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EM6320FR32AS-10L

EM6320FR32AS-10L

  • 厂商:

    EMLSI

  • 封装:

  • 描述:

    EM6320FR32AS-10L - 128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM - Emerging Memor...

  • 详情介绍
  • 数据手册
  • 价格&库存
EM6320FR32AS-10L 数据手册
merging Memory & Logic Solutions Inc. Document Title 128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM EM610FV8T Series Low Power, 128Kx8 SRAM Revision History Revision No. 0.0 0.1 History Initial Draft 2’nd Draft Add Pb-free part number Draft Date May 9 , 2003 February 13 , 2004 Remark Emerging Memory & Logic Solutions Inc. IT Venture Tower Eastside 11F, 78, Karac-Dong, Songpa-Ku, Seoul, Rep.of Korea Zip Code : 138-160 Tel : +82-2-2142-1759~1766 Fax : +82-2-2142-1769 / Homepage : www.emlsi.com The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 merging Memory & Logic Solutions Inc. FEATURES • • • • • • Process Technology : 0.18µ m Full CMOS Organization : 128K x 8 bit Power Supply Voltage : 2.7V ~ 3.6V Low Data Retention Voltage : 1.5V(Min) Three state output and TTL Compatible Package Type : 32-TSOP1 EM610FV8T Series Low Power, 128Kx8 SRAM GENERAL DESCRIPTION The EM610FV8T families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. PRODUCT FAMILY Power Dissipation Product Family EM610FV8T Operating Temperature Industrial (-40 ~ 85o C) Vcc Range Speed Standby (ISB1 , Typ) 0.5 µA2) Operating (I CC1.Max) 3 mA PKG Type 32-TSOP1 2.7V~3.6V 551) / 70ns 1. The parameter is measured with 30pF test load. 2. Typical values are measured at Vcc=3.3V, TA=25 oC and not 100% tested. PIN DESCRIPTION A11 A9 A8 A13 WE CS2 A15 VCC NC A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 OE A10 CS1 IO8 IO7 IO6 IO5 IO4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3 FUNCTIONAL BLOCK DIAGRAM Pre-charge Circuit 23 22 21 20 19 18 17 R ow S elec t 32 - TSOP Type1 - Forward 26 25 24 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 VC C VSS Memory Array 1024 x 1024 I/O1 ~ I/O8 Data Cont I/O Circuit Column Select N ame CS 1 ,CS 2 OE A 0 ~A16 I/O1 ~I/O 8 Function Chip select inputs O utput Enable input A ddress Inputs D ata Inputs/outputs Name WE Vcc Vss NC Function A A11 A A13 A A A 14 15 16 10 12 Write Enable input Power Supply Ground No Connection WE OE C1 S C2 S Control Logic 2 merging Memory & Logic Solutions Inc. ABSOLUTE MAXIMUM RATINGS * Parameter Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature EM610FV8T Series Low Power, 128Kx8 SRAM Symbol VIN , VOUT VCC PD TA Ratings -0.2 to Vcc+0.3 (Max. 4.0V) -0.2 to 4.0V 1.0 -40 to 85 Unit V V W oC * Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS 1 H X L L L CS 2 X L H H H OE X X H L X WE X X H H L I/O High-Z High-Z High-Z Data Out Data In Mode Deselected Deselected Output Disabled Read Write Power Stand by Stand by Active Active Active Note: X means don’t care. (Must be low or high state) 3 merging Memory & Logic Solutions Inc. RECOMMENDED DC OPERATING CONDITIONS 1) Parameter Supply voltage Ground Input high voltage Input low voltage 1. 2. 3. 4. EM610FV8T Series Low Power, 128Kx8 SRAM Symbol VCC VSS VIH VIL Min 2.7 0 2.2 -0.2 3) Typ 3.3 0 - Max 3.6 0 VCC + 0 .22) 0.6 Unit V V V V TA= -40 to 85oC, otherwise specified Overshoot: V CC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE 1) (f =1MHz, TA=25oC) Item Input capacitance Input/Ouput capacitance 1. Capacitance is sampled, not 100% tested Symbol C IN CIO Test Condition VIN=0V VIO =0V Min - Max 8 10 Unit pF pF DC AND OPERATING CHARACTERISTICS Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC I CC1 Average operating current I CC2 Output low voltage Output high voltage Standby Current (TTL) VOL VOH ISB V IN=V SS t o V CC C S 1 = VIH , CS2 =VIL o r OE=V IH o r WE =VIL , VIO= VSS t o V CC I IO=0mA, CS 1=V IL, CS 2=WE = VIH , VI N=VI H or VIL C ycle time=1 µs, 100% duty, I IO=0mA, CS 1< 0.2V, CS2 >V CC -0.2V, V IN< 0.2V or VIN >V CC-0.2V C ycle time = Min, I IO =0mA, 100% duty, CS 1=V IL, CS2 =V IH, V IN=V IL or VI H I OL = 2 .1mA I O H = - 1.0mA C S 1 = VIH , CS2 =VIL , Other inputs=V IH or V IL C S 1 >V CC-0.2V, CS 2>V C C-0.2V (CS 1 c ontrolled) or 0V
EM6320FR32AS-10L
物料型号: - 型号:EM610FV8T

器件简介: - EM610FV8T系列是由Emerging Memory & Logic Solutions Inc.(EMLSI)生产的低功耗、128Kx8位的静态随机存取存储器(SRAM)。该系列产品采用0.18微米全CMOS工艺技术制造,支持工业温度范围和芯片级封装,以提供系统设计的灵活性。此外,该系列还支持低数据保持电压,适用于电池备份操作且数据保持电流低。

引脚分配: - CS1, CS2:芯片选择输入 - WE:写使能输入 - OE:输出使能输入 - Vcc:电源供应 - A0~A16:地址输入 - I/O1-I/O7:数据输入/输出 - Vss:地 - NC:无连接

参数特性: - 工艺技术:0.18微米全CMOS - 组织:128K x 8位 - 电源电压:2.7V ~ 3.6V - 低数据保持电压:1.5V(最小值) - 三态输出和TTL兼容 - 封装类型:32-TSOP1

功能详解: - 该SRAM支持工业温度范围(-40 ~ 85°C)和低功耗操作,适用于需要低功耗和数据保持的应用场景。

应用信息: - 适用于需要低功耗和数据保持的应用,如电池备份系统、工业控制系统等。

封装信息: - 封装类型为32-TSOP1,这是一种常见的表面贴装封装形式,适用于自动贴装生产线。
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