EP2A40F672C9

Package Information Datasheet for Mature Altera Devices DS-PKG-16.8 This datasheet provides package and thermal resistance information for mature Altera® devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish (plating), JEDEC outline reference, lead coplanarity, weight, moisture sensitivity level, and other special information. The thermal resistance information includes device pin count, package name, and resistance values. This datasheet includes the following sections: ■ “Device and Package Cross Reference” on page 1 ■ “Thermal Resistance” on page 23 ■ “Package Outlines” on page 44 f For more package and thermal resistance information about Altera devices that are not listed in this datasheet, refer to the Package and Thermal Resistance page of the Altera website. f For information about trays, tubes, and dry packs, refer to AN 71: Guidelines for Handling J-Lead, QFP, and BGA Devices. f RoHS-compliant devices are compatible with leaded-reflow temperatures. For more information, refer to Altera’s RoHS-Compliant Devices literature page. Device and Package Cross Reference Table 2 through Table 22 lists the device, package type, and number of pins for each Altera device listed in this datasheet. Altera devices listed in this datasheet are available in the following packages: © December 2011 ■ Ball-Grid Array (BGA) ■ Ceramic Pin-Grid Array (PGA) ■ FineLine BGA (FBGA) ■ Hybrid FineLine BGA (HBGA) ■ Plastic Dual In-Line Package (PDIP) ■ Plastic Enhanced Quad Flat Pack (EQFP) ■ Plastic J-Lead Chip Carrier (PLCC) ■ Plastic Quad Flat Pack (PQFP) ■ Power Quad Flat Pack (RQFP) ■ Thin Quad Flat Pack (TQFP) ■ Ultra FineLine BGA (UBGA) Altera Corporation Package Information Datasheet for Mature Altera Devices 2 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Table 1 lists the Altera devices and the associated table locations. Table 1. Mature Altera Device and Package Cross Reference Altera Device Arria® series FPGAs Stratix® series FPGAs Cyclone® series FPGAs MAX® series CPLDs HardCopy® series ASICs APEX™ series FPGAs ® Table locations ■ Arria GX Devices: Table 2 on page 3 ■ Stratix II Devices: Table 3 on page 3 ■ Stratix Devices: Table 4 on page 5 ■ Cyclone II Devices: Table 5 on page 7 ■ Cyclone Devices: Table 6 on page 8 ■ MAX 9000 Devices: Table 7 on page 8 ■ MAX 7000 Devices: Table 8 on page 9 ■ MAX 3000A Devices: Table 9 on page 10 ■ HardCopy II Devices: Table 10 on page 11 ■ HardCopy Devices: Table 11 on page 11 ■ HardCopy APEX Devices: Table 12 on page 12 ■ APEX II Devices: Table 13 on page 13 ■ APEX 20KE Devices: Table 14 on page 13 ■ APEX 20KC Devices: Table 15 on page 15 ■ APEX 20K Devices: Table 16 on page 15 ACEX 1K FPGAs ACEX 1K Devices: Table 17 on page 16 Mercury™ FPGAs Mercury Devices: Table 18 on page 17 ® FLEX series FPGAs ■ FLEX 10KA Devices: Table 19 on page 17 ■ FLEX 10KS Devices: Table 20 on page 18 ■ FLEX 10KE Devices: Table 21 on page 18 Excalibur™ FPGAs Excalibur Devices: Table 22 on page 21 Configuration devices Configuration Devices: Table 23 on page 22 Enhanced configuration devices Enhanced Configuration Devices: Table 24 on page 22 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 3 Arria GX Devices Table 2 lists the device name, package type, and number of pins for the Arria GX device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 2. Arria GX Devices Device EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX60 EP1AGX90 Package Pins Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single- Piece Lid: FBGA, Flip Chip, Option 4 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Channel Lid: FBGA, Flip Chip, Option 1 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1152 Channel Lid: FBGA, Flip Chip, Option 1 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1152 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1152 Stratix II Devices Table 3 lists the device name, package type, and number of pins for the Stratix II device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 3. Stratix II Devices (Part 1 of 2) Device EP2S15 © December 2011 Altera Corporation Package Pins Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 672 Package Information Datasheet for Mature Altera Devices 4 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Table 3. Stratix II Devices (Part 2 of 2) Device EP2S30 EP2S60 EP2S90 EP2S130 EP2S180 EP2SGX30 EP2SGX60 EP2SGX90 EP2SGX130 Package Information Datasheet for Mature Altera Devices Package Pins Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, option 2 1020 Channel Lid: HBGA, Flip Chip 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 Channel Lid: FBGA, Flip Chip, Option 1 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1152 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1152 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 5 Stratix Devices Table 4 lists the device name, package type, and number of pins for the Stratix device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 4. Stratix Devices (Part 1 of 2) Device EP1SGX10 EP1SGX25 EP1SGX40 EP1S10 EP1S20 EP1S25 EP1S30 © December 2011 Altera Corporation Package Pins Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 484 BGA, Wire Bond 672 FBGA, Wire Bond, Option 2 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 4 484 BGA, Wire Bond 672 FBGA, Wire Bond, Option 2 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 BGA, Wire Bond 672 FBGA, Wire Bond, Option 2 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: BGA, Flip Chip, Option 1 Single-Piece Lid: BGA, Flip Chip, Option 2 956 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Package Information Datasheet for Mature Altera Devices 6 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Table 4. Stratix Devices (Part 2 of 2) Device EP1S40 EP1S60 EP1S80 Package Information Datasheet for Mature Altera Devices Package Pins Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Dual-Piece Lid: BGA, Flip Chip, Option 1 Single-Piece Lid: BGA, Flip Chip, Option 2 956 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 Dual-Piece Lid: BGA, Flip Chip, Option 1 Single-Piece Lid: BGA, Flip Chip, Option 2 956 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 Dual-Piece Lid: BGA, Flip Chip, Option 1 Single-Piece Lid: BGA, Flip Chip, Option 2 956 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 7 Cyclone II Devices Table 5 lists the device name, package type, and number of pins for the Cyclone II device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 5. Cyclone II Devices Device EP2C5 EP2C8 EP2C8A EP2C15A EP2C20 EP2C20A EP2C35 EP2C50 EP2C70 © December 2011 Altera Corporation Package Pins TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 2, Thin 256 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 2, Thin 256 FBGA, Wire Bond, Option 2, Thin 256 FBGA, Wire Bond, Option 2, Thin 256 FBGA, Wire Bond, A:2.40 484 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 2, Thin 256 FBGA, Wire Bond, A:2.40 484 FBGA, Wire Bond, Option 2, Thin 256 FBGA, Wire Bond, A:2.40 484 FBGA, Wire Bond, A:2.40 484 UBGA, Wire Bond 484 FBGA, Wire Bond, A:2.40 672 FBGA, Wire Bond, A:2.40 484 UBGA, Wire Bond 484 FBGA, Wire Bond, A:2.40 672 FBGA, Wire Bond, A:2.40 672 FBGA, Wire Bond, A:2.40 896 Package Information Datasheet for Mature Altera Devices 8 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Cyclone Devices Table 6 lists the device name, package type, and number of pins for the Cyclone device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 6. Cyclone Devices Device EP1C3 EP1C4 EP1C6 EP1C12 EP1C20 Package Pins TQFP, Wire Bond 100 TQFP, Wire Bond 144 FBGA, Wire Bond, Option 1 324 FBGA, Wire Bond 400 TQFP, Wire Bond 144 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 256 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 256 FBGA, Wire Bond, Option 1 324 FBGA, Wire Bond, Option 1 324 FBGA, Wire Bond 400 MAX 9000 Devices Table 7 lists the device name, package type, and number of pins for the MAX 9000 device family. Table 7. MAX 9000 Devices Device Package Pins EPM9320 BGA, Wire Bond 356 EPM9320A BGA, Wire Bond 356 EPM9560 BGA, Wire Bond 356 MAX 7000 Devices Table 8 lists the device name, package type, and number of pins for the MAX 7000 device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 9 Table 8. MAX 7000 Devices (Part 1 of 2) Device EPM7032B EPM7064B EPM7128B EPM7256B EPM7512B EPM7032AE EPM7064AE EPM7128AE © December 2011 Altera Corporation Package Pins PLCC, Wire Bond 44 TQFP, Wire Bond 44 UBGA, Wire Bond 49 TQFP, Wire Bond 44 UBGA, Wire Bond 49 FBGA, Wire Bond, Option 1 100 TQFP, Wire Bond 100 UBGA, Wire Bond 49 TQFP, Wire Bond 100 FBGA, Wire Bond, Option 1 100 TQFP, Wire Bond 144 UBGA, Wire Bond 169 FBGA, Wire Bond, Option 1 256 TQFP, Wire Bond 100 TQFP, Wire Bond 144 UBGA, Wire Bond 169 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 TQFP, Wire Bond 144 UBGA, Wire Bond 169 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 BGA, Wire Bond, Option 1 256 PLCC, Wire Bond 44 TQFP, Wire Bond 44 PLCC, Wire Bond 44 UBGA, Wire Bond 49 FBGA, Wire Bond, Option 1 100 TQFP, Wire Bond 44 TQFP, Wire Bond 100 FBGA, Wire Bond, Option 1 256 PLCC, Wire Bond 84 FBGA, Wire Bond, Option 1 100 TQFP, Wire Bond 100 TQFP, Wire Bond 144 UBGA, Wire Bond 169 FBGA, Wire Bond, Option 1 256 Package Information Datasheet for Mature Altera Devices 10 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Table 8. MAX 7000 Devices (Part 2 of 2) Device EPM7256AE EPM7512AE EPM7032A EPM7128A EPM7256A EPM7192E Package Pins TQFP, Wire Bond 100 FBGA, Wire Bond, Option 1 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 TQFP, Wire Bond 144 PQFP, Wire Bond 208 BGA, Wire Bond, Option 1 256 FBGA, Wire Bond, Option 1 256 PLCC, Wire Bond 44 TQFP, Wire Bond 44 PLCC, Wire Bond 84 TQFP, Wire Bond 100 FBGA, Wire Bond 100 TQFP, Wire Bond 144 FBGA, Wire Bond, Option 1 256 TQFP, Wire Bond 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 PGA, Wire Bond 160 PQFP, Wire Bond 160 MAX 3000A Devices Table 8 lists the device name, package type, and number of pins for the MAX 3000A device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 9. MAX 3000A Devices (Part 1 of 2) Device EPM3032A EPM3064A EPM3128A Package Information Datasheet for Mature Altera Devices Package Pins PLCC, Wire Bond 44 TQFP, Wire Bond 44 TQFP, Wire Bond 44 PLCC, Wire Bond 44 TQFP, Wire Bond 100 TQFP, Wire Bond 100 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 11 Table 9. MAX 3000A Devices (Part 2 of 2) Device EPM3256A EPM3512A Package Pins TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 HardCopy II Devices Table 10 lists the device name, package type, and number of pins for the HardCopy II device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 10. HardCopy II Devices Device HC210 HC220 HC230 HC240 Package Pins FBGA, Wire Bond, A:2.40 484 Single-Piece Lid: FBGA, Flip Chip, Option 4 672 Single-Piece Lid: FBGA, Flip Chip, Option 3 780 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020 Single-Piece Lid: FBGA, Flip Chip, Option 2 1508 HardCopy Devices Table 11 lists the device name, package type, and number of pins for the HardCopy device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 11. HardCopy Devices Device Pins FBGA, Wire Bond, A:2.40 672 BGA, Wire Bond 672 HC1S30 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780 HC1S40 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780 HC1S60 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 HC1S80 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 HC1S25 © December 2011 Package Altera Corporation Package Information Datasheet for Mature Altera Devices 12 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference HardCopy APEX Devices Table 12 lists the device name, package type, and number of pins for the HardCopy APEX device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 12. HardCopy APEX Devices Device HC20K400 HC20K600 Package Information Datasheet for Mature Altera Devices Package Pins BGA, Wire Bond, Option 3 652 BGA, Wire Bond, Option 3 652 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 13 APEX II Devices Table 13 lists the device name, package type, and number of pins for the APEX II device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 13. APEX II Devices Device EP2A15 EP2A25 EP2A40 EP2A70 Package Pins Dual-Piece Lid: FBGA, Flip Chip, Option 1 672 Dual-Piece Lid: BGA, Flip Chip 724 Channel Lid: FBGA, Flip Chip, Option 1 672 Dual-Piece Lid: BGA, Flip Chip 724 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 Channel Lid: FBGA, Flip Chip, Option 1 672 Dual-Piece Lid: BGA, Flip Chip 724 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 Dual-Piece Lid: BGA, Flip Chip 724 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1508 APEX 20KE Devices Table 14 lists the device name, package type, and number of pins for the APEX 20KE device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 14. APEX 20KE Devices (Part 1 of 2) Device EP20K30E EP20K60E © December 2011 Altera Corporation Package Pins FBGA, Wire Bond 144 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 324 FBGA, Wire Bond 144 TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 324 BGA, Wire Bond 356 Package Information Datasheet for Mature Altera Devices 14 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Table 14. APEX 20KE Devices (Part 2 of 2) Device EP20K100E EP20K160E EP20K200E EP20K300E EP20K400E EP20K600E EP20K1000E EP20K1500E Package Information Datasheet for Mature Altera Devices Package Pins FBGA, Wire Bond 144 TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 324 BGA, Wire Bond 356 TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 BGA, Wire Bond, Option 2 652 FBGA, Wire Bond, Option 2 672 PQFP, Wire Bond 240 BGA, Wire Bond, Option 2 652 FBGA, Wire Bond, Option 2 672 BGA, Wire Bond, Option 3 652 FBGA, Flip Chip, Option 1 672 BGA, Wire Bond, Option 3 652 FBGA, Flip Chip, Option 1 672 FBGA, Flip Chip, Option 1 1020 BGA, Flip Chip 652 FBGA, Flip Chip, Option 1 672 FBGA, Flip Chip, Option 1 1020 BGA, Flip Chip 652 FBGA, Flip Chip, Option 1 1020 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 15 APEX 20KC Devices Table 15 lists the device name, package type, and number of pins for the APEX 20KC device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 15. APEX 20KC Devices Device EP20K200C EP20K400C EP20K600C EP20K1000C Package Pins PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 BGA, Wire Bond, Option 3 652 FBGA, Flip Chip, Option 1 672 BGA, Wire Bond, Option 3 652 FBGA, Flip Chip, Option 1 672 FBGA, Flip Chip, Option 1 1020 BGA, Flip Chip 652 FBGA, Flip Chip, Option 1 672 FBGA, Flip Chip, Option 1 1020 APEX 20K Devices Table 16 lists the device name, package type, and number of pins for the APEX 20K device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 16. APEX 20K Devices (Part 1 of 2) Device EP20K100 EP20K160 © December 2011 Altera Corporation Package Pins TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 324 BGA, Wire Bond 356 PQFP, Wire Bond 240 TQFP, Wire Bond 144 Package Information Datasheet for Mature Altera Devices 16 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Table 16. APEX 20K Devices (Part 2 of 2) Device EP20K200 EP20K300 EP20K400 Package Pins PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 FBGA, Wire Bond, Option 2 672 BGA, Wire Bond, Option 3 652 PGA, Wire Bond 655 FBGA, Flip Chip, Option 1 672 ACEX 1K Devices Table 17 lists the device name, package type, and number of pins for the ACE 1K device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 17. ACEX 1K Devices Device EP1K10 EP1K30 EP1K50 EP1K100 Package Information Datasheet for Mature Altera Devices Package Pins TQFP, Wire Bond 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 FBGA, Wire Bond, Option 2 484 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 FBGA, Wire Bond, Option 2 484 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 17 Mercury Devices Table 18 lists the device name, package type, and number of pins for the Mercury device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 18. Mercury Devices Device Package Pins EP1M120 Dual-Piece Lid: FBGA, Flip Chip, Option 1 484 EP1M350 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780 FLEX 10KA Devices Table 19 lists the device name, package type, and number of pins for the FLEX 10KA device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 19. FLEX 10KA Devices Device EPF10K10A EPF10K30A EPF10K100A EPF10K250A © December 2011 Altera Corporation Package Pins TQFP, Wire Bond 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 256 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 RQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 BGA, Wire Bond 600 PGA, Wire Bond 599 BGA, Wire Bond 600 Package Information Datasheet for Mature Altera Devices 18 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference FLEX 10KS Devices Table 20 lists the device name, package type, and number of pins for the FLEX 10KS device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 20. FLEX 10KS Devices Device EPF10K50S EPF10K200S Package Pins TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 256 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 RQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 BGA, Wire Bond 600 FBGA, Wire Bond, Option 2 672 FLEX 10KE Devices Table 21 lists the device name, package type, and number of pins for the FLEX 10KE device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 21. FLEX 10KE Devices (Part 1 of 3) Device EPF10K30E EPF10K50E Package Information Datasheet for Mature Altera Devices Package Pins TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 FBGA, Wire Bond, Option 2 484 TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 256 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 19 Table 21. FLEX 10KE Devices (Part 2 of 3) Device EPF10K100E EPF10K130E EPF10K200E EPF10K10 EPF10K20 EPF10K30 EPF10K40 EPF10K50 EPF10K50V EPF10K70 EPF10K100 EPF10K130V EPF6010A © December 2011 Altera Corporation Package Pins PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 256 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 BGA, Wire Bond 600 FBGA, Wire Bond, Option 2 672 PGA, Wire Bond 599 BGA, Wire Bond 600 FBGA, Wire Bond, Option 2 672 PLCC, Wire Bond 84 TQFP, Wire Bond 144 PQFP, Wire Bond 208 TQFP, Wire Bond 144 RQFP, Wire Bond 208 RQFP, Wire Bond 240 RQFP, Wire Bond 208 RQFP, Wire Bond 240 BGA, Wire Bond 356 RQFP, Wire Bond 208 RQFP, Wire Bond 240 RQFP, Wire Bond 240 BGA, Wire Bond 356 PGA, Wire Bond 403 RQFP, Wire Bond 240 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond 484 RQFP, Wire Bond 240 PGA, Wire Bond 503 PGA, Wire Bond 503 PGA, Wire Bond 599 BGA, Wire Bond 600 TQFP, Wire Bond 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 Package Information Datasheet for Mature Altera Devices 20 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Table 21. FLEX 10KE Devices (Part 2 of 3) Device EPF10K100E EPF10K130E EPF10K200E EPF10K10 EPF10K20 EPF10K30 EPF10K40 EPF10K50 EPF10K50V EPF10K70 EPF10K100 EPF10K130V EPF6010A Package Information Datasheet for Mature Altera Devices Package Pins PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 256 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 BGA, Wire Bond 600 FBGA, Wire Bond, Option 2 672 PGA, Wire Bond 599 BGA, Wire Bond 600 FBGA, Wire Bond, Option 2 672 PLCC, Wire Bond 84 TQFP, Wire Bond 144 PQFP, Wire Bond 208 TQFP, Wire Bond 144 RQFP, Wire Bond 208 RQFP, Wire Bond 240 RQFP, Wire Bond 208 RQFP, Wire Bond 240 BGA, Wire Bond 356 RQFP, Wire Bond 208 RQFP, Wire Bond 240 RQFP, Wire Bond 240 BGA, Wire Bond 356 PGA, Wire Bond 403 RQFP, Wire Bond 240 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond 484 RQFP, Wire Bond 240 PGA, Wire Bond 503 PGA, Wire Bond 503 PGA, Wire Bond 599 BGA, Wire Bond 600 TQFP, Wire Bond 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference 21 Table 21. FLEX 10KE Devices (Part 3 of 3) Device EPF6016 EPF6016A EPF6024A EPF8282A EPF8452A Package Pins TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond, Option 2 256 TQFP, Wire Bond 100 FBGA, Wire Bond 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond, Option 2 256 FBGA, Wire Bond, Option 1 256 PLCC, Wire Bond 84 TQFP, Wire Bond 100 TQFP, Wire Bond 100 PQFP, Wire Bond 160 Excalibur Devices Table 22 lists the device name, package type, and number of pins for the Excalibur device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 22. Excalibur Devices Device EPXA1 EPXA4 EPXA10 © December 2011 Altera Corporation Package Pins FBGA, Wire Bond, Option 2 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 Package Information Datasheet for Mature Altera Devices 22 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Configuration Devices Table 23 lists the device name, package type, and number of pins for the Configuration device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 23. Configuration Devices Device EPC1 EPC2 EPC1064 EPC1213 EPC1441 Package Pins PDIP, Wire Bond 8 PLCC, Wire Bond 20 PLCC, Wire Bond 20 TQFP, Wire Bond 32 PDIP, Wire Bond 8 PLCC, Wire Bond 20 PDIP, Wire Bond 8 PLCC, Wire Bond 20 PDIP, Wire Bond 8 PLCC, Wire Bond 20 TQFP, Wire Bond 32 Enhanced Configuration Devices Table 24 lists the device name, package type, and number of pins for the Enhanced configuration device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 24. Enhanced Configuration Devices Device Package Pins EPC4 PQFP, Wire Bond 100 EPC8 PQFP, Wire Bond 100 UBGA, Wire Bond 88 PQFP, Wire Bond 100 EPC16 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 23 Thermal Resistance Altera follows JEDEC JESD51 series standards to provide thermal resistances. The purpose of the JESD51 standards is to compare the thermal performance of various packages under standardized test conditions. While standardized thermal resistances can help compare the relative thermal performance of different packages, they cannot apply directly to the many specific applications because JESD51 test conditions may not match a specific application. Several factors affect the thermal performance of a device in a user’s application. These include power dissipation in the component; airflow velocity, direction and turbulence level; power in adjacent components; two-sided vs. one-sided active component mounting; printed circuit board (PCB) orientation & construction; and adjacent boards and their power dissipation. It may be necessary to test or model specific applications. This testing and modeling of a component user’s specific applications is the user’s responsibility. Table 26throughTable 43provideJA (junction-to-ambientthermalresistance)andJC (junction-to-case thermal resistance) values for the Altera device families. Altera reserves the right to make changes to thermal resistances without notice in the future. Table 25 lists the mature Altera devices and the associated table locations. Table 25. Thermal Resistance Altera Device Arria series FPGAs Stratix series FPGAs Cyclone series FPGAs MAX series CPLDs HardCopy series ASICs APEX series FPGAs Table Location ■ Arria GX Devices: Table 26 on page 24 ■ Stratix II Devices: Table 27 on page 25 ■ Stratix Devices: Table 28 on page 26 ■ Cyclone II Devices: Table 29 on page 27 ■ Cyclone Devices: Table 30 on page 28 ■ MAX 9000 Devices: Table 31 on page 29 ■ MAX 7000 Devices: Table 32 on page 30 ■ MAX 3000A Devices: Table 33 on page 33 ■ HardCopy II Devices: Table 34 on page 34 ■ HardCopy Devices: Table 35 on page 34 ■ APEX II Devices: Table 36 on page 35 ■ APEX 20K: Table 37 on page 36 ACEX 1K FPGAs ACEX 1K Devices: Table 38 on page 38 Mercury FPGAs Mercury Devices: Table 39 on page 39 FLEX series FPGAs Excalibur FPGAs ■ FLEX 10K Devices: Table 40 on page 39 ■ FLEX 8000 Devices: Table 41 on page 41 ■ FLEX 6000 Devices: Table 42 on page 42 Excalibur Devices: Table 43 on page 43 Altera is transitioning to an industry-standard copper lid for its thermally enhanced BGA and thermally enhanced Flip Chip FBGA package offerings. f © December 2011 Altera Corporation For more information, refer to Process Change Notice PCN0214. Package Information Datasheet for Mature Altera Devices 24 Package Information Datasheet for Mature Altera Devices Thermal Resistance This change affects the APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur device families. Therefore, two thermal resistance specifications are provided for devices affected by this change. The older packages are identified as using the aluminum silicon carbide (AlSiC) lid, while the newer packages are identified as using the copper (Cu) lid. Thermally enhanced BGA and thermally enhanced Flip Chip FBGA packages offered in the newer Altera families, including Stratix and Stratix GX, were introduced using an industry-standard Cu lid. Therefore, these device specifications include only a single thermal resistance specification. 1 Contact Altera if you need typical +/– values of A dimensions for thermal analysis. The max numbers are provided for physical layout. Arria Series Devices Thermal Resistance Table 26 provides thermal resistance values for Arria series devices. Arria GX Devices Table 26 lists the thermal resistance of Arria GX devices. Table 26. Thermal Resistance of Arria GX Devices Device EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX60 EP1AGX90 Package Pin Count JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. JC (° C/W) JB (° C/W) FBGA 484 12.8 10.3 8.7 7.5 0.3 3.1 FBGA 780 11.1 8.6 7.2 6.0 0.2 3.1 FBGA 484 12.8 10.3 8.7 7.5 0.3 3.1 FBGA 780 11.1 8.6 7.2 6.0 0.2 3.1 FBGA 484 12.7 10.2 8.6 7.3 0.2 2.9 FBGA 780 10.9 8.4 6.9 5.8 0.2 2.9 FBGA 1152 9.9 7.5 6.1 5.0 0.2 2.5 FBGA 484 12.7 10.2 8.6 7.3 0.2 2.9 FBGA 780 10.9 8.4 6.9 5.8 0.2 2.8 FBGA 1152 9.9 7.5 6.1 5.0 0.2 2.5 FBGA 1152 9.6 7.3 5.9 4.9 0.1 2.3 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 25 Stratix Series Devices Thermal Resistance Table 27 to Table 28 provide thermal resistance values for Stratix series devices. Stratix II Devices Table 27 lists the thermal resistance of Stratix II devices. Table 27. Thermal Resistance of Stratix II Devices (Part 1 of 2) Device EP2S15 EP2S30 EP2S60 EP2S90 EP2S130 EP2S180 EP2SGX30 EP2SGX60 © December 2011 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. JB (° C/W) FBGA, Flip Chip 484 0.4 13.1 11.1 9.6 8.3 4.2 FBGA, Flip Chip 672 0.4 12.2 10.2 8.8 7.6 4.1 FBGA, Flip Chip 484 0.2 12.6 10.6 9.1 7.9 3.7 FBGA, Flip Chip 672 0.2 11.7 9.7 8.3 7.1 3.4 FBGA, Flip Chip 484 0.1 12.3 10.3 8.8 7.5 3.4 FBGA, Flip Chip 672 0.1 11.4 9.4 7.8 6.7 3.0 FBGA, Flip Chip 1020 0.1 10.4 8.4 7.0 5.9 2.7 HBGA, Flip Chip 484 0.1 12.0 9.9 8.3 7.1 3.7 FBGA, Flip Chip 780 0.1 10.8 8.8 7.3 6.1 2.6 FBGA, Flip Chip 1020 0.1 10.2 8.2 6.8 5.7 2.4 FBGA, Flip Chip 1508 0.1 9.3 7.4 6.1 5.0 2.2 FBGA, Flip Chip 780 0.1 10.1 8.7 7.2 6.0 2.4 FBGA, Flip Chip 1020 0.1 9.5 8.1 6.7 5.5 2.2 FBGA, Flip Chip 1508 0.1 8.6 7.3 6.0 4.8 2.1 FBGA, Flip Chip 1020 0.1 9.0 7.9 6.5 5.4 2.1 FBGA, Flip Chip 1508 0.1 8.1 7.1 5.8 4.7 1.9 FBGA, Flip Chip 780 0.2 11.1 8.6 7.2 6.0 3.1 FBGA, Flip Chip 780 0.2 10.9 8.4 6.9 5.8 2.8 FBGA, Flip Chip 1152 0.2 9.9 7.5 6.1 5.0 2.5 Altera Corporation Package Information Datasheet for Mature Altera Devices 26 Package Information Datasheet for Mature Altera Devices Thermal Resistance Table 27. Thermal Resistance of Stratix II Devices (Part 2 of 2) Device EP2SGX90 EP2SGX130 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. JB (° C/W) FBGA, Flip Chip 1152 0.1 9.6 7.3 5.9 4.9 2.3 FBGA, Flip Chip 1508 0.1 9.0 6.7 5.4 4.4 1.9 FBGA, Flip Chip 1508 0.1 8.3 6.6 5.3 4.3 1.8 Stratix Devices Table 28 lists the thermal resistance of Stratix devices. Table 28. Thermal Resistance of Stratix Devices (Part 1 of 2) Device Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. EP1SGX10C EP1SGX10D FBGA, Flip Chip 672 0.4 11.1 9.1 7.7 6.5 EP1SGX25C EP1SGX25D FBGA, Flip Chip 672 0.2 10.8 8.8 7.4 6.2 EP1SGX25D EP1SGX25F FBGA, Flip Chip 1020 0.2 9.9 7.9 6.5 5.4 EP1SGX40D EP1SGX40G FBGA, Flip Chip 1020 0.2 9.8 7.7 6.4 5.3 FBGA, Flip Chip 484 0.4 11.9 9.8 8.4 7.2 BGA 672 3.2 16.8 13.7 11.9 10.5 FBGA 672 3.4 17.2 14.0 12.2 10.8 FBGA, Flip Chip 780 0.4 10.9 8.8 7.4 6.3 FBGA, Flip Chip 484 0.3 11.8 9.7 8.3 7.1 BGA 672 2.5 15.5 12.4 10.7 9.3 FBGA 672 2.7 16.0 12.8 11.0 9.6 FBGA, Flip Chip 780 0.3 10.7 8.6 7.2 6.1 BGA 672 2.2 14.8 11.7 10.0 8.7 FBGA 672 2.3 15.3 12 10.4 9.0 FBGA, Flip Chip 780 0.3 10.5 8.5 7.1 6.0 FBGA, Flip Chip 1020 0.3 10.0 8.0 6.6 5.5 EP1S10 EP1S20 EP1S25 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 27 Table 28. Thermal Resistance of Stratix Devices (Part 2 of 2) Device EP1S30 EP1S40 EP1S60 EP1S80 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. FBGA, Flip Chip 780 0.2 10.4 8.4 7.0 5.9 BGA, Flip Chip 956 0.2 9.1 7.1 5.8 4.8 FBGA, Flip Chip 1020 0.2 9.9 7.9 6.5 5.4 FBGA, Flip Chip 780 0.2 10.4 8.3 6.9 5.8 BGA, Flip Chip 956 0.2 9.0 7.0 5.7 4.7 FBGA, Flip Chip 1020 0.2 9.8 7.8 6.4 5.3 FBGA, Flip Chip 1508 0.2 9.1 7.1 5.8 4.7 BGA, Flip Chip 956 0.1 8.9 6.9 5.6 4.6 FBGA, Flip Chip 1020 0.1 9.7 7.7 6.3 5.2 FBGA, Flip Chip 1508 0.1 8.9 7.0 5.6 4.6 BGA, Flip Chip 956 0.1 8.8 6.8 5.5 4.5 FBGA, Flip Chip 1020 0.1 9.6 7.6 6.2 5.1 FBGA, Flip Chip 1508 0.1 8.8 6.9 5.5 4.5 Cyclone Series Devices Thermal Resistance Table 29 to Table 30 provide thermal resistance values for Cyclone series devices. Cyclone II Devices Table 29 lists the thermal resistance of Cyclone II devices. Table 29. Thermal Resistance of Cyclone II Devices (Part 1 of 2) Device EP2C5 © December 2011 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. TQFP, Wire Bond 144 10.0 31.0 29.3 27.9 25.5 PQFP, Wire Bond 208 5.5 30.4 29.2 27.3 22.3 FBGA, Wire Bond 256 8.7 30.2 26.1 23.6 21.7 Altera Corporation Package Information Datasheet for Mature Altera Devices 28 Package Information Datasheet for Mature Altera Devices Thermal Resistance Table 29. Thermal Resistance of Cyclone II Devices (Part 2 of 2) Device EP2C8 EP2C15 EP2C20 EP2C35 EP2C50 EP2C70 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. TQFP, Wire Bond 144 9.9 29.8 28.3 26.9 24.9 PQFP, Wire Bond 208 5.4 30.2 28.8 26.9 21.7 FBGA, Wire Bond 256 7.1 27.0 23.0 20.5 18.5 FBGA, Wire Bond 256 5.5 24.2 20.0 17.8 16.0 FBGA, Wire Bond 484 4.2 21.0 17.0 14.8 13.1 PQFP, Wire Bond 240 4.2 26.6 24.0 21.4 17.4 FBGA, Wire Bond 256 5.5 24.2 20.0 17.8 16.0 FBGA, Wire Bond 484 4.2 21.0 17.0 14.8 13.1 FBGA, Wire Bond 484 3.3 19.4 15.4 13.3 11.7 UBGA, Wire Bond 484 5.0 20.6 16.6 14.5 12.8 FBGA, Wire Bond 672 3.1 18.6 14.6 12.6 11.1 FBGA, Wire Bond 484 2.8 18.4 14.4 12.4 10.9 UBGA, Wire Bond 484 4.4 19.6 15.6 13.6 11.9 FBGA, Wire Bond 672 2.6 17.7 13.7 11.8 10.2 FBGA, Wire Bond 672 2.2 16.9 13.0 11.1 9.7 FBGA, Wire Bond 896 2.1 16.3 11.9 10.5 9.1 Cyclone Devices Table 30 lists the thermal resistance of Cyclone devices. Table 30. Thermal Resistance of Cyclone Devices (Part 1 of 2) Device EP1C3 EP1C6 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. TQFP 100 11.0 37.5 35.4 33.4 29.8 TQFP 144 10.0 31.1 29.4 27.9 25.5 TQFP 144 9.8 29.4 28.0 26.7 24.7 PQFP 240 4.3 27.2 24.7 22.1 17.8 FBGA 256 8.8 28.7 24.5 22.3 20.5 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 29 Table 30. Thermal Resistance of Cyclone Devices (Part 2 of 2) Device Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. PQFP 240 4.0 26.0 23.4 20.8 17.1 FBGA 256 6.6 24.3 20.2 18.1 16.4 FBGA 324 6.1 23.0 19.8 17.7 16.1 FBGA 324 5.0 21.0 17.7 15.6 14.1 FBGA 400 4.7 20.7 17.5 15.5 13.9 EP1C12 EP1C20 MAX Series Devices Thermal Resistance Table 31 through Table 33 provide thermal resistance values for MAX series devices. MAX 9000 Devices Table 31 lists the thermal resistance of MAX 9000 devices. Table 31. Thermal Resistance of MAX 9000 Devices Device EPM9320 EPM9320A EPM9400 EPM9480 EPM9560 EPM9560A © December 2011 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. PLCC 84 9.0 29.0 27.0 25.0 23.0 RQFP 208 1.0 17.0 16.0 15.0 13.0 PGA 280 2.0 14.0 10.0 7.0 5.0 BGA 356 2.0 14.0 12.0 11.0 10.0 PLCC 84 9.0 29.0 27.0 26.0 23.0 RQFP 208 2.0 17.0 16.0 15.0 13.0 BGA 356 1.0 12.0 11.0 10.0 9.0 PLCC 84 9.0 29.0 27.0 25.0 23.0 RQFP 208 1.0 17.0 16.0 15.0 13.0 RQFP 240 1.0 14.0 12.0 11.0 10.0 RQFP 208 1.0 17.0 16.0 15.0 12.0 RQFP 240 1.0 12.0 11.0 10.0 9.0 RQFP 208 1.0 17.0 16.0 15.0 12.0 RQFP 240 1.0 12.0 11.0 10.0 9.0 BGA 356 1.0 12.0 11.0 10.0 9.0 RQFP 208 1.0 17.0 16.0 15.0 12.0 RQFP 240 1.0 11.0 10.0 9.0 8.0 BGA 356 1.0 12.0 11.0 10.0 9.0 Altera Corporation Package Information Datasheet for Mature Altera Devices 30 Package Information Datasheet for Mature Altera Devices Thermal Resistance MAX 7000 Devices Table 32 lists the thermal resistance of MAX 7000 devices. Table 32. Thermal Resistance of MAX 7000 Devices (Part 1 of 3) Device Package Pin Count PLCC EPM7032 PQFP 44 TQFP PLCC EPM7032B TQFP UBGA EPM7032S EPM7032V EPM7032AE PLCC TQFP PLCC TQFP PLCC TQFP PLCC EPM7064S TQFP EPM7064B 44 44 JA (° C/W) 400 ft./min. 10.0 33.0 31.0 30.0 27.0 15.0 48.0 46.0 45.0 42.0 14.0 46.0 44.0 43.0 40.0 10.0 33.0 31.0 30.0 27.0 14.0 46.0 44.0 43.0 40.0 23.0 69.0 67.0 66.0 62.0 10.0 33.0 31.0 30.0 27.0 14.0 46.0 44.0 43.0 40.0 9.0 31.0 30.0 28.0 25.0 14.0 45.0 44.0 42.0 39.0 9.0 31.0 30.0 28.0 25.0 14.0 46.0 45.0 43.0 40.0 9.0 31.0 30.0 28.0 25.0 14.0 46.0 44.0 43.0 40.0 28.0 26.0 25.0 23.0 TQFP 100 11.0 39.0 37.0 35.0 32.0 TQFP 44 9.0 31.0 30.0 28.0 25.0 13.0 44.0 43.0 41.0 38.0 PLCC 84 9.0 28.0 26.0 25.0 22.0 PQFP 100 6.0 33.0 32.0 31.0 30.0 9.0 31.0 30.0 28.0 25.0 14.0 46.0 45.0 43.0 40.0 23.0 56.0 53.0 51.0 47.0 12.0 39.0 37.0 35.0 31.0 TQFP UBGA TQFP 44 49 100 21.0 49.0 47.0 44.0 40.0 PLCC 68 9.0 29.0 27.0 26.0 23.0 PLCC 84 9.0 28.0 26.0 24.0 22.0 PLCC 84 9.0 28.0 26.0 25.0 22.0 11.0 37.0 35.0 33.0 30.0 18.0 44.0 42.0 39.0 35.0 TQFP EPM7128A 44 JA (° C/W) 200 ft./min. 9.0 FBGA EPM7096 44 JA (° C/W) 100 ft./min. 84 PLCC EPM7064AE 49 JA (° C/W) Still Air PLCC PLCC EPM7064 44 JC (° C/W) FBGA 100 TQFP 144 9.0 31.0 29.0 28.0 25.0 FBGA 256 12.0 38.0 36.0 34.0 31.0 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 31 Table 32. Thermal Resistance of MAX 7000 Devices (Part 2 of 3) Device Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. UBGA 49 22.0 53.0 50.0 48.0 44.0 11.0 38.0 36.0 34.0 31.0 19.0 46.0 44.0 41.0 37.0 TQFP EPM7128B EPM7128E EPM7128S FBGA TQFP 144 9.0 32.0 30.0 29.0 26.0 UBGA 169 16.0 44.0 42.0 39.0 35.0 FBGA 256 13.0 40.0 38.0 36.0 33.0 PLCC 84 10.0 29.0 28.0 26.0 23.0 PQFP 100 6.0 32.0 31.0 30.0 29.0 PQFP 160 6.0 32.0 31.0 30.0 28.0 PLCC 84 10.0 30.0 28.0 26.0 23.0 12.0 38.0 36.0 34.0 30.0 10.0 35.0 34.0 33.0 32.0 7.0 33.0 32.0 31.0 30.0 TQFP PQFP EPM7160E EPM7160S EPM7192S EPM7192E EPM7256A EPM7256B © December 2011 100 PQFP 160 PLCC 84 TQFP EPM7128AE 100 FBGA 100 11.0 30.0 28.0 26.0 23.0 12.0 38.0 36.0 34.0 30.0 14.0 43.0 40.0 38.0 37.0 TQFP 144 11.0 33.0 30.0 28.0 26.0 UBGA 169 14.0 42.0 40.0 38.0 36.0 FBGA 256 12.0 39.0 37.0 35.0 31.0 PLCC 84 10.0 29.0 28.0 26.0 23.0 PQFP 100 6.0 32.0 31.0 30.0 29.0 PQFP 160 6.0 33.0 32.0 31.0 30.0 PLCC 84 10.0 35.0 28.0 26.0 23.0 TQFP 100 12.0 37.0 35.0 33.0 30.0 PQFP 160 6.0 33.0 32.0 31.0 30.0 PQFP 160 6.0 32.0 31.0 30.0 29.0 6.0 20.0 13.0 10.0 8.0 6.0 32.0 31.0 30.0 26.0 PGA PQFP 160 TQFP 100 9.0 36.0 34.0 32.0 30.0 TQFP 144 8.0 32.0 27.0 25.0 24.0 PQFP 208 5.0 30.0 28.0 26.0 21.0 FBGA 256 12.0 34.0 32.0 29.0 28.0 TQFP 100 12.0 37.0 35.0 33.0 30.0 TQFP 144 9.0 33.0 29.0 27.0 25.0 UBGA 169 13.0 40.0 38.0 36.0 34.0 PQFP 208 5.0 31.0 29.0 27.0 22.0 FBGA 256 9.0 34.0 32.0 30.0 28.0 Altera Corporation Package Information Datasheet for Mature Altera Devices 32 Package Information Datasheet for Mature Altera Devices Thermal Resistance Table 32. Thermal Resistance of MAX 7000 Devices (Part 3 of 3) Device EPM7256E EPM7256S EPM7256AE EPM7512AE Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. PGA 192 6.0 20.0 13.0 10.0 8.0 PQFP 160 6.0 31.0 30.0 29.0 25.0 RQFP 208 1.0 17.0 16.0 15.0 13.0 5.0 30.0 29.0 26.0 21.0 1.0 18.0 17.0 16.0 15.0 PQFP RQFP FBGA 100 13.0 42.0 39.0 37.0 36.0 TQFP 100 12.0 37.0 35.0 33.0 30.0 TQFP 144 9.0 33.0 29.0 27.0 25.0 PQFP 208 5.0 31.0 29.0 27.0 22.0 FBGA 256 9.0 34.0 32.0 30.0 28.0 TQFP 144 10.0 32.0 27.0 25.0 23.0 PQFP 208 5.0 30.0 28.0 25.0 21.0 1.2 14.0 12.0 11.0 10.0 BGA FBGA EPM7512B 208 256 11.0 32.0 30.0 28.0 22.0 TQFP 144 10.0 32.0 27.0 25.0 24.0 UBGA 169 12.0 35.0 33.0 31.0 30.0 PQFP 208 5.0 30.0 28.0 25.0 21.0 BGA 256 1.2 14.0 12.0 11.0 10.0 FBGA 256 11.0 32.0 30.0 28.0 27.0 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 33 MAX 3000A Devices Table 33 lists the thermal resistance of MAX 3000A devices. Table 33. Thermal Resistance of MAX 3000A Devices Device EPM3032A Package TQFP PLCC TQFP EPM3064A EPM3128A EPM3256A EPM3512A PLCC Pin Count 44 44 JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. 14.0 46.0 45.0 43.0 40.0 9.0 31.0 30.0 28.0 25.0 14.0 46.0 45.0 43.0 40.0 9.0 31.0 30.0 28.0 25.0 TQFP 100 12.0 39.0 37.0 35.0 31.0 TQFP 100 12.0 38.0 36.0 34.0 30.0 TQFP 144 9.0 33.0 29.0 27.0 25.0 PQFP 208 5.0 31.0 29.0 27.0 22.0 PQFP 208 5.0 30.0 28.0 25.0 21.0 FBGA 256 11.0 32.0 30.0 28.0 22.0 HardCopy Series Devices Thermal Resistance Table 34 to Table 35 provide thermal resistance values for HardCopy series devices. © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 34 Package Information Datasheet for Mature Altera Devices Thermal Resistance HardCopy II Devices Table 34 lists the thermal resistance of HardCopy II devices. Table 34. Thermal Resistance of HardCopy II Devices JA (° C/W) JA (° C/W) 100 ft./min. 200 ft./min. JA (° C/W) 400 ft./min. JB (° C/W) 15.3 13.8 9.6 9.9 8.3 7.1 3.6 11.7 9.5 8.0 6.8 3.5 0.3 10.8 8.6 7.1 6.0 2.9 1020 0.2 10.6 8.4 6.9 5.8 2.7 1508 0.2 9.7 7.5 6.1 5.0 2.6 Device Package Pin Count JC (° C/W) JA (° C/W) Still Air HC210 FBGA, Wire Bond 484 5.5 21.3 17.4 FBGA, Flip Chip 672 0.5 12.1 FBGA, Flip Chip 780 0.5 FBGA, Flip Chip 1020 FBGA, Flip Chip FBGA, Flip Chip HC220 HC230 HC240 HardCopy Devices Table 35 lists the thermal resistance of HardCopy devices. Table 35. Thermal Resistance of HardCopy Devices Device Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. HC20K400 BGA, Flip Chip 652 0.5 9.1 7.9 6.4 5.3 HC20K600 FBGA, Flip Chip 672 1.0 13.0 10.2 8.6 7.3 3.7 19.7 15.8 13.9 12.4 3.4 19.3 15.6 13.8 12.3 HC1S25 FBGA, Wire Bond BGA, Wire Bond 672 HC1S30 FBGA, Flip Chip 780 0.4 10.9 8.8 7.4 6.3 HC1S40 FBGA, Flip Chip 780 0.4 10.9 8.8 7.4 6.3 HC1S60 FBGA, Flip Chip 1020 0.3 10.3 8.54 7.0 5.8 HC1S80 FBGA, Flip Chip 1020 0.3 10.3 8.54 7.0 5.8 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 35 APEX Series Devices Thermal Resistance Table 36 to Table 37 list thermal resistance values for APEX series devices. APEX II Devices Table 36 lists the thermal resistance of APEX II devices. Table 36. Thermal Resistance of APEX II Devices Device Package FBGA, Flip Chip (Cu lid) EP2A15 FBGA, Flip Chip (AlSiC lid) BGA, Flip Chip (Cu lid) BGA, Flip Chip (AlSiC lid) FBGA (Cu lid) FBGA, Flip Chip (AlSiC lid) EP2A25 BGA, Flip Chip (Cu lid) BGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) EP2A40 BGA, Flip Chip (Cu lid) BGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) BGA, Flip Chip (Cu lid) EP2A70 BGA, Flip Chip (AlSiC lid) FBGA, Flip Chip (Cu lid) FBGA, Flip Chip (AlSiC lid) © December 2011 Altera Corporation Pin Count 672 724 672 724 1020 672 724 1020 724 1508 JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. 0.2 10.8 8.8 7.4 6.2 0.3 11.6 9.6 8.0 6.6 0.2 9.7 7.7 6.4 5.3 0.4 10.0 8.2 6.6 5.4 0.2 10.7 8.7 7.2 6.1 0.3 11.5 9.6 8.0 6.6 0.2 9.6 7.6 6.2 5.2 0.3 10.0 8.2 6.6 5.4 0.2 9.8 7.8 6.4 5.3 0.3 10.4 8.5 6.9 5.7 0.2 10.0 8.2 6.9 5.9 0.2 10.0 8.2 6.9 5.9 0.2 9.5 7.5 6.1 5.1 0.2 9.5 7.5 6.1 5.1 0.2 9.7 7.7 6.3 5.2 0.2 9.7 7.7 6.3 5.2 0.1 9.3 7.3 6.0 4.9 0.1 10.0 7.9 6.4 5.3 0.1 8.8 6.8 5.5 4.5 0.1 9.3 7.3 5.8 4.7 Package Information Datasheet for Mature Altera Devices 36 Package Information Datasheet for Mature Altera Devices Thermal Resistance APEX 20K Devices Table 37 lists the thermal resistance of APEX 20KE, 20KC, and 20K devices. Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 1 of 3) Device EP20K30E EP20K60E EP20K100 EP20K100E EP20K160E EP20K200 EP20K200E Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. TQFP 144 8.0 29.0 28.0 26.0 25.0 PQFP 208 5.0 30.0 29.0 27.0 22.0 FBGA 144 14.0 36.0 34.0 32.0 29.0 FBGA 324 9.0 31.0 29.0 28.0 25.0 TQFP 144 7.0 28.0 26.0 25.0 24.0 FBGA 144 11.0 33.0 32.0 30.0 27.0 PQFP 208 5.0 30.0 28.0 26.0 21.0 PQFP 240 4.0 26.0 24.0 21.0 17.0 FBGA 324 7.0 29.0 28.0 26.0 24.0 BGA 356 1.0 12.0 11.0 10.0 9.0 TQFP 144 7.0 26.0 25.0 24.0 23.0 PQFP 208 5.0 29.0 27.0 25.0 20.0 PQFP 240 4.0 25.0 23.0 20.0 17.0 FBGA 324 6.0 28.0 26.0 25.0 23.0 BGA 356 1.0 12.0 11.0 10.0 9.0 TQFP 144 7.0 26.0 25.0 24.0 23.0 FBGA 144 9.0 32.0 30.0 29.0 26.0 PQFP 208 5.0 29.0 27.0 25.0 20.0 PQFP 240 4.0 25.0 23.0 20.0 17.0 FBGA 324 6.0 28.0 26.0 25.0 23.0 BGA 356 1.0 12.0 11.0 10.0 9.0 TQFP 144 6.0 25.0 24.0 23.0 22.0 PQFP 208 5.0 28.0 26.0 23.0 19.0 PQFP 240 4.0 24.0 21.0 19.0 16.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 24.0 23.0 22.0 21.0 PQFP 208 4.0 25.0 23.0 20.0 17.0 PQFP 240 3.0 21.0 19.0 17.0 15.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 22.0 21.0 20.0 19.0 PQFP 208 4.0 25.0 23.0 20.0 17.0 PQFP 240 3.0 22.0 19.0 18.0 16.0 BGA 356 2.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 23.0 22.0 21.0 20.0 BGA 652 1.0 12.0 11.0 10.0 9.0 FBGA 672 5.0 21.0 20.0 19.0 18.0 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 37 Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 2 of 3) Device EP20K200C EP20K300E EP20K400 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. PQFP 208 4.0 25.0 23.0 20.0 17.0 PQFP 240 3.0 22.0 19.0 18.0 16.0 BGA 356 2.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 23.0 22.0 21.0 20.0 PQFP 240 3.0 19.0 18.0 16.0 15.0 BGA 652 1.0 12.0 11.0 10.0 9.0 FBGA 672 5.0 20.0 19.0 18.0 17.0 BGA 652 0.5 9.0 8.0 7.0 6.0 PGA 655 1.0 8.0 7.0 6.0 4.0 FBGA 672 0.4 11.6 9.6 7.9 6.5 FBGA w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6 BGA 652 0.5 9.0 8.0 7.0 6.0 0.3 10.9 8.8 7.4 6.3 EP20K400E FBGA (Cu lid) EP20K400C FBGA (AlSiC lid) 0.4 11.7 9.7 8.0 6.7 FBGA w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6 BGA 652 0.5 9.0 8.0 7.0 6.0 0.2 10.8 8.7 7.3 6.1 0.3 11.6 9.6 7.9 6.5 0.5 5.0 3.0 3.0 2.0 0.2 9.9 7.8 6.5 5.4 0.3 10.4 8.4 6.8 5.6 FBGA (Cu lid) EP20K600E EP20K600C FBGA (AlSiC lid) FBGA w/ fin (1) FBGA (Cu lid) FBGA (AlSiC lid) FBGA w/ fin (1) BGA (Cu lid) BGA (AlSiC lid) FBGA w/ fin (1) EP20K1000E EP20K1000C FBGA (Cu lid) FBGA (AlSiC lid) FBGA w/ fin (1) FBGA (Cu lid) FBGA (AlSiC lid) FBGA w/ fin (1) © December 2011 672 Altera Corporation 672 672 1,020 1,020 652 652 672 672 1,020 1,020 0.5 5.0 3.0 3.0 2.0 0.1 8.3 7.0 5.6 4.5 0.2 9.3 7.4 6.0 4.9 0.5 4.0 3.0 3.0 2.0 0.1 10.6 8.6 7.2 6.0 0.2 11.4 9.4 7.7 6.3 0.5 6.0 4.0 3.0 2.0 0.1 9.7 7.7 6.3 5.2 0.2 10.2 8.2 6.6 5.4 0.5 5.0 3.0 2.0 2.0 Package Information Datasheet for Mature Altera Devices 38 Package Information Datasheet for Mature Altera Devices Thermal Resistance Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 3 of 3) Device Package BGA (Cu lid) BGA (AlSiC lid) EP20K1500E Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. 0.1 8.2 6.9 5.5 4.4 0.2 9.2 7.3 5.8 4.8 652 FBGA 652 0.1 9.2 7.3 5.8 4.8 FBGA w/ fin (1) 652 0.5 4.0 3.0 2.5 2.0 0.1 9.6 7.6 6.2 5.1 0.2 10.1 8.1 6.4 5.3 0.5 5.0 3.0 2.5 2.0 FBGA (Cu lid) FBGA (AlSiC lid) FBGA w/ fin (1) 1,020 1,020 Note to Table 37: (1) “fin” is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera performed the thermal calculations in Table 37 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base thickness: 0.5 mm. ACEX 1K Devices Thermal Resistance Table 38 provides thermal resistance values for ACEX 1K devices. Table 38. Thermal Resistance of ACEX 1K Devices Device EP1K10 EP1K30 EP1K50 EP1K100 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. TQFP 100 11.0 37.0 35.0 33.0 29.0 TQFP 144 8.0 31.0 29.0 28.0 25.0 PQFP 208 6.0 30.0 29.0 27.0 22.0 FBGA 256 12.0 37.0 35.0 33.0 30.0 TQFP 144 8.0 28.0 27.0 26.0 24.0 PQFP 208 5.0 30.0 28.0 26.0 21.0 FBGA 256 9.0 31.0 29.0 28.0 25.0 TQFP 144 7.0 26.0 25.0 24.0 23.0 PQFP 208 5.0 29.0 28.0 25.0 20.0 FBGA 256 7.0 30.0 28.0 27.0 24.0 FBGA 484 5.0 25.0 24.0 23.0 22.0 PQFP 208 5.0 28.0 26.0 23.0 18.0 FBGA 256 6.0 28.0 26.0 25.0 23.0 FBGA 484 5.0 24.0 23.0 22.0 21.0 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 39 Mercury Devices Thermal Resistance Table 39 provides thermal resistance values for Mercury devices. Table 39. Thermal Resistance of Mercury Devices Device EP1M120 EP1M350 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. FBGA (Cu lid) 484 0.6 12.2 10.1 8.7 7.5 FBGA (AlSiC lid) 484 0.9 13.0 11.1 9.3 7.9 FBGA (Cu lid) 780 0.2 10.5 8.5 7.1 5.9 FBGA (AlSiC lid) 780 0.3 11.0 9.2 7.6 6.3 FLEX Series Devices Thermal Resistance Table 40 through Table 42 provide thermal resistance values for FLEX series devices. FLEX 10K Devices Table 40 lists the thermal resistance of FLEX 10K devices. Table 40. Thermal Resistance of FLEX 10K Devices (Part 1 of 3) Device EPF10K10 EPF10K10A EPF10K20 EPF10K30 EPF10K30A EPF10K30E © December 2011 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. PLCC 84 9.0 28.0 26.0 24.0 22.0 TQFP 144 7.0 26.0 25.0 24.0 23.0 PQFP 208 5.0 29.0 27.0 25.0 20.0 TQFP 100 10.0 35.0 33.0 31.0 28.0 TQFP 144 7.0 29.0 28.0 26.0 25.0 PQFP 208 5.0 30.0 29.0 27.0 21.0 FBGA 256 7.0 33.0 30.0 28.0 26.0 TQFP 144 6.0 24.0 23.0 22.0 21.0 RQFP 208 1.0 17.0 16.0 15.0 13.0 RQFP 240 1.0 14.0 12.0 11.0 10.0 RQFP 208 1.0 17.0 16.0 15.0 12.0 RQFP 240 1.0 13.0 12.0 11.0 10.0 BGA 356 1.0 12.0 11.0 10.0 9.0 TQFP 144 7.0 25.0 24.0 23.0 22.0 PQFP 208 5.0 29.0 27.0 24.0 19.0 PQFP 240 4.0 25.0 22.0 20.0 17.0 FBGA 256 6.0 28.0 26.0 24.0 23.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 24.0 22.0 21.0 20.0 TQFP 144 9.0 28.0 27.0 26.0 24.0 PQFP 208 5.0 30.0 28.0 26.0 21.0 FBGA 256 9.0 31.0 29.0 28.0 25.0 FBGA 484 6.0 26.0 25.0 24.0 22.0 Altera Corporation Package Information Datasheet for Mature Altera Devices 40 Package Information Datasheet for Mature Altera Devices Thermal Resistance Table 40. Thermal Resistance of FLEX 10K Devices (Part 2 of 3) Device EPF10K40 EPF10K50 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. RQFP 208 1.0 17.0 16.0 15.0 12.0 RQFP 240 1.0 13.0 12.0 11.0 10.0 RQFP 240 1.0 12.0 11.0 10.0 9.0 BGA 356 1.0 12.0 11.0 10.0 9.0 3.0 12.0 10.0 9.0 8.0 PGA PGA (1) EPF10K50V EPF10K50E EPF10K50S EPF10K70 403 3.0 10.0 8.0 7.0 6.0 PQFP 240 4.0 25.0 22.0 20.0 17.0 RQFP 240 1.0 13.0 12.0 11.0 10.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 23.0 22.0 21.0 20.0 TQFP 144 9.0 26.0 25.0 24.0 23.0 PQFP 208 5.0 29.0 27.0 24.0 19.0 PQFP 240 4.0 25.0 22.0 20.0 17.0 FBGA 256 6.0 29.0 27.0 26.0 24.0 FBGA 484 5.0 25.0 24.0 23.0 21.0 TQFP 144 9.0 26.0 25.0 24.0 23.0 PQFP 208 5.0 29.0 28.0 25.0 20.0 PQFP 240 4.0 26.0 23.0 20.0 17.0 FBGA 256 7.0 30.0 28.0 27.0 24.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 25.0 24.0 23.0 22.0 RQFP 240 1.0 12.0 11.0 10.0 9.0 PGA 503 1.0 8.0 7.0 6.0 4.0 1.0 8.0 7.0 6.0 4.0 1.0 6.0 5.0 4.0 3.0 — 2.0 — — — PGA EPF10K100 PGA (1) 503 PGA (2) EPF10K100A EPF10K100E EPF10K130V RQFP 240 1.0 13.0 11.0 10.0 9.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 22.0 21.0 20.0 18.0 BGA 600 0.5 10.0 9.0 8.0 7.0 PQFP 208 5.0 28.0 26.0 23.0 18.0 PQFP 240 4.0 23.0 21.0 19.0 16.0 FBGA 256 6.0 28.0 26.0 25.0 23.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 24.0 23.0 22.0 21.0 PGA 599 1.0 8.0 7.0 6.0 4.0 BGA 600 0.5 10.0 9.0 8.0 7.0 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 41 Table 40. Thermal Resistance of FLEX 10K Devices (Part 3 of 3) Device EPF10K130E EPF10K200E EPF10K200S EPF10K250A Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. PQFP 240 4.0 21.0 19.0 17.0 15.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 23.0 22.0 21.0 20.0 BGA 600 0.5 10.0 9.0 8.0 7.0 FBGA 672 5.0 21.0 20.0 19.0 18.0 PGA 599 1.0 8.0 7.0 6.0 4.0 BGA 600 0.5 10.0 9.0 8.0 7.0 FBGA 672 5.0 20.0 19.0 18.0 17.0 RQFP 240 1.0 13.0 11.0 10.0 9.0 BGA 356 1.0 12.0 11.0 10.0 9.0 FBGA 484 5.0 22.0 21.0 20.0 19.0 BGA 600 0.5 10.0 9.0 8.0 7.0 FBGA 672 5.0 21.0 20.0 19.0 18.0 PGA 599 1.0 8.0 7.0 6.0 4.0 BGA 600 0.5 10.0 9.0 8.0 7.0 Notes to Table 40: (1) With attached pin-fin heat sink. (2) With attached motor-driven fan heat sink. FLEX 8000 Devices Table 41 lists the thermal resistance of FLEX 8000 devices. Table 41. Thermal Resistance of FLEX 8000 Devices (Part 1 of 2) Device EPF8282A EPF8452A EPF8636A © December 2011 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. PLCC 84 10.0 30.0 28.0 26.0 23.0 TQFP 100 11.0 36.0 34.0 32.0 29.0 PLCC 84 10.0 30.0 28.0 26.0 23.0 TQFP 100 11.0 35.0 33.0 31.0 28.0 PQFP 160 6.0 32.0 31.0 30.0 28.0 PLCC 84 10.0 29.0 28.0 26.0 23.0 PQFP 160 6.0 32.0 31.0 30.0 27.0 PGA 192 6.0 16.0 11.0 8.0 6.0 PQFP 208 5.0 30.0 38.0 26.0 20.0 RQFP 208 1.0 17.0 16.0 15.0 14.0 Altera Corporation Package Information Datasheet for Mature Altera Devices 42 Package Information Datasheet for Mature Altera Devices Thermal Resistance Table 41. Thermal Resistance of FLEX 8000 Devices (Part 2 of 2) Device EPF8820A EPF81188A EPF81500A Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. TQFP 144 9.0 26.0 25.0 24.0 23.0 PQFP 160 6.0 32.0 31.0 30.0 27.0 PQFP 208 5.0 29.0 27.0 25.0 20.0 RQFP 208 1.0 17.0 16.0 15.0 14.0 BGA 225 6.0 28.0 19.0 14.0 11.0 PQFP 208 5.0 28.0 26.0 24.0 19.0 PGA 232 2.0 14.0 10.0 7.0 5.0 PQFP 240 4.0 24.0 21.0 19.0 16.0 RQFP 240 1.0 14.0 12.0 11.0 10.0 PQFP 240 4.0 22.0 20.0 19.0 16.0 RQFP 240 1.0 13.0 12.0 11.0 10.0 PGA 280 2.0 14.0 10.0 7.0 5.0 FLEX 6000 Devices Table 42 lists the thermal resistance of FLEX 6000 devices. Table 42. Thermal Resistance of FLEX 6000 Devices Device EPF6010A EPF6016 Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. TQFP 100 11.0 35.0 33.0 31.0 28.0 TQFP 144 10.0 28.0 26.0 25.0 24.0 TQFP 144 10.0 28.0 26.0 25.0 24.0 PQFP 208 5.0 30.0 28.0 26.0 21.0 PQFP 240 4.0 26.0 24.0 21.0 17.0 BGA 256 6.0 28.0 22.0 20.0 19.0 11.0 35.0 33.0 31.0 28.0 14.0 36.0 34.0 32.0 29.0 10.0 29.0 28.0 26.0 24.0 TQFP FBGA EPF6016A EPF6024A 100 TQFP 144 PQFP 208 5.0 30.0 29.0 26.0 21.0 FBGA 256 10.0 32.0 30.0 29.0 26.0 TQFP 144 10.0 27.0 26.0 25.0 24.0 PQFP 208 5.0 29.0 28.0 26.0 20.0 PQFP 240 4.0 26.0 23.0 21.0 17.0 6.0 28.0 22.0 20.0 19.0 8.0 30.0 29.0 27.0 25.0 BGA FBGA 256 Excalibur Devices Thermal Resistance Table 43 provides thermal resistance values for Excalibur devices. Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Thermal Resistance 43 Table 43. Thermal Resistance of Excalibur Embedded Processor Solutions Package Pin Count JC (° C/W) JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. FBGA 484 4.0 20.0 18.3 15.8 13.9 FBGA, Flip Chip (Cu lid) 672 0.5 11.3 9.3 7.9 6.7 FBGA, Flip Chip (AlSiC lid) 672 0.8 12.2 10.2 8.6 7.2 Device EPXA1 EPXA4 EPXA10 FBGA, Flip Chip (Cu lid) 672 0.2 10.8 8.8 7.3 6.2 FBGA, Flip Chip (AlSiC lid) 672 0.3 11.6 9.6 7.9 6.6 FBGA, Flip Chip (Cu lid) 1,020 0.2 9.9 7.9 6.5 5.4 FBGA, Flip Chip (AlSiC lid) 1,020 0.3 10.4 8.5 6.9 5.7 FBGA, Flip Chip (Cu lid) 1,020 0.1 9.6 7.6 6.2 5.1 FBGA, Flip Chip (AlSiC lid) 1,020 0.2 10.0 8.0 6.4 5.7 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 44 Package Information Datasheet for Mature Altera Devices Package Outlines Package Outlines The package outlines on the following pages are listed in order of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. 1 All lidless flip chip and wire bond packages are non-vented packages. All other flip chip packages are vented packages. Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 45 8-Pin Plastic Dual In-Line Package (PDIP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in inches. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference P Package Acronym PDIP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-001 Variation: BA Lead Coplanarity NA Weight 0.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Inches Symbol Min. Nom. Max. A — — 0.170 A1 0.015 — — A2 D 0.360 — 0.380 E 0.300 0.310 0.325 E1 0.240 0.250 0.260 L 0.125 — 0.135 b 0.016 0.018 0.020 c 0.008 0.010 0.014 e © December 2011 Altera Corporation 0.130 TYP 0.100 BSC Package Information Datasheet for Mature Altera Devices 46 Package Information Datasheet for Mature Altera Devices Package Outline D Pin 8 E E1 Pin 1 ID Pin 4 c Pin 1 A A2 A1 e L b Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 47 20-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in inches. ■ Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1's proximity, on package surface. Package Information Description Specification Ordering Code Reference L Package Acronym PLCC Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-018 Variation: AA Lead Coplanarity 0.004 inches (0.10mm) Weight 0.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Inches Symbol Min. Nom. Max. A 0.165 0.172 0.180 A1 0.020 — — A2 © December 2011 Altera Corporation 0.150 TYP D 0.385 0.390 0.395 D1 0.350 0.353 0.356 D2 0.290 0.310 0.330 E 0.385 0.390 0.395 E1 0.350 0.353 0.356 E2 0.290 0.310 0.330 b 0.013 — 0.021 c 0.010 TYP e 0.050 TYP Package Information Datasheet for Mature Altera Devices 48 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 49 32-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference T Package Acronym TQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-026 Variation: ABA Lead Coplanarity 0.004 inches (0.1mm) Weight 0.2 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.20 A1 0.05 — 0.15 A2 0.95 1.00 1.05 D 9.00 BSC D1 7.00 BSC E 9.00 BSC E1 L 7.00 BSC 0.45 L1 S 0.20 — — b 0.30 0.37 0.45 c 0.09 — 0.20  Altera Corporation 0.75 1.00 REF e © December 2011 0.60 0.80 BSC 0 3.5 7 Package Information Datasheet for Mature Altera Devices 50 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 51 44-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in inches. ■ Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1’s proximity, on package surface. Package Information Description Specification Ordering Code Reference L Package Acronym PLCC Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-018 Variation: AC Lead Coplanarity 0.004 inches (0.10 mm) Weight 2.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Inches Symbol Min. Nom. Max. A 0.165 0.172 0.180 A1 0.020 — — A2 © December 2011 Altera Corporation 0.150 TYP D 0.685 0.690 0.695 D1 0.650 0.653 0.656 D2 0.582 0.610 0.638 E 0.685 0.690 0.695 E1 0.650 0.653 0.656 E2 0.582 0.610 0.638 b 0.013 — 0.021 c 0.010 TYP e 0.050 TYP Package Information Datasheet for Mature Altera Devices 52 Package Information Datasheet for Mature Altera Devices Package Outline D D1 Pin 1 Pin 44 Pin 7 Pin 1 ID E2 E E1 Pin 17 e c A A2 b A1 D2 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 53 44-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference T Package Acronym TQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-026 Variation: ACB Lead Coplanarity 0.004 inches (0.1mm) Weight 0.3 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.20 A1 0.05 — 0.15 A2 0.95 — — D 12.00 BSC D1 10.00 BSC E 12.00 BSC E1 L 10.00 BSC 0.45 L1 S 0.20 — — b 0.30 0.37 0.45 c 0.09 — 0.20  Altera Corporation 0.75 1.00 REF e © December 2011 0.60 0.80 BSC 0 3.5 7 Package Information Datasheet for Mature Altera Devices 54 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 55 49-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference U Package Acronym UBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-216 Variation: BAB-2 Lead Coplanarity 0.005 inches (0.12mm) Weight 0.2 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.55 A1 0.20 — — A2 — — 1.35 A3 0.70 TYP D 7.00 BSC E 7.00 BSC b e © December 2011 Altera Corporation 0.40 0.50 0.60 0.80 BSC Package Information Datasheet for Mature Altera Devices 56 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 57 64-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference E Package Acronym EQFP Leadframe Material Copper Lead Finish (plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-026 Variation: ABD-HD Lead Coplanarity 0.003 inch (0.08 mm) Weight 0.15 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.20 A1 0.05 — 0.15 A2 0.95 1.00 1.05 D 9.00 BSC D1 7.00 BSC D2 3.50 E 9.00 BSC E1 7.00 BSC 3.50 4.50 5.50 L 0.45 0.60 0.75 1.00 REF S 0.20 — — b 0.13 0.18 0.23 c 0.09 — 0.20 e  Altera Corporation 5.50 E2 L1 © December 2011 4.50 0.40 BSC 0° 3.5° 7° Package Information Datasheet for Mature Altera Devices 58 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW Pin 64 Pin 64 Pin 1 Pin 1 Pin 1 ID Pin 16 Pin 16 See Detail A Detail A Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 59 84-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in inches. ■ Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1's proximity, on package surface. Package Information Description Specification Ordering Code Reference L Package Acronym PLCC Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-018 Variation: AF Lead Coplanarity 0.004 inches (0.10mm) Weight 7.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Inches Symbol Min. Nom. Max. A 0.165 0.172 0.180 A1 0.020 — — A2 © December 2011 Altera Corporation 0.150 TYP D 1.185 1.190 1.195 D1 1.150 1.154 1.158 D2 1.082 1.110 1.138 E 1.185 1.190 1.195 E1 1.150 1.154 1.158 E2 1.082 1.110 1.138 b 0.013 — 0.021 c 0.008 TYP e 0.050 TYP Package Information Datasheet for Mature Altera Devices 60 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 61 88-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference U Package Acronym UBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline MO-219 Lead Coplanarity 0.005 inches (0.12 mm) Weight 0.4 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.40 A1 0.25 — — A2 0.80 — — A3 0.70 REF D 11.00 BSC E 8.00 BSC b e © December 2011 Altera Corporation 0.40 0.45 0.50 0.80 BSC Package Information Datasheet for Mature Altera Devices 62 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E Pin A1 ID e E F G H b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 63 100-Pin FineLine Ball-Grid Array (FBGA), Option 1—Wire Bond 1 ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface. This POD is applicable to F100 packages of all products except MAX II, which is assembled in Option 2 package outlines. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder ball composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-192 Variation: AAC-1 Lead Coplanarity 0.008 inches (0.20mm) Weight 0.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Max. A — — 1.70 0.30 — — A2 0.25 — 1.10 A3 — — 0.80 D 11.00 BSC E 11.00 BSC e Altera Corporation Nom. A1 b © December 2011 Min. 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 64 Package Information Datasheet for Mature Altera Devices Package Outline BOTTOM VIEW TOP VIEW D Pin A1 Corner Pin A1 ID e E b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 65 100-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface. Package Information Description Specification Ordering Code Reference Q Package Acronym PQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-022 Variation: GC-1 Lead Coplanarity 0.004 inches (0.10mm) Weight 1.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.40 A1 0.25 — 0.50 A2 2.50 2.70 2.90 D 17.20 BSC D1 14.00 BSC E 23.20 BSC E1 20.00 BSC L 0.73 L1 1.60 REF 0.20 — — b 0.22 — 0.40 c 0.11 — 0.23  Altera Corporation 1.03 S e © December 2011 0.88 0.65 BSC 0 — 7 Package Information Datasheet for Mature Altera Devices 66 Package Information Datasheet for Mature Altera Devices Package Outline D D1 Pin 100 Pin 1 Pin 1 ID E E1 Pin 30 A A2 A1 See Detail A Detail A e C Gage Plane b S L 0.25mm L1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 67 100-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference T Package Acronym TQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-026 Variation: AED Lead Coplanarity 0.003 inches (0.08mm) Weight 0.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.20 A1 0.05 — 0.15 A2 0.95 1.00 1.05 D 16.00 BSC D1 14.00 BSC E 16.00 BSC E1 14.00 BSC L 0.45 L1 1.00 REF 0.20 — — b 0.17 0.22 0.27 c 0.09 — 0.20  Altera Corporation 0.75 S e © December 2011 0.60 0.50 BSC 0 3.5 7 Package Information Datasheet for Mature Altera Devices 68 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 69 144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference E Package Acronym EQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-026 Variation: BFB Lead Coplanarity 0.003 inches (0.08mm) Weight 1.1 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.60 A1 0.05 — 0.15 A2 1.35 1.40 1.45 D 22.00 BSC D1 20.00 BSC D2 4.00 E 22.00 BSC E1 20.00 BSC 4.00 — — L 0.45 0.60 0.75 1.00 REF S 0.20 — — b 0.17 0.22 0.27 c 0.09 — 0.20 e  Altera Corporation — E2 L1 © December 2011 — 0.50 BSC 0 3.5 7 Package Information Datasheet for Mature Altera Devices 70 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 71 144-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-192 Variation: AAD-1 Lead Coplanarity 0.008 inches (0.20mm) Weight 0.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.20 A1 0.30 — — A2 0.25 — 1.80 A3 0.70 REF D 13.00 BSC E 13.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 72 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 73 144-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference T Package Acronym TQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-026 Variation: BFB Lead Coplanarity 0.003 inches (0.08mm) Weight 1.1 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.60 A1 0.05 — 0.15 A2 1.35 1.40 1.45 D 22.00 BSC D1 20.00 BSC E 22.00 BSC E1 L 20.00 BSC 0.45 L1 S 0.20 — — b 0.17 0.22 0.27 c 0.09 — 0.20  Altera Corporation 0.75 1.00 REF e © December 2011 0.60 0.50 BSC 0 3.5 7 Package Information Datasheet for Mature Altera Devices 74 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 75 160-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in inches. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference G Package Acronym PGA Leadframe Material Alloy 42 Lead Finish Gold Over Nickel Plate JEDEC Outline Reference MO-067 Variation: AG Lead Coplanarity N/A Weight 19.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Inches Symbol A Min. Nom. Max. 0.160 0.190 0.220 A1 0.050 TYP A2 0.120 0.140 0.160 D 1.540 1.560 1.580 E 1.540 1.560 1.580 L b e © December 2011 Altera Corporation 0.130 TYP 0.016 0.018 0.020 0.100 BSC Package Information Datasheet for Mature Altera Devices 76 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 77 160-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference Q Package Acronym PQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-022 Variation: DD-1 Lead Coplanarity 0.004 inches (0.10mm) Weight 6.2 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 4.10 A1 0.25 — 0.50 A2 3.20 3.40 3.60 D 31.20 BSC D1 28.00 BSC E 31.20 BSC E1 28.00 BSC L 0.50 L1 1.60 REF 0.20 — — b 0.22 — 0.40 c 0.09 — 0.23 e Altera Corporation 1.03 S  © December 2011 — 0.65 BSC 0 — 7 Package Information Datasheet for Mature Altera Devices 78 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 79 169-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference U Package Acronym UBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-216 Variation: BAF-1 Lead Coplanarity 0.005 inches (0.12mm) Weight 0.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.70 A1 0.20 — — A2 0.65 — — A3 0.70 TYP D 11.00 BSC E 11.00 BSC b e © December 2011 Altera Corporation 0.40 0.50 0.60 0.80 BSC Package Information Datasheet for Mature Altera Devices 80 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 81 208-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot in its proximity on package surface. Package Information Description Specification Ordering Code Reference Q Package Acronym PQFP Lead Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-029 Variation: FA-1 Lead Coplanarity 0.003 inches (0.08 mm) Weight 6.3 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 4.10 A1 0.25 — 0.50 A2 3.20 3.40 3.60 D 30.60 BSC D1 28.00 BSC E 30.60 BSC E1 L 28.00 BSC 0.50 L1 S 0.20 — — b 0.17 — 0.27 c 0.09 — 0.20  Altera Corporation 0.75 1.30 REF e © December 2011 0.60 0.50 BSC 0° 3.5° 8° Package Information Datasheet for Mature Altera Devices 82 Package Information Datasheet for Mature Altera Devices Package Outline D D1 Pin 208 Pin 1 Pin 1 ID E E1 Pin 52 A A2 A1 See Detail A Detail A e C Gage Plane b S 0.25mm L L1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 83 208-Pin Power Quad Flat Pack (RQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference R Package Acronym RQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-029 Variation: FA-1 Lead Coplanarity 0.003 inches (0.08mm) Weight 11.0 g (Typ.) or 6.4 g (Typ.) (1) Moisture Sensitivity Level Printed on moisture barrier bag Note: (1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized aluminum). Refer to PCN1002. Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 4.10 A1 0.25 — 0.50 A2 3.20 3.40 3.60 D 30.60 BSC D1 28.00 BSC E 30.60 BSC E1 28.00 BSC L 0.45 L1 S 0.20 — — b 0.17 — 0.27 c 0.09 — 0.20  Altera Corporation 0.75 1.30 REF e © December 2011 0.60 0.50 BSC 0 3.5 8 Package Information Datasheet for Mature Altera Devices 84 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 85 240-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference Q Package Acronym PQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-029 Variation: GA Lead Coplanarity 0.003 inches (0.08mm) Weight 8.0 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 4.10 A1 0.25 — 0.50 A2 3.20 3.40 3.60 D 34.60 BSC D1 32.00 BSC E 34.60 BSC E1 32.00 BSC L 0.45 L1 0.20 — — b 0.17 — 0.27 c 0.09 — 0.20  Altera Corporation 0.75 S e © December 2011 0.60 1.30 REF 0.50 BSC 0 3.5 8 Package Information Datasheet for Mature Altera Devices 86 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 87 240-Pin Power Quad Flat Pack (RQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference R Package Acronym RQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-029 Variation: GA Lead Coplanarity 0.003 inches (0.08mm) Weight 15.4 g (Typ.) or 8.5 g (Typ.) (1) Moisture Sensitivity Level Printed on moisture barrier bag Note: (1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized aluminum). Refer to PCN1002. Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 4.10 A1 0.25 — 0.50 A2 3.20 3.40 3.60 D 34.60 BSC D1 32.00 BSC E 34.60 BSC E1 32.00 BSC L 0.45 L1 S 0.20 — — b 0.17 — 0.27 c 0.09 — 0.20  Altera Corporation 0.75 1.30 REF e © December 2011 0.60 0.50 BSC 0 3.5 8 Package Information Datasheet for Mature Altera Devices 88 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 89 256-Pin Ball-Grid Array (BGA), Option 1—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT or tape Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-192 Variation: BAL-2 Lead Coplanarity 0.008 inches (0.20 mm) Weight 4.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.70 A1 0.35 — — A2 0.25 — 1.10 D 27.00 BSC E 27.00 BSC b e © December 2011 Altera Corporation 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 90 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D 20 18 16 14 12 10 8 6 4 2 19 17 15 13 11 9 7 5 3 1 Pin A1 Corner A C Pin A1 ID E e G J E L N R U W b B D F H K M P T V Y e A A2 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 91 256-Pin Plastic Ball-Grid Array (BGA), Option 2—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: BAL-2 Lead Coplanarity 0.008 inches (0.20 mm) Weight 2.2 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.60 A1 0.35 — — A2 — — 2.20 A3 — — 1.80 D 27.00 BSC E 27.00 BSC b e © December 2011 Altera Corporation 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 92 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D 20 18 19 16 17 14 15 12 13 10 11 8 9 6 7 4 5 Pin A1 Corner 2 3 1 A C E e Pin A1 ID G J E L N R U W b B D F H K M P T V Y e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 93 256-Pin FineLine Ball-Grid Array (FBGA), Option 1—Wire Bond 1 ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. This POD is applicable to F256 packages of all products listed in this datasheet except Cyclone II, which are assembled in Option 2 package outlines. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAF-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 1.5 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.20 A1 0.30 — — A2 — — 1.80 A3 0.70 REF D 17.00 BSC E 17.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 94 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner Pin A1 ID e E b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 95 256-Pin FineLine Ball-Grid Array (FBGA), Option 2—Thin—Wire Bond 1 ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface. This POD is applicable to F256 packages of the Cyclone II devices only. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-192 Variation: DAF-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 1.5 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.55 A1 0.25 — — A2 A3 1.05 REF — D e © December 2011 Altera Corporation 0.80 17.00 BSC E b — 17.00 BSC 0.45 0.50 0.55 1.00 BSC Package Information Datasheet for Mature Altera Devices 96 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 97 324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Option 1 ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAG-1 Lead Coplanarity 0.008 inches (0.20mm) Weight 1.4 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.20 A1 0.30 — — A2 — — 1.80 A3 0.70 REF D 19.00 BSC E 19.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 98 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 99 356-Pin Ball-Grid Array (BGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT or tape Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-192 Variation: BAR-2 Lead Coplanarity 0.008 inches (0.20mm) Weight 7.7 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 1.70 A1 0.35 — — A2 0.25 — 1.10 D 35.00 BSC E 35.00 BSC b e © December 2011 Altera Corporation 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 100 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 101 400-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAH-1 Lead Coplanarity 0.008 inches (0.20mm) Weight 2.3 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeteres Symbol Max. A — — 2.20 0.30 — — A2 — — 1.80 A3 0.80 REF D 21.00 BSC E 21.00 BSC e Altera Corporation Nom. A1 b © December 2011 Min. 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 102 Package Information Datasheet for Mature Altera Devices Package Outline BOTTOM VIEW TOP VIEW Pin A1 Corner D Pin A1 ID e E b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 103 403-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in inches. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference G Package Acronym PGA Leadframe Material Alloy 42 Lead Finish Gold Over Nickel Plate JEDEC Outline Reference MO-128 Variation: AL Lead Coplanarity N/A Weight 47.7 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Inches Symbol A Min. Nom. Max. 0.157 0.180 0.203 A1 0.050 TYP A2 0.117 0.130 0.143 D 1.940 1.960 1.980 E 1.940 1.960 1.980 L b e © December 2011 Altera Corporation 0.130 TYP 0.016 0.018 0.020 0.100 BSC Package Information Datasheet for Mature Altera Devices 104 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 105 484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAJ-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 6.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Max. A — — 3.50 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 23.00 BSC E 23.00 BSC e Altera Corporation Nom. A1 b © December 2011 Min. 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 106 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW Pin A1 Corner D Pin A1 ID e E b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 107 484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip—Channel Lid ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-034 Variation: AAJ-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 6.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. A 2.95 3.15 3.35 0.40 0.50 0.60 A2 2.35 2.65 2.95 A3 1.35 1.45 1.55 D 23.00 BSC E 23.00 BSC e Altera Corporation Max. A1 b © December 2011 Nom. 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 108 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW Pin A1 Corner D Pin A1 ID e E b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 109 484-Pin FineLine Ball-Grid Array (FBGA), Option 2—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Lead Coplanarity 0.008 inches (0.20 mm) Weight 2.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Variation: AAJ-1 Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.60 A1 0.30 — — A2 — — 2.20 A3 — — 1.80 D 23.00 BSC E 23.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 110 Package Information Datasheet for Mature Altera Devices Package Outline BOTTOM VIEW TOP VIEW Pin A1 Corner D Pin A1 ID e E e b A3 A A2 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 111 484-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Lead Coplanarity 0.008 inches (0.20 mm) Weight 5.3 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Variation: AAJ-1 Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 23.00 BSC D1 17.00 BSC E 23.00 BSC E1 17.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 112 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 113 484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40 ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Lead Coplanarity 0.008 inches (0.20 mm) Weight 2.3 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Variation: AAJ-1 Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A 2.10 2.25 2.40 A1 0.40 0.50 0.60 A2 1.50 1.75 2.00 A3 1.12 1.17 1.22 D 23.00 BSC E 23.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 114 Package Information Datasheet for Mature Altera Devices Package Outline A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 115 484-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference H Package Acronym HBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAL-1 Lead Coplanarity 0.008 inches (0.20mm) Weight 11.3 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 27.00 BSC E 27.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 116 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner Pin A1 ID e E e b A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 117 484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference U Package Acronym UBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-216 Variation: BAP-2 Lead Coplanarity 0.005 inches (0.12mm) Weight 1.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Max. A — — 2.20 0.20 — — A2 0.65 — — A3 0.95 TYP D 19.00 BSC E 19.00 BSC e Altera Corporation Nom. A1 b © December 2011 Min. 0.40 0.50 0.60 0.80 BSC Package Information Datasheet for Mature Altera Devices 118 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW Pin A1 Corner D Pin A1 ID e E e b A A3 A2 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 119 503-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in inches. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference G Package Acronym PGA Leadframe Material Alloy 42 Lead Finish Gold Over Nickel Plate JEDEC Outline Reference MO-128 Lead Coplanarity N/A Weight 59.0 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Variation: AN Package Outline Dimension Table Inches Symbol A Min. Nom. Max. — — 0.205 A1 0.050 TYP A2 — — 0.145 D 2.245 2.260 2.275 E 2.245 2.260 2.275 L b e © December 2011 Altera Corporation 0.130 TYP 0.016 0.018 0.020 0.100 BSC Package Information Datasheet for Mature Altera Devices 120 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 A C Pin A1 ID E G J e L N R U B D F H K M P T 1 E V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR AT AU AV AW AY BA BB BC 2 e b 1 2 e e A A2 A1 L Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 121 599-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in inches. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference G Package Acronym PGA Leadframe Material Alloy 42 Lead Finish Gold over Nickel Plate JEDEC Outline Reference MO-128 Variation: AP Lead Coplanarity N/A Weight 69.0 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Inches Symbol A Min. Nom. Max. — — 0.205 A1 0.050 TYP A2 — — 0.145 D 2.445 2.460 2.475 E 2.445 2.460 2.475 L b e © December 2011 Altera Corporation 0.130 TYP 0.016 0.018 0.020 0.100 BSC Package Information Datasheet for Mature Altera Devices 122 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 123 600-Pin Ball-Grid Array (BGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT or tape Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-192 Variation: BAW-1 Lead Coplanarity 0.008 inches (0.20mm) Weight 12.0 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.00 A1 0.35 — — A2 0.25 — 1.10 D 45.00 BSC E b e © December 2011 Altera Corporation 45.00 BSC 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 124 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Pin A1 Corner A C Pin A1 ID E e G J L N R E U W AA AC AE AG AJ AL AN B D F H K M P T V Y AB AD AF AH AK AM AP AR b e A A2 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 125 652-Pin Ball-Grid Array (BGA), Option 1—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: BAW-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 23.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 45.00 BSC E 45.00 BSC b e © December 2011 Altera Corporation 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 126 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D 34 35 32 33 30 31 28 29 26 27 25 Pin A1 Corner 6 4 2 24 22 20 18 16 14 12 10 8 7 5 3 1 23 21 19 17 15 13 11 9 A B C D Pin A1 ID E e F G H J K L M N P R T E U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 127 652-Pin Plastic Ball-Grid Array (BGA), Option 2—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: BAW-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 15.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.20 A1 0.35 — — A2 — — 2.80 A3 — — 2.40 D 45.00 BSC E 45.00 BSC b e © December 2011 Altera Corporation 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 128 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 A C E G J e Pin A1 ID L N R E U W AA AC AE AG AJ AL AN AR B D F H K M P T V Y AB AD AF AH AK AM AP e b A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 129 652-Pin Plastic Ball-Grid Array (BGA), Option 3—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT or tape Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-192 Variation: BAW-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 15.1 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.00 A1 0.35 — — A2 0.25 — 1.10 D 45.00 BSC E 45.00 BSC b e © December 2011 Altera Corporation 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 130 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Pin A1 Corner A C Pin A1 ID E e G J L N R E U W AA AC AE AG AJ AL AN B D F H K M P T V Y AB AD AF AH AK AM AP AR b e A A2 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 131 655-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in inches. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference G Package Acronym PGA Leadframe Material Alloy 42 Lead Finish Gold over Nickel Plate JEDEC Outline Reference MO-128 Variation: AP Lead Coplanarity N/A Weight 74.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Inches Symbol A Min. Nom. Max. — — 0.205 A1 0.050 TYP A2 — — 0.145 D 2.445 2.460 2.475 E 2.445 2.460 2.475 L b e © December 2011 Altera Corporation 0.130 TYP 0.016 0.018 0.020 0.100 BSC Package Information Datasheet for Mature Altera Devices 132 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 133 672-Pin Plastic Ball-Grid Array (BGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: BAR-2 Lead Coplanarity 0.008 inches (0.20 mm) Weight 5.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.60 A1 0.35 — — A2 — — 2.20 A3 — — 1.80 D 35.00 BSC E 35.00 BSC b e © December 2011 Altera Corporation 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 134 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D 26 24 25 22 23 20 21 18 19 16 17 14 15 12 13 10 11 8 9 6 7 Pin A1 Corner 2 4 5 3 1 A B C D E F Pin A1 ID G e H J K L M E N P R T U V W Y AA AB AC AD AE AF e b A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 135 672-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAL-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 9.5 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 27.00 BSC E 27.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 136 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner Pin A1 ID e E e b A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 137 672-Pin FineLine Ball-Grid Array (FBGA), Option 2—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAL-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 3.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 2.60 A1 0.30 — — A2 — — 2.20 A3 — — 1.80 D 27.00 BSC E 27.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 138 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner Pin A1 ID e E e b A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 139 672-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAL-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 7.1 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 27.00 BSC D1 20.00 BSC E 27.00 BSC E1 20.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 140 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 141 672-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40 ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAL-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 3.0 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A 2.10 2.25 2.40 A1 0.40 0.50 0.60 A2 1.50 1.75 2.00 A3 1.12 1.17 1.22 D 27.00 BSC E 27.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 142 Package Information Datasheet for Mature Altera Devices Package Outline e b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 143 724-Pin Ball-Grid Array (BGA)—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: BAR-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 13.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 35.00 BSC E 35.00 BSC b e © December 2011 Altera Corporation 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 144 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner Pin A1 ID e E b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 145 780-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAM-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 10.7 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 29.00 BSC E 29.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 146 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner Pin A1 ID e E e b A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 147 780-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip—Channel Lid ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MO-034 Variation: AAM-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 9.5 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A 3.05 3.25 3.45 A1 0.40 0.50 0.60 A2 2.45 2.75 3.05 A3 1.45 1.55 1.65 D 29.00 BSC E 29.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 148 Package Information Datasheet for Mature Altera Devices Package Outline TOP VIEW BOTTOM VIEW D Pin A1 Corner Pin A1 ID e E e b A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 149 780-Pin FineLine Ball-Grid Array (FBGA), Option 3—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAM-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 8.2 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 29.00 BSC D1 21.00 BSC E 29.00 BSC E1 21.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 150 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 151 896-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40 ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Lead Coplanarity 0.008 inches (0.20 mm) Weight 3.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Variation: AAN-1 Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A 2.10 2.25 2.40 A1 0.40 0.50 0.60 A2 1.50 1.75 2.00 A3 1.12 1.17 1.22 D 31.00 BSC E 31.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 152 Package Information Datasheet for Mature Altera Devices Package Outline D e E b e A A2 A3 A1 Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 153 956-Pin Ball-Grid Array (BGA), Option 1—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: BAU-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 19.6 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Max. A — — 3.50 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 40.00 BSC E 40.00 BSC e Altera Corporation Nom. A1 b © December 2011 Min. 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 154 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 155 956-Pin Ball-Grid Array (BGA), Option 2—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: BAU-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 17.0 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Max. A — — 3.50 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 40.00 BSC D1 30.00 BSC E 40.00 BSC E1 30.00 BSC e Altera Corporation Nom. A1 b © December 2011 Min. 0.60 0.75 0.90 1.27 BSC Package Information Datasheet for Mature Altera Devices 156 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 157 1020-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAP-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 13.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 33.00 BSC E 33.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 158 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 159 1020-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAP-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 10.8 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 33.00 BSC D1 26.00 BSC E 33.00 BSC E1 26.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 160 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 161 1152-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAR-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 15.5 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Max. A — — 3.50 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 35.00 BSC E 35.00 BSC e Altera Corporation Nom. A1 b © December 2011 Min. 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 162 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 163 1152-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAR-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 12.4 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 35.00 BSC D1 27.00 BSC E 35.00 BSC E1 b e © December 2011 Altera Corporation 27.00 BSC 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 164 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 165 1508-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAU-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 18.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 40.00 BSC E 40.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 166 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 167 1508-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAU-1 Lead Coplanarity 0.008 inches (0.20 mm) Weight 15.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Millimeters Symbol Min. Nom. Max. A — — 3.50 A1 0.30 — — A2 0.25 — 3.00 A3 — — 2.50 D 40.00 BSC D1 30.00 BSC E 40.00 BSC E1 30.00 BSC b e © December 2011 Altera Corporation 0.50 0.60 0.70 1.00 BSC Package Information Datasheet for Mature Altera Devices 168 Package Information Datasheet for Mature Altera Devices Package Outline Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Additional Information i Additional Information This section contains revision history and contact information. Revision History Table 60 lists the revision history for this document. Table 60. Document Revision History (1) (Part 1 of 13) Date and Document Version Changes Made Summary of Changes December 2011 ■ Updated for version 16.8 Added “896-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond— A:2.40”, “484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond— A:2.40”, and “672-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond— A:2.40”. November 2011 ■ Added Table 9 on page 10. Updated for version 16.7 August 2011 ■ Removed HardCopy III, HardCopy IV, MAX V, MAX II, Classic, and EPCS devices’ package listing and thermal resistance values. Updated for version 16.6 July 2011 ■ Removed Arria II, Stratix V, Stratix IV, Stratix III, Cyclone IV, and Cyclone III devices’ package listing and thermal resistance values. Updated for version 16.5 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices ii Package Information Datasheet for Mature Altera Devices Additional Information Table 60. Document Revision History (1) (Part 2 of 13) Date and Document Version June 2011 Changes Made Summary of Changes ■ Updated package diagram in “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SL150)” and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SE110)” ■ Added Table 30 and Table 58. ■ Updated the A and A2 dimension values in “780-Pin FineLine BallGrid Array (FBGA)—Flip Chip—Channel Lid (EP4SGX230)” and “780Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid (EP4SE230)”. ■ Updated the D1 and E1 dimension values in “1152-Pin FineLine BallGrid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX290)” and “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX360)”. ■ Updated Table 13. ■ Updated the b, A, and A2 dimension values in “256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond—Thin (EP3C10)”, “256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond—Thin (EP3C16)” and “256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond— Thin (EP3C25)”. ■ Updated information in “Package Outlines”. ■ Added new package diagram for “1152-Pin FineLine Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece Lid (EP3SL340)”, and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid (EP4SGX180)”. ■ Added new 1760-pin packages for 5SGXB5 and 5SGXB6 devices: “1760-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid—A:3.40” to replace the 1932-pin packages for 5SGXB5 and 5SGXB6 devices. ■ Updated cross reference for 5SGXB5 and 5SGXB6 1517-pin package diagram in Table 3. ■ Updated table Table 33. Package Information Datasheet for Mature Altera Devices Updated for version 16.4 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Additional Information iii Table 60. Document Revision History (1) (Part 3 of 13) Date and Document Version December 2010 © December 2011 Changes Made Summary of Changes Updated for version 16.3 ■ Updated document title and metadata. ■ Updated Table 43 with new thermal resistance value for EP3C16 (U484 Wire Bond package) and EP3C40 (U484 Wire Bond and F780 Wire Bond packages). ■ Updated note 3 in Table 9. ■ Updated Table 19 and Table 53 to remove dual-piece lid options for HardCopy II devices. ■ Added Arria II GZ device package listing in Table 2 and Arria II GZ thermal resistance in Table 35. ■ Added Stratix V device package listing in Table 4 and Stratix V thermal resistance in Table 37. ■ Added MAX V device package listing in Table 13 and MAX V thermal resistance in Table 46. ■ Added new Cyclone IV device package in Table 9 and thermal resistance values in Table 42. ■ Updated lead coplanarity and A3 dimension values in 358-Pin Ultra FineLine Ball-Grid Array (UBGA)—Flip Chip, 358-Pin Ultra FineLine Ball-Grid Array (UBGA)—Flip Chip—Lidless (EP2AGX45), and 358Pin Ultra FineLine Ball-Grid Array (UBGA)—Flip Chip—Lidless (EP2AGX65). ■ Added new package diagram for 1932-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX360), 324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond (EPM2210), and 324Pin FineLine Ball-Grid Array (FBGA)—Wire Bond (EPM2210G). Altera Corporation Package Information Datasheet for Mature Altera Devices iv Package Information Datasheet for Mature Altera Devices Additional Information Table 60. Document Revision History (1) (Part 4 of 13) Date and Document Version September 2010 Changes Made Summary of Changes Updated for version 16.2 ■ Updated JEDEC Outline Reference for “144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond (EP3C10)”, “144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond—(EP3C16)”, and “144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond— (EP3C25)”. ■ Updated dimension value for Arria II GX devices: “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless—Flip Chip (EP2AGX95)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX95)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX95)”, “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless— Flip Chip (EP2AGX65)”, “780-Pin FineLine Ball-Grid Array (FBGA)— Flip Chip—Lidless (EP2AGX65)”, “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless—Flip Chip (EP2AGX45)”,“780-Pin FineLine BallGrid Array (FBGA)—Flip Chip—Lidless (EP2AGX45)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX260)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX260)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX190)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX190)”, “1152-Pin FineLine BallGrid Array (FBGA)—Flip Chip—Lidless (EP2AGX125)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX125)”, and “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless—Flip Chip (EP2AGX125)”. ■ Updated dimension value for HardCopy devices: “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E35)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E35)”, “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC335)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip— Lidless (HC335)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC325)”, “484-Pin FineLine Ball-Grid Array (FBGA)— Flip Chip—Lidless (HC4E25)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E25)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX15)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX25)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX25)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX35)”, and “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX35)”. ■ Revised the unit weight info for: “484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, “484-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip”, “572-Pin FineLine Ball-Grid Array (FBGA)—Option 1, Flip Chip”, “572-Pin FineLine Ball-Grid Array (FBGA)—Option 2, Flip Chip”, “672-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, “672-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip”, “780-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, “780-Pin FineLine Ball-Grid Array (FBGA), Option 3—Flip Chip”, “780-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip”“1020-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, and “1020-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip”. Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Additional Information v Table 60. Document Revision History (1) (Part 5 of 13) Date and Document Version © December 2011 Changes Made Summary of Changes ■ Revised the unit weight info for: “1152-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, “1152-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip”, “1152-Pin FineLine Ball-Grid Array (FBGA), Option 3—Flip Chip”, “1508-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, “1508-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip”, “1517-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, “1517-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip”, “1760-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, “1760-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip”, “1932-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip”, “1932-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip”, “484-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip”, “780-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip”, “1517-Pin Hybrid FineLine Ball-Grid Array (HBGA), Option 1—Flip Chip”, “1517-Pin Hybrid FineLine Ball-Grid Array (HBGA), Option 2—Flip Chip”, “1152-Pin Hybrid FineLine BallGrid Array (HBGA), Option 1—Flip Chip”, “1152-Pin Hybrid FineLine Ball-Grid Array (HBGA), Option 2—Flip Chip”, “1152-Pin Hybrid FineLine Ball-Grid Array (HBGA), Option 3—Flip Chip”, and “1152-Pin Hybrid FineLine Ball-Grid Array (HBGA), Option 4—Flip Chip”. ■ Added package diagram: “144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond (EP3C10)”, “148-Pin Quad Flat No-Lead Package (QFN)—Wire Bond”, “780-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip”, “1152-Pin FineLine Ball-Grid Array (FBGA), Option 3—Flip Chip”, and “572-Pin FineLine Ball-Grid Array (FBGA)—Option 2, Flip Chip”. ■ Added package diagram for Stratix IV devices: “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX290)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX110)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX110)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid (EP4SGX180)”,“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX180)”, “1932-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX290)”, “780-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Channel Lid (EP4SGX360)”, “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX360)”, “1760-Pin FineLine Ball-Grid Array (FBGA) — Flip Chip — Single-Piece Lid (EP4SGX360)”, “1517-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece Lid (EP4SE530)”, “1517-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip— Single-Piece Lid (EP4SE530)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid (EP4SE230)”, and “1152-Pin Hybrid Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid (EP4SE530)”. Altera Corporation Package Information Datasheet for Mature Altera Devices vi Package Information Datasheet for Mature Altera Devices Additional Information Table 60. Document Revision History (1) (Part 6 of 13) Date and Document Version Changes Made Summary of Changes ■ Added package diagram for Stratix III devices: “780-Pin FineLine BallGrid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SL150)”, “780Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece Lid (EP3SL200)”,“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SE110)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SE110)”, “780-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece Lid (EP3SE260)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid (EP3SE260)”, and “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SE260)”. ■ Added package diagram for Cyclone IV devices: “780-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP4CE115)”. ■ Added package diagram for Cyclone III devices :“780-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C120)”, “144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond— (EP3C16)”,“256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond—Thin (EP3C10)”, “780-Pin FineLine Ball-Grid Array (FBGA)— Wire Bond—OMPAC (EP3C55)”, “144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond—(EP3C25)”, “256-Pin FineLine BallGrid Array (FBGA)—Wire Bond—Thin (EP3C10)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C80)”,“484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C120)”, “256-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Thin (EP3C16)”, “256-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond— Thin (EP3C25)”, “324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond (EP3C25)”, “324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond (EP3C40)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C16)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C40)”, “484-Pin FineLine BallGrid Array (FBGA)—Wire Bond—OMPAC (EP3C55)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C80)”, “484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond (EP3CLS100)”, “256-Pin Ultra FineLine Ball-Grid Array (UBGA)— Wire Bond—Thin (EP3C16)”, “484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond (EP3C16)”, “256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond—Thin (EP3C25)”, “484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond (EP3C55)”, and “484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond (EP3C80)”. ■ Added package diagram for MAX II devices: “100-Pin FineLine BallGrid Array (FBGA)—Wire Bond—Thin (EPM240)”, “100-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Thin (EPM570)”. ■ Updated A3 dimension for “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless—Flip Chip (EP2AGX45)”, “572-Pin FineLine BallGrid Array (FBGA)—Lidless—Flip Chip (EP2AGX65)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX45)”, and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX65)”. Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Additional Information vii Table 60. Document Revision History (1) (Part 7 of 13) Date and Document Version © December 2011 Changes Made Summary of Changes ■ Added package diagram for HardCopy III devices: “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC325)” and “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC325)”. ■ Updated D1/E1 values in “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4S40G2)”, “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4S100G2)”, “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX180)”, “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX230)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E25)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E25)”, and “1020-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip”. ■ Updated Table 7. ■ Updated Table 10 footnote. ■ Updated thermal resistance values of EP3CLS70, EP3CLS100, EP3CLS150, and EP3CLS200 devices F484 pin package in Table 42. ■ Updated package diagram in “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX360)” ■ Updated the notes in “256-Pin FineLine Ball-Grid Array (FBGA), Option 1—Wire Bond” and “256-Pin FineLine Ball-Grid Array (FBGA), Option 2—Thin—Wire Bond” to include Cyclone IV devices. ■ Updated EP4SE230 device package to Channel Lid from Dual-Piece Lid in Table 4. ■ Updated package diagram in “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP4SGX180)”. ■ Updated EP1AGX50 and EP1AGX60 F484 pin package description from dual-piece lid to channel lid in Table 3. ■ Updated EP4SGX180 and EP4SGX230 device package description in Table 4. ■ Added note 1 to Table 6. ■ Deleted HC315WF484 from Table 18. ■ Added additional information to “148-Pin Quad Flat No-Lead Package (QFN)—Wire Bond—(EP4CGX15)” and “148-Pin Quad Flat No-Lead Package (QFN)—Wire Bond” Altera Corporation Package Information Datasheet for Mature Altera Devices viii Package Information Datasheet for Mature Altera Devices Additional Information Table 60. Document Revision History (1) (Part 8 of 13) Date and Document Version April 2010 Changes Made Summary of Changes Updated for version 16.1 ■ Added Table 1 and Table 38 ■ Updated Table 2 through Table 37 ■ Updated values in Table 49, Table 50, Table 58 ■ Removed 148-pin Quad Flat No-Lead Package (QFN)—Wire Bond, 484-Pin FBGA, Flip Chip, Dual-Piece Lid (EP2S15), 484-Pin FBGA, Flip Chip, Single-Piece Lid (EP2S15), 672-Pin FBGA, Flip Chip, DualPiece Lid (EP2S15), 672-Pin FBGA, Flip Chip, Single-Piece Lid (EP2S15) package outlines. ■ Corrected title in 1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC4E35) ■ Added 148-Pin Quad Flat No-Lead Package (QFN)—Wire Bond— (EP4CGX15) ■ Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—SinglePiece Lid (EP4S40G2), 1517-Pin FineLine Ball-Grid Array (FBGA)— Flip Chip—Single-Piece Lid (EP4S100G2), 1517-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid (EP4S40G5), and 1932-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—SinglePiece Lid (EP4S100G4) ■ Added 1152-Pin Hybrid Ball-Grid Array (HBGA)—Flip Chip—SinglePiece Lid (EP4SE820), 1517-Pin Hybrid Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid (EP4SE820), and 1760-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SE820) ■ Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—SinglePiece Lid (EP4SGX180) and 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP4SGX180) ■ Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—DualPiece Lid (EP4SGX230) ■ Added “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E25)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip— Single-Piece Lid (HC4E25)”, and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E25)” ■ Added “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX15)”, and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC4GX15)” ■ Added “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX25)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip— Single-Piece Lid (HC4GX25)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX25)”, and “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC4GX25)” Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Additional Information ix Table 60. Document Revision History (1) (Part 9 of 13) Date and Document Version December 2009 © December 2011 Changes Made Summary of Changes ■ Added “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip— Single-Piece Lid (HC4GX35)”, “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX35)”, and “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC4GX35)” ■ Updated 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip— Single-Piece Lid (EP4SGX230) ■ Corrected title for 324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Option 1 from 324-Pin FineLine Ball-Grid Array (FBGA) ■ Corrected title for 1517-Pin Hybrid FineLine Ball-Grid Array (HBGA) — Flip Chip — Single-Piece Lid (EP4SE820) from 1517-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid (EP4SGX820) ■ Corrected weight in 324-Pin FBGA Data Sheet ■ Added thermal resistance disclaimer at the beginning of the Thermal Resistance section ■ Moved EPC1, EPC2, EPC1441 entries from Table 27 to Table 37 ■ Added notes for preliminary thermal information (Table 36, Table 37, Table 46, and Table 47) Altera Corporation Updated for version 16.0 Package Information Datasheet for Mature Altera Devices x Package Information Datasheet for Mature Altera Devices Additional Information Table 60. Document Revision History (1) (Part 10 of 13) Date and Document Version November 2009 Changes Made Summary of Changes Updated for version 15.9 ■ Added Cyclone IV information ■ Added notes to 1152-Pin HBGA Option 3 Data Sheet ■ Corrected drawings for 358-Pin UBGA—Lidless (EP2AGX45), 358-Pin UBGA—Lidless (EP2AGX65), and 1152-Pin FBGA—Lidless (EP2AGX95) Data Sheets ■ Added 148-Pin QFN, 169-Pin FBGA, and 324-Pin FBGA Option 2 Data Sheets ■ Added 1517-Pin—Lidless (HC4E35) and 1517-Pin Single-Piece Lid (HC4E35) Data Sheets ■ Added 780-pin FBGA—Channel Lid (EP4SGX230), 780-Pin HBGA— Channel Lid (EP4SGX 360), 1152-Pin FBGA—Channel Lid (EP4SGX230), 1152-Pin FBGA—Channel Lid (EP4SGX360), 1152-Pin FBGA—Dual-Piece Lid (EP4SGX230), 1152-Pin FBGA— Single-Piece Lid (EP4SGX230), 1152-Pin FBGA—Single-Piece Lid (EP4SGX360), 1152-Pin HBGA—Single-Piece Lid (EP4SGX530), 1152-Pin HBGA—Single-Piece Lid (EP4SGX820), 1517-Pin FBGA— Dual-Piece Lid (EP4SGX230), 1517-Pin FBGA—Single-Piece Lid (EP4SGX230), 1517-Pin FBGA— Single-Piece Lid (EP4SGX360), 1517-Pin HBGA—Dual-Piece Lid (EP4SGX530), 1517-Pin HBGA—Single-Piece Lid (EP4SGX530), 1517-Pin HBGA—Single-Piece Lid (EP4S40G2 and EP4S100G2), 1517-Pin HBGA—Single-Piece Lid (EP4S100G5), 1517-Pin HBGA— Single-Piece Lid (EP4SGX820), 1760-Pin FBGA—Dual-Piece Lid (EP4SGX530), 1760-Pin FBGA—Single-Piece Lid (EP4SGX360), 1760-Pin FBGA—Single-Piece Lid (EP4SGX820), 1932-Pin FBGA— Dual-Piece Lid (EP4SGX530), 1932-Pin FBGA—Single-Piece Lid (EP4SGX530), 1932-Pin FBGA—Single-Piece Lid (EP4S100G2) Data Sheets ■ Added 484-Pin FBGA—Dual-Piece Lid (EP2S15), 484-Pin FBGA— Single-Piece Lid (EP2S15), 672-Pin FBGA—Dual-Piece Lid (EP2S15), 672-Pin FBGA—Single-Piece Lid (EP2S15), 164-Pin MBGA (EP3C16), and 484-Pin UBGA (EP3C40) Data Sheets Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Additional Information xi Table 60. Document Revision History (1) (Part 11 of 13) Date and Document Version October 2009 June 2009 March 2009 © December 2011 Changes Made Summary of Changes ■ Added 1152-Pin HBGA Option 3, 1152-Pin HBGA Option 4, 1517-Pin HBGA Option 2, 1760-Pin FBGA Option 2, and 1932-Pin FBGA Option 2 Data Sheets ■ Added 358-Pin UBGA—Lidless (EP2AGX45), 358-Pin UBGA—Lidless (EP2AGX65), 572-Pin FBGA—Lidless (EP2AGX45), 572-Pin FBGA— Lidless (EP2AGX65), 572-Pin FBGA—Lidless (EP2AGX95), 572-Pin FBGA—Lidless (EP2AGX125), 780-Pin FBGA—Lidless (EP2AGX45), 780-Pin FBGA—Lidless (EP2AGX65), 780-Pin FBGA—Lidless (EP2AGX95), 780-Pin FBGA—Lidless (EP2AGX125), 780-Pin FBGA—Lidless (EP2AGX190), 780-Pin FBGA—Lidless (EP2AGX260), 1152-Pin FBGA—Lidless (EP2AGX95), 1152-Pin FBGA—Lidless (EP2AGX125), 1152-Pin FBGA—Lidless (EP2AGX190), and 1152-Pin FBGA—Lidless (EP2AGX260) Data Sheets ■ Added 780-Pin FBGA—Lidless (HC325), 780-Pin FBGA—SinglePiece Lid (HC325), 1152-Pin FBGA—Lidless (HC335), 1152-Pin FBGA—Single-Piece Lid (HC335), 1152-Pin FBGA—Lidless (HC4E35), 1152-Pin FBGA—Single-Piece Lid (HC4E35), 1517-Pin FBGA—Lidless (HC335), and 1517-Pin FBGA—Single-Piece Lid (HC335) Data Sheets ■ Removed EP2AGX20 and EP2AGX30 entries from Table 2 and Table 39 ■ Added EP4SE820 entries to Table 41 ■ Added Stratix IV GT devices to Table 4; added option references ■ Updated thermal resistance values in Table 39 ■ Made three corrections to Stratix III thermal resistance table ■ Added Cyclone III LS information ■ Added Stratix IV GT thermal resistance values ■ Added and/or HardCopy III and IV cross-reference and thermal resistance tables ■ Updated HardCopy III and IV part numbers ■ Added Cyclone III M164 package information ■ Added 484-Pin FBGA Option 4, 672-Pin FBGA Option 4, 1020-Pin FBGA Option 2, 1508-Pin FBGA Option 2, and 1517-Pin Option 2 FBGA Data Sheets ■ Revised 1508-Pin FBGA Option 1, 1020-Pin FBGA Option 1, 1517-Pin FBGA Option 1, 572-Pin FBGA, and 1152-Pin FBGA Option 2 Data Sheets ■ Added 956-Pin BGA Option 2 Data Sheet ■ Corrected “b Nom.” value in 358-Pin UBGA Data Sheet ■ Corrected “A Max.” value and replaced package drawing in 780-Pin FBGA - Option 3 Data Sheet ■ Corrected “A Max.” value in 256-Pin UBGA Data Sheet ■ Modified thermal resistance values for EP3SL200 device in Stratix III thermal resistance table Altera Corporation Updated for version 15.8 Updated for version 15.7 Updated for version 15.6 Package Information Datasheet for Mature Altera Devices xii Package Information Datasheet for Mature Altera Devices Additional Information Table 60. Document Revision History (1) (Part 12 of 13) Date and Document Version March 2009 Changes Made Summary of Changes ■ Fixed theta symbols in several data sheet Dimension Tables ■ Updated dimensions in 256-Pin UBGA Data Sheet ■ Added 358-Pin UBGA Data Sheet, 572-Pin, 780-Pin Option 3, and 1152-Pin Option 2 FBGA Data Sheets ■ Added Arria II GX thermal resistance table ■ Added Arria II GX device and package cross-reference table ■ Added EP3SL50, EP3SE80, and EP3SL110 devices to Stratix III thermal resistance table ■ Added EP4SGX70, EP4SGX180, and EP4SGX290 devices and updated Stratix IV GX thermal resistance table ■ Added HardCopy III and HardCopy IV thermal resistance table ■ Miscellaneous formatting changes December 2008 ■ Changed dimension “A” Max. value in 1932-Pin FBGA Data Sheet Updated for version 15.4 November 2008 ■ Moved Revision History to the end and added “How to Contact Altera” section Updated for version 15.3 ■ Added subheadings in Thermal Resistance section ■ Converted to 8-1/2 x 11 page size ■ Changed “Maximum Lead Coplanarity” to “Lead Coplanarity” and added “(Typ.)” to weights for all packages ■ Added EP2C15 information to Cyclone II tables ■ Added thermal resistance values for Stratix IV ■ Added new 1152-Pin HBGA Option 2 (42.5 MM SQ.) Data Sheet ■ Added new 1517-Pin HBGA (42.5 MM SQ.) Data Sheet ■ Added theta-JB thermal resistance values for Stratix II ■ Added HardCopy II thermal resistance values ■ Revised weights for 256-Pin BGA Option 2, 652-Pin BGA Option 2, 652-Pin BGA Option 3, 208-Pin RQFP, 240-Pin RQFP, and 304-Pin RQFP Data Sheets ■ Added notes to 1152-Pin FBGA, 1517-Pin FBGA, 1760-Pin FBGA; changed dimension “A” thickness and “A2” thickness in 1932-Pin FBGA Data Sheet ■ Added 1932-Pin FBGA Data Sheet ■ Added Device and Package Cross Reference table for Stratix IV ■ Revised Maximum Lead Coplanarity values for 1517-Pin FBGA and 1760-Pin FBGA Data Sheets ■ Added three entries to Table 3 ■ Corrected minor typos in Table 4 and Table 10 ■ Corrected HC210W package in Table 12 ■ Many tables updated for formatting consistency September 2008 May 2008 April 2008 Package Information Datasheet for Mature Altera Devices Updated for version 15.5 Updated for version 15.2 Updated for version 15.1 Updated for version 15.0 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Additional Information xiii Table 60. Document Revision History (1) (Part 13 of 13) Date and Document Version February 2008 October 2007 May 2007 v14.7 February 2007 v14.6 December 2006 v14.5 Changes Made Summary of Changes Updated for version 14.9 ■ Added 164-Pin MBGA information in Table 8 ■ Added HardCopy II device information in Table 12 ■ Updated Stratix III thermal resistance values in Table 22 ■ Added 164-Pin MBGA Data Sheet ■ Corrected 8-Pin SOIC Data Sheet (changed “B” to “b” in Package Outline Dimension Table) ■ Corrected 68-Pin MBGA Data Sheet (changed “Inches” to “Millimeters” in Package Outline Dimension Table) ■ Removed note from 100-Pin PQFP Option 1 Data Sheet ■ Removed 100-Pin PQFP Option 2 Data Sheet ■ Updated 88-Pin UBGA, 144-Pin EQFP, 256-Pin FBGA Option 1, 256Pin FBGA Option 2, 256-Pin UBGA, 1517-Pin FBGA, and 1760-Pin FBGA Data Sheets ■ Added 780-Pin HBGA and 1152-Pin HBGA Data Sheets ■ Added Arria™ GX information ■ Added Cyclone III tables ■ Revised D2 and E2 dimensions for 144-Pin EQFP ■ Revised 100-Pin MBGA - Wire Bond and 256-Pin MBGA - Wire Bond ■ Added 780-Pin FBGA option 2 - Wire Bond, 256-Pin UBGA - Wire Bond, 68-Pin MBGA - Wire Bond, and 144-Pin MBGA - Wire Bond ■ Updated 144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet to correct title and ordering code reference ■ Added revision history ■ Table 2 was added for Stratix III Device and Package Cross-Reference Added Tables for Stratix III, updated other Tables 16, 17, and 18 were added for Stratix III Thermal Resistance data sheets information ■ Updated for version 14.8 Changes and additions as described in “Changes Made” section ■ 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added ■ 1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added ■ "Wire Bond" and "Flip Chip" was added to title of each data sheet, as appropriate ■ "BGA" was spelled out as "Ball-Grid Array" in all titles ■ Some package outline drawings were reformatted ■ Weights were updated for many packages Revised one data sheet (144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet), added revision history Note to Table 60: (1) Formal revision history for this document began with version 14.5. © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Additional Information How to Contact Altera For the most up-to-date information about Altera® products, see the following table. Contact (Note 1) Contact Method Address Technical support Website www.altera.com/support Technical training Website www.altera.com/training Email custrain@altera.com Altera literature services Email literature@altera.com Non-technical support (General) Email nacomp@altera.com (Software Licensing) Email authorization@altera.com Note: (1) You can also contact your local Altera sales office or sales representative. 101 Innovation Drive San Jose, CA 95134 www.altera.com Technical Support www.altera.com/support Copyright © December 2011. Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Altera products are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera Corporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services.