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EM6160FS32DT-85LL

EM6160FS32DT-85LL

  • 厂商:

    EMLSI

  • 封装:

  • 描述:

    EM6160FS32DT-85LL - 256K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM - Emerging Memo...

  • 详情介绍
  • 数据手册
  • 价格&库存
EM6160FS32DT-85LL 数据手册
merging Memory & Logic Solutions Inc. Document Title 256K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM EM620FV8AS Series Low Power, 256Kx8 SRAM Revision History Revision No. 0.0 0.1 History Initial Draft 1’st Revision I CC2 value changed ( @70ns product : 20mA -> 25mA ) ( @55ns product : 25mA -> 30mA ) ISB1 Max. value changed from 5uA to 15uA. ISB1 Typ. value deleted. IDR Max. value changed to 5uA. IDR Typ. value deleted. Draft Date May 31 , 2004 Dec 14 , 2004 Remark 0.2 2’nd Revision Jan 4 , 2005 Emerging Memory & Logic Solutions Inc. 4F Korea Construction Financial Cooperative B/D, 301-1 Yeon-Dong, Jeju-Si, Jeju-Do, Rep.of Korea Tel : +82-64-740-1700 Fax : +82-64-740-1749~1750 / Homepage : www.emlsi.com Zip Code : 690-719 The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 Rev 0.2 merging Memory & Logic Solutions Inc. FEATURES • • • • • • Process Technology : 0.15µ m Full CMOS Organization : 256K x 8 bit Power Supply Voltage : 2.7V ~ 3.6V Low Data Retention Voltage : 1.5V(Min) Three state output and TTL Compatible Package Type : 32-sTSOP1 EM620FV8AS Series Low Power, 256Kx8 SRAM GENERAL DESCRIPTION The EM620FV8AS families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. PRODUCT FAMILY Power Dissipation Product Family Operating Temperature Industrial (-40 ~ 85oC) Vcc Range Speed Standby (ISB1 , Max) 15 µA Operating (I CC1.Max) 3 mA PKG Type EM620FV8AS 2.7V~3.6V 551) / 70ns 32 - sTSOP1 1. The parameter is measured with 30pF test load. PIN DESCRIPTION A11 A9 A8 A13 WE CS2 A15 VCC A17 A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 OE A10 CS1 IO8 IO7 IO6 IO5 IO4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3 FUNCTIONAL BLOCK DIAGRAM Pre-charge Circuit 23 22 21 20 19 18 17 R ow S elec t 32 - sTSOP Type1 - Forward 26 25 24 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 VC C VSS Memory Array 1024 x 2048 I/O1 ~ I/O8 Data Cont I/O Circuit Column Select N ame CS 1 ,CS 2 OE A 0 ~A17 I/O1 ~I/O 8 Function Chip select inputs O utput Enable input A ddress Inputs D ata Inputs/outputs Name WE Vcc Vss NC Function A A11 A12 A13 A A15 A A 10 14 16 17 Write Enable input Power Supply Ground No Connection WE OE C1 S C2 S Control Logic 2 Rev 0.2 merging Memory & Logic Solutions Inc. ABSOLUTE MAXIMUM RATINGS * Parameter Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature EM620FV8AS Series Low Power, 256Kx8 SRAM Symbol VIN , VOUT VCC PD TA Ratings -0.2 to Vcc+0.3 (Max. 4.0V) -0.2 to 4.0V 1.0 -40 to 85 Unit V V W oC * Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS 1 H X L L L CS 2 X L H H H OE X X H L X WE X X H H L I/O High-Z High-Z High-Z Data Out Data In Mode Deselected Deselected Output Disabled Read Write Power Stand by Stand by Active Active Active Note: X means don’t care. (Must be low or high state) 3 Rev 0.2 merging Memory & Logic Solutions Inc. RECOMMENDED DC OPERATING CONDITIONS 1) Parameter Supply voltage Ground Input high voltage Input low voltage 1. 2. 3. 4. EM620FV8AS Series Low Power, 256Kx8 SRAM Symbol VCC VSS VIH VIL Min 2.7 0 2.2 -0.23) Typ 3.3 0 - Max 3.6 0 VCC + 0.22) 0.6 Unit V V V V TA= -40 to 85oC, otherwise specified Overshoot: V CC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE 1) (f =1MHz, TA=25oC) Item Input capacitance Input/Ouput capacitance 1. Capacitance is sampled, not 100% tested Symbol C IN CIO Test Condition VIN=0V VIO =0V Min - Max 8 10 Unit pF pF DC AND OPERATING CHARACTERISTICS Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC I CC1 Average operating current I CC2 Output low voltage Output high voltage Standby Current (TTL) VOL VOH ISB V IN=V SS t o V CC C S 1 = VIH , CS2 =VIL o r OE=V IH o r WE =VIL , VIO= VSS t o V CC I IO=0mA, CS 1=V IL, CS 2=WE = VIH , VI N=VI H or VIL C ycle time=1 µs, 100% duty, I IO=0mA, CS 1< 0.2V, CS2 >V CC -0.2V, V IN< 0.2V or VIN >V CC-0.2V C ycle time = Min, I IO =0mA, 100% duty, CS 1=V IL, CS2 =V IH, V IN=V IL or VI H I OL = 2 .1mA I O H = - 1.0mA C S 1 = VIH , CS2 =VIL , Other inputs=V IH or V IL C S 1 >V CC-0.2V, CS 2>V C C-0.2V (CS 1 c ontrolled) or 0V
EM6160FS32DT-85LL
### 物料型号 - 型号:EM620FV8AS - 系列:低功耗、256Kx8位SRAM

### 器件简介 - 工艺技术:0.15µm全CMOS工艺 - 支持:工业温度范围,芯片级封装,低数据保持电压,适用于电池备份操作,低数据保持电流 - 组织:256K x 8位 - 电源电压:2.7V ~ 3.6V - 低数据保持电压:1.5V(最小) - 三态输出和TTL兼容 - 封装类型:32-SOP1

### 引脚分配 - CS1, CS2:芯片选择输入 - WE:写使能输入 - OE:输出使能输入 - Vcc:电源供应 - A0~A17:地址输入 - I/O1~I/O8:数据输入/输出 - NC:无连接

### 参数特性 - 操作温度范围:-40 ~ 85°C - 电源电压范围:2.7V ~ 3.6V - 待机功耗:15µA - 操作功耗:3mA

### 功能详解 - 功能块图:提供了芯片的功能块图,显示了芯片内部的逻辑结构。 - 绝对最大额定值:包括任何引脚相对于Vss的电压、Vcc供电相对于Vss的电压、功耗和操作温度。 - 功能描述:详细描述了不同引脚组合下的工作模式和功耗。

### 应用信息 - 应用:适用于需要低功耗和低电压操作的工业和商业环境,特别是在电池备份操作中。

### 封装信息 - 封装类型:32-SOP1 - 尺寸:提供了详细的封装尺寸图,单位为毫米/英寸。
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