TH97/10561QM
TW00/17276EM
IATF 0060636 SGS TH07/1033
BYD57DA - BYD57VA
PRV : 200 - 1400 Volts Io : 1.0 - 1.2 Amperes
FEATURES :
* * * * * * Glass passivated junction chip High maximum operating temperature Low leakage current Excellent stability Smallest surface mount rectifier outline Pb / RoHS Free
ULTRA-FAST SOFT-RECOVERY CONTROLLED AVALANCHE RECTIFIERS
SMA (DO-214AC)
5.0 ± 0.15
4.5 ± 0.15
1.1 ± 0.3
1.2 ± 0.2 2.1 ± 0.2 2.6 ± 0.15
0.2 ± 0.07
MECHANICAL DATA :
* * * * * * Case : SMA Molded plastic Epoxy : UL94V-O rate flame retardant Lead : Lead Formed for Surface Mount Polarity : Color band denotes cathode end Mounting position : Any Weight : 0.067 gram
2.0 ± 0.2
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25 °C ambient temperature unless otherwise specified
RATING Maximum Repetitive Peak Reverse Voltage Maximum Continuous Reverse Voltage Min. Reverse Avalanche Breakdown Voltage @ I R = 0.1 mA Maximum Average Forward Current Maximum Non-Repetitive Peak Forward Surge Current (Note 3) Maximum Repetitive Peak Forward Current at Ttp = 85 °C Maximum Forward Voltage at IF = 1.0 A ; TJ = 25 °C Maximum Reverse Current at VR =VRRMmax Maximum Reverse Recovery Time (Note 4) Thermal Resistance from Junction to Tie-Point Thermal Resistance from Junction to Ambient (Note 5) Junction Temperature Range Storage Temperature Range TJ = 25 °C TJ = 165 °C
SYMBOL VRRM VR V(BR)R-min IF(AV) IFSM IFRM VF IR IR(H) Trr Rth j-tp Rth j-a TJ TSTG
BYD 57DA
BYD 57GA
BYD 57JA
BYD
BYD
BYD
BYD 57VA
57KA 57MA 57UA
UNIT V V V A A
200 200 300
400 400 500
600 600 700 1.0
(1)
800 800 900 0.4 5
(2)
1000 1200 1400 1000 1200 1400 1100 1300 1500 1.2
(1)
8.5 3.6 5.0 100 30 30 150 - 65 to + 175 - 65 to + 175 75
11 2.3
A V μA μA
150
ns K/W K/W °C °C
Notes : (1) Ttp = 85 °C; see Fig. 1and 2; averaged over any 20 ms period; see also Fig.5 and 6. (2) Tamb = 60 °C; PCB mounting ; see Fig. 3 and 4; averaged over any 20 ms period; see also Fig.5 and 6. (3) t=10ms half sine wave; Tj = Tjmax prior to surge; V R = VRRMmax (4) Reverse Recovery Test Conditions : IF = 0.5 A, I R = 1.0 A, Irr = 0.25 A. (5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥ 40 μm.
Page 1 of 3
Rev. 00 : February 13, 2008
TH97/10561QM
TW00/17276EM
IATF 0060636 SGS TH07/1033
RATING AND CHARACTERISTIC CURVES ( BYD57DA - BYD57VA )
FIG.1 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE
2.0
FIG.2 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE
2.0
BYD57DA to MA
BYD57UA to VA
AVERAGE FORWARD CURRENT, IF(AV) (A)
1.2
AVERAGE FORWARD CURRENT, IF(AV) (A)
0 40 80 120 160 200
1.6
1.6
1.2
0.8
0.8
0.4
0.4
0
0 0 40 80 120 160 200
TIE-POINT TEMPERATURE, Ttp ( °C) FIG.3 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE AVERAGE FORWARD CURRENT, I F(AV) (A)
0.6
TIE-POINT TEMPERATURE, Ttp ( °C) FIG.4 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE AVERAGE FORWARD CURRENT, I F(AV) (A)
0.6
BYD57DA to MA
0.5
BYD57UA to VA
0.4
0.4
0.3
0.2
0.2
0.1 0 0 40 80 120 160 200
0
0
40
80
120
160
200
AMBIENT TEMPERATURE, Tamp ( °C) FIG.5 - MAXIMUM STEADY STATE POWER DISSIPATION AS A FUNCTION OF AVERAGE FORWARD CURRENT
3
AMBIENT TEMPERATURE, Tamp ( °C) FIG.6 - MAXIMUM STEADY STATE POWER DISSIPATION AS A FUNCTION OF AVERAGE FORWARD CURRENT
6
POWER DISSIPATION, P D (W)
a =3 2.5
2
1.57 1.42
POWER DISSIPATION, P D (W)
BYD57UA to VA
5 4 a =3 2.5 2 1.57 1.42
2
3 2
1
BYD57DA to MA
a = IF(RMS)/IF(AV) ; VR = VRRMmax ; δ = 0.5 0 0 0.5
1 a = IF(RMS)/IF(AV) ; VR = VRRMmax ; δ = 0.5 0 0 0.4 0.8 1.2 1.6 2.0
AVERAGE FORWARD CURRENT, I F(AV) (A)
AVERAGE FORWARD CURRENT, I F(AV) (A)
Page 2 of 3
Rev. 00 : February 13, 2008
TH97/10561QM
TW00/17276EM
IATF 0060636 SGS TH07/1033
RATING AND CHARACTERISTIC CURVES ( BYD57DA - BYD57VA )
FIG.7 - FORWARD CURRENT AS FUNCTION OF FORWARD VOLTAGE
FIG.8 - FORWARD CURRENT AS FUNCTION OF FORWARD VOLTAGE
4
4
BYD57DA to MA
BYD57UA to VA
FORWARD CURRENT, I F (A)
3
FORWARD CURRENT, I F (A)
TJ = 25 °C
3
TJ = 25 °C
2
2
1
1
0 0 2 4 6 8
0 0 1 2 3 4
FORWARD VOLTAGE, V F (V)
FORWARD VOLTAGE, V F (V)
FIG.9 - REVERSE CURRENT AS FUNCTION OF JUNCTION TEMPERATURE
1000
REVERSE CURRENT, IR (μA)
100 VR =VRRMmax
10
1 0
100
200
JUNCTION TEMPERATURE, TJ ( °C)
Page 3 of 3
Rev. 00 : February 13, 2008
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