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BRUS2

BRUS2

  • 厂商:

    EDI

  • 封装:

  • 描述:

    BRUS2 - ULTRA-FAST RECOVERY SINGLE-PHASE, FULL-WAVE BRIDGES HEAT SINK CHASSIS P.C. BOARD MOUNTING - ...

  • 数据手册
  • 价格&库存
BRUS2 数据手册
BRUS2 BRUS2F M INIBRIDGE 5 0 ns. ULTRA-FAST RECOVERY SINGLE-PHASE, FULL-WAVE BRIDGES HEAT SINK CHASSIS P.C. BOARD MOUNTING ne po om c t he er , inc. nd s n u rie itio rato n og bo rec rs La s ate rite dic derw in rk Un ma of is m Th ogra pr nt BRUS2 9 Amps. Wire Leads BRUS 2F 10.5 Amps. Quick-connects PRV/Leg 9.0 AMP SERIES 10.5AMP SERIES 50V BRUS205 BRUS205F 100V BRUS210 BRUS210F 200V BRUS220 BRUS220F 400V BRUS240 BRUS240F 600V BRUS260 BRUS260F ELECTRICAL CHARACTERISTICS PER LEG (at TA =25 C U nle ss O the rwis e Sp eci fie d) Average Output Current l F (Av.) TC 60 C (Fig.1) Max. Forward Voltage Drop, VF@ IF= 2.0 Max.DC Reverse Current @ PRV and 25 C ,IR Max.DC Reverse Current @ PRV and 100 C ,IR Max. Reverse Recovery Time,Trr (Fig.4) Max. Peak Surge Current, l FSM (8.3ms) Storage Temperature Range, TSTG Thermal Resistance (Total Bridge), R0 j -c O BRUS2 9.0 1.3 10 200 50 125 BRUS2F 10.5 1.3 10 200 50 125 UNITS Amps Volts , A A Nanosec. Amps o -55 to+150 5.5 typ. 4.5 typ. o C C/W E DI reserves the right to change these specifications at any time without notice. BRUS2 BRUS2F FIG.1 CURRENT DERATING 12 L l F(AV). AVERAGE FORWARD CURRENT FIG.2 NON-REPETITIVE SURGE CURRENT 1000 500 PEAK SURGE CURRENT I FSM BRUS2F 10 8 BRUS2 200 6 100 4 50 2 (AMP) 20 0 0 25 50 75 O 10 125 150 1 2 5 10 20 50 100 100 TC=TEMPERATURE( C) NUMBER OF CYCLES AT 60 Hz T RR FIG.3 TEST CIRCUIT ZERO REFERENCE 0.5A R1 50 OHM D.U.T. PULSE GENERATOR R2 1 OHM SCOPE 1.0A 0.25A - R1, R2 NON-INDUCTIVE RESISTORS PULSE GENERATOR - HEWLETT PACKARD 214A OR EQUIV. IKC REP.RA TE, 10 SEC. PULSE WIDTH ADJUST PULSE AMPLITUDE FOR PEAK IR BRUS2-F SERIES MECH. OUTLINE Dielectric test voltage 1500 volts rms, max. 50-60Hz + .040 _ .002 DIA. THRU AC + BRUS2 SERIES MECH. OUTLINE FASTON 4 PLACES .150 DIA THRU. .50 MAX. + + AC AC 1 MIN. _ .463 + .015 + AC .30 MAX. EPOXY _ _ .463 + .015 .30 MAX. .85MAX. .85 MAX. METAL BASE EPOXY METAL BASE NOTE: A thin film of silicone thermal compound is recommended between the Minibridge case and mounting surface for improved thermal conduction. ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951. 21 GRAY OAKS AVENUE * YONKERS. NEW YORK 10710 914-965-4400 * FAX 914-965-5531 * 1-800-678-0828 E e-mail:sales@edidiodes.com * website: http://www.edidiodes.com W
BRUS2 价格&库存

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