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EM640FR16C-12L

EM640FR16C-12L

  • 厂商:

    EMLSI

  • 封装:

  • 描述:

    EM640FR16C-12L - 128K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM - Emerging Memory...

  • 详情介绍
  • 数据手册
  • 价格&库存
EM640FR16C-12L 数据手册
merging Memory & Logic Solutions Inc. Document Title 128K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM EM621FU16 Series Low Power, 128Kx16 SRAM Revision History Revision No. 0.0 0.1 History Initial Draft 2’nd Draft Add Pb-free part number Draft Date December 18 , 2002 February 13 , 2004 Remark Emerging Memory & Logic Solutions Inc. IT Venture Tower Eastside 11F, 78, Karac-Dong, Songpa-Ku, Seoul, Rep.of Korea Zip Code : 138-160 Tel : +82-2-2142-1759~1766 Fax : +82-2-2142-1769 / Homepage : www.emlsi.com The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 merging Memory & Logic Solutions Inc. FEATURES • • • • • • Process Technology : 0.18µ m Full CMOS Organization : 128K x 16 bit Power Supply Voltage : 2.7V ~ 3.3V Low Data Retention Voltage : 1.5V(Min.) Three state output and TTL Compatible Package Type : 48-FPBGA 6.0x7.0 EM621FU16 Series Low Power, 128Kx16 SRAM GENERAL DESCRIPTION The EM621FU16 families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. PRODUCT FAMILY Power Dissipation Product Family EM621FU16 Operating Temperature Industrial (-40 ~ 85oC) Vcc Range Speed Standby (I SB1 , Typ.) 1 µA Operating (I CC1.Max.) 2 mA PKG Type 2.7V~3.3V 551) /70ns 48 FPBGA 1. The parameter is measured with 30pF test load. PIN DESCRIPTION 1 A B C D E F G H 2 3 4 5 6 FUNCTIONAL BLOCK DIAGRAM Pre-charge Circuit LB I/O 9 OE UB A0 A3 A5 DNU DNU A14 A12 A9 A1 A4 A6 A7 A16 A15 A13 A10 A2 CS I/O2 I/O4 I/O5 I/O6 WE A11 DNU I/O1 I/O3 VCC V SS I/O7 I/O8 DNU A A11 A A A14 A A 10 12 13 15 16 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 Data Cont Data Cont VC C R ow S elec t VSS Memory Array 1024 x 2048 I/O10 I/O11 V SS VC C I/O12 I/O13 I/O1 ~ I/O8 I/O9 ~ I/O16 I/O Circuit Column Select I/O15 I/O14 I/O16 DNU DNU A8 48-FPBGA : Top view (ball down) W E O E UB Control Logic N ame CS OE WE A 0 ~A16 Function C hip select input O utput Enable input W rite Enable input A ddress Inputs Name Vcc Vss UB LB DNU Function Power Supply Ground U pper Byte (I/O 9~16) L ower Byte (I/O 1~8 ) Do Not Use LB CS I/O1 ~I/O16 D ata Inputs/outputs 2 merging Memory & Logic Solutions Inc. ABSOLUTE MAXIMUM RATINGS * Parameter Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature EM621FU16 Series Low Power, 128Kx16 SRAM Symbol VIN , VOUT VCC PD TA Ratings -0.2 to Vcc+0.3 (Max. 4.0V) -0.2 to 4.0V 1.0 -40 to 85 Unit V V W oC * Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS H X L L L L L L L L OE X X H H L L L X X X WE X X H H H H H L L L LB X H L X L H L L H L UB X H X L H L L H L L I/O 1-8 High-Z High-Z High-Z High-Z Data Out High-Z Data Out Data In High-Z Data In I/O9-16 High-Z High-Z High-Z High-Z High-Z Data Out Data Out High-Z Data In Data In Mode Deselected Deselected Output Disabled Output Disabled Lower Byte Read Upper Byte Read Word Read Lower Byte Write Upper Byte Write Word Write Power Stand by Stand by Active Active Active Active Active Active Active Active Note: X means don’t care. (Must be low or high state) 3 merging Memory & Logic Solutions Inc. RECOMMENDED DC OPERATING CONDITIONS 1) Parameter Supply voltage Ground Input high voltage Input low voltage 1. 2. 3. 4. EM621FU16 Series Low Power, 128Kx16 SRAM Symbol VCC VSS VIH VIL Min 2.7 0 2.0 -0.2 3) Typ 3.0 0 - Max 3.3 0 VCC + 0 .22) 0.6 Unit V V V V TA= -40 to 85oC, otherwise specified Overshoot: V CC +2.0 V in case of pulse width < 20ns Undershoot: -2.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE 1) (f =1MHz, TA=25oC) Item Input capacitance Input/Ouput capacitance 1. Capacitance is sampled, not 100% tested Symbol C IN CIO Test Condition VIN=0V VIO =0V Min - Max 8 10 Unit pF pF DC AND OPERATING CHARACTERISTICS Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO ICC I CC1 Average operating current I CC2 Output low voltage Output high voltage Standby Current (TTL) VOL VOH ISB VIN =VS S to VCC CS =VIH or OE =VIH or WE=VIL, LB =UB=VIH , VIO =VSS to VCC IIO=0mA, CS=VIL, VIN =VIH or VIL Cycle time=1µs, 100% duty, I IO=0mA, CS
EM640FR16C-12L
1. 物料型号: - 型号为EM621FU16系列,属于低功耗、128Kx16位SRAM。

2. 器件简介: - EM621FU16系列由Emerging Memory & Logic Solutions Inc.(EMLSI)采用0.18微米全CMOS工艺技术制造,支持工业温度范围,提供芯片尺寸封装以增加系统设计的灵活性,并支持低数据保持电压,适用于电池备份操作且数据保持电流低。

3. 引脚分配: - 该器件采用48-FPBGA封装,具体引脚功能如下: - CS:芯片选择输入 - OE:输出使能输入 - WE:写使能输入 - UB:高字节(I/O9-16) - LB:低字节(I/O1-8) - A0-A16:地址输入 - I/O1-I/O16:数据输入/输出 - Vss:地 - Vcc:电源供应 - DNU:不用

4. 参数特性: - 工作电压:2.7V至3.3V - 低数据保持电压:1.5V(最小) - 三态输出且与TTL兼容 - 封装类型:48-FPBGA 6.0x7.0

5. 功能详解: - 该SRAM支持不同的操作模式,包括高阻态、输出禁用、字节读取、字节写入和字写入。具体模式取决于CS、OE、WE、LB和UB的电平状态。

6. 应用信息: - 适用于需要低功耗和低电压操作的工业应用,特别是在电池备份操作中。

7. 封装信息: - 采用48球Fine Pitch BGA封装,球间距为0.75mm。
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