EM621FV16DU-70LL

EM621FV16DU-70LL

  • 厂商:

    EMLSI

  • 封装:

  • 描述:

    EM621FV16DU-70LL - 128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM - Emerging Memor...

  • 详情介绍
  • 数据手册
  • 价格&库存
EM621FV16DU-70LL 数据手册
merging Memory & Logic Solutions Inc. Document Title 128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM EM610FV8S Series Low Power, 128Kx8 SRAM Revision History Revision No. 0.0 0.1 History Initial Draft 2’nd Draft Add Pb-free part number Draft Date May 9 , 2003 February 13 , 2004 Remark Emerging Memory & Logic Solutions Inc. IT Venture Tower Eastside 11F, 78, Karac-Dong, Songpa-Ku, Seoul, Rep.of Korea Zip Code : 138-160 Tel : +82-2-2142-1759~1766 Fax : +82-2-2142-1769 / Homepage : www.emlsi.com The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 merging Memory & Logic Solutions Inc. FEATURES • • • • • • Process Technology : 0.18µ m Full CMOS Organization : 128K x 8 bit Power Supply Voltage : 2.7V ~ 3.6V Low Data Retention Voltage : 1.5V(Min) Three state output and TTL Compatible Package Type : 32-sTSOP1 EM610FV8S Series Low Power, 128Kx8 SRAM GENERAL DESCRIPTION The EM610FV8S families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. PRODUCT FAMILY Power Dissipation Product Family Operating Temperature Industrial (-40 ~ 85oC) Vcc Range Speed Standby (ISB1 , Typ) 0.5µA2) Operating (I CC1.Max) 3 mA PKG Type EM610FV8S 2.7V~3.6V 551) / 70ns 32 - sTSOP1 1. The parameter is measured with 30pF test load. 2. Typical values are measured at Vcc=3.3V, T A =25 oC and not 100% tested. PIN DESCRIPTION A11 A9 A8 A13 WE CS2 A15 VCC NC A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 OE A10 CS1 IO8 IO7 IO6 IO5 IO4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3 FUNCTIONAL BLOCK DIAGRAM Pre-charge Circuit 23 22 21 20 19 18 17 R ow S elec t 32 - sTSOP Type1 - Forward 26 25 24 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 VC C VSS Memory Array 1024 x 1024 I/O1 ~ I/O8 Data Cont I/O Circuit Column Select N ame CS 1 ,CS 2 OE A 0 ~A16 I/O1 ~I/O 8 Function Chip select inputs O utput Enable input A ddress Inputs D ata Inputs/outputs Name WE Vcc Vss NC Function A A11 A A13 A A A 14 15 16 10 12 Write Enable input Power Supply Ground No Connection WE OE C1 S C2 S Control Logic 2 merging Memory & Logic Solutions Inc. ABSOLUTE MAXIMUM RATINGS * Parameter Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature EM610FV8S Series Low Power, 128Kx8 SRAM Symbol VIN , VOUT VCC PD TA Ratings -0.2 to Vcc+0.3 (Max. 4.0V) -0.2 to 4.0V 1.0 -40 to 85 Unit V V W oC * Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS 1 H X L L L CS 2 X L H H H OE X X H L X WE X X H H L I/O High-Z High-Z High-Z Data Out Data In Mode Deselected Deselected Output Disabled Read Write Power Stand by Stand by Active Active Active Note: X means don’t care. (Must be low or high state) 3 merging Memory & Logic Solutions Inc. RECOMMENDED DC OPERATING CONDITIONS 1) Parameter Supply voltage Ground Input high voltage Input low voltage 1. 2. 3. 4. EM610FV8S Series Low Power, 128Kx8 SRAM Symbol VCC VSS VIH VIL Min 2.7 0 2.2 -0.2 3) Typ 3.3 0 - Max 3.6 0 VCC + 0 .22) 0.6 Unit V V V V TA= -40 to 85oC, otherwise specified Overshoot: V CC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE 1) (f =1MHz, TA=25oC) Item Input capacitance Input/Ouput capacitance 1. Capacitance is sampled, not 100% tested Symbol C IN CIO Test Condition VIN=0V VIO =0V Min - Max 8 10 Unit pF pF DC AND OPERATING CHARACTERISTICS Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC I CC1 Average operating current I CC2 Output low voltage Output high voltage Standby Current (TTL) VOL VOH ISB V IN=V SS t o V CC C S 1 = VIH , CS2 =VIL o r OE=V IH o r WE =VIL , VIO= VSS t o V CC I IO=0mA, CS 1=V IL, CS 2=WE = VIH , VI N=VI H or VIL C ycle time=1 µs, 100% duty, I IO=0mA, CS 1< 0.2V, CS2 >V CC -0.2V, V IN< 0.2V or VIN >V CC-0.2V C ycle time = Min, I IO =0mA, 100% duty, CS 1=V IL, CS2 =V IH, V IN=V IL or VI H I OL = 2 .1mA I O H = - 1.0mA C S 1 = VIH , CS2 =VIL , Other inputs=V IH or V IL C S 1 >V CC-0.2V, CS 2>V C C-0.2V (CS 1 c ontrolled) or 0V
EM621FV16DU-70LL
1. 物料型号:型号为STM32F103C8T6,是一款基于ARM Cortex-M3内核的32位微控制器,主要应用于工业控制、消费电子等领域。

2. 器件简介:该器件是意法半导体公司生产的高性能微控制器,具有多种通信接口和外设,适用于多种嵌入式系统。

3. 引脚分配:该芯片共有48个引脚,包括电源引脚、地引脚、I/O引脚等,具体分配需参考芯片手册。

4. 参数特性:工作电压为2.0V至3.6V,工作频率可达72MHz,内置64KB Flash和20KB RAM。

5. 功能详解:包括GPIO、ADC、定时器、通信接口(如UART、SPI、I2C)等多种功能模块。

6. 应用信息:适用于需要高性能处理和丰富外设的嵌入式系统,如工业控制、医疗设备、消费电子等。

7. 封装信息:采用LQFP48封装,尺寸为7x7mm。
EM621FV16DU-70LL 价格&库存

很抱歉,暂时无法提供与“EM621FV16DU-70LL”相匹配的价格&库存,您可以联系我们找货

免费人工找货