EH2645ETTTS-50.000MTR

EH2645ETTTS-50.000M TR REGULATORY COMPLIANCE (Data Sheet downloaded on Jan 9, 2020) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) 50.000MHz ±50ppm -40°C to +85°C ELECTRICAL SPECIFICATIONS Nominal Frequency 50.000MHz Frequency Tolerance/Stability ±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration) Aging at 25°C ±5ppm/year Maximum Operating Temperature Range -40°C to +85°C Supply Voltage 3.3Vdc ±10% Input Current 35mA Maximum (No Load) Output Voltage Logic High (Voh) 2.7Vdc Minimum (IOH= -8mA) Output Voltage Logic Low (Vol) 0.5Vdc Maximum (IOL= +8mA) Rise/Fall Time 6nSec Maximum (Measured at 20% to 80% of waveform) Duty Cycle 50 ±5(%) (Measured at 50% of waveform) Load Drive Capability 30pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output, No Connect to enable output. Absolute Clock Jitter ±250pSec Maximum, ±100pSec Typical One Sigma Clock Period Jitter ±50pSec Maximum, ±40pSec Typical Start Up Time 10mSec Maximum Storage Temperature Range -55°C to +125°C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 1 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EH2645ETTTS-50.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 ±0.15 5.08 ±0.15 4 3 MARKING ORIENTATION 5.00 ±0.15 2.20 ±0.15 2 1 1.4 ±0.2 1.4 ±0.1 3.68 ±0.15 PIN CONNECTION 1 Tri-State (High Impedance) 2 Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 50.000M 3 XXXXX XXXXX=Ecliptek Manufacturing Identifier 1.60 ±0.20 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 2 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EH2645ETTTS-50.000M TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 3 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EH2645ETTTS-50.000M TR Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01µF (Note 1) 0.1µF (Note 1) Ground CL (Note 3) No Connect or Tri-State Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 4 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EH2645ETTTS-50.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 ±0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 ±0.10 1.75 ±0.10 7.50 ±0.10 MARKING ORIENTATION 16.00 ±0.30 1.50 MIN 8.00 ±0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 ±0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 16.4 +2.0/-0.0 www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 5 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EH2645ETTTS-50.000M TR Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 Seconds 6°C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 6 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EH2645ETTTS-50.000M TR Recommended Solder Reflow Methods Low Temperature Infrared/Convection 240°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5°C/Second Maximum N/A 150°C N/A 60 - 120 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 240°C Maximum 240°C Maximum 2 Times / 230°C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5°C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 06/06/2012 | Page 7 of 7 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200