EDS1216AHTA

DATA SHEET 128M bits SDRAM EDS1216AHTA (8M words × 16 bits) Specifications • Density: 128M bits • Organization ⎯ 2M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II) ⎯ Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 3.3V ± 0.3V • Clock frequency: 166MHz/133MHz (max.) • Four internal banks for concurrent operation • Interface: LVTTL • Burst lengths (BL): 1, 2, 4, 8, full page • Burst type (BT): ⎯ Sequential (1, 2, 4, 8, full page) ⎯ Interleave (1, 2, 4, 8) • /CAS Latency (CL): 2, 3 • Precharge: auto precharge option for each burst access • Refresh: auto-refresh, self-refresh • Refresh cycles: 4096 cycles/64ms ⎯ Average refresh period: 15.6μs • Operating ambient temperature range ⎯ TA = 0°C to +70°C Pin Configurations /xxx indicates active low signal. 54-pin Plastic TSOP (II) VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ Features • Single pulsed /RAS • Burst read/write operation and burst read/single write operation capability • Byte control by UDQM and LDQM DQ7 VDD LDQM /WE /CAS /RAS /CS BA0 BA1 A10 A0 A1 A2 A3 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 VSS NC UDQM CLK CKE NC A11 A9 A8 A7 A6 A5 A4 VSS (Top view) A0 to A11 BA0, BA1 DQ0 to DQ15 /CS /RAS /CAS /WE LDQM, UDQM CKE CLK VDD VSS VDDQ VSSQ NC Address input Bank select address Data-input/output Chip select Row address strobe Column address strobe Write enable Input/output mask Clock enable Clock input Power for internal circuit Ground for internal circuit Power for DQ circuit Ground for DQ circuit No connection Document No. E1160E20 (Ver. 2.0) Date Published February 2008 (K) Japan Printed in Japan URL: http://www.elpida.com ©Elpida Memory, Inc. 2007-2008 EDS1216AHTA Ordering Information Part number EDS1216AHTA-6B-E EDS1216AHTA-75-E Supply voltage 3.3V Organization Internal (words × bits) Banks 8M × 16 4 Clock frequency MHz (max.) 166 100 133 100 /CAS latency 3 2 3 2 Package 54-pin plastic TSOP (II) Part Number E D S 12 16 A H TA - 6B - E Elpida Memory Type D: Monolithic Device Environment Code E: Lead Free (RoHS compliant) Product Family S: SDRAM Density / Bank 12: 128M/4-bank Organization 16: x16 Power Supply, Interface A: 3.3V, LVTTL Die Rev. Speed 6B: 166MHz/CL3 100MHz/CL2 75: 133MHz/CL3 100MHz/CL2 Package TA: TSOP (II) Data Sheet E1160E20 (Ver. 2.0) 2 EDS1216AHTA CONTENTS Specifications.................................................................................................................................................1 Features.........................................................................................................................................................1 Pin Configurations .........................................................................................................................................1 Ordering Information......................................................................................................................................2 Part Number ..................................................................................................................................................2 Electrical Specifications.................................................................................................................................4 Block Diagram .............................................................................................................................................10 Pin Function.................................................................................................................................................11 Command Operation ...................................................................................................................................13 Simplified State Diagram .............................................................................................................................21 Mode Register Configuration.......................................................................................................................22 Power-up sequence.....................................................................................................................................24 Operation of the SDRAM.............................................................................................................................25 Timing Waveforms.......................................................................................................................................41 Package Drawing ........................................................................................................................................47 Recommended Soldering Conditions..........................................................................................................48 Data Sheet E1160E20 (Ver. 2.0) 3 EDS1216AHTA Electrical Specifications • All voltages are referenced to VSS (GND). • After power up, execute power up sequence and initialization sequence before proper device operation is achieved (refer to the Power up sequence). Absolute Maximum Ratings Parameter Voltage on any pin relative to VSS Supply voltage relative to VSS Short circuit output current Power dissipation Operating ambient temperature Storage temperature Symbol VT VDD IOS PD TA Tstg Rating –0.5 to VDD + 0.5 (≤ 4.6 (max.)) –0.5 to +4.6 50 1.0 0 to +70 –55 to +125 Unit V V mA W °C °C Note Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Recommended DC Operating Conditions (TA = 0°C to +70°C) Parameter Supply voltage Input high voltage Input low voltage Symbol VDD, VDDQ VSS, VSSQ VIH VIL min. 3.0 0 2.0 –0.3 max. 3.6 0 VDD + 0.3 0.8 Unit V V V V Notes 1 2 3 4 Notes: 1. 2. 3. 4. The supply voltage with all VDD and VDDQ pins must be on the same level. The supply voltage with all VSS and VSSQ pins must be on the same level. VIH (max.) = VDD + 1.5V (pulse width ≤ 5ns). VIL (min.) = VSS – 1.5V (pulse width ≤ 5ns). Data Sheet E1160E20 (Ver. 2.0) 4 EDS1216AHTA DC Characteristics 1 (TA = 0°C to +70°C, VDD, VDDQ = 3.3V ± 0.3V, VSS, VSSQ = 0V) Parameter Operating current Standby current in power-down Standby current in power-down (input signal stable) Standby current in non power-down Standby current in non power-down (input signal stable) Active standby current in power-down Active standby current in power-down (input signal stable) Symbol IDD1 IDD2P IDD2PS IDD2N IDD2NS IDD3P IDD3PS Grade -6B -75 max. 100 90 3 2 20 8 4 3 20 15 -6B -75 -6B -75 90 80 200 180 2 Unit mA mA mA mA mA mA mA mA mA mA mA mA Test condition Burst length = 1 tRC = tRC (min.) CKE = VIL, tCK = tCK (min.) CKE = VIL, tCK = ∞ CKE, /CS = VIH, tCK = tCK (min.) CKE = VIH, tCK = ∞, /CS = VIH CKE = VIL, tCK = tCK (min.) CKE = VIL, tCK = ∞ CKE, /CS = VIH, tCK = tCK (min.) CKE = VIH, tCK = ∞, /CS = VIH tCK = tCK (min.), BL = 4 tRC = tRC (min.) VIH ≥ VDD – 0.2V VIL ≤ 0.2V Notes 1, 2, 3 6 7 4 8 1, 2, 6 2, 7 1, 2, 4 2, 8 1, 2, 5 3 Active standby current in non power-down IDD3N Active standby current in non power-down IDD3NS (input signal stable) Burst operating current Refresh current Self-refresh current IDD4 IDD5 IDD6 Notes: 1. IDD depends on output load condition when the device is selected. IDD (max.) is specified at the output open condition. 2. One bank operation. 3. Input signals are changed once per one clock. 4. Input signals are changed once per two clocks. 5. Input signals are changed once per four clocks. 6. After power-down mode, CLK operating current. 7. After power-down mode, no CLK operating current. 8. Input signals are VIH or VIL fixed. Data Sheet E1160E20 (Ver. 2.0) 5 EDS1216AHTA DC Characteristics 2 (TA = 0°C to +70°C, VDD, VDDQ = 3.3V ± 0.3V, VSS, VSSQ = 0V) Parameter Input leakage current Output leakage current Output high voltage Output low voltage Symbol ILI ILO VOH VOL min. –1 –1.5 2.4 — max. 1 1.5 — 0.4 Unit µA µA V V Test condition 0 ≤ VIN ≤ VDD 0 ≤ VOUT ≤ VDD, DQ = disable IOH = –4 mA IOL = 4 mA Notes Pin Capacitance (TA = 25°C, VDD, VDDQ = 3.3V ± 0.3V) Parameter Input capacitance Symbol CI1 CI2 Data input/output capacitance CI/O Pins CLK Address, CKE, /CS, /RAS, /CAS, /WE, DQM DQ min. 2.5 2.5 4.0 typ. — — — max. 3.5 3.8 6.5 Unit pF pF pF Notes 1, 2, 4 1, 2, 4 1, 2, 3, 4 Notes: 1. 2. 3. 4. Capacitance measured with Boonton Meter or effective capacitance measuring method. Measurement condition: f = 1MHz, 1.4V bias, 200mV swing. DQM = VIH to disable DOUT. This parameter is sampled and not 100% tested. Data Sheet E1160E20 (Ver. 2.0) 6 EDS1216AHTA AC Characteristics (TA = 0°C to +70°C, VDD, VDDQ = 3.3V ± 0.3V, VSS, VSSQ = 0V) -6B Parameter System clock cycle time (CL = 2) (CL = 3) CLK high pulse width CLK low pulse width Access time from CLK Data-out hold time CLK to Data-out low impedance CLK to Data-out high impedance Input setup time Input hold time Ref/Active to Ref/Active command period Active to Precharge command period Active command to column command (same bank) Precharge to active command period Write recovery or data-in to precharge lead time Last data into active latency (tCK < 10) (tCK ≥ 10) Active (a) to Active (b) command period Transition time (rise and fall) Refresh period (4096 refresh cycles) Symbol tCK tCK tCH tCL tAC tOH tLZ tHZ tSI tHI tRC tRAS tRCD tRP tDPL tDAL tDAL tRRD tT tREF min. 10 6 2.5 2.5 — 3 0 — 1.5 0.8 60 42 18 18 10 2CLK + 18ns 1CLK + 20ns 12 — — max. — — — — 5.4 — — 5.4 — — — 120000 — — — — — — 5.0 64 -75 min. 10 7.5 2.5 2.5 — 3 0 — 1.5 0.8 67.5 45 20 20 10 2CLK + 20ns 1CLK + 20ns 15 — — max. — — — — 5.4 — — 5.4 — — — 120000 — — — — — — 5.0 64 ns ns ms 1 ns ns ns ns ns ns ns ns ns ns Unit ns ns ns ns Notes 1 1 1, 5 1, 5 1, 2, 5 1, 2, 5 1, 2, 3, 5 1, 4 1, 5 1, 5 1 1 1 1 1 Notes: 1. 2. 3. 4. 5. AC measurement assumes tT = 0.5ns. Reference level for timing of input signals is 1.4V. Access time is measured at 1.4V. Load condition is CL = 50pF. tLZ (min.) defines the time at which the outputs achieves the low impedance state. tHZ (max.) defines the time at which the outputs achieves the high impedance state. If tT ≥ 1ns, each parameters is changed as follows; tAC, tOH, tLZ: should be added (tT (rise)/2 – 0.5) tCH, tCL, tSI, tHI: should be added {(tT (rise) + tT (fall))/2 – 1} Data Sheet E1160E20 (Ver. 2.0) 7 EDS1216AHTA Test Conditions • AC high level voltage/low level input voltage: 2.4V/0.4V • Input and output timing reference levels: 1.4V • Input waveform and output load: See following figures 2.4 V input 0.4 V 2.0 V 0.8 V I/O CL tT tT Input waveform and Output load Data Sheet E1160E20 (Ver. 2.0) 8 EDS1216AHTA Relationship Between Frequency and Minimum Latency Parameter Frequency (MHz) tCK (ns) Active command to column command (same bank) Active command to active command (same bank) Active command to precharge command (same bank) Precharge command to active command (same bank) Write recovery or data-in to precharge command (same bank) Active command to active command (different bank) Self-refresh exit time Last data in to active command (Auto precharge, same bank) Self-refresh exit to command input Precharge command to high impedance (CL = 2) (CL = 3) Symbol lRCD lRC lRAS lRP lDPL lRRD lSREX lDAL lSEC lHZP lHZP -6B 166 6 3 10 7 3 2 2 1 5 10 ⎯ 3 1 ⎯ –2 1 0 0 2 1 2 0 1 100 10 2 7 5 2 1 2 1 3 7 2 3 1 –1 –2 1 0 0 2 1 2 0 1 -75 133 7.5 3 9 6 3 2 2 1 5 9 ⎯ 3 1 ⎯ –2 1 0 0 2 1 2 0 1 100 10 2 7 5 2 1 2 1 3 7 2 3 1 –1 –2 1 0 0 2 1 2 0 1 Unit tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK = [lRC] 3 Notes 1 1 1 1 1 1 2 Last data out to active command lAPR (Auto precharge, same bank) Last data out to precharge (early precharge) lEP (CL = 2) (CL = 3) Column command to column command Write command to data in latency DQM to data in DQM to data out CKE to CLK disable Register set to active command /CS to command disable Power-down exit to command input lEP lCCD lWCD lDID lDOD lCLE lMRD lCDD lPEC Notes: 1. lRCD to lRRD are recommended value. 2. Be valid [DESL] or [NOP] at next command of self-refresh exit. 3. Except [DESL] and [NOP] Data Sheet E1160E20 (Ver. 2.0) 9 EDS1216AHTA Block Diagram CLK CKE Clock Generator Bank 3 Bank 2 Bank 1 Row Address Buffer & Refresh Counter Address Mode Register Row Decoder Bank 0 Sense Amplifier Command Decoder Control Logic /CS /RAS /CAS /WE Data Control Circuit Input & Output Buffer Latch Circuit Column Address Buffer & Burst Counter Column Decoder & Latch Circuit UDQM and LDQM DQ Data Sheet E1160E20 (Ver. 2.0) 10 EDS1216AHTA Pin Function CLK (input pin) CLK is the master clock input. Other inputs signals are referenced to the CLK rising edge. CKE (input pins) CKE determine validity of the next CLK (clock). If CKE is high, the next CLK rising edge is valid; otherwise it is invalid. If the CLK rising edge is invalid, the internal clock is not issued and the Synchronous DRAM suspends operation. When the Synchronous DRAM is not in burst mode and CKE is negated, the device enters power-down mode. During power-down mode, CKE must remain low. /CS (input pins) /CS low starts the command input cycle. When /CS is high, commands are ignored but operations continue. /RAS, /CAS, and /WE (input pins) /RAS, /CAS and /WE have the same symbols on conventional DRAM but different functions. For details, refer to the command table. A0 to A11 (input pins) Row address (AX0 to AX11) is determined by A0 to A11 at the bank active command cycle CLK rising edge. Column address is determined by A0 to A8 (see Address Pins Table) at the read or write command cycle CLK rising edge. And this column address becomes burst access start address. [Address Pins Table] Address (A0 to A11) Part number EDS1216AHTA Row address AX0 to AX11 Column address AY0 to AY8 A10 defines the precharge mode. When A10 = High at the precharge command cycle, all banks are precharged. But when A10 = Low at the precharge command cycle, only the bank that is selected by BA0 and BA1 (BS) is precharged. For details refer to the command operation section. BA0 and BA1 (input pin) BA0 and BA1 are bank select signal. (See Bank Select Signal Table) [Bank Select Signal Table] BA0 Bank 0 Bank 1 Bank 2 Bank 3 L H L H BA1 L L H H Remark: H: VIH. L: VIL. UDQM and LDQM (input pins) UDQM and LDQM control input/output buffers. UDQM and LDQM control upper byte (DQ8 to DQ15) and lower byte (DQ0 to DQ7). Read operation: If DQM is High, the output buffer becomes High-Z. If the DQM is Low, the output buffer becomes Low-Z. (The latency of DQM during reading is 2 clocks.) Write operation: If DQM is High, the previous data is held (the new data is not written). If DQM is Low, the data is written. (The latency of DQM during writing is 0 clock.) Data Sheet E1160E20 (Ver. 2.0) 11 EDS1216AHTA DQ0 to DQ15 (input/output pins) DQ pins have the same function as I/O pins on a conventional DRAM. VDD, VSS, VDDQ, VSSQ (Power supply) VDD and VSS are power supply pins for internal circuits. VDDQ and VSSQ are power supply pins for the output buffers. Data Sheet E1160E20 (Ver. 2.0) 12 EDS1216AHTA Command Operation Command Truth Table The SDRAM recognizes the following commands specified by the /CS, /RAS, /CAS, /WE and address pins. CKE Function Device deselect No operation Burst stop Read Read with auto precharge Write Write with auto precharge Bank activate Precharge select bank Precharge all banks Mode register set Symbol DESL NOP BST READ READA WRIT WRITA ACT PRE PALL MRS n–1 H H H H H H H H H H H n × × × × × × × × × × × /CS H L L L L L L L L L L /RAS × H H H H H H L L L L /CAS × H H L L L L H H H L /WE × H L H H L L H L L L BA1 × × × V V V V V V × L BA0 × × × V V V V V V × L A10 × × × L H L H V L H L A0 to A11 × × × V V V V V × × V Remark: H: VIH. L: VIL. ×: VIH or VIL. V: Valid address input. Device deselect command [DESL] When this command is set (/CS is High), the SDRAM ignore command input at the clock. However, the internal status is held. No operation [NOP] This command is not an execution command. However, the internal operations continue. Burst stop command [BST] This command can stop the current burst operation. Column address strobe and read command [READ] This command starts a read operation. In addition, the start address of burst read is determined by the column address (see Address Pins Table in Pin Function) and the bank select address (BA0, BA1). After the read operation, the output buffer becomes High-Z. Read with auto-precharge [READA] This command automatically performs a precharge operation after a burst read with a burst length of 1, 2, 4 or 8. Column address strobe and write command [WRIT] This command starts a write operation. When the burst write mode is selected, the column address (see Address Pins Table in Pin Function) and the bank select address (BA0, BA1) become the burst write start address. When the single write mode is selected, data is only written to the location specified by the column address (see Address Pins Table in Pin Function) and the bank select address (BA0, BA1). Write with auto-precharge [WRITA] This command automatically performs a precharge operation after a burst write with a length of 1, 2, 4 or 8, or after a single write operation. Data Sheet E1160E20 (Ver. 2.0) 13 EDS1216AHTA Row address strobe and bank activate [ACT] This command activates the bank that is selected by BA0, BA1 and determines the row address (A0 to A11). (See Bank Select Signal Table) Precharge selected bank [PRE] This command starts precharge operation for the bank selected by BA0, BA1. (See Bank Select Signal Table) [Bank Select Signal Table] BA0 Bank 0 Bank 1 Bank 2 Bank 3 L H L H BA1 L L H H Remark: H: VIH. L: VIL. Precharge all banks [PALL] This command starts a precharge operation for all banks. Refresh [REF/SELF] This command starts the refresh operation. There are two types of refresh operation, the one is auto-refresh, and the other is self-refresh. For details, refer to the CKE truth table section. Mode register set [MRS] The SDRAM has a mode register that defines how it operates. The mode register is specified by the address pins (A0 to BA0 and BA1) at the mode register set cycle. For details, refer to the Mode Register Configuration. After power on, the contents of the mode register are undefined, execute the mode register set command to set up the mode register. Data Sheet E1160E20 (Ver. 2.0) 14 EDS1216AHTA DQM Truth Table CKE Commands Upper byte write enable/output enable Lower byte write enable/output enable Upper byte write inhibit/output disable Lower byte write inhibit/output disable Symbol ENBU ENBL MASKU MASKL n–1 H H H H n × × × × UDQM L × H × LDQM × L × H Remark: H: VIH. L: VIL. ×: VIH or VIL Write: lDID is needed. Read: lDOD is needed. CKE Truth Table CKE Current state Activating Any Clock suspend Idle Idle Self-refresh Idle Power-down Function Clock suspend mode entry Clock suspend mode Clock suspend mode exit CBR (auto) refresh command Self-refresh entry Self-refresh exit Power-down entry Power-down exit REF SELF Symbol n–1 H L L H H L L H H L L n L L H H L H H L L H H /CS × × × L L L H L H H L /RAS × × × L L H × H × × H /CAS × × × L L H × H × × H /WE × × × H H H × H × × H Address × × × × × × × × × × × Remark: H: VIH. L: VIL. ×: VIH or VIL Data Sheet E1160E20 (Ver. 2.0) 15 EDS1216AHTA Function Truth Table The following table shows the operations that are performed when each command is issued in each mode of the SDRAM. The following table assumes that CKE is high. Current state Precharge /CS H L L L L L L L L Idle H L L L L L L L L Row active H L L L L L L L L Read H L L L L L L L L /RAS × H H H H L L L L × H H H H L L L L × H H H H L L L L × H H H H L L L L /CAS × H H L L H H L L × H H L L H H L L × H H L L H H L L × H H L L H H L L /WE × H L H L H L H L × H L H L H L H L × H L H L H L H L × H L H L H L H L Address × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS Operation Enter IDLE after tRP Enter IDLE after tRP ILLEGAL ILLEGAL* ILLEGAL* ILLEGAL* NOP* 5 3 3 3 ILLEGAL ILLEGAL NOP NOP ILLEGAL ILLEGAL* ILLEGAL* 4 4 Bank and row active NOP Refresh Mode register set* NOP NOP ILLEGAL Begin read* 6 6 8 Begin write* Other bank active 2 ILLEGAL on same bank* Precharge* ILLEGAL ILLEGAL Continue burst to end Continue burst to end Burst stop Continue burst read to /CAS latency and New read Term burst read/start write Other bank active 2 ILLEGAL on same bank* Term burst read and Precharge ILLEGAL ILLEGAL 7 Data Sheet E1160E20 (Ver. 2.0) 16 EDS1216AHTA Current state Read with autoprecharge /CS H L L L L L L L L /RAS × H H H H L L L L × H H H H L L L L × H H H H L L L L × H H H H L L L L /CAS × H H L L H H L L × H H L L H H L L × H H L L H H L L × H H L L H H L L /WE × H L H L H L H L × H L H L H L H L × H L H L H L H L × H L H L H L H L Address × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS Operation Continue burst to end and precharge Continue burst to end and precharge ILLEGAL ILLEGAL* ILLEGAL* 3 3 Other bank active 2 ILLEGAL on same bank* ILLEGAL* ILLEGAL ILLEGAL Continue burst to end Continue burst to end Burst stop Term burst and New read Term burst and New write Other bank active 3 ILLEGAL on same bank* Term burst write and Precharge* ILLEGAL ILLEGAL Continue burst to end and precharge Continue burst to end and precharge ILLEGAL ILLEGAL* ILLEGAL* 3 3 1 3 Write H L L L L L L L L Write with autoprecharge H L L L L L L L L Other bank active 3 ILLEGAL on same bank* ILLEGAL* ILLEGAL ILLEGAL Enter IDLE after tRC Enter IDLE after tRC ILLEGAL ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL* ILLEGAL ILLEGAL 4 4 4 4 3 Refresh (auto-refresh) H L L L L L L L L Data Sheet E1160E20 (Ver. 2.0) 17 EDS1216AHTA Current state Mode register set /CS H L L L L L L L L /RAS × H H H H L L L L /CAS × H H L L H H L L /WE × H L H L H L H L Address × × × BA, CA, A10 BA, CA, A10 BA, RA BA, A10 × MODE Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE, PALL REF, SELF MRS Operation NOP NOP ILLEGAL ILLEGAL* ILLEGAL* 4 4 9 Bank and row active* NOP Refresh* 9 8 Mode register set* Remark: H: VIH. L: VIL. ×: VIH or VIL Notes: 1. An interval of tDPL is required between the final valid data input and the precharge command. 2. If tRRD is not satisfied, this operation is illegal. 3. Illegal for same bank, except for another bank. 4. Illegal for all banks. 5. NOP for same bank, except for another bank. 6. Illegal if tRCD is not satisfied. 7. Illegal if tRAS is not satisfied. 8. MRS command must be issued after DOUT finished, in case of DOUT remaining. 9. Illegal if lMRD is not satisfied. Data Sheet E1160E20 (Ver. 2.0) 18 EDS1216AHTA Command Truth Table for CKE CKE Current State Self-refresh n–1 n H L L L L L Self-refresh recovery H H H H H H H H Power-down H L L L All banks idle H H H H H H H H H H L L Row active H L Any state other than listed above H H L L × H H H H L H H H H L L L L × H H L H H H H H L L L L L H L × × H L H L /CS × H L L L × H L L L H L L L × H L × H L L L L H L L L L × × × × × × × × /RAS /CAS /WE Address × × H H L × × H H L × H H L × × H × × H L L L × H L L L × × × × × × × × × × H L × × × H L × × H L × × × H × × × H L L × × H L L × × × × × × × × × × × × × × × × × × × × × × × × H × × × × H L × × × H L × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × Operation INVALID, CLK (n – 1) would exit self-refresh Self-refresh recovery Self-refresh recovery ILLEGAL ILLEGAL Continue self-refresh Idle after tRC Idle after tRC ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL INVALID, CLK (n – 1) would exit power-down EXIT power-down EXIT power-down Continue power-down mode Refer to operations in Function Truth Table Refer to operations in Function Truth Table Refer to operations in Function Truth Table CBR (auto) Refresh Notes OPCODE Refer to operations in Function Truth Table Begin power-down next cycle Refer to operations in Function Truth Table Refer to operations in Function Truth Table Self-refresh 1 OPCODE Refer to operations in Function Truth Table Exit power-down next cycle Power-down Refer to operations in Function Truth Table Clock suspend Refer to operations in Function Truth Table Begin clock suspend next cycle Exit clock suspend next cycle Maintain clock suspend 2 1 1 Remark: H: VIH. L: VIL. ×: VIH or VIL Notes: 1. Self-refresh can be entered only from the all banks idle state. Power-down can be entered only from all banks idle. Clock suspend can be entered only from following states, row active, read, read with autoprecharge, write and write with auto precharge. 2. Must be legal command as defined in Function Truth Table. Data Sheet E1160E20 (Ver. 2.0) 19 EDS1216AHTA Clock suspend mode entry The SDRAM enters clock suspend mode from active mode by setting CKE to Low. If command is input in the clock suspend mode entry cycle, the command is valid. The clock suspend mode changes depending on the current status (1 clock before) as shown below. ACTIVE clock suspend This suspend mode ignores inputs after the next clock by internally maintaining the bank active status. READ suspend and READ with Auto-precharge suspend The data being output is held (and continues to be output). WRITE suspend and WRIT with Auto-precharge suspend In this mode, external signals are not accepted. However, the internal state is held. Clock suspend During clock suspend mode, keep the CKE to Low. Clock suspend mode exit The SDRAM exits from clock suspend mode by setting CKE to High during the clock suspend state. IDLE In this state, all banks are not selected, and completed precharge operation. Auto-refresh command [REF] When this command is input from the IDLE state, the SDRAM starts auto-refresh operation. (The auto-refresh is the same as the CBR refresh of conventional DRAMs.) During the auto-refresh operation, refresh address and bank select address are generated inside the SDRAM. For every auto-refresh cycle, the internal address counter is updated. Accordingly, 4096 times are required to refresh the entire memory. Before executing the auto-refresh command, all the banks must be in the IDLE state. In addition, since the precharge for all banks is automatically performed after auto-refresh, no precharge command is required after auto-refresh. Self-refresh entry [SELF] When this command is input during the IDLE state, the SDRAM starts self-refresh operation. After the execution of this command, self-refresh continues while CKE is Low. Since self-refresh is performed internally and automatically, external refresh operations are unnecessary. Power-down mode entry When this command is executed during the IDLE state, the SDRAM enters power-down mode. In power-down mode, power consumption is suppressed by cutting off the initial input circuit. Self-refresh exit When this command is executed during self-refresh mode, the SDRAM can exit from self-refresh mode. After exiting from self-refresh mode, the SDRAM enters the IDLE state. Power-down exit When this command is executed at the power-down mode, the SDRAM can exit from power-down mode. After exiting from power-down mode, the SDRAM enters the IDLE state. Data Sheet E1160E20 (Ver. 2.0) 20 EDS1216AHTA Simplified State Diagram SELF REFRESH SR ENTRY SR EXIT MODE REGISTER SET MRS IDLE REFRESH *1 AUTO REFRESH CKE CKE_ IDLE POWER DOWN ACTIVE CLOCK SUSPEND ACTIVE CKE_ CKE ROW ACTIVE BST BST WRITE Write WRITE SUSPEND CKE_ WRITE CKE WRITE WITH AP CKE_ WRITEA SUSPEND WRITEA CKE PRECHARGE READ WITH AP WRITE WITH AP READ READ WITH AP WRITE READ Read CKE_ READ CKE READ WITH AP CKE_ READA CKE PRECHARGE READA SUSPEND READ SUSPEND WRITE WITH AP PRECHARGE POWER APPLIED POWER ON PRECHARGE PRECHARGE Automatic transition after completion of command. Transition resulting from command input. Note: 1. After the auto-refresh operation, precharge operation is performed automatically and enter the IDLE state. Data Sheet E1160E20 (Ver. 2.0) 21 EDS1216AHTA Mode Register Configuration Mode Register Set The mode register is set by the input to the address pins (A0 to A11, BA0 and BA1) during mode register set cycles. The mode register consists of five sections, each of which is assigned to address pins. BA1, BA0, A8, A9, A10, A11: (OPCODE): The SDRAM has two types of write modes. One is the burst write mode, and the other is the single write mode. These bits specify write mode. Burst read and burst write: Burst write is performed for the specified burst length starting from the column address specified in the write cycle. Burst read and single write: Data is only written to the column address specified during the write cycle, regardless of the burst length. A7: Keep this bit Low at the mode register set cycle. If this pin is high, the vender test mode is set. A6, A5, A4: (LMODE): These pins specify the /CAS latency. A3: (BT): A burst type is specified. A2, A1, A0: (BL): These pins specify the burst length. BA1 BA0 A11 A10 A9 A8 A7 0 A6 A5 LMODE A4 A3 BT A2 A1 BL A0 OPCODE A6 A5 A4 0 0 0 0 1 0 0 1 1 X 0 1 0 1 X CAS latency R R 2 3 R A3 Burst type 0 1 Sequential Interleave A2 A1 A0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Burst length BT=0 1 2 4 8 R R R F.P. BT=1 1 2 4 8 R R R R BA1 BA0 A11 0 0 0 0 0 1 1 0 0 0 0 1 0 1 0 X X X X X X A10 0 X X X X X X A9 0 0 1 1 X X X A8 0 1 0 1 X X X Write mode Burst read and burst write R Burst read and single write R R R R F.P.: Full Page R is Reserved (inhibit) X: 0 or 1 Mode Register Set Data Sheet E1160E20 (Ver. 2.0) 22 EDS1216AHTA Burst length = 2 Starting Ad. Addressing(decimal) A0 0 1 Sequential Interleave 0, 1, 1, 0, 0, 1, 1, 0, Burst length = 4 Starting Ad. Addressing(decimal) A1 0 0 1 1 A0 0 1 0 1 Sequential 0, 1, 2, 3, 1, 2, 3, 0, 2, 3, 0, 1, 3, 0, 1, 2, Interleave 0, 1, 2, 3, 1, 0, 3, 2, 2, 3, 0, 1, 3, 2, 1, 0, Burst length = 8 Starting Ad. A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Addressing(decimal) Interleave 0, 1, 2, 3, 4, 5, 6, 7, 1, 0, 3, 2, 5, 4, 7, 6, 2, 3, 0, 1, 6, 7, 4, 5, 3, 2, 1, 0, 7, 6, 5, 4, 4, 5, 6, 7, 0, 1, 2, 3, 5, 4, 7, 6, 1, 0, 3, 2, 6, 7, 4, 5, 2, 3, 0, 1, 7, 6, 5, 4, 3, 2, 1, 0, 0, 1, 2, 3, 4, 5, 6, 7, 1, 2, 3, 4, 5, 6, 7, 0, 2, 3, 4, 5, 6, 7, 0, 1, 3, 4, 5, 6, 7, 0, 1, 2, 4, 5, 6, 7, 0, 1, 2, 3, 5, 6, 7, 0, 1, 2, 3, 4, 6, 7, 0, 1, 2, 3, 4, 5, 7, 0, 1, 2, 3, 4, 5, 6, A0 Sequential Burst Sequence Full page burst is available only for sequential addressing. The addressing sequence is started from the column address that is asserted by read/write command. And the address is increased one by one. It is back to the address 0 when the address reaches at the end of address 511. “Full page burst” stops the burst read/write with burst stop command. Data Sheet E1160E20 (Ver. 2.0) 23 EDS1216AHTA Power-up sequence Power-up sequence 1. Apply VDD and VDDQ at the same time. Keep CKE low during power up. 2. Wait for stable power. 3. Start clock and drive CKE high. Note: Voltage on any input pin must not exceed VDD + 0.3V during power up. Initialization sequence 4. 5. 6. 7. After stable power and stable clock, wait 200μs. Issue precharge all command (PALL). After tRP delay, issue 8 or more auto-refresh commands (REF). Set the mode register set command (MRS) to initialize the mode register. Note: We recommend that you keep DQM and CKE high during initialization sequence to prevent data contention on the DQ bus. Power up sequence Initialization sequence VDD, VDDQ 0V CKE Low CLK l RP Command Power stable Clock stable PALL REF l RC REF l RC MRS l MRD CMD Power-up and Initialization sequence Data Sheet E1160E20 (Ver. 2.0) 24 EDS1216AHTA Operation of the SDRAM Read/Write Operations Bank active Before executing a read or write operation, the corresponding bank and the row address must be activated by the bank active (ACT) command. An interval of tRCD is required between the bank active command input and the following read/write command input. Read operation A read operation starts when a read command is input. Output buffer becomes Low-Z in the (/CAS Latency - 1) cycle after read command set. The SDRAM can perform a burst read operation. The burst length can be set to 1, 2, 4 and 8. The start address for a burst read is specified by the column address and the bank select address at the read command set cycle. In a read operation, data output starts after the number of clocks specified by the /CAS Latency. The /CAS Latency can be set to 2 or 3. When the burst length is 1, 2, 4 and 8 the DOUT buffer automatically becomes High-Z at the next clock after the successive burst-length data has been output. The /CAS latency and burst length must be specified at the mode register. CLK tRCD Command ACT READ Address Row Column DQ CL = 2 CL = 3 out 0 out 1 out 0 out 2 out 1 out 3 out 2 out 3 CL = /CAS latency Burst Length = 4 /CAS Latency CLK tRCD Command Address ACT READ Row Column BL = 1 out 0 out 0 out 1 DQ BL = 2 out 0 out 1 out 2 out 3 BL = 4 out 0 out 1 out 2 out 3 out 4 out 5 out 6 out 7 BL = 8 BL : Burst Length /CAS Latency = 2 Burst Length Data Sheet E1160E20 (Ver. 2.0) 25 EDS1216AHTA Write operation Burst write or single write mode is selected by the OPCODE of the mode register. 1. Burst write: A burst write operation is enabled by setting OPCODE (A9, A8) to (0, 0). A burst write starts in the same clock as a write command set. (The latency of data input is 0 clock.) The burst length can be set to 1, 2, 4 and 8, like burst read operations. The write start address is specified by the column address and the bank select address at the write command set cycle. CLK tRCD Command Address ACT WRIT Row Column BL = 1 in 0 in 0 in 1 in 1 in 1 in 2 in 2 DQ BL = 2 in 0 in 3 in 3 in 4 in 5 in 6 in 7 BL = 4 in 0 BL = 8 CL = 2, 3 Burst write 2. Single write: A single write operation is enabled by setting OPCODE (A9, A8) to (1, 0). In a single write operation, data is only written to the column address and the bank select address specified by the write command set cycle without regard to the burst length setting. (The latency of data input is 0 clock). CLK tRCD Command ACT WRIT Address DQ Row Column in 0 Single write Data Sheet E1160E20 (Ver. 2.0) 26 EDS1216AHTA Auto Precharge Read with auto-precharge In this operation, since precharge is automatically performed after completing a read operation, a precharge command need not be executed after each read operation. The command executed for the same bank after the execution of this command must be the bank active (ACT) command. In addition, an interval defined by lAPR is required before execution of the next command. [Clock cycle time] /CAS latency 3 2 CLK Precharge start cycle 2 cycle before the final data is output 1 cycle before the final data is output CL=2 Command ACT lRAS READA ACT DQ out0 out1 out2 out3 lAPR CL=3 Command ACT lRAS DQ out0 out1 out2 out3 READA ACT Note: Internal auto-precharge starts at the timing indicated by " ". And an interval of tRAS (lRAS) is required between previous active (ACT) command and internal precharge " lAPR ". Burst Read (BL = 4) Write with auto-precharge In this operation, since precharge is automatically performed after completing a burst write or single write operation, a precharge command need not be executed after each write operation. The command executed for the same bank after the execution of this command must be the bank active (ACT) command. In addition, an interval of lDAL is required between the final valid data input and input of next command. CLK Command ACT ACT WRITA lRAS DQ in0 in1 in2 in3 lDAL Note: Internal auto-precharge starts at the timing indicated by " ". and an interval of tRAS (lRAS) is required between previous active (ACT) command and internal precharge " ". Burst Write (BL = 4) Data Sheet E1160E20 (Ver. 2.0) 27 EDS1216AHTA CLK Command ACT ACT WRITA lRAS DQ in lDAL Note: Internal auto-precharge starts at the timing indicated by " ". and an interval of tRAS (lRAS) is required between previous active (ACT) command and internal precharge " ". Single Write Data Sheet E1160E20 (Ver. 2.0) 28 EDS1216AHTA Burst Stop Command During a read cycle, when the burst stop command is issued, the burst read data are terminated and the data bus goes to High-Z after the /CAS latency from the burst stop command. CLK Command DQ (CL = 2) DQ (CL = 3) READ BST High-Z out out out out out out High-Z Burst Stop at Read During a write cycle, when the burst stop command is issued, the burst write data are terminated and data bus goes to High-Z at the same clock with the burst stop command. CLK Command DQ WRITE in in in in BST High-Z Burst Stop at Write Data Sheet E1160E20 (Ver. 2.0) 29 EDS1216AHTA Command Intervals Read command to Read command interval 1. Same bank, same ROW address: When another read command is executed at the same ROW address of the same bank as the preceding read command execution, the second read can be performed after an interval of no less than 1 clock. Even when the first command is a burst read that is not yet finished, the data read by the second command will be valid. CLK Command Address BS ACT READ READ Row Column A Column B DQ Bank0 Active out A0 out B0 out B1 out B2 out B3 Column =A Column =B Column =A Column =B Dout Read Read Dout CL = 3 BL = 4 Bank 0 READ to READ Command Interval (same ROW address in same bank) 2. Same bank, different ROW address: When the ROW address changes on same bank, consecutive read commands cannot be executed; it is necessary to separate the two read commands with a precharge command and a bank active command. 3. Different bank: When the bank changes, the second read can be performed after an interval of no less than 1 clock, provided that the other bank is in the bank active state. Even when the first command is a burst read that is not yet finished, the data read by the second command will be valid. CLK Command Address ACT Row 0 ACT Row 1 READ READ Column A Column B BS DQ Bank0 Active Bank3 Bank0 Bank3 Active Read Read out A0 out B0 out B1 out B2 out B3 Bank0 Bank3 Dout Dout CL = 3 BL = 4 READ to READ Command Interval (different bank) Data Sheet E1160E20 (Ver. 2.0) 30 EDS1216AHTA Write command to Write command interval 1. Same bank, same ROW address: When another write command is executed at the same ROW address of the same bank as the preceding write command, the second write can be performed after an interval of no less than 1 clock. In the case of burst writes, the second write command has priority. CLK Command Address ACT WRIT WRIT Row Column A Column B BS DQ Bank0 Active in A0 in B0 in B1 in B2 in B3 Column =A Column =B Write Write Burst Write Mode BL = 4 Bank 0 WRITE to WRITE Command Interval (same ROW address in same bank) 2. Same bank, different ROW address: When the ROW address changes, consecutive write commands cannot be executed; it is necessary to separate the two write commands with a precharge command and a bank active command. 3. Different bank: When the bank changes, the second write can be performed after an interval of no less than 1 clock, provided that the other bank is in the bank active state. In the case of burst write, the second write command has priority. CLK Command Address BS ACT ACT WRIT WRIT Row 0 Row 1 Column A Column B DQ Bank0 Active in A0 in B0 in B1 in B2 in B3 Bank3 Bank0 Bank3 Active Write Write Burst Write Mode BL = 4 WRITE to WRITE Command Interval (different bank) Data Sheet E1160E20 (Ver. 2.0) 31 EDS1216AHTA Read command to Write command interval 1. Same bank, same ROW address: When the write command is executed at the same ROW address of the same bank as the preceding read command, the write command can be performed after an interval of no less than 1 clock. However, UDQM and LDQM must be set High so that the output buffer becomes High-Z before data input. CLK Command READ WRIT UDQM CL=2 LDQM CL=3 DQ (input) in B0 High-Z in B1 in B2 in B3 DQ (output) BL = 4 Burst write READ to WRITE Command Interval (1) CLK Command READ WRIT UDQM LDQM CL=2 out 2 clock out out out out in in in in in in in in DQ CL=3 READ to WRITE Command Interval (2) 2. Same bank, different ROW address: When the ROW address changes, consecutive write commands cannot be executed; it is necessary to separate the two commands with a precharge command and a bank active command. 3. Different bank: When the bank changes, the write command can be performed after an interval of no less than 1 cycle, provided that the other bank is in the bank active state. However, UDQM and LDQM must be set High so that the output buffer becomes High-Z before data input. Data Sheet E1160E20 (Ver. 2.0) 32 EDS1216AHTA Write command to Read command interval: 1. Same bank, same ROW address: When the read command is executed at the same ROW address of the same bank as the preceding write command, the read command can be performed after an interval of no less than 1 clock. However, in the case of a burst write, data will continue to be written until one clock before the read command is executed. CLK Command UDQM LDQM DQ (input) DQ (output) WRIT READ in A0 out B0 Column = A Write Column = B Read out B1 out B2 out B3 Burst Write Mode CL = 2 BL = 4 Bank 0 /CAS Latency Column = B Dout WRITE to READ Command Interval (1) CLK Command UDQM LDQM DQ (input) DQ (output) Column = A Write Column = B Read in A0 in A1 out B0 out B1 out B2 out B3 Burst Write Mode CL = 2 BL = 4 Bank 0 WRIT READ /CAS Latency Column = B Dout WRITE to READ Command Interval (2) 2. Same bank, different ROW address: When the ROW address changes, consecutive read commands cannot be executed; it is necessary to separate the two commands with a precharge command and a bank active command. 3. Different bank: When the bank changes, the read command can be performed after an interval of no less than 1 clock, provided that the other bank is in the bank active state. However, in the case of a burst write, data will continue to be written until one clock before the read command is executed (as in the case of the same bank and the same address). Data Sheet E1160E20 (Ver. 2.0) 33 EDS1216AHTA Read with auto precharge to Read command interval 1. Different bank: When some banks are in the active state, the second read command (another bank) is executed. Even when the first read with auto-precharge is a burst read that is not yet finished, the data read by the second command is valid. The internal auto-precharge of one bank starts at the next clock of the second command. CLK Command BS DQ bank0 Read A bank3 Read ". out A0 out A1 out B0 out B1 CL= 3 BL = 4 READA READ Note: Internal auto-precharge starts at the timing indicated by " Read with Auto Precharge to Read Command Interval (Different bank) 2. Same bank: The consecutive read command (the same bank) is illegal. Write with auto precharge to Write command interval 1. Different bank: When some banks are in the active state, the second write command (another bank) is executed. In the case of burst writes, the second write command has priority. The internal auto-precharge of one bank starts 2 clocks later from the second command. CLK Command BS DQ in A0 bank0 Write A in A1 in B0 bank3 Write ". in B1 in B2 in B3 BL= 4 WRITA WRIT Note: Internal auto-precharge starts at the timing indicated by " Write with Auto Precharge to Write Command Interval (Different bank) 2. Same bank: The consecutive write command (the same bank) is illegal. Data Sheet E1160E20 (Ver. 2.0) 34 EDS1216AHTA Read with auto precharge to Write command interval 1. Different bank: When some banks are in the active state, the second write command (another bank) is executed. However, UDQM and LDQM must be set High so that the output buffer becomes High-Z before data input. The internal auto-precharge of one bank starts at the next clock of the second command. CLK Command BS UDQM LDQM CL = 2 CL = 3 in B0 in B1 in B2 in B3 READA WRIT DQ (input) DQ (output) bank0 ReadA High-Z bank3 Write ". BL = 4 Note: Internal auto-precharge starts at the timing indicated by " Read with Auto Precharge to Write Command Interval (Different bank) 2. Same bank: The consecutive write command from read with auto precharge (the same bank) is illegal. It is necessary to separate the two commands with a bank active command. Write with auto precharge to Read command interval 1. Different bank: When some banks are in the active state, the second read command (another bank) is executed. However, in case of a burst write, data will continue to be written until one clock before the read command is executed. The internal auto-precharge of one bank starts at 2 clocks later from the second command. CLK Command BS UDQM LDQM DQ (input) DQ (output) bank0 WriteA bank3 Read ". in A0 out B0 out B1 out B2 out B3 CL = 3 BL = 4 WRITA READ Note: Internal auto-precharge starts at the timing indicated by " Write with Auto Precharge to Read Command Interval (Different bank) 2. Same bank: The consecutive read command from write with auto precharge (the same bank) is illegal. It is necessary to separate the two commands with a bank active command. Data Sheet E1160E20 (Ver. 2.0) 35 EDS1216AHTA Read command to Precharge command interval (same bank) When the precharge command is executed for the same bank as the read command that preceded it, the minimum interval between the two commands is one clock. However, since the output buffer then becomes High-Z after the clocks defined by lHZP, there is a case of interruption to burst read data output will be interrupted, if the precharge command is input during burst read. To read all data by burst read, the clocks defined by lEP must be assured as an interval from the final data output to precharge command execution. CLK Command READ PRE/PALL DQ out A0 out A1 out A2 out A3 CL=2 lEP = -1 cycle READ to PRECHARGE Command Interval (same bank): To output all data (CL = 2, BL = 4) CLK Command READ PRE/PALL DQ out A0 out A1 out A2 out A3 CL=3 lEP = -2 cycle READ to PRECHARGE Command Interval (same bank): To output all data (CL = 3, BL = 4) CLK Command READ PRE/PALL High-Z DQ out A0 lHZP = 2 READ to PRECHARGE Command Interval (same bank): To stop output data (CL = 2, BL = 1, 2, 4, 8) CLK Command READ PRE/PALL High-Z DQ out A0 lHZP =3 READ to PRECHARGE Command Interval (same bank): To stop output data (CL = 3, BL = 1, 2, 4, 8) Data Sheet E1160E20 (Ver. 2.0) 36 EDS1216AHTA Write command to Precharge command interval (same bank) When the precharge command is executed for the same bank as the write command that preceded it, the minimum interval between the two commands is 1 clock. However, if the burst write operation is unfinished, the input data must be masked by means of UDQM and LDQM for assurance of the clock defined by tDPL. CLK Command UDQM LDQM DQ in A0 in A1 in A2 WRIT PRE/PALL tDPL WRITE to PRECHARGE Command Interval (same bank) (BL = 4 (To stop write operation)) CLK Command UDQM LDQM WRIT PRE/PALL DQ in A0 in A1 in A2 in A3 tDPL WRITE to PRECHARGE Command Interval (same bank) (BL = 4 (To write all data)) Data Sheet E1160E20 (Ver. 2.0) 37 EDS1216AHTA Bank active command interval 1. Same bank: The interval between the two bank active commands must be no less than tRC. 2. In the case of different bank active commands: The interval between the two bank active commands must be no less than tRRD. CLK Command ACT ACT Address ROW ROW BS tRC Bank 0 Active Bank 0 Active Bank Active to Bank Active for Same Bank CLK Command Address ACT ROW:0 ACT ROW:1 BS tRRD Bank 0 Active Bank 3 Active Bank Active to Bank Active for Different Bank Mode register set to Bank active command interval The interval between setting the mode register and executing a bank active command must be no less than lMRD. CLK Command MRS ACT Address OPCODE BS & ROW lMRD Mode Register Set Bank Active Mode register set to Bank active command interval Data Sheet E1160E20 (Ver. 2.0) 38 EDS1216AHTA DQM Control The UDQM and LDQM mask the upper and lower bytes of the DQ data, respectively. The timing of UDQM and LDQM is different during reading and writing. Reading When data is read, the output buffer can be controlled by UDQM and LDQM. By setting UDQM and LDQM to Low, the output buffer becomes Low-Z, enabling data output. By setting UDQM and LDQM to High, the output buffer becomes High-Z, and the corresponding data is not output. However, internal reading operations continue. The latency of UDQM and LDQM during reading is 2 clocks. Writing Input data can be masked by UDQM and LDQM. By setting DQM to Low, data can be written. In addition, when UDQM and LDQM are set to High, the corresponding data is not written, and the previous data is held. The latency of UDQM and LDQM during writing is 0 clock. CLK UDQM LDQM DQ High-Z out 0 out 1 out 3 lDOD = 2 Latency Reading CLK UDQM LDQM DQ in 3 in 0 in 1 lDID = 0 Latency Writing Data Sheet E1160E20 (Ver. 2.0) 39 EDS1216AHTA Refresh Auto-refresh All the banks must be precharged before executing an auto-refresh command. Since the auto-refresh command updates the internal counter every time it is executed and determines the banks and the ROW addresses to be refreshed, external address specification is not required. The refresh cycles are required to refresh all the ROW addresses within tREF (max.). The output buffer becomes High-Z after auto-refresh start. In addition, since a precharge has been completed by an internal operation after the auto-refresh, an additional precharge operation by the precharge command is not required. Self-refresh After executing a self-refresh command, the self-refresh operation continues while CKE is held Low. During selfrefresh operation, all ROW addresses are refreshed by the internal refresh timer. A self-refresh is terminated by a self-refresh exit command. Before and after self-refresh mode, execute auto-refresh to all refresh addresses in or within tREF (max.) period on the condition 1 and 2 below. 1. Enter self-refresh mode within time as below* after either burst refresh or distributed refresh at equal interval to all refresh addresses are completed. 2. Start burst refresh or distributed refresh at equal interval to all refresh addresses within time as below*after exiting from self-refresh mode. Note: tREF (max.) / refresh cycles. Others Power-down mode The SDRAM enters power-down mode when CKE goes Low in the IDLE state. In power-down mode, power consumption is suppressed by deactivating the input initial circuit. Power-down mode continues while CKE is held Low. In addition, by setting CKE to High, the SDRAM exits from the power-down mode, and command input is enabled from the next clock. In this mode, internal refresh is not performed. Clock suspend mode By driving CKE to Low during a bank active or read/write operation, the SDRAM enters clock suspend mode. During clock suspend mode, external input signals are ignored and the internal state is maintained. When CKE is driven High, the SDRAM terminates clock suspend mode, and command input is enabled from the next clock. For details, refer to the "CKE Truth Table". Data Sheet E1160E20 (Ver. 2.0) 40 EDS1216AHTA Timing Waveforms Read Cycle tCK tCH t CL CLK t RC VIH CKE tRCD tSI tHI tSI tHI tRAS tSI tHI t RP tSI tHI /CS tSI tHI tSI tHI tSI tHI tSI tHI /RAS tSI tHI tSI tHI tSI tHI tSI tHI /CAS tSI tHI tSI tHI tSI tHI tSI tHI /WE tSI tHI tSI tHI tSI tHI tSI tHI BS tSI tHI tSI tHI tSI tHI tSI tHI A10 tSI tHI tSI tHI tSI tHI Address tSI tHI UDQM LDQM DQ (input) tAC tAC tAC tHZ DQ (output) t AC tOH Bank 0 Active Bank 0 Read tOH tOH Bank 0 Precharge tOH tLZ /CAS latency = 2 Burst length = 4 Bank 0 access = VIH or VIL = VOH or VOL Data Sheet E1160E20 (Ver. 2.0) 41 EDS1216AHTA Write Cycle tCK tCH tCL CLK tRC VIH CKE tRCD tSI tHI tSI tHI tSI tHI tSI tHI tRAS tRP /CS tSI tHI tSI tHI tSI tHI tSI tHI /RAS tSI tHI tSI tHI tSI tHI tSI tHI /CAS tSI tHI tSI tHI tSI tHI tSI tHI /WE tSI tHI tSI tHI tSI tHI tSI tHI tSI tHI tSI tHI tSI tHI BS tSI tHI A10 tSI tHI tSI tHI tSI tHI Address tSI tHI UDQM LDQM tSI t HI tSI tHI tSI tHI tSI tHI DQ (input) tDPL DQ (output) Bank 0 Active Bank 0 Write Bank 0 Precharge CL = 2 BL = 4 Bank 0 access = VIH or VIL Mode Register Set Cycle 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 CLK CKE /CS /RAS /CAS /WE BS Address UDQM LDQM DQ (output) DQ (input) lRP Precharge If needed Mode register Set VIH valid code R: b C: b C: b’ b High-Z lMRD Bank 3 Active b+3 b’ b’+1 b’+2 b’+3 lRCD Bank 3 Read Output mask lRCD = 3 /CAS latency = 3 Burst length = 4 = VIH or VIL Data Sheet E1160E20 (Ver. 2.0) 42 EDS1216AHTA Read Cycle/Write Cycle 0 CLK CKE /CS /RAS /CAS /WE BS Address UDQM, LDQM VIH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Read cycle /RAS-/CAS delay = 3 /CAS latency = 3 Burst length = 4 = VIH or VIL R:a C:a R:b a C:b a+1 a+2 a+3 Bank 3 Bank 0 Read Precharge C:b' b High-Z C:b" b'+1 b" b"+1 b"+2 b"+3 Bank 3 Precharge DQ (output) DQ (input) Bank 0 Active Bank 0 Read Bank 3 Active b+1 b+2 b+3 b' Bank 3 Read Bank 3 Read CKE /CS /RAS /CAS /WE BS Address UDQM, LDQM VIH Write cycle /RAS-/CAS delay = 3 /CAS latency = 3 Burst length = 4 = VIH or VIL R:a C:a R:b C:b High-Z C:b' C:b" DQ (output) DQ (input) Bank 0 Active a Bank 0 Write a+1 a+2 a+3 Bank 3 Active b Bank 3 Write b+1 b+2 b+3 b' Bank 0 Precharge Bank 3 Write b'+1 b" Bank 3 Write b"+1 b"+2 b"+3 Bank 3 Precharge Read/Single Write Cycle 0 CLK CKE /CS /RAS /CAS /WE BS Address R:a C:a R:b C:a' C:a a a Bank 0 Active Bank 0 Read Bank 3 Active 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 VIH UDQM, LDQM DQ (input) DQ (output) a+1 a+2 a+3 Bank 0 Bank 0 Write Read a a+1 a+2 a+3 Bank 0 Precharge Bank 3 Precharge CKE /CS /RAS /CAS /WE BS Address VIH R:a C:a R:b C:a a a a+1 a+3 Bank 0 Write C:b C:c b c UDQM, LDQM DQ (input) DQ (output) Bank 0 Active Bank 0 Read Bank 3 Active Bank 0 Bank 0 Write Write Bank 0 Precharge Read/Single write /RAS-/CAS delay = 3 /CAS latency = 3 Burst length = 4 = VIH or VIL Data Sheet E1160E20 (Ver. 2.0) 43 EDS1216AHTA Read/Burst Write Cycle 0 CLK CKE /CS /RAS /CAS /WE BS Address UDQM, LDQM DQ (input) DQ (output) Bank 0 Active Bank 0 Read Bank 3 Active 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 R:a C:a R:b C:a' a a a+1 a+2 a+3 Clock suspend a+1 a+2 a+3 Bank 0 Precharge Bank 3 Precharge Bank 0 Write CKE /CS /RAS /CAS /WE BS Address UDQM, LDQM DQ (input) DQ (output) VIH R:a C:a R:b C:a a a a+1 a+3 Bank 0 Write Bank 0 Precharge a+1 a+2 a+3 Bank 0 Active Bank 0 Read Bank 3 Active Read/Burst write /RAS-/CAS delay = 3 /CAS latency = 3 Burst length = 4 = VIH or VIL Auto-Refresh Cycle 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 CLK CKE /CS /RAS /CAS /WE BS Address UDQM LDQM A10=1 VIH R:a C:a DQ (input) DQ (output) High-Z a a+1 t RP Precharge If needed Auto Refresh t RC Auto Refresh t RC Active Bank 0 Read Bank 0 Refresh cycle and Read cycle /RAS-/CAS delay = 2 /CAS latency = 2 Burst length = 4 = VIH or VIL Data Sheet E1160E20 (Ver. 2.0) 44 EDS1216AHTA Self-Refresh Cycle CLK CKE /CS /RAS /CAS /WE BS Address A10=1 lSREX CKE Low UDQM LDQM DQ (input) DQ (output) t RP Precharge command If needed Self refresh entry command Self refresh exit ignore command or No operation High-Z t RC Next clock enable Self refresh entry command t RC Auto Next clock refresh enable Self refresh cycle /RAS-/CAS delay = 3 CL = 3 BL = 4 = VIH or VIL Clock Suspend Mode tSI tHI tSI 0 CLK CKE /CS /RAS /CAS /WE BS Address UDQM, LDQM DQ (output) DQ (input) R:a 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Read cycle /RAS-/CAS delay = 2 /CAS latency = 2 Burst length = 4 = VIH or VIL C:a R:b a a+1 a+2 High-Z C:b a+3 b b+1 b+2 b+3 Bank0 Active clock Active suspend start Active clock Bank0 suspend end Read Bank3 Active Read suspend start Read suspend end Bank3 Read Bank0 Precharge Earliest Bank3 Precharge CKE /CS /RAS /CAS /WE BS Address UDQM, LDQM DQ (output) DQ (input) Bank0 Active Active clock suspend start Write cycle /RAS-/CAS delay = 2 /CAS latency = 2 Burst length = 4 = VIH or VIL R:a C:a R:b High-Z C:b a a+1 a+2 Write suspend start a+3 b Write suspend end b+1 b+2 b+3 Earliest Bank3 Precharge Active clock Bank0 Bank3 supend end Write Active Bank3 Bank0 Write Precharge Data Sheet E1160E20 (Ver. 2.0) 45 EDS1216AHTA Power-Down Mode CLK CKE /CS /RAS /CAS /WE BS Address UDQM LDQM DQ (input) DQ (output) tRP Precharge command If needed Power down entry Power down /RAS-/CAS delay = 3 mode exit Active Bank 0 /CAS latency = 3 A10=1 CKE Low R: a High-Z Power down cycle Burst length = 4 = VIH or VIL Initialization Sequence 0 1 2 3 4 5 6 7 8 9 10 48 49 50 51 52 53 54 55 CLK CKE /CS /RAS /CAS /WE Address valid VIH High-Z tRP All banks Precharge Auto Refresh t RC Auto Refresh tRC lMRD Mode register Set Bank active If needed code Valid VIH UDQM LDQM DQ Data Sheet E1160E20 (Ver. 2.0) 46 EDS1216AHTA Package Drawing 54-pin Plastic TSOP(ll) Solder plating: Lead free (Sn-Bi) Unit: mm 22.22 ± 0.10*1 A 54 28 PIN#1 ID 1 0.80 27 B 0.25 to 0.45 0.91 max. 0.16 M S A B 0 to 8° 11.76 ± 0.20 10.16 0.80 Nom 0.25 0.09 to 0.21 1.0 ± 0.05 1.2 max. S 0.10 S 0.10 +0.08 −0.05 0.40 to 0.75 Note: 1. This dimension does not include mold protrusions or gate burrs. Mold protrusions and gate burrs shall not exceed 0.20mm per side. ECA-TS2-0168-01 Data Sheet E1160E20 (Ver. 2.0) 47 EDS1216AHTA Recommended Soldering Conditions Please consult with our sales offices for soldering conditions of the EDS1216AHTA. Type of Surface Mount Device EDS1216AHTA: 54-pin Plastic TSOP(ll) < Lead free (Sn-Bi) > Data Sheet E1160E20 (Ver. 2.0) 48 EDS1216AHTA N OTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR MOS DEVICES Exposing the MOS devices to a strong electric field can cause destruction of the gate oxide and ultimately degrade the MOS devices operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it, when once it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. MOS devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. MOS devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor MOS devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS DEVICES No connection for CMOS devices input pins can be a cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. The unused pins must be handled in accordance with the related specifications. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Power-on does not necessarily define initial status of MOS devices. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the MOS devices with reset function have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. MOS devices are not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for MOS devices having reset function. CME0107 Data Sheet E1160E20 (Ver. 2.0) 49 EDS1216AHTA The information in this document is subject to change without notice. Before using this document, confirm that this is the latest version. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Elpida Memory, Inc. Elpida Memory, Inc. does not assume any liability for infringement of any intellectual property rights (including but not limited to patents, copyrights, and circuit layout licenses) of Elpida Memory, Inc. or third parties by or arising from the use of the products or information listed in this document. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of Elpida Memory, Inc. or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of the customer's equipment shall be done under the full responsibility of the customer. Elpida Memory, Inc. assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. [Product applications] Be aware that this product is for use in typical electronic equipment for general-purpose applications. Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability. However, users are instructed to contact Elpida Memory's sales office before using the product in aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment, medical equipment for life support, or other such application in which especially high quality and reliability is demanded or where its failure or malfunction may directly threaten human life or cause risk of bodily injury. [Product usage] Design your application so that the product is used within the ranges and conditions guaranteed by Elpida Memory, Inc., including the maximum ratings, operating supply voltage range, heat radiation characteristics, installation conditions and other related characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when the product is used beyond the guaranteed ranges and conditions. Even within the guaranteed ranges and conditions, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. products does not cause bodily injury, fire or other consequential damage due to the operation of the Elpida Memory, Inc. product. [Usage environment] Usage in environments with special characteristics as listed below was not considered in the design. Accordingly, our company assumes no responsibility for loss of a customer or a third party when used in environments with the special characteristics listed below. Example: 1) Usage in liquids, including water, oils, chemicals and organic solvents. 2) Usage in exposure to direct sunlight or the outdoors, or in dusty places. 3) Usage involving exposure to significant amounts of corrosive gas, including sea air, CL 2 , H 2 S, NH 3 , SO 2 , and NO x . 4) Usage in environments with static electricity, or strong electromagnetic waves or radiation. 5) Usage in places where dew forms. 6) Usage in environments with mechanical vibration, impact, or stress. 7) Usage near heating elements, igniters, or flammable items. If you export the products or technology described in this document that are controlled by the Foreign Exchange and Foreign Trade Law of Japan, you must follow the necessary procedures in accordance with the relevant laws and regulations of Japan. Also, if you export products/technology controlled by U.S. export control regulations, or another country's export control laws or regulations, you must follow the necessary procedures in accordance with such laws or regulations. If these products/technology are sold, leased, or transferred to a third party, or a third party is granted license to use these products, that third party must be made aware that they are responsible for compliance with the relevant laws and regulations. M01E0706 Data Sheet E1160E20 (Ver. 2.0) 50