Arria V Device Datasheet
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Contents
Contents
1. Arria® V GX, GT, SX, and ST Device Datasheet....................................................................................................................... 4
1.1. Electrical Characteristics................................................................................................................................................ 4
1.1.1. Operating Conditions.........................................................................................................................................4
1.2. Switching Characteristics............................................................................................................................................. 24
1.2.1. Transceiver Performance Specifications.............................................................................................................. 25
1.2.2. Core Performance Specifications....................................................................................................................... 44
1.2.3. Periphery Performance.....................................................................................................................................49
1.2.4. HPS Specifications.......................................................................................................................................... 57
1.3. Configuration Specifications......................................................................................................................................... 74
1.3.1. POR Specifications.......................................................................................................................................... 74
1.3.2. FPGA JTAG Configuration Timing....................................................................................................................... 75
1.3.3. FPP Configuration Timing................................................................................................................................. 75
1.3.4. Active Serial (AS) Configuration Timing..............................................................................................................79
1.3.5. DCLK Frequency Specification in the AS Configuration Scheme..............................................................................80
1.3.6. Passive Serial (PS) Configuration Timing............................................................................................................ 81
1.3.7. Initialization................................................................................................................................................... 82
1.3.8. Configuration Files.......................................................................................................................................... 83
1.3.9. Minimum Configuration Time Estimation.............................................................................................................84
1.3.10. Remote System Upgrades.............................................................................................................................. 85
1.3.11. User Watchdog Internal Oscillator Frequency Specifications.................................................................................85
1.4. I/O Timing................................................................................................................................................................. 85
1.4.1. Programmable IOE Delay................................................................................................................................. 86
1.4.2. Programmable Output Buffer Delay................................................................................................................... 87
1.5. Glossary.................................................................................................................................................................... 87
1.6. Arria V GX, GT, SX, and ST Device Datasheet Revision History......................................................................................... 94
2. Arria V GZ Device Datasheet...............................................................................................................................................100
2.1. Electrical Characteristics............................................................................................................................................ 100
2.1.1. Operating Conditions .................................................................................................................................... 100
2.2. Switching Characteristics ...........................................................................................................................................119
2.2.1. Transceiver Performance Specifications ........................................................................................................... 119
2.2.2. Core Performance Specifications .....................................................................................................................133
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Contents
2.2.3. Periphery Performance .................................................................................................................................. 139
2.3. Configuration Specification ........................................................................................................................................ 151
2.3.1. POR Specifications ........................................................................................................................................151
2.3.2. JTAG Configuration Specifications ................................................................................................................... 151
2.3.3. Fast Passive Parallel (FPP) Configuration Timing ................................................................................................152
2.3.4. Active Serial Configuration Timing .................................................................................................................. 160
2.3.5. Passive Serial Configuration Timing .................................................................................................................163
2.3.6. Initialization ................................................................................................................................................ 165
2.3.7. Configuration Files ........................................................................................................................................165
2.3.8. Remote System Upgrades Circuitry Timing Specification .................................................................................... 167
2.3.9. User Watchdog Internal Oscillator Frequency Specification ................................................................................. 167
2.4. I/O Timing .............................................................................................................................................................. 167
2.4.1. Programmable IOE Delay .............................................................................................................................. 168
2.4.2. Programmable Output Buffer Delay .................................................................................................................169
2.5. Glossary ................................................................................................................................................................. 169
2.6. Arria V GZ Device Datasheet Revision History ............................................................................................................. 175
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1. Arria® V GX, GT, SX, and ST Device Datasheet
This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing
for Arria® V devices.
Arria V devices are offered in commercial and industrial grades. Commercial devices are offered in –C4 (fastest), –C5, and –
C6 speed grades. Industrial grade devices are offered in the –I3 and –I5 speed grades.
Related Information
Arria V Device Overview
Provides more information about the densities and packages of devices in the Arria V family.
1.1. Electrical Characteristics
The following sections describe the operating conditions and power consumption of Arria V devices.
1.1.1. Operating Conditions
Arria V devices are rated according to a set of defined parameters. To maintain the highest possible performance and
reliability of the Arria V devices, you must consider the operating requirements described in this section.
1.1.1.1. Absolute Maximum Ratings
This section defines the maximum operating conditions for Arria V devices. The values are based on experiments conducted
with the devices and theoretical modeling of breakdown and damage mechanisms.
The functional operation of the device is not implied for these conditions.
Caution:
Conditions outside the range listed in the following table may cause permanent damage to the device. Additionally, device
operation at the absolute maximum ratings for extended periods of time may have adverse effects on the device.
Intel Corporation. All rights reserved. Agilex, Altera, Arria, Cyclone, Enpirion, Intel, the Intel logo, MAX, Nios, Quartus and Stratix words and logos are trademarks
of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Intel warrants performance of its FPGA and semiconductor products to current
specifications in accordance with Intel's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Intel
assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in
writing by Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing
orders for products or services.
*Other names and brands may be claimed as the property of others.
ISO
9001:2015
Registered
1. Arria® V GX, GT, SX, and ST Device Datasheet
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Table 1.
Absolute Maximum Ratings for Arria V Devices
Symbol
Description
Minimum
Maximum
Unit
VCC
Core voltage power supply
–0.50
1.43
V
VCCP
Periphery circuitry, PCI Express* (PCIe*) hard IP block, and transceiver physical
coding sublayer (PCS) power supply
–0.50
1.43
V
VCCPGM
Configuration pins power supply
–0.50
3.90
V
VCC_AUX
Auxiliary supply
–0.50
3.25
V
VCCBAT
Battery back-up power supply for design security volatile key register
–0.50
3.90
V
VCCPD
I/O pre-driver power supply
–0.50
3.90
V
VCCIO
I/O power supply
–0.50
3.90
V
VCCD_FPLL
Phase-locked loop (PLL) digital power supply
–0.50
1.80
V
VCCA_FPLL
PLL analog power supply
–0.50
3.25
V
VCCA_GXB
Transceiver high voltage power
–0.50
3.25
V
VCCH_GXB
Transmitter output buffer power
–0.50
1.80
V
VCCR_GXB
Receiver power
–0.50
1.50
V
VCCT_GXB
Transmitter power
–0.50
1.50
V
VCCL_GXB
Transceiver clock network power
–0.50
1.50
V
VI
DC input voltage
–0.50
3.80
V
VCC_HPS
HPS core voltage and periphery circuitry power supply
–0.50
1.43
V
VCCPD_HPS
HPS I/O pre-driver power supply
–0.50
3.90
V
VCCIO_HPS
HPS I/O power supply
–0.50
3.90
V
VCCRSTCLK_HPS
HPS reset and clock input pins power supply
–0.50
3.90
V
VCCPLL_HPS
HPS PLL analog power supply
–0.50
3.25
V
VCC_AUX_SHARED
HPS auxiliary power supply
–0.50
3.25
V
IOUT
DC output current per pin
–25
40
mA
TJ
Operating junction temperature
–55
125
°C
TSTG
Storage temperature (no bias)
–65
150
°C
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1.1.1.2. Maximum Allowed Overshoot and Undershoot Voltage
During transitions, input signals may overshoot to the voltage listed in the following table and undershoot to –2.0 V for input
currents less than 100 mA and periods shorter than 20 ns.
The maximum allowed overshoot duration is specified as a percentage of high time over the lifetime of the device. A DC signal
is equivalent to 100% duty cycle.
For example, a signal that overshoots to 4.00 V can only be at 4.00 V for ~15% over the lifetime of the device; for a device
lifetime of 10 years, this amounts to 1.5 years.
Table 2.
Maximum Allowed Overshoot During Transitions for Arria V Devices
This table lists the maximum allowed input overshoot voltage and the duration of the overshoot voltage as a percentage of device lifetime.
Symbol
Vi (AC)
Description
AC input voltage
Condition (V)
Overshoot Duration as % of High Time
Unit
3.8
100
%
3.85
68
%
3.9
45
%
3.95
28
%
4
15
%
4.05
13
%
4.1
11
%
4.15
9
%
4.2
8
%
4.25
7
%
4.3
5.4
%
4.35
3.2
%
4.4
1.9
%
4.45
1.1
%
continued...
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Symbol
Description
Condition (V)
Overshoot Duration as % of High Time
Unit
4.5
0.6
%
4.55
0.4
%
4.6
0.2
%
For an overshoot of 3.8 V, the percentage of high time for the overshoot can be as high as 100% over a 10-year period.
Percentage of high time is calculated as ([delta T]/T) × 100. This 10-year period assumes that the device is always turned on
with 100% I/O toggle rate and 50% duty cycle signal.
Figure 1.
Arria V Devices Overshoot Duration
4.1 V
4V
3.3 V
DT
T
1.1.1.3. Recommended Operating Conditions
This section lists the functional operation limits for the AC and DC parameters for Arria V devices.
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1.1.1.3.1. Recommended Operating Conditions
Table 3.
Recommended Operating Conditions for Arria V Devices
This table lists the steady-state voltage values expected from Arria V devices. Power supply ramps must all be strictly monotonic, without plateaus.
Symbol
VCC
Description
Core voltage power supply
VCCP
Periphery circuitry, PCIe hard IP block, and
transceiver PCS power supply
VCCPGM
Configuration pins power supply
Condition
Minimum(1)
Typical
Maximum(1)
Unit
–C4, –I5, –C5, –C6
1.07
1.1
1.13
V
–I3
1.12
1.15
1.18
V
–C4, –I5, –C5, –C6
1.07
1.1
1.13
V
–I3
1.12
1.15
1.18
V
3.3 V
3.135
3.3
3.465
V
3.0 V
2.85
3.0
3.15
V
2.5 V
2.375
2.5
2.625
V
1.8 V
1.71
1.8
1.89
V
VCC_AUX
Auxiliary supply
—
2.375
2.5
2.625
V
VCCBAT(2)
Battery back-up power supply
(For design security volatile key register)
—
1.2
—
3.0
V
VCCPD(3)
I/O pre-driver power supply
3.3 V
3.135
3.3
3.465
V
3.0 V
2.85
3.0
3.15
V
2.5 V
2.375
2.5
2.625
V
3.3 V
3.135
3.3
3.465
VCCIO
I/O buffers power supply
V
continued...
(1)
The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance
requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(2)
If you do not use the design security feature in Arria V devices, connect VCCBAT to a 1.5-V, 2.5-V, or 3.0-V power supply. Arria V
power-on reset (POR) circuitry monitors VCCBAT. Arria V devices do not exit POR if VCCBAT is not powered up.
(3)
VCCPD must be 2.5 V when VCCIO is 2.5, 1.8, 1.5, 1.35, 1.25, or 1.2 V. VCCPD must be 3.0 V when VCCIO is 3.0 V. VCCPD must be 3.3 V
when VCCIO is 3.3 V.
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Symbol
Description
Condition
Minimum(1)
Typical
Maximum(1)
Unit
3.0 V
2.85
3.0
3.15
V
2.5 V
2.375
2.5
2.625
V
1.8 V
1.71
1.8
1.89
V
1.5 V
1.425
1.5
1.575
V
1.35 V
1.283
1.35
1.418
V
1.25 V
1.19
1.25
1.31
V
1.2 V
1.14
1.2
1.26
V
VCCD_FPLL
PLL digital voltage regulator power supply
—
1.425
1.5
1.575
V
VCCA_FPLL
PLL analog voltage regulator power supply
—
2.375
2.5
2.625
V
VI
DC input voltage
—
–0.5
—
3.6
V
VO
Output voltage
—
0
—
VCCIO
V
TJ
Operating junction temperature
Commercial
0
—
85
°C
Industrial
–40
—
100
°C
Standard POR
200 µs
—
100 ms
—
Fast POR
200 µs
—
4 ms
—
tRAMP(4)
Power supply ramp time
(1)
The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance
requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(4)
This is also applicable to HPS power supply. For HPS power supply, refer to tRAMP specifications for standard POR when HPS_PORSEL
= 0 and tRAMP specifications for fast POR when HPS_PORSEL = 1.
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1.1.1.3.2. Transceiver Power Supply Operating Conditions
Table 4.
Transceiver Power Supply Operating Conditions for Arria V Devices
Symbol
VCCA_GXBL
Transceiver high voltage power (left side)
VCCA_GXBR
Transceiver high voltage power (right side)
VCCR_GXBL
GX and SX speed grades—receiver power (left side)
VCCR_GXBR
GX and SX speed grades—receiver power (right side)
VCCR_GXBL
GT and ST speed grades—receiver power (left side)
VCCR_GXBR
GT and ST speed grades—receiver power (right side)
VCCT_GXBL
GX and SX speed grades—transmitter power (left side)
VCCT_GXBR
GX and SX speed grades—transmitter power (right side)
VCCT_GXBL
GT and ST speed grades—transmitter power (left side)
VCCT_GXBR
GT and ST speed grades—transmitter power (right side)
VCCH_GXBL
Transmitter output buffer power (left side)
VCCH_GXBR
Transmitter output buffer power (right side)
VCCL_GXBL
GX and SX speed grades—clock network power (left side)
VCCL_GXBR
GX and SX speed grades—clock network power (right side)
VCCL_GXBL
GT and ST speed grades—clock network power (left side)
VCCL_GXBR
GT and ST speed grades—clock network power (right side)
Minimum(5)
Typical
Maximum(5)
Unit
2.375
2.500
2.625
V
1.08/1.12
1.1/1.15(6)
1.14/1.18
V
1.17
1.20
1.23
V
1.08/1.12
1.1/1.15(6)
1.14/1.18
V
1.17
1.20
1.23
V
1.425
1.500
1.575
V
1.08/1.12
1.1/1.15(6)
1.14/1.18
V
1.17
1.20
1.23
V
(5)
The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance
requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(6)
For data rate 3.2
Gbps, connect VCCR_GXBL/R, VCCT_GXBL/R, or VCCL_GXBL/R to a 1.15-V power supply. For details, refer to the Arria V GT, GX, ST, and SX
Device Family Pin Connection Guidelines.
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Related Information
Arria V GT, GX, ST, and SX Device Family Pin Connection Guidelines
Provides more information about the power supply connection for different data rates.
1.1.1.3.3. HPS Power Supply Operating Conditions
Table 5.
HPS Power Supply Operating Conditions for Arria V SX and ST Devices
This table lists the steady-state voltage and current values expected from Arria V system-on-a-chip (SoC) devices with Arm*-based hard processor system (HPS).
Power supply ramps must all be strictly monotonic, without plateaus. Refer to Recommended Operating Conditions for Arria V Devices table for the steady-state
voltage values expected from the FPGA portion of the Arria V SoC devices.
Symbol
VCC_HPS
VCCPD_HPS
(8)
VCCIO_HPS
Description
Condition
Minimum(7)
Typical
Maximum(7)
Unit
HPS core
voltage and
periphery
circuitry
power
supply
–C4, –I5, –C5, –C6
1.07
1.1
1.13
V
–I3
1.12
1.15
1.18
V
3.3 V
3.135
3.3
3.465
V
3.0 V
2.85
3.0
3.15
V
2.5 V
2.375
2.5
2.625
V
3.3 V
3.135
3.3
3.465
V
3.0 V
2.85
3.0
3.15
V
2.5 V
2.375
2.5
2.625
V
1.8 V
1.71
1.8
1.89
V
1.5 V
1.425
1.5
1.575
V
1.283
1.35
1.418
HPS I/O predriver power
supply
HPS I/O
buffers
power
supply
1.35 V
(9)
V
continued...
(7)
The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance
requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(8)
VCCPD_HPS must be 2.5 V when VCCIO_HPS is 2.5, 1.8, 1.5, or 1.2 V. VCCPD_HPS must be 3.0 V when VCCIO_HPS is 3.0 V. VCCPD_HPS must be
3.3 V when VCCIO_HPS is 3.3 V.
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Symbol
VCCRSTCLK_HPS
Description
HPS reset
and clock
input pins
power
supply
Condition
Minimum(7)
Typical
Maximum(7)
Unit
1.2 V
1.14
1.2
1.26
V
3.3 V
3.135
3.3
3.465
V
3.0 V
2.85
3.0
3.15
V
2.5 V
2.375
2.5
2.625
V
1.8 V
1.71
1.8
1.89
V
VCCPLL_HPS
HPS PLL
analog
voltage
regulator
power
supply
—
2.375
2.5
2.625
V
VCC_AUX_SHARED
HPS auxiliary
power
supply
—
2.375
2.5
2.625
V
Related Information
Recommended Operating Conditions on page 8
Provides the steady-state voltage values for the FPGA portion of the device.
1.1.1.4. DC Characteristics
1.1.1.4.1. Supply Current and Power Consumption
Intel offers two ways to estimate power for your design—the Excel-based Early Power Estimator (EPE) and the Intel®
Quartus® Prime Power Analyzer feature.
Use the Excel-based EPE before you start your design to estimate the supply current for your design. The EPE provides a
magnitude estimate of the device power because these currents vary greatly with the resources you use.
(7)
The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance
requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(9)
VCCIO_HPS 1.35 V is supported for HPS row I/O bank only.
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The Intel Quartus Prime Power Analyzer provides better quality estimates based on the specifics of the design after you
complete place-and-route. The Power Analyzer can apply a combination of user-entered, simulation-derived, and estimated
signal activities that, when combined with detailed circuit models, yields very accurate power estimates.
Related Information
•
Early Power Estimator User Guide
Provides more information about power estimation tools.
•
Power Analysis chapter, Intel Quartus Prime Handbook
Provides more information about power estimation tools.
1.1.1.4.2. I/O Pin Leakage Current
Table 6.
I/O Pin Leakage Current for Arria V Devices
Symbol
Description
Condition
Min
Typ
Max
Unit
II
Input pin
VI = 0 V to VCCIOMAX
–30
—
30
µA
IOZ
Tri-stated I/O pin
VO = 0 V to VCCIOMAX
–30
—
30
µA
1.1.1.4.3. Bus Hold Specifications
Table 7.
Bus Hold Parameters for Arria V Devices
The bus-hold trip points are based on calculated input voltages from the JEDEC* standard.
Parameter
Symbol
Condition
VCCIO (V)
1.2
1.5
1.8
Unit
2.5
3.0
3.3
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Bus-hold, low,
sustaining
current
ISUSL
VIN > VIL
(max)
8
—
12
—
30
—
50
—
70
—
70
—
µA
Bus-hold, high,
sustaining
current
ISUSH
VIN < VIH
(min)
–8
—
–12
—
–30
—
–50
—
–70
—
–70
—
µA
continued...
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Parameter
Symbol
Condition
VCCIO (V)
1.2
1.5
1.8
Unit
2.5
3.0
3.3
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Bus-hold, low,
overdrive current
IODL
0 V < VIN <
VCCIO
—
125
—
175
—
200
—
300
—
500
—
500
µA
Bus-hold, high,
overdrive current
IODH
0 V 700
Mbps
1.60
Related Information
•
Transceiver Specifications for Arria V GX and SX Devices on page 25
Provides the specifications for transmitter, receiver, and reference clock I/O pin.
•
Transceiver Specifications for Arria V GT and ST Devices on page 30
Provides the specifications for transmitter, receiver, and reference clock I/O pin.
1.2. Switching Characteristics
This section provides performance characteristics of Arria V core and periphery blocks.
(16)
(17)
(18)
The minimum VID value is applicable over the entire common mode range, VCM.
RL range: 90 ≤ RL ≤ 110 Ω.
This applies to default pre-emphasis setting only.
(21)
For optimized Mini-LVDS receiver performance, the receiver voltage input range must be within 0.3 V to 1.425 V.
(22)
For optimized LVPECL receiver performance, the receiver voltage input range must be within 0.85 V to 1.75 V for data rates above
700 Mbps and 0.45 V to 1.95 V for data rates below 700 Mbps.
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1.2.1. Transceiver Performance Specifications
1.2.1.1. Transceiver Specifications for Arria V GX and SX Devices
Table 20.
Reference Clock Specifications for Arria V GX and SX Devices
Symbol/Description
Condition
Transceiver Speed Grade 4
Min
Supported I/O standards
Typ
Transceiver Speed Grade 6
Max
Min
1.2 V PCML, 1.4 V PCML,1.5 V PCML, 2.5 V PCML, Differential
Typ
LVPECL(23),
Unit
Max
HCSL, and LVDS
—
27
—
710
27
—
710
MHz
Rise time
Measure at ±60 mV of
differential signal(24)
—
—
400
—
—
400
ps
Fall time
Measure at ±60 mV of
differential signal(24)
—
—
400
—
—
400
ps
Duty cycle
—
45
—
55
45
—
55
%
Peak-to-peak differential input
voltage
—
200
—
300(25)/
2000
200
—
300(25)/
2000
mV
Spread-spectrum modulating clock
frequency
PCIe
30
—
33
30
—
33
kHz
Spread-spectrum downspread
PCIe
—
0 to –0.5%
—
—
0 to –0.5%
—
—
On-chip termination resistors
—
—
100
—
—
100
—
Ω
—
1.1/1.15(26)
—
1.1/1.15(26)
—
Input frequency from REFCLK
input pins
VICM (AC coupled)
—
—
V
continued...
(23)
Differential LVPECL signal levels must comply to the minimum and maximum peak-to-peak differential input voltage specified in this
table.
(24)
REFCLK performance requires to meet transmitter REFCLK phase noise specification.
(25)
The maximum peak-to peak differential input voltage of 300 mV is allowed for DC coupled link.
(26)
For data rate ≤3.2 Gbps, connect VCCR_GXBL/R to either 1.1-V or 1.15-V power supply. For data rate >3.2 Gbps, connect VCCR_GXBL/R to
a 1.15-V power supply. For details, refer to the Arria V GT, GX, ST, and SX Device Family Pin Connection Guidelines.
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Symbol/Description
VICM (DC coupled)
Transmitter REFCLK phase
noise(27)
RREF
Table 21.
Transceiver Speed Grade 4
Transceiver Speed Grade 6
Unit
Min
Typ
Max
Min
Typ
Max
HCSL I/O standard for the
PCIe reference clock
250
—
550
250
—
550
mV
10 Hz
—
—
–50
—
—
–50
dBc/Hz
100 Hz
—
—
–80
—
—
–80
dBc/Hz
1 KHz
—
—
–110
—
—
–110
dBc/Hz
10 KHz
—
—
–120
—
—
–120
dBc/Hz
100 KHz
—
—
–120
—
—
–120
dBc/Hz
≥1 MHz
—
—
–130
—
—
–130
dBc/Hz
—
—
2000 ±1%
—
—
2000 ±1%
—
Ω
Transceiver Clocks Specifications for Arria V GX and SX Devices
Symbol/Description
fixedclk clock frequency
Transceiver Reconfiguration
Controller Intel FPGA IP
(mgmt_clk_clk) clock frequency
Table 22.
Condition
Condition
Transceiver Speed Grade 4
Transceiver Speed Grade 6
Unit
Min
Typ
Max
Min
Typ
Max
PCIe Receiver Detect
—
125
—
—
125
—
MHz
—
75
—
125
75
—
125
MHz
Receiver Specifications for Arria V GX and SX Devices
Symbol/Description
Condition
Transceiver Speed Grade 4
Min
Supported I/O standards
Data rate(28)
Typ
Max
Transceiver Speed Grade 6
Min
Typ
Max
—
3125
Unit
1.5 V PCML, 2.5 V PCML, LVPECL, and LVDS
—
611
—
6553.6
611
Mbps
continued...
(27)
The transmitter REFCLK phase jitter is 30 ps p-p at bit error rate (BER) 10-12.
(28)
To support data rates lower than the minimum specification through oversampling, use the CDR in LTR mode only.
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Symbol/Description
Condition
Transceiver Speed Grade 4
Transceiver Speed Grade 6
Unit
Min
Typ
Max
Min
Typ
Max
—
—
—
1.2
—
—
1.2
V
Absolute VMIN for a receiver pin
—
–0.4
—
—
–0.4
—
—
V
Maximum peak-to-peak differential
input voltage VID (diff p-p) before
device configuration
—
—
—
1.6
—
—
1.6
V
Maximum peak-to-peak differential
input voltage VID (diff p-p) after
device configuration
—
—
—
2.2
—
—
2.2
V
Minimum differential eye opening
at the receiver serial input pins(30)
—
100
—
—
100
—
—
mV
VICM (AC coupled)
—
—
0.7/0.75/0.8
—
—
0.7/0.75/0.8
—
mV
VICM (DC coupled)
≤ 3.2Gbps(32)
670
700
730
670
700
730
mV
85-Ω setting
—
85
—
—
85
—
Ω
100-Ω setting
—
100
—
—
100
—
Ω
120-Ω setting
—
120
—
—
120
—
Ω
150-Ω setting
—
150
—
—
150
—
Absolute VMAX for a receiver
pin(29)
Differential on-chip termination
resistors
(31)
(31)
Ω
continued...
(29)
The device cannot tolerate prolonged operation at this absolute maximum.
(30)
The differential eye opening specification at the receiver input pins assumes that you have disabled the Receiver Equalization
feature. If you enable the Receiver Equalization feature, the receiver circuitry can tolerate a lower minimum eye opening,
depending on the equalization level.
(31)
The AC coupled VICM = 700 mV for Arria V GX and SX in PCIe mode only. The AC coupled VICM = 750 mV for Arria V GT and ST in
PCIe mode only.
(32)
For standard protocol compliance, use AC coupling.
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Symbol/Description
Condition
Unit
Typ
Max
Min
Typ
Max
—
—
—
10
—
—
10
µs
—
4
—
—
4
—
—
µs
—
4
—
—
4
—
—
µs
—
15
—
—
15
—
—
µs
tLTR
tLTD(34)
tLTD_manual(35)
tLTR_LTD_manual(36)
Programmable ppm detector(37)
—
Run length
—
Table 23.
Transceiver Speed Grade 6
Min
(33)
Programmable equalization AC and
DC gain
Transceiver Speed Grade 4
AC gain setting = 0 to 3(38)
DC gain setting = 0 to 1
±62.5, 100, 125, 200, 250, 300, 500, and 1000
—
—
200
—
—
ppm
200
UI
Refer to CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC
Gain for Arria V GX, GT, SX, and ST Devices and CTLE Response at Data Rates ≤ 3.25
Gbps across Supported AC Gain and DC Gain for Arria V GX, GT, SX, and ST Devices
diagrams.
dB
Transmitter Specifications for Arria V GX and SX Devices
Symbol/Description
Condition
Transceiver Speed Grade 4
Min
Typ
Supported I/O standards
Data rate
Max
Transceiver Speed Grade 6
Min
Typ
Max
611
—
3125
Unit
1.5 V PCML
—
611
—
6553.6
Mbps
continued...
(33)
tLTR is the time required for the receive CDR to lock to the input reference clock frequency after coming out of reset.
(34)
tLTD is time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high.
(35)
tLTD_manual is the time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high
when the CDR is functioning in the manual mode.
(36)
tLTR_LTD_manual is the time the receiver CDR must be kept in lock to reference (LTR) mode after the rx_is_lockedtoref signal goes
high when the CDR is functioning in the manual mode.
(37)
The rate match FIFO supports only up to ±300 parts per million (ppm).
(38)
The Intel Quartus Prime software allows AC gain setting = 3 for design with data rate between 611 Mbps and 1.25 Gbps only.
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Symbol/Description
Condition
VOCM (AC coupled)
Transceiver Speed Grade 4
—
VOCM (DC coupled)
≤
Differential on-chip termination
resistors
3.2Gbps(32)
Transceiver Speed Grade 6
Unit
Min
Typ
Max
Min
Typ
Max
—
650
—
—
650
—
mV
670
700
730
670
700
730
mV
85-Ω setting
—
85
—
—
85
—
Ω
100-Ω setting
—
100
—
—
100
—
Ω
120-Ω setting
—
120
—
—
120
—
Ω
150-Ω setting
—
150
—
—
150
—
Ω
TX VCM = 0.65 V (AC
coupled) and slew rate of
15 ps
—
—
15
—
—
15
ps
Intra-transceiver block transmitter
channel-to-channel skew
×6 PMA bonded mode
—
—
180
—
—
180
ps
Inter-transceiver block transmitter
channel-to-channel skew(39)
×N PMA bonded mode
—
—
500
—
—
500
ps
Intra-differential pair skew
Table 24.
CMU PLL Specifications for Arria V GX and SX Devices
Symbol/Description
Transceiver Speed Grade 4
Transceiver Speed Grade 6
Unit
Min
Max
Min
Max
Supported data range
611
6553.6
611
3125
Mbps
fPLL supported data range
611
3125
611
3125
Mbps
Table 25.
Transceiver-FPGA Fabric Interface Specifications for Arria V GX and SX Devices
Symbol/Description
Transceiver Speed Grade 4 and 6
Unit
Min
Max
Interface speed (single-width mode)
25
187.5
MHz
Interface speed (double-width mode)
25
163.84
MHz
(39)
This specification is only applicable to channels on one side of the device across two transceiver banks.
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Related Information
•
CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain on page 36
•
CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain on page 37
•
Arria V GT, GX, ST, and SX Device Family Pin Connection Guidelines
Provides more information about the power supply connection for different data rates.
1.2.1.2. Transceiver Specifications for Arria V GT and ST Devices
Table 26.
Reference Clock Specifications for Arria V GT and ST Devices
Symbol/Description
Condition
Transceiver Speed Grade 3
Min
Supported I/O standards
Typ
1.2 V PCML, 1.4 VPCML, 1.5 V PCML, 2.5 V PCML, Differential
Unit
Max
LVPECL(40),
HCSL, and LVDS
—
27
—
710
MHz
Rise time
Measure at ±60 mV of differential
signal(41)
—
—
400
ps
Fall time
Measure at ±60 mV of differential
signal(41)
—
—
400
ps
Duty cycle
—
45
—
55
%
Peak-to-peak differential input voltage
—
200
—
300(42)/2000
mV
Spread-spectrum modulating clock frequency
PCIe
30
—
33
kHz
Spread-spectrum downspread
PCIe
—
0 to –0.5%
—
—
On-chip termination resistors
—
—
100
—
Ω
VICM (AC coupled)
—
—
1.2
—
Input frequency from REFCLK input pins
V
continued...
(40)
Differential LVPECL signal levels must comply to the minimum and maximum peak-to-peak differential input voltage specified in this
table.
(41)
REFCLK performance requires to meet transmitter REFCLK phase noise specification.
(42)
The maximum peak-to peak differential input voltage of 300 mV is allowed for DC coupled link.
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Symbol/Description
VICM (DC coupled)
Transmitter REFCLK phase noise(43)
Condition
Typ
Max
HCSL I/O standard for the PCIe
reference clock
250
—
550
mV
10 Hz
—
—
–50
dBc/Hz
100 Hz
—
—
–80
dBc/Hz
1 KHz
—
—
–110
dBc/Hz
10 KHz
—
—
–120
dBc/Hz
100 KHz
—
—
–120
dBc/Hz
≥ 1 MHz
—
—
–130
dBc/Hz
—
—
2000 ±1%
—
Ω
Transceiver Clocks Specifications for Arria V GT and ST Devices
Symbol/Description
fixedclk clock frequency
Condition
Transceiver Speed Grade 3
Unit
Min
Typ
Max
PCIe Receiver Detect
—
125
—
MHz
—
75
—
125
MHz
Transceiver Reconfiguration Controller Intel FPGA
IP (mgmt_clk_clk) clock frequency
Table 28.
Unit
Min
RREF
Table 27.
Transceiver Speed Grade 3
Receiver Specifications for Arria V GT and ST Devices
Symbol/Description
Condition
Transceiver Speed Grade 3
Min
Supported I/O Standards
Data rate (6-Gbps transceiver)(44)
Typ
Unit
Max
1.5 V PCML, 2.5 V PCML, LVPECL, and LVDS
—
611
—
6553.6
Mbps
continued...
(43)
The transmitter REFCLK phase jitter is 30 ps p-p (5 ps RMS) with bit error rate (BER) 10-12, equivalent to 14 sigma.
(44)
To support data rates lower than the minimum specification through oversampling, use the CDR in LTR mode only.
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Symbol/Description
Condition
Transceiver Speed Grade 3
Unit
Min
Typ
Max
—
0.611
—
10.3125
Gbps
—
—
—
1.2
V
Absolute VMIN for a receiver pin
—
–0.4
—
—
V
Maximum peak-to-peak differential input
voltage VID (diff p-p) before device
configuration
—
—
—
1.6
V
Maximum peak-to-peak differential input
voltage VID (diff p-p) after device configuration
—
—
—
2.2
V
Minimum differential eye opening at the
receiver serial input pins(46)
—
100
—
—
mV
VICM (AC coupled)
—
—
750(47)/800
—
mV
670
700
730
mV
Data rate (10-Gbps
transceiver)(44)
pin(45)
Absolute VMAX for a receiver
VICM (DC coupled)
Differential on-chip termination resistors
tLTR(49)
≤
3.2Gbps(48)
85-Ω setting
85
Ω
100-Ω setting
100
Ω
120-Ω setting
120
Ω
150-Ω setting
150
Ω
—
—
—
10
µs
continued...
(45)
The device cannot tolerate prolonged operation at this absolute maximum.
(46)
The differential eye opening specification at the receiver input pins assumes that you have disabled the Receiver Equalization
feature. If you enable the Receiver Equalization feature, the receiver circuitry can tolerate a lower minimum eye opening,
depending on the equalization level.
(47)
The AC coupled VICM is 750 mV for PCIe mode only.
(48)
For standard protocol compliance, use AC coupling.
(49)
tLTR is the time required for the receive CDR to lock to the input reference clock frequency after coming out of reset.
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Symbol/Description
Condition
Typ
Max
—
4
—
—
µs
—
4
—
—
µs
—
15
—
—
tLTD_manual(51)
tLTR_LTD_manual(52)
Programmable ppm detector(53)
—
Run length
—
Table 29.
Unit
Min
tLTD(50)
Programmable equalization AC and DC gain
Transceiver Speed Grade 3
µs
±62.5, 100, 125, 200, 250, 300, 500, and 1000
—
AC gain setting = 0 to 3(54)
DC gain setting = 0 to 1
—
ppm
200
UI
Refer to CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and
DC Gain for Arria V GX, GT, SX, and ST Devices and CTLE Response at Data Rates ≤
3.25 Gbps across Supported AC Gain and DC Gain for Arria V GX, GT, SX, and ST
Devices diagrams.
Transmitter Specifications for Arria V GT and ST Devices
Symbol/Description
Condition
Transceiver Speed Grade 3
Min
Supported I/O standards
Unit
Typ
Max
1.5 V PCML
Data rate (6-Gbps transceiver)
—
611
—
6553.6
Mbps
Data rate (10-Gbps transceiver)
—
0.611
—
10.3125
Gbps
VOCM (AC coupled)
—
—
650
—
mV
continued...
(50)
tLTD is time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high.
(51)
tLTD_manual is the time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high
when the CDR is functioning in the manual mode.
(52)
tLTR_LTD_manual is the time the receiver CDR must be kept in lock to reference (LTR) mode after the rx_is_lockedtoref signal goes
high when the CDR is functioning in the manual mode.
(53)
The rate match FIFO supports only up to ±300 ppm.
(54)
The Intel Quartus Prime software allows AC gain setting = 3 for design with data rate between 611 Mbps and 1.25 Gbps only.
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Symbol/Description
Transceiver Speed Grade 3
Unit
Min
Typ
Max
670
700
730
mV
85-Ω setting
—
85
—
Ω
100-Ω setting
—
100
—
Ω
120-Ω setting
—
120
—
Ω
150-Ω setting
—
150
—
Ω
TX VCM = 0.65 V (AC coupled) and
slew rate of 15 ps
—
—
15
ps
Intra-transceiver block transmitter channel-tochannel skew
×6 PMA bonded mode
—
—
180
ps
Inter-transceiver block transmitter channel-tochannel skew(55)
×N PMA bonded mode
—
—
500
ps
VOCM (DC coupled)
≤ 3.2
Differential on-chip termination resistors
Intra-differential pair skew
Table 30.
Supported data range
fPLL supported data range
(55)
Gbps(48)
CMU PLL Specifications for Arria V GT and ST Devices
Symbol/Description
Transceiver Speed Grade 3
Unit
Min
Max
0.611
10.3125
Gbps
611
3125
Mbps
This specification is only applicable to channels on one side of the device across two transceiver banks.
Arria V Device Datasheet
34
Condition
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Table 31.
Transceiver-FPGA Fabric Interface Specifications for Arria V GT and ST Devices
Symbol/Description
Transceiver Speed Grade 3
Unit
Min
Max
Interface speed (PMA direct mode)
50
153.6(56), 161(57)
MHz
Interface speed (single-width mode)
25
187.5
MHz
Interface speed (double-width mode)
25
163.84
MHz
Related Information
•
CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain on page 36
•
CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain on page 37
(56)
The maximum frequency when core transceiver local routing is selected.
(57)
The maximum frequency when core transceiver network routing (GCLK, RCLK, or PCLK) is selected.
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1.2.1.3. CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain
Figure 3.
Continuous Time-Linear Equalizer (CTLE) Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC
Gain for Arria V GX, GT, SX, and ST Devices
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1.2.1.4. CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain
Figure 4.
CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain for Arria V GX, GT, SX, and ST
Devices
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1.2.1.5. Typical TX VOD Setting for Arria V Transceiver Channels with termination of 100 Ω
Table 32.
Typical TX VOD Setting for Arria V Transceiver Channels with termination of 100 Ω
Symbol
VOD differential peak-to-peak typical
VOD Setting(58)
VOD Value (mV)
VOD Setting(58)
VOD Value (mV)
6(59)
120
34
680
7(59)
140
35
700
8(59)
160
36
720
9
180
37
740
10
200
38
760
11
220
39
780
12
240
40
800
13
260
41
820
14
280
42
840
15
300
43
860
16
320
44
880
17
340
45
900
18
360
46
920
19
380
47
940
20
400
48
960
21
420
49
980
22
440
50
1000
23
460
51
1020
24
480
52
1040
continued...
(58)
Convert these values to their binary equivalent form if you are using the dynamic reconfiguration mode for PMA analog controls.
(59)
Only valid for data rates ≤ 5 Gbps.
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Symbol
VOD Setting(58)
VOD Value (mV)
VOD Setting(58)
VOD Value (mV)
25
500
53
1060
26
520
54
1080
27
540
55
1100
28
560
56
1120
29
580
57
1140
30
600
58
1160
31
620
59
1180
32
640
60
1200
33
660
1.2.1.6. Transmitter Pre-Emphasis Levels
The following table lists the simulation data on the transmitter pre-emphasis levels in dB for the first post tap under the
following conditions:
•
Low-frequency data pattern—five 1s and five 0s
•
Data rate—2.5 Gbps
The levels listed are a representation of possible pre-emphasis levels under the specified conditions only and the preemphasis levels may change with data pattern and data rate.
Arria V devices only support 1st post tap pre-emphasis with the following conditions:
(58)
•
The 1st post tap pre-emphasis settings must satisfy |B| + |C| ≤ 60 where |B| = VOD setting with termination value, RTERM
= 100 Ω and |C| = 1st post tap pre-emphasis setting.
•
|B| – |C| > 5 for data rates < 5 Gbps and |B| – |C| > 8.25 for data rates > 5 Gbps.
•
(VMAX/VMIN – 1)% < 600%, where VMAX = |B| + |C| and VMIN = |B| – |C|.
Convert these values to their binary equivalent form if you are using the dynamic reconfiguration mode for PMA analog controls.
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Exception for PCIe Gen2 design: VOD setting = 43 and pre-emphasis setting = 19 are allowed for PCIe Gen2 design with
transmit de-emphasis –6dB setting (pipe_txdeemp = 1’b0) using Arria V Hard IP for PCI Express Intel FPGA IP and PHY for
PCI Express (PIPE) Intel FPGA IP cores.
For example, when VOD = 800 mV, the corresponding VOD value setting is 40. The following conditions show that the 1st post
tap pre-emphasis setting = 2 is valid:
•
|B| + |C| ≤ 60→ 40 + 2 = 42
•
|B| – |C| > 5→ 40 – 2 = 38
•
(VMAX/VMIN – 1)% < 600%→ (42/38 – 1)% = 10.52%
To predict the pre-emphasis level for your specific data rate and pattern, run simulations using the Arria V HSSI HSPICE
models.
Table 33.
Transmitter Pre-Emphasis Levels for Arria V Devices
Intel Quartus Prime 1st
Post Tap Pre-Emphasis
Setting
Intel Quartus Prime VOD Setting
Unit
10 (200 mV)
20 (400 mV)
30 (600 mV)
35 (700 mV)
40 (800 mV)
45 (900 mV)
50 (1000 mV)
0
0
0
0
0
0
0
0
dB
1
1.97
0.88
0.43
0.32
0.24
0.19
0.13
dB
2
3.58
1.67
0.95
0.76
0.61
0.5
0.41
dB
3
5.35
2.48
1.49
1.2
1
0.83
0.69
dB
4
7.27
3.31
2
1.63
1.36
1.14
0.96
dB
5
—
4.19
2.55
2.1
1.76
1.49
1.26
dB
6
—
5.08
3.11
2.56
2.17
1.83
1.56
dB
7
—
5.99
3.71
3.06
2.58
2.18
1.87
dB
8
—
6.92
4.22
3.47
2.93
2.48
2.11
dB
9
—
7.92
4.86
4
3.38
2.87
2.46
dB
10
—
9.04
5.46
4.51
3.79
3.23
2.77
dB
11
—
10.2
6.09
5.01
4.23
3.61
—
dB
12
—
11.56
6.74
5.51
4.68
3.97
—
dB
continued...
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Intel Quartus Prime 1st
Post Tap Pre-Emphasis
Setting
Intel Quartus Prime VOD Setting
Unit
10 (200 mV)
20 (400 mV)
30 (600 mV)
35 (700 mV)
40 (800 mV)
45 (900 mV)
50 (1000 mV)
13
—
12.9
7.44
6.1
5.12
4.36
—
dB
14
—
14.44
8.12
6.64
5.57
4.76
—
dB
15
—
—
8.87
7.21
6.06
5.14
—
dB
16
—
—
9.56
7.73
6.49
—
—
dB
17
—
—
10.43
8.39
7.02
—
—
dB
18
—
—
11.23
9.03
7.52
—
—
dB
19
—
—
12.18
9.7
8.02
—
—
dB
20
—
—
13.17
10.34
8.59
—
—
dB
21
—
—
14.2
11.1
—
—
—
dB
22
—
—
15.38
11.87
—
—
—
dB
23
—
—
—
12.67
—
—
—
dB
24
—
—
—
13.48
—
—
—
dB
25
—
—
—
14.37
—
—
—
dB
26
—
—
—
—
—
—
—
dB
27
—
—
—
—
—
—
—
dB
28
—
—
—
—
—
—
—
dB
29
—
—
—
—
—
—
—
dB
30
—
—
—
—
—
—
—
dB
31
—
—
—
—
—
—
—
dB
Related Information
SPICE Models for Intel Devices
Provides the Arria V HSSI HSPICE models.
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1.2.1.7. Transceiver Compliance Specification
The following table lists the physical medium attachment (PMA) specification compliance of all supported protocol for Arria V
GX, GT, SX, and ST devices. For more information about the protocol parameter details and compliance specifications, contact
your Intel Sales Representative.
Table 34.
Transceiver Compliance Specification for All Supported Protocol for Arria V GX, GT, SX, and ST Devices
Protocol
PCIe
XAUI
Serial
RapidIO®
(SRIO)
Common Public Radio Interface (CPRI)
Sub-protocol
Data Rate (Mbps)
PCIe Gen1
2,500
PCIe Gen2
5,000
PCIe Cable
2,500
XAUI 2135
3,125
SRIO 1250 SR
1,250
SRIO 1250 LR
1,250
SRIO 2500 SR
2,500
SRIO 2500 LR
2,500
SRIO 3125 SR
3,125
SRIO 3125 LR
3,125
SRIO 5000 SR
5,000
SRIO 5000 MR
5,000
SRIO 5000 LR
5,000
SRIO_6250_SR
6,250
SRIO_6250_MR
6,250
SRIO_6250_LR
6,250
CPRI E6LV
614.4
CPRI E6HV
614.4
CPRI E6LVII
614.4
CPRI E12LV
1,228.8
continued...
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Protocol
Sub-protocol
Data Rate (Mbps)
CPRI E12HV
1,228.8
CPRI E12LVII
1,228.8
CPRI E24LV
2,457.6
CPRI E24LVII
2,457.6
CPRI E30LV
3,072
CPRI E30LVII
3,072
CPRI E48LVII
4,915.2
CPRI E60LVII
6,144
CPRI E96LVIII(60)
9,830.4
Gbps Ethernet (GbE)
GbE 1250
1,250
OBSAI
OBSAI 768
768
OBSAI 1536
1,536
OBSAI 3072
3,072
OBSAI 6144
6,144
SDI 270 SD
270
SDI 1485 HD
1,485
SDI 2970 3G
2,970
SONET 155
155.52
SONET 622
622.08
SONET 2488
2,488.32
GPON 155
155.52
GPON 622
622.08
Serial digital interface (SDI)
SONET
Gigabit-capable passive optical network (GPON)
continued...
(60)
You can achieve compliance with TX channel restriction of one HSSI channel per six-channel transceiver bank.
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Protocol
QSGMII
Sub-protocol
Data Rate (Mbps)
GPON 1244
1,244.16
GPON 2488
2,488.32
QSGMII 5000
5,000
1.2.2. Core Performance Specifications
1.2.2.1. Clock Tree Specifications
Table 35.
Clock Tree Specifications for Arria V Devices
Parameter
Performance
Unit
–I3, –C4
–I5, –C5
–C6
Global clock and Regional clock
625
625
525
MHz
Peripheral clock
450
400
350
MHz
1.2.2.2. PLL Specifications
Table 36.
PLL Specifications for Arria V Devices
This table lists the Arria V PLL block specifications. Arria V PLL block does not include HPS PLL.
Symbol
fIN
fINPFD
Parameter
Input clock frequency
Integer input clock frequency to the phase
frequency detector (PFD)
Condition
Min
Typ
Max
Unit
–3 speed grade
5
—
800(61)
MHz
–4 speed grade
5
—
800(61)
MHz
–5 speed grade
5
—
750(61)
MHz
–6 speed grade
5
—
625(61)
MHz
—
5
—
325
MHz
continued...
(61)
This specification is limited in the Intel Quartus Prime software by the I/O maximum frequency. The maximum I/O frequency is
different for each I/O standard.
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Symbol
fFINPFD
(62)
fVCO
Parameter
Fractional input clock frequency to the PFD
PLL voltage-controlled oscillator (VCO)
operating range
tEINDUTY
Input clock or external feedback clock input
duty cycle
fOUT
Output frequency for internal global or
regional clock
fOUT_EXT
Output frequency for external clock output
Condition
Min
Typ
Max
Unit
—
50
—
160
MHz
–3 speed grade
600
—
1600
MHz
–4 speed grade
600
—
1600
MHz
–5 speed grade
600
—
1600
MHz
–6 speed grade
600
—
1300
MHz
—
40
—
60
%
–3 speed grade
—
—
500(63)
MHz
MHz
–4 speed grade
—
—
500(63)
–5 speed grade
—
—
500(63)
MHz
–6 speed grade
—
—
400(63)
MHz
–3 speed grade
—
—
670(63)
MHz
–4 speed grade
—
—
670(63)
MHz
–5 speed grade
—
—
622(63)
MHz
–6 speed grade
—
—
500(63)
MHz
tOUTDUTY
Duty cycle for external clock output (when set
to 50%)
—
45
50
55
%
tFCOMP
External feedback clock compensation time
—
—
—
10
ns
tDYCONFIGCLK
Dynamic configuration clock for mgmt_clk
and scanclk
—
—
—
100
MHz
tLOCK
Time required to lock from end-of-device
configuration or deassertion of areset
—
—
—
1
ms
continued...
(62)
The VCO frequency reported by the Intel Quartus Prime software takes into consideration the VCO post divider value. Therefore, if the
VCO post divider value is 2, the frequency reported can be lower than the fVCO specification.
(63)
This specification is limited by the lower of the two: I/O fMAX or FOUT of the PLL.
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Symbol
Parameter
tDLOCK
Time required to lock dynamically (after
switchover or reconfiguring any non-postscale counters/delays)
fCLBW
PLL closed-loop bandwidth
Condition
Min
Typ
Max
Unit
—
—
—
1
ms
Low
—
0.3
—
MHz
Medium
—
1.5
—
MHz
High(64)
—
4
—
MHz
tPLL_PSERR
Accuracy of PLL phase shift
—
—
—
±50
ps
tARESET
Minimum pulse width on the areset signal
—
10
—
—
ns
FREF ≥ 100 MHz
—
—
0.15
UI (p-p)
FREF < 100 MHz
—
—
±750
ps (p-p)
FOUT ≥ 100 MHz
—
—
175
ps (p-p)
FOUT < 100 MHz
—
—
17.5
mUI (p-p)
(65)(66)
tINCCJ
tOUTPJ_DC(67)
tFOUTPJ_DC(67)
Input clock cycle-to-cycle jitter
Period jitter for dedicated clock output in
integer PLL
Period jitter for dedicated clock output in
fractional PLL
FOUT ≥ 100 MHz
FOUT < 100 MHz
—
—
—
250(68),
—
25(68),
175(69)
17.5(69)
ps (p-p)
mUI (p-p)
continued...
(64)
High bandwidth PLL settings are not supported in external feedback mode.
(65)
A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you must provide a clean clock source with
jitter < 120 ps.
(66)
FREF is fIN/N, specification applies when N = 1.
(67)
Peak-to-peak jitter with a probability level of 10–12 (14 sigma, 99.99999999974404% confidence level). The output jitter specification
applies to the intrinsic jitter of the PLL, when an input jitter of 30 ps is applied. The external memory interface clock output jitter
specifications use a different measurement method and are available in Memory Output Clock Jitter Specification for Arria V Devices
table.
(68)
This specification only covered fractional PLL for low bandwidth. The fVCO for fractional value range 0.05–0.95 must be ≥ 1000 MHz.
(69)
This specification only covered fractional PLL for low bandwidth. The fVCO for fractional value range 0.20–0.80 must be ≥ 1200 MHz.
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Symbol
(67)
tOUTCCJ_DC
(67)
tFOUTCCJ_DC
tOUTPJ_IO(67)(70)
tFOUTPJ_IO(67)(68)(70)
tOUTCCJ_IO(67)(70)
tFOUTCCJ_IO(67)(68)(70)
tCASC_OUTPJ_DC(67)(71)
Parameter
Condition
Min
Typ
Max
Unit
Cycle-to-cycle jitter for dedicated clock output
in integer PLL
FOUT ≥ 100 MHz
—
—
175
ps (p-p)
FOUT < 100 MHz
—
—
17.5
mUI (p-p)
—
250(68),
—
—
25(68),
—
—
600
ps (p-p)
FOUT < 100 MHz
—
—
60
mUI (p-p)
FOUT ≥ 100 MHz
—
—
600
ps (p-p)
FOUT < 100 MHz
—
—
60
mUI (p-p)
FOUT ≥ 100 MHz
—
—
600
ps (p-p)
FOUT < 100 MHz
—
—
60
mUI (p-p)
FOUT ≥ 100 MHz
—
—
600
ps (p-p)
FOUT < 100 MHz
—
—
60
mUI (p-p)
FOUT ≥ 100 MHz
—
—
175
ps (p-p)
FOUT < 100 MHz
—
—
17.5
mUI (p-p)
—
—
±10
%
Cycle-to-cycle jitter for dedicated clock output
in fractional PLL
FOUT ≥ 100 MHz
FOUT < 100 MHz
Period jitter for clock output on a regular I/O
in integer PLL
FOUT ≥ 100 MHz
Period jitter for clock output on a regular I/O
in fractional PLL
Cycle-to-cycle jitter for clock output on a
regular I/O in integer PLL
Cycle-to-cycle jitter for clock output on a
regular I/O in fractional PLL
Period jitter for dedicated clock output in
cascaded PLLs
—
175(69)
17.5(69)
ps (p-p)
mUI (p-p)
tDRIFT
Frequency drift after PFDENA is disabled for a
duration of 100 µs
—
dKBIT
Bit number of Delta Sigma Modulator (DSM)
—
8
24
32
bits
kVALUE
Numerator of fraction
—
128
8388608
2147483648
—
fRES
Resolution of VCO frequency
fINPFD = 100 MHz
390625
5.96
0.023
Hz
(70)
External memory interface clock output jitter specifications use a different measurement method, which are available in Memory
Output Clock Jitter Specification for Arria V Devices table.
(71)
The cascaded PLL specification is only applicable with the following conditions:
• Upstream PLL: 0.59 MHz ≤ Upstream PLL BW < 1 MHz
• Downstream PLL: Downstream PLL BW > 2 MHz
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Related Information
Memory Output Clock Jitter Specifications on page 56
Provides more information about the external memory interface clock output jitter specifications.
1.2.2.3. DSP Block Performance Specifications
Table 37.
DSP Block Performance Specifications for Arria V Devices
Mode
Modes using One DSP Block
Modes using Two DSP Blocks
Performance
Unit
–I3, –C4
–I5, –C5
–C6
Independent 9 × 9 multiplication
370
310
220
MHz
Independent 18 × 19 multiplication
370
310
220
MHz
Independent 18 × 25 multiplication
370
310
220
MHz
Independent 20 × 24 multiplication
370
310
220
MHz
Independent 27 × 27 multiplication
310
250
200
MHz
Two 18 × 19 multiplier adder mode
370
310
220
MHz
18 × 18 multiplier added summed with 36-bit input
370
310
220
MHz
Complex 18 × 19 multiplication
370
310
220
MHz
1.2.2.4. Memory Block Performance Specifications
To achieve the maximum memory block performance, use a memory block clock that comes through global clock routing from
an on-chip PLL and set to 50% output duty cycle. Use the Intel Quartus Prime software to report timing for the memory block
clocking schemes.
When you use the error detection cyclical redundancy check (CRC) feature, there is no degradation in fMAX.
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Table 38.
Memory Block Performance Specifications for Arria V Devices
Memory
MLAB
M10K Block
Mode
Resources Used
Performance
Unit
ALUTs
Memory
–I3, –C4
–I5, –C5
–C6
Single port, all supported widths
0
1
500
450
400
MHz
Simple dual-port, all supported widths
0
1
500
450
400
MHz
Simple dual-port with read and write at the same
address
0
1
400
350
300
MHz
ROM, all supported width
—
—
500
450
400
MHz
Single-port, all supported widths
0
1
400
350
285
MHz
Simple dual-port, all supported widths
0
1
400
350
285
MHz
Simple dual-port with the read-during-write option
set to Old Data, all supported widths
0
1
315
275
240
MHz
True dual port, all supported widths
0
1
400
350
285
MHz
ROM, all supported widths
0
1
400
350
285
MHz
1.2.2.5. Internal Temperature Sensing Diode Specifications
Table 39.
Internal Temperature Sensing Diode Specifications for Arria V Devices
Temperature Range
Accuracy
Offset Calibrated Option
Sampling Rate
Conversion
Time(72)
Resolution
Minimum Resolution with
no Missing Codes
–40 to 100°C
±8°C
No
1 MHz
< 100 ms
8 bits
8 bits
Related Information
Intel FPGA Temperature Sensor IP Core User Guide
Provides more information about the temperature sensing operation.
1.2.3. Periphery Performance
This section describes the periphery performance, high-speed I/O, and external memory interface.
(72)
For more details about the temperature sensing operations, refer to the Intel FPGA Temperature Sensor IP Core User Guide.
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Actual achievable frequency depends on design and system specific factors. Ensure proper timing closure in your design and
perform HSPICE/IBIS simulations based on your specific design and system setup to determine the maximum achievable
frequency in your system.
1.2.3.1. High-Speed I/O Specifications
Table 40.
High-Speed I/O Specifications for Arria V Devices
When J = 3 to 10, use the serializer/deserializer (SERDES) block. When J = 1 or 2, bypass the SERDES block.
For LVDS applications, you must use the PLLs in integer PLL mode.
The Arria V devices support the following output standards using true LVDS output buffer types on all I/O banks.
•
True RSDS output standard with data rates of up to 360 Mbps
•
True mini-LVDS output standard with data rates of up to 400 Mbps
Symbol
Condition
–I3, –C4
–I5, –C5
–C6
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
fHSCLK_in (input clock frequency) True Differential
I/O Standards
Clock boost factor W = 1
to 40(73)
5
—
800
5
—
750
5
—
625
MHz
fHSCLK_in (input clock frequency) Single-Ended
I/O Standards(74)
Clock boost factor W = 1
to 40(73)
5
—
625
5
—
625
5
—
500
MHz
fHSCLK_in (input clock frequency) Single-Ended
I/O Standards(75)
Clock boost factor W = 1
to 40(73)
5
—
420
5
—
420
5
—
420
MHz
—
5
—
625(76)
5
—
625(76
5
—
500(76)
MHz
SERDES factor J =3 to
10(77)
(78)
—
1250
(78)
—
1250
(78)
—
1050
Mbp
s
fHSCLK_OUT (output clock frequency)
Transmitter
True Differential I/O
Standards - fHSDR (data
rate)
)
continued...
(73)
Clock boost factor (W) is the ratio between the input data rate and the input clock rate.
(74)
This applies to DPA and soft-CDR modes only.
(75)
This applies to non-DPA mode only.
(76)
This is achieved by using the LVDS clock network.
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Symbol
Condition
–I3, –C4
Min
Max
Min
—
1600
(78)
(78)
—
(80)
SERDES factor J = 4 to
10(82)
(78)
—
SERDES factor J = 4 to
10(82)
(78)
Total Jitter for Data Rate
600 Mbps – 1.25 Gbps
Total Jitter for Data Rate
< 600 Mbps
Unit
Min
Typ
Max
—
1500
(78)
—
1250
Mbp
s
(78)
—
(80)
(78)
—
(80)
Mbp
s
945
(78)
—
945
(78)
—
945
Mbp
s
—
200
(78)
—
200
(78)
—
200
Mbp
s
—
—
160
—
—
160
—
—
160
ps
—
—
0.1
—
—
0.1
—
—
0.1
UI
SERDES factor J ≥
(79), LVDS TX with RX
DPA
(78)
SERDES factor J = 1 to
2, Uses DDR Registers
Emulated Differential I/O
Standards with Three
External Output Resistor
Network - fHSDR (data rate)
Emulated Differential I/O
Standards with One External
Output Resistor Network fHSDR (data rate)(81)
Typ
–C6
Max
8(77)
Typ
–I5, –C5
(81)
tx Jitter -True Differential I/O
Standards
continued...
(77)
The Fmax specification is based on the fast clock used for serial data. The interface Fmax is also dependent on the parallel clock domain
which is design dependent and requires timing analysis.
(78)
The minimum specification depends on the clock source (for example, the PLL and clock pin) and the clock routing resource (global,
regional, or local) that you use. The I/O differential buffer and input register do not have a minimum toggle rate.
(79)
The VCC and VCCP must be on a separate power layer and a maximum load of 5 pF for chip-to-chip interface.
(80)
The maximum ideal data rate is the SERDES factor (J) x the PLL maximum output frequency (fOUT), provided you can close the design
timing and the signal integrity simulation is clean.
(81)
You must calculate the leftover timing margin in the receiver by performing link timing closure analysis. You must consider the board
skew margin, transmitter channel-to-channel skew, and receiver sampling margin to determine the leftover timing margin.
(82)
When using True LVDS RX channels for emulated LVDS TX channel, only serialization factors 1 and 2 are supported.
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Symbol
–I3, –C4
–I5, –C5
–C6
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
tx Jitter -Emulated Differential
I/O Standards with Three
External Output Resistor
Network
Total Jitter for Data Rate
600 Mbps – 1.25 Gbps
—
—
260
—
—
300
—
—
350
ps
Total Jitter for Data Rate
< 600 Mbps
—
—
0.16
—
—
0.18
—
—
0.21
UI
tx Jitter -Emulated Differential
I/O Standards with One
External Output Resistor
Network
—
—
—
0.15
—
—
0.15
—
—
0.15
UI
TX output clock duty
cycle for both True and
Emulated Differential I/O
Standards
45
50
55
45
50
55
45
50
55
%
True Differential I/O
Standards(83)
—
—
160
—
—
180
—
—
200
ps
Emulated Differential I/O
Standards with Three
External Output Resistor
Network
—
—
250
—
—
250
—
—
300
ps
Emulated Differential I/O
Standards with One
External Output Resistor
Network
—
—
500
—
—
500
—
—
500
ps
True Differential I/O
Standards
—
—
150
—
—
150
—
—
150
ps
Emulated Differential I/O
Standards
—
—
300
—
—
300
—
—
300
ps
SERDES factor J =3 to
10(77)
150
—
1250
150
—
1250
150
—
1050
Mbp
s
SERDES factor J ≥ 8 with
DPA(77)(79)
150
—
1600
150
—
1500
150
—
1250
Mbp
s
tDUTY
tRISE and tFALL
TCCS
Receiver
Condition
True Differential I/O
Standards - fHSDRDPA (data
rate)
continued...
(83)
This applies to default pre-emphasis and VOD settings only.
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Symbol
Condition
–I3, –C4
Min
fHSDR (data rate)
–I5, –C5
–C6
Unit
Typ
Max
Min
Typ
Max
Min
Typ
Max
SERDES factor J = 3 to
10
(78)
—
(84)
(78)
—
(84)
(78)
—
(84)
Mbp
s
SERDES factor J = 1 to
2, uses DDR registers
(78)
—
(80)
(78)
—
(80)
(78)
—
(80)
Mbp
s
DPA Mode
DPA run length
—
—
—
10000
—
—
10000
—
—
10000
UI
Soft-CDR Mode
Soft-CDR ppm tolerance
—
—
—
300
—
—
300
—
—
300
±pp
m
Non-DPA Mode
Sampling Window
—
—
—
300
—
—
300
—
—
300
ps
1.2.3.2. DPA Lock Time Specifications
Figure 5.
Dynamic Phase Alignment (DPA) Lock Time Specifications with DPA PLL Calibration Enabled
rx_reset
DPA Lock Time
rx_dpa_locked
256 Data
Transitions
(84)
96 Slow
Clock Cycles
256 Data
Transitions
96 Slow
Clock Cycles
256 Data
Transitions
You can estimate the achievable maximum data rate for non-DPA mode by performing link timing closure analysis. You must consider
the board skew margin, transmitter delay margin, and receiver sampling margin to determine the maximum data rate supported.
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Table 41.
DPA Lock Time Specifications for Arria V Devices
The specifications are applicable to both commercial and industrial grades. The DPA lock time is for one channel. One data transition is defined as a 0-to-1 or 1to-0 transition.
Standard
SPI-4
Parallel Rapid I/O
Miscellaneous
Training Pattern
Number of Data Transitions in
One Repetition of the Training
Pattern
Number of Repetitions per
256 Data Transitions(85)
Maximum Data Transition
00000000001111111111
2
128
640
00001111
2
128
640
10010000
4
64
640
10101010
8
32
640
01010101
8
32
640
1.2.3.3. LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specifications
LVDS Soft-Clock Data Recovery (CDR)/DPA Sinusoidal Jitter Tolerance Specification for a Data Rate Equal to 1.25
Gbps
Jitter Amphlitude (UI)
Figure 6.
25
8.5
0.35
0.1
F1 F2
(85)
F4
This is the number of repetitions for the stated training pattern to achieve the 256 data transitions.
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F3
Jitter Frequency (Hz)
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Table 42.
LVDS Soft-CDR/DPA Sinusoidal Jitter Mask Values for a Data Rate Equal to 1.25 Gbps
Jitter Frequency (Hz)
Figure 7.
Sinusoidal Jitter (UI)
F1
10,000
25.000
F2
17,565
25.000
F3
1,493,000
0.350
F4
50,000,000
0.350
LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specification for a Data Rate Less than 1.25 Gbps
Sinusoidal Jitter Amplitude
20db/dec
0.1 UI
P-P
baud/1667
20 MHz
Frequency
1.2.3.4. DLL Frequency Range Specifications
Table 43.
DLL Frequency Range Specifications for Arria V Devices
Parameter
DLL operating frequency range
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–I3, –C4
–I5, –C5
–C6
Unit
200 – 667
200 – 667
200 – 667
MHz
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1.2.3.5. DQS Logic Block Specifications
Table 44.
DQS Phase Shift Error Specifications for DLL-Delayed Clock (tDQS_PSERR) for Arria V Devices
This error specification is the absolute maximum and minimum error.
Number of DQS Delay Buffer
–I3, –C4
–I5, –C5
–C6
Unit
2
40
80
80
ps
1.2.3.6. Memory Output Clock Jitter Specifications
Table 45.
Memory Output Clock Jitter Specifications for Arria V Devices
The memory output clock jitter measurements are for 200 consecutive clock cycles, as specified in the JEDEC DDR2/DDR3 SDRAM standard.
The memory output clock jitter is applicable when an input jitter of 30 ps (p-p) is applied with bit error rate (BER) 10–12, equivalent to 14 sigma.
Intel recommends using the UniPHY IP cores with PHYCLK connections for better jitter performance.
Parameter
Clock Network
Symbol
Clock period jitter
PHYCLK
tJIT(per)
Cycle-to-cycle period jitter
PHYCLK
tJIT(cc)
–I3, –C4
–I5, –C5
–C6
Unit
Min
Max
Min
Max
Min
Max
–41
41
–50
50
–55
55
63
90
ps
94
ps
1.2.3.7. OCT Calibration Block Specifications
Table 46.
OCT Calibration Block Specifications for Arria V Devices
Symbol
Min
Typ
Max
Unit
OCTUSRCLK
Clock required by OCT calibration blocks
—
—
20
MHz
TOCTCAL
Number of OCTUSRCLK clock cycles required for RS OCT/RT
OCT calibration
—
1000
—
Cycles
TOCTSHIFT
Number of OCTUSRCLK clock cycles required for OCT code to
shift out
—
32
—
Cycles
TRS_RT
Time required between the dyn_term_ctrl and oe signal
transitions in a bidirectional I/O buffer to dynamically switch
between RS OCT and RT OCT
—
2.5
—
ns
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Figure 8.
Timing Diagram for oe and dyn_term_ctrl Signals
RX
Tristate
Tristate
TX
RX
oe
dyn_term_ctrl
TRS_RT
TRS_RT
1.2.3.8. Duty Cycle Distortion (DCD) Specifications
Table 47.
Worst-Case DCD on Arria V I/O Pins
The output DCD cycle only applies to the I/O buffer. It does not cover the system DCD.
Symbol
Output Duty Cycle
–I3, –C4
–C5, –I5
–C6
Unit
Min
Max
Min
Max
Min
Max
45
55
45
55
45
55
%
1.2.4. HPS Specifications
This section provides HPS specifications and timing for Arria V devices.
For HPS reset, the minimum reset pulse widths for the HPS cold and warm reset signals (HPS_nRST and HPS_nPOR) are six
clock cycles of HPS_CLK1.
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1.2.4.1. HPS Clock Performance
Table 48.
HPS Clock Performance for Arria V Devices
Symbol/Description
–I3
–C4
–C5, –I5
–C6
Unit
mpu_base_clk (microprocessor unit clock)
1050
925
800
700
MHz
main_base_clk (L3/L4 interconnect clock)
400
400
400
350
MHz
h2f_user0_clk
100
100
100
100
MHz
h2f_user1_clk
100
100
100
100
MHz
h2f_user2_clk
200
200
200
160
MHz
1.2.4.2. HPS PLL Specifications
1.2.4.2.1. HPS PLL VCO Frequency Range
Table 49.
HPS PLL VCO Frequency Range for Arria V Devices
Description
VCO range
Speed Grade
Minimum
Maximum
Unit
–C5, –I5, –C6
320
1,600
MHz
–C4
320
1,850
MHz
–I3
320
2,100
MHz
1.2.4.2.2. HPS PLL Input Clock Range
The HPS PLL input clock range is 10 – 50 MHz. This clock range applies to both HPS_CLK1 and HPS_CLK2 inputs.
Related Information
Clock Select, Booting and Configuration chapter
Provides more information about the clock range for different values of clock select (CSEL).
1.2.4.2.3. HPS PLL Input Jitter
Use the following equation to determine the maximum input jitter (peak-to-peak) the HPS PLLs can tolerate. The divide value
(N) is the value programmed into the denominator field of the VCO register for each PLL. The PLL input reference clock is
divided by this value. The range of the denominator is 1 to 64.
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Maximum input jitter = Input clock period × Divide value (N) × 0.02
Table 50.
Examples of Maximum Input Jitter
Input Reference Clock Period
Divide Value (N)
Maximum Jitter
Unit
40 ns
1
0.8
ns
40 ns
2
1.6
ns
40 ns
4
3.2
ns
1.2.4.3. Quad SPI Flash Timing Characteristics
Table 51.
Quad Serial Peripheral Interface (SPI) Flash Timing Requirements for Arria V Devices
Symbol
Fclk
Description
SCLK_OUT clock frequency (External clock)
Min
Typ
Max
Unit
—
—
108
MHz
Tqspi_clk
QSPI_CLK clock period (Internal reference clock)
2.32
—
—
ns
Tdutycycle
SCLK_OUT duty cycle
45
—
55
%
Tdssfrst
Output delay QSPI_SS valid before first clock edge
—
1/2 cycle of
SCLK_OUT
—
ns
Tdsslst
Output delay QSPI_SS valid after last clock edge
–1
—
1
ns
Tdio
I/O data output delay
–1
—
1
ns
Tdin_start
Input data valid start
—
—
(2 + Rdelay) ×
Tqspi_clk – 7.52 (86)
ns
Tdin_end
Input data valid end
(2 + Rdelay) ×
Tqspi_clk – 1.21 (86)
—
—
ns
(86)
Rdelay is set by programming the register qspiregs.rddatacap. For the SoC EDS software version 13.1 and later, Intel provides
automatic Quad SPI calibration in the preloader. For more information about Rdelay, refer to the Quad SPI Flash Controller chapter in
the Arria V Hard Processor System Technical Reference Manual.
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Figure 9.
Quad SPI Flash Timing Diagram
This timing diagram illustrates clock polarity mode 0 and clock phase mode 0.
Tdsslst
QSPI_SS
Tdssfrst
SCLK_OUT
Tdio
Data Out
QSPI_DATA
Tdin_start
Data In
Tdin_end
Related Information
Quad SPI Flash Controller Chapter, Arria V Hard Processor System Technical Reference Manual
Provides more information about Rdelay.
1.2.4.4. SPI Timing Characteristics
Table 52.
SPI Master Timing Requirements for Arria V Devices
The setup and hold times can be used for Texas Instruments SSP mode and National Semiconductor Microwire mode.
Symbol
Tclk
Description
CLK clock period
Tsu
SPI Master-in slave-out (MISO) setup time
Th
SPI MISO hold time
Min
Max
Unit
16.67
—
ns
—
ns
8.35
1
(87)
—
ns
continued...
(87)
This value is based on rx_sample_dly = 1 and spi_m_clk = 120 MHz. spi_m_clk is the internal clock that is used by SPI Master
to derive it’s SCLK_OUT. These timings are based on rx_sample_dly of 1. This delay can be adjusted as needed to accommodate
slower response times from the slave. Note that a delay of 0 is not allowed. The setup time can be used as a reference starting point.
It is very crucial to do a calibration to get the correct rx_sample_dly value because each SPI slave device may have different
output delay and each application board may have different path delay. For more information about rx_sample_delay, refer to the
SPI Controller chapter in the Hard Processor System Technical Reference Manual.
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Symbol
Description
Min
Max
Unit
45
55
%
Tdutycycle
SPI_CLK duty cycle
Tdssfrst
Output delay SPI_SS valid before first clock edge
8
—
ns
Tdsslst
Output delay SPI_SS valid after last clock edge
8
—
ns
Tdio
Master-out slave-in (MOSI) output delay
–1
1
ns
Figure 10.
SPI Master Timing Diagram
Tdsslst
SPI_SS
SPI_CLK (scpol = 0)
Tdssfrst
SPI_CLK (scpol = 1)
Tdio
SPI_MOSI (scph = 1)
Tsu
Th
SPI_MISO (scph = 1)
Tdio
SPI_MOSI (scph = 0)
Tsu
Th
SPI_MISO (scph = 0)
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Table 53.
SPI Slave Timing Requirements for Arria V Devices
The setup and hold times can be used for Texas Instruments SSP mode and National Semiconductor Microwire mode.
Symbol
Min
Max
Unit
Tclk
CLK clock period
20
—
ns
Ts
MOSI Setup time
5
—
ns
Th
MOSI Hold time
5
—
ns
Tsuss
Setup time SPI_SS valid before first clock edge
8
—
ns
Thss
Hold time SPI_SS valid after last clock edge
8
—
ns
Td
MISO output delay
—
6
ns
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Figure 11.
SPI Slave Timing Diagram
Thss
SPI_SS
Tsuss
SPI_CLK (scpol = 0)
SPI_CLK (scpol = 1)
Td
SPI_MISO (scph = 1)
Ts
Th
SPI_MOSI (scph = 1)
Td
SPI_MISO (scph = 0)
Ts
Th
SPI_MOSI (scph = 0)
Related Information
SPI Controller, Arria V Hard Processor System Technical Reference Manual
Provides more information about rx_sample_delay.
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1.2.4.5. SD/MMC Timing Characteristics
Table 54.
Secure Digital (SD)/MultiMediaCard (MMC) Timing Requirements for Arria V Devices
After power up or cold reset, the Boot ROM uses drvsel = 3 and smplsel = 0 to execute the code. At the same time, the SD/MMC controller enters the
Identification Phase followed by the Data Phase. During this time, the value of interface output clock SDMMC_CLK_OUT changes from a maximum of 400 kHz
(Identification Phase) up to a maximum of 12.5 MHz (Data Phase), depending on the internal reference clock SDMMC_CLK and the CSEL setting. The value of
SDMMC_CLK is based on the external oscillator frequency and has a maximum value of 50 MHz.
After the Boot ROM code exits and control is passed to the preloader, software can adjust the value of drvsel and smplsel via the system manager. drvsel
can be set from 1 to 7 and smplsel can be set from 0 to 7. While the preloader is executing, the values for SDMMC_CLK and SDMMC_CLK_OUT increase to a
maximum of 200 MHz and 50 MHz respectively.
Symbol
Min
Max
Unit
SDMMC_CLK clock period (Identification
mode)
20
—
ns
SDMMC_CLK clock period (Default speed
mode)
5
—
ns
SDMMC_CLK clock period (High speed
mode)
5
—
ns
2500
—
ns
SDMMC_CLK_OUT clock period (Default
speed mode)
40
—
ns
SDMMC_CLK_OUT clock period (High speed
mode)
20
—
ns
Tdutycycle
SDMMC_CLK_OUT duty cycle
45
55
%
Td
SDMMC_CMD/SDMMC_D output delay
(Tsdmmc_clk × drvsel)/2 – 1.23
(Tsdmmc_clk × drvsel)/2 +
1.69 (88)
ns
Tsu
Input setup time
1.05 – (Tsdmmc_clk × smplsel)/2
—
ns
Th
Input hold time
—
ns
Tsdmmc_clk (internal reference
clock)
Tsdmmc_clk_out (interface output
clock)
Description
SDMMC_CLK_OUT clock period
(Identification mode)
(88)
(89)
(88)
drvsel is the drive clock phase shift select value.
(89)
smplsel is the sample clock phase shift select value.
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(Tsdmmc_clk × smplsel)/2
(89)
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Figure 12.
SD/MMC Timing Diagram
SDMMC_CLK_OUT
Td
SDMMC_CMD & SDMMC_D (Out)
Command/Data Out
Tsu
Th
SDMMC_CMD & SDMMC_D (In)
Command/Data In
Related Information
Booting and Configuration Chapter, Arria V Hard Processor System Technical Reference Manual
Provides more information about CSEL pin settings in the SD/MMC Controller CSEL Pin Settings table.
1.2.4.6. USB Timing Characteristics
PHYs that support LPM mode may not function properly with the USB controller due to a timing issue. It is recommended that
designers use the MicroChip USB3300 PHY device that has been proven to be successful on the development board.
Table 55.
USB Timing Requirements for Arria V Devices
Symbol
Description
Min
Typ
Max
Unit
—
16.67
—
ns
4.4
—
11
ns
Tclk
USB CLK clock period
Td
CLK to USB_STP/USB_DATA[7:0] output delay
Tsu
Setup time for USB_DIR/USB_NXT/USB_DATA[7:0]
2
—
—
ns
Th
Hold time for USB_DIR/USB_NXT/USB_DATA[7:0]
1
—
—
ns
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Figure 13.
USB Timing Diagram
USB_CLK
USB_STP
USB_DATA[7:0]
Td
From PHY
To PHY
Tsu
Th
USB_DIR & USB_NXT
1.2.4.7. Ethernet Media Access Controller (EMAC) Timing Characteristics
Table 56.
Reduced Gigabit Media Independent Interface (RGMII) TX Timing Requirements for Arria V Devices
Symbol
Description
Min
Typ
Max
Unit
Tclk (1000Base-T)
TX_CLK clock period
—
8
—
ns
Tclk (100Base-T)
TX_CLK clock period
—
40
—
ns
Tclk (10Base-T)
TX_CLK clock period
—
400
—
ns
Tdutycycle
TX_CLK duty cycle
45
—
55
%
Td
TX_CLK to TXD/TX_CTL output data delay
–0.85
—
0.15
ns
Figure 14.
RGMII TX Timing Diagram
TX_CLK
TX_D[3:0]
Td
TX_CTL
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Table 57.
RGMII RX Timing Requirements for Arria V Devices
Symbol
Description
Min
Typ
Unit
Tclk (1000Base-T)
RX_CLK clock period
—
8
ns
Tclk (100Base-T)
RX_CLK clock period
—
40
ns
Tclk (10Base-T)
RX_CLK clock period
—
400
ns
Tsu
RX_D/RX_CTL setup time
1
—
ns
Th
RX_D/RX_CTL hold time
1
—
ns
Figure 15.
RGMII RX Timing Diagram
RX_CLK
Tsu
Th
RX_D[3:0]
RX_CTL
Table 58.
Management Data Input/Output (MDIO) Timing Requirements for Arria V Devices
Symbol
Description
Min
Typ
Max
Unit
Tclk
MDC clock period
—
400
—
ns
Td
MDC to MDIO output data delay
10
—
20
ns
Ts
Setup time for MDIO data
10
—
—
ns
Th
Hold time for MDIO data
0
—
—
ns
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Figure 16.
MDIO Timing Diagram
MDC
Td
MDIO_OUT
Tsu
Th
MDIO_IN
1.2.4.8. I2C Timing Characteristics
Table 59.
I2C Timing Requirements for Arria V Devices
Symbol
Standard Mode
Fast Mode
Unit
Min
Max
Min
Max
Tclk
Serial clock (SCL) clock period
10
—
2.5
—
µs
Tclkhigh
SCL high time
4.7
—
0.6
—
µs
Tclklow
SCL low time
4
—
1.3
—
µs
Ts
Setup time for serial data line (SDA) data to SCL
0.25
—
0.1
—
µs
Th
Hold time for SCL to SDA data
0
3.45
0
0.9
µs
Td
SCL to SDA output data delay
—
0.2
—
0.2
µs
Tsu_start
Setup time for a repeated start condition
4.7
—
0.6
—
µs
Thd_start
Hold time for a repeated start condition
4
—
0.6
—
µs
Tsu_stop
Setup time for a stop condition
4
—
0.6
—
µs
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Figure 17.
I2C Timing Diagram
I2C_SCL
Td
Ts
Tsu_start Thd_start
Data Out
I2C_SDA
Tsu_stop
Th
Data In
1.2.4.9. NAND Timing Characteristics
Table 60.
NAND ONFI 1.0 Timing Requirements for Arria V Devices
The NAND controller supports Open NAND FLASH Interface (ONFI) 1.0 Mode 5 timing as well as legacy NAND devices. This table lists the requirements for ONFI
1.0 mode 5 timing. The HPS NAND controller can meet this timing by programming the C4 output of the main HPS PLL and timing registers provided in the NAND
controller.
Symbol
Description
(90)
Write enable pulse width
(90)
Write enable hold time
Twp
Twh
(90)
Trp
Treh(90)
(90)
Read enable pulse width
Read enable hold time
Tclesu
Command latch enable to write enable setup time
Tcleh(90)
Command latch enable to write enable hold time
Tcesu(90)
Chip enable to write enable setup time
Tceh(90)
Chip enable to write enable hold time
Talesu(90)
Address latch enable to write enable setup time
Taleh(90)
Address latch enable to write enable hold time
Tdsu(90)
Data to write enable setup time
Tdh(90)
Data to write enable hold time
Min
Max
Unit
10
—
ns
7
—
ns
10
—
ns
7
—
ns
10
—
ns
5
—
ns
15
—
ns
5
—
ns
10
—
ns
5
—
ns
10
—
ns
5
—
ns
continued...
(90)
Timing of the NAND interface is controlled through the NAND configuration registers.
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Symbol
Description
Min
Max
Unit
Tcea
Chip enable to data access time
—
25
ns
Trea
Read enable to data access time
—
16
ns
Trhz
Read enable to data high impedance
—
100
ns
Trr
Ready to read enable low
20
—
ns
Figure 18.
NAND Command Latch Timing Diagram
NAND_CLE
NAND_CE
Tclesu
Tcesu
Tcleh
Twp
Tceh
NAND_WE
Talesu
Taleh
NAND_ALE
Tdsu
NAND_DQ[7:0]
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Tdh
Command
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Figure 19.
NAND Address Latch Timing Diagram
NAND_CLE
NAND_CE
Tcesu
Tclesu
Twp
Twh
NAND_WE
Talesu
Taleh
NAND_ALE
Tdsu
NAND_DQ[7:0]
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Tdh
Address
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Figure 20.
NAND Data Write Timing Diagram
NAND_CLE
NAND_CE
Tcleh
Twp
Tceh
NAND_WE
Talesu
NAND_ALE
Tdsu
Tdh
NAND_DQ[7:0]
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Figure 21.
NAND Data Read Timing Diagram
Tcea
NAND_CE
Trr
Trp
Treh
NAND_RE
Trhz
NAND_RB
Trea
NAND_DQ[7:0]
Dout
1.2.4.10. Arm Trace Timing Characteristics
Table 61.
Arm Trace Timing Requirements for Arria V Devices
Most debugging tools have a mechanism to adjust the capture point of trace data.
Description
Min
Max
Unit
12.5
—
ns
CLK maximum duty cycle
45
55
%
CLK to D0 –D7 output data delay
–1
1
ns
CLK clock period
1.2.4.11. UART Interface
The maximum UART baud rate is 6.25 megasymbols per second.
1.2.4.12. GPIO Interface
The minimum detectable general-purpose I/O (GPIO) pulse width is 2 μs. The pulse width is based on a debounce clock
frequency of 1 MHz.
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1.2.4.13. HPS JTAG Timing Specifications
Table 62.
HPS JTAG Timing Parameters and Values for Arria V Devices
Symbol
Description
Min
Max
Unit
tJCP
TCK clock period
30
—
ns
tJCH
TCK clock high time
14
—
ns
tJCL
TCK clock low time
14
—
ns
tJPSU (TDI)
TDI JTAG port setup time
2
—
ns
tJPSU (TMS)
TMS JTAG port setup time
3
—
ns
tJPH
JTAG port hold time
5
—
ns
—
12(91)
ns
—
14(91)
ns
—
14(91)
ns
tJPCO
JTAG port clock to output
tJPZX
JTAG port high impedance to valid output
tJPXZ
JTAG port valid output to high impedance
1.3. Configuration Specifications
This section provides configuration specifications and timing for Arria V devices.
1.3.1. POR Specifications
Table 63.
Fast and Standard POR Delay Specification for Arria V Devices
POR Delay
Fast
Standard
Minimum
Maximum
Unit
4
12(92)
ms
100
300
ms
(91)
A 1-ns adder is required for each VCCIO _HPS voltage step down from 3.0 V. For example, tJPCO= 13 ns if VCCIO _HPS of the TDO I/O bank
= 2.5 V, or 14 ns if it equals 1.8 V.
(92)
The maximum pulse width of the fast POR delay is 12 ms, providing enough time for the PCIe hard IP to initialize after the POR trip.
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Related Information
MSEL Pin Settings
Provides more information about POR delay based on MSEL pin settings for each configuration scheme.
1.3.2. FPGA JTAG Configuration Timing
Table 64.
FPGA JTAG Timing Parameters and Values for Arria V Devices
Symbol
Description
Min
Unit
—
ns
tJCP
TCK clock period
tJCH
TCK clock high time
14
—
ns
tJCL
TCK clock low time
14
—
ns
tJPSU (TDI)
TDI JTAG port setup time
2
—
ns
tJPSU (TMS)
TMS JTAG port setup time
3
—
ns
tJPH
JTAG port hold time
5
—
ns
—
12(94)
ns
ns
ns
tJPCO
JTAG port clock to output
30,
Max
167(93)
tJPZX
JTAG port high impedance to valid output
—
14(94)
tJPXZ
JTAG port valid output to high impedance
—
14(94)
1.3.3. FPP Configuration Timing
1.3.3.1. DCLK-to-DATA[] Ratio (r) for FPP Configuration
Fast passive parallel (FPP) configuration requires a different DCLK-to-DATA[] ratio when you turn on encryption or the
compression feature.
(93)
The minimum TCK clock period is 167 ns if VCCBAT is within the range 1.2 V – 1.5 V when you perform the volatile key programming.
(94)
A 1-ns adder is required for each VCCIO voltage step down from 3.0 V. For example, tJPCO= 13 ns if VCCIO of the TDO I/O bank =
2.5 V, or 14 ns if it equals 1.8 V.
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Depending on the DCLK-to-DATA[] ratio, the host must send a DCLK frequency that is r times the DATA[] rate in byte per
second (Bps) or word per second (Wps). For example, in FPP ×16 where the r is 2, the DCLK frequency must be 2 times the
DATA[] rate in Wps.
Table 65.
DCLK-to-DATA[] Ratio for Arria V Devices
Configuration Scheme
FPP (8-bit wide)
FPP (16-bit wide)
Encryption
Compression
DCLK-to-DATA[] Ratio (r)
Off
Off
1
On
Off
1
Off
On
2
On
On
2
Off
Off
1
On
Off
2
Off
On
4
On
On
4
1.3.3.2. FPP Configuration Timing when DCLK-to-DATA[] = 1
When you enable decompression or the design security feature, the DCLK-to-DATA[] ratio varies for FPP ×8 and FPP ×16. For
the respective DCLK-to-DATA[] ratio, refer to the DCLK-to-DATA[] Ratio for Arria V Devices table.
Table 66.
FPP Timing Parameters When DCLK-to-DATA[] Ratio is 1 for Arria V Devices
Symbol
Parameter
Minimum
Maximum
Unit
tCF2CD
nCONFIG low to CONF_DONE low
—
600
ns
tCF2ST0
nCONFIG low to nSTATUS low
—
600
ns
tCFG
nCONFIG low pulse width
2
—
µs
tSTATUS
nSTATUS low pulse width
268
1506(95)
µs
continued...
(95)
You can obtain this value if you do not delay configuration by extending the nCONFIG or the nSTATUS low pulse width.
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Symbol
tCF2ST1
Parameter
nCONFIG high to nSTATUS high
Minimum
Maximum
Unit
—
1506(96)
µs
(97)
nCONFIG high to first rising edge on DCLK
1506
—
µs
tST2CK
(97)
nSTATUS high to first rising edge of DCLK
2
—
µs
tDSU
DATA[] setup time before rising edge on DCLK
5.5
—
ns
tDH
DATA[] hold time after rising edge on DCLK
0
—
ns
tCH
DCLK high time
0.45 × 1/fMAX
—
s
tCL
DCLK low time
0.45 × 1/fMAX
—
s
tCLK
DCLK period
1/fMAX
—
s
fMAX
DCLK frequency (FPP ×8/ ×16)
—
125
MHz
tCD2UM
CONF_DONE high to user mode(98)
175
437
µs
tCD2CU
CONF_DONE high to CLKUSR enabled
4× maximum DCLK period
—
—
tCD2UMC
CONF_DONE high to user mode with CLKUSR option on
tCD2CU + (Tinit × CLKUSR period)
—
—
Tinit
Number of clock cycles required for device initialization
8,576
—
Cycles
tCF2CK
Related Information
FPP Configuration Timing
Provides the FPP configuration timing waveforms.
(96)
You can obtain this value if you do not delay configuration by externally holding the nSTATUS low.
(97)
If nSTATUS is monitored, follow the tST2CK specification. If nSTATUS is not monitored, follow the tCF2CK specification.
(98)
The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for initializing the device.
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1.3.3.3. FPP Configuration Timing when DCLK-to-DATA[] >1
Table 67.
FPP Timing Parameters When DCLK-to-DATA[] Ratio is >1 for Arria V Devices
Use these timing parameters when you use the decompression and design security features.
Symbol
Parameter
Minimum
Maximum
Unit
tCF2CD
nCONFIG low to CONF_DONE low
—
600
ns
tCF2ST0
nCONFIG low to nSTATUS low
—
600
ns
tCFG
nCONFIG low pulse width
2
—
µs
tSTATUS
nSTATUS low pulse width
268
1506(99)
µs
tCF2ST1
nCONFIG high to nSTATUS high
—
1506(100)
µs
(101)
tCF2CK
nCONFIG high to first rising edge on DCLK
1506
—
µs
tST2CK(101)
nSTATUS high to first rising edge of DCLK
2
—
µs
tDSU
DATA[] setup time before rising edge on DCLK
5.5
—
ns
tDH
DATA[] hold time after rising edge on DCLK
N – 1/fDCLK(102)
—
s
tCH
DCLK high time
0.45 × 1/fMAX
—
s
tCL
DCLK low time
0.45 × 1/fMAX
—
s
tCLK
DCLK period
1/fMAX
—
s
fMAX
DCLK frequency (FPP ×8/ ×16)
—
125
MHz
tR
Input rise time
—
40
ns
tF
Input fall time
—
40
ns
continued...
(99)
This value can be obtained if you do not delay configuration by extending the nCONFIG or nSTATUS low pulse width.
(100)
This value can be obtained if you do not delay configuration by externally holding nSTATUS low.
(101)
If nSTATUS is monitored, follow the tST2CK specification. If nSTATUS is not monitored, follow the tCF2CK specification.
(102)
N is the DCLK-to-DATA[] ratio and fDCLK is the DCLK frequency of the system.
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Symbol
Parameter
Minimum
Maximum
Unit
175
437
µs
4 × maximum DCLK period
—
—
mode(103)
tCD2UM
CONF_DONE high to user
tCD2CU
CONF_DONE high to CLKUSR enabled
tCD2UMC
CONF_DONE high to user mode with CLKUSR option on
tCD2CU + (Tinit × CLKUSR period)
—
—
Tinit
Number of clock cycles required for device initialization
8,576
—
Cycles
Related Information
FPP Configuration Timing
Provides the FPP configuration timing waveforms.
1.3.4. Active Serial (AS) Configuration Timing
Table 68.
AS Timing Parameters for AS ×1 and ×4 Configurations in Arria V Devices
The minimum and maximum numbers apply to both the internal oscillator and CLKUSR when either one is used as the clock source for device configuration.
The tCF2CD, tCF2ST0, tCFG, tSTATUS, and tCF2ST1 timing parameters are identical to the timing parameters for passive serial (PS) mode listed in PS Timing Parameters
for Arria V Devices table. You can obtain the tCF2ST1 value if you do not delay configuration by externally holding nSTATUS low.
Symbol
tCO
(104)
Parameter
Condition
Minimum
Maximum
Unit
DCLK falling edge to the AS_DATA0/ASDO output
—
—
2
ns
tSU(105)
Data setup time before the falling edge on DCLK
—
1.5
—
ns
tDH(105)
Data hold time after the falling edge on DCLK
–3 speed grade
1.7
—
ns
–4 speed grade
2.0
—
ns
continued...
(103)
The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for initializing the device.
(104)
Load capacitance for DCLK = 6 pF and AS_DATA/ASDO = 8 pF. Intel recommends obtaining the tCO for a given link (including receiver,
transmission lines, connectors, termination resistors, and other components) through IBIS or HSPICE simulation.
(105)
To evaluate the data setup (tSU) and data hold time (tDH) slack on your board in order to ensure you are meeting the tSU and tDH
requirement, Intel recommends following the guideline in the "Evaluating Data Setup and Hold Timing Slack" chapter in AN822: Intel
FPGA Configuration Device Migration Guideline.
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Symbol
Parameter
Condition
Minimum
Maximum
Unit
–5 speed grade
2.3
—
ns
–6 speed grade
2.6
—
ns
tCD2UM
CONF_DONE high to user mode
—
175
437
µs
tCD2CU
CONF_DONE high to CLKUSR enabled
—
4 × maximum DCLK period
—
—
tCD2UMC
CONF_DONE high to user mode with CLKUSR option on
—
tCD2CU + (Tinit × CLKUSR
period)
—
—
Tinit
Number of clock cycles required for device initialization
—
8,576
—
Cycles
Related Information
•
Passive Serial (PS) Configuration Timing on page 81
•
AS Configuration Timing
Provides the AS configuration timing waveform.
•
Evaluating Data Setup and Hold Timing Slack chapter, AN822: Intel FPGA Configuration Device Migration Guideline
1.3.5. DCLK Frequency Specification in the AS Configuration Scheme
Table 69.
DCLK Frequency Specification in the AS Configuration Scheme
This table lists the internal clock frequency specification for the AS configuration scheme. The DCLK frequency specification applies when you use the internal
oscillator as the configuration clock source. The AS multi-device configuration scheme does not support DCLK frequency of 100 MHz.
Parameter
DCLK frequency in AS configuration scheme
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Minimum
Typical
Maximum
Unit
5.3
7.9
12.5
MHz
10.6
15.7
25.0
MHz
21.3
31.4
50.0
MHz
42.6
62.9
100.0
MHz
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1.3.6. Passive Serial (PS) Configuration Timing
Table 70.
PS Timing Parameters for Arria V Devices
Symbol
Parameter
Minimum
Maximum
Unit
tCF2CD
nCONFIG low to CONF_DONE low
—
600
ns
tCF2ST0
nCONFIG low to nSTATUS low
—
600
ns
tCFG
nCONFIG low pulse width
2
—
µs
tSTATUS
nSTATUS low pulse width
268
1506(106)
µs
—
1506(107)
µs
tCF2ST1
(108)
nCONFIG high to nSTATUS high
tCF2CK
nCONFIG high to first rising edge on DCLK
1506
—
µs
tST2CK(108)
nSTATUS high to first rising edge of DCLK
2
—
µs
tDSU
DATA[] setup time before rising edge on DCLK
5.5
—
ns
tDH
DATA[] hold time after rising edge on DCLK
0
—
ns
tCH
DCLK high time
0.45 × 1/fMAX
—
s
tCL
DCLK low time
0.45 × 1/fMAX
—
s
tCLK
DCLK period
1/fMAX
—
s
fMAX
DCLK frequency
—
125
MHz
tCD2UM
CONF_DONE high to user mode(109)
175
437
µs
continued...
(106)
You can obtain this value if you do not delay configuration by extending the nCONFIG or nSTATUS low pulse width.
(107)
You can obtain this value if you do not delay configuration by externally holding nSTATUS low.
(108)
If nSTATUS is monitored, follow the tST2CK specification. If nSTATUS is not monitored, follow the tCF2CK specification.
(109)
The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for initializing the device.
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Symbol
Parameter
Minimum
Maximum
Unit
4 × maximum DCLK period
—
—
tCD2CU
CONF_DONE high to CLKUSR enabled
tCD2UMC
CONF_DONE high to user mode with CLKUSR option on
tCD2CU + (Tinit × CLKUSR period)
—
—
Tinit
Number of clock cycles required for device initialization
8,576
—
Cycles
Related Information
PS Configuration Timing
Provides the PS configuration timing waveform.
1.3.7. Initialization
Table 71.
Initialization Clock Source Option and the Maximum Frequency for Arria V Devices
Initialization Clock Source
Internal Oscillator
CLKUSR(110)
DCLK
(110)
Maximum Frequency (MHz)
Minimum Number of Clock Cycles
AS, PS, and FPP
12.5
Tinit
PS and FPP
125
AS
100
PS and FPP
125
To enable CLKUSR as the initialization clock source, turn on the Enable user-supplied start-up clock (CLKUSR) option in the Intel
Quartus Prime software from the General panel of the Device and Pin Options dialog box.
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1.3.8. Configuration Files
Table 72.
Uncompressed .rbf Sizes for Arria V Devices
Use this table to estimate the file size before design compilation. Different configuration file formats, such as a hexadecimal file (.hex) or tabular text file (.ttf)
format, have different file sizes.
For the different types of configuration file and file sizes, refer to the Intel Quartus Prime software. However, for a specific version of the Intel Quartus Prime
software, any design targeted for the same device has the same uncompressed configuration file size.
The IOCSR raw binary file (.rbf) size is specifically for the Configuration via Protocol (CvP) feature.
Variant
Member Code
Configuration .rbf Size (bits)
IOCSR .rbf Size (bits)
Arria V GX
A1
71,015,712
439,960
A3
71,015,712
439,960
A5
101,740,800
446,360
A7
101,740,800
446,360
B1
137,785,088
457,368
B3
137,785,088
457,368
B5
185,915,808
463,128
B7
185,915,808
463,128
C3
71,015,712
439,960
Arria V GT
Arria V SX
Arria V ST
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C7
101,740,800
446,360
D3
137,785,088
457,368
D7
185,915,808
463,128
B3
185,903,680
450,968
B5
185,903,680
450,968
D3
185,903,680
450,968
D5
185,903,680
450,968
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1.3.9. Minimum Configuration Time Estimation
Table 73.
Minimum Configuration Time Estimation for Arria V Devices
The estimated values are based on the configuration .rbf sizes in Uncompressed .rbf Sizes for Arria V Devices table.
Variant
Arria V GX
Arria V GT
Arria V SX
Arria V ST
Active Serial(111)
Member Code
Fast Passive Parallel(112)
Width
DCLK (MHz)
Minimum Configuration
Time (ms)
Width
DCLK (MHz)
Minimum Configuration
Time (ms)
A1
4
100
178
16
125
36
A3
4
100
178
16
125
36
A5
4
100
255
16
125
51
A7
4
100
255
16
125
51
B1
4
100
344
16
125
69
B3
4
100
344
16
125
69
B5
4
100
465
16
125
93
B7
4
100
465
16
125
93
C3
4
100
178
16
125
36
C7
4
100
255
16
125
51
D3
4
100
344
16
125
69
D7
4
100
465
16
125
93
B3
4
100
465
16
125
93
B5
4
100
465
16
125
93
D3
4
100
465
16
125
93
D5
4
100
465
16
125
93
(111)
DCLK frequency of 100 MHz using external CLKUSR.
(112)
Maximum FPGA FPP bandwidth may exceed bandwidth available from some external storage or control logic.
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Related Information
Configuration Files on page 83
1.3.10. Remote System Upgrades
Table 74.
Remote System Upgrade Circuitry Timing Specifications for Arria V Devices
Parameter
(113)
tRU_nCONFIG
(114)
tRU_nRSTIMER
Minimum
Unit
250
ns
250
ns
Related Information
•
Remote System Upgrade State Machine
Provides more information about configuration reset (RU_CONFIG) signal.
•
User Watchdog Timer
Provides more information about reset_timer (RU_nRSTIMER) signal.
1.3.11. User Watchdog Internal Oscillator Frequency Specifications
Table 75.
User Watchdog Internal Oscillator Frequency Specifications for Arria V Devices
Parameter
User watchdog internal oscillator frequency
Minimum
Typical
Maximum
Unit
5.3
7.9
12.5
MHz
1.4. I/O Timing
Intel offers two ways to determine I/O timing—the Excel-based I/O timing and the Intel Quartus Prime Timing Analyzer.
(113)
This is equivalent to strobing the reconfiguration input of the Remote Update Intel FPGA IP core high for the minimum timing
specification.
(114)
This is equivalent to strobing the reset timer input of the Remote Update Intel FPGA IP core high for the minimum timing
specification.
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Excel-based I/O timing provides pin timing performance for each device density and speed grade. The data is typically used
prior to designing the FPGA to get an estimate of the timing budget as part of the link timing analysis.
The Intel Quartus Prime Timing Analyzer provides a more accurate and precise I/O timing data based on the specifics of the
design after you complete place-and-route.
Related Information
Arria V I/O Timing Spreadsheet
Provides the Arria V Excel-based I/O timing spreadsheet.
1.4.1. Programmable IOE Delay
Table 76.
I/O element (IOE) Programmable Delay for Arria V Devices
Parameter(115
Available
Settings
Minimum
Offset(116)
D1
32
D3
)
Fast Model
Slow Model
Unit
Industrial
Commercial
–C4
–C5
–C6
–I3
–I5
0
0.508
0.517
0.870
1.063
1.063
0.872
1.057
ns
8
0
1.763
1.795
2.999
3.496
3.571
3.031
3.643
ns
D4
32
0
0.508
0.518
0.869
1.063
1.063
1.063
1.057
ns
D5
32
0
0.508
0.517
0.870
1.063
1.063
0.872
1.057
ns
(115)
You can set this value in the Intel Quartus Prime software by selecting D1, D3, D4, and D5 in the Assignment Name column of
Assignment Editor.
(116)
Minimum offset does not include the intrinsic delay.
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1.4.2. Programmable Output Buffer Delay
Table 77.
Programmable Output Buffer Delay for Arria V Devices
This table lists the delay chain settings that control the rising and falling edge delays of the output buffer.
You can set the programmable output buffer delay in the Intel Quartus Prime software by setting the Output Buffer Delay Control assignment to either
positive, negative, or both edges, with the specific values stated here (in ps) for the Output Buffer Delay assignment.
Symbol
DOUTBUF
Parameter
Rising and/or falling edge delay
Typical
Unit
0 (default)
ps
50
ps
100
ps
150
ps
1.5. Glossary
Table 78.
Glossary
Term
Differential I/O standards
Definition
Receiver Input Waveforms
continued...
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Term
Definition
Single-Ended Waveform
Positive Channel (p) = V IH
VID
Negative Channel (n) = VIL
VCM
Ground
Differential Waveform
VID
p-n=0V
VID
Transmitter Output Waveforms
continued...
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Term
Definition
Single-Ended Waveform
Positive Channel (p) = V OH
VOD
Negative Channel (n) = VOL
VCM
Ground
Differential Waveform
VOD
p-n=0V
VOD
fHSCLK
Left/right PLL input clock frequency.
fHSDR
High-speed I/O block—Maximum/minimum LVDS data transfer rate (fHSDR =1/TUI).
J
High-speed I/O block—Deserialization factor (width of parallel data bus).
JTAG timing specifications
JTAG Timing Specifications
continued...
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Term
Definition
TMS
TDI
t JCP
t JCH
t JCL
t JPSU
t JPH
TCK
tJPZX
tJPCO
t JPXZ
TDO
PLL specifications
Diagram of PLL specifications
continued...
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Term
Definition
CLKOUT Pins
Switchover
CLK
fOUT_EXT
4
fIN
N
fINPFD
PFD
Core Clock
CP
LF
VCO
fVCO
Counters
C0..C17
fOUT
GCLK
RCLK
Delta Sigma
Modulator
Legend
Reconfigurable in User Mode
External Feedback
Note:
(1) Core Clock can only be fed by dedicated clock input pins or PLL outputs.
RL
Receiver differential input discrete resistor (external to the Arria V device).
Sampling window (SW)
Timing diagram—The period of time during which the data must be valid in order to capture it correctly. The setup and hold times
determine the ideal strobe position in the sampling window, as shown:
Bit Time
0.5 x TCCS
RSKM
Sampling Window
(SW)
RSKM
0.5 x TCCS
continued...
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Term
Single-ended voltage referenced
I/O standard
Definition
The JEDEC standard for the SSTL and HSTL I/O defines both the AC and DC input signal values. The AC values indicate the voltage
levels at which the receiver must meet its timing specifications. The DC values indicate the voltage levels at which the final logic state of
the receiver is unambiguously defined. After the receiver input has crossed the AC value, the receiver changes to the new logic state.
The new logic state is then maintained as long as the input stays beyond the DC threshold. This approach is intended to provide
predictable receiver timing in the presence of input waveform ringing.
Single-Ended Voltage Referenced I/O Standard
V CCIO
V OH
V IH (AC )
V REF
V IH(DC )
V IL(DC )
V IL(AC )
V OL
V SS
tC
High-speed receiver/transmitter input and output clock period.
TCCS (channel-to-channel-skew)
The timing difference between the fastest and slowest output edges, including the tCO variation and clock skew, across channels driven
by the same PLL. The clock is included in the TCCS measurement (refer to the Timing Diagram figure under SW in this table).
tDUTY
High-speed I/O block—Duty cycle on high-speed transmitter output clock.
tFALL
Signal high-to-low transition time (80–20%)
tINCCJ
Cycle-to-cycle jitter tolerance on the PLL clock input
continued...
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Term
Definition
tOUTPJ_IO
Period jitter on the GPIO driven by a PLL
tOUTPJ_DC
Period jitter on the dedicated clock output driven by a PLL
tRISE
Signal low-to-high transition time (20–80%)
Timing Unit Interval (TUI)
The timing budget allowed for skew, propagation delays, and the data sampling window. (TUI = 1/(Receiver Input Clock Frequency
Multiplication Factor) = tC/w)
VCM(DC)
DC common mode input voltage.
VICM
Input common mode voltage—The common mode of the differential signal at the receiver.
VID
Input differential voltage swing—The difference in voltage between the positive and complementary conductors of a differential
transmission at the receiver.
VDIF(AC)
AC differential input voltage—Minimum AC input differential voltage required for switching.
VDIF(DC)
DC differential input voltage— Minimum DC input differential voltage required for switching.
VIH
Voltage input high—The minimum positive voltage applied to the input which is accepted by the device as a logic high.
VIH(AC)
High-level AC input voltage
VIH(DC)
High-level DC input voltage
VIL
Voltage input low—The maximum positive voltage applied to the input which is accepted by the device as a logic low.
VIL(AC)
Low-level AC input voltage
VIL(DC)
Low-level DC input voltage
VOCM
Output common mode voltage—The common mode of the differential signal at the transmitter.
VOD
Output differential voltage swing—The difference in voltage between the positive and complementary conductors of a differential
transmission line at the transmitter.
VSWING
Differential input voltage
VX
Input differential cross point voltage
VOX
Output differential cross point voltage
W
High-speed I/O block—Clock boost factor
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1.6. Arria V GX, GT, SX, and ST Device Datasheet Revision History
Document
Version
Changes
2019.04.26
•
•
Added a note for Conversion Time in the Internal Temperature Sensing Diode Specifications for Arria V Devices table.
Updated tDH specifications in the AS Timing Parameters for AS ×1 and ×4 Configurations in Arria V Devices table.
2019.01.25
•
•
Added Arria V Devices Overshoot Duration diagram.
•
Updated the AS Timing Parameters for AS ×1 and ×4 Configurations in Arria V Devices table.
— Updated tDH specifications. These specifications are applicable to the commercial and industrial grade devices.
— Added note to tCO, tSU, and tDH.
Removed PowerPlay text from tool name.
Renamed IP cores as per Intel rebranding.
•
•
Date
December 2016
Changed "VCO post-scale counter K value" to "VCO post divider value" in the fVCO note in the PLL Specifications for Arria V Devices table.
Version
2016.12.09
Changes
•
•
•
June 2016
2016.06.10
•
•
•
•
Updated VICM (AC coupled) specifications in Receiver Specifications for Arria V GX and SX Devices table.
Added maximum specification for Td in Management Data Input/Output (MDIO) Timing Requirements for Arria V Devices
table.
Updated Tinit specifications in the following tables:
— FPP Timing Parameters When DCLK-to-DATA[] Ratio is 1 for Arria V Devices
— FPP Timing Parameters When DCLK-to-DATA[] Ratio is >1 for Arria V Devices
— AS Timing Parameters for AS ×1 and ×4 Configurations in Arria V Devices
— PS Timing Parameters for Arria V Devices
Changed pin capacitance to maximum values.
Updated SPI Master Timing Requirements for Arria V Devices table.
— Added Tsu and Th specifications.
— Removed Tdinmax specifications.
Updated SPI Master Timing Diagram.
Updated Tclk spec from maximum to minimum in I2C Timing Requirements for Arria V Devices table.
continued...
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Date
December 2015
Version
2015.12.16
Changes
•
•
•
•
•
•
June 2015
2015.06.16
•
•
•
•
•
•
•
•
Updated Quad Serial Peripheral Interface (SPI) Flash Timing Requirements for Arria V Devices table.
— Updated Fclk, Tdutycycle, and Tdssfrst specifications.
— Added Tqspi_clk, Tdin_start, and Tdin_end specifications.
— Removed Tdinmax specifications.
Updated the minimum specification for Tclk to 16.67 ns and removed the maximum specification in SPI Master Timing
Requirements for Arria V Devices table.
Updated Secure Digital (SD)/MultiMediaCard (MMC) Timing Requirements for Arria V Devices table.
— Updated T clk to Tsdmmc_clk_out symbol.
— Updated Tsdmmc_clk_out and Td specifications.
— Added Tsdmmc_clk, Tsu, and Th specifications.
— Removed Tdinmax specifications.
Updated the following diagrams:
— Quad SPI Flash Timing Diagram
— SD/MMC Timing Diagram
Updated configuration .rbf sizes for Arria V devices.
Changed instances of Quartus II to Quartus Prime.
Added the supported data rates for the following output standards using true LVDS output buffer types in the High-Speed
I/O Specifications for Arria V Devices table:
— True RSDS output standard: data rates of up to 360 Mbps
— True mini-LVDS output standard: data rates of up to 400 Mbps
Added note in the condition for Transmitter—Emulated Differential I/O Standards fHSDR data rate parameter in the HighSpeed I/O Specifications for Arria V Devices table. Note: When using True LVDS RX channels for emulated LVDS TX
channel, only serialization factors 1 and 2 are supported.
Changed Queued Serial Peripheral Interface (QSPI) to Quad Serial Peripheral Interface (SPI) Flash.
Updated Th location in I2C Timing Diagram.
Updated Twp location in NAND Address Latch Timing Diagram.
Corrected the unit for tDH from ns to s in FPP Timing Parameters When DCLK-to-DATA[] Ratio is >1 for Arria V Devices
table.
Updated the maximum value for tCO from 4 ns to 2 ns in AS Timing Parameters for AS ×1 and ×4 Configurations in Arria V
Devices table.
Moved the following timing diagrams to the Configuration, Design Security, and Remote System Upgrades in Arria V
Devices chapter.
— FPP Configuration Timing Waveform When DCLK-to-DATA[] Ratio is 1
— FPP Configuration Timing Waveform When DCLK-to-DATA[] Ratio is >1
— AS Configuration Timing Waveform
— PS Configuration Timing Waveform
continued...
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Date
January 2015
Version
2015.01.30
Changes
•
•
•
•
•
•
•
•
•
•
•
•
July 2014
3.8
•
•
•
•
•
•
•
•
•
•
Updated the description for VCC_AUX_SHARED to “HPS auxiliary power supply” in the following tables:
— Absolute Maximum Ratings for Arria V Devices
— HPS Power Supply Operating Conditions for Arria V SX and ST Devices
Added statement in I/O Standard Specifications: You must perform timing closure analysis to determine the maximum
achievable frequency for general purpose I/O standards.
Updated the conditions for transceiver reference clock rise time and fall time: Measure at ±60 mV of differential signal.
Added a note to the conditions: REFCLK performance requires to meet transmitter REFCLK phase noise specification.
Updated the description in Periphery Performance Specifications to mention that proper timing closure is required in
design.
Updated HPS Clock Performance main_base_clk specifications from 525 MHz (for –I3 speed grade) and 462 MHz (for –C4
speed grade) to 400 MHz.
Updated HPS PLL VCO maximum frequency to 1,600 MHz (for –C5, –I5, and –C6 speed grades), 1,850 MHz (for –C4
speed grade), and 2,100 MHz (for –I3 speed grade).
Changed the symbol for HPS PLL input jitter divide value from NR to N.
Removed “Slave select pulse width (Texas Instruments SSP mode)” parameter from the following tables:
— SPI Master Timing Requirements for Arria V Devices
— SPI Slave Timing Requirements for Arria V Devices
Added descriptions to USB Timing Characteristics section in HPS Specifications: PHYs that support LPM mode may not
function properly with the USB controller due to a timing issue. It is recommended that designers use the MicroChip
USB3300 PHY device that has been proven to be successful on the development board.
Added HPS JTAG timing specifications.
Updated FPGA JTAG timing specifications note as follows: A 1-ns adder is required for each VCCIO voltage step down from
3.0 V. For example, tJPCO = 13 ns if VCCIO of the TDO I/O bank = 2.5 V, or 14 ns if it equals 1.8 V.
Updated the value in the VICM (AC Coupled) row and in note 6 from 650 mV to 750 mV in the Transceiver Specifications for
Arria V GT and ST Devices table.
Added a note in Table 3, Table 4, and Table 5: The power supply value describes the budget for the DC (static) power
supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget
for the dynamic tolerance requirements.
Updated VCC_HPS specification in Table 5.
Added a note in Table 19: Differential inputs are powered by VCCPD which requires 2.5 V.
Updated "Minimum differential eye opening at the receiver serial input pins" specification in Table 20 and Table 21.
Updated description in “HPS PLL Specifications” section.
Updated VCO range maximum specification in Table 39.
Updated Td and Th specifications in Table 45.
Added Th specification in Table 47 and Figure 13.
Updated a note in Figure 20, Figure 21, and Figure 23 as follows: Do not leave DCLK floating after configuration. DCLK is
ignored after configuration is complete. It can toggle high or low if required.
Removed “Remote update only in AS mode” specification in Table 58.
continued...
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Date
Version
Changes
•
•
Added DCLK device initialization clock source specification in Table 60.
•
Added description in “Configuration Files” section: The IOCSR .rbf size is specifically for the Configuration via Protocol
(CvP) feature.
Removed fMAX_RU_CLK specification in Table 63.
February 2014
3.7
•
•
Updated VCCRSTCLK_HPS maximum specification in Table 1.
Added VCC_AUX_SHARED specification in Table 1.
December 2013
3.6
•
•
•
•
•
Added “HPS PLL Specifications”.
Added Table 24, Table 39, and Table 40.
Updated Table 1, Table 3, Table 5, Table 19, Table 20, Table 21, Table 38, Table 41, Table 42, Table 43, Table 44, Table 45,
Table 46, Table 47, Table 48, Table 49, Table 50, Table 51, Table 55, Table 56, and Table 59.
Updated Figure 7, Figure 13, Figure 15, Figure 16, and Figure 19.
Removed table: GPIO Pulse Width for Arria V Devices.
August 2013
3.5
•
•
Removed “Pending silicon characterization” note in Table 29.
Updated Table 25.
August 2013
3.4
•
Removed Preliminary tags for Table 1, Table 2, Table 3, Table 4, Table 5, Table 6, Table 7, Table 9, Table 12, Table 13, Table
14, Table 15, Table 16, Table 17, Table 18, Table 19, Table 20, Table 21, Table 22, Table 23, Table 24, Table 25, Table 26,
Table 27, Table 28, Table 29, Table 30, Table 31, Table 35, Table 36, Table 51, Table 53, Table 54, Table 55, Table 56, Table
57, Table 60, Table 62, and Table 64.
Updated Table 1, Table 3, Table 11, Table 19, Table 20, Table 21, Table 22, Table 25, and Table 29.
•
June 2013
3.3
Updated Table 20, Table 21, Table 25, and Table 38.
May 2013
3.2
•
•
•
March 2013
3.1
•
Added Table 37.
Updated Figure 8, Figure 9, Figure 20, Figure 22, and Figure 23.
Updated Table 1, Table 5, Table 10, Table 13, Table 19, Table 20, Table 21, Table 23, Table 29, Table 39, Table 40, Table 46,
Table 56, Table 57, Table 60, and Table 64.
Updated industrial junction temperature range for –I3 speed grade in “PLL Specifications” section.
•
•
•
•
Added HPS reset information in the “HPS Specifications” section.
Added Table 60.
Updated Table 1, Table 3, Table 17, Table 20, Table 29, and Table 59.
Updated Figure 21.
continued...
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Date
November 2012
Version
3.0
Changes
•
•
•
Updated Table 2, Table 4, Table 9, Table 14, Table 16, Table 17, Table 20, Table 21, Table 25, Table 29, Table 36, Table 56,
Table 57, and Table 60.
Removed table: Transceiver Block Jitter Specifications for Arria V Devices.
Added HPS information:
— Added “HPS Specifications” section.
— Added Table 38, Table 39, Table 40, Table 41, Table 42, Table 43, Table 44, Table 45, Table 46, Table 47, Table 48, Table
49, and Table 50.
— Added Figure 7, Figure 8, Figure 9, Figure 10, Figure 11, Figure 12, Figure 13, Figure 14, Figure 15, Figure 16, Figure
17, Figure 18, and Figure 19.
— Updated Table 3 and Table 5.
October 2012
2.4
•
•
Updated Arria V GX VCCR_GXBL/R, VCCT_GXBL/R, and VCCL_GXBL/R minimum and maximum values, and data rate in Table 4.
Added receiver VICM (AC coupled) and VICM (DC coupled) values, and transmitter VOCM (AC coupled) and VOCM (DC
coupled) values in Table 20 and Table 21.
August 2012
2.3
Updated the SERDES factor condition in Table 30.
July 2012
2.2
•
•
•
•
•
June 2012
2.1
Updated VCCR_GXBL/R, VCCT_GXBL/R, and VCCL_GXBL/R values in Table 4.
June 2012
2.0
•
•
•
•
•
•
•
Updated for the Quartus II software v12.0 release:
Restructured document.
Updated “Supply Current and Power Consumption” section.
Updated Table 20, Table 21, Table 24, Table 25, Table 26, Table 35, Table 39, Table 43, and Table 52.
Added Table 22, Table 23, and Table 33.
Added Figure 1–1 and Figure 1–2.
Added “Initialization” and “Configuration Files” sections.
February 2012
1.3
•
•
•
Updated Table 2–1.
Updated Transceiver-FPGA Fabric Interface rows in Table 2–20.
Updated VCCP description.
Updated
Updated
Updated
Updated
Updated
the maximum voltage for VI (DC input voltage) in Table 1.
Table 20 to include the Arria V GX -I3 speed grade.
the minimum value of the fixedclk clock frequency in Table 20 and Table 21.
the SERDES factor condition in Table 30.
Table 50 to include the IOE programmable delay settings for the Arria V GX -I3 speed grade.
continued...
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Date
Version
Changes
December 2011
1.2
Updated Table 2–1 and Table 2–3.
November 2011
1.1
•
•
•
August 2011
1.0
Initial release.
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Updated Table 2–1, Table 2–19, Table 2–26, and Table 2–36.
Added Table 2–5.
Added Figure 2–4.
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2. Arria V GZ Device Datasheet
This document covers the electrical and switching characteristics for Arria V GZ devices. Electrical characteristics include
operating conditions and power consumption. Switching characteristics include transceiver specifications, core, and periphery
performance. This document also describes I/O timing, including programmable I/O element (IOE) delay and programmable
output buffer delay.
Related Information
Arria V Device Overview
For information regarding the densities and packages of devices in the Arria V GZ family.
2.1. Electrical Characteristics
2.1.1. Operating Conditions
When you use Arria V GZ devices, they are rated according to a set of defined parameters. To maintain the highest possible
performance and reliability of Arria V GZ devices, you must consider the operating requirements described in this datasheet.
Arria V GZ devices are offered in commercial and industrial temperature grades.
Commercial devices are offered in –3 (fastest) and –4 core speed grades. Industrial devices are offered in –3L and –4 core
speed grades. Arria V GZ devices are offered in –2 and –3 transceiver speed grades.
Intel Corporation. All rights reserved. Agilex, Altera, Arria, Cyclone, Enpirion, Intel, the Intel logo, MAX, Nios, Quartus and Stratix words and logos are trademarks
of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Intel warrants performance of its FPGA and semiconductor products to current
specifications in accordance with Intel's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Intel
assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in
writing by Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing
orders for products or services.
*Other names and brands may be claimed as the property of others.
ISO
9001:2015
Registered
2. Arria V GZ Device Datasheet
AV-51002 | 2019.04.26
Table 79.
Commercial and Industrial Speed Grade Offering for Arria V GZ Devices
C = Commercial temperature grade; I = Industrial temperature grade.
Lower number refers to faster speed grade.
L = Low power devices.
Transceiver Speed Grade
Core Speed Grade
C3
C4
I3L
I4
2
Yes
—
Yes
—
3
—
Yes
—
Yes
2.1.1.1. Absolute Maximum Ratings
Absolute maximum ratings define the maximum operating conditions for Arria V GZ devices. The values are based on
experiments conducted with the devices and theoretical modeling of breakdown and damage mechanisms. The functional
operation of the device is not implied for these conditions.
Caution:
Conditions other than those listed in the following table may cause permanent damage to the device. Additionally, device
operation at the absolute maximum ratings for extended periods of time may have adverse effects on the device.
Table 80.
Absolute Maximum Ratings for Arria V GZ Devices
Symbol
Description
Minimum
Maximum
Unit
VCC
Power supply for core voltage and periphery circuitry
–0.5
1.35
V
VCCPT
Power supply for programmable power technology
–0.5
1.8
V
VCCPGM
Power supply for configuration pins
–0.5
3.9
V
VCC_AUX
Auxiliary supply for the programmable power technology
–0.5
3.4
V
VCCBAT
Battery back-up power supply for design security volatile key register
–0.5
3.9
V
VCCPD
I/O pre-driver power supply
–0.5
3.9
V
VCCIO
I/O power supply
–0.5
3.9
V
VCCD_FPLL
PLL digital power supply
–0.5
1.8
V
VCCA_FPLL
PLL analog power supply
–0.5
3.4
V
continued...
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Symbol
Description
Minimum
Maximum
Unit
VI
DC input voltage
–0.5
3.8
V
TJ
Operating junction temperature
–55
125
°C
TSTG
Storage temperature (No bias)
–65
150
°C
IOUT
DC output current per pin
–25
40
mA
Table 81.
Transceiver Power Supply Absolute Conditions for Arria V GZ Devices
Symbol
Description
Minimum
Maximum
Unit
VCCA_GXBL
Transceiver channel PLL power supply (left side)
–0.5
3.75
V
VCCA_GXBR
Transceiver channel PLL power supply (right side)
–0.5
3.75
V
VCCHIP_L
Transceiver hard IP power supply (left side)
–0.5
1.35
V
VCCHSSI_L
Transceiver PCS power supply (left side)
–0.5
1.35
V
VCCHSSI_R
Transceiver PCS power supply (right side)
–0.5
1.35
V
VCCR_GXBL
Receiver analog power supply (left side)
–0.5
1.35
V
VCCR_GXBR
Receiver analog power supply (right side)
–0.5
1.35
V
VCCT_GXBL
Transmitter analog power supply (left side)
–0.5
1.35
V
VCCT_GXBR
Transmitter analog power supply (right side)
–0.5
1.35
V
VCCH_GXBL
Transmitter output buffer power supply (left side)
–0.5
1.8
V
VCCH_GXBR
Transmitter output buffer power supply (right side)
–0.5
1.8
V
2.1.1.2. Maximum Allowed Overshoot and Undershoot Voltage
During transitions, input signals may overshoot to the voltage shown in the following table. They may also undershoot to –
2.0 V for input currents less than 100 mA and periods shorter than 20 ns.
The maximum allowed overshoot duration is specified as a percentage of high time over the lifetime of the device. A DC signal
is equivalent to 100% of the duty cycle.
For example, a signal that overshoots to 3.95 V can be at 3.95 V for only ~21% over the lifetime of the device; for a device
lifetime of 10 years, the overshoot duration amounts to ~2 years.
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2. Arria V GZ Device Datasheet
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Table 82.
Maximum Allowed Overshoot During Transitions for Arria V GZ Devices
Symbol
Vi (AC)
Description
AC input voltage
Condition (V)
Overshoot Duration as % @ TJ = 100°C
Unit
3.8
100
%
3.85
64
%
3.9
36
%
3.95
21
%
4
12
%
4.05
7
%
4.1
4
%
4.15
2
%
4.2
1
%
For an overshoot of 3.8 V, the percentage of high time for the overshoot can be as high as 100% over a 10-year period.
Percentage of high time is calculated as ([delta T]/T) × 100. This 10-year period assumes that the device is always turned on
with 100% I/O toggle rate and 50% duty cycle signal.
Figure 22.
Arria V GZ Devices Overshoot Duration
4V
3.95V
3.3 V
DT
T
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2.1.1.3. Recommended Operating Conditions
Table 83.
Recommended Operating Conditions for Arria V GZ Devices
Power supply ramps must all be strictly monotonic, without plateaus.
Symbol
Description
(118)
Condition
Minimum(117)
Typical
—
0.82
0.85
0.88
V
Maximum
(117)
Unit
VCC
Core voltage and periphery circuitry power supply
VCCPT
Power supply for programmable power technology
—
1.45
1.50
1.55
V
Auxiliary supply for the programmable power technology
—
2.375
2.5
2.625
V
I/O pre-driver (3.0 V) power supply
—
2.85
3.0
3.15
V
I/O pre-driver (2.5 V) power supply
—
2.375
2.5
2.625
V
I/O buffers (3.0 V) power supply
—
2.85
3.0
3.15
V
I/O buffers (2.5 V) power supply
—
2.375
2.5
2.625
V
I/O buffers (1.8 V) power supply
—
1.71
1.8
1.89
V
I/O buffers (1.5 V) power supply
—
1.425
1.5
1.575
V
I/O buffers (1.35 V) power supply
—
1.283
1.35
1.45
V
I/O buffers (1.25 V) power supply
—
1.19
1.25
1.31
V
I/O buffers (1.2 V) power supply
—
1.14
1.2
1.26
V
Configuration pins (3.0 V) power supply
—
2.85
3.0
3.15
V
Configuration pins (2.5 V) power supply
—
2.375
2.5
2.625
V
Configuration pins (1.8 V) power supply
—
1.71
1.8
1.89
V
PLL analog voltage regulator power supply
—
2.375
2.5
2.625
VCC_AUX
VCCPD
(119)
VCCIO
VCCPGM
VCCA_FPLL
V
continued...
(117)
The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance
requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(118)
The VCC core supply must be set to 0.9 V if the Partial Reconfiguration (PR) feature is used.
(119)
VCCPD must be 2.5 V when VCCIO is 2.5, 1.8, 1.5, 1.35, 1.25 or 1.2 V. VCCPD must be 3.0 V when VCCIO is 3.0 V.
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Condition
Minimum(117)
Typical
PLL digital voltage regulator power supply
—
1.45
1.5
1.55
V
Battery back-up power supply (For design security volatile
key register)
—
1.2
—
3.0
V
VI
DC input voltage
—
–0.5
—
3.6
V
VO
Output voltage
—
0
—
VCCIO
V
TJ
Operating junction temperature
Commercial
0
—
85
°C
Industrial
–40
—
100
°C
Standard POR
200 µs
—
100 ms
—
Fast POR
200 µs
—
4 ms
—
Typical
Maximum(121)
Unit
2.85
3.0
3.15
V
2.375
2.5
2.625
2.85
3.0
3.15
Symbol
Description
VCCD_FPLL
VCCBAT
(120)
tRAMP
Power supply ramp time
Maximum
(117)
Unit
2.1.1.3.1. Recommended Transceiver Power Supply Operating Conditions
Table 84.
Recommended Transceiver Power Supply Operating Conditions for Arria V GZ Devices
Symbol
VCCA_GXBL (122),
VCCA_GXBR
(123)
(122), (123)
Description
Transceiver channel PLL power supply (left side)
Transceiver channel PLL power supply (right side)
Minimum
(121)
V
continued...
(117)
The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance
requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(120)
If you do not use the design security feature in Arria V GZ devices, connect VCCBAT to a 1.2- to 3.0-V power supply. Arria V GZ poweron-reset (POR) circuitry monitors VCCBAT. Arria V GZ devices do not exit POR if VCCBAT is not powered up.
(121)
This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements.
Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(122)
This supply must be connected to 3.0 V if the CMU PLL, receiver CDR, or both, are configured at a base data rate > 6.5 Gbps. Up to
6.5 Gbps, you can connect this supply to either 3.0 V or 2.5 V.
(123)
When using ATX PLLs, the supply must be 3.0 V.
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Symbol
Description
Typical
Maximum(121)
2.375
2.5
2.625
Minimum
(121)
Unit
VCCHIP_L
Transceiver hard IP power supply (left side)
0.82
0.85
0.88
V
VCCHSSI_L
Transceiver PCS power supply (left side)
0.82
0.85
0.88
V
VCCHSSI_R
Transceiver PCS power supply (right side)
0.82
0.85
0.88
V
VCCR_GXBL (124)
Receiver analog power supply (left side)
0.82
0.85
0.88
V
0.97
1.0
1.03
1.03
1.05
1.07
0.82
0.85
0.88
0.97
1.0
1.03
1.03
1.05
1.07
0.82
0.85
0.88
0.97
1.0
1.03
1.03
1.05
1.07
0.82
0.85
0.88
0.97
1.0
1.03
1.03
1.05
1.07
VCCR_GXBR (124)
VCCT_GXBL (124)
VCCT_GXBR (124)
Receiver analog power supply (right side)
Transmitter analog power supply (left side)
Transmitter analog power supply (right side)
V
V
V
VCCH_GXBL
Transmitter output buffer power supply (left side)
1.425
1.5
1.575
V
VCCH_GXBR
Transmitter output buffer power supply (right side)
1.425
1.5
1.575
V
(121)
This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements.
Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
(124)
This supply must be connected to 1.0 V if the transceiver is configured at a data rate > 6.5 Gbps, and to 1.05 V if configured at a
data rate > 10.3 Gbps when DFE is used. For data rate up to 6.5 Gbps, you can connect this supply to 0.85 V.
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2.1.1.3.2. Transceiver Power Supply Requirements
Table 85.
Transceiver Power Supply Voltage Requirements for Arria V GZ Devices
Conditions
VCCR_GXB and VCCT_GXB
If BOTH of the following conditions are true:
• Data rate > 10.3 Gbps.
• DFE is used.
If
•
•
•
ANY of the following conditions are true (126) :
ATX PLL is used.
Data rate > 6.5Gbps.
DFE (data rate ≤ 10.3 Gbps), AEQ, or EyeQ feature is used.
If
•
•
•
ALL of the following conditions are true:
ATX PLL is not used.
Data rate ≤ 6.5Gbps.
DFE, AEQ, and EyeQ are not used.
1.05
(125)
VCCA_GXB
VCCH_GXB
Unit
3.0
1.5
V
1.0
0.85
2.5
2.1.1.4. DC Characteristics
2.1.1.4.1. Supply Current
Standby current is the current drawn from the respective power rails used for power budgeting.
Use the Excel-based Early Power Estimator (EPE) to get supply current estimates for your design because these currents vary
greatly with the resources you use.
Related Information
•
Early Power Estimator User Guide
For more information about the EPE tool.
•
Power Analysis chapter, Intel Quartus Prime Handbook
For more information about power analysis.
(125)
If the VCCR_GXB and VCCT_GXB supplies are set to 1.0 V or 1.05 V, they cannot be shared with the VCC core supply. If the
VCCR_GXB and VCCT_GXB are set to 0.85 V, they can be shared with the VCC core supply.
(126)
Choose this power supply voltage requirement option if you plan to upgrade your design later with any of the listed conditions.
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2.1.1.4.2. Power Consumption
Intel offers two ways to estimate power consumption for a design—the Excel-based Early Power Estimator and the Intel
Quartus Prime Power Analyzer feature.
Note:
You typically use the interactive Excel-based EPE before designing the FPGA to get a magnitude estimate of the device power.
The Intel Quartus Prime Power Analyzer provides better quality estimates based on the specifics of the design after you
complete place-and-route. The Power Analyzer can apply a combination of user-entered, simulation-derived, and estimated
signal activities that, when combined with detailed circuit models, yields very accurate power estimates.
Related Information
•
Early Power Estimator User Guide
For more information about the EPE tool.
•
Power Analysis chapter, Intel Quartus Prime Handbook
For more information about power analysis.
2.1.1.4.3. I/O Pin Leakage Current
Table 86.
I/O Pin Leakage Current for Arria V GZ Devices
If VO = VCCIO to VCCIOMax, 100 µA of leakage current per I/O is expected.
Min
Typ
Max
Unit
II
Symbol
Input pin
Description
VI = 0 V to VCCIOMAX
Conditions
–30
—
30
µA
IOZ
Tri-stated I/O pin
VO = 0 V to VCCIOMAX
–30
—
30
µA
2.1.1.4.4. Bus Hold Specifications
Table 87.
Bus Hold Parameters for Arria V GZ Devices
Parameter
Symbol
Conditions
VCCIO
1.2 V
Low sustaining
current
ISUSL
VIN > VIL
1.5 V
Unit
1.8 V
2.5 V
3.0 V
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
22.5
—
25.0
—
30.0
—
50.0
—
70.0
—
µA
continued...
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Parameter
Symbol
Conditions
VCCIO
1.2 V
1.5 V
Unit
1.8 V
2.5 V
3.0 V
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
–22.5
—
–25.0
—
–30.0
—
–50.0
—
–70.0
—
µA
(maximum)
High sustaining
current
ISUSH
VIN < VIH
(minimum)
Low overdrive
current
IODL
0V < VIN < VCCIO
—
120
—
160
—
200
—
300
—
500
µA
High overdrive
current
IODH
0V < VIN < VCCIO
—
–120
—
–160
—
–200
—
–300
—
–500
µA
Bus-hold trip
point
VTRIP
—
0.45
0.95
0.50
1.00
0.68
1.07
0.70
1.70
0.80
2.00
V
2.1.1.4.5. On-Chip Termination (OCT) Specifications
If you enable OCT calibration, calibration is automatically performed at power-up for I/Os connected to the calibration block.
Table 88.
OCT Calibration Accuracy Specifications for Arria V GZ Devices
OCT calibration accuracy is valid at the time of calibration only.
Symbol
Description
Conditions
Calibration Accuracy
C3, I3L
C4, I4
Unit
25-Ω RS
Internal series termination with calibration (25-Ω
setting)
VCCIO = 3.0, 2.5, 1.8, 1.5, 1.2 V
±15
±15
%
50-Ω RS
Internal series termination with calibration (50-Ω
setting)
VCCIO = 3.0, 2.5, 1.8, 1.5, 1.2 V
±15
±15
%
34-Ω and 40-Ω RS
Internal series termination with calibration (34-Ω
and 40-Ω setting)
VCCIO = 1.5, 1.35, 1.25, 1.2 V
±15
±15
%
48-Ω, 60-Ω, 80-Ω, and 240-Ω RS
Internal series termination with calibration (48Ω, 60-Ω, 80-Ω, and 240-Ω setting)
VCCIO = 1.2 V
±15
±15
%
50-Ω RT
Internal parallel termination with calibration (50Ω setting)
VCCIO = 2.5, 1.8, 1.5, 1.2 V
–10 to +40
–10 to
+40
%
continued...
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Symbol
Conditions
Calibration Accuracy
Unit
C3, I3L
C4, I4
20-Ω, 30-Ω, 40-Ω, 60-Ω, and 120Ω RT
Internal parallel termination with calibration (20Ω , 30-Ω, 40-Ω, 60-Ω, and 120-Ω setting)
VCCIO = 1.5, 1.35, 1.25 V
–10 to +40
–10 to
+40
%
60-Ω and 120-Ω RT
Internal parallel termination with calibration (60Ω and 120-Ω setting)
VCCIO = 1.2
–10 to +40
–10 to
+40
%
25-Ω RS_left_shift
Internal left shift series termination with
calibration (25-Ω RS_left_shift setting)
VCCIO = 3.0, 2.5, 1.8, 1.5, 1.2 V
±15
±15
%
Table 89.
OCT Without Calibration Resistance Tolerance Specifications for Arria V GZ Devices
Symbol
Description
Conditions
Resistance Tolerance
C3, I3L
C4, I4
Unit
25-Ω R, 50-Ω RS
Internal series termination without calibration
(25-Ω setting)
VCCIO = 3.0 and 2.5 V
±40
±40
%
25-Ω RS
Internal series termination without calibration
(25-Ω setting)
VCCIO = 1.8 and 1.5 V
±40
±40
%
25-Ω RS
Internal series termination without calibration
(25-Ω setting)
VCCIO = 1.2 V
±50
±50
%
50-Ω RS
Internal series termination without calibration
(50-Ω setting)
VCCIO = 1.8 and 1.5 V
±40
±40
%
50-Ω RS
Internal series termination without calibration
(50-Ω setting)
VCCIO = 1.2 V
±50
±50
%
100-Ω RD
Internal differential termination (100-Ω setting)
VCCIO = 2.5 V
±25
±25
%
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Figure 23.
OCT Variation Without Re-Calibration for Arria V GZ Devices
(
ROCT = RSCAL 1 + ( dR x
dT
T ) ± ( dR x
dV
V)
(
Notes:
1. The ROCT value shows the range of OCT resistance with the variation of temperature and VCCIO.
2. RSCAL is the OCT resistance value at power-up.
3. ΔT is the variation of temperature with respect to the temperature at power-up.
4. ΔV is the variation of voltage with respect to the VCCIO at power-up.
5. dR/dT is the percentage change of RSCAL with temperature.
6. dR/dV is the percentage change of RSCAL with voltage.
Table 90.
OCT Variation after Power-Up Calibration for Arria V GZ Devices
Valid for a VCCIO range of ±5% and a temperature range of 0° to 85°C.
Symbol
dR/dV
dR/dT
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Description
OCT variation with voltage without re-calibration
OCT variation with temperature without re-calibration
VCCIO (V)
Typical
Unit
3.0
0.0297
%/mV
2.5
0.0344
1.8
0.0499
1.5
0.0744
1.2
0.1241
3.0
0.189
2.5
0.208
1.8
0.266
1.5
0.273
1.2
0.317
%/°C
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2.1.1.4.6. Pin Capacitance
Table 91.
Pin Capacitance for Arria V GZ Devices
Maximum
Unit
CIOTB
Symbol
Input capacitance on the top and bottom I/O pins
Description
6
pF
CIOLR
Input capacitance on the left and right I/O pins
6
pF
COUTFB
Input capacitance on dual-purpose clock output and feedback pins
6
pF
2.1.1.4.7. Hot Socketing
Table 92.
Hot Socketing Specifications for Arria V GZ Devices
Symbol
IIOPIN (DC)
DC current per I/O pin
IIOPIN (AC)
AC current per I/O pin
IXCVR-TX (DC)
DC current per transceiver transmitter pin
IXCVR-RX (DC)
DC current per transceiver receiver pin
(127)
Maximum
300 μA
8 mA
(127)
100 mA
50 mA
The I/O ramp rate is 10 ns or more. For ramp rates faster than 10 ns, |IIOPIN| = C dv/dt, in which C is the I/O pin capacitance and
dv/dt is the slew rate.
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2.1.1.4.8. Internal Weak Pull-Up Resistor
Table 93.
Internal Weak Pull-Up Resistor for Arria V GZ Devices
All I/O pins have an option to enable the weak pull-up resistor except the configuration, test, and JTAG pins. The internal weak pull-down feature is only available
for the JTAG TCK pin. The typical value for this internal weak pull-down resistor is approximately 25 kΩ .
Symbol
RPU
Description
VCCIO Conditions (V)
Value of the I/O pin pull-up resistor before and
during configuration, as well as user mode if you
enable the programmable pull-up resistor option.
(128)
Value
(129)
Unit
3.0 ±5%
25
kΩ
2.5 ±5%
25
kΩ
1.8 ±5%
25
kΩ
1.5 ±5%
25
kΩ
1.35 ±5%
25
kΩ
1.25 ±5%
25
kΩ
1.2 ±5%
25
kΩ
2.1.1.5. I/O Standard Specifications
The VOL and VOH values are valid at the corresponding IOH and IOL, respectively.
Table 94.
Single-Ended I/O Standards for Arria V GZ Devices
I/O Standard
VOL (V)
VOH (V)
Min
Typ
Max
Min
Max
Min
Max
Max
Min
LVTTL
2.85
3
3.15
–0.3
0.8
1.7
3.6
0.4
LVCMOS
2.85
3
3.15
–0.3
0.8
1.7
3.6
2.375
2.5
2.625
–0.3
0.7
1.7
3.6
2.5 V
VCCIO (V)
VIL (V)
VIH (V)
IOL (mA)
IOH (mA)
2.4
2
–2
0.2
VCCIO – 0.2
0.1
–0.1
0.4
2
1
–1
continued...
(128)
The pin pull-up resistance values may be lower if an external source drives the pin higher than VCCIO.
(129)
These specifications are valid with a ±10% tolerance to cover changes over PVT.
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I/O Standard
VCCIO (V)
VIH (V)
VOL (V)
VOH (V)
IOL (mA)
IOH (mA)
Min
Typ
Max
Min
Max
Min
Max
Max
Min
1.8 V
1.71
1.8
1.89
–0.3
0.35 ×
VCCIO
0.65 ×
VCCIO
VCCIO + 0.3
0.45
VCCIO – 0.45
2
–2
1.5 V
1.425
1.5
1.575
–0.3
0.35 ×
VCCIO
0.65 ×
VCCIO
VCCIO + 0.3
0.25 × VCCIO
0.75 × VCCIO
2
–2
1.2 V
1.14
1.2
1.26
–0.3
0.35 ×
VCCIO
0.65 ×
VCCIO
VCCIO + 0.3
0.25 × VCCIO
0.75 × VCCIO
2
–2
Table 95.
Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications for Arria V GZ Devices
I/O Standard
VCCIO (V)
VREF (V)
VTT (V)
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
SSTL-2
Class I, II
2.375
2.5
2.625
0.49 × VCCIO
0.5 × VCCIO
0.51 ×
VCCIO
VREF – 0.04
VREF
VREF + 0.04
SSTL-18
Class I, II
1.71
1.8
1.89
0.833
0.9
0.969
VREF – 0.04
VREF
VREF + 0.04
SSTL-15
Class I, II
1.425
1.5
1.575
0.49 × VCCIO
0.5 × VCCIO
0.51 ×
VCCIO
0.49 × VCCIO
0.5 × VCCIO
0.51 × VCCIO
SSTL-135
Class I, II
1.283
1.35
1.418
0.49 × VCCIO
0.5 × VCCIO
0.51 ×
VCCIO
0.49 × VCCIO
0.5 × VCCIO
0.51 × VCCIO
SSTL-125
Class I, II
1.19
1.25
1.26
0.49 × VCCIO
0.5 × VCCIO
0.51 ×
VCCIO
0.49 × VCCIO
0.5 × VCCIO
0.51 × VCCIO
SSTL-12
Class I, II
1.14
1.20
1.26
0.49 × VCCIO
0.5 × VCCIO
0.51 ×
VCCIO
0.49 × VCCIO
0.5 × VCCIO
0.51 × VCCIO
HSTL-18
Class I, II
1.71
1.8
1.89
0.85
0.9
0.95
—
VCCIO/2
—
HSTL-15
Class I, II
1.425
1.5
1.575
0.68
0.75
0.9
—
VCCIO/2
—
HSTL-12
Class I, II
1.14
1.2
1.26
0.47 × VCCIO
0.5 × VCCIO
0.53 ×
VCCIO
—
VCCIO/2
—
HSUL-12
1.14
1.2
1.3
0.49 × VCCIO
0.5 × VCCIO
0.51 ×
VCCIO
—
—
—
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Table 96.
Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications for Arria V GZ Devices
I/O Standard
VIL(DC) (V)
VIH(DC) (V)
VIL(AC) (V)
VIH(AC) (V)
VOL (V)
VOH (V)
Iol (mA)
Ioh (mA)
Min
Max
Min
Max
Max
Min
Max
Min
SSTL-2 Class I
–0.3
VREF – 0.15
VREF + 0.15
VCCIO + 0.3
VREF – 0.31
VREF + 0.31
VTT – 0.608
VTT + 0.608
8.1
–8.1
SSTL-2 Class II
–0.3
VREF – 0.15
VREF + 0.15
VCCIO + 0.3
VREF – 0.31
VREF + 0.31
VTT – 0.81
VTT + 0.81
16.2
–16.2
SSTL-18 Class I
–0.3
VREF –
0.125
VREF +
0.125
VCCIO + 0.3
VREF – 0.25
VREF + 0.25
VTT – 0.603
VTT + 0.603
6.7
–6.7
SSTL-18 Class II
–0.3
VREF –
0.125
VREF +
0.125
VCCIO + 0.3
VREF – 0.25
VREF + 0.25
0.28
VCCIO – 0.28
13.4
–13.4
SSTL-15 Class I
—
VREF – 0.1
VREF + 0.1
—
VREF – 0.175
VREF + 0.175
0.2 × VCCIO
0.8 × VCCIO
8
–8
SSTL-15 Class II
—
VREF – 0.1
VREF + 0.1
—
VREF – 0.175
VREF + 0.175
0.2 × VCCIO
0.8 × VCCIO
16
–16
SSTL-135
Class I, II
—
VREF – 0.09
VREF + 0.09
—
VREF – 0.16
VREF + 0.16
0.2 * VCCIO
0.8 * VCCIO
—
—
SSTL-125
Class I, II
—
VREF – 0.85
VREF + 0.85
—
VREF – 0.15
VREF + 0.15
0.2 * VCCIO
0.8 * VCCIO
—
—
SSTL-12
Class I, II
—
VREF – 0.1
VREF + 0.1
—
VREF – 0.15
VREF + 0.15
0.2 * VCCIO
0.8 * VCCIO
—
—
HSTL-18 Class I
—
VREF – 0.1
VREF + 0.1
—
VREF – 0.2
VREF + 0.2
0.4
VCCIO – 0.4
8
–8
HSTL-18 Class II
—
VREF – 0.1
VREF + 0.1
—
VREF – 0.2
VREF + 0.2
0.4
VCCIO – 0.4
16
–16
HSTL-15 Class I
—
VREF – 0.1
VREF + 0.1
—
VREF – 0.2
VREF + 0.2
0.4
VCCIO – 0.4
8
–8
HSTL-15 Class II
—
VREF – 0.1
VREF + 0.1
—
VREF – 0.2
VREF + 0.2
0.4
VCCIO – 0.4
16
–16
HSTL-12 Class I
–0.15
VREF – 0.08
VREF + 0.08
VCCIO +
0.15
VREF – 0.15
VREF + 0.15
0.25 × VCCIO
0.75 × VCCIO
8
–8
HSTL-12 Class II
–0.15
VREF – 0.08
VREF + 0.08
VCCIO +
0.15
VREF – 0.15
VREF + 0.15
0.25 × VCCIO
0.75 × VCCIO
16
–16
—
VREF – 0.13
VREF + 0.13
—
VREF – 0.22
VREF + 0.22
0.1 × VCCIO
0.9 × VCCIO
—
—
HSUL-12
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Table 97.
Differential SSTL I/O Standards for Arria V GZ Devices
I/O Standard
VCCIO (V)
VSWING(DC) (V)
VX(AC) (V)
VSWING(AC) (V)
Min
Typ
Max
Min
Max
Min
Typ
Max
Min
Max
2.375
2.5
2.625
0.3
VCCIO + 0.6
VCCIO/2 –
0.2
—
VCCIO/2 +
0.2
0.62
VCCIO + 0.6
SSTL-18 Class I, II
1.71
1.8
1.89
0.25
VCCIO + 0.6
VCCIO/2 –
0.175
—
VCCIO/2 +
0.175
0.5
VCCIO + 0.6
SSTL-15 Class I, II
1.425
1.5
1.575
0.2
(130)
VCCIO/2 –
0.15
—
VCCIO/2 +
0.15
0.35
—
SSTL-135
Class I, II
1.283
1.35
1.45
0.2
(130)
VCCIO/2 –
0.15
VCCIO/2
VCCIO/2 +
0.15
2(VIH(AC) VREF)
2(VIL(AC) - VREF)
SSTL-125
Class I, II
1.19
1.25
1.31
0.18
(130)
VCCIO/2 –
0.15
VCCIO/2
VCCIO/2 +
0.15
2(VIH(AC) VREF)
—
SSTL-12
Class I, II
1.14
1.2
1.26
0.18
—
VREF
–0.15
VCCIO/2
VREF + 0.15
–0.30
0.30
SSTL-2 Class I, II
Table 98.
Differential HSTL and HSUL I/O Standards for Arria V GZ Devices
I/O Standard
VCCIO (V)
VDIF(DC) (V)
VX(AC) (V)
VCM(DC) (V)
VDIF(AC) (V)
Min
Typ
Max
Min
Max
Min
Typ
Max
Min
Typ
Max
Min
Max
HSTL-18 Class I, II
1.71
1.8
1.89
0.2
—
0.78
—
1.12
0.78
—
1.12
0.4
—
HSTL-15 Class I, II
1.425
1.5
1.575
0.2
—
0.68
—
0.9
0.68
—
0.9
0.4
—
HSTL-12 Class I, II
1.14
1.2
1.26
0.16
VCCIO +
0.3
—
0.5 × VCCIO
—
0.4 ×
VCCIO
0.5
×
VCCI
0.6 ×
VCCIO
0.3
VCCIO +
0.48
0.6 ×
VCCIO
0.44
0.44
O
HSUL-12
1.14
1.2
1.3
0.26
0.26
0.5 ×
VCCIO –
0.12
0.5 × VCCIO
0.5 × VCCIO
+ 0.12
0.4 ×
VCCIO
0.5
×
VCCI
O
(130)
The maximum value for VSWING(DC) is not defined. However, each single-ended signal needs to be within the respective single-ended
limits (VIH(DC) and VIL(DC)).
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Table 99.
Differential I/O Standard Specifications for Arria V GZ Devices
I/O Standard
VCCIO (V)
Min
PCML
(134)
(135)
RSDS (HIO)
(136)
Max
VID (mV)
Min
(132)
Condition
VICM(DC) (V)
Max
Min
Condition
VOD (V)
Max
Min
(133)
Typ
VOCM (V)
Max
Min
Typ
(133)
Max
Transmitter, receiver, and input reference clock pins of the high-speed transceivers use the PCML I/O standard. For transmitter, receiver, and reference clock
I/O pin specifications, refer to the "Transceiver Performance Specifications" section.
2.5 V LVDS
BLVDS
Typ
(131)
2.375
2.5
2.625
100
VCM = 1.25 V
—
0.05
DMAX ≤
700 Mbps
1.8
0.247
—
0.6
1.125
1.25
1.375
—
1.05
DMAX >
700 Mbps
1.55
0.247
—
0.6
1.125
1.25
1.375
2.375
2.5
2.625
100
—
—
—
—
—
—
—
—
—
—
—
2.375
2.5
2.625
100
VCM = 1.25 V
—
0.3
—
1.4
0.1
0.2
0.6
0.5
1.2
1.4
continued...
(131)
Differential inputs are powered by VCCPD which requires 2.5 V.
(132)
The minimum VID value is applicable over the entire common mode range, VCM.
(133)
RL range: 90 ≤ RL ≤ 110 Ω.
(134)
For optimized LVDS receiver performance, the receiver voltage input range must be between 0.25 V to 1.6 V for data rates above 700
Mbps, and 0 V to 1.85 V for data rates below 700 Mbps.
(135)
There are no fixed VICM, VOD, and VOCM specifications for BLVDS. They depend on the system topology.
(136)
For optimized RSDS receiver performance, the receiver voltage input range must be between 0.25 V to 1.45 V.
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I/O Standard
VCCIO (V)
(131)
VID (mV)
(132)
VICM(DC) (V)
VOD (V)
(133)
VOCM (V)
(133)
Min
Typ
Max
Min
Condition
Max
Min
Condition
Max
Min
Typ
Max
Min
Typ
Max
Mini-LVDS
(HIO) (137)
2.375
2.5
2.625
200
—
600
0.4
—
1.325
0.25
—
0.6
1
1.2
1.4
LVPECL
(138), (139)
—
—
—
300
—
—
0.6
DMAX ≤
700 Mbps
1.8
—
—
—
—
—
—
—
—
—
300
—
—
1
DMAX >
700 Mbps
1.6
—
—
—
—
—
—
Related Information
Glossary on page 169
(131)
Differential inputs are powered by VCCPD which requires 2.5 V.
(132)
The minimum VID value is applicable over the entire common mode range, VCM.
(133)
RL range: 90 ≤ RL ≤ 110 Ω.
(137)
For optimized Mini-LVDS receiver performance, the receiver voltage input range must be between 0.3 V to 1.425 V.
(138)
LVPECL is only supported on dedicated clock input pins.
(139)
For optimized LVPECL receiver performance, the receiver voltage input range must be between 0.85 V to 1.75 V for data rate above
700 Mbps and 0.45 V to 1.95 V for data rate below 700 Mbps.
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2.2. Switching Characteristics
2.2.1. Transceiver Performance Specifications
2.2.1.1. Reference Clock
Table 100.
Reference Clock Specifications for Arria V GZ Devices
Speed grades shown refer to the PMA Speed Grade in the device ordering code. The maximum data rate could be restricted by the Core/PCS speed grade. Contact
your Intel Sales Representative for the maximum data rate specifications in each speed grade combination offered. For more information about device ordering
codes, refer to the Arria V Device Overview.
Symbol/Description
Conditions
Transceiver Speed Grade 2
Min
Typ
Max
Transceiver Speed Grade 3
Min
Typ
Unit
Max
Reference Clock
Supported I/O Standards
Dedicated reference clock pin
1.2-V PCML, 1.4-V PCML, 1.5-V PCML, 2.5-V PCML, Differential LVPECL, LVDS, and HCSL
RX reference clock pin
1.4-V PCML, 1.5-V PCML, 2.5-V PCML, LVPECL, and LVDS
Input Reference Clock Frequency
(CMU PLL) (140)
—
40
—
710
40
—
710
MHz
Input Reference Clock Frequency
(ATX PLL)(140)
—
100
—
710
100
—
710
MHz
Rise time
Measure at ±60 mV of
differential signal (141)
—
—
400
—
—
400
ps
Fall time
Measure at ±60 mV of
differential signal (141)
—
—
400
—
—
400
Duty cycle
—
45
—
55
45
—
55
%
Spread-spectrum modulating clock
frequency
PCI Express (PCIe)
30
—
33
30
—
33
kHz
Spread-spectrum downspread
PCIe
—
0 to
–0.5
—
—
0 to
–0.5
—
%
continued...
(140)
The input reference clock frequency options depend on the data rate and the device speed grade.
(141)
REFCLK performance requires to meet transmitter REFCLK phase noise specification.
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Symbol/Description
Conditions
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Min
Typ
Max
Min
Typ
Max
Unit
On-chip termination resistors
—
—
100
—
—
100
—
Ω
Absolute VMAX
Dedicated reference clock pin
—
—
1.6
—
—
1.6
V
—
—
1.2
—
—
1.2
Absolute VMIN
RX reference clock pin
—
–0.4
—
—
–0.4
—
—
V
Peak-to-peak differential input voltage
—
200
—
1600
200
—
1600
mV
VICM (AC coupled)
Dedicated reference clock pin
1000/900/850
RX reference clock pin
VICM (DC coupled)
HCSL I/O standard for PCIe
reference clock
Transmitter REFCLK Phase Noise
(622 MHz) (144)
1.0/0.9/0.85
(142)
1000/900/850
(143)
(142)
mV
1.0/0.9/0.85(143)
mV
250
—
550
250
—
550
mV
100 Hz
—
—
-70
—
—
-70
dBc/Hz
1 kHz
—
—
-90
—
—
-90
dBc/Hz
10 kHz
—
—
-100
—
—
-100
dBc/Hz
100 kHz
—
—
-110
—
—
-110
dBc/Hz
≥1 MHz
—
—
-120
—
—
-120
dBc/Hz
Transmitter REFCLK Phase Jitter
(100 MHz) (145)
10 kHz to 1.5 MHz
(PCIe)
—
—
3
—
—
3
ps (rms)
RREF
—
—
1800 ±1%
—
—
1800 ±1%
—
Ω
(142)
The reference clock common mode voltage is equal to the VCCR_GXB power supply level.
(143)
This supply follows VCCR_GXB
(144)
To calculate the REFCLK phase noise requirement at frequencies other than 622 MHz, use the following formula: REFCLK phase noise
at f(MHz) = REFCLK phase noise at 622 MHz + 20*log(f/622).
(145)
To calculate the REFCLK rms phase jitter requirement for PCIe at reference clock frequencies other than 100 MHz, use the following
formula:
REFCLK rms phase jitter at f(MHz) = REFCLK rms phase jitter at 100 MHz × 100/f.
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Related Information
Arria V Device Overview
For more information about device ordering codes.
2.2.1.2. Transceiver Clocks
Table 101.
Transceiver Clocks Specifications for Arria V GZ Devices
Speed grades shown refer to the PMA Speed Grade in the device ordering code. The maximum data rate could be restricted by the Core/PCS speed grade. Contact
your Intel Sales Representative for the maximum data rate specifications in each speed grade combination offered. For more information about device ordering
codes, refer to the Arria V Device Overview.
Symbol/Description
Conditions
fixedclk clock frequency
PCIe
Receiver Detect
Reconfiguration clock (mgmt_clk_clk)
frequency
—
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Unit
Min
Typ
Max
Min
Typ
Max
—
100 or
125
—
—
100 or
125
—
MHz
100
—
125
100
—
125
MHz
Related Information
Arria V Device Overview
For more information about device ordering codes.
2.2.1.3. Receiver
Table 102.
Receiver Specifications for Arria V GZ Devices
Speed grades shown refer to the PMA Speed Grade in the device ordering code. The maximum data rate could be restricted by the Core/PCS speed grade. Contact
your Intel Sales Representative for the maximum data rate specifications in each speed grade combination offered. For more information about device ordering
codes, refer to the Arria V Device Overview.
Symbol/Description
Conditions
Transceiver Speed Grade 2
Min
Supported I/O Standards
Data rate (Standard PCS)
Typ
Transceiver Speed Grade 3
Max
Min
Typ
Max
9900
600
—
8800
Unit
1.4-V PCML, 1.5-V PCML, 2.5-V PCML, LVPECL, and LVDS
(146), (147)
—
600
—
Mbps
continued...
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Symbol/Description
Data rate (10G PCS)
(146), (147)
Absolute VMAX for a receiver pin
(148)
Conditions
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Unit
Min
Typ
Max
Min
Typ
Max
—
600
—
12500
600
—
10312.5
Mbps
—
—
—
1.2
—
—
1.2
V
Absolute VMIN for a receiver pin
—
–0.4
—
—
–0.4
—
—
V
Maximum peak-to-peak differential input
voltage VID (diff p-p) before device
configuration
—
—
—
1.6
—
—
1.6
V
Maximum peak-to-peak differential input
voltage VID (diff p-p) after device
configuration (149)
VCCR_GXB = 1.0 V
(VICM = 0.75 V)
—
—
1.8
—
—
1.8
V
VCCR_GXB = 0.85 V
(VICM = 0.6 V)
—
—
2.4
—
—
2.4
V
—
85
—
—
85
—
—
mV
85−Ω setting
—
85 ±
30%
—
—
85 ±
30%
—
Ω
100−Ω setting
—
100 ±
30%
—
—
100 ±
30%
—
Ω
120−Ω setting
—
120 ±
30%
—
—
120 ±
30%
—
Ω
Minimum differential eye opening at receiver
serial input pins (150)(151)
Differential on-chip termination resistors
continued...
(146)
The line data rate may be limited by PCS-FPGA interface speed grade.
(147)
To support data rates lower than the minimum specification through oversampling, use the CDR in LTR mode only.
(148)
The device cannot tolerate prolonged operation at this absolute maximum.
(149)
The maximum peak to peak differential input voltage VID after device configuration is equal to 4 × (absolute VMAX for receiver pin VICM).
(150)
The differential eye opening specification at the receiver input pins assumes that Receiver Equalization is disabled. If you enable
Receiver Equalization, the receiver circuitry can tolerate a lower minimum eye opening, depending on the equalization level.
(151)
Minimum eye opening of 85 mV is only for the unstressed input eye condition.
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Symbol/Description
VICM (AC and DC coupled)
tLTR (152)
tLTD
(153)
tLTD_manual
(154)
tLTR_LTD_manual
(155)
Programmable equalization
(AC Gain)
Programmable DC gain
Conditions
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Unit
Min
Typ
Max
Min
Typ
Max
150−Ω setting
—
150 ±
30%
—
—
150 ±
30%
—
Ω
VCCR_GXB = 0.85 V
full bandwidth
—
600
—
—
600
—
mV
VCCR_GXB = 0.85 V
half bandwidth
—
600
—
—
600
—
mV
VCCR_GXB = 1.0 V
full bandwidth
—
700
—
—
700
—
mV
VCCR_GXB = 1.0 V
half bandwidth
—
700
—
—
700
—
mV
—
—
—
10
—
—
10
µs
—
4
—
—
4
—
—
µs
—
4
—
—
4
—
—
µs
—
15
—
—
15
—
—
µs
Full bandwidth (6.25 GHz)
Half bandwidth (3.125 GHz)
—
—
16
—
—
16
dB
DC gain setting = 0
—
0
—
—
0
—
dB
DC gain setting = 1
—
2
—
—
2
—
dB
continued...
(152)
tLTR is the time required for the receive CDR to lock to the input reference clock frequency after coming out of reset.
(153)
tLTD is time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high.
(154)
tLTD_manual is the time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high
when the CDR is functioning in the manual mode.
(155)
tLTR_LTD_manual is the time the receiver CDR must be kept in lock to reference (LTR) mode after the rx_is_lockedtoref signal goes
high when the CDR is functioning in the manual mode.
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Symbol/Description
Conditions
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Unit
Min
Typ
Max
Min
Typ
Max
DC gain setting = 2
—
4
—
—
4
—
dB
DC gain setting = 3
—
6
—
—
6
—
dB
DC gain setting = 4
—
8
—
—
8
—
dB
Related Information
Arria V Device Overview
For more information about device ordering codes.
2.2.1.4. Transmitter
Table 103.
Transmitter Specifications for Arria V GZ Devices
Speed grades shown refer to the PMA Speed Grade in the device ordering code. The maximum data rate could be restricted by the Core/PCS speed grade. Contact
your Intel Sales Representative for the maximum data rate specifications in each speed grade combination offered. For more information about device ordering
codes, refer to the Arria V Device Overview.
Symbol/Description
Supported I/O Standards
Conditions
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Min
Typ
Max
Min
Typ
Max
Unit
1.4-V and 1.5-V PCML
Data rate (Standard PCS)
—
600
—
9900
600
—
8800
Mbps
Data rate (10G PCS)
—
600
—
12500
600
—
10312.5
Mbps
85-Ω setting
—
85 ±
20%
—
—
85 ±
20%
—
Ω
100-Ω setting
—
100 ±
20%
—
—
100 ±
20%
—
Ω
120-Ω setting
—
120 ±
20%
—
—
120 ±
20%
—
Ω
150-Ω setting
—
150 ±
20%
—
—
150 ±
20%
—
Ω
VOCM (AC coupled)
0.65-V setting
—
650
—
—
650
—
mV
VOCM (DC coupled)
—
—
650
—
—
650
—
Differential on-chip termination resistors
mV
continued...
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Symbol/Description
Conditions
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Unit
Min
Typ
Max
Min
Typ
Max
Tx VCM = 0.5 V and slew rate of
15 ps
—
—
15
—
—
15
ps
Intra-transceiver block transmitter channel-tochannel skew
x6 PMA bonded mode
—
—
120
—
—
120
ps
Inter-transceiver block transmitter channel-tochannel skew
xN PMA bonded mode
—
—
500
—
—
500
ps
Intra-differential pair skew
Related Information
Arria V Device Overview
For more information about device ordering codes.
2.2.1.5. CMU PLL
Table 104.
CMU PLL Specifications for Arria V GZ Devices
Speed grades shown refer to the PMA Speed Grade in the device ordering code. The maximum data rate could be restricted by the Core/PCS speed grade. Contact
your Intel Sales Representative for the maximum data rate specifications in each speed grade combination offered. For more information about device ordering
codes, refer to the Arria V Device Overview.
Symbol/Description
Supported data range
tpll_powerdown
tpll_lock
(156)
(157)
Conditions
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Unit
Min
Typ
Max
Min
Typ
Max
—
600
—
12500
600
—
10312.5
Mbps
—
1
—
—
1
—
—
µs
—
10
—
—
10
µs
—
Related Information
Arria V Device Overview
For more information about device ordering codes.
(156)
tpll_powerdown is the PLL powerdown minimum pulse width.
(157)
tpll_lock is the time required for the transmitter CMU/ATX PLL to lock to the input reference clock frequency after coming out of reset.
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2.2.1.6. ATX PLL
Table 105.
ATX PLL Specifications for Arria V GZ Devices
Speed grades shown refer to the PMA Speed Grade in the device ordering code. The maximum data rate could be restricted by the Core/PCS speed grade. Contact
your Intel Sales Representative for the maximum data rate specifications in each speed grade combination offered. For more information about device ordering
codes, refer to the Arria V Device Overview.
Symbol/Description
Supported data rate range
Conditions
tpll_lock
(160)
Transceiver Speed Grade 3
Unit
Min
Typ
Max
Min
Typ
Max
VCO post-divider
L=2
8000
—
12500
8000
—
10312.5
Mbps
L=4
4000
—
6600
4000
—
6600
Mbps
2000
—
3300
2000
—
3300
Mbps
—
1
—
—
1
—
—
µs
—
—
—
10
—
—
10
µs
L=8
tpll_powerdown (159)
Transceiver Speed Grade 2
(158)
Related Information
•
Arria V Device Overview
For more information about device ordering codes.
•
Transceiver Clocking in Arria V Devices
For more information about clocking ATX PLLs.
•
Dynamic Reconfiguration in Arria V Devices
For more information about reconfiguring ATX PLLs.
(158)
This clock can be further divided by central or local clock dividers making it possible to use ATX PLL for data rates < 1 Gbps. For more
information about ATX PLLs, refer to the Transceiver Clocking in Arria V Devices chapter and the Dynamic Reconfiguration in Arria V
Devices chapter.
(159)
tpll_powerdown is the PLL powerdown minimum pulse width.
(160)
tpll_lock is the time required for the transmitter CMU/ATX PLL to lock to the input reference clock frequency after coming out of reset.
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2.2.1.7. Fractional PLL
Table 106.
Fractional PLL Specifications for Arria V GZ Devices
Speed grades shown refer to the PMA Speed Grade in the device ordering code. The maximum data rate could be restricted by the Core/PCS speed grade. Contact
your Intel Sales Representative for the maximum data rate specifications in each speed grade combination offered. For more information about device ordering
codes, refer to the Arria V Device Overview.
Symbol/Description
Conditions
Transceiver Speed Grade 2
Transceiver Speed Grade 3
Min
Typ
Max
Min
Typ
Max
Unit
Supported data range
—
600
—
3250/
3125(161)
600
—
3250/
3125 (161)
Mbps
tpll_powerdown(162)
—
1
—
—
1
—
—
µs
tpll_lock (163)
—
—
—
10
—
10
µs
Related Information
Arria V Device Overview
For more information about device ordering codes.
(161)
When you use fPLL as a TXPLL of the transceiver.
(162)
tpll_powerdown is the PLL powerdown minimum pulse width.
(163)
tpll_lock is the time required for the transmitter CMU/ATX PLL to lock to the input reference clock frequency after coming out of reset.
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2.2.1.8. Clock Network Data Rate
Table 107.
Clock Network Maximum Data Rate Transmitter Specifications
Valid data rates below the maximum specified in this table depend on the reference clock frequency and the PLL counter settings. Check the Parameter Editor
message during the Arria V Transceiver Native PHY Intel FPGA IP core instantiation.
Clock Network
ATX PLL
CMU PLL
Non-bonded Bonded Mode
Mode (Gbps)
(Gbps)
x1
(165)
x6
(165)
Channel
Span
(164)
fPLL
Non-bonded Bonded Mode
Mode (Gbps)
(Gbps)
Channel
Span
Non-bonded Bonded Mode
Mode (Gbps)
(Gbps)
Channel
Span
12.5
—
6
12.5
—
6
3.125
—
3
—
12.5
6
—
12.5
6
—
3.125
6
—
12.5
Side-wide
—
12.5
Side-wide
—
—
—
xN (PCIe)
—
8.0
8
—
5.0
8
—
—
—
xN (Arria V Transceiver
Native PHY Intel FPGA IP
core)
8.0
8.0
Up to 13
channels
above and
below PLL
7.99
7.99
Up to 13
channels
above and
below PLL
3.125
3.125
Up to 13
channels
above and
below PLL
—
8.01 to
9.8304
Up to 7
channels
above and
below PLL
x6 PLL Feedback
(166)
(164)
ATX PLL is recommended at 8 Gbps and above data rates for improved jitter performance.
(165)
Channel span is within a transceiver bank.
(166)
Side-wide channel bonding is allowed up to the maximum supported by the Arria V Transceiver Native PHY Intel FPGA IP core.
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2.2.1.9. Standard PCS Data Rate
Table 108.
Standard PCS Approximate Maximum Date Rate (Gbps) for Arria V GZ Devices
The maximum data rate is also constrained by the transceiver speed grade. Refer to the “Commercial and Industrial Speed Grade Offering for Arria V GZ Devices”
table for the transceiver speed grade.
Mode
(167)
FIFO
Register
Transceiver
Speed Grade
PMA Width
20
20
16
16
10
10
8
8
PCS/Core Width
40
20
32
16
20
10
16
8
2
C3, I3L
core speed grade
9.9
9
7.84
7.2
5.3
4.7
4.24
3.76
3
C4, I4
core speed grade
8.8
8.2
7.2
6.56
4.8
4.3
3.84
3.44
2
C3, I3L
core speed grade
9.9
9
7.92
7.2
4.9
4.,5
3.92
3.6
3
C4, I4
core speed grade
8.8
8.2
7.04
6.56
4.4
4.1
3.52
3.28
Related Information
Operating Conditions on page 100
(167)
The Phase Compensation FIFO can be configured in FIFO mode or register mode. In the FIFO mode, the pointers are not fixed, and
the latency can vary. In the register mode the pointers are fixed for low latency.
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2.2.1.10. 10G PCS Data Rate
Table 109.
Mode
10G PCS Approximate Maximum Data Rate (Gbps) for Arria V GZ Devices
(168)
Transceiver Speed
Grade
PMA Width
64
40
40
40
32
32
PCS Width
64
66/67
50
40
64/66/67
32
2
C3, I3L core speed grade
12.5
12.5
10.69
12.5
10.88
10.88
3
C4, I4 core speed grade
10.3125
10.3125
10.69
10.3125
9.92
9.92
2
C3, I3L core speed grade
12.5
12.5
10.69
12.5
10.88
10.88
3
C4, I4 core speed grade
10.3125
10.3125
10.69
10.3125
9.92
9.92
FIFO
Register
2.2.1.11. Typical VOD Settings
Table 110.
Typical VOD Setting for Arria V GZ Channel, TX Termination = 100 Ω
The tolerance is +/-20% for all VOD settings except for settings 2 and below.
Symbol
VOD differential peak to peak typical
VOD Setting
0
(169)
VOD Value (mV)
VOD Setting
VOD Value (mV)
0
32
640
1(169)
20
33
660
2(169)
40
34
680
3(169)
60
35
700
4(169)
80
36
720
5(169)
100
37
740
6
120
38
760
7
140
39
780
8
160
40
800
continued...
(168)
The Phase Compensation FIFO can be configured in FIFO mode or register mode. In the FIFO mode, the pointers are not fixed, and
the latency can vary. In the register mode the pointers are fixed for low latency.
(169)
If TX termination resistance = 100 Ω,this VOD setting is illegal.
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Symbol
VOD differential peak to peak typical
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VOD Setting
VOD Value (mV)
VOD Setting
VOD Value (mV)
9
180
41
820
10
200
42
840
11
220
43
860
12
240
44
880
13
260
45
900
14
280
46
920
15
300
47
940
16
320
48
960
17
340
49
980
18
360
50
1000
19
380
51
1020
20
400
52
1040
21
420
53
1060
22
440
54
1080
23
460
55
1100
24
480
56
1120
25
500
57
1140
26
520
58
1160
27
540
59
1180
28
560
60
1200
29
580
61
1220
30
600
62
1240
31
620
63
1260
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Figure 24.
AC Gain Curves for Arria V GZ Channels (full bandwidth)
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2.2.2. Core Performance Specifications
2.2.2.1. Clock Tree Specifications
Table 111.
Clock Tree Performance for Arria V GZ Devices
Symbol
Performance
Unit
C3, I3L
C4, I4
Global and Regional Clock
650
580
MHz
Periphery Clock
500
500
MHz
2.2.2.2. PLL Specifications
Table 112.
PLL Specifications for Arria V GZ Devices
Symbol
Min
Typ
Max
Unit
Input clock frequency (C3, I3L speed grade)
5
—
800
MHz
Input clock frequency (C4, I4 speed grade)
5
—
650
MHz
fINPFD
Input frequency to the PFD
5
—
325
MHz
fFINPFD
Fractional Input clock frequency to the PFD
50
—
160
MHz
PLL VCO operating range (C3, I3L speed grade)
600
—
1600
MHz
PLL VCO operating range (C4, I4 speed grade)
600
—
1300
MHz
40
—
60
fIN
(170)
fVCO
(171)
tEINDUTY
Parameter
Input clock or external feedback clock input duty cycle
%
continued...
(170)
This specification is limited in the Intel Quartus Prime software by the I/O maximum frequency. The maximum I/O frequency is
different for each I/O standard.
(171)
The VCO frequency reported by the Intel Quartus Prime software in the PLL Usage Summary section of the compilation report takes
into consideration the VCO post divider value. Therefore, if the VCO post divider value is 2, the frequency reported can be lower than
the fVCO specification.
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Symbol
Parameter
Min
Typ
Max
Unit
Output frequency for an internal global or regional clock (C3,
I3L speed grade)
—
—
650
MHz
Output frequency for an internal global or regional clock (C4,
I4 speed grade)
—
—
580
MHz
Output frequency for an external clock output (C3, I3L speed
grade)
—
—
667
MHz
Output frequency for an external clock output (C4, I4 speed
grade)
—
—
533
MHz
tOUTDUTY
Duty cycle for a dedicated external clock output (when set to
50%)
45
50
55
%
tFCOMP
External feedback clock compensation time
—
—
10
ns
fDYCONFIGCLK
Dynamic configuration clock for mgmt_clk and scanclk
—
—
100
MHz
tLOCK
Time required to lock from the end-of-device configuration or
deassertion of areset
—
—
1
ms
tDLOCK
Time required to lock dynamically (after switchover or
reconfiguring any non-post-scale counters/delays)
—
—
1
ms
fCLBW
PLL closed-loop low bandwidth
—
0.3
—
MHz
PLL closed-loop medium bandwidth
—
1.5
—
MHz
—
4
—
MHz
fOUT
(172)
fOUT_EXT
(172)
PLL closed-loop high bandwidth
(173)
tPLL_PSERR
Accuracy of PLL phase shift
—
—
±50
ps
tARESET
Minimum pulse width on the areset signal
10
—
—
ns
Input clock cycle-to-cycle jitter (fREF ≥ 100 MHz)
—
—
0.15
tINCCJ
(174), (175)
UI (p-p)
continued...
(172)
This specification is limited by the lower of the two: I/O fMAX or fOUT of the PLL.
(173)
High bandwidth PLL settings are not supported in external feedback mode.
(174)
A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you must provide a clean clock source with
jitter < 120 ps.
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Symbol
Parameter
Min
Typ
Max
Unit
-750
—
+750
ps (p-p)
Period Jitter for dedicated clock output in integer PLL (fOUT ≥
100 MHz)
—
—
175
ps (p-p)
Period Jitter for dedicated clock output in integer PLL (fOUT <
100 Mhz)
—
—
17.5
mUI (p-p)
Period Jitter for dedicated clock output in fractional PLL (fOUT
≥ 100 MHz)
—
—
250(179),
175(177)
ps (p-p)
Period Jitter for dedicated clock output in fractional PLL (fOUT
< 100 MHz)
—
—
25(179),
17.5 (177)
mUI (p-p)
Cycle-to-cycle Jitter for a dedicated clock output in integer
PLL (fOUT ≥ 100 MHz)
—
—
175
ps (p-p)
Cycle-to-cycle Jitter for a dedicated clock output in integer
PLL (fOUT < 100 MHz)
—
—
17.5
mUI (p-p)
Cycle-to-cycle Jitter for a dedicated clock output in fractional
PLL (fOUT ≥ 100 MHz)
—
—
250(179),
175 (177)
ps (p-p)
Cycle-to-cycle Jitter for a dedicated clock output in fractional
PLL (fOUT < 100 MHz)
—
—
25(179),
17.5 (177)
mUI (p-p)
Period Jitter for a clock output on a regular I/O in integer PLL
(fOUT ≥ 100 MHz)
—
—
600
ps (p-p)
Period Jitter for a clock output on a regular I/O in integer PLL
(fOUT < 100 MHz)
—
—
60
mUI (p-p)
Input clock cycle-to-cycle jitter (fREF < 100 MHz)
tOUTPJ_DC
(176)
tFOUTPJ_DC
tOUTCCJ_DC
(176)
(176)
tFOUTCCJ_DC
tOUTPJ_IO,
(176)
(176), (178)
continued...
(175)
The fREF is fIN/N specification applies when N = 1.
(176)
Peak-to-peak jitter with a probability level of 10–12 (14 sigma, 99.99999999974404% confidence level). The output jitter specification
applies to the intrinsic jitter of the PLL, when an input jitter of 30 ps is applied. The external memory interface clock output jitter
specifications use a different measurement method and are available in the Worst-Case DCD on Arria V GZ I/O Pins table.
(177)
This specification only covered fractional PLL for low bandwidth. The fVCO for fractional value range 0.20–0.80 must be ≥ 1200 MHz.
(178)
The external memory interface clock output jitter specifications use a different measurement method, which is available in the
Memory Output Clock Jitter Specification for Arria V GZ Devices table.
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Symbol
Min
Typ
Max
Unit
Period Jitter for a clock output on a regular I/O in fractional
PLL (fOUT ≥ 100 MHz)
—
—
600
ps (p-p)
Period Jitter for a clock output on a regular I/O in fractional
PLL (fOUT < 100 MHz)
—
—
60
mUI (p-p)
Cycle-to-cycle Jitter for a clock output on a regular I/O in
integer PLL (fOUT ≥ 100 MHz)
—
—
600
ps (p-p)
Cycle-to-cycle Jitter for a clock output on a regular I/O in
integer PLL (fOUT < 100 MHz)
—
—
60
mUI (p-p)
Cycle-to-cycle Jitter for a clock output on a regular I/O in
fractional PLL (fOUT ≥ 100 MHz)
—
—
600
ps (p-p)
Cycle-to-cycle Jitter for a clock output on a regular I/O in
fractional PLL (fOUT < 100 MHz)
—
—
60
mUI (p-p)
Period Jitter for a dedicated clock output in cascaded PLLs
(fOUT ≥ 100 MHz)
—
—
175
ps (p-p)
Period Jitter for a dedicated clock output in cascaded PLLS
(fOUT < 100 MHz)
—
—
17.5
mUI (p-p)
dKBIT
Bit number of Delta Sigma Modulator (DSM)
8
24
32
Bits
kVALUE
Numerator of Fraction
128
8388608
2147483648
—
fRES
Resolution of VCO frequency (fINPFD = 100 MHz)
390625
5.96
0.023
Hz
tFOUTPJ_IO
tOUTCCJ_IO
(176), (178), (179)
(176), (178)
tFOUTCCJ_IO
(176), (178), (179)
tCASC_OUTPJ_DC (176),
(180)
Parameter
Related Information
•
Duty Cycle Distortion (DCD) Specifications on page 150
•
DLL Range Specifications on page 148
(179)
This specification only covered fractional PLL for low bandwidth. The fVCO for fractional value range 0.05–0.95 must be ≥ 1000 MHz.
(180)
The cascaded PLL specification is only applicable with the following condition:
a. Upstream PLL: 0.59Mhz ≤ Upstream PLL BW < 1 MHz
b. Downstream PLL: Downstream PLL BW > 2 MHz
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2.2.2.3. DSP Block Specifications
Table 113.
DSP Block Performance Specifications for Arria V GZ Devices
Mode
Performance
C3, I3L
Unit
C4
I4
Modes using One DSP Block
Three 9 × 9
480
420
MHz
One 18 × 18
480
420
400
MHz
Two partial 18 × 18 (or 16 × 16)
480
420
400
MHz
One 27 × 27
400
350
MHz
One 36 × 18
400
350
MHz
One sum of two 18 × 18 (One sum of two 16 × 16)
400
350
MHz
One sum of square
400
350
MHz
One 18 × 18 plus 36 (a × b) + c
400
350
MHz
Modes using Two DSP Blocks
Three 18 × 18
400
350
MHz
One sum of four 18 × 18
380
300
MHz
One sum of two 27 × 27
380
One sum of two 36 × 18
380
300
MHz
One complex 18 × 18
400
350
MHz
One 36 × 36
380
300
MHz
300
290
MHz
Modes using Three DSP Blocks
One complex 18 × 25
340
275
265
MHz
Modes using Four DSP Blocks
One complex 27 × 27
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350
310
MHz
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2.2.2.4. Memory Block Specifications
Table 114.
Memory Block Performance Specifications for Arria V GZ Devices
To achieve the maximum memory block performance, use a memory block clock that comes through global clock routing from an on-chip PLL set to 50% output
duty cycle. Use the Intel Quartus Prime software to report timing for this and other memory block clocking schemes.
When you use the error detection cyclical redundancy check (CRC) feature, there is no degradation in FMAX.
Memory
MLAB
Mode
(181)
Unit
Memory
C3
C4
I3L
I4
Single port, all supported widths
0
1
400
315
400
315
MHz
Simple dual-port, x32/x64 depth
0
1
400
315
400
315
MHz
(181)
0
1
533
400
533
400
MHz
ROM, all supported widths
0
1
500
450
500
450
MHz
Single-port, all supported widths
0
1
650
550
500
450
MHz
Simple dual-port, all supported widths
0
1
650
550
500
450
MHz
Simple dual-port with the read-during-write option
set to Old Data, all supported widths
0
1
455
400
455
400
MHz
Simple dual-port with ECC enabled, 512 × 32
0
1
400
350
400
350
MHz
Simple dual-port with ECC and optional pipeline
registers enabled, 512 × 32
0
1
500
450
500
450
MHz
True dual port, all supported widths
0
1
650
550
500
450
MHz
ROM, all supported widths
0
1
650
550
500
450
MHz
The FMAX specification is only achievable with Fitter options, MLAB Implementation In 16-Bit Deep Mode enabled.
Arria V Device Datasheet
138
Performance
ALUTs
Simple dual-port, x16 depth
M20K Block
Resources Used
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2.2.2.5. Temperature Sensing Diode Specifications
Table 115.
Internal Temperature Sensing Diode Specification for Arria V GZ Devices
Temperature Range
Accuracy
Offset Calibrated
Option
Sampling Rate
Conversion Time(182)
Resolution
Minimum Resolution
with no Missing
Codes
–40°C to 100°C
±8°C
No
1 MHz, 500 kHz
< 100 ms
8 bits
8 bits
Table 116.
External Temperature Sensing Diode Specifications for Arria V GZ Devices
Description
Min
Typ
Max
Unit
Ibias, diode source current
8
—
200
μA
Vbias, voltage across diode
0.3
—
0.9
V
—
—
1
Figure 30.
FPP Configuration Timing Waveform When the DCLK-to-DATA[] Ratio is >1 ,
Timing when using a MAX II device, MAX V device, or microprocessor as an external host.
tCFG
nCONFIG
nSTATUS (3)
CONF_DONE (4)
DCLK (6)
tCF2ST1
tCF2CK
tSTATUS
tCF2ST0
tCL
tCH
tCF2CD tST2CK
1
DATA[31..0] (8)
User I/O
tDSU
High-Z
2
r
1
(8)
2
tCLK
Word 0
Word 1
tDH
tDH
r
(7)
1
Word 3
r
1
(5)
2
User Mode
Word (n-1)
User Mode
INIT_DONE (9)
tCD2UM
Notes:
1. To find out the DCLK-to-DATA[] ratio for your system, refer to the "DCLK-to-DATA[] Ratio for Arria V GZ Devices" table.
2. The beginning of this waveform shows the device in user mode. In user mode, nCONFIG, nSTATUS, and CONF_DONE
are at logic high levels. When nCONFIG is pulled low, a reconfiguration cycle begins.
3. After power-up, the Arria V GZ device holds nSTATUS low for the time as specified by the POR delay.
4. After power-up, before and during configuration, CONF_DONE is low.
5. Do not leave DCLK floating after configuration. DCLK is ignored after configuration is complete. It can toggle high or
low if required.
6. “r” denotes the DCLK-to-DATA[] ratio. For the DCLK-to-DATA[] ratio based on the decompression and the design
security feature enable settings, refer to the "DCLK-to-DATA[] Ratio for Arria V GZ Devices" table.
7. If needed, pause DCLK by holding it low. When DCLK restarts, the external host must provide data on the DATA[31..0]
pins prior to sending the first DCLK rising edge.
8. To ensure a successful configuration, send the entire configuration data to the Arria V GZ device. CONF_DONE is
released high after the Arria V GZ device receives all the configuration data successfully. After CONF_DONE goes
high, send two additional falling edges on DCLK to begin initialization and enter user mode.
9. After the option bit to enable the INIT_DONE pin is configured into the device, the INIT_DONE goes low.
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Table 135.
FPP Timing Parameters for Arria V GZ Devices When the DCLK-to-DATA[] Ratio is >1
Use these timing parameters when you use the decompression and design security features.
Symbol
Parameter
Minimum
Maximum
Unit
tCF2CD
nCONFIG low to CONF_DONE low
—
600
ns
tCF2ST0
nCONFIG low to nSTATUS low
—
600
ns
tCFG
nCONFIG low pulse width
2
—
μs
tSTATUS
tCF2ST1
tCF2CK
(216)
nSTATUS low pulse width
nCONFIG high to nSTATUS high
268
—
1,506
(214)
μs
1,506
(215)
μs
nCONFIG high to first rising edge on DCLK
1,506
—
μs
tST2CK(216)
nSTATUS high to first rising edge of DCLK
2
—
μs
tDSU
DATA[] setup time before rising edge on DCLK
5.5
—
ns
(217)
—
s
tDH
DATA[] hold time after rising edge on DCLK
N–1/fDCLK
tCH
DCLK high time
0.45 × 1/fMAX
—
s
tCL
DCLK low time
0.45 × 1/fMAX
—
s
tCLK
DCLK period
1/fMAX
—
s
fMAX
DCLK frequency (FPP ×8/×16)
—
125
MHz
DCLK frequency (FPP ×32)
—
100
MHz
tR
Input rise time
—
40
ns
tF
Input fall time
—
40
ns
continued...
(214)
You can obtain this value if you do not delay configuration by extending the nCONFIG or nSTATUS low pulse width.
(215)
You can obtain this value if you do not delay configuration by externally holding the nSTATUS low.
(216)
If nSTATUS is monitored, follow the tST2CK specification. If nSTATUS is not monitored, follow the tCF2CK specification.
(217)
N is the DCLK-to-DATA ratio and fDCLK is the DCLK frequency the system is operating.
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Symbol
Parameter
(218)
tCD2UM
CONF_DONE high to user mode
tCD2CU
CONF_DONE high to CLKUSR enabled
tCD2UMC
CONF_DONE high to user mode with CLKUSR option on
Minimum
Maximum
Unit
175
437
μs
4 × maximum DCLK
period
—
—
tCD2CU +
(8576 × CLKUSR period)
—
—
(219)
Related Information
•
DCLK-to-DATA[] Ratio (r) for FPP Configuration on page 152
•
Configuration, Design Security, and Remote System Upgrades in Arria V Devices
(218)
The minimum and maximum numbers apply only if you use the internal oscillator as the clock source for initializing the device.
(219)
To enable the CLKUSR pin as the initialization clock source and to obtain the maximum frequency specification on these pins, refer to
the Initialization section of the Configuration, Design Security, and Remote System Upgrades in Arria V Devices chapter.
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2.3.4. Active Serial Configuration Timing
Figure 31.
AS Configuration Timing
Timing waveform for the active serial (AS) x1 mode and AS x4 mode configuration timing.
tCF2ST1
nCONFIG
nSTATUS
CONF_DONE
nCSO
DCLK
AS_DATA0/ASDO
tCO
Read Address
tDH
tSU
AS_DATA1 (1)
bit 0
bit 1
bit (n - 2)
bit (n - 1)
tCD2UM(2)
INIT_DONE (3)
User I/O
User Mode
Notes:
1. If you are using AS ×4 mode, this signal rep rese nts the AS_DATA[3..0] and EPCQ sends in 4-bits of d ata for each DCLKcycle.
2. The initialization clock can be from internal oscillator or CLKUSR pin
.
3. After the option bit to enable the INIT_DONE pin isconfigu red into the d evice, the INIT_DONE oges low.
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Table 136.
AS Timing Parameters for AS x1 and AS x4 Configurations in Arria V GZ Devices
The minimum and maximum numbers apply only if you choose the internal oscillator as the clock source for initializing the device.
tCF2CD, tCF2ST0, tCFG, tSTATUS, and tCF2ST1 timing parameters are identical to the timing parameters for PS mode listed in the "PS Timing Parameters for Arria V GZ
Devices" table.
Symbol
Parameter
Condition
Minimum
Maximum
Unit
tCO
(220)
DCLK falling edge to AS_DATA0/ASDO output
—
—
4
ns
tSU
(221)
Data setup time before falling edge on DCLK
—
1.5
—
ns
tDH
(221)
Data hold time after falling edge on DCLK
–3 speed grade
3.7
—
ns
–4 speed grade
3.9
—
ns
—
175
437
μs
(222)
tCD2UM
CONF_DONE high to user mode
tCD2CU
CONF_DONE high to CLKUSR enabled
—
4 × maximum DCLK period
—
—
tCD2UMC
CONF_DONE high to user mode with CLKUSR option on
—
tCD2CU + (8576 × CLKUSR
period)
—
—
(220)
Load capacitance for DCLK = 6 pF and AS_DATA/ASDO = 8 pF. Intel recommends obtaining the tCO for a given link (including receiver,
transmission lines, connectors, and termination resistors) through IBIS or HSPICE simulation.
(221)
To evaluate the data setup (tSU) and data hold time (tDH) slack on your board in order to ensure you are meeting the tSU and tDH
requirement, Intel recommends following the guideline in the "Evaluating Data Setup and Hold Timing Slack" chapter in AN822: Intel
FPGA Configuration Device Migration Guideline.
(222)
To enable the CLKUSR pin as the initialization clock source and to obtain the maximum frequency specification on this pin, refer to the
“Initialization” section of the Configuration, Design Security, and Remote System Upgrades in Arria V Devices chapter.
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Table 137.
DCLK Frequency Specification in the AS Configuration Scheme
This applies to the DCLK frequency specification when using the internal oscillator as the configuration clock source.
The AS multi-device configuration scheme does not support DCLK frequency of 100 MHz.
Minimum
Typical
Maximum
Unit
5.3
7.9
12.5
MHz
10.6
15.7
25.0
MHz
21.3
31.4
50.0
MHz
42.6
62.9
100.0
MHz
Related Information
•
Passive Serial Configuration Timing on page 163
•
Evaluating Data Setup and Hold Timing Slack chapter, AN822: Intel FPGA Configuration Device Migration Guideline
•
Configuration, Design Security, and Remote System Upgrades in Arria V Devices
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2.3.5. Passive Serial Configuration Timing
Figure 32.
PS Configuration Timing Waveform
Timing waveform for a passive serial (PS) configuration when using a MAX II device, MAX V device, or microprocessor as an external host.
tCFG
nCONFIG
nSTATUS (2)
CONF_DONE (3)
tCF2ST1
tCF2CK
tCF2ST0
tSTATUS
tCLK
tCH tCL
tCF2CD t
ST2CK
(4)
DCLK
DATA0
User I/O
(6)
tDH
Bit 0
Bit 1 Bit 2
tDSU
Bit 3
(5)
Bit (n-1)
User Mode
High-Z
INIT_DONE (7)
tCD2UM
Notes:
1. The beginning of this waveform shows the device in user mode. In user mode, nCONFIG, nSTATUS,
and CONF_DONE are at logic high levels. When nCONFIG is pulled low, a reconfiguration cycle begins.
2. After power-up, the Arria V GZ device holds nSTATUS low for the time of the POR delay.
3. After power-up, before and during configuration, CONF_DONE is low.
4. Do not leave DCLK floating after configuration. DCLK is ignored after configuration is complete.
It can toggle high or low if required.
5. DATA0 is available as a user I/O pin after configuration. The state of this pin depends on the
dual-purpose pin settings in the Device and Pins Option.
6. To ensure a successful configuration, send the entire configuration data to the Arria V GZ device.
CONF_DONE is released high after the Arria V GZ device receives all the configuration data
successfully. After CONF_DONE goes high, send two additional falling edges on DCLK to begin
initialization and enter user mode.
7. After the option bit to enable the INIT_DONE pin is configured into the device, the INIT_DONE goes low.
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Table 138.
PS Timing Parameters for Arria V GZ Devices
Symbol
Parameter
Minimum
Maximum
Unit
tCF2CD
nCONFIG low to CONF_DONE low
—
600
ns
tCF2ST0
nCONFIG low to nSTATUS low
—
600
ns
tCFG
nCONFIG low pulse width
2
—
μs
tSTATUS
tCF2ST1
268
nSTATUS low pulse width
nCONFIG high to nSTATUS high
—
1,506
(223)
μs
1,506
(224)
μs
tCF2CK
(225)
nCONFIG high to first rising edge on DCLK
1,506
—
μs
tST2CK
(225)
nSTATUS high to first rising edge of DCLK
2
—
μs
5.5
—
ns
0
—
ns
tDSU
DATA[] setup time before rising edge on DCLK
tDH
DATA[] hold time after rising edge on DCLK
tCH
DCLK high time
0.45 × 1/fMAX
—
s
tCL
DCLK low time
0.45 × 1/fMAX
—
s
tCLK
DCLK period
1/fMAX
—
s
fMAX
DCLK frequency
—
125
MHz
tCD2UM
CONF_DONE high to user mode
175
437
μs
tCD2CU
CONF_DONE high to CLKUSR enabled
4 × maximum DCLK period
—
—
tCD2UMC
CONF_DONE high to user mode with CLKUSR option on
tCD2CU + (8576 × CLKUSR
period) (227)
—
—
(226)
(223)
This value is applicable if you do not delay configuration by extending the nCONFIG or nSTATUS low pulse width.
(224)
This value is applicable if you do not delay configuration by externally holding the nSTATUS low.
(225)
If nSTATUS is monitored, follow the tST2CK specification. If nSTATUS is not monitored, follow the tCF2CK specification.
(226)
The minimum and maximum numbers apply only if you choose the internal oscillator as the clock source for initializing the device.
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Related Information
Configuration, Design Security, and Remote System Upgrades in Arria V Devices
2.3.6. Initialization
Table 139.
Initialization Clock Source Option and the Maximum Frequency for Arria V GZ Devices
Initialization Clock Source
Internal Oscillator
CLKUSR
(228)
DCLK
Configuration Schemes
Maximum Frequency (MHz)
Minimum Number of Clock Cycles
AS, PS, FPP
12.5
8576
PS, FPP
125
AS
100
PS, FPP
125
2.3.7. Configuration Files
Use the following table to estimate the file size before design compilation. Different configuration file formats, such as a
hexadecimal file (.hex) or tabular text file (.ttf) format, have different file sizes.
For the different types of configuration file and file sizes, refer to the Intel Quartus Prime software. However, for a specific
version of the Intel Quartus Prime software, any design targeted for the same device has the same uncompressed
configuration file size.
(227)
To enable the CLKUSR pin as the initialization clock source and to obtain the maximum frequency specification on these pins, refer to
the Initialization section of the Configuration, Design Security, and Remote System Upgrades in Arria V Devices chapter.
(228)
To enable CLKUSR as the initialization clock source, turn on the Enable user-supplied start-up clock (CLKUSR) option in the Intel
Quartus Prime software from the General panel of the Device and Pin Options dialog box.
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Table 140.
Uncompressed .rbf Sizes for Arria V GZ Devices
Variant
Arria V GZ
Table 141.
Member Code
Configuration .rbf Size (bits)
IOCSR .rbf Size (bits)
E1
137,598,880
562,208
E3
137,598,880
562,208
E5
213,798,880
561,760
E7
213,798,880
561,760
Minimum Configuration Time Estimation for Arria V GZ Devices
Variant
Arria V GZ
Member Code
Active Serial
(230)
Fast Passive Parallel
DCLK (MHz)
Min Config Time
(ms)
Width
DCLK (MHz)
Min Config Time
(ms)
E1
4
100
344
32
100
43
E3
4
100
344
32
100
43
E5
4
100
534
32
100
67
E7
4
100
534
32
100
67
The IOCSR .rbf size is specifically for the Configuration via Protocol (CvP) feature.
(230)
DCLK frequency of 100 MHz using external CLKUSR.
(231)
Max FPGA FPP bandwidth may exceed bandwidth available from some external storage or control logic.
Arria V Device Datasheet
(231)
Width
(229)
166
(229)
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2.3.8. Remote System Upgrades Circuitry Timing Specification
Table 142.
Remote System Upgrade Circuitry Timing Specifications
Parameter
tRU_nCONFIG
(232)
tRU_nRSTIMER
(233)
Minimum
Maximum
Unit
250
—
ns
250
—
ns
Related Information
•
Configuration, Design Security, and Remote System Upgrades in Arria V Devices
For more information about the reconfiguration input for the Remote Update Intel FPGA IP core, refer to the User
Watchdog Timer section.
•
Configuration, Design Security, and Remote System Upgrades in Arria V Devices
For more information about the reset_timer input for the Remote Update Intel FPGA IP core, refer to the Remote
System Upgrade State Machine section.
2.3.9. User Watchdog Internal Oscillator Frequency Specification
Table 143.
User Watchdog Internal Oscillator Frequency Specifications
Minimum
Typical
Maximum
Unit
5.3
7.9
12.5
MHz
2.4. I/O Timing
Intel offers two ways to determine I/O timing—the Excel-based I/O Timing and the Intel Quartus Prime Timing Analyzer.
(232)
This is equivalent to strobing the reconfiguration input of the Remote Update Intel FPGA IP core high for the minimum timing
specification. For more information, refer to the Remote System Upgrade State Machine section in the Configuration, Design Security,
and Remote System Upgrades in Arria V Devices chapter.
(233)
This is equivalent to strobing the reset_timer input of the Remote Update Intel FPGA IP core high for the minimum timing
specification. For more information, refer to the User Watchdog Timer section in the Configuration, Design Security, and Remote
System Upgrades in Arria V Devices chapter.
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Excel-based I/O timing provides pin timing performance for each device density and speed grade. The data is typically used
prior to designing the FPGA to get an estimate of the timing budget as part of the link timing analysis.
The Intel Quartus Prime Timing Analyzer provides a more accurate and precise I/O timing data based on the specifics of the
design after you complete place-and-route.
Related Information
Arria V Devices Documentation page
For the Excel-based I/O Timing spreadsheet.
2.4.1. Programmable IOE Delay
Table 144.
Parameter
IOE Programmable Delay for Arria V GZ Devices
(234)
Available
Settings
Min Offset
(235)
Fast Model
Slow Model
Unit
Industrial
Commercial
C3
C4
I3L
I4
D1
64
0
0.464
0.493
0.924
1.011
0.921
1.006
ns
D2
32
0
0.230
0.244
0.459
0.503
0.456
0.500
ns
D3
8
0
1.587
1.699
2.992
3.192
3.047
3.257
ns
D4
64
0
0.464
0.492
0.924
1.011
0.920
1.006
ns
D5
64
0
0.464
0.493
0.924
1.011
0.921
1.006
ns
D6
32
0
0.229
0.244
0.458
0.503
0.456
0.499
ns
(234)
You can set this value in the Intel Quartus Prime software by selecting D1, D2, D3, D4, D5, and D6 in the Assignment Name
column of Assignment Editor.
(235)
Minimum offset does not include the intrinsic delay.
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2.4.2. Programmable Output Buffer Delay
Table 145.
Programmable Output Buffer Delay for Arria V GZ Devices
You can set the programmable output buffer delay in the Intel Quartus Prime software by setting the Output Buffer Delay Control assignment to either
positive, negative, or both edges, with the specific values stated here (in ps) for the Output Buffer Delay assignment.
Symbol
DOUTBUF
Parameter
Typical
Unit
Rising and/or falling edge delay
0 (default)
ps
50
ps
100
ps
150
ps
2.5. Glossary
Table 146.
Glossary
Term
Differential I/O Standards
Definition
Receiver Input Waveforms
continued...
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Term
Definition
Single-Ended Waveform
Positive Channel (p) = VIH
VID
Negative Channel (n) = VIL
VCM
Ground
Differential Waveform
VID
p-n=0V
VID
Transmitter Output Waveforms
continued...
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Term
Definition
Single-Ended Waveform
Positive Channel (p) = VOH
VOD
Negative Channel (n) = VOL
VCM
Ground
Differential Waveform
VOD
p-n=0V
VOD
fHSCLK
Left and right PLL input clock frequency.
fHSDR
High-speed I/O block—Maximum and minimum LVDS data transfer rate
(fHSDR = 1/TUI), non-DPA.
fHSDRDPA
High-speed I/O block—Maximum and minimum LVDS data transfer rate
(fHSDRDPA = 1/TUI), DPA.
J
High-speed I/O block—Deserialization factor (width of parallel data bus).
JTAG Timing Specifications
JTAG Timing Specifications:
continued...
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Term
Definition
TMS
TDI
tJCH
tJCP
t JCL
tJPH
tJPSU
TCK
tJPZX
tJPXZ
tJPCO
TDO
PLL Specifications
Diagram of PLL Specifications
CLKOUT Pins
Switchover
CLK
fOUT_EXT
4
fIN
Core Clock
N
fINPFD
PFD
CP
LF
VCO fVCO
Counters
C 0..C 17
fOUT
GCLK
RCLK
Delta Sigma
Modulator
Key
Reconfigurable in User Mode
External Feedback
Note:
1. Core Clock can only be fed by dedicated clock input pins or PLL outputs.
RL
Receiver differential input discrete resistor (external to the Arria V GZ device).
SW (sampling window)
Timing Diagram—the period of time during which the data must be valid in order to capture it correctly. The setup and hold times determine
the ideal strobe position within the sampling window, as shown:
continued...
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Term
Definition
Bit Time
0.5 x TCCS
Single-ended voltage
referenced I/O standard
RSKM
Sampling Window
(SW)
RSKM
0.5 x TCCS
The JEDEC standard for SSTL and HSTL I/O defines both the AC and DC input signal values. The AC values indicate the voltage levels at which
the receiver must meet its timing specifications. The DC values indicate the voltage levels at which the final logic state of the receiver is
unambiguously defined. After the receiver input has crossed the AC value, the receiver changes to the new logic state.
The new logic state is then maintained as long as the input stays beyond the DC threshold. This approach is intended to provide predictable
receiver timing in the presence of input waveform ringing:
Single-Ended Voltage Referenced I/O Standard
V CCIO
V OH
V IH (AC )
V REF
V IH(DC )
V IL(DC )
V IL(AC )
V OL
V SS
tC
High-speed receiver and transmitter input and output clock period.
TCCS (channel-to-channelskew)
The timing difference between the fastest and slowest output edges, including tCO variation and clock skew, across channels driven by the
same PLL. The clock is included in the TCCS measurement (refer to the Timing Diagram figure under SW in this table).
tDUTY
High-speed I/O block—Duty cycle on the high-speed transmitter output clock.
tFALL
Signal high-to-low transition time (80-20%)
tINCCJ
Cycle-to-cycle jitter tolerance on the PLL clock input.
tOUTPJ_IO
Period jitter on the general purpose I/O driven by a PLL.
tOUTPJ_DC
Period jitter on the dedicated clock output driven by a PLL.
tRISE
Signal low-to-high transition time (20-80%)
continued...
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Term
Timing Unit Interval (TUI)
The timing budget allowed for skew, propagation delays, and the data sampling window.
(TUI = 1/(receiver input clock frequency multiplication factor) = tC/w)
VCM(DC)
DC common mode input voltage.
VICM
Input common mode voltage—The common mode of the differential signal at the receiver.
VID
Input differential voltage swing—The difference in voltage between the positive and complementary conductors of a differential transmission at
the receiver.
VDIF(AC)
AC differential input voltage—Minimum AC input differential voltage required for switching.
VDIF(DC)
DC differential input voltage— Minimum DC input differential voltage required for switching.
VIH
Voltage input high—The minimum positive voltage applied to the input which is accepted by the device as a logic high.
VIH(AC)
High-level AC input voltage
VIH(DC)
High-level DC input voltage
VIL
Voltage input low—The maximum positive voltage applied to the input which is accepted by the device as a logic low.
VIL(AC)
Low-level AC input voltage
VIL(DC)
Low-level DC input voltage
VOCM
Output common mode voltage—The common mode of the differential signal at the transmitter.
VOD
Output differential voltage swing—The difference in voltage between the positive and complementary conductors of a differential transmission
at the transmitter.
VSWING
Differential input voltage
VX
Input differential cross point voltage
VOX
Output differential cross point voltage
W
High-speed I/O block—clock boost factor
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2.6. Arria V GZ Device Datasheet Revision History
Document
Version
Changes
2019.04.26
Added a note for Conversion Time in the Internal Temperature Sensing Diode Specification for Arria V GZ Devices table.
2019.01.25
•
•
•
•
•
•
Date
February 2017
Added Arria V GZ Devices Overshoot Duration diagram.
Changed "VCO post-scale counter K value" to "VCO post divider value" in the fVCO note in the PLL Specifications for Arria V GZ Devices table.
Updated the AS Timing Parameters for AS ×1 and ×4 Configurations in Arria V GZ Devices table.
— Updated tDH specifications. These specifications are applicable to the commercial and industrial grade devices.
— Added note to tCO, tSU, and tDH.
Changed instances of Quartus II to Intel Quartus Prime.
Removed PowerPlay text from tool name.
Renamed IP cores as per Intel rebranding.
Version
2017.02.10
Changes
•
•
•
•
•
June 2016
December 2015
2016.06.20
2015.12.16
•
•
Changed the minimum value for tCD2UMC in the “FPP Timing Parameters for Arria V GZ Devices When the DCLK-to-DATA[] Ratio
is 1” table.
Changed the minimum value for tCD2UMC in the "FPP Timing Parameters for Arria V GZ Devices When the DCLK-to-DATA[] Ratio
is >1" table.
Changed the minimum value for tCD2UMC in the "AS Timing Parameters for AS x1 and AS x4 Configurations in Arria V GZ
Devices" table.
Changed the minimum value for tCD2UMC in the "PS Timing Parameters for Arria V GZ Devices" table.
Changed the minimum number of clock cycles value in the "Initialization Clock Source Option and the Maximum Frequency for
Arria V GZ Devices" table.
•
Changed column heading from "Value" to "Maximum" in the "Pin Capacitance for Arria V GZ Devices" table.
Changed the minimum supported data rate range values from "1000" to "2000" in the "ATX PLL Specifications for Arria V GZ
Devices" table.
Added the supported data rates for the following output standards using true LVDS output buffer types in the "High-Speed
Clock Specifications for Arria V GZ Devices" table:
— True RSDS output standard: data rates of up to 230 Mbps
— True mini-LVDS output standard: data rates of up to 340 Mbps
•
•
•
•
Removed the CDR ppm tolerance specification from the "Receiver Specifications for Arria V GZ Devices" table.
Removed transmitter rise and fall time specifications from the "Transmitter Specifications for Arria V GZ Devices" table.
Changed the .rbf sizes in the "Uncompressed .rbf Sizes for Arria V GZ Devices" table.
Added a footnote to the "Transmitter High-Speed I/O Specifications for Arria V GZ Devices" table.
continued...
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Date
June 2015
Version
2015.06.16
Changes
•
•
January 2015
2015.01.30
•
•
•
Added 240-Ω to the "OCT Calibration Accuracy Specifications for Arria V GZ Devices" table.
Changed the CDR PPM tolerance spec in the "Receiver Specifications for Arria V GZ Devices" table.
Added additional max data rate for fPLL in the "Fractional PLL Specifications for Arria V GZ Devices" table.
July 2014
3.8
•
•
•
•
•
•
•
Updated Table 21.
Updated Table 22 VOCM (DC Coupled) condition.
Updated the DCLK note to Figure 6, Figure 7, and Figure 9.
Added note to Table 5 and Table 6.
Added the DCLK specification to Table 50.
Added note to Table 51.
Updated the list of parameters in Table 53.
February 2014
3.7
Updated Table 28.
December 2013
3.6
•
•
Updated Table 2, Table 13, Table 18, Table 19, Table 22, Table 30, Table 33, Table 37, Table 38, Table 45, Table 46, Table 47,
Table 56, Table 49.
Updated “PLL Specifications”.
August 2013
3.5
Updated Table 28.
August 2013
3.4
•
•
Removed Preliminary tags for Table 2, Table 4, Table 5, Table 14, Table 27, Table 28, Table 29, Table 31, Table 32, Table 43,
Table 45, Table 46, Table 47, Table 48, Table 49, Table 50, and Table 54.
Updated Table 2 and Table 28.
June 2013
3.3
Updated Table 23, Table 28, Table 51, and Table 55.
May 2013
3.2
•
•
•
Added Table 23.
Updated Table 5, Table 22, Table 26, and Table 57.
Updated Figure 6, Figure 7, Figure 8, and Figure 9.
March 2013
3.1
•
•
Updated Table 2, Table 6, Table 7, Table 8, Table 19, Table 22, Table 26, Table 29, Table 52.
Updated “Maximum Allowed Overshoot and Undershoot Voltage”.
December 2012
3.0
Initial release.
Arria V Device Datasheet
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Changed the conditions for the reference clock rise and fall time and added a note to the condition in the "Reference Clock
Specifications for Arria V GZ Devices" table.
Added a note to the "Minimum differential eye opening at receiver serial input pins" specification in the "Receiver
Specifications for Arria V GZ Devices" table.
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