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EM621FV8DU-45S

EM621FV8DU-45S

  • 厂商:

    EMLSI

  • 封装:

  • 描述:

    EM621FV8DU-45S - 128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM - Emerging Memory ...

  • 详情介绍
  • 数据手册
  • 价格&库存
EM621FV8DU-45S 数据手册
merging Memory & Logic Solutions Inc. Document Title 128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM EM610FV8S Series Low Power, 128Kx8 SRAM Revision History Revision No. 0.0 0.1 History Initial Draft 2’nd Draft Add Pb-free part number Draft Date May 9 , 2003 February 13 , 2004 Remark Emerging Memory & Logic Solutions Inc. IT Venture Tower Eastside 11F, 78, Karac-Dong, Songpa-Ku, Seoul, Rep.of Korea Zip Code : 138-160 Tel : +82-2-2142-1759~1766 Fax : +82-2-2142-1769 / Homepage : www.emlsi.com The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 merging Memory & Logic Solutions Inc. FEATURES • • • • • • Process Technology : 0.18µ m Full CMOS Organization : 128K x 8 bit Power Supply Voltage : 2.7V ~ 3.6V Low Data Retention Voltage : 1.5V(Min) Three state output and TTL Compatible Package Type : 32-sTSOP1 EM610FV8S Series Low Power, 128Kx8 SRAM GENERAL DESCRIPTION The EM610FV8S families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. PRODUCT FAMILY Power Dissipation Product Family Operating Temperature Industrial (-40 ~ 85oC) Vcc Range Speed Standby (ISB1 , Typ) 0.5µA2) Operating (I CC1.Max) 3 mA PKG Type EM610FV8S 2.7V~3.6V 551) / 70ns 32 - sTSOP1 1. The parameter is measured with 30pF test load. 2. Typical values are measured at Vcc=3.3V, T A =25 oC and not 100% tested. PIN DESCRIPTION A11 A9 A8 A13 WE CS2 A15 VCC NC A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 OE A10 CS1 IO8 IO7 IO6 IO5 IO4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3 FUNCTIONAL BLOCK DIAGRAM Pre-charge Circuit 23 22 21 20 19 18 17 R ow S elec t 32 - sTSOP Type1 - Forward 26 25 24 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 VC C VSS Memory Array 1024 x 1024 I/O1 ~ I/O8 Data Cont I/O Circuit Column Select N ame CS 1 ,CS 2 OE A 0 ~A16 I/O1 ~I/O 8 Function Chip select inputs O utput Enable input A ddress Inputs D ata Inputs/outputs Name WE Vcc Vss NC Function A A11 A A13 A A A 14 15 16 10 12 Write Enable input Power Supply Ground No Connection WE OE C1 S C2 S Control Logic 2 merging Memory & Logic Solutions Inc. ABSOLUTE MAXIMUM RATINGS * Parameter Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature EM610FV8S Series Low Power, 128Kx8 SRAM Symbol VIN , VOUT VCC PD TA Ratings -0.2 to Vcc+0.3 (Max. 4.0V) -0.2 to 4.0V 1.0 -40 to 85 Unit V V W oC * Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS 1 H X L L L CS 2 X L H H H OE X X H L X WE X X H H L I/O High-Z High-Z High-Z Data Out Data In Mode Deselected Deselected Output Disabled Read Write Power Stand by Stand by Active Active Active Note: X means don’t care. (Must be low or high state) 3 merging Memory & Logic Solutions Inc. RECOMMENDED DC OPERATING CONDITIONS 1) Parameter Supply voltage Ground Input high voltage Input low voltage 1. 2. 3. 4. EM610FV8S Series Low Power, 128Kx8 SRAM Symbol VCC VSS VIH VIL Min 2.7 0 2.2 -0.2 3) Typ 3.3 0 - Max 3.6 0 VCC + 0 .22) 0.6 Unit V V V V TA= -40 to 85oC, otherwise specified Overshoot: V CC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE 1) (f =1MHz, TA=25oC) Item Input capacitance Input/Ouput capacitance 1. Capacitance is sampled, not 100% tested Symbol C IN CIO Test Condition VIN=0V VIO =0V Min - Max 8 10 Unit pF pF DC AND OPERATING CHARACTERISTICS Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC I CC1 Average operating current I CC2 Output low voltage Output high voltage Standby Current (TTL) VOL VOH ISB V IN=V SS t o V CC C S 1 = VIH , CS2 =VIL o r OE=V IH o r WE =VIL , VIO= VSS t o V CC I IO=0mA, CS 1=V IL, CS 2=WE = VIH , VI N=VI H or VIL C ycle time=1 µs, 100% duty, I IO=0mA, CS 1< 0.2V, CS2 >V CC -0.2V, V IN< 0.2V or VIN >V CC-0.2V C ycle time = Min, I IO =0mA, 100% duty, CS 1=V IL, CS2 =V IH, V IN=V IL or VI H I OL = 2 .1mA I O H = - 1.0mA C S 1 = VIH , CS2 =VIL , Other inputs=V IH or V IL C S 1 >V CC-0.2V, CS 2>V C C-0.2V (CS 1 c ontrolled) or 0V
EM621FV8DU-45S
物料型号: - EM610FV8S系列,包括不同速度和温度范围的版本。

器件简介: - EM610FV8S系列是由Emerging Memory & Logic Solutions Inc.(EMLSI)生产的低功耗、128Kx8位的全CMOS静态RAM。 - 采用0.18微米全CMOS工艺技术,组织为128K x 8位,电源电压为2.7V至3.6V,支持低数据保持电压1.5V。 - 支持工业温度范围,提供芯片级封装,适用于系统设计的灵活性,并支持低数据保持电流,适用于电池备份操作。

引脚分配: - CS1, CS2:芯片选择输入。 - WE:写使能输入。 - OE:输出使能输入。 - Vcc:电源供应。 - A0~A16:地址输入。 - I/O1~I/O8:数据输入/输出。 - NC:无连接。

参数特性: - 绝对最大额定值包括任何引脚相对于Vss的电压、Vcc供电相对于Vss的电压、功耗和工作温度。 - 推荐直流工作条件包括供电电压、地、输入高电平电压和输入低电平电压。

功能详解: - 功能块图展示了SRAM的基本架构。 - 功能描述表格详细描述了不同输入组合下的工作模式和功耗。 - 读写周期参数包括读周期时间和写周期时间,以及相关的时序参数。

应用信息: - 该SRAM适用于需要低功耗和低电压操作的应用,特别是在电池备份操作中。

封装信息: - 提供32引脚的小型TSOP1封装。
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