10M08SAE144I7G

Intel® MAX® 10 FPGA Device Datasheet Subscribe Send Feedback M10-DATASHEET | 2020.06.30 Latest document on the web: PDF | HTML Contents Contents Intel® MAX® 10 FPGA Device Datasheet..................................................................................................................................... 3 Electrical Characteristics...................................................................................................................................................... 3 Operating Conditions.................................................................................................................................................. 4 Switching Characteristics....................................................................................................................................................25 Core Performance Specifications.................................................................................................................................26 Periphery Performance Specifications.......................................................................................................................... 35 Configuration Specifications................................................................................................................................................ 57 JTAG Timing Parameters........................................................................................................................................... 58 Remote System Upgrade Circuitry Timing Specifications................................................................................................ 59 User Watchdog Internal Circuitry Timing Specifications..................................................................................................59 Uncompressed Raw Binary File (.rbf) Sizes.................................................................................................................. 59 Internal Configuration Time....................................................................................................................................... 60 Internal Configuration Timing Parameter..................................................................................................................... 61 I/O Timing....................................................................................................................................................................... 61 Programmable IOE Delay................................................................................................................................................... 62 Programmable IOE Delay On Row Pins........................................................................................................................ 62 Programmable IOE Delay for Column Pins....................................................................................................................63 Glossary.......................................................................................................................................................................... 64 Document Revision History for the Intel MAX 10 FPGA Device Datasheet...................................................................................67 Intel® MAX® 10 FPGA Device Datasheet 2 Send Feedback M10-DATASHEET | 2020.06.30 Send Feedback Intel® MAX® 10 FPGA Device Datasheet This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and timing for Intel MAX® 10 devices. Table 1. Intel MAX 10 Device Grades and Speed Grades Supported Device Grade Speed Grade Supported Commercial • • –C7 –C8 (slowest) Industrial • • –I6 (fastest) –I7 Automotive • • –A6 –A7 Note: The –I6 and –A6 speed grades of the Intel MAX 10 FPGA devices are not available by default in the Intel Quartus® Prime software. Contact your local Intel sales representatives for support. Related Information Device Ordering Information, Intel MAX 10 FPGA Device Overview Provides more information about the densities and packages of devices in the Intel MAX 10. Electrical Characteristics The following sections describe the operating conditions and power consumption of Intel MAX 10 devices. Intel Corporation. All rights reserved. Agilex, Altera, Arria, Cyclone, Enpirion, Intel, the Intel logo, MAX, Nios, Quartus and Stratix words and logos are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Intel warrants performance of its FPGA and semiconductor products to current specifications in accordance with Intel's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services. *Other names and brands may be claimed as the property of others. ISO 9001:2015 Registered Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Operating Conditions Intel MAX 10 devices are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of the Intel MAX 10 devices, you must consider the operating requirements described in this section. Absolute Maximum Ratings This section defines the maximum operating conditions for Intel MAX 10 devices. The values are based on experiments conducted with the devices and theoretical modeling of breakdown and damage mechanisms. The functional operation of the device is not implied for these conditions. Caution: Conditions outside the range listed in the absolute maximum ratings tables may cause permanent damage to the device. Additionally, device operation at the absolute maximum ratings for extended periods of time may have adverse effects on the device. Single Supply Devices Absolute Maximum Ratings Table 2. Absolute Maximum Ratings for Intel MAX 10 Single Supply Devices Symbol Parameter Min Max Unit VCC_ONE Supply voltage for core and periphery through on-die voltage regulator –0.5 3.9 V VCCIO Supply voltage for input and output buffers –0.5 3.9 V VCCA Supply voltage for phase-locked loop (PLL) regulator and analog-todigital converter (ADC) block (analog) –0.5 3.9 V Min Max Unit Dual Supply Devices Absolute Maximum Ratings Table 3. Absolute Maximum Ratings for Intel MAX 10 Dual Supply Devices Symbol Parameter VCC Supply voltage for core and periphery –0.5 1.63 V VCCIO Supply voltage for input and output buffers –0.5 3.9 V VCCA Supply voltage for PLL regulator (analog) –0.5 3.41 V continued... Intel® MAX® 10 FPGA Device Datasheet 4 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Min Max Unit VCCD_PLL Supply voltage for PLL regulator (digital) –0.5 1.63 V VCCA_ADC Supply voltage for ADC analog block –0.5 3.41 V VCCINT Supply voltage for ADC digital block –0.5 1.63 V Min Max Unit Absolute Maximum Ratings Table 4. Absolute Maximum Ratings for Intel MAX 10 Devices Symbol Parameter VI DC input voltage –0.5 4.12 V IOUT DC output current per pin –25 25 mA TSTG Storage temperature –65 150 °C TJ Operating junction temperature –40 125 °C Maximum Allowed Overshoot During Transitions over a 11.4-Year Time Frame During transitions, input signals may overshoot to the voltage listed in the following table and undershoot to –2.0 V for input currents less than 100 mA and periods shorter than 20 ns. The maximum allowed overshoot duration is specified as a percentage of high time over the lifetime of the device. A DC signal is equivalent to 100% duty cycle. For example, a signal that overshoots to 4.17 V can only be at 4.17 V for ~11.7% over the lifetime of the device; for a device lifetime of 11.4 years, this amounts to 1.33 years. Table 5. Maximum Allowed Overshoot During Transitions over a 11.4-Year Time Frame for Intel MAX 10 Devices Condition (V) Overshoot Duration as % of High Time Unit 4.12 100.0 % 4.17 11.7 % 4.22 7.1 % 4.27 4.3 % continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 5 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Condition (V) Overshoot Duration as % of High Time Unit 4.32 2.6 % 4.37 1.6 % 4.42 1.0 % 4.47 0.6 % 4.52 0.3 % 4.57 0.2 % Recommended Operating Conditions This section lists the functional operation limits for the AC and DC parameters for Intel MAX 10 devices. The tables list the steady-state voltage values expected from Intel MAX 10 devices. Power supply ramps must all be strictly monotonic, without plateaus. Single Supply Devices Power Supplies Recommended Operating Conditions Table 6. Power Supplies Recommended Operating Conditions for Intel MAX 10 Single Supply Devices Symbol Parameter Condition Min Typ Max Unit VCC_ONE(1) Supply voltage for core and periphery through ondie voltage regulator — 2.85/3.135 3.0/3.3 3.15/3.465 V VCCIO(2) Supply voltage for input and output buffers 3.3 V 3.135 3.3 3.465 V 3.0 V 2.85 3 3.15 V 2.5 V 2.375 2.5 2.625 V 1.8 V 1.71 1.8 1.89 V 1.5 V 1.425 1.5 1.575 V 1.35 V 1.2825 1.35 1.4175 V continued... (1) VCCA must be connected to VCC_ONE through a filter. (2) VCCIO for all I/O banks must be powered up during user mode because VCCIO I/O banks are used for the ADC and I/O functionalities. Intel® MAX® 10 FPGA Device Datasheet 6 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol VCCA (1) Parameter Supply voltage for PLL regulator and ADC block (analog) Condition Min Typ Max Unit 1.2 V 1.14 1.2 1.26 V 1.0 V 0.95 1.0 1.05 V — 2.85/3.135 3.0/3.3 3.15/3.465 V Dual Supply Devices Power Supplies Recommended Operating Conditions Table 7. Power Supplies Recommended Operating Conditions for Intel MAX 10 Dual Supply Devices Symbol VCC Parameter Supply voltage for core and periphery VCCIO (3) Supply voltage for input and output buffers Condition Min Typ Max Unit — 1.15 1.2 1.25 V 3.3 V 3.135 3.3 3.465 V 3.0 V 2.85 3 3.15 V 2.5 V 2.375 2.5 2.625 V 1.8 V 1.71 1.8 1.89 V 1.5 V 1.425 1.5 1.575 V 1.35 V 1.2825 1.35 1.4175 V 1.2 V 1.14 1.2 1.26 V 1.0 V 0.95 1.0 1.05 V (4) Supply voltage for PLL regulator (analog) — 2.375 2.5 2.625 V VCCD_PLL(5) Supply voltage for PLL regulator (digital) — 1.15 1.2 1.25 V VCCA_ADC Supply voltage for ADC analog block — 2.375 2.5 2.625 V VCCINT Supply voltage for ADC digital block — 1.15 1.2 1.25 V VCCA (3) VCCIO for all I/O banks must be powered up during user mode because VCCIO I/O banks are used for the ADC and I/O functionalities. (4) All VCCA pins must be powered to 2.5 V (even when PLLs are not used), and must be powered up and powered down at the same time. (5) VCCD_PLL must always be connected to VCC through a decoupling capacitor and ferrite bead. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 7 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Recommended Operating Conditions Table 8. Recommended Operating Conditions for Intel MAX 10 Devices Condition Min Max Unit VI Symbol DC input voltage Parameter — –0.5 3.6 V VO Output voltage for I/O pins — 0 VCCIO V TJ Operating junction temperature Commercial 0 85 °C Industrial –40(6) 100 °C Automotive –40(6) 125 °C tRAMP Power supply ramp time — (7) 10 ms IDiode Magnitude of DC current across PCI* clamp diode when enabled — — 10 mA Programming/Erasure Specifications Table 9. Programming/Erasure Specifications for Intel MAX 10 Devices This table shows the programming cycles and data retention duration of the user flash memory (UFM) and configuration flash memory (CFM) blocks. For more information about data retention duration with 10,000 programming cycles for automotive temperature devices, contact your Intel quality representative. Erase and reprogram cycles (E/P) page) Temperature (°C) Data retention duration (Years) 10,000 85 20 10,000 100 10 (Cycles/ (6) –40°C is only applicable to Start of Test, when the device is powered-on. The device does not stay at the minimum junction temperature for a long time. (7) There is no absolute minimum value for the ramp time requirement. Intel characterized the minimum ramp time at 200 μs. (8) The number of E/P cycles applies to the smallest possible flash block that can be erased or programmed in each Intel MAX 10 device. Each Intel MAX 10 device has multiple flash pages per device. Intel® MAX® 10 FPGA Device Datasheet 8 (8) Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 DC Characteristics Supply Current and Power Consumption Intel offers two ways to estimate power for your design—the Excel-based Early Power Estimator (EPE) and the Intel Quartus Prime Power Analyzer feature. Use the Excel-based EPE before you start your design to estimate the supply current for your design. The EPE provides a magnitude estimate of the device power because these currents vary greatly with the usage of the resources. The Intel Quartus Prime Power Analyzer provides better quality estimates based on the specifics of the design after you complete place-and-route. The Power Analyzer can apply a combination of user-entered, simulation-derived, and estimated signal activities that, when combined with detailed circuit models, yield very accurate power estimates. Related Information • Early Power Estimator User Guide Provides more information about power estimation tools. • Power Analysis chapter, Intel Quartus Prime Handbook Provides more information about power estimation tools. I/O Pin Leakage Current The values in the table are specified for normal device operation. The values vary during device power-up. This applies for all VCCIO settings (3.3, 3.0, 2.5, 1.8, 1.5, 1.35, and 1.2 V). 10 µA I/O leakage current limit is applicable when the internal clamping diode is off. A higher current can be the observed when the diode is on. Input channel leakage of ADC I/O pins due to hot socket is up to maximum of 1.8 mA. The input channel leakage occurs when the ADC IP core is enabled or disabled. This is applicable to all Intel MAX 10 devices with ADC IP core, which are 10M04, 10M08, 10M16, 10M25, 10M40, and 10M50 devices. The ADC I/O pins are in Bank 1A. Table 10. I/O Pin Leakage Current for Intel MAX 10 Devices Min Max Unit II Symbol Input pin leakage current VI = 0 V to VCCIOMAX –10 10 µA IOZ Tristated I/O pin leakage current VO = 0 V to VCCIOMAX –10 10 µA Send Feedback Parameter Condition Intel® MAX® 10 FPGA Device Datasheet 9 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Table 11. ADC_VREF Pin Leakage Current for Intel MAX 10 Devices Symbol Parameter Iadc_vref Condition ADC_VREF pin leakage current Min Max Unit Single supply mode — 10 µA Dual supply mode — 20 µA Bus Hold Parameters Bus hold retains the last valid logic state after the source driving it either enters the high impedance state or is removed. Each I/O pin has an option to enable bus hold in user mode. Bus hold is always disabled in configuration mode. Table 12. Bus Hold Parameters for Intel MAX 10 Devices Parameter Condition VCCIO (V) 1.2 1.8 2.5 3.0 3.3 Min Max Min Max Min Max Min Max Min Max Min Max Bus-hold low, sustaining current VIN > VIL (maximum) 8 — 12 — 30 — 50 — 70 — 70 — µA Bus-hold high, sustaining current VIN < VIH (minimum) –8 — –12 — –30 — –50 — –70 — –70 — µA Bus-hold low, overdrive current 0 V < VIN < VCCIO — 125 — 175 — 200 — 300 — 500 — 500 µA Bus-hold high, overdrive current 0 V < VIN < VCCIO — –125 — –175 — –200 — –300 — –500 — –500 µA — 0.3 0.9 0.375 1.125 0.68 1.07 0.7 1.7 0.8 2 0.8 2 V Bus-hold trip point Intel® MAX® 10 FPGA Device Datasheet 10 1.5 Unit Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Series OCT without Calibration Specifications Table 13. Series OCT without Calibration Specifications for Intel MAX 10 Devices This table shows the variation of on-chip termination (OCT) without calibration across process, voltage, and temperature (PVT). Description Series OCT without calibration VCCIO (V) Resistance Tolerance Unit –C7, –I6, –I7, –A6, –A7 –C8 3.00 ±35 ±30 % 2.50 ±35 ±30 % 1.80 ±40 ±35 % 1.50 ±40 ±40 % 1.35 ±40 ±50 % 1.20 ±45 ±60 % Series OCT with Calibration at Device Power-Up Specifications Table 14. Series OCT with Calibration at Device Power-Up Specifications for Intel MAX 10 Devices OCT calibration is automatically performed at device power-up for OCT enabled I/Os. Description Series OCT with calibration at device power-up VCCIO (V) Calibration Accuracy Unit 3.00 ±12 % 2.50 ±12 % 1.80 ±12 % 1.50 ±12 % 1.35 ±12 % 1.20 ±12 % OCT Variation after Calibration at Device Power-Up The OCT resistance may vary with the variation of temperature and voltage after calibration at device power-up. Use the following table and equation to determine the final OCT resistance considering the variations after calibration at device power-up. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 11 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Table 15. OCT Variation after Calibration at Device Power-Up for Intel MAX 10 Devices This table lists the change percentage of the OCT resistance with voltage and temperature. Description OCT variation after calibration at device power-up Figure 1. Nominal Voltage dR/dT (%/°C) dR/dV (%/mV) 3.00 0.25 –0.027 2.50 0.245 –0.04 1.80 0.242 –0.079 1.50 0.235 –0.125 1.35 0.229 –0.16 1.20 0.197 –0.208 Equation for OCT Resistance after Calibration at Device Power-Up For For The definitions for equation are as follows: • T1 is the initial temperature. • T2 is the final temperature. • MF is multiplication factor. • Rinitial is initial resistance. • Rfinal is final resistance. Intel® MAX® 10 FPGA Device Datasheet 12 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 • Subscript x refers to both V and T. • ∆RV is variation of resistance with voltage. • ∆RT is variation of resistance with temperature. • dR/dT is the change percentage of resistance with temperature after calibration at device power-up. • dR/dV is the change percentage of resistance with voltage after calibration at device power-up. • V1 is the initial voltage. • V2 is final voltage. The following figure shows the example to calculate the change of 50 Ω I/O impedance from 25°C at 3.0 V to 85°C at 3.15 V. Figure 2. Example for OCT Resistance Calculation after Calibration at Device Power-Up B 1 B Send Feedback Intel® MAX® 10 FPGA Device Datasheet 13 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Pin Capacitance Table 16. Pin Capacitance for Intel MAX 10 Devices Maximum Unit CIOB Symbol Input capacitance on bottom I/O pins Parameter 8 pF CIOLRT Input capacitance on left/right/top I/O pins 7 pF CLVDSB Input capacitance on bottom I/O pins with dedicated LVDS output 8 pF CADCL Input capacitance on left I/O pins with ADC input 9 pF CVREFLRT Input capacitance on left/right/top dual purpose VREF pin when used as VREF or user I/O pin (11) 48 pF CVREFB Input capacitance on bottom dual purpose VREF pin when used as VREF or user I/O pin 50 pF CCLKB Input capacitance on bottom dual purpose clock input pins 7 pF CCLKLRT Input capacitance on left/right/top dual purpose clock input pins 6 pF (9) (10) (12) (12) Internal Weak Pull-Up Resistor All I/O pins, except configuration, test, and JTAG pins, have an option to enable weak pull-up. (9) Dedicated LVDS output buffer is only available at bottom I/O banks. (10) ADC pins are only available at left I/O banks. (11) When VREF pin is used as regular input or output, Fmax performance is reduced due to higher pin capacitance. Using the VREF pin capacitance specification from device datasheet, perform SI analysis on your board setup to determine the Fmax of your system. (12) 10M40 and 10M50 devices have dual purpose clock input pins at top/bottom I/O banks. Intel® MAX® 10 FPGA Device Datasheet 14 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Table 17. Internal Weak Pull-Up Resistor for Intel MAX 10 Devices Pin pull-up resistance values may be lower if an external source drives the pin higher than VCCIO. Symbol R_PU Parameter Condition Value of I/O pin (dedicated and dual-purpose) pull-up resistor before and during configuration, as well as user mode if the programmable pull-up resistor option is enabled Min Typ Max Unit VCCIO = 3.3 V ± 5% 7 12 34 kΩ VCCIO = 3.0 V ± 5% 8 13 37 kΩ VCCIO = 2.5 V ± 5% 10 15 46 kΩ VCCIO = 1.8 V ± 5% 16 25 75 kΩ VCCIO = 1.5 V ± 5% 20 36 106 kΩ VCCIO = 1.2 V ± 5% 33 82 179 kΩ Hot-Socketing Specifications Table 18. Hot-Socketing Specifications for Intel MAX 10 Devices Symbol Parameter IIOPIN(DC) DC current per I/O pin IIOPIN(AC) AC current per I/O pin Maximum 300 µA 8 mA (13) Hysteresis Specifications for Schmitt Trigger Input Intel MAX 10 devices support Schmitt trigger input on all I/O pins. A Schmitt trigger feature introduces hysteresis to the input signal for improved noise immunity, especially for signal with slow edge rate. (13) The I/O ramp rate is 10 ns or more. For ramp rates faster than 10 ns, |IIOPIN| = C dv/dt, in which C is I/O pin capacitance and dv/dt is the slew rate. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 15 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Table 19. Hysteresis Specifications for Schmitt Trigger Input for Intel MAX 10 Devices Symbol VHYS Parameter Hysteresis for Schmitt trigger input Intel® MAX® 10 FPGA Device Datasheet 16 Condition Minimum Unit VCCIO = 3.3 V 180 mV VCCIO = 2.5 V 150 mV VCCIO = 1.8 V 120 mV VCCIO = 1.5 V 110 mV Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Figure 3. LVTTL/LVCMOS Input Standard Voltage Diagram Send Feedback Intel® MAX® 10 FPGA Device Datasheet 17 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Figure 4. Schmitt Trigger Input Standard Voltage Diagram VHYS I/O Standards Specifications Tables in this section list input voltage (VIH and VIL), output voltage (VOH and VOL), and current drive characteristics (IOH and IOL) for various I/O standards supported by Intel MAX 10 devices. For minimum voltage values, use the minimum VCCIO values. For maximum voltage values, use the maximum VCCIO values. You must perform timing closure analysis to determine the maximum achievable frequency for general purpose I/O standards. Intel® MAX® 10 FPGA Device Datasheet 18 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Single-Ended I/O Standards Specifications Table 20. Single-Ended I/O Standards Specifications for Intel MAX 10 Devices To meet the IOL and IOH specifications, you must set the current strength settings accordingly. For example, to meet the 3.3-V LVTTL specification (4 mA), you should set the current strength settings to 4 mA. Setting at lower current strength may not meet the IOL and IOH specifications in the datasheet. I/O Standard VCCIO (V) VIL (V) VIH (V) VOL (V) VOH (V) IOL (mA) IOH (mA) Min Typ Max Min Max Min Max Max Min 3.3 V LVTTL 3.135 3.3 3.465 –0.3 0.8 1.7 3.6 0.45 2.4 4 –4 3.3 V LVCMOS 3.135 3.3 3.465 –0.3 0.8 1.7 3.6 0.2 VCCIO – 0.2 2 –2 3.0 V LVTTL 2.85 3 3.15 –0.3 0.8 1.7 VCCIO + 0.3 0.45 2.4 4 –4 3.0 V LVCMOS 2.85 3 3.15 –0.3 0.8 1.7 VCCIO + 0.3 0.2 VCCIO – 0.2 0.1 –0.1 2.5 V LVTTL and LVCMOS 2.375 2.5 2.625 –0.3 0.7 1.7 VCCIO + 0.3 0.4 2 1 –1 1.8 V LVTTL and LVCMOS 1.71 1.8 1.89 –0.3 0.35 × VCCIO 0.65 × VCCIO 2.25 0.45 VCCIO – 0.45 2 –2 1.5 V LVCMOS 1.425 1.5 1.575 –0.3 0.35 × VCCIO 0.65 × VCCIO VCCIO + 0.3 0.25 × VCCIO 0.75 × VCCIO 2 –2 1.2 V LVCMOS 1.14 1.2 1.26 –0.3 0.35 × VCCIO 0.65 × VCCIO VCCIO + 0.3 0.25 × VCCIO 0.75 × VCCIO 2 –2 0.95 1.0 1.05 –0.3 0.35 × VCCIO 0.65 × VCCIO VCCIO + 0.3 0.25 × VCCIO 0.75 × VCCIO 4 –4 3.3 V Schmitt Trigger 3.135 3.3 3.465 –0.3 0.8 1.7 VCCIO + 0.3 — — — — 2.5 V Schmitt Trigger 2.375 2.5 2.625 –0.3 0.7 1.7 VCCIO + 0.3 — — — — 1.0 V LVCMOS (14) continued... (14) The 1.0 V LVCMOS I/O standard is only supported on the following devices: 10M02SCU324C8G, 10M04SCU324C8G, 10M08SCU324C8G, 10M16SCU324C8G, 10M16SCU169C8G, 10M16SAU169C8G, 10M16DCF484C8G, 10M16DAF484C8G, 10M25DCF484C8G, 10M25DAF484C8G, 10M40DCF484C8G, 10M40DAF484C8G, 10M50DCF484C8G, 10M50DAF484C8G. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 19 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 I/O Standard VCCIO (V) VIL (V) VIH (V) VOL (V) VOH (V) IOL (mA) IOH (mA) Min Typ Max Min Max Min Max Max Min 1.8 V Schmitt Trigger 1.71 1.8 1.89 –0.3 0.35 × VCCIO 0.65 × VCCIO VCCIO + 0.3 — — — — 1.5 V Schmitt Trigger 1.425 1.5 1.575 –0.3 0.35 × VCCIO 0.65 × VCCIO VCCIO + 0.3 — — — — 2.85 3 3.15 — 0.3 × VCCIO 0.5 × VCCIO VCCIO + 0.3 0.1 × VCCIO 0.9 × VCCIO 1.5 –0.5 3.0 V PCI Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications Table 21. Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications for Intel MAX 10 Devices I/O Standard VCCIO (V) VREF (V) (15) Min Typ Max Min Typ Max Min Typ Max 2.375 2.5 2.625 1.19 1.25 1.31 VREF – 0.04 VREF VREF + 0.04 SSTL-18 Class I, II 1.7 1.8 1.9 0.833 0.9 0.969 VREF – 0.04 VREF VREF + 0.04 SSTL-15 Class I, II 1.425 1.5 1.575 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO SSTL-135 Class I, II 1.283 1.35 1.45 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO HSTL-18 Class I, II 1.71 1.8 1.89 0.85 0.9 0.95 0.85 0.9 0.95 HSTL-15 Class I, II 1.425 1.5 1.575 0.71 0.75 0.79 0.71 0.75 0.79 HSTL-12 Class I, II 1.14 1.2 1.26 0.48 × VCCIO 0.5 × VCCIO (16) 0.52 × VCCIO — 0.5 × VCCIO — 0.47 × VCCIO 0.5 × VCCIO (17) — — — SSTL-2 Class I, II (16) (17) HSUL-12 1.14 1.2 1.3 0.49 × VCCIO (15) VTT of transmitting device must track VREF of the receiving device. (16) Value shown refers to DC input reference voltage, VREF(DC). (17) Value shown refers to AC input reference voltage, VREF(AC). Intel® MAX® 10 FPGA Device Datasheet 20 VTT (V) (16) 0.5 × VCCIO 0.53 × VCCIO (17) 0.51 × VCCIO Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications Table 22. Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications for Intel MAX 10 Devices To meet the IOL and IOH specifications, you must set the current strength settings accordingly. For example, to meet the SSTL-15 Class I specification (8 mA), you should set the current strength settings to 8 mA. Setting at lower current strength may not meet the IOL and IOH specifications in the datasheet. I/O Standard VIL(DC) (V) VIH(DC) (V) VIL(AC) (V) VIH(AC) (V) VOL (V) VOH (V) IOL (mA) IOH (mA) Min Max Min Max Min Max Min Max Max Min SSTL-2 Class I — VREF – 0.18 VREF + 0.18 — — VREF – 0.31 VREF + 0.31 — VTT – 0.57 VTT + 0.57 8.1 –8.1 SSTL-2 Class II — VREF – 0.18 VREF + 0.18 — — VREF – 0.31 VREF + 0.31 — VTT – 0.76 VTT + 0.76 16.4 –16.4 SSTL-18 Class I — VREF – 0.125 VREF + 0.125 — — VREF – 0.25 VREF + 0.25 — VTT – 0.475 VTT + 0.475 6.7 –6.7 SSTL-18 Class II — VREF – 0.125 VREF + 0.125 — — VREF – 0.25 VREF + 0.25 — 0.28 VCCIO – 0.28 13.4 –13.4 SSTL-15 Class I — VREF – 0.1 VREF + 0.1 — — VREF – 0.175 VREF + 0.175 — 0.2 × VCCIO 0.8 × VCCIO 8 –8 SSTL-15 Class II — VREF – 0.1 VREF + 0.1 — — VREF – 0.175 VREF + 0.175 — 0.2 × VCCIO 0.8 × VCCIO 16 –16 SSTL-135 — VREF – 0.09 VREF + 0.09 — — VREF – 0.16 VREF + 0.16 — 0.2 × VCCIO 0.8 × VCCIO — — HSTL-18 Class I — VREF – 0.1 VREF + 0.1 — — VREF – 0.2 VREF + 0.2 — 0.4 VCCIO – 0.4 8 –8 HSTL-18 Class II — VREF – 0.1 VREF + 0.1 — — VREF – 0.2 VREF + 0.2 — 0.4 VCCIO – 0.4 16 –16 HSTL-15 Class I — VREF – 0.1 VREF + 0.1 — — VREF – 0.2 VREF + 0.2 — 0.4 VCCIO – 0.4 8 –8 HSTL-15 Class II — VREF – 0.1 VREF + 0.1 — — VREF – 0.2 VREF + 0.2 — 0.4 VCCIO – 0.4 16 –16 continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 21 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 I/O Standard VIL(DC) (V) VIH(DC) (V) VIL(AC) (V) VIH(AC) (V) VOL (V) VOH (V) IOL (mA) IOH (mA) Min Max Min Max Min Max Min Max Max Min HSTL-12 Class I –0.15 VREF – 0.08 VREF + 0.08 VCCIO + 0.15 –0.24 VREF – 0.15 VREF + 0.15 VCCIO + 0.24 0.25 × VCCIO 0.75 × VCCIO 8 –8 HSTL-12 Class II –0.15 VREF – 0.08 VREF + 0.08 VCCIO + 0.15 –0.24 VREF – 0.15 VREF + 0.15 VCCIO + 0.24 0.25 × VCCIO 0.75 × VCCIO 14 –14 — VREF – 0.13 VREF + 0.13 — — VREF – 0.22 VREF + 0.22 — 0.1 × VCCIO 0.9 × VCCIO — — HSUL-12 Differential SSTL I/O Standards Specifications Differential SSTL requires a VREF input. Table 23. Differential SSTL I/O Standards Specifications for Intel MAX 10 Devices I/O Standard VCCIO (V) VSwing(DC) (V) VX(AC) (V) VSwing(AC) (V) Min Typ Max Min Max(18) Min Typ Max Min Max 2.375 2.5 2.625 0.36 VCCIO VCCIO/2 – 0.2 — VCCIO/2+ 0.2 0.7 VCCIO SSTL-18 Class I, II 1.7 1.8 1.9 0.25 VCCIO VCCIO/2 – 0.175 — VCCIO/2+ 0.175 0.5 VCCIO SSTL-15 Class I, II 1.425 1.5 1.575 0.2 — VCCIO/2 – 0.15 — VCCIO/2 + 0.15 2(VIH(AC) – VREF) 2(VIL(AC) – VREF) SSTL-135 1.283 1.35 1.45 0.18 — VREF – 0.135 0.5 × VCCIO VREF + 0.135 2(VIH(AC) – VREF) 2(VIL(AC) – VREF) SSTL-2 Class I, II Differential HSTL and HSUL I/O Standards Specifications Differential HSTL requires a VREF input. (18) The maximum value for VSWING(DC) is not defined. However, each single-ended signal needs to be within the respective single-ended limits (VIH(DC) and VIL(DC)). Intel® MAX® 10 FPGA Device Datasheet 22 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Table 24. Differential HSTL and HSUL I/O Standards Specifications for Intel MAX 10 Devices I/O Standard VCCIO (V) VDIF(DC) (V) VX(AC) (V) VCM(DC) (V) VDIF(AC) (V) Min Typ Max Min Max Min Typ Max Min Typ Max Min HSTL-18 Class I, II 1.71 1.8 1.89 0.2 — 0.85 — 0.95 0.85 — 0.95 0.4 HSTL-15 Class I, II 1.425 1.5 1.575 0.2 — 0.71 — 0.79 0.71 — 0.79 0.4 HSTL-12 Class I, II 1.14 1.2 1.26 0.16 VCCIO 0.48 × VCCIO 0.5 × VCCIO 0.52 × VCCIO 0.48 × VCCIO 0.5 × VCCIO 0.52 × VCCIO 0.3 HSUL-12 1.14 1.2 1.3 0.26 — 0.5 × VCCIO – 0.12 0.5 × VCCIO 0.5 × VCCIO + 0.12 0.4 × VCCIO 0.5 × VCCIO 0.6 × VCCIO 0.44 Differential I/O Standards Specifications Table 25. Differential I/O Standards Specifications for Intel MAX 10 Devices I/O Standard LVPECL (22) LVDS VCCIO (V) VID (mV) VICM (V) (19) VOD (mV) (20)(21) VOS (V) (20) Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max 2.375 2.5 2.625 100 — 0.05 DMAX ≤ 500 Mbps 1.8 — — — — — — 0.55 500 Mbps ≤ DMAX ≤ 700 Mbps 1.8 1.05 DMAX > 700 Mbps 1.55 0.05 DMAX ≤ 500 Mbps 1.8 247 — 600 1.125 1.25 1.375 0.55 500 Mbps ≤ DMAX ≤ 700 Mbps 1.8 2.375 2.5 2.625 100 — continued... (19) VIN range: 0 V ≤ VIN ≤ 1.85 V. (20) RL range: 90 ≤ RL ≤ (21) Low VOD setting is only supported for RSDS standard. (22) LVPECL input standard is only supported at clock input. Output standard is not supported. Send Feedback 110 Ω. Intel® MAX® 10 FPGA Device Datasheet 23 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 I/O Standard VCCIO (V) Min BLVDS (23) mini-LVDS 2.375 (24) Typ 2.5 VID (mV) Max Min Max VICM (V) (19) VOD (mV) Min Condition Max 1.05 DMAX > 700 Mbps 1.55 — — 2.625 100 — — (20)(21) VOS (V) (20) Min Typ Max Min Typ Max — — — — — — 2.375 2.5 2.625 — — — — — 300 — 600 1 1.2 1.4 2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.5 PPDS (Row I/Os) 2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.4 TMDS(25) 2.375 2.5 2.625 100 — 0.05 DMAX ≤ 500 Mbps 1.8 — — — — — — 0.55 500 Mbps ≤ DMAX ≤ 700 Mbps 1.8 1.05 DMAX > 700 Mbps 1.55 0.55 — 1.25 (27) 0.9 1 1.1 (27) RSDS (24) (24) Sub-LVDS SLVS (26) 1.71 2.375 1.8 2.5 1.89 2.625 100 100 — — 0.05 — 0.8 (28) continued... (19) (20) (21) VIN range: 0 V ≤ VIN ≤ 1.85 V. RL range: 90 ≤ RL ≤ 110 Ω. Low VOD setting is only supported for RSDS standard. Intel® MAX® 10 FPGA Device Datasheet 24 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 I/O Standard HiSpi VCCIO (V) VID (mV) VICM (V) (19) VOD (mV) (20)(21) VOS (V) (20) Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max 2.375 2.5 2.625 100 — 0.05 DMAX ≤ 500 Mbps 1.8 — — — — — — 0.55 500 Mbps ≤ DMAX ≤ 700 Mbps 1.8 1.05 DMAX > 700 Mbps 1.55 Related Information Intel MAX 10 LVDS SERDES I/O Standards Support, Intel MAX 10 High-Speed LVDS I/O User Guide Provides the list of I/O standards supported in single supply and dual supply devices. Switching Characteristics This section provides the performance characteristics of Intel MAX 10 core and periphery blocks. (19) (20) (21) VIN range: 0 V ≤ VIN ≤ 1.85 V. RL range: 90 ≤ RL ≤ 110 Ω. Low VOD setting is only supported for RSDS standard. (23) No fixed VIN , VOD , and VOS specifications for Bus LVDS (BLVDS). They are dependent on the system topology. (24) Mini-LVDS, RSDS, and Point-to-Point Differential Signaling (PPDS) standards are only supported at the output pins for Intel MAX 10 devices. (25) Supported with requirement of an external level shift (26) Sub-LVDS input buffer is using 2.5 V differential buffer. (27) Differential output depends on the values of the external termination resistors. (28) Differential output offset voltage depends on the values of the external termination resistors. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 25 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Core Performance Specifications Clock Tree Specifications Table 26. Clock Tree Specifications for Intel MAX 10 Devices Device Performance Unit –I6 –A6, –C7 –I7 –A7 –C8 10M02 450 416 416 382 402 MHz 10M04 450 416 416 382 402 MHz 10M08 450 416 416 382 402 MHz 10M16 450 416 416 382 402 MHz 10M25 450 416 416 382 402 MHz 10M40 450 416 416 382 402 MHz 10M50 450 416 416 382 402 MHz PLL Specifications Table 27. PLL Specifications for Intel MAX 10 Devices VCCD_PLL should always be connected to VCCINT through decoupling capacitor and ferrite bead. Symbol fIN (29) fINPFD Parameter Condition Min Typ Max Unit Input clock frequency — 5 — 472.5 MHz Phase frequency detector (PFD) input frequency — 5 — 325 MHz continued... (29) This parameter is limited in the Intel Quartus Prime software by the I/O maximum frequency. The maximum I/O frequency is different for each I/O standard. Intel® MAX® 10 FPGA Device Datasheet 26 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol fVCO (30) fINDUTY tINJITTER_CCJ fOUT_EXT (31) Parameter Condition Min Typ Max Unit PLL internal voltage-controlled oscillator (VCO) operating range — 600 — 1300 MHz Input clock duty cycle — 40 — 60 % FINPFD ≥ 100 MHz — — 0.15 UI FINPFD < 100 MHz — — ±750 ps — — — 472.5 MHz –6 speed grade — — 472.5 MHz –7 speed grade — — 450 MHz Input clock cycle-to-cycle jitter (29) PLL output frequency for external clock output fOUT PLL output frequency to global clock tOUTDUTY Duty cycle for external clock output tLOCK Time required to lock from end of device configuration tDLOCK Time required to lock dynamically tOUTJITTER_PERIOD_IO Regular I/O period jitter (32) tOUTJITTER_CCJ_IO (32) Regular I/O cycle-to-cycle jitter –8 speed grade — — 402.5 MHz Duty cycle set to 50% 45 50 55 % — — — 1 ms After switchover, reconfiguring any non-post-scale counters or delays, or when areset is deasserted — — 1 ms FOUT ≥ 100 MHz — — 650 ps FOUT < 100 MHz — — 75 mUI FOUT ≥ 100 MHz — — 650 ps FOUT < 100 MHz — — 75 mUI continued... (30) The VCO frequency reported by the Intel Quartus Prime software in the PLL summary section of the compilation report takes into consideration the VCO post-scale counter K value. Therefore, if the counter K has a value of 2, the frequency reported can be lower than the fVCO specification. (31) A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you must provide a clean clock source, which is less than 200 ps. (32) Peak-to-peak jitter with a probability level of 10–12 (14 sigma, 99.99999999974404% confidence level). The output jitter specification applies to the intrinsic jitter of the PLL, when an input jitter of 30 ps is applied. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 27 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Condition Min Typ Max Unit tPLL_PSERR Accuracy of PLL phase shift — — — ±50 ps tARESET Minimum pulse width on areset signal. — 10 — — ns — SCANCLK tCONFIGPLL Time required to reconfigure scan chains for PLLs — fSCANCLK scanclk frequency — Table 28. — 3.5 (33) cycles — — 100 MHz PLL Specifications for Intel MAX 10 Single Supply Devices For V36 package, the PLL specification is based on single supply devices. Symbol Parameter tOUTJITTER_PERIOD_DEDCLK tOUTJITTER_CCJ_DEDCLK Table 29. (32) (32) Dedicated clock output period jitter Dedicated clock output cycle-to-cycle jitter Parameter tOUTJITTER_PERIOD_DEDCLK tOUTJITTER_CCJ_DEDCLK (32) (32) Dedicated clock output period jitter Dedicated clock output cycle-to-cycle jitter Unit FOUT ≥ 100 MHz 660 ps FOUT < 100 MHz 66 mUI FOUT ≥ 100 MHz 660 ps FOUT < 100 MHz 66 mUI Condition Max Unit FOUT ≥ 100 MHz 300 ps FOUT < 100 MHz 30 mUI FOUT ≥ 100 MHz 300 ps FOUT < 100 MHz 30 mUI With 100 MHz scanclk frequency. Intel® MAX® 10 FPGA Device Datasheet 28 Max PLL Specifications for Intel MAX 10 Dual Supply Devices Symbol (33) Condition Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Embedded Multiplier Specifications Table 30. Embedded Multiplier Specifications for Intel MAX 10 Devices Mode Number of Multipliers 9 × 9-bit multiplier Power Supply Mode 1 18 × 18-bit multiplier 1 Performance Unit –I6 –A6, –C7, –I7, –A7 –C8 Single supply mode 198 183 160 MHz Dual supply mode 310 260 210 MHz Single supply mode 198 183 160 MHz Dual supply mode 265 240 190 MHz Memory Block Performance Specifications Table 31. Memory Block Performance Specifications for Intel MAX 10 Devices Memory M9K Block Mode FIFO 256 × 36 Single-port 256 × 36 Simple dual-port 256 × 36 Resources Used LEs M9K Memory 47 1 0 0 1 1 CLK True dual port 512 × 18 single CLK Send Feedback 0 1 Power Supply Mode Performance Unit –I6 –A6, –C7, –I7, –A7 –C8 Single supply mode 232 219 204 MHz Dual supply mode 330 300 250 MHz Single supply mode 232 219 204 MHz Dual supply mode 330 300 250 MHz Single supply mode 232 219 204 MHz Dual supply mode 330 300 250 MHz Single supply mode 232 219 204 MHz Dual supply mode 330 300 250 MHz Intel® MAX® 10 FPGA Device Datasheet 29 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Internal Oscillator Specifications Table 32. Internal Oscillator Frequencies for Intel MAX 10 Devices You can access to the internal oscillator frequencies in this table. The duty cycle of internal oscillator is approximately 45%–55%. Device Frequency 10M02 Unit Minimum Typical Maximum 55 82 116 MHz 35 52 77 MHz 10M04 10M08 10M16 10M25 10M40 10M50 UFM Performance Specifications Table 33. Block UFM UFM Performance Specifications for Intel MAX 10 Devices Mode Avalon®-MM Interface slave Parallel Serial Device Maximum 3.43 7.25 MHz 10M04, 10M08, 10M16, 10M25, 10M40, 10M50 5 116 MHz 10M02, 10M04, 10M08, 10M16, 10M25 3.43 7.25 MHz 10M40, 10M50 2.18 4.81 MHz 10M02 (35) (34) Clock source is derived from user, except for 10M02 device. (35) Clock source is derived from 1/16 of the frequency of the internal oscillator. Intel® MAX® 10 FPGA Device Datasheet 30 Unit Minimum (34) (35) Frequency Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 ADC Performance Specifications Single Supply Devices ADC Performance Specifications Table 34. ADC Performance Specifications for Intel MAX 10 Single Supply Devices Parameter Symbol Condition Min Typ Max Unit — — — — 12 bits VCC_ONE — 2.85 3.0/3.3 3.465 V VREF — VCC_ONE – 0.5 — VCC_ONE V Sampling rate FS Accumulative sampling rate — — 1 MSPS Operating junction temperature range TJ — –40 25 125 °C VIN Prescalar disabled 0 — VREF V 0 — 3.6 V ADC resolution ADC supply voltage External reference voltage Analog input voltage Prescalar enabled (36) Input resistance RIN — — (37) — — Input capacitance CIN — — (37) — — Eoffset Prescalar disabled –0.2 — 0.2 %FS Prescalar enabled –0.5 — 0.5 %FS Prescalar disabled –0.5 — 0.5 %FS Prescalar enabled –0.75 — 0.75 %FS External VREF, no missing code –0.9 — 0.9 LSB Internal VREF, no missing code –1 — 1.7 LSB DC Accuracy Offset error and drift Gain error and drift Differential non linearity Egain DNL continued... (36) Prescalar function divides the analog input voltage by half. The analog input handles up to 3.6 V for the Intel MAX 10 single supply devices. (37) Download the SPICE models for simulation. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 31 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Parameter Integral non linearity AC Accuracy Condition Min Typ Max Unit INL — –2 — 2 LSB — — dB (38) Total harmonic distortion THD FIN = 50 kHz, FS = 1 MHz, PLL –65 Signal-to-noise ratio SNR FIN = 50 kHz, FS = 1 MHz, PLL 54 (39) — — dB SINAD FIN = 50 kHz, FS = 1 MHz, PLL 53 (40) — — dB Temperature sampling rate TS — — — 50 kSPS Absolute accuracy — –40 to 125°C, with 64 samples averaging — — ±10 °C Signal-to-noise and distortion On-Chip Temperature Sensor Symbol (41) Conversion Rate (42) Conversion time — Single measurement — — 1 Cycle Continuous measurement — — 1 Cycle Temperature measurement — — 1 Cycle Related Information SPICE Models for Intel FPGAs (38) THD with prescalar enabled is 6dB less than the specification. (39) SNR with prescalar enabled is 6dB less than the specification. (40) SINAD with prescalar enabled is 6dB less than the specification. (41) For the Intel Quartus Prime software version 15.0 and later, Modular ADC Core Intel FPGA IP and Modular Dual ADC Core Intel FPGA IP cores handle the 64 samples averaging. For the Intel Quartus Prime software versions prior to 14.1, you need to implement your own averaging calculation. (42) For more detailed description, refer to the Timing section in the Intel MAX 10 Analog-to-Digital Converter User Guide. Intel® MAX® 10 FPGA Device Datasheet 32 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Dual Supply Devices ADC Performance Specifications Table 35. ADC Performance Specifications for Intel MAX 10 Dual Supply Devices Parameter Symbol Condition Min Typ Max Unit — — — — 12 bits Analog supply voltage VCCA_ADC — 2.375 2.5 2.625 V Digital supply voltage VCCINT — 1.15 1.2 1.25 V VREF — VCCA_ADC – 0.5 — VCCA_ADC V Sampling rate FS Accumulative sampling rate — — 1 MSPS Operating junction temperature range TJ — –40 25 125 °C VIN Prescalar disabled 0 — VREF V 0 — 3 V ADC resolution External reference voltage Analog input voltage Prescalar enabled (43) Analog supply current (DC) IACC_ADC Average current — 275 450 µA Digital supply current (DC) ICCINT Average current — 65 150 µA Input resistance RIN — — (44) — — Input capacitance CIN — — (44) — — Eoffset Prescalar disabled –0.2 — 0.2 %FS Prescalar enabled –0.5 — 0.5 %FS Prescalar disabled –0.5 — 0.5 %FS Prescalar enabled –0.75 — 0.75 %FS External VREF, no missing code –0.9 — 0.9 LSB DC Accuracy Offset error and drift Gain error and drift Differential non linearity Egain DNL continued... (43) Prescalar function divides the analog input voltage by half. The analog input handles up to 3 V input for the Intel MAX 10 dual supply devices. (44) Download the SPICE models for simulation. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 33 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Parameter Integral non linearity AC Accuracy INL Condition Min Typ Max Unit Internal VREF, no missing code –1 — 1.7 LSB — –2 — 2 LSB (45)(46) — — dB — — dB — — dB Total harmonic distortion THD FIN = 50 kHz, FS = 1 MHz, PLL Signal-to-noise ratio SNR FIN = 50 kHz, FS = 1 MHz, PLL SINAD FIN = 50 kHz, FS = 1 MHz, PLL Temperature sampling rate TS — — — 50 kSPS Absolute accuracy — –40 to 125°C, with 64 samples averaging — — ±5 °C Signal-to-noise and distortion On-Chip Temperature Sensor Symbol –70 62 (47) (48)(49)(47) 61.5 (50) (51)(47) (52) continued... (45) Total harmonic distortion is –65 dB for dual function pin. (46) THD with prescalar enabled is 6dB less than the specification. (47) When using internal VREF, THD = 66 dB, SNR = 58 dB and SINAD = 57.5 dB for dedicated ADC input channels. (48) Signal-to-noise ratio is 54 dB for dual function pin. (49) SNR with prescalar enabled is 6dB less than the specification. (50) Signal-to-noise and distortion is 53 dB for dual function pin. (51) SINAD with prescalar enabled is 6dB less than the specification. (52) For the Intel Quartus Prime software version 15.0 and later, Modular ADC Core and Modular Dual ADC Core IP cores handle the 64 samples averaging. For the Intel Quartus Prime software versions prior to 14.1, you need to implement your own averaging calculation. Intel® MAX® 10 FPGA Device Datasheet 34 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Parameter Conversion Rate (53) Conversion time Symbol Condition Min Typ Max Unit — Single measurement — — 1 Cycle Continuous measurement — — 1 Cycle Temperature measurement — — 1 Cycle Related Information SPICE Models for Intel FPGAs Periphery Performance Specifications This section describes the periphery performance, high-speed I/O, and external memory interface. Actual achievable frequency depends on design and system specific factors. Ensure proper timing closure in your design and perform HSPICE/IBIS simulations based on your specific design and system setup to determine the maximum achievable frequency in your system. High-Speed I/O Specifications For more information about the high-speed and low-speed I/O performance pins, refer to the respective device pin-out files. Related Information Documentation: Pin-Out Files for Intel FPGAs (53) For more detailed description, refer to the Timing section in the Intel MAX 10 Analog-to-Digital Converter User Guide. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 35 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications Table 36. True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices True PPDS transmitter is only supported at bottom I/O banks. Emulated PPDS transmitter is supported at the output pin of all I/O banks. Symbol fHSCLK HSIODR fHSCLK HSIODR Parameter Input clock frequency (high-speed I/O performance pin) Data rate (high-speed I/O performance pin) Input clock frequency (low-speed I/O performance pin) Data rate (low-speed I/O performance pin) Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×10 5 — 155 5 — 155 5 — 155 MHz ×8 5 — 155 5 — 155 5 — 155 MHz ×7 5 — 155 5 — 155 5 — 155 MHz ×4 5 — 155 5 — 155 5 — 155 MHz ×2 5 — 155 5 — 155 5 — 155 MHz ×1 5 — 310 5 — 310 5 — 310 MHz ×10 100 — 310 100 — 310 100 — 310 Mbps ×8 80 — 310 80 — 310 80 — 310 Mbps ×7 70 — 310 70 — 310 70 — 310 Mbps ×4 40 — 310 40 — 310 40 — 310 Mbps ×2 20 — 310 20 — 310 20 — 310 Mbps ×1 10 — 310 10 — 310 10 — 310 Mbps ×10 5 — 150 5 — 150 5 — 150 MHz ×8 5 — 150 5 — 150 5 — 150 MHz ×7 5 — 150 5 — 150 5 — 150 MHz ×4 5 — 150 5 — 150 5 — 150 MHz ×2 5 — 150 5 — 150 5 — 150 MHz ×1 5 — 300 5 — 300 5 — 300 MHz ×10 100 — 300 100 — 300 100 — 300 Mbps ×8 80 — 300 80 — 300 80 — 300 Mbps ×7 70 — 300 70 — 300 70 — 300 Mbps continued... Intel® MAX® 10 FPGA Device Datasheet 36 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×4 40 — 300 40 — 300 40 — 300 Mbps ×2 20 — 300 20 — 300 20 — 300 Mbps ×1 10 — 300 10 — 300 10 — 300 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 % TCCS(54) Transmitter channelto-channel skew — — — 300 — — 300 — — 300 ps tx Jitter(55) Output jitter (highspeed I/O performance pin) — — — 425 — — 425 — — 425 ps Output jitter (lowspeed I/O performance pin) — — — 470 — — 470 — — 470 ps tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 ms (54) TCCS specifications apply to I/O banks from the same side only. (55) TX jitter is the jitter induced from core noise and I/O switching noise. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 37 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications Single Supply Devices True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications Table 37. True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices True RSDS transmitter is only supported at bottom I/O banks. Emulated RSDS transmitter is supported at the output pin of all I/O banks. Symbol fHSCLK HSIODR fHSCLK HSIODR Parameter Input clock frequency (high-speed I/O performance pin) Data rate (high-speed I/O performance pin) Input clock frequency (low-speed I/O performance pin) Data rate (low-speed I/O performance pin) Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×10 5 — 50 5 — 50 5 — 50 MHz ×8 5 — 50 5 — 50 5 — 50 MHz ×7 5 — 50 5 — 50 5 — 50 MHz ×4 5 — 50 5 — 50 5 — 50 MHz ×2 5 — 50 5 — 50 5 — 50 MHz ×1 5 — 100 5 — 100 5 — 100 MHz ×10 100 — 100 100 — 100 100 — 100 Mbps ×8 80 — 100 80 — 100 80 — 100 Mbps ×7 70 — 100 70 — 100 70 — 100 Mbps ×4 40 — 100 40 — 100 40 — 100 Mbps ×2 20 — 100 20 — 100 20 — 100 Mbps ×1 10 — 100 10 — 100 10 — 100 Mbps ×10 5 — 50 5 — 50 5 — 50 MHz ×8 5 — 50 5 — 50 5 — 50 MHz ×7 5 — 50 5 — 50 5 — 50 MHz ×4 5 — 50 5 — 50 5 — 50 MHz ×2 5 — 50 5 — 50 5 — 50 MHz ×1 5 — 100 5 — 100 5 — 100 MHz ×10 100 — 100 100 — 100 100 — 100 Mbps continued... Intel® MAX® 10 FPGA Device Datasheet 38 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×8 80 — 100 80 — 100 80 — 100 Mbps ×7 70 — 100 70 — 100 70 — 100 Mbps ×4 40 — 100 40 — 100 40 — 100 Mbps ×2 20 — 100 20 — 100 20 — 100 Mbps ×1 10 — 100 10 — 100 10 — 100 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 % TCCS(56) Transmitter channelto-channel skew — — — 300 — — 300 — — 300 ps tx Jitter(57) Output jitter (highspeed I/O performance pin) — — — 425 — — 425 — — 425 ps Output jitter (lowspeed I/O performance pin) — — — 470 — — 470 — — 470 ps tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 ms (56) TCCS specifications apply to I/O banks from the same side only. (57) TX jitter is the jitter induced from core noise and I/O switching noise. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 39 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Dual Supply Devices True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications Table 38. True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices True RSDS transmitter is only supported at bottom I/O banks. Emulated RSDS transmitter is supported at the output pin of all I/O banks. Symbol fHSCLK HSIODR fHSCLK HSIODR Parameter Input clock frequency (high-speed I/O performance pin) Data rate (high-speed I/O performance pin) Input clock frequency (low-speed I/O performance pin) Data rate (low-speed I/O performance pin) Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×10 5 — 155 5 — 155 5 — 155 MHz ×8 5 — 155 5 — 155 5 — 155 MHz ×7 5 — 155 5 — 155 5 — 155 MHz ×4 5 — 155 5 — 155 5 — 155 MHz ×2 5 — 155 5 — 155 5 — 155 MHz ×1 5 — 310 5 — 310 5 — 310 MHz ×10 100 — 310 100 — 310 100 — 310 Mbps ×8 80 — 310 80 — 310 80 — 310 Mbps ×7 70 — 310 70 — 310 70 — 310 Mbps ×4 40 — 310 40 — 310 40 — 310 Mbps ×2 20 — 310 20 — 310 20 — 310 Mbps ×1 10 — 310 10 — 310 10 — 310 Mbps ×10 5 — 150 5 — 150 5 — 150 MHz ×8 5 — 150 5 — 150 5 — 150 MHz ×7 5 — 150 5 — 150 5 — 150 MHz ×4 5 — 150 5 — 150 5 — 150 MHz ×2 5 — 150 5 — 150 5 — 150 MHz ×1 5 — 300 5 — 300 5 — 300 MHz ×10 100 — 300 100 — 300 100 — 300 Mbps ×8 80 — 300 80 — 300 80 — 300 Mbps ×7 70 — 300 70 — 300 70 — 300 Mbps continued... Intel® MAX® 10 FPGA Device Datasheet 40 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×4 40 — 300 40 — 300 40 — 300 Mbps ×2 20 — 300 20 — 300 20 — 300 Mbps ×1 10 — 300 10 — 300 10 — 300 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 % TCCS(58) Transmitter channelto-channel skew — — — 300 — — 300 — — 300 ps tx Jitter(59) Output jitter (highspeed I/O performance pin) — — — 425 — — 425 — — 425 ps Output jitter (lowspeed I/O performance pin) — — — 470 — — 470 — — 470 ps tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 ms (58) TCCS specifications apply to I/O banks from the same side only. (59) TX jitter is the jitter induced from core noise and I/O switching noise. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 41 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Emulated RSDS_E_1R Transmitter Timing Specifications Table 39. Emulated RSDS_E_1R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices Emulated RSDS_E_1R transmitter is supported at the output pin of all I/O banks. Symbol fHSCLK HSIODR fHSCLK HSIODR Parameter Input clock frequency (high-speed I/O performance pin) Data rate (high-speed I/O performance pin) Input clock frequency (low-speed I/O performance pin) Data rate (low-speed I/O performance pin) Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×10 5 — 85 5 — 85 5 — 85 MHz ×8 5 — 85 5 — 85 5 — 85 MHz ×7 5 — 85 5 — 85 5 — 85 MHz ×4 5 — 85 5 — 85 5 — 85 MHz ×2 5 — 85 5 — 85 5 — 85 MHz ×1 5 — 170 5 — 170 5 — 170 MHz ×10 100 — 170 100 — 170 100 — 170 Mbps ×8 80 — 170 80 — 170 80 — 170 Mbps ×7 70 — 170 70 — 170 70 — 170 Mbps ×4 40 — 170 40 — 170 40 — 170 Mbps ×2 20 — 170 20 — 170 20 — 170 Mbps ×1 10 — 170 10 — 170 10 — 170 Mbps ×10 5 — 85 5 — 85 5 — 85 MHz ×8 5 — 85 5 — 85 5 — 85 MHz ×7 5 — 85 5 — 85 5 — 85 MHz ×4 5 — 85 5 — 85 5 — 85 MHz ×2 5 — 85 5 — 85 5 — 85 MHz ×1 5 — 170 5 — 170 5 — 170 MHz ×10 100 — 170 100 — 170 100 — 170 Mbps ×8 80 — 170 80 — 170 80 — 170 Mbps ×7 70 — 170 70 — 170 70 — 170 Mbps continued... Intel® MAX® 10 FPGA Device Datasheet 42 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×4 40 — 170 40 — 170 40 — 170 Mbps ×2 20 — 170 20 — 170 20 — 170 Mbps ×1 10 — 170 10 — 170 10 — 170 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 % TCCS(60) Transmitter channelto-channel skew — — — 300 — — 300 — — 300 ps tx Jitter(61) Output jitter (highspeed I/O performance pin) — — — 425 — — 425 — — 425 ps Output jitter (lowspeed I/O performance pin) — — — 470 — — 470 — — 470 ps tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 ms (60) TCCS specifications apply to I/O banks from the same side only. (61) TX jitter is the jitter induced from core noise and I/O switching noise. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 43 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications Table 40. True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices True mini-LVDS transmitter is only supported at the bottom I/O banks. Emulated mini-LVDS_E_3R transmitter is supported at the output pin of all I/O banks. Symbol fHSCLK HSIODR fHSCLK HSIODR Parameter Input clock frequency (high-speed I/O performance pin) Data rate (high-speed I/O performance pin) Input clock frequency (low-speed I/O performance pin) Data rate (low-speed I/O performance pin) Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×10 5 — 155 5 — 155 5 — 155 MHz ×8 5 — 155 5 — 155 5 — 155 MHz ×7 5 — 155 5 — 155 5 — 155 MHz ×4 5 — 155 5 — 155 5 — 155 MHz ×2 5 — 155 5 — 155 5 — 155 MHz ×1 5 — 310 5 — 310 5 — 310 MHz ×10 100 — 310 100 — 310 100 — 310 Mbps ×8 80 — 310 80 — 310 80 — 310 Mbps ×7 70 — 310 70 — 310 70 — 310 Mbps ×4 40 — 310 40 — 310 40 — 310 Mbps ×2 20 — 310 20 — 310 20 — 310 Mbps ×1 10 — 310 10 — 310 10 — 310 Mbps ×10 5 — 150 5 — 150 5 — 150 MHz ×8 5 — 150 5 — 150 5 — 150 MHz ×7 5 — 150 5 — 150 5 — 150 MHz ×4 5 — 150 5 — 150 5 — 150 MHz ×2 5 — 150 5 — 150 5 — 150 MHz ×1 5 — 300 5 — 300 5 — 300 MHz ×10 100 — 300 100 — 300 100 — 300 Mbps ×8 80 — 300 80 — 300 80 — 300 Mbps continued... Intel® MAX® 10 FPGA Device Datasheet 44 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×7 70 — 300 70 — 300 70 — 300 Mbps ×4 40 — 300 40 — 300 40 — 300 Mbps ×2 20 — 300 20 — 300 20 — 300 Mbps ×1 10 — 300 10 — 300 10 — 300 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 % TCCS(62) Transmitter channelto-channel skew — — — 300 — — 300 — — 300 ps tx Jitter(63) Output jitter (highspeed I/O performance pin) — — — 425 — — 425 — — 425 ps Output jitter (lowspeed I/O performance pin) — — — 470 — — 470 — — 470 ps tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 ms (62) TCCS specifications apply to I/O banks from the same side only. (63) TX jitter is the jitter induced from core noise and I/O switching noise. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 45 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 True LVDS Transmitter Timing Single Supply Devices True LVDS Transmitter Timing Specifications Table 41. True LVDS Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices True LVDS transmitter is only supported at the bottom I/O banks. Symbol fHSCLK HSIODR Parameter Input clock frequency Data rate Mode –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×10 5 — 145 5 — 100 5 — 100 MHz ×8 5 — 145 5 — 100 5 — 100 MHz ×7 5 — 145 5 — 100 5 — 100 MHz ×4 5 — 145 5 — 100 5 — 100 MHz ×2 5 — 145 5 — 100 5 — 100 MHz ×1 5 — 290 5 — 200 5 — 200 MHz ×10 100 — 290 100 — 200 100 — 200 Mbps ×8 80 — 290 80 — 200 80 — 200 Mbps ×7 70 — 290 70 — 200 70 — 200 Mbps ×4 40 — 290 40 — 200 40 — 200 Mbps ×2 20 — 290 20 — 200 20 — 200 Mbps ×1 10 — 290 10 — 200 10 — 200 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 % TCCS(64) Transmitter channelto-channel skew — — — 300 — — 300 — — 300 ps tx Jitter(65) Output jitter — — — 1,000 — — 1,000 — — 1,000 ps continued... (64) TCCS specifications apply to I/O banks from the same side only. (65) TX jitter is the jitter induced from core noise and I/O switching noise. Intel® MAX® 10 FPGA Device Datasheet 46 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 ms Dual Supply Devices True LVDS Transmitter Timing Specifications Table 42. True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices True LVDS transmitter is only supported at the bottom I/O banks. Symbol fHSCLK HSIODR Parameter Input clock frequency Data rate Mode –I6 –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max ×10 5 — 360 5 — 340 5 — 310 5 — 300 MHz ×8 5 — 360 5 — 360 5 — 320 5 — 320 MHz ×7 5 — 360 5 — 340 5 — 310 5 — 300 MHz ×4 5 — 360 5 — 350 5 — 320 5 — 320 MHz ×2 5 — 360 5 — 350 5 — 320 5 — 320 MHz ×1 5 — 360 5 — 350 5 — 320 5 — 320 MHz ×10 100 — 720 100 — 680 100 — 620 100 — 600 Mbps ×8 80 — 720 80 — 720 80 — 640 80 — 640 Mbps ×7 70 — 720 70 — 680 70 — 620 70 — 600 Mbps ×4 40 — 720 40 — 700 40 — 640 40 — 640 Mbps ×2 20 — 720 20 — 700 20 — 640 20 — 640 Mbps continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 47 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –I6 –A6, –C7, –I7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max ×1 10 — 360 10 — 350 10 — 320 10 — 320 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 45 — 55 % TCCS(66) Transmitter channel-tochannel skew — — — 300 — — 300 — — 300 — — 300 ps tx Output jitter — — — 380 — — 380 — — 380 — — 380 ps tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 — — 1 ms (67) Jitter (66) TCCS specifications apply to I/O banks from the same side only. (67) TX jitter is the jitter induced from core noise and I/O switching noise. Intel® MAX® 10 FPGA Device Datasheet 48 –A7 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications Single Supply Devices Emulated LVDS_E_3R Transmitter Timing Specifications Table 43. Emulated LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices Emulated LVDS_E_3R transmitters are supported at the output pin of all I/O banks. Symbol fHSCLK HSIODR fHSCLK HSIODR Parameter Input clock frequency (high-speed I/O performance pin) Data rate (high-speed I/O performance pin) Input clock frequency (low-speed I/O performance pin) Data rate (low-speed I/O performance pin) Mode –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×10 5 — 142.5 5 — 100 5 — 100 MHz ×8 5 — 142.5 5 — 100 5 — 100 MHz ×7 5 — 142.5 5 — 100 5 — 100 MHz ×4 5 — 142.5 5 — 100 5 — 100 MHz ×2 5 — 142.5 5 — 100 5 — 100 MHz ×1 5 — 285 5 — 200 5 — 200 MHz ×10 100 — 285 100 — 200 100 — 200 Mbps ×8 80 — 285 80 — 200 80 — 200 Mbps ×7 70 — 285 70 — 200 70 — 200 Mbps ×4 40 — 285 40 — 200 40 — 200 Mbps ×2 20 — 285 20 — 200 20 — 200 Mbps ×1 10 — 285 10 — 200 10 — 200 Mbps ×10 5 — 100 5 — 100 5 — 100 MHz ×8 5 — 100 5 — 100 5 — 100 MHz ×7 5 — 100 5 — 100 5 — 100 MHz ×4 5 — 100 5 — 100 5 — 100 MHz ×2 5 — 100 5 — 100 5 — 100 MHz ×1 5 — 200 5 — 200 5 — 200 MHz ×10 100 — 200 100 — 200 100 — 200 Mbps continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 49 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –C7, –I7 –A7 Unit Min Typ Max Min Typ Max Min Typ Max ×8 80 — 200 80 — 200 80 — 200 Mbps ×7 70 — 200 70 — 200 70 — 200 Mbps ×4 40 — 200 40 — 200 40 — 200 Mbps ×2 20 — 200 20 — 200 20 — 200 Mbps ×1 10 — 200 10 — 200 10 — 200 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 % TCCS(68) Transmitter channelto-channel skew — — — 300 — — 300 — — 300 ps tx Jitter(69) Output jitter — — — 1,000 — — 1,000 — — 1,000 ps tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 ms (68) TCCS specifications apply to I/O banks from the same side only. (69) TX jitter is the jitter induced from core noise and I/O switching noise. Intel® MAX® 10 FPGA Device Datasheet 50 –C8 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Dual Supply Devices Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications Table 44. Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices Emulated LVDS_E_3R, SLVS, and Sub-LVDS transmitters are supported at the output pin of all I/O banks. Symbol fHSCLK HSIODR fHSCLK HSIODR Parameter Input clock frequency (high-speed I/O performance pin) Data rate (high-speed I/O performance pin) Input clock frequency (low-speed I/O performance pin) Data rate (low-speed I/O performance pin) Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Typ Max Min Typ Max Min Typ Max ×10 5 — 300 5 — 275 5 — 275 MHz ×8 5 — 300 5 — 275 5 — 275 MHz ×7 5 — 300 5 — 275 5 — 275 MHz ×4 5 — 300 5 — 275 5 — 275 MHz ×2 5 — 300 5 — 275 5 — 275 MHz ×1 5 — 300 5 — 275 5 — 275 MHz ×10 100 — 600 100 — 550 100 — 550 Mbps ×8 80 — 600 80 — 550 80 — 550 Mbps ×7 70 — 600 70 — 550 70 — 550 Mbps ×4 40 — 600 40 — 550 40 — 550 Mbps ×2 20 — 600 20 — 550 20 — 550 Mbps ×1 10 — 300 10 — 275 10 — 275 Mbps ×10 5 — 150 5 — 150 5 — 150 MHz ×8 5 — 150 5 — 150 5 — 150 MHz ×7 5 — 150 5 — 150 5 — 150 MHz ×4 5 — 150 5 — 150 5 — 150 MHz ×2 5 — 150 5 — 150 5 — 150 MHz ×1 5 — 300 5 — 300 5 — 300 MHz ×10 100 — 300 100 — 300 100 — 300 Mbps ×8 80 — 300 80 — 300 80 — 300 Mbps continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 51 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 Unit Min Typ Max Min Typ Max Min Typ Max ×7 70 — 300 70 — 300 70 — 300 Mbps ×4 40 — 300 40 — 300 40 — 300 Mbps ×2 20 — 300 20 — 300 20 — 300 Mbps ×1 10 — 300 10 — 300 10 — 300 Mbps tDUTY Duty cycle on transmitter output clock — 45 — 55 45 — 55 45 — 55 % TCCS(70) Transmitter channelto-channel skew — — — 300 — — 300 — — 300 ps tx Jitter(71) Output jitter (highspeed I/O performance pin) — — — 425 — — 425 — — 425 ps Output jitter (lowspeed I/O performance pin) — — — 470 — — 470 — — 470 ps tRISE Rise time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tFALL Fall time 20 – 80%, CLOAD = 5 pF — 500 — — 500 — — 500 — ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — — 1 — — 1 — — 1 ms (70) TCCS specifications apply to I/O banks from the same side only. (71) TX jitter is the jitter induced from core noise and I/O switching noise. Intel® MAX® 10 FPGA Device Datasheet 52 –C8 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications Single Supply Devices LVDS Receiver Timing Specifications Table 45. LVDS Receiver Timing Specifications for Intel MAX 10 Single Supply Devices LVDS receivers are supported at all banks. Symbol fHSCLK HSIODR fHSCLK HSIODR Parameter Input clock frequency (highspeed I/O performance pin) Data rate (high-speed I/O performance pin) Input clock frequency (lowspeed I/O performance pin) Data rate (low-speed I/O performance pin) Mode –C7, –I7 –A7 –C8 Unit Min Max Min Max Min Max ×10 5 145 5 100 5 100 MHz ×8 5 145 5 100 5 100 MHz ×7 5 145 5 100 5 100 MHz ×4 5 145 5 100 5 100 MHz ×2 5 145 5 100 5 100 MHz ×1 5 290 5 200 5 200 MHz ×10 100 290 100 200 100 200 Mbps ×8 80 290 80 200 80 200 Mbps ×7 70 290 70 200 70 200 Mbps ×4 40 290 40 200 40 200 Mbps ×2 20 290 20 200 20 200 Mbps ×1 10 290 10 200 10 200 Mbps ×10 5 100 5 100 5 100 MHz ×8 5 100 5 100 5 100 MHz ×7 5 100 5 100 5 100 MHz ×4 5 100 5 100 5 100 MHz ×2 5 100 5 100 5 100 MHz ×1 5 200 5 200 5 200 MHz ×10 100 200 100 200 100 200 Mbps continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 53 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –C7, –I7 –A7 –C8 Unit Min Max Min Max Min Max ×8 80 200 80 200 80 200 Mbps ×7 70 200 70 200 70 200 Mbps ×4 40 200 40 200 40 200 Mbps ×2 20 200 20 200 20 200 Mbps ×1 10 200 10 200 10 200 Mbps Sampling window (highspeed I/O performance pin) — — 910 — 910 — 910 ps Sampling window (lowspeed I/O performance pin) — — 1,110 — 1,110 — 1,110 ps tx Jitter(72) Input jitter — — 1,000 — 1,000 — 1,000 ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — 1 — 1 — 1 ms SW Dual Supply Devices LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications Table 46. LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS receivers are supported at all banks. Symbol fHSCLK Parameter Input clock frequency (highspeed I/O performance pin) Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Max Min Max Min Max ×10 5 350 5 320 5 320 MHz ×8 5 360 5 320 5 320 MHz ×7 5 350 5 320 5 320 MHz ×4 5 360 5 320 5 320 MHz continued... (72) TX jitter is the jitter induced from core noise and I/O switching noise. Intel® MAX® 10 FPGA Device Datasheet 54 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol HSIODR fHSCLK HSIODR SW Parameter Data rate (high-speed I/O performance pin) Input clock frequency (lowspeed I/O performance pin) Data rate (low-speed I/O performance pin) Sampling window (highspeed I/O performance pin) Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Max Min Max Min Max ×2 5 360 5 320 5 320 MHz ×1 5 360 5 320 5 320 MHz ×10 100 700 100 640 100 640 Mbps ×8 80 720 80 640 80 640 Mbps ×7 70 700 70 640 70 640 Mbps ×4 40 720 40 640 40 640 Mbps ×2 20 720 20 640 20 640 Mbps ×1 10 360 10 320 10 320 Mbps ×10 5 150 5 150 5 150 MHz ×8 5 150 5 150 5 150 MHz ×7 5 150 5 150 5 150 MHz ×4 5 150 5 150 5 150 MHz ×2 5 150 5 150 5 150 MHz ×1 5 300 5 300 5 300 MHz ×10 100 300 100 300 100 300 Mbps ×8 80 300 80 300 80 300 Mbps ×7 70 300 70 300 70 300 Mbps ×4 40 300 40 300 40 300 Mbps ×2 20 300 20 300 20 300 Mbps ×1 10 300 10 300 10 300 Mbps — — 510 — 510 — 510 ps continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 55 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit Min Max Min Max Min Max Sampling window (lowspeed I/O performance pin) — — 910 — 910 — 910 ps tx Jitter(73) Input jitter — — 500 — 500 — 500 ps tLOCK Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration — — 1 — 1 — 1 ms Memory Standards Supported by the Soft Memory Controller Table 47. Memory Standards Supported by the Soft Memory Controller for Intel MAX 10 Devices Contact your local sales representatives for access to the -I6 or -A6 speed grade devices in the Intel Quartus Prime software. External Memory Interface Standard Rate Support Speed Grade Voltage (V) Max Frequency (MHz) DDR3 SDRAM Half –I6 1.5 303 DDR3L SDRAM Half –I6 1.35 303 DDR2 SDRAM Half –I6 1.8 200 –I7 and –C7 LPDDR2(74) Half –I6 167 1.2 200(75) Related Information External Memory Interface Spec Estimator Provides the specific details of the memory standards supported. (73) TX jitter is the jitter induced from core noise and I/O switching noise. (74) Intel MAX 10 devices support only single-die LPDDR2. (75) To achieve the specified performance, constrain the memory device I/O and core power supply variation to within ±3%. By default, the frequency is 167 MHz. Intel® MAX® 10 FPGA Device Datasheet 56 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Memory Output Clock Jitter Specifications Intel MAX 10 devices support external memory interfaces up to 303 MHz. The external memory interfaces for Intel MAX 10 devices calibrate automatically. The memory output clock jitter measurements are for 200 consecutive clock cycles. The clock jitter specification applies to memory output clock pins generated using DDIO circuits clocked by a PLL output routed on a PHY clock network. DDR3 and LPDDR2 SDRAM memory interfaces are only supported on the fast speed grade device. Table 48. Memory Output Clock Jitter Specifications for Intel MAX 10 Devices Parameter Symbol –6 Speed Grade –7 Speed Grade Min Max Min Max Unit Clock period jitter tJIT(per) –127 127 –215 215 ps Cycle-to-cycle period jitter tJIT(cc) — 242 — 360 ps Related Information Literature: External Memory Interfaces Provides more information about external memory system performance specifications, board design guidelines, timing analysis, simulation, and debugging information. Configuration Specifications This section provides configuration specifications and timing for Intel MAX 10 devices. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 57 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 JTAG Timing Parameters Table 49. JTAG Timing Parameters for Intel MAX 10 Devices The values are based on CL = 10 pF of TDO. The affected Boundary Scan Test (BST) instructions are SAMPLE/PRELOAD, EXTEST, INTEST, and CHECK_STATUS. Symbol Parameter Non-BST and non-CONFIG_IO Operation Minimum Maximum Minimum Maximum Unit tJCP TCK clock period 40 — 50 — ns tJCH TCK clock high time 20 — 25 — ns tJCL TCK clock low time 20 — 25 — ns tJPSU_TDI JTAG port setup time 2 — 2 — ns tJPSU_TMS JTAG port setup time 3 — 3 — ns tJPH JTAG port hold time 10 — 10 — ns tJPCO JTAG port clock to output — • • tJPZX JTAG port high impedance to valid output — • • tJPXZ JTAG port valid output to high impedance — • • Intel® MAX® 10 FPGA Device Datasheet 58 BST and CONFIG_IO Operation 15 (for VCCIO = 3.3, 3.0, and 2.5 V) 17 (for VCCIO = 1.8 and 1.5 V) — 15 (for VCCIO = 3.3, 3.0, and 2.5 V) 17 (for VCCIO = 1.8 and 1.5 V) — 15 (for VCCIO = 3.3, 3.0, and 2.5 V) 17 (for VCCIO = 1.8 and 1.5 V) — • • • • • • 18 (for VCCIO = 3.3, 3.0, and 2.5 V) 20 (for VCCIO = 1.8 and 1.5 V) ns 15 (for VCCIO = 3.3, 3.0, and 2.5 V) 17 (for VCCIO = 1.8 and 1.5 V) ns 15 (for VCCIO = 3.3, 3.0, and 2.5 V) 17 (for VCCIO = 1.8 and 1.5 V) ns Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Remote System Upgrade Circuitry Timing Specifications Table 50. Remote System Upgrade Circuitry Timing Specifications for Intel MAX 10 Devices Parameter Device Minimum Maximum Unit tMAX_RU_CLK All — 40 MHz tRU_nCONFIG 10M02, 10M04, 10M08, 10M16, 10M25 250 — ns 10M40, 10M50 350 — ns 10M02, 10M04, 10M08, 10M16, 10M25 300 — ns 10M40, 10M50 500 — ns tRU_nRSTIMER User Watchdog Internal Circuitry Timing Specifications Table 51. User Watchdog Timer Specifications for Intel MAX 10 Devices The specifications are subject to PVT changes. Parameter User watchdog frequency Device Minimum Typical Maximum Unit 10M02, 10M04, 10M08, 10M16, 10M25 3.4 5.1 7.3 MHz 10M40, 10M50 2.2 3.3 4.8 MHz Uncompressed Raw Binary File (.rbf) Sizes Table 52. Uncompressed .rbf Sizes for Intel MAX 10 Devices Device CFM Data Size (bits) Without Memory Initialization With Memory Initialization 10M02/10M02SCU324 554,000/1,540,000 — 10M04 1,540,000 1,880,000 10M08 1,540,000 1,880,000 10M16 2,800,000 3,430,000 continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 59 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Device CFM Data Size (bits) Without Memory Initialization With Memory Initialization 10M25 4,140,000 4,780,000 10M40 7,840,000 9,670,000 10M50 7,840,000 9,670,000 Internal Configuration Time The internal configuration time measurement is from the rising edge of nSTATUS signal to the rising edge of CONF_DONE signal. Table 53. Internal Configuration Time for Intel MAX 10 Devices (Uncompressed .rbf) Device Internal Configuration Time (ms) Unencrypted Without Memory Initialization With Memory Initialization Without Memory Initialization With Memory Initialization Min Max Min Max Min Max Min Max 10M02/ 10M02SCU324 0.3/0.6 1.7/2.7 — — 1.7/5.0 5.4/15.0 — — 10M04 0.6 2.7 1.0 3.4 5.0 15.0 6.8 19.6 10M08 0.6 2.7 1.0 3.4 5.0 15.0 6.8 19.6 10M16 1.1 3.7 1.4 4.5 9.3 25.3 11.7 31.5 10M25 1.0 3.7 1.3 4.4 14.0 38.1 16.9 45.7 10M40 2.6 6.9 3.2 9.8 41.5 112.1 51.7 139.6 10M50 2.6 6.9 3.2 9.8 41.5 112.1 51.7 139.6 Intel® MAX® 10 FPGA Device Datasheet 60 Encrypted Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Table 54. Internal Configuration Time for Intel MAX 10 Devices (Compressed .rbf) Compression ratio depends on design complexity. The minimum value is based on the best case (25% of original .rbf sizes) and the maximum value is based on the typical case (70% of original .rbf sizes). Device Internal Configuration Time (ms) Unencrypted/Encrypted Without Memory Initialization With Memory Initialization Min Max Min Max 10M02/10M02SCU324 0.3/0.6 5.2/10.7 — — 10M04 0.6 10.7 1.0 13.9 10M08 0.6 10.7 1.0 13.9 10M16 1.1 17.9 1.4 22.3 10M25 1.1 26.9 1.4 32.2 10M40 2.6 66.1 3.2 82.2 10M50 2.6 66.1 3.2 82.2 Internal Configuration Timing Parameter Table 55. Internal Configuration Timing Parameter for Intel MAX 10 Devices Symbol tCD2UM Parameter Device Minimum Maximum Unit CONF_DONE high to 10M02, 10M04, 10M08, 10M16, 10M25 182.8 385.5 μs 10M40, 10M50 275.3 605.7 μs user mode I/O Timing The data is typically used prior to designing the FPGA to get an estimate of the timing budget as part of the link timing analysis. The Intel Quartus Prime Timing Analyzer provides a more accurate and precise I/O timing data based on the specific device and design after you complete place-and-route. Send Feedback Intel® MAX® 10 FPGA Device Datasheet 61 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Table 56. I/O Timing for Intel MAX 10 Devices These I/O timing parameters are for the 3.3-V LVTTL I/O standard with the maximum drive strength and fast slew rate for 10M08DAF484 device. Symbol Parameter –C7, –I7 –C8 Unit –0.750 –0.808 ns Tsu Global clock setup time Th Global clock hold time 1.180 1.215 ns Tco Global clock to output delay 5.131 5.575 ns Tpd Best case pin-to-pin propagation delay through one LUT 4.907 5.467 ns Programmable IOE Delay Programmable IOE Delay On Row Pins Table 57. IOE Programmable Delay on Row Pins for Intel MAX 10 Devices The incremental values for the settings are generally linear. For exact values of each setting, refer to the Assignment Name column in the latest version of the Intel Quartus Prime software. The minimum and maximum offset timing numbers are in reference to setting ‘0’ as available in the Intel Quartus Prime software. Parameter Paths Affected Minimum Offset Maximum Offset Fast Corner Unit Slow Corner –I7 –C8 –A6 –C7 –C8 –I7 –A7 Input delay from pin to internal cells Pad to I/O dataout to core 7 0 0.815 0.873 1.831 1.811 1.874 1.871 1.922 ns Input delay from pin to input register Pad to I/O input register 8 0 0.924 0.992 2.081 2.055 2.125 2.127 2.185 ns Delay from output register to output pin I/O output register to pad 2 0 0.479 0.514 1.069 1.070 1.117 1.105 1.134 ns Intel® MAX® 10 FPGA Device Datasheet 62 Number of Settings Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Programmable IOE Delay for Column Pins Table 58. IOE Programmable Delay on Column Pins for Intel MAX 10 Devices The incremental values for the settings are generally linear. For exact values of each setting, refer to the Assignment Name column in the latest version of the Intel Quartus Prime software. The minimum and maximum offset timing numbers are in reference to setting ‘0’ as available in the Intel Quartus Prime software. Parameter Paths Affected Number of Settings Minimum Offset Maximum Offset Fast Corner Unit Slow Corner –I7 –C8 –A6 –C7 –C8 –I7 –A7 Input delay from pin to internal cells Pad to I/O dataout to core 7 0 0.81 0.868 1.823 1.802 1.864 1.862 1.912 ns Input delay from pin to input register Pad to I/O input register 8 0 0.914 0.981 2.06 2.032 2.101 2.102 2.161 ns Delay from output register to output pin I/O output register to pad 2 0 0.435 0.466 0.971 0.97 1.013 1.001 1.028 ns Send Feedback Intel® MAX® 10 FPGA Device Datasheet 63 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Glossary Table 59. Glossary Term JTAG Timing Specifications Definition TMS TDI t JCH t JCP t JCL t JPSU tJPH TCK tJPZX tJPCO t JPXZ TDO RL Receiver differential input discrete resistor (external to Intel MAX 10 devices). RSKM (Receiver input skew margin) HIGH-SPEED I/O block: The total margin left after accounting for the sampling window and TCCS. RSKM = (TUI – SW – TCCS) / 2. Sampling window (SW) HIGH-SPEED I/O Block: The period of time during which the data must be valid to capture it correctly. The setup and hold times determine the ideal strobe position in the sampling window. Single-ended voltage referenced I/O standard The AC input signal values indicate the voltage levels at which the receiver must meet its timing specifications. The DC input signal values indicate the voltage levels at which the final logic state of the receiver is unambiguously defined. After the receiver input crosses the AC value, the receiver changes to the new logic state. The new logic state is then maintained as long as the input stays beyond the DC threshold. This approach is intended to provide predictable receiver timing in the presence of input waveform ringing. tC High-speed receiver/transmitter input and output clock period. TCCS (Channel-to- channel-skew) HIGH-SPEED I/O block: The timing difference between the fastest and slowest output edges, including tCO variation and clock skew. The clock is included in the TCCS measurement. tcin Delay from clock pad to I/O input register. tCO Delay from clock pad to I/O output. tcout Delay from clock pad to I/O output register. continued... Intel® MAX® 10 FPGA Device Datasheet 64 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Term Definition tDUTY HIGH-SPEED I/O Block: Duty cycle on high-speed transmitter output clock. tFALL Signal high-to-low transition time (80–20%). tH Input register hold time. Timing Unit Interval (TUI) HIGH-SPEED I/O block: The timing budget allowed for skew, propagation delays, and data sampling window. (TUI = 1/(Receiver Input Clock Frequency Multiplication Factor) = tC/w). tINJITTER Period jitter on PLL clock input. tOUTJITTER_DEDCLK Period jitter on dedicated clock output driven by a PLL. tOUTJITTER_IO Period jitter on general purpose I/O driven by a PLL. tpllcin Delay from PLL inclk pad to I/O input register. tpllcout Delay from PLL inclk pad to I/O output register. tRISE Signal low-to-high transition time (20–80%). tSU Input register setup time. VCM(DC) DC common mode input voltage. VDIF(AC) AC differential input voltage: The minimum AC input differential voltage required for switching. VDIF(DC) DC differential input voltage: The minimum DC input differential voltage required for switching. VHYS Hysteresis for Schmitt trigger input. VICM Input common mode voltage: The common mode of the differential signal at the receiver. VID Input differential Voltage Swing: The difference in voltage between the positive and complementary conductors of a differential transmission at the receiver. VIH Voltage input high: The minimum positive voltage applied to the input which is accepted by the device as a logic high. VIH(AC) High-level AC input voltage. VIH(DC) High-level DC input voltage. VIL Voltage input low: The maximum positive voltage applied to the input which is accepted by the device as a logic low. VIL (AC) Low-level AC input voltage. VIL (DC) Low-level DC input voltage. VIN DC input voltage. continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 65 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Term VOCM Output common mode voltage: The common mode of the differential signal at the transmitter. VOD Output differential voltage swing: The difference in voltage between the positive and complementary conductors of a differential transmission line at the transmitter. VOD = VOH – VOL. VOH Voltage output high: The maximum positive voltage from an output which the device considers is accepted as the minimum positive high level. VOL Voltage output low: The maximum positive voltage from an output which the device considers is accepted as the maximum positive low level. VOS Output offset voltage: VOS = (VOH + VOL) / 2. VOX (AC) AC differential Output cross point voltage: The voltage at which the differential output signals must cross. VREF Reference voltage for SSTL, HSTL, and HSUL I/O Standards. VREF(AC) AC input reference voltage for SSTL, HSTL, and HSUL I/O Standards. VREF(AC) = VREF(DC) + noise. The peak-to-peak AC noise on VREF should not exceed 2% of VREF(DC). VREF(DC) DC input reference voltage for SSTL, HSTL, and HSUL I/O Standards. VSWING (AC) AC differential input voltage: AC Input differential voltage required for switching. VSWING (DC) DC differential input voltage: DC Input differential voltage required for switching. VTT Termination voltage for SSTL, HSTL, and HSUL I/O Standards. VX (AC) AC differential Input cross point voltage: The voltage at which the differential input signals must cross. Intel® MAX® 10 FPGA Device Datasheet 66 Definition Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Document Revision History for the Intel MAX 10 FPGA Device Datasheet Document Version 2020.06.30 Changes • • • 2018.06.29 Date December 2017 • • • Added VCCIO specifications for 1.0 V in the following tables: — Power Supplies Recommended Operating Conditions for Intel MAX 10 Single Supply Devices — Power Supplies Recommended Operating Conditions for Intel MAX 10 Dual Supply Devices Added 1.0 V LVCMOS specifications in the Single-Ended I/O Standards Specifications for Intel MAX 10 Devices table. Added specifications for 10M02SCU324 device in the following tables: — Uncompressed .rbf Sizes for Intel MAX 10 Devices — Internal Configuration Time for Intel MAX 10 Devices (Uncompressed .rbf) — Internal Configuration Time for Intel MAX 10 Devices (Compressed .rbf) Removed links on instant-on feature. Added JTAG timing specifications term in Glossary. Renamed the following IP cores as per Intel rebranding: — Renamed Altera Modular ADC IP core to Modular ADC core Intel FPGA IP core. — Renamed Altera Modular Dual ADC IP core to Modular Dual ADC core Intel FPGA IP core. Version 2017.12.15 Changes • • June 2017 2017.06.16 • Removed the units for "Input resistance" and "Input capacitance" parameters in the following tables: — ADC Performance Specifications for Intel MAX 10 Single Supply Devices — ADC Performance Specifications for Intel MAX 10 Dual Supply Devices Removed the specification with memory initialization for 10M02 device in the Uncompressed .rbf Sizes for Intel MAX 10 Devices table. • • • Added notes for TJ for Industrial and Automotive devices in Recommended Operating Conditions for Intel MAX 10 Devices table. Updated the parameter in Internal Weak Pull-Up Resistor for Intel MAX 10 Devices table. Changed "Performance" to "Frequency" in UFM Performance Specifications for Intel MAX 10 Devices table. Removed PowerPlay text from tool name. February 2017 2017.02.21 • Rebranded as Intel. October 2016 2016.10.31 • • Updated the note to the Intel MAX 10 Device Grades and Speed Grades Supported table. Updated the Memory Standards Supported by the Soft Memory Controller for Intel MAX 10 Devices table. continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 67 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Date May 2016 Version 2016.05.02 Changes • • • • • • Updated tRAMP specifications in Recommended Operating Conditions for Intel MAX 10 Devices table. — Removed standard POR and fast POR specifications. — Updated maximum value from 3 ms to 10 ms and added a not for the minimum value. Added Supply Current and Power Consumption section. Added the following tables: — Memory Standards Supported by the Soft Memory Controller for Intel MAX 10 Devices — Internal Configuration Timing Parameter for Intel MAX 10 Devices Removed POR Delay Specifications for Intel MAX 10 Devices table. Updated the description in the Internal Configuration Time section. Updated the following tables: — Internal Configuration Time for Intel MAX 10 Devices (Uncompressed .rbf) — Internal Configuration Time for Intel MAX 10 Devices (Compressed .rbf) January 2016 2016.01.22 • • • • • • • • • • Added description about automotive temperature devices in the Programming/Erasure Specifications table. Changed the pin capacitance to maximum values. Updated maximum TCCS specifications from 410 ps to 300 ps in the following tables: — True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated RSDS_E_1R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True LVDS Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices — True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices — Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices Added new table: True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices. Updated maximum fHSCLK and HSIODR specifications for –A6, –C7, and –I7 speed grades in True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices table. Updated SW specifications in the following tables: — LVDS Receiver Timing Specifications for Intel MAX 10 Single Supply Devices — LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices Updated maximum fHSCLK and HSIODR (high-speed I/O performance pin) specifications for –I6, –A6, –C7, –I7 speed grades in LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices table. Removed Internal Configuration Time information in the Uncompressed .rbf Sizes for Intel MAX 10 Devices table. Added Internal Configuration Time tables for uncompressed .rbf files and compressed .rbf files. Removed Preliminary tags for all tables. continued... Intel® MAX® 10 FPGA Device Datasheet 68 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Date November 2015 Version 2015.11.02 Changes • • Added description to Maximum Allowed Overshoot During Transitions over a 11.4-Year Time Frame topic. • Updated the condition for "Bus-hold high, sustaining current" parameter from "VIN < VIL (minimum)" to "VIN < VIH (minimum)" in Bus Hold Parameters table. Added –A6 speed grade in the following tables: — Intel MAX 10 Device Grades and Speed Grades Supported — Series OCT without Calibration Specifications for Intel MAX 10 Devices — Clock Tree Specifications for Intel MAX 10 Devices — Embedded Multiplier Specifications for Intel MAX 10 Devices — Memory Block Performance Specifications for Intel MAX 10 Devices — True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated RSDS_E_1R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices — IOE Programmable Delay on Row Pins for Intel MAX 10 Devices — IOE Programmable Delay on Column Pins for Intel MAX 10 Devices Updated the maximum value for input clock cycle-to-cycle jitter (tINJITTER_CCJ) with FINPFD < 100 MHz condition from 750 ps to ±750 ps in PLL Specifications for Intel MAX 10 Devices table. Updated the dual supply mode performance in Embedded Multiplier Specifications for Intel MAX 10 Devices table. Updated the dual supply mode performance in Memory Block Performance Specifications for Intel MAX 10 Devices table. Added typical specifications in Internal Oscillator Frequencies for Intel MAX 10 Devices table. Updated specifications in UFM Performance Specifications for Intel MAX 10 Devices table. Updated sampling window specifications in LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices table. Updated IOE programmable delay for row and column pins. Changed instances of Quartus II to Quartus Prime. • • • • • • • • • June 2015 2015.06.12 • • • • • Added ADC_VREF Pin Leakage Current for Intel MAX 10 Devices table. Updated the maximum values in Internal Weak Pull-Up Resistor for Intel MAX 10 Devices table. Removed Internal Weak Pull-Up Resistor equation. Updated the note for input resistance and input capacitance parameters in the ADC Performance Specifications table for both single supply and dual supply devices. Note: Download the SPICE models for simulation. Added a note to AC Accuracy - THD, SNR, and SINAD parameters in the ADC Performance Specifications for Intel MAX 10 Dual Supply Devices table. Note: When using internal VREF, THD = 66 dB, SNR = 58 dB and SINAD = 57.5 dB for dedicated ADC input channels. Updated clock period jitter and cycle-to-cycle period jitter parameters in the Memory Output Clock Jitter Specifications for Intel MAX 10 Devices table. continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 69 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Date May 2015 Version 2015.05.04 Changes • • • • • • • Updated a note to VCCIO for both single supply and dual supply power supplies recommended operating conditions tables. Note updated: VCCIO for all I/O banks must be powered up during user mode because VCCIO I/O banks are used for the ADC and I/O functionalities. Updated Example for OCT Resistance Calculation after Calibration at Device Power-Up. Removed a note to BLVDS in Differential I/O Standards Specifications for Intel MAX 10 Devices table. BLVDS is now supported in Intel MAX 10 single supply devices. Note removed: BLVDS TX is not supported in single supply devices. Updated ADC Performance Specifications for both single supply and dual supply devices. — Changed the symbol for Operating junction temperature range parameter from TA to TJ. — Edited sampling rate maximum value from 1000 kSPS to 1 MSPS. — Added a note to analog input voltage parameter. — Removed input frequency, fIN specification. — Updated the condition for DNL specification: External VREF, no missing code. Added DNL specification for condition: Internal VREF, no missing code. — Added notes to AC accuracy specifications that the value with prescalar enabled is 6dB less than the specification. — Added a note to On-Chip Temperature Sensor (absolute accuracy) parameter about the averaging calculation. Updated ADC Performance Specifications for Intel MAX 10 Single Supply Devices table. — Added condition for On-Chip Temperature Sensor (absolute accuracy) parameter: with 64 samples averaging. Updated ADC Performance Specifications for Intel MAX 10 Dual Supply Devices table. — Updated Digital Supply Voltage minimum value from 1.14 V to 1.15 V and maximum value from 1.26 V to 1.25 V. Updated fHSCLK and HSIODR specifications for –A7 speed grade in the following tables: — True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True LVDS Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices — True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices — Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — LVDS Receiver Timing Specifications for Intel MAX 10 Single Supply Devices — LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices continued... Intel® MAX® 10 FPGA Device Datasheet 70 Send Feedback Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Date Version Changes • • • • • • • • January 2015 2015.01.23 • • December 2014 2014.12.15 • • • Updated TCCS specifications in the following tables: — True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated RSDS_E_1R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True LVDS Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices — True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices — Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices Updated tx Jitter specifications in the following tables: — True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated RSDS_E_1R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices — Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices Updated SW specifications in LVDS Receiver Timing Specifications for Intel MAX 10 Single Supply Devices table. Added a note to tx Jitter for all LVDS tables. Note: TX jitter is the jitter induced from core noise and I/O switching noise. Updated the description for tLOCK for all LVDS tables: Time required for the PLL to lock, after CONF_DONE signal goes high, indicating the completion of device configuration. Updated Memory Output Clock Jitter Specifications section. — Updated maximum external memory interfaces frequency from 300 MHz to 303 MHz. — Updated PLL output routing from global clock network to PHY clock network. Added I/O Timing for Intel MAX 10 Devices table. Added VHYS in the Glossary table. Removed a note to VCCA in Power Supplies Recommended Operating Conditions for Intel MAX 10 Dual Supply Devices table. This note is not valid: All VCCA pins must be connected together for EQFP package. Corrected the maximum value for tOUTJITTER_CCJ_ IO (FOUT ≥ 100 MHz) from 60 ps to 650 ps in PLL Specifications for Intel MAX 10 Devices table. Restructured Programming/Erasure Specifications for Intel MAX 10 Devices table to add temperature specifications that affect the data retention duration. Added statements in the I/O Pin Leakage Current section: Input channel leakage of ADC I/O pins due to hot socket is up to maximum of 1.8 mA. The input channel leakage occurs when the ADC IP core is enabled or disabled. This is applicable to all Intel MAX 10 devices with ADC IP core, which are 10M04, 10M08, 10M16, 10M25, 10M40, and 10M50 devices. The ADC I/O pins are in Bank 1A. Added a statement in the I/O Standards Specifications section: You must perform timing closure analysis to determine the maximum achievable frequency for general purpose I/O standards. continued... Send Feedback Intel® MAX® 10 FPGA Device Datasheet 71 Intel® MAX® 10 FPGA Device Datasheet M10-DATASHEET | 2020.06.30 Date Version Changes • • • • • • • • • • • • • • September 2014 2014.09.22 Intel® MAX® 10 FPGA Device Datasheet 72 Updated SSTL-2 Class I and II I/O standard specifications for JEDEC compliance as follows: — VIL(AC) Max: Updated from VREF – 0.35 to VREF – 0.31 — VIH(AC) Min: Updated from VREF + 0.35 to VREF + 0.31 Added a note to BLVDS in Differential I/O Standards Specifications for Intel MAX 10 Devices table: BLVDS TX is not supported in single supply devices. Added a link to MAX 10 High-Speed LVDS I/O User Guide for the list of I/O standards supported in single supply and dual supply devices. Added a statement in PLL Specifications for Intel MAX 10 Single Supply Device table: For V36 package, the PLL specification is based on single supply devices. Added Internal Oscillator Specifications from Intel MAX 10 Clocking and PLL User Guide. Added UFM specifications for serial interface. Updated total harmonic distortion (THD) specifications as follows: — Single supply devices: Updated from 65 dB to –65 dB — Dual supply devices: Updated from 70 dB to –70 dB (updated from 65 dB to –65 dB for dual function pin) Added condition for On-Chip Temperature Sensor—Absolute accuracy parameter in ADC Performance Specifications for Intel MAX 10 Dual Supply Devices table. The condition is: with 64 samples averaging. Updated the description in Periphery Performance Specifications to mention that proper timing closure is required in design. Updated HSIODR and fHSCLK specifications for x10 and x7 modes in True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices. Added specifications for low-speed I/O performance pin sampling window in LVDS Receiver Timing Specifications for Intel MAX 10 Single Supply Devices table: Max = 900 ps for –C7, –I7, –A7, and –C8 speed grades. Added tRU_nCONFIG and tRU_nRSTIMER specifications for different devices in Remote System Upgrade Circuitry Timing Specifications for Intel MAX 10 Devices table. Removed the word "internal oscillator" in User Watchdog Timer Specifications for Intel MAX 10 Devices table to avoid confusion. Added IOE programmable delay specifications. Initial release. Send Feedback