BYD67A

TH97/10561QM TW00/17276EM IATF 0060636 SGS TH07/1033 BYD67A PRV : 300 Volts Io : 1.2 Amperes FEATURES : * * * * * * Glass passivated junction chip High maximum operating temperature Low leakage current Excellent stability Smallest surface mount rectifier outline Pb / RoHS Free RIPPLE BOCKING DIODE SMA (DO-214AC) 5.0 ± 0.15 4.5 ± 0.15 1.1 ± 0.3 1.2 ± 0.2 2.1 ± 0.2 2.6 ± 0.15 0.2 ± 0.07 2.0 ± 0.2 MECHANICAL DATA : * * * * * * Case : SMA Molded plastic Epoxy : UL94V-O rate flame retardant Lead : Lead Formed for Surface Mount Polarity : Color band denotes cathode end Mounting position : Any Weight : 0.067 gram Dimensions in millimeters MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25 °C ambient temperature unless otherwise specified RATING Maximum Repetitive Peak Reverse Voltage Maximum Continuous Reverse Voltage Maximum Average Forward Current Maximum Non-Repetitive Peak Forward Surge Current (Note 3) Maximum Repetitive Peak Forward Current at Ttp = 85 °C Maximum Forward Voltage at IF = 1.0 A, TJ = 25 °C Maximum Reverse Current at VR = VRRMmax Maximum Reverse Recovery Time (Note 4) Thermal Resistance from Junction to Tie-Point Thermal Resistance from Junction to Ambient (Note 5) Junction Temperature Range Storage Temperature Range TJ = 25 °C TJ = 165 °C SYMBOL VRRM VR IF(AV) IFSM IFRM VF IR IR(H) Trr Rth j-tp Rth j-a TJ TSTG VALUE 300 300 1.2 (1) 0.4 (2) 5.0 11 2.3 1.0 100 150 30 150 - 65 to + 175 - 65 to + 175 UNIT V V A A A V μA μA ns K/W K/W °C °C Notes : (1) Ttp = 85 °C; see Fig. 1; averaged over any 20 ms period; see Fig. 2 (2) Tamb = 60 °C; PCB mounting ; see Fig. 3; averaged over any 20 ms period; see also Fig.2 (3) t=10ms half sine wave; Tj = Tjmax prior to surge; V R = VRRMmax (4) Reverse Recovery Test Conditions : IF = 0.5 A, I R = 1.0 A, Irr = 0.25 A. (5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥ 40 μm. Page 1 of 2 Rev. 00 : February 13, 2008 TH97/10561QM TW00/17276EM IATF 0060636 SGS TH07/1033 RATING AND CHARACTERISTIC CURVES ( BYD67A ) FIG.1 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE 2.0 FIG.2 - MAXIMUM STEADY STATE POWER DISSIPATION AS A FUNCTION OF AVERAGE FORWARD CURRENT 5 AVERAGE FORWARD CURRENT, IF(AV) (A) POWER DISSIPATION, P D (W) 1.6 4 a =3 2.5 2 1.57 1.42 1.2 3 0.8 2 0.4 1 a = IF(RMS)/IF(AV) ; VR = VRRMmax ; δ = 0.5 0 0 0.4 0.8 1.2 1.6 2.0 0 0 40 80 120 160 200 TIE-POINT TEMPERATURE, Ttp ( °C) FIG.2 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE 0.6 6 AVERAGE FORWARD CURRENT, I F(AV) (A) FIG.4 - FORWARD CURRENT AS FUNCTION OF FORWARD VOLTAGE AVERAGE FORWARD CURRENT, IF(AV) (A) FORWARD CURRENT, I F (A) 5 TJ = 25 °C 4 0.4 3 0.2 2 1 0 0 0 40 80 120 160 200 0 1 2 3 4 5 AMBIENT TEMPERATURE, Ta ( °C) FIG.5 - REVERSE CURRENT AS FUNCTION OF JUNCTION TEMPERATURE; MAXIMUM VALUES 1000 FORWARD VOLTAGE, V F (V) REVERSE CURRENT, IR (μA) VR =VRRMmax 100 10 1 0 100 200 JUNCTION TEMPERATURE, TJ ( °C) Page 2 of 2 Rev. 00 : February 13, 2008