suvstrate P.C.B. with an area of 0.8×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad. 2. On glass epoxy P.C.B. mouted on 0.05×0.05”(1.3×1.3mm) pads. ABS1 THRU ABS10 RATINGS AND CHARACTERISTIC CURVES FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE FIG.2- TYPICAL REVERSE CHARACTERISTICS PER BRIDGE ELEMENT 1.6 1.4 100 AVERAGE FORWARD CURRENT. (A) 1.2 SIN 1.0 0.8 0.6 0.4 0.2 0 A LUMINA SUBSTRATE 50.8mm X 50.8mm SOLDERING LAND 1mm X 1mm CONDUCTOR LAYER 20 mm SUBSTRATE THICKNESS 0.64mm INSTANTANEOUS REVERSE CURRENT. ( A) 10 Tj=100 0C 1 Tj=75 0C 0.1 Tj=25 0C 0 20 40 60 80 100 120 140 160 0.01 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE. (%) 35 FIG.3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT JUNCTION CAPACITANCE.(pF) FIG.4- TYPICAL JUNCTION CAPACITANCE 1000 600 500 Tj=25 0C PEAK FORWARD SURGE CURRENT. (A) 30 25 20 15 10 5 0 1 400 300 200 100 IFSM 10ms 10ms 1 Cycle Ta=40 C NON-REPETITIVE, Single Half Sine-Wave SINE WAVE, Method) (JEDEC Tj = 25OC BEFORE SURGE CURRENT IS APPLIED 10 NUMBER OF CYCLES (CYCLE) 100 0 0.1 0.5 1 2 10 50 100 5 20 REVERSE VOLTAGE. (V) 200 500 800 50 FIG.5- TYPICAL FORWARD CHARACTERISTICS INSTANTANEOUS FORWARD CURRENT. (A) 10 1 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 FORWARD VOLTAGE. (V)