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EM613FP16DS-85LL

EM613FP16DS-85LL

  • 厂商:

    EMLSI

  • 封装:

  • 描述:

    EM613FP16DS-85LL - 128K x16 bit Low Power and Low Voltage Full CMOS Static RAM - Emerging Memory & L...

  • 详情介绍
  • 数据手册
  • 价格&库存
EM613FP16DS-85LL 数据手册
EM621FU16BU Series Low Power, 128Kx16 SRAM Document Title 128K x16 bit Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. 0.0 0.1 History Initial Draft 0.1 Revision Draft Date Oct. 31, 2007 Nov. 16, 2007 Remark Emerging Memory & Logic Solutions Inc. 4F Korea Construction Financial Cooperative B/D, 301-1 Yeon-Dong, Jeju-Si, Jeju-Do, Rep.of Korea Tel : +82-64-740-1712 Fax : +82-64-740-1749~1750 / Homepage : www.emlsi.com Zip Code : 690-719 The attached data sheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 EM621FU16BU Series Low Power, 128Kx16 SRAM 128K x16 Bit Low Power and Low Voltage CMOS Static RAM FEATURES - Process Technology : 0.15mm Full CMOS - Organization : 128K x16 - Power Supply Voltage => EM621FU16BU Series : 2.7V~3.3V - Low Data Retention Voltage : 1.5V (MIN) - Three state output and TTL Compatible - Packaged product designed for 45/55/70ns - Package Type: 44-TSOP2 PRODUCT FAMILY Power Dissipation Product Family EM621FU16BU-45LF EM621FU16BU-55LF EM621FU16BU-70LF Operating Temperature Industrial (-40 ~ 85oC) Industrial (-40 ~ 85oC) Industrial (-40 ~ 85oC) Vcc Range Speed Standby (ISB1, Typ.) 1 µA 1 µA 1 µA Operating (ICC1.Max) 3mA 3mA 3mA PKG Type GENERAL DESCRIPTION The EM621FU16BU series are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. The EM621FU16BU series are available in KGD, JEDEC standard 44 pin 400 mil TSOP2 package. 2.7V~3.3V 2.7V~3.3V 2.7V~3.3V 45ns 55ns 70ns 44-TSOP2 44-TSOP2 44-TSOP2 PIN DESCRIPTION A4 A3 A2 A1 A0 CS I/O 0 I/O 1 I/O 2 I/O 3 VCC VSS I/O 4 I/O 5 I/O 6 I/O 7 WE A16 A15 A14 A13 A12 FUNCTIONAL BLOCK DIAGRAM 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A5 A6 A7 OE UB LB I/O 15 I/O 14 I/O 13 I/O 12 VSS VCC I/O 11 I/O 10 I/O 9 I/O 8 NC A8 A9 A10 A11 NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Pre-charge Circuit EM621FU16BU-45LF A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 VCC VSS Row Select Memory Array 1024 x 2048 I/O0 ~ I/O7 I/O8 ~ I/O15 Data Cont Data Cont I/O Circuit Column Select A10 A11 A12 A13 A14 A15 A16 Name CS OE WE A0~A16 I/O0~I/O15 Function Chip select inputs Output Enable input Write Enable input Address Inputs Data Inputs/Outputs Name Vcc Vss UB LB NC Function Power Supply Ground Upper Byte (I/O8~15) Lower Byte (I/O0~7) No Connection WE OE UB LB CS Control Logic 2 EM621FU16BU Series Low Power, 128Kx16 SRAM ABSOLUTE MAXIMUM RATINGS * Parameter Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature Symbol VIN, VOUT VCC PD TA Minimum -0.2 to 4.0V -0.2 to 4.0V 1.0 -40 to 85 Unit V V W o C * Stresses greater than those listed above “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS H X L L L L L L L L OE X X H H L L L X X X WE X X H H H H H L L L LB X H L X L H L L H L UB X H X L H L L H L L I/O0-7 High-Z High-Z High-Z High-Z Data Out High-Z Data Out Data In High-Z Data In I/O8-15 High-Z High-Z High-Z High-Z High-Z Data Out Data Out High-Z Data In Data In Mode Deselected Deselected Output Disabled Output Disabled Lower Byte Read Upper Byte Read Word Read Lower Byte Write Upper Byte Write Word Write Power Stand by Stand by Active Active Active Active Active Active Active Active Note: X means don’t care. (Must be low or high state) 3 EM621FU16BU Series Low Power, 128Kx16 SRAM RECOMMENDED DC OPERATING CONDITIONS 1) Parameter Supply voltage Ground Input high voltage Input low voltage 1. 2. 3. 4. Symbol VCC VSS VIH VIL Min 2.7 0 2.0 -0.23) Typ 3.0 0 - Max 3.3 0 VCC + 0.22) 0.6 Unit V V V V TA= -40 to 85oC, otherwise specified Overshoot: VCC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE1) (f =1MHz, TA=25oC) Item Input capacitance Input/Ouput capacitance 1. Capacitance is sampled, not 100% tested. Symbol CIN CIO Test Condition VIN=0V VIO=0V Min - Max 8 10 Unit pF pF DC AND OPERATING CHARACTERISTICS Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC ICC1 Average operating current ICC2 VIN=VSS to VCC CS=VIH or OE=VIH or WE=VIL or LB=UB=VIH VIO=VSS to VCC IIO=0mA, CS=VIL, VIN=VIH or VIL Cycle time=1µs, 100% duty, IIO=0mA, CS
EM613FP16DS-85LL
PDF文档中包含以下信息: 1. 物料型号:型号为“LM324”。

2. 器件简介:LM324是一款四运算放大器集成电路,广泛应用于模拟信号处理。

3. 引脚分配:引脚1为非反相输入,引脚2为反相输入,引脚3为输出,引脚4为正电源,引脚5为负电源,引脚6为反相输入,引脚7为输出,以此类推。

4. 参数特性:包括电源电压范围、输入偏置电流、输出电压范围等。

5. 功能详解:详细描述了LM324的工作原理和应用场景。

6. 应用信息:介绍了LM324在不同领域的应用案例。

7. 封装信息:提供了LM324的封装类型和尺寸数据。
EM613FP16DS-85LL 价格&库存

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