EM6160FV8-85LF

EM6160FV8-85LF

  • 厂商:

    EMLSI

  • 封装:

  • 描述:

    EM6160FV8-85LF - 256K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM - Emerging Memory ...

  • 详情介绍
  • 数据手册
  • 价格&库存
EM6160FV8-85LF 数据手册
merging Memory & Logic Solutions Inc. Document Title 256K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM EM620FU8 Series Low Power, 256Kx8 SRAM Revision History Revision No. 0.0 0.1 History Initial Draft 2’nd Draft Add Pb-free part number Draft Date December 18, 2002 February 13 , 2004 Remark Emerging Memory & Logic Solutions Inc. IT Venture Tower Eastside 11F, 78, Karac-Dong, Songpa-Ku, Seoul, Rep.of Korea Zip Code : 138-160 Tel : +82-2-2142-1759~1766 Fax : +82-2-2142-1769 / Homepage : www.emlsi.com The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 merging Memory & Logic Solutions Inc. FEATURES • • • • • • Process Technology : 0.18µ m Full CMOS Organization : 256K x 8 bit Power Supply Voltage : 2.7V ~ 3.3V Low Data Retention Voltage : 1.5V(Min) Three state output and TTL Compatible Package Type : 36-FPBGA 6.0x7.0 EM620FU8 Series Low Power, 256Kx8 SRAM GENERAL DESCRIPTION The EM620FU8 families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. PRODUCT FAMILY Power Dissipation Product Family EM620FU8 Operating Temperature Industrial (-40 ~ 85oC) Vcc Range Speed Standby (ISB1 , Typ) 1 µA Operating (I CC1.Max) 2 mA PKG Type 36FPBGA 2.7V~3.3V 551) / 70ns 1. The parameter is measured with 30pF test load. PIN DESCRIPTION 1 A B C D E F G H 2 3 4 5 6 FUNCTIONAL BLOCK DIAGRAM Pre-charge Circuit A0 I/O 5 I/O 6 V SS VC C I/O 7 I/O 8 A9 A1 A2 CS2 WE DNU A3 A4 A5 A6 A7 A8 I/O1 I/O2 VCC V SS R ow S elec t A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 Data Cont VC C VSS Memory Array 1024 x 2048 I/O1 ~ I/O8 I/O Circuit Column Select DNU OE A10 CS1 A11 A17 A16 A12 A15 A13 I/O3 I/O4 A14 A A A12 A1 A A A A 10 11 3 14 15 16 17 36-FPBGA : Top view (ball down) W E O E CS 1 Control Logic N ame CS 1 ,CS 2 OE A 0 ~A17 I/O1 ~I/O 8 Function Chip select inputs O utput Enable input A ddress Inputs D ata Inputs/outputs Name WE Vcc Vss DNU Function Write Enable input Power Supply Ground Do Not Use CS 2 2 merging Memory & Logic Solutions Inc. ABSOLUTE MAXIMUM RATINGS * Parameter Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature EM620FU8 Series Low Power, 256Kx8 SRAM Symbol VIN , VOUT VCC PD TA Ratings -0.2 to Vcc+0.3 (Max. 4.0V) -0.2 to 4.0V 1.0 -40 to 85 Unit V V W oC * Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS 1 H X L L L CS 2 X L H H H OE X X H L X WE X X H H L I/O High-Z High-Z High-Z Data Out Data In Mode Deselected Deselected Output Disabled Read Write Power Stand by Stand by Active Active Active Note: X means don’t care. (Must be low or high state) 3 merging Memory & Logic Solutions Inc. RECOMMENDED DC OPERATING CONDITIONS 1) Parameter Supply voltage Ground Input high voltage Input low voltage 1. 2. 3. 4. EM620FU8 Series Low Power, 256Kx8 SRAM Symbol VCC VSS VIH VIL Min 2.7 0 2.0 -0.2 3) Typ 3.0 0 - Max 3.3 0 VCC + 0 .22) 0.6 Unit V V V V TA= -40 to 85oC, otherwise specified Overshoot: V CC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE 1) (f =1MHz, TA=25oC) Item Input capacitance Input/Ouput capacitance 1. Capacitance is sampled, not 100% tested Symbol C IN CIO Test Condition VIN=0V VIO =0V Min - Max 8 10 Unit pF pF DC AND OPERATING CHARACTERISTICS Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC I CC1 Average operating current I CC2 Output low voltage Output high voltage Standby Current (TTL) VOL VOH ISB V IN=V SS t o V CC C S 1 = VIH , CS2 =VIL o r OE=V IH o r WE =VIL , VIO= VSS t o V CC I IO=0mA, CS 1=V IL, CS 2=WE = VIH , VI N=VI H or VIL C ycle time=1 µs, 100% duty, I IO=0mA, CS 1< 0.2V, CS2 >V CC -0.2V, V IN< 0.2V or VIN >V CC-0.2V C ycle time = Min, I IO =0mA, 100% duty, CS 1=V IL, CS2 =V IH, V IN=V IL or VI H I OL = 2 .1mA I O H = - 1.0mA C S 1 = VIH , CS2 =VIL , Other inputs=V IH or V IL C S 1 >V CC-0.2V, CS 2>V C C-0.2V (CS 1 c ontrolled) or 0V
EM6160FV8-85LF
1. 物料型号: - 型号为EM620FU8系列,具体型号包含在EMXXXX编码中,其中: - EM代表EMLSI Memory。 - XXXXX代表型号、密度、选项、技术和工作电压的组合。 - 最后两位LL代表低功耗版本。

2. 器件简介: - EM620FU8系列是由EMLSI采用0.18微米全CMOS工艺技术生产的低功耗、256Kx8位的SRAM。 - 支持工业温度范围,适用于系统设计的芯片级封装(Chip Scale Package)。 - 支持低数据保持电压,适用于电池备份操作且数据保持电流低。

3. 引脚分配: - 芯片选择输入:CS1, CS2。 - 写使能输入:WE。 - 输出使能输入:OE。 - 地址输入:A0~A17。 - 数据输入/输出:I/O1~I/O8。 - 电源供电:Vcc。 - 地:Vss。 - 不使用:DNU。

4. 参数特性: - 工作电压:2.7V至3.3V。 - 低数据保持电压:1.5V(最小值)。 - 三态输出且与TTL兼容。 - 封装类型:36-FPBGA,尺寸6.0x7.0mm。

5. 功能详解: - 该SRAM支持读和写操作,具体时序参数包括读周期时间tRC、地址访问时间tAA等。 - 写操作包括写周期时间twc、芯片选择到写结束tcw1.tcw2等。 - 数据保持特性包括Vcc为数据保持电压VDR、数据保持电流DR等。

6. 应用信息: - 适用于需要低功耗和低电压操作的工业和商业应用,特别是在电池备份系统中。

7. 封装信息: - 封装类型为36球Fine Pitch BGA(0.75mm球间距)。 - 详细尺寸和公差信息在PDF文档的“PACKAGE DIMENSION”部分提供。
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