H6006B1SO8B

R EM MICROELECTRONIC - MARIN SA H6006 Failsafe Watchdog Description The H6006 is a monolithic low power CMOS device combining a programmable digital timer and a series of voltage comparators on the same chip. The device is specially convenient for Watch-Dog functions such as microprocessor and supply voltage monitoring. The watchdog part is designed to be used in all applications where it is important that after the occurrence of a malfunction the microprocessor system is stopped to avoid further damage. The timeout warning signal ( TO ) can be used to try to reactivate the system before halting it. The voltage monitoring part provides double security by combining both unregulated voltage and regulated voltage monitoring simultaneously. The H6006 initializes the poweron reset after VIN reached VSH and VDD raises above 3.5 V. If VIN drops below VSL, the H6006 gives an advanced warning signal for register saving and if the voltage drops further below VRL, RES goes active. The H6006 functions at any supply voltage down to 1.5 V and is therefore particularly suited for start-up and shut-down control of microprocessor systems Features Failsafe watchdog function: timeout warning after 1st timeout period, reset after 2nd timeout period, reset remains active to avoid further failures Standard timeout period and power-on reset time (10 ms), externally programmable if required VIN monitoring with 3 standard or programmable trigger voltages for: power-on reset initialization, advanced power-fail warning ( SAVE ), reset at power-down ( RES ) VDD monitoring: power-on reset initialization enabled only if VDD ≥ 3.5 V Internal voltage reference Works down to 1.5 V supply voltage Push-pull or Open drain outputs Low current consumption Available for normal and extended temperature range SO8 package Applications Microprocessor and microcontroller systems Point of sales equipment Telecom products Automotive subsystems Typical Operating Configuration Pin Assignment Voltage Regulator 5V SO8 VIN VIN VDD TCL TO SAVE RES INT NMI RES I/O TCL RC VSS VDD TO SAVE RES H6006 Microprocessor H6006 VSS GND Fig. 1 Fig. 2 Copyright © 2004, EM Microelectronic-Marin SA 1 www.emmicroelectronic.com R H6006 Absolute Maximum Ratings Parameter Voltage VDD to VSS Voltage at any pin to VSS Voltage at any pin to VDD(except VIN) Voltage at VIN to VSS Current at any output Storage temperature Symbol Conditions VDD -0.3 to +8 V VMIN -0.3 +0.3 VMAX VINMAX IMAX TSTO +15 V ±10 mA -65… +150 °C Table 1 Unless otherwise specified, proper operation can only occur when all terminal voltages are kept within the supply voltage range. Unused inputs must always be tied to a defined logic voltage level. Operating Conditions Symbol Min. Parameter Operating temperature Industrial TAI -40 Supply voltage VDD 1.5 Comparator input voltage Version A2, A3, VIN 0 B2,B3 Version B1 VIN 0 RC-oscillator programming (see Fig. 15) External capacitance C1 External resistance R1 10 Typ Max. Units +85 5.5 VDD 12 Stresses above these listed maximum ratings may cause permanent damage to the device. Exposure beyond specified operating conditions may affect device reliability or cause malfunction. °C V V V Handling Procedures This device has built-in protection against high static voltages or electric fields; however, anti-static precautions must be taken as for any other CMOS component. 100 nF kΩ Table 2 Electrical Characteristics VDD = 5.0 V, TA = -40 to +85 °C, unless otherwise specified Parameter VDD activation threshold VDD deactivation threshold Supply current Input VIN,, TCL Leakage current Input current on pin VIN TCL input low level TCL input high level TO , RES . SAVE Outputs Leakage current Symbol VON VOFF IDD IIP IIN VIL VIH IOLK Test Conditions TA = 25 °C TA = 25 °C RC open, TCL= 5 V, VIN = 0 V VSS ≤ VIP ≤ VDD; T A = 85 ° C Version B1; VIN = 10 V Min. 3 Typ. VON - 1.5 50 Max. 3.5 140 Units V V µA 0.005 100 2.4 1 180 0.8 µA µA V V Versions A2, A3; VOUT = VDD Drive currents (all versions) IOL VOL = 0.4 V IOL VDD = 3.5 V; VOL = 0.4 V IOL VDD = 1.6 V; VOL = 0.4 V Drive currents IOH VOH = 4.0 V 1) (versions B1, B2, B3) IOH VDD = 3.5 V; VOH ≥ 2.8 V IOH VDD = 1.6 V; VOH = VDD-0.4 1) Versions: An = open drain outputs; Bn = push-pull outputs 3.2 2 80 3.2 2 80 0 .05 8 1 8 µA mA mA µA mA mA µA Table 3 VIN Surveillance Voltage thresholds at TA = 25 °C Version1) B1 A2, B2 A3, B3 1) 2) Comparator Reference VDD VDD Band-gap reference Input Resistance RVIN 100kΩ ~100MΩ ~100MΩ Thresholds 9.00 8.00 7.00 2) 2.25 2.00 1.75 2.00 1.95 1.90 2) Threshold Tolerance ± 5% ± 5% ± 10% Ratio Tolerance 3) +2% +2% +2% Versions: An = open drain outputs; Bn = push-pull outputs at VDD = 5 V 3) Threshold ratio as VSH/VSL or VSL/VRL Table 4 Copyright © 2004, EM Microelectronic-Marin SA 2 www.emmicroelectronic.com R H6006 Timing Characteristics VDD = 5.0 V, TA = −40 °C to +85 °C, unless otherwise specified Parameter Propagation delays TCL to output pins VIN to output pins Logic transition times on all output pins Timeout period TTCL input pulse width Power-on reset debounce Symbol TDIDO TAIDO TTR TTO TTO TTCL TDB Test Conditions Min. Typ. 250 4 30 Max. 500 10 100 16 20 Units ns µs ns ms ms ns ms Table 5 Excluding debounce time TDB Load 10 kΩ, 100 pF RC open, unshielded , TA =25 °C RC open, unshielded (not tested) 6 4.5 150 10 TTO/32 Timing Waveforms Voltage Reaction: VDD Monitoring VDD VON VOFF VIN monitoring enabled Fig. 3 Voltage Reaction: VIN Monitoring VIN VSH VSL VRL TTO 0 TDB TDB TTO Conditions: VDD > VON No timeout SAVE RES Timer Start Power-on Reset Timer Stop Timer Start Power-on Reset No Power-on Reset (as VIN > VRL) Fig. 4 Copyright © 2004, EM Microelectronic-Marin SA 3 www.emmicroelectronic.com R H6006 Timer Reaction Conditions: VIN > VRL after power-up sequence. TTCL ______ TCL TO TTO TTO TTO RES Timer Reset TO Timeout RES Timeout Timer Reset Timer Reset Fig. 5 Combined Voltage and Timer Reaction VSH VSL VRL VIN TDB SAVE RES TO TCL Power-on Reset TTO TTO TTO TTO TO Timeout RES Timeout Timer Reset TO Timeout Timer Stop Fig. 6 Block Diagram VDD 1 2 VIN Band-Gap Reference VSH Save Control SAVE VSL Reset VRL Control RES Version B1 A2, B2 A3, B3 TO TCL Connections 1 and 3 1 2 Fig. 7 VSS RC 3 OSC Timer Copyright © 2004, EM Microelectronic-Marin SA 4 www.emmicroelectronic.com R H6006 Pin Description Pin 1 2 3 4 5 6 7 8 Name VIN TCL RC VSS RES SAVE TO VDD Function Voltage monitoring input Timer clear input signal RC oscillator tuning input GND terminal Reset output Save output Timer output signal Positive supply voltage terminal Table 6 Version B1: with internal voltage divider, resulting in thresholds for direct monitoring of the unregulated voltage without external components. >9V Voltage Regulator 5V VIN VDD H6006 B1 VSS any voltage Voltage Regulator 5V Functional Description Supply Lines The circuit is powered through the VDD and VSS pins. It monitors both its own VDD supply and a voltage applied to the VIN input. VDD Monitoring During power-up the VIN monitoring is disabled and RES and SAVE stay active low as long as VDD is below VON (3.5 V). As soon as VDD reaches the VON level, the state of the outputs depend on the watchdog timer and the volt-age at VIN relative to the thresholds (see Fig. 3 and 4). If the supply voltage VDD falls back below VOFF (1.5 V) the watchdog timer and the VIN monitoring are disabled and the outputs SAVE and RES are active low. The VDD line should be free of spikes. VIN Monitoring The analog voltage comparators compare the voltage applied to VIN (typically connected to the input of the voltage regulator) with the stabilized supply voltage VDD (versions B1, A2, B2) or with the bandgap voltage (versions A3, B3) (see Fig. 7). At power-up, when VDD reached VON and VIN reaches the VSH level, the SAVE output goes high, and the timer starts running, setting RES high after the time TTO (see Fig. 4). If VIN falls below VSL, the SAVE output goes low and stays low until VIN rises again above VSH. If VIN falls below the voltage VRL, the RES output will go low and the on-chip timer will stop. When VIN rises again above VSH, the timer will initiate a power-up sequence. The RES output may however be influenced independently of the voltage VIN by the timer action, see section “Combined Voltage and Timer Action”. Monitoring the rough DC side of the regulator as shown in Fig. 12 is the only way to have advanced warning at power-down. Spikes on VIN should be filtered if they are likely to drop below VSL. The combination of VIN and VDD monitoring provide high system security: if VIN rises much faster than VDD, then the device starts the power-on sequence only when VDD reached VON (Fig. 3). Short circuits on the regulated supply voltage can be detected. Voltage Thresholds on VIN The H6006 is available with 3 different sets of thresholds: SAVE RES Note: The threshold levels are 9/8/7 V normally.These are divided internally by 4 to give internal thresholds of 2.25 / 2 / 1.75 V. VDD = 5 V (thresholds Fig. 8 dependent on VDD). RVIN = ~ 100 kΩ. Version A2, B2: for monitoring of all unregulated voltage, where custom programming is required. Fixed resistor values can be used for programming. H6006 A2, B2 H6006 A3, B3 VIN VDD VSS SAVE RES Note : the internal threshold levels are 2.25 / 2.00 / 1.75 V at VDD = 5 V (thresholds dependent on VDD) Fig. 9 RVIN = ~ 100 MΩ. Version A3, B3: for monitoring of regulated voltage, where no unregulated voltage is available (the tolerance is ±10 %, see Table 4. For tighter tolerances, trimming can be used, see Fig. 10). 5 V ± 10% VIN VDD SAVE RES VSS Note: the internal threshold levels are 2.00 / 1.95 / 1.90 V (thresholds dependent on the internal bandgap Fig. 10 reference) RVIN = ~ 100 MΩ. Copyright © 2004, EM Microelectronic-Marin SA 5 www.emmicroelectronic.com R H6006 Monitoring of the unregulated voltage require versions B1, A2 and B2. The versions are based on the principle that VDD rises with VIN on power-up and VDD holds up for a certain time after VIN starts dropping on power-down. The version B1 has a 100 kΩ nominal resistance from VIN to VSS (internal voltage divider). The versions A2, B2, A3 and B3 have high impedance VIN inputs (see Fig. 7 and Table 4) for external threshold voltage programming by a voltage divider on pin VIN. The levels obtained are proportional to the internal levels VSH, VSL and VRL on the chip itself (see Electrical Specifications). Timer Clearing and RES Action A negative edge or a negative pulse at the TCL input longer than 150 ns will reset the timer and set TO high. If a further TCL signal edge or pulse is applied before TTO timeout, TO will stay high and the timer will again be reset to zero (see Fig. 5). If no TCL signal is applied before the TTO timeout, TO will start to generate a square wave of period 2 x TTO starting with a low state. If no TCL signal is applied during the first low state of TO , then the RES output will go low and stay low until the next TCL signal, or until a fresh power-up sequence. Combined Voltage and Timer Action The combination of voltage and timer action is illustrated by the sequence of events shown in Fig. 6. One timeout period after VIN reached VSH, during power-up, RES goes inactive high. No TCL pulse will have any effect until this power-on reset delay is completed. After completing the power-up sequence the watchdog timer starts acting. If no TCL pulse occurs, the timeout warning TO goes active low after one timeout period TTO. After each subsequent timeout period without a timer clear pulse TCL , TO changes its polarity providing a square wave signal. RES activates at the end of the first low state of the TO signal. A TCL pulse clears the watchdog timer and resets the TO and RES output inactive high again. A voltage drop below the VRL level overrides the timer and immediately forces RES and SAVE active low and disables TO . Any further TCL pulse has no effect until the next power-up sequence has complete Timer Programming With pin RC unconnected, the on-chip RC oscillator together with its divider chain give a timeout TTO of typically 10 ms. For programming a different TTO, an approximation for calculating component values is given by the formula: ⎡ ⎤ ⎢ (32 + C1) • 1.6 ⎥ =⎢0.75 + ⎥ • 1.024 V − 0.8 ⎥ ⎢ 5.5 + DD ⎢ ⎥ R1 ⎣ ⎦ TTO R1 min. = 10 kΩ, C1 max. = 1 µF If R1 is in MΩ and C1 in pF, TTO will be in ms. Thus, a resistor decreases and a capacitor increases the interval to timeout. By using both external components, excellent temperature stability of TTO can be achieved. With TCL tied to either VDD or VSS, a precise square wave of period 2 x TTO is generated at the output TO . The oscillator and watchdog timer run so long as the chip is powered with at least the minimum positive supply voltage specified (VON), and so long as VIN remains above the level VRL after a power-up sequence. If the timer function is not required, input TCL should be tied to output TO to give a simple voltage monitor (see Fig. 14). Typical Applications >9 V R1 = 470 kΩ Monitored Voltage Voltage Regulator VIN VDD 5V Adress Decoder SEL Latched Address Bus RD Microprocessor H6006 TCL RC C1 = 220 pF RESET IR 1 IR 2 VSS TO SAVE RES CS Disable RAM TTO =~ 30 ms Fig. 11 Copyright © 2004, EM Microelectronic-Marin SA 6 www.emmicroelectronic.com R H6006 Voltage Monitor with Spike Suppression 2.7 kΩ Voltage Regulator VIN 330 nF VDD 5 VDC 10 VDC Rough H6006 TCL TO SAVE RES VSS Versions A1 or B1 Fig. 12 Watchdog and Power-On Reset VDD Monitoring and Power-On Reset H6006 A3, B3 TCL TO TCL H6006 A3, B3 VIN VDD VIN VDD TO SAVE RES VSS RES VSS If only VDD monitoring is used, (i.e.VIN and VDD common) then the version A3 or B3 with its constant thresholds are recommended. The power-on reset function is still available as the VDD monitoring is active. Fig. 13 VIN monitoring and watchdog function not used. Versions A3 and B3 only. Fig. 14 External Programming of RC Oscillator R1 VDD VDD R1 VDD TO H6006 H6006 RC C1 VSS RC RES VSS RC2 RES C1 VSS H6006 TCL TO TCL TO TCL RES C1 increases TTO R1 shortens TTo Note: using both external components R1 and C1 allows to achieve tighter timeout period tolerances. This circuit provides independent programming of both timeout period and power-on reset delay. Fig. 15 Copyright © 2004, EM Microelectronic-Marin SA 7 www.emmicroelectronic.com R H6006 Package Information Dimensions of 8-Pin SOIC Package D C E 0 - 8° L H Dimensions in mm Min Nom Max A 1.35 1.63 1.75 A1 0.10 0.15 0.25 B 0.33 0.41 0.51 C 0.19 0.20 0.25 D 4.80 4.93 5.00 E 3.80 3.94 4.00 e 1.27 H 5.80 5.99 6.20 L 0.40 0.64 1.27 Fig. 16 A1 B A e 4 3 2 5 6 7 8 Ordering Information When ordering, please specify the complete Part Number Part Number H6006A2SO8A H6006A2SO8B H6006A3SO8A* H6006A3SO8B* H6006B1SO8A H6006B1SO8B* H6006B2SO8A H6006B2SO8B H6006B3SO8A H6006B3SO8B Version Threshol d (see Table 4) 2.00 1.95 8.00 2.00 1.95 Outpu t Type Open drain Package 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC Delivery Form Stick Tape & Reel Stick Tape & Reel Stick Tape & Reel Stick Tape & Reel Stick Tape & Reel A2 A3 B1 B2 B3 Pushpull Package Marking (first line) 6006A2 6006A2 6006A3 6006A3 6006B1 6006B1 6006B2 6006B2 6006B3 6006B3 Temperature Range -40 to +85 °C * = non stock item. Might be available on request and upon minimum order quantity (please contact EM Microelectronic). Note: Other versions are no longer available EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure that the information given has not been superseded by a more up-to-date version. © EM Microelectronic-Marin SA, 07/04, Rev. G Copyright © 2004, EM Microelectronic-Marin SA 8 www.emmicroelectronic.com