Intel® RealSense™ Camera R200
Embedded Infrared Assisted Stereovision 3D
Imaging System with Color Camera
Product Datasheet
R200 Intel Production Part Number: MM#939143
†
(X) Numeric characters representing configuration or programmed firmware at manufacturing
June 2016
Revision 001
Document: 334616-001
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Copyright © 2016, Intel Corporation. All rights reserved.
2
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Contents
1
Description and Features .................................................................................... 9
2
Overview ......................................................................................................... 10
2.1
2.2
2.3
2.4
2.5
3
Component Specification ................................................................................... 15
3.1
3.2
3.3
3.4
3.5
3.6
4
6.2
USB Composite Device ........................................................................... 23
6.1.1
Device Endpoints ...................................................................... 23
Power States ......................................................................................... 24
6.2.1
Power Consumption .................................................................. 24
System Integration ........................................................................................... 25
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
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Firmware Update (Windows* Only) .......................................................... 21
Infrared Camera Functions ...................................................................... 21
Color Camera Functions R200.................................................................. 21
System Interoperability ..................................................................................... 23
6.1
7
Embedded 3D Imaging System ................................................................ 19
Camera Video Stream Formats ................................................................ 19
Firmware ......................................................................................................... 21
5.1
5.2
5.3
6
Imaging ................................................................................................ 15
3.1.1
Color Imaging System ............................................................... 15
3.1.2
Infrared Imaging System ........................................................... 15
Infrared Light Projection ......................................................................... 16
Activity LED .......................................................................................... 17
Temperature Sensor............................................................................... 17
Camera Module Connector ...................................................................... 17
Other Components ................................................................................. 18
Functional Specification ..................................................................................... 19
4.1
4.2
5
R200 Description ................................................................................... 10
R200 Camera Module ............................................................................. 11
Components .......................................................................................... 12
Storage and Operating Conditions ............................................................ 13
Handling Conditions ............................................................................... 13
Integration Overview .............................................................................. 25
Module Stability ..................................................................................... 25
Camera Module Dimensions .................................................................... 27
Camera Module Mass.............................................................................. 27
Grounding ............................................................................................. 27
Motherboard Receptacle ......................................................................... 27
Shielding .............................................................................................. 28
Rear Cover Design Guidance ................................................................... 29
7.8.1
Transparent Cover Material ........................................................ 29
7.8.2
Gaskets ................................................................................... 30
7.8.3
Optical Isolation ....................................................................... 30
7.8.4
Dust Protection ........................................................................ 32
3
7.9
7.10
Thermal Design Guidance ....................................................................... 32
7.9.1
Thermal Limits ......................................................................... 33
7.9.2
Thermal Management ............................................................... 34
Motherboard Routing Considerations ........................................................ 36
7.10.1 Cable TX to RX Crossover .......................................................... 37
7.10.2 Power Gate Circuit .................................................................... 37
7.10.3 Platform Specific Routing Guidance ............................................. 38
7.10.4 Motherboard Receptacle ............................................................ 38
7.10.5 High Speed Cable Assembly ....................................................... 39
8
Calibration ....................................................................................................... 41
9
System BIOS ................................................................................................... 42
9.1
9.2
UPC (USB Port Capabilities) ..................................................................... 42
PLD (Physical Device Location) ................................................................ 42
10
Packaging and Labeling ..................................................................................... 44
11
Regulatory Compliance R200.............................................................................. 45
12
R200 Interconnect Cable Drawings ..................................................................... 47
13
R200 Connector Drawings .................................................................................. 48
14
Schematic Checklist .......................................................................................... 50
4
334616-001
List of Figures
Figure
Figure
Figure
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Figure
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Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
1-1. R200 Module Assembly .......................................................................................... 9
2-1. Example Color Stream .......................................................................................... 10
2-2. Example Depth Stream ......................................................................................... 11
2-3. R200 Module Form Factor...................................................................................... 11
2-4. Component Locations (Front View) ......................................................................... 13
3-1. Infrared Projector ................................................................................................. 16
4-1. Active Stereo Technology Overview ........................................................................ 19
6-1. USB Composite Device Hardware ID ....................................................................... 23
7-1. Z Direction Module Flex Example ............................................................................ 25
7-2. Y Direction Module Flex Example ............................................................................ 26
7-3. Twist Module Flex Example .................................................................................... 26
7-4. Receptacle Ground Bar Motherboard Connections ..................................................... 28
7-5. Example IR Transmission of Acceptable Cover Material ............................................. 30
7-6. Example of Light Leakage Effects ........................................................................... 31
7-7. Example of Gasket Material Placement .................................................................... 32
7-8. Example of Separated Windows for Cover Material ................................................... 32
7-9. System Component Placement ............................................................................... 33
7-10. Module Thermal Probe Points ............................................................................... 33
7-11. Module Thermal Solution Chassis or Frame Mount .................................................. 35
7-12. Module Mounting Chassis or Frame ....................................................................... 35
7-13. Module Thermal Solution Rear Cover Mount ........................................................... 35
7-14. Module Mounting Rear Cover ............................................................................... 36
7-15. Example of Host Platform Motherboard Routing ...................................................... 37
7-16. Module Platform Power Gate Example ................................................................... 38
7-17. System Receptacle Properties .............................................................................. 38
9-1. UPC Return Package Values ................................................................................... 42
9-2. PLD System Design Considerations ......................................................................... 43
10-1. Camera Module Label .......................................................................................... 44
12-1. Cable Mechanical Drawing ................................................................................... 47
13-1. R200 Receptacle Mechanical Drawing .................................................................... 48
13-2. R200 Interconnect Plug Mechanical Drawing .......................................................... 49
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5
List of Tables
Table
Table
Table
Table
Table
Table
Table
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Table
Table
Table
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Table
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Table
Table
Table
Table
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Table
Table
Table
Table
Table
Table
Table
Table
Table
6
2-1. Component Descriptions......................................................................................... 12
2-2. Storage and Operating Conditions ........................................................................... 13
2-3. Electrostatic Discharge Caution ............................................................................... 14
3-1. Color Camera Properties......................................................................................... 15
3-2. Infrared Camera Properties..................................................................................... 15
3-3. Infrared Projector Parameters ................................................................................. 16
3-4. Module Receptacle Pinout ....................................................................................... 17
3-5. Camera Module Functional Components ................................................................... 18
4-1. Supported Left/Right Infrared Camera Video Stream Formats and Modes ..................... 19
4-2. Supported Color Camera Video Stream Formats and Modes ........................................ 20
4-3. Supported Depth Video Stream Formats and Modes ................................................... 20
5-1. Left and Right IR Sensor Configuration ..................................................................... 21
5-2. RGB Sensor Configuration ...................................................................................... 21
6-1. USB Composite Device Endpoints ............................................................................ 23
6-2. Device Power States .............................................................................................. 24
6-3. Typical Power Consumption .................................................................................... 24
7-1. Module Bend and Twist Limits ................................................................................. 27
7-2. Component Case Temperature Limits ....................................................................... 33
7-3. Component Case Temperature vs. Junction Temperature ........................................... 34
7-4. Thermal Sensor vs. Laser Projector Junction Temperature .......................................... 34
7-5. Copper Foil Recommendation .................................................................................. 36
7-6. Heat Spreader Recommendation ............................................................................. 36
7-7. Receptacle Pin Out ................................................................................................ 38
7-8. Receptacle Characteristics ...................................................................................... 39
7-9. Plug Characteristics ............................................................................................... 39
7-10. Cable Assembly Specification ................................................................................ 39
7-11. Cable Assembly Interconnect Properties ................................................................. 40
9-1. UPC Elements ....................................................................................................... 42
9-2. PLD Elements........................................................................................................ 42
9-3. PLD Return Package Values .................................................................................... 43
10-1. Scan Code Fields ................................................................................................. 44
12-1. Cable Part Numbers ............................................................................................. 47
14-1. Motherboard Connector Signals ............................................................................. 50
14-2. USB_RX Motherboard Signals ................................................................................ 50
14-3. USB_TX Motherboard Signals ................................................................................ 50
14-4. Power Signals ..................................................................................................... 51
334616-001
Additional References
Reference document
Intel® RealSense™ Camera R200 3D CAD Files
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Document Number
334617-001
7
Revision History
Revision
Number
001
Description
•
Revision Date
Initial Release
June 2016
§§
8
334616-001
Description and Features
1
Description and Features
Figure 1-1. R200 Module Assembly
R200 Description
The Intel® RealSenseTM Camera R200 is a module that
implements a long range, stereovision 3D imaging
system.
The small size of the R200 module provides system
integrators flexibility to design into a wide range of
products.
Features
Minimum System Requirements
• Onboard Imaging ASIC.
• 1GB Disk Storage Space(1)
• VGA resolution depth capture from 0.4 to
2.8m(1)
• 2GB Memory(1)
• Infrared (IR) Laser Projector System (Class 1)
• R200 Interconnect Cable(2)
• Dimensions 101.56mm length x 9.55mm
height x 3.8mm width.
• USB3
(1)
Additional disk space and memory may be required for
certain applications. Refer to application minimum
requirements.
(2)
Provided by the system integrator. Cable design is
specific to system definition and meets R200 cable design
specifications.
(3)
Contact local Intel representative for latest OS and
platform support.
• Full HD RGB color stream.
(1)
Software may optimize within this range.
§§
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9
Overview
2
Overview
2.1
R200 Description
The R200 camera is a USB 3.0 device that can provide color, depth, and infrared video
streams. Depth video streams are like color video streams, except each pixel has a
value representing the distance away from the camera instead of color information. It
consists of an infrared laser projection system, two infrared and a full HD color
imaging sensors. The depth video stream is generated with stereo vision technology
assisted by the Infrared laser projector and the two infrared imaging sensors. Color
data is provided by the full HD color imaging sensor. The R200 module is not intended
to be the primary photography solution. It has the ability to synchronize with a high
resolution world facing camera for depth + photography applications.
Figure 2-1. Example Color Stream
10
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Overview
Figure 2-2. Example Depth Stream
The R200 3D camera is available in either a camera module or camera peripheral form
factor option.
2.2
R200 Camera Module
The R200 module form factor option is the final product form factor for system
integrators. This module should be integrated into a system chassis and connected
directly to a motherboard that implements an Intel® RealSense™ 3D Camera Rear
R200 compatible connector
Figure 2-3. R200 Module Form Factor
Camera Module
Cable (Not Included)
Note: Due to the variations in cable assemblies across system designs, a motherboard cable
will not be provided with this form factor option. System integrators should work with their
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11
Overview
respective cable suppliers to manufacture a cable according to the guidance provided in this
document.
2.3
Components
Table 2-1. Component Descriptions
Acronym
12
Definition
AR
Anti-Reflective (Coating)
ASIC
Application Specific Integrated Circuit
Baseline
Distance between Left and Right Infrared Imager
CMC
Common Mode Choke
EMI
Electromagnetic Interference
ESD
Electrostatic Discharge
FEA
Finite Element Analysis, a type of mechanical simulation
FHD
Full High Definition
FOP
Field of Projection (Horizontal/Vertical/Diagonal)
FOV
Field of View (Horizontal/Vertical/Diagonal)
GPIO
General Purpose Input/Output
IR
Infrared
LED
Light Emitting Diode
PCB
Printed Circuit Board
R200
Intel® RealSense™ R200
RFI
Radio Frequency Interference
TBD
To Be Determined
TDP
Thermal Design Power
TIM
Thermal Interface Material
TJ
Component Junction Temperature
USB
Universal Serial Bus
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Overview
Figure 2-4. Component Locations (Front View)
Note: Module shown without reinforcement frame to expose components.
2.4
Storage and Operating Conditions
Table 2-2. Storage and Operating Conditions
Condition
Storage (Still Air), Not
Operating
Description
Temperature (Sustained, Controlled)(1)
(2)
Temperature (Short Exposure)
Min
Max
0
40
o
70
o
-40
Temperature
C
C
90% RH, 30oC
Humidity, Non-Condensing
Operating(3) (Still Air)
Unit
0
50
o
C
NOTES:
1. Controlled conditions should be used for long term storage of product.
2. Short exposure represents temporary max limits acceptable for transportation conditions.
3. Component case temperature limits must be met for all operating temperatures, module
performance will degrade at higher temperatures.
2.5
Handling Conditions
The R200 has limited ESD protection built into the subassembly.
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13
Overview
Table 2-3. Electrostatic Discharge Caution
To provide a consistent ESD protection level during R200 system
assembly and rework, it is recommended that the JEDEC JESD625A requirements standard be incorporated into the ESD environment
controls.
§§
14
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Component Specification
3
Component Specification
3.1
Imaging
3.1.1
Color Imaging System
The color camera on the R200 camera module provides texture information. Usages
for the texture information include overlay on a depth image to create a color point
cloud and overlay on a 3d model for reconstruction.
Table 3-1. Color Camera Properties
Parameter
3.1.2
R200 Color Camera
Active Pixels
1920x1080
Sensor Aspect Ratio
16:9
Filter Type
IR Cut Filter
Focus
Fixed
Shutter Type
Rolling Shutter
Vertical Field of View
43o +/-2o
Horizontal Field of View
70o +/-2o
Diagonal Field of View
77o +/-4o
Infrared Imaging System
The module has two infrared cameras, they are identical parts and are configured with
identical settings. The imagers are labeled “left” and “right” from the perspective of
the camera module as shown in Figure 4-1.
Table 3-2. Infrared Camera Properties
Parameter
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Infrared Cameras
Active Pixels
640x480
Sensor Aspect Ratio
4:3
Filter Type
IR Band Pass
Focus
Fixed
Shutter Type
Global Shutter
Vertical Field of View
46o +/-5o
Horizontal Field of View
59o +/-5o
15
Component Specification
Parameter
Infrared Cameras
70o+/-4.5o
Diagonal Field of View
3.2
Infrared Light Projection
The infrared projector improves the ability of the stereo imaging system to determine
depth by projecting a static infrared pattern on the scene to increase texture on low
texture scenes. The projector contains a laser diode. The module is rated at class 1
level in normal operation. Do not modify or adjust the infrared projector or related
circuitry. The laser diode can reach harmful 3B levels when exposed.
Figure 3-1. Infrared Projector
Table 3-3. Infrared Projector Parameters
Parameter
16
Laser Projector
Projector
Static Infrared Pattern
Illuminating Component
Infrared Laser Diode
Laser Wavelength
859nm Nominal
R200 Laser Compliance
Class 1,
o
IEC 60825-1:2007 Edition 2
o
Vertical Field of Projection
60 +/-5
Horizontal Field of Projection
60o +/-5o
Diagonal Field of Projection
80o +/-5o
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Component Specification
3.3
Activity LED
The camera module integrates one activity LED to notify the user if either the infrared
camera or color camera is streaming data.
3.4
Temperature Sensor
The module is equipped with a thermal sensor that is used for laser safety. The
software library provides access to the thermal sensor but it is not intended to be used
by applications outside of development environments.
3.5
Camera Module Connector
The connector on the R200 camera module transmits the depth and color information
to the host system. It also provides power delivery to the module and a way to update
the module firmware. The data transfers are done over USB3.0 protocol. For more
information on the host platform requirements please see the platform design guide
chapter on depth camera module integration.
The receptacle mechanical drawing can be found as part of the thermal mechanical
design package.
The receptacle is designed for 10 insertion and removal cycles, additional
cycling may cause electrical or mechanical failures
Table 3-4. Module Receptacle Pinout
Pin
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Signal
Function
Description
1
GND
Power Delivery
Ground
2
USB3_SSTX-
USB3.0 Data
SuperSpeed TX Differential Pair Negative
3
USB3_SSTX+
USB3.0 Data
SuperSpeed TX Differential Pair Positive
4
GND
Power Delivery
Ground
5
USB3_SSRX-
USB3.0 Data
SuperSpeed RX Differential Pair Negative
6
USB3_SSRX+
USB3.0 Data
SuperSpeed RX Differential Pair Positive
7
GND
Power Delivery
Ground
8
RSVD
Reserved
Reserved (No Connect)
9
3.3VDC
Power Delivery
3.3V Image System Power
10
3.3VDC
Power Delivery
3.3V Image System Power
17
Component Specification
3.6
Other Components
The image system consists of additional components that interface directly to the
R200 ASIC. These components are described in table below.
Table 3-5. Camera Module Functional Components
Feature
Requirement
Laser Driver
The camera module implements a laser driver which controls the infrared
laser within the infrared laser projector system.
Laser Thermal
Control
The camera module implements a laser safety control circuit that adjusts
laser drive output based on operating conditions.
Flash Memory
The camera module implements flash memory for storing the module
component firmware and module calibration data.
1.8V Voltage
Regulator
The camera module implements a DC to DC voltage converter to generate
1.8 V from the 2.5 V supply.
2.8V Voltage
Regulators
The camera module implements 2 DC to DC voltage converters to generate
2.8 V from the 3.3 V supply.
2.5V Voltage
Regulator
The camera module implements a DC to DC voltage converter to generate
2.5 V from the 3.3 V supply.
1.1V Voltage
Regulator
The camera module implements a DC to DC voltage converter to generate
1.1 V from the 3.3 V supply.
Oscillator
The camera module implements a 24 MHz crystal which supplies the
reference clock source to the image system.
§§
18
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Functional Specification
4
Functional Specification
4.1
Embedded 3D Imaging System
The R200 module uses stereo vision to calculate depth. The stereo vision
implementation consists of left infrared camera, right infrared camera, and an infrared
laser projector. The left and right camera data is sent to the R200 ASIC. The ASIC
calculates depth values for each pixel in the image. The infrared projector is used to
enhance the ability of the system to calculate depth in scenes with low amounts of
texture. Traditionally, scenes with low texture such as walls presented a challenge for
stereo vision systems to calculate depth.
Figure 4-1. Active Stereo Technology Overview
4.2
Camera Video Stream Formats
Table 4-1. Supported Left/Right Infrared Camera Video Stream Formats and Modes
Format
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Description
Resolution
Frame
Rates
RY12LY12_4_3
12 bits right, 12 bits left, 4 pixels
packed into 3 32 bit words
640x480, 492x372,
332x252
30, 60
LY_8_4_1
8 bits left, 4 pixels packed into 1 32 bit
words
640x480, 492x372,
332x252
30, 60
19
Functional Specification
Format
Description
Resolution
Frame
Rates
LY12_2_1
12 bits left, 2 pixels packed into 1 32
bit words
640x480, 492x372,
332x252
30, 60
RY8LY8_2_1
8 bits right, 8 bits left, 2 pixels packed
into 1 32 bit words
640x480, 492x372,
332x252
30, 60
Table 4-2. Supported Color Camera Video Stream Formats and Modes
Format
Raw10
Description
Resolution
Bayer image pattern
Frame Rates
1920x1080
30
YUY2
1920x1080
30
YUY2
640x480
15,30,60
Table 4-3. Supported Depth Video Stream Formats and Modes
Format
Z16_2_1
Description
Resolution
16 bits, 2 pixels packed into 1 32 bit
word
628x468, 480x360,
320x240
Frame
Rates
30, 60
Note: The modes listed above are hardware supported modes and may not be visible to
applications.
All frame rates are expressed as nominal. Effective frame rates can vary
depending on the exposure settings of the camera. Camera settings that
increase the exposure time can decrease the effective frame rate.
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20
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Firmware
5
Firmware
5.1
Firmware Update (Windows* Only)
During a firmware update, a firmware update application is used to load new firmware
into the R200 memory. The R200 firmware will check the firmware manifest and
digitally sign the updated firmware. If the firmware update is interrupted or becomes
corrupted the new code will not be signed and the device will revert to recovery
firmware after restart. Recovery firmware is intended for the device to accept a new
firmware update and should not be used for normal operation.
The firmware version programmed by the firmware utility is tightly
coupled with the DCM runtime version. This is why the firmware utility is
bundled with the DCM system software installer and should not be
decoupled. If there is a mismatch between firmware and DCM versions,
features can cease to function or unknown behaviors can occur.
5.2
Infrared Camera Functions
Table 5-1. Left and Right IR Sensor Configuration
Property
Image Gain
Image Exposure
Min
Max
Default
Auto
1
63.9
-
Yes
0.1
33.3
-
Yes
The left and right IR sensors must share settings, it is not possible to
configure each IR sensor individually
5.3
Color Camera Functions R200
Table 5-2. RGB Sensor Configuration
Property
Image Gain
Image Exposure
Brightness
Contrast
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Min
Max
Default
Auto
1
63.9
-
Yes
0.1
33.3
-
Yes
0
255
55
No
16
64
32
No
21
Firmware
Property
Min
Max
Default
Auto
0
255
128
No
-2200
2200
0
No
100
280
220
No
2000
8000
-
Yes
Sharpness
0
7
0
No
Backlight Comp
0
4
1
No
PowerLine Freq
50
60
60
No
Saturation
Hue
Gamma
White Balance
§§
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System Interoperability
6
System Interoperability
6.1
USB Composite Device
The R200 ASIC is a USB3 composite device which exposes all hardware endpoints to
the operating system. The ASIC is a bulk device and transmits depth and color videos
streams in data bursts rather than as constant video streams.
The camera module is compliant with the USB3.0 specification. The module does not
support USB2.0 connections and does not route the USB2.0 pins. In the case of a
USB3.0 link training failure it is possible that the module will not be detected.
Because the module is an integrated device, it is not expected for the module to
encounter USB3.0 link training failures.
Intel® RealSense™ 3D Camera (R200), has passed the USB-IF Test Procedure for
SuperSpeed products, and is posted on the USB-IF Integrators List.
Product Name:
Intel® RealSense™ 3D Camera/ R200
Product Test ID:
310000173
Figure 6-1. USB Composite Device Hardware ID
Hardware ID
Bits
Vendor ID
[15:0]
0x8086
Device ID
[15:0]
0x0A80
Revision ID
[15:12]
Firmware Major Version
[11:5]
Firmware Minor Version
[4:0]
6.1.1
Value
Firmware Sub-Minor Version
Device Endpoints
Table 6-1. USB Composite Device Endpoints
Endpoint
USB Composite Device
Intel® RealSense™ 3D Camera (R200) RGB
Intel® RealSense™ 3D Camera (R200) Depth
Intel® RealSense™ 3D Camera (R200) Left-Right
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23
System Interoperability
6.2
Power States
The R200 device power state is dependent on the video stream configuration and
system state.
Table 6-2. Device Power States
System State
Device State
Link State
Device Power
Streaming
S0
D0
U0
VCC = ON
Yes
S0
D3Cold
U3
VCC =OFF
No
D3Cold
U3
VCC = OFF
No
D3Cold
U3
VCC =OFF
No
S3/S4/S5
Connected Standby
(1)
(1)
Connected Standby and Modern Standby are an operating specific state and only applies to
systems that have support.
The R200 is not a wake device. If the R200 is put into D3 then it is up to
the client system to wake. If the host system does not remove power
from the R200 in D3 the module will continue to consume power while
idle which is not recommended.
6.2.1
Power Consumption
Table 6-3. Typical Power Consumption
Depth Mode
Infrared Mode
Color Mode
Power
Unit
OFF
OFF
OFF
0.334
W
OFF
OFF
1080P, 30FPS
0.75-.92
W
VGA, 60FPS
VGA, 60FPS
OFF
0.99-1.15
W
VGA, 60FPS
VGA, 60FPS
1080P, 30FPS
1.3-1.6
W
§§
24
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System Integration
7
System Integration
7.1
Integration Overview
The small size of the R200 module provides system integrators flexibility to design
into a wide range of products. This section describes how to integrate the module into
a system chassis.
7.2
Module Stability
It is critical that the R200 module does not experience flex during system
integration or during use after integration. The module arrives calibrated and
ready for installation into a system. Micron level flexing of the module can render the
calibration incorrect and will result in poor performance or nonfunctional depth data. It
is important for system designers to isolate the module from any chassis flex the
system may encounter. Micron levels of module flex can disrupt the depth
stream. While the module has reinforcement housing, the housing is not intended to
counter loads from chassis flex. The primary function of the housing is to prevent loss
of calibration from handling and operating environments.
There are three types of flex the module can encounter independently or in
combination: Y, Z, and twisting. The impacts to performance of each flex type are
discussed in this section.
Flex across the module Z axis shown in figure below, will cause error in the depth
image as it modifies the baseline between the imagers. Extreme flex in this direction
will cause a loss of depth data.
Figure 7-1. Z Direction Module Flex Example
Flex across the module Y axis shown in figure below, will cause a loss of depth data.
The module is most resilient to flex across this axis to prevent loss of depth data.
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System Integration
Figure 7-2. Y Direction Module Flex Example
Twisting forces are composite forces that rotate the module on the X axis shown in
figure below. This type of movement creates displacement in both the X and Z
directions. The chassis design should avoid transmitting twisting forces to the module
as much as possible.
Figure 7-3. Twist Module Flex Example
7.2.1.1
Module Flex Specifications
Module flex specifications are provided for in the z-direction and for twist about the
module’s x-axis as demonstrated in the figure above. The specifications are separated
into a number of different regions:
1. Depth performance degradation is minimal and the module can continue to
operate under its current levels of deflection without a significant impact to depth
data.
2. Depth performance degradation is significant. However, when the load or
deflection is removed from the module, the module depth performance will return
to proper levels without requiring user calibration.
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System Integration
3. Depth performance degradation is significant. When the load or deflection is
removed from the module a user calibration will be required to recover the
module’s depth performance.
Note: These are Intel® RealSense™ R200 module specifications. Further analysis is required
to determine the relationship between the system flex and the module flex, and as a result,
determine size of the air gap around the module in order to buffer the module from the
system.
Table 7-1. Module Bend and Twist Limits
7.3
Limit
Max Load
Deflection
Bend while functional
5N
0 - 40 um
Bend Nonfunctional
129 N
40um - 1mm
Bend Failure (Recalibration Required)
193 N
1 - 1.5mm
Twist while functional
2.4Nmm
0.5 degrees
Twist Nonfunctional
48Nmm
0.5-1.5 degrees
Twist Failure (Recalibration Required)
96Nmm
1.5-2.0 degrees
Camera Module Dimensions
The camera module nominal dimensions, with tolerances, are in the mechanical design
package.
7.4
Camera Module Mass
The module mass is approximately 8 grams.
7.5
Grounding
Testing should be performed to quantify the level of grounding required. It is
recommended that there be at least two ground contact points to the system.
•
•
7.6
The thermal heat spreader and reinforcement frame can be used as primary
GND contact points to the system.
The openings at the system for each of the R200 components should be as
small as possible.
Motherboard Receptacle
It is recommended that the motherboard receptacle is grounded as well as ground bar
pads implemented.
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System Integration
Figure 7-4. Receptacle Ground Bar Motherboard Connections
7.7
Shielding
Testing should be done to quantify the level of shielding required. Typically, if the
R200 is placed greater than 2-3” from system antennas, only the cable may require
shielding.
•
The cable should be wrapped end to end with a conductive EMI fabric. The
fabric should make contact with the connector plug shield on each end.
•
The conductive fabric should make a ground connection with the system
chassis.
•
Between the cable shielding and the module shielding, the opening should be
as small as possible to avoid RFI leakage.
•
Component placement and cable routing must be optimized to minimize noise
pickup from system sources.
•
The RFI value should not increase more than 5dB when the R200 is active
compared to when inactive.
Conductive shielding material must not make contact with any non-GND
subassembly components, pads, or signals.
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System Integration
7.8
Rear Cover Design Guidance
In addition to any thermal heat spreaders, the rear cover design must take into
consideration the openings for the R200 camera, projector, and LED. The openings
should be designed so that they provide protection from dirt and damage but also
accommodate the following considerations.
• Maximize effective field of view of the cameras and field of projection of the
projector
• Minimize air gap distance between the bezel surface and the front of the imaging
module components. This is done to minimize the size of the holes in the rear cover
required.
• Employ gasket material and separate cover material windows to isolate the IR laser
projector output and prevent reflections off the cover material back into the system
chassis.
The R200 computer aided design model (part of mechanical design package) includes
the lens field of view projection profiles for each component. It is recommended to use
the model along with a platform chassis model to minimize the cover hole diameters.
7.8.1
Transparent Cover Material
It is recommended to use a transparent cover material over in the rear cover holes to
protect the camera module and prevent dirt from entering the system chassis. For the
IR projector and IR cameras, the material must have a 98% or higher transmission
rate in the 854 nm to 864 nm range. Anti-reflective coatings can help increase the IR
transmission of transparent material. Most designs will require an AR coating on both
sides of the cover material to reach 98% IR light transmission, using material with
lower than 98% transmission can result in poor depth performance. Because the
camera performance is limited by IR light from the projector indoors, a transparent
cover material that reduces IR light transmission will decrease the working range of
the camera.
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System Integration
Figure 7-5. Example IR Transmission of Acceptable Cover Material
7.8.2
Gaskets
Gaskets are recommended for providing optical isolation and dust protection.
However, gaskets can impede FOV and place unwanted stress on the module or the
individual sensor lens holders.
Gasket static force can deform the cosmetic baffle/lens holder resulting in poor image
quality and permanent damage to the camera. Gaskets placed on the R200 housing
can transfer chassis flex into the camera module causing loss of depth data. Gasket
thickness has a large effect on the static force applied to the module surface. The
thinner the seal, the greater the static force applied. Once the gasket is compressed,
the static force will increase exponentially.
7.8.3
Optical Isolation
Note: It is recommended to isolate the module cameras and IR projector from each other.
Not properly isolating the cameras can result in leakage light as shown in Figure 7-6.
To light leakage, it is recommended to use a gasket material in between the rear
cover holes and the module as shown in Figure 7-7. The gasket material needs to be
compliant so that it does not transmit chassis flex forces to the module.
In addition, light can transmit through a single piece of cover material. Using separate
cover material pieces with physical partitions for each opening minimizes the ability of
light to transmit through the cover. Refer Figure 7-8 for reference.
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System Integration
Figure 7-6. Example of Light Leakage Effects
Gasket
No Gasket
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System Integration
Figure 7-7. Example of Gasket Material Placement
Figure 7-8. Example of Separated Windows for Cover Material
7.8.4
Dust Protection
Dust particles can accumulate over the camera lenses which can be visually
unappealing and degrade image quality.
7.9
Thermal Design Guidance
While necessary to avoid module flex, the air gap around the module creates thermal
challenges. Without thermal management, cameras on the module can be
permanently damaged. Most system designs do not have sufficient free space to allow
for air convection based cooling methods. This section lists a number of strategies that
can be used to successfully meet module and system thermal requirements.
It is strongly recommended to use thermal modeling to simulate a chassis design
before implementation. Any simulations should be correlated with empirical
measurements to verify the simulated behavior is accurate.
In general it is recommended to place the camera module, SoC, and display driver as
far apart as possible to minimize the thermal dissipation solution as shown in Figure
7-9.
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System Integration
Figure 7-9. System Component Placement
7.9.1
Thermal Limits
Table 7-2. Component Case Temperature Limits
Component
Case Temperature
Limit
R200 Color Camera
Sensor
61oC
IR Camera Sensor
Laser Projector
R200 ASIC
ΔT Junction to
Case
Junction Temperature
(Est.)
9oC
70oC
62oC
8oC
70oC
†
-
75°C
o
-
-
95 C
NOTE: † Laser projector temperature should be monitored through the R200’s embedded
thermal sensor. Refer to the following section for more details.
It is not possible to directly measure junction temperature of the module components.
Because of this, Intel recommends taking measurements with thermal probes at the
locations identified in Figure 7-10. The measurements can be correlated with the
thermal model to estimate component junction temperatures.
Figure 7-10. Module Thermal Probe Points
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System Integration
Table 7-3. Component Case Temperature vs. Junction Temperature
Point
Component
Junction Temp (Est.)
TC1
Right IR Camera Surface
Case Temp +8oC
TC2
RGB Camera Surface
Case Temp +9oC
TC3
Left IR Camera Surface
Case Temp +8oC
There is a single embedded thermal sensor on the R200 module. This thermal sensor
has been correlated to the Laser Projector’s junction temperature. It should not be
used to correlate junction temperatures of any of the other components on the R200
module.
Table 7-4. Thermal Sensor vs. Laser Projector Junction Temperature
7.9.2
Item
Component
Junction Temp (Est.)
Embedded Thermal Sensor
Laser Projector
Thermal Sensor +9 ± 3°C
Thermal Management
The recommended strategy for thermal management is to use thin copper foil to
transfer heat away from the module. The use of flexible foil maintains the isolation of
the module from the system chassis as the foil will not apply mechanical loading on
the module. The copper foil is adhered to the back side of the module and transfers
heat to a graphite heat spreader on the system chassis rear cover or over the LCD
panel heat spreader. If the LCD panel heat spreader is used, care must be taken to
avoid overheating the LCD panel.
It is recommended to mount the module on a thermally conductive chassis
component. The thermal properties of the adhesive should be considered when
choosing an adhesive to attach the camera module to the chassis. The bracket should
contact metal in the chassis to dissipate heat and provide an ESD ground path.
Alternatively, the copper foil can provide an ESD ground path and other nonelectrically conductive adhesives can be used. While a longer bracket would help
thermal performance, the bracket should be no more than 25mm long to keep the
module isolated from chassis flex.
34
334616-001
System Integration
Figure 7-11. Module Thermal Solution Chassis or Frame Mount
Figure 7-12. Module Mounting Chassis or Frame
Module
Figure 7-13. Module Thermal Solution Rear Cover Mount
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35
System Integration
Figure 7-14. Module Mounting Rear Cover
Camera
Module
Adhesive
Table 7-5. Copper Foil Recommendation
Detail
Notes
Material
Copper
Thickness
0.2mm
Width
110mm (entire back side of module)
Min Overlap with Module
9.5mm
Table 7-6. Heat Spreader Recommendation
7.10
Detail
Notes
Material
Graphite
Thickness
0.2mm
Minimum Surface Area
260x80mm^2
Min Overlap With Copper Foil
10mm
Motherboard Routing Considerations
The imaging module requires a dedicated XHCI USB3 port. A USB hub must not be
implemented between the imaging module and XHCI USB3 port to ensure highest
possible bandwidth. The routing topology is specific to the platform. If the platform
the R200 is being integrated is not listed below, please contact your Intel
representative for support details.
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System Integration
7.10.1
Cable TX to RX Crossover
Standard USB3.0 requires the cable to cross the host TX to the device RX and the host
RX to the device TX. For the R200 module, it is recommended not to cross over the
signals in the cable to allow cable wiring to be flat and as thin as possible. The
modules do not cross over the TX and RX signals, it is necessary to do this on the
platform motherboard.
Figure 7-15. Example of Host Platform Motherboard Routing
7.10.2
Power Gate Circuit
It is required that the host platform is able to gate power to the R200 module. The
power gate must be controllable via an ACPI and BIOS controllable GPIO. It is
recommended for the implementation to be able to vary the delay from when the
GPIO is asserted to when the ACPI code notifies the OS the device is powered.
334616-001
37
System Integration
Figure 7-16. Module Platform Power Gate Example
7.10.3
Platform Specific Routing Guidance
Contact local Intel representative for details on platform specific board routing
requirements.
7.10.4
Motherboard Receptacle
Figure 7-17. System Receptacle Properties
Pin
Wire Description
Differential Impedance
Rise Time
75 to 105Ω (USB3 Signals)
50ps (20% - 80%)
Max Cross Talk
-34dB up to 2.5GHz.
Current Rating
0.3A ± 5%
Shielding
Grounding
Metal shielding, connected to GND plane.
Two ground bar connections in addition to the connector GND.
Table 7-7. Receptacle Pin Out
Position
38
Name
Type
-
Description
1
GND
2
USB3_SSTX-
OUT
USB3 Transmitter Negative
3
USB3_SSTX+
OUT
USB3 Transmitter Positive
4
GND
5
USB3_SSRX-
IN
USB3 Receiver Negative
6
USB3_SSRX+
IN
USB3 Receiver Positive
7
GND
-
-
Ground
Ground
Ground
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System Integration
Position
8
Name
RSVD
9
VCC
10
VCC
Type
Description
-
RSVD (No Connect)
-
Supply Voltage, Connect to
3.3V
-
Supply Voltage, Connect to
3.3V
Table 7-8. Receptacle Characteristics
7.10.5
Property
Description
Shell Finish
Tin (Sn)
Lock
Yes
Ground Bar
Yes
Alignment Boss
No
Part Number
IPEX 20347-310E-12R
Diagram
High Speed Cable Assembly
The high speed cable assembly is developed and procured by the system integrator.
The cable assembly design is specific to the system definition and must meet R200
cable assembly design specification.
Table 7-9. Plug Characteristics
Property
Description
Shell Finish
Tin (Sn)
Friction Lock
Yes
Ground Bar
Yes
Plug Part Number
IPEX 2047-0103R
Housing Part
Number
IPEX 20346-010T31R
Diagram
Table 7-10. Cable Assembly Specification
Property
Cable Length
Controlled Impedance
Max Insertion Loss
334616-001
Description
508mm ± 10mm (~20 inches)
50Ω ± 10%
7.0 dB at 2.5 GHz
Cable Shielding
Each plug should be connected to the receptacle shield and GND bar.
Minimum Gauge
40 AWG for micro-coax, 36 AWG for wire.
39
System Integration
Deviation from these properties is allowed, but the compatibility with the
R200 receptacle must be maintained. Longer cable lengths is allowed, but
signal integrity should be evaluated by the system integrator.
Table 7-11. Cable Assembly Interconnect Properties
Pos
R200
System
Gauge
Interconnect Description
1
GND
GND
40
50Ω micro-coax, shield soldered to GND
bar.
2
USB3_SSTX-
USB3_SSTX-
40
50Ω micro-coax, shield soldered to GND
bar.
3
USB3_SSTX+
USB3_SSTX+
40
50Ω micro-coax, shield soldered to GND
bar.
4
GND
GND
40
50Ω micro-coax, shield soldered to GND
bar.
5
USB3_SSRX-
USB3_SSRX-
40
50Ω micro-coax, shield soldered to GND
bar.
6
USB3_SSRX+
USB3_SSRX+
40
50Ω micro-coax, shield soldered to GND
bar.
7
GND
GND
36
UL 10064 Wire (Rated at least 0.3A.)
8
No Connect
No Connect
9
VCC
5V
36
UL 10064 Wire (Rated at least 0.3A.)
10
VCC
5V
36
UL 10064 Wire (Rated at least 0.3A.)
-
No Connect
The TX to RX pair crossover is expected on the system board and not the
cable assembly. This is done to allow for flat cable assemblies.
§§
40
334616-001
Calibration
8
Calibration
The R200 camera module requires calibration if it is distorted during the assembly
process or by environmental conditions in the field. For details on high volume
calibration solutions, contact local Intel representative.
§§
334616-001
41
System BIOS
9
System BIOS
The BIOS must map the integrated USB3 port to the R200 and report the location for
each camera. The BIOS must declare the R200 power resource methods and creates
an interface to directly control the power resource and interrupt pin through a GPIO.
9.1
UPC (USB Port Capabilities)
The USB3 port in the USB port allocation must be a non-companion port.
Table 9-1. UPC Elements
Element
Type
Description
Value
Port Is Connectable
Integer (BYTE)
Yes
0xFF
Port Connector Type
Integer (BYTE)
Fixed
0xFF
Reserved 0
Integer
N/A
0x00000000
Reserved 1
Integer
N/A
0x00000000
Figure 9-1. UPC Return Package Values
Name(_UPC, Package()) {
}
9.2
0xFF,
0xFF,
0x00000000,
0x00000000})
// Port is Connectable and Internal
// Connector is Proprietary and Fixed
// Reserved 0, must be zero
// Reserved 1, must be zero
PLD (Physical Device Location)
An independent _PLD table must be mapped to each camera’s address. The address
(_ADR) for the color camera (offset 0x0) and infrared camera (offset 0x2) are
dependent on the USB port that the R200 is mapped.
For example, if the R200 was mapped to USB port 15 (0x0F), the color camera _ADR
value is 0x0F and infrared camera _ADR value is 0x11. The UVC OS Address property
can be used to verify this value.
Table 9-2. PLD Elements
42
Element
Bits
Description
Value
Revision
[6:0]
Current
2
Color
[7]
Ignore
1
334616-001
System BIOS
Element
Bits
Description
Value
User Visible
[64]
Integrated
0
Panel Surface
[69:67]
Rear Surface
5
Vertical Position
[71:70]
Upper
0
Horizontal Position
[73:72]
Center
1
Group Position
[94:87]
Non-Companion USB3 Port
Unique Port Value
Rotation
[118:115]
Default Orientation, No Rotation
0
Vertical Offset
[143:128]
Offset from Panel Surface Origin
System Specific
Horizontal Offset
[159:144]
Offset from Panel Surface Origin
System Specific
Figure 9-2. PLD System Design Considerations
Table 9-3. PLD Return Package Values
Camera
Reference PLD Example(1)
Name (PLD_DEPTH) {
Depth
0x82, 0x00, 0x00, 0x00, 0x00, 0x00, 0x00,
0x00,
0x24, 0x01, 0x80, 0x0F, 0x00, 0x00, 0x00,
0x00,
VV, VV, HH, HH}
Name (PLD_COLOR) {
Color
0x82, 0x00, 0x00, 0x00, 0x00, 0x00, 0x00,
0x00,
0x24, 0x01, 0x80, 0x0F, 0x00, 0x00, 0x00,
0x00,
VV, VV, HH, HH}
Reference Attributes(1)
USB3 Port = 0xF (Group
Position)
ADR = 0xF + 0x2 = 0x11
V Offset = Y
H Offset = X
USB3 Port = 0xF (Group
Position)
ADR = 0xF + 0x0 = 0xF
V Offset = Y
H Offset = X + 58.4
(1) The group position, vertical and horizontal offsets are system design specific and
defined by the integrator. Apart from the 58.4 mm horizontal offset difference
between the infrared left camera and color camera on the subassembly, the PLD
for both cameras are identical.
§§
334616-001
43
Packaging and Labeling
10
Packaging and Labeling
The 8.0 x 6.0 mm camera module label illustrated in Figure 10-1 consists of a 3.5 x
3.5 mm barcode and descriptor fields described in fields table.
Figure 10-1. Camera Module Label
Note: The scan code is encoded with the serial number, YWWFXXXXXX
Table 10-1. Scan Code Fields
Group
Field
Identifier
Description
Type
Serial Number
YWWFXXXXXX
Manufacture Date Factory Code Serial Code
Dynamic
Product Assembly
Number
939143
Material Master Number
Static
H55024-101
Product Identifier Code
Static
§§
44
334616-001
Regulatory Compliance R200
11
Regulatory Compliance R200
System integrators should refer to their respective regulatory and
compliance owner to finalize regulatory requirements for a specific
geography.
This device complies with International Standard EN/IEC 60825-1:2007 edition 2 for a
Class 1 laser product. This device also complies with US FDA performance standards
for laser products except for deviations pursuant to Laser notice No. 50, dated June
24, 2007.
CLASS 1 LASER PRODUCT
CLASSIFIED EN/IEC 60825-1 2014 (EU & other)
CLASSIFIED IEC 60825-1 2007 (US)
This device complies with US FDA performance standards for laser products
except for deviations pursuant to Laser Notice No. 50 dated June 24, 2007.
Caution--use of controls or adjustments or performance of procedures other than
those specified herein may result in hazardous radiation exposure.
Manufactured by Intel Corporation
2200 Mission College Blvd., Santa Clara, CA 95054
Model Number: Rear R200
U.S. FDA accession number is 1420260-000 and the peripheral version is 1420260001.
This number should be entered into Box B.1 of the Food and Drug Administration
(FDA) 2877 Declaration for Imported Electronic Products Subject to Radiation Control
Standards.
The camera module certification is transferable to the system and no system
recertification is required. However, the following statements and labels must be
included in the user manual of the system product.
This product is classified as Class 1 under the IEC 60825-1 edition 2, 2007 in the US
and is classified as Class 1 under the EN/IEC60825-1 edition 3, 2014 in the EU and
other countries, at the time of publication. This device also complies with US FDA
334616-001
45
Regulatory Compliance R200
performance standards for laser products except for deviations pursuant to Laser
notice No. 50, dated June 24, 2007.
The image system continuously monitors the IR laser projector system. If the
projector system falls outside normal operating conditions for Class 1, the IR laser
projector system is turned off. This is a requirement for Class 1 laser devices.
There are no service/maintenance, modification, or disassembly procedures for
R200 and infrared projector. The system integrator must either notify Intel or
return modules before any failure analysis is performed.
• Do not attempt to open any portion of this laser product.
• There are no user serviceable parts with this laser product.
• Modification or service of the R200, specifically the infrared projector, may cause
the emissions to exceed Class 1.
This device is EU RoHS 2 (Directive 2011/65/EU) compliant and low halogen (PCB).
For additional details please download the R200 Material Declaration Data Sheet.
www.ul.com/database
NWGQ2.E139761, NWGQ8.E139761
§§
46
334616-001
R200 Interconnect Cable Drawings
12
R200 Interconnect Cable
Drawings
The interconnect cable can be used to connect the R200 to the motherboard
receptacle or to the receptacle on the USB adapter card.
Table 12-1. Cable Part Numbers
Vendor
Part Number
Length
Revision
Amphenol
H26311-001
100mm
AX1
Amphenol
H26312-001
150mm
AX1
Amphenol
H26313-001
300mm
AX1
Amphenol
H26314-001
500mm
AX1
Sales Contact
Bruce Motavaf
AGIS - Sales Engineer
Amphenol
bruce.motavaf@amphenol-gis.com
408.799.6060
Figure 12-1. Cable Mechanical Drawing
§§
334616-001
47
R200 Connector Drawings
13
R200 Connector Drawings
Figure 13-1. R200 Receptacle Mechanical Drawing
48
334616-001
R200 Connector Drawings
Figure 13-2. R200 Interconnect Plug Mechanical Drawing
§§
334616-001
49
Schematic Checklist
14
Schematic Checklist
The following checklist should be compared to the motherboard design.
Table 14-1. Motherboard Connector Signals
Connector
Motherboard
Required
Pin 1
Routed to GND
Y
Pin 2
Routed to USB3_RXN
Y
Pin 3
Routed to USB3_RXP
Y
Pin 4
Routed to GND
Y
Pin 5
Routed to USB3_TXN
Y
Pin 6
Routed to USB3_TXP
Y
Pin 7
Routed to GND
Y
Pin 8
Not Connected
Y
Pin 9
Routed to 5V Supply
Y
Pin 10
Routed to 5V Supply
Y
Connector
Routed to GND
Y
Connector
Routed to GND
Y
Ground Bar
Routed to GND
Y
Ground Bar
Routed to GND
Y
√
Table 14-2. USB_RX Motherboard Signals
Signal
Motherboard
Required
Pin 2
ESD protection diode connected to GND.
Optional
Pin 3
ESD protection diode connected to GND.
Optional
√
Table 14-3. USB_TX Motherboard Signals
Signal
50
Motherboard
Required
Pin 5
Inline 80 Ohm choke placed close to connector.
Y
Pin 5
Inline 0.1uF AC capacitor placed close to the
connector.
Y
Pin 5
ESD protection diode connected to GND.
Pin 6
Inline 80ohm choke placed closed to connector.
Y
Pin 6
Inline 0.1uF AC capacitor placed close to the
connector.
Y
Pin 6
ESD protection diode connected to GND.
√
Optional
Optional
334616-001
Schematic Checklist
Table 14-4. Power Signals
Signal
Motherboard
Required
Pin 9/10
Series components rated for at least 1A.
Y
Pin 9/10
Independent 3.3V controllable FET
Y
Pin 9/10
Routed 3.3V FET control GPIO
Y
√
§§
334616-001
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