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FKBP201

FKBP201

  • 厂商:

    EIC

  • 封装:

  • 描述:

    FKBP201 - FAST RECOVERY - EIC discrete Semiconductors

  • 详情介绍
  • 数据手册
  • 价格&库存
FKBP201 数据手册
TH97/2478 TH09/2479 IATF 0060636 SGS TH07/1033 FKBP200 - FKBP210 PRV : 50 - 1000 Volts Io : 2.0 Amperes FEATURES : * * * * * * * * High case dielectric strength of 2000 VDC High surge current capability High reliability Low reverse current Low forward voltage drop Fast switching for high efficiency Ideal for printed circuit board Pb / RoHS Free FAST RECOVERY BRIDGE RECTIFIERS KBP 0.59 (14.9) 0.57 (14.5) 0.448 (11.4) 0.433 (11.0) Φ3 + AC AC 0.0307 (0.78) 0.0303 (0.77) 0.696 (17.7) MIN. 0.150 (3.82) 0.148 (3.78) 0.151 (3.85 ) 0.147 (3.75) MECHANICAL DATA : * Case : Molded plastic * Epoxy : UL94V-0 rate flame retardant * Terminals : Plated lead solderable per MIL-STD-202, Method 208 guaranteed * Polarity : Polarity symbols marked on case * Mounting position : Any * Weight : 3.4 grams 0.051 (1.30) 0.043 (1.10) Dimensions in inches and ( millimeter ) Rating at 25 °C ambient temperature unless otherwise specifie. d Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS RATING Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Current Tc = 50 °C Peak Forward Surge Current Single half sine wave Superimposed on rated load (JEDEC Method) Current Squared Time at t < 8.3 ms. Maximum Forward Voltage drop per Diode at I F = 1.0 A Maximum DC Reverse Current at Rated DC Blocking Voltage Typical Thermal Resistance (Note 2) Operating Junction Temperature Range Storage Temperature Range Ta = 25 °C Ta = 100 °C SYMBOL VRRM VRMS VDC IF(AV) IFSM 2 It FKBP FKBP FKBP FKBP FKBP FKBP FKBP 200 201 202 204 206 208 210 UNIT V V V A A A2S V 50 35 50 100 70 100 200 140 200 400 280 400 2.0 35 10 1.3 10 500 600 420 600 800 560 800 1000 700 1000 VF IR IR(H) Trr RθJA TJ TSTG 150 μA μA 250 500 ns Maximum Reverse Recovery Time (Note 1) 30 - 50 to + 150 - 50 to + 150 °C/W °C °C Notes : F 1 ) Measured with I = 0.5 Amp., IR = 1 Amp., Irr = 0.25 Amp. 2 ) Thermal resistance from Junction to Ambient on P.C. Board with, 0.47" X 0.47" ( 12 mm. x 12 mm. ) Cu. pads. Page 1 of 2 Rev. 03 : June 11, 2009 TH97/2478 TH09/2479 IATF 0060636 SGS TH07/1033 RATING AND CHARACTERISTIC CURVES ( FKBP200 - FKBP210 ) FIG.1 - REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM 50 Ω 10 Ω + 0 .5 A Trr + D.U.T. 50 Vdc (approx) 1Ω PULSE GENERATOR ( NOTE 2 ) OSCILLOSCOPE ( NOTE 1 ) 0 - 0.25 A - 1.0 A SET TIME BASE FOR 50/100 ns/cm NOTES : 1. Rise Time = 7 ns max., Input Impedance = 1 megaohm, 22 pF. 2. Rise time = 10 ns max., Source Impedance = 50 ohms. 3. All Resistors = Non-inductive Types. 1 cm FIG.2 - DERATING CURVE FOR OUTPUT RECTIFIED CURRENT AVERAGE FORWARD OUTPUT CURRENT, AMPERES 2.5 50 FIG.3 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT, AMPERES Tc = 50 °C 40 2.0 1.5 30 1.0 20 0.5 60Hz RESISTIVE OR INDUCTIVE LOAD 0 0 25 50 75 100 125 150 175 10 0 1 2 4 6 10 20 40 60 100 CASE TEMPERATURE, ( °C) FIG.4 - TYPICAL FORWARD CHARACTERISTICS PER DIODE 100 10 Pulse Width = 300 μs 2% Duty Cycle TJ = 25 °C 10 NUMBER OF CYCLES AT 60Hz FIG.5 - TYPICAL REVERSE CHARACTERISTICS PER DIODE TJ = 100 °C FORWARD CURRENT, AMPERES REVERSE CURRENT, MICROAMPERES 1.0 1.0 0.1 TJ = 25 °C 0.1 0.01 0 20 40 60 80 100 120 140 PERCENT OF RATED REVERSE VOLTAGE, (%) 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE, VOLTS Page 2 of 2 Rev. 03 : June 11, 2009
FKBP201
### 物料型号 - 型号:FKBP200至FKBP210

### 器件简介 - 这些器件是快恢复桥式整流器,具有高耐压、高浪涌电流能力、高可靠性、低反向电流、低正向电压降和快速开关特性,适合用于印刷电路板,且不含铅和RoHS。

### 引脚分配 - 引脚为镀铅可焊性引脚,符合MIL-STD-202标准,方法208保证。 - 极性符号标记在外壳上。

### 参数特性 - 最大重复峰值反向电压(VRRM):50至1000伏不等。 - 最大RMS电压(VRMS):35至700伏不等。 - 最大DC阻断电压(Voc):50至1000伏不等。 - 最大平均正向电流(IF(AV)):2.0安培。 - 正向浪涌电流(IFSM):35安培(FKBP202型号)。 - 正向电压降(VF):1.3伏(FKBP200型号)。 - 最大反向电流(IR):10微安(FKBP200型号)。 - 最大反向恢复时间(Trr):150至500纳秒不等。 - 典型热阻(RthJA):30°C/W。

### 功能详解 - 这些器件适用于需要高效率和快速开关的应用,如电源整流和电机驱动。

### 应用信息 - 适用于印刷电路板,不含铅和RoHS,适用于环保要求高的应用。

### 封装信息 - 封装为模塑塑料,尺寸以英寸和毫米标注,重量为3.4克。 - 安装位置:任意。
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