BZG03-C12

TH97/10561QM TW00/17276EM IATF 0060636 SGS TH07/1033 BZG03-C10 ~ BZG03-C200 FEATURES : VOLTAGE REGULATOR DIODES SMA * Excellent stability * Low leakage current * Pb / RoHS Free 1.6 ± 0.25 2.6 ± 0.15 2.3 ± 0.2 MECHANICAL DATA : * Case : SMA Molded plastic * Epoxy : UL94V-O rate flame retardant * Polarity : Color band denotes cathode end * Mounting position : Any * Weight : 0.060 gram (Approximately) 1.6 ± 0.25 Dimensions in millimeters MAXIMUM RATINGS Rating at 25 °C ambient temperature unless otherwise specified Parameter Power dissipation Power dissipation Symbol Ptot Ptot Condition Ttp = 100 °C, see Fig. 1 Ta = 50 °C, see Fig. 1; device mounted on an Al 2O3 PCB (Fig. 4) tp = 100 µs; square pulse; Tj = 25°C prior to surge; see Fig. 2 IF = 0.5 A; Tj = 25 °C; see Fig. 3 5.3 ± 0.35 4.2 ± 0.25 * Complete Voltage Range 10 to 200 Volts * High maximum operating temperature 1.3 ± 0.2 Min. - Max. 3 1.25 Unit W W Non-repetitive peak reverse Forward voltage Junction Temperature Range Storage Temperature Range PZSM VF Tj Tstg -65 -65 600 1.2 +175 +175 W V °C °C THERMAL CHARACTERISTICS Parameter Thermal resistance from junction to tie-point Thermal resistance from junction to ambient Note 1. Device mounted on an AlO3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.4. 2 Symbol Rth j-tp Rth j-a (Note 1) Condition Value 25 100 Unit K/W K/W Page 1 of 3 Rev. 08 : September 18, 2008 TH97/10561QM TW00/17276EM IATF 0060636 SGS TH07/1033 ELECTRICAL CHARACTERISTICS Rating at Tj = 25 °C unless otherwise specified Working Voltage Differental Resistance Temperature Coefficient Test Current Maximum Reverse Leakage Current Type No. Marking Code Min. C10 C11 C12 C13 C15 C16 C18 C20 C22 C24 C27 C30 C33 C36 C39 C43 C47 C51 C56 C62 C68 C75 C82 C91 C100 C110 C120 C130 C150 C160 C180 C200 9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 25.1 28 31 34 37 40 44 48 52 58 64 70 77 85 94 104 114 124 138 153 168 188 VZ @ I Z Nom. 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 160 180 200 Max. 10.6 11.6 12.7 14.1 15.6 17.1 19.1 21.2 23.3 25.6 28.9 32 35 38 41 46 50 54 60 66 72 79 87 96 106 116 127 141 156 171 191 212 rdiff(Ω) at I Z Typ. 2 4 4 5 5 6 6 6 6 7 7 8 8 21 21 24 24 25 25 25 25 30 30 60 60 80 80 110 130 150 180 200 Max. 4 7 7 10 10 15 15 15 15 15 15 15 15 40 40 45 45 60 60 80 80 100 100 200 200 250 250 300 300 350 400 500 SZ (%/K) at I Z Min. 0.05 0.05 0.05 0.05 0.05 0.05 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.07 0.07 0.07 0.07 0.08 0.08 0.08 0.08 0.09 0.09 0.09 0.09 0.09 0.09 0.09 0.09 0.09 Max. 0.09 0.10 0.10 0.10 0.10 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.12 0.12 0.12 0.12 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 IZ (mA) 50 50 50 50 50 25 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 10 5 5 5 5 5 5 5 5 5 IR @ V R (μA) 7.0 4.0 3.0 2.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 (V) 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 BZG03-C10 BZG03-C11 BZG03-C12 BZG03-C13 BZG03-C15 BZG03-C16 BZG03-C18 BZG03-C20 BZG03-C22 BZG03-C24 BZG03-C27 BZG03-C30 BZG03-C33 BZG03-C36 BZG03-C39 BZG03-C43 BZG03-C47 BZG03-C51 BZG03-C56 BZG03-C62 BZG03-C68 BZG03-C75 BZG03-C82 BZG03-C91 BZG03-C100 BZG03-C110 BZG03-C120 BZG03-C130 BZG03-C150 BZG03-C160 BZG03-C180 BZG03-C200 Page 2 of 3 Rev. 08 : September 18, 2008 TH97/10561QM TW00/17276EM IATF 0060636 SGS TH07/1033 RATING AND CHARACTERISTIC CURVES ( BZG03-C10 ~ BZG03-C200 ) FIG.1 - Maximum total power dissipation as a function of temperature. FIG.2 - Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Ptot (W) 4 PZSM (W) 104 3 103 2 102 1 0 0 100 10 T, (°C) 175 10-2 10-1 1 tp (ms) 10 Solid line: tie-point temperature. Dotted line: ambient temperature; device mounted on an Al2O3 PCB as shown in Fig.5. Tj= 25 °C prior to surge. FIG. 3 - Forward current as a function of forward voltage; typical values. 3 IF (A) FIG.4 - Printed-circuit board for surface mounting. 50 4.5 2 50 □ 2.5 1 1.25 0 0 1 VF (V) 2 Dimensions in mm. Tj= 25 °C. Page 3 of 3 Rev. 08 : September 18, 2008