BRUS1 BRUS5
M INIBRIDGE
50 ns. ULTRA-FAST RECOVERY 4 to 6 AMPERES
S INGLE-PHASE, FULL-WAVE BRIDGES HEAT SINK CHASSIS PC BOARD MOUNTING
nt ne
BRUS1 3A PC MOUNTING 4A HEAT SINK MOUNTING
c the . er , inc d un ies ion rator nit og bo ec s La rr tes ite ica erwr ind nd ark of U m is m BRUS5 Th ogra 5A PC BOARD MOUNTING pr 6A HEAT SINK MOUNTING
po om
PRV/LEG
BRUS1 SERIES BRUS5 SERIES
50V
BRUS105 BRUS505
100V
BRUS110 BRUS510
200V
BRUS120 BRUS520
400V
BRUS140 BRUS540
500V
BRUS150 BRUS550
600V
BRUS160 BRUS560
ELECTRICAL CHARACTERISTICS PER LEG (at TA =25 C U nle ss O the rwis e Sp eci fie d)
Average Output Current, lo @ 60 C Tc (Fig.1) Average Output Current, lo @ 80 C TL (Fig.2)
BRUS1 Series = 2A Max. Forward Voltage Drop, IF BRUS5 Series = 4A
O O
SERIES DESIGNATION B RUS1 4 3 1.3 10 200 50 100 -55 to+150 -55 to+150 7.7 typ. 8.7 typ.
o
BRUS5 6 5 1.3 10 200 50 240
UNITS Amps Amps Volts
Max.DC Reverse Current @ PRV and 25 C , IR Max.DC Reverse Current @ PRV and 100 C ,IR Max.Reverse Recovery Time,Trr (Fig.3) Max.Peak Surge Current, lFSM (8.3ms) (Fig.2) Storage Temperature Range, TSTG Ambient Operating Temperature Range,TA
Thermal Resistance (Total Bridge), R0 j-c
A A
Nanosec. Amps
o
C C
o
C/W
NOTE: A thin film of silicone thermal compound is recommended between the Minibridge case and mounting surface for improved thermal conduction.
E DI reserves the right to change these specifications at any time without notice.
BRUS1 BRUS5
FIG.1 CURRENT DERATING
6 L lO. AVERAGE FORWARD CURRENT (AMP)
FIG.2 NON-REPETITIVE SURGE CURRENT
1000
BRUS5
MAX. PEAK SURGE CURRENT I FSM 5 500 300 200
4
BRUS1
3
100
BRU
S5
2
50 30 20
1
BRU
S1
0 0 25 50 75
O
10 100 125 150 1 2 5 10 20 50 100
Tc
=TEMPERATURE ( C)
NUMBER OF CYCLES AT 60 CPS
T RR
FIG.3 REVERSE RECOVERY TEST METHOD
ZERO REFERENCE
0.5A
R1 50 OHM
D.U.T. PULSE GENERATOR R2 1 OHM SCOPE
1.0A 0.25A
-
R1, R2 NON-INDUCTIVE RESISTORS PULSE GENERATOR - HEWLETT PACKARD 214A OR EQUIV. IKC REP.RA TE, 10 SEC. PULSE WIDTH ADJUST PULSE AMPLITUDE FOR PEAK IR
BRUS MECHANICAL OUTLINE
Dielectric test voltage 2,500 V rms.,max. 50-60Hz
+
BRUS5 MECHANICAL OUTLINE
.935 .895
+
A
A
AC B
D
.160 .140
.185 .165 45 .085 .065
.280 .260
E
.700 .660 .760Max. .075R.Typ. (2 Places)
AC
LTR A B C D E F
C
INCHES .411-.441 .137-.167DIA .590-.610 .038-.042 .750MIN .300MAX
_
MILLIMETERS 10.44-11.20 3.48-4.24DIA 14.99-15.49 .97-1.07 19.05MIN 7.62MAX
F
.455 .405
1.0Min.
.260 .180
.205 .185
.220 .180
.052 .048
M aximum lead and terminal temperature for soldering, 3/8 inch from case, 5 seconds at 250 C.
A t hin film of silicone thermal compound is recommended between the Minibridge case and mounting surface for improved thermal conduction.
ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE * YONKERS. NEW YORK 10710 914-965-4400 * FAX 914-965-5531 * 1-800-678-0828
E e-mail:sales@edidiodes.com *W website: www.edidiodes.com
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