Enpirion® Power Datasheet
EN23F2QI 15A PowerSoC
Voltage Mode Synchronous Buck
With Integrated Inductor
Not Recommended for New Designs
Description
Features
The EN23F2QI is a Power System on a Chip
(PowerSoC) DC-DC converter. It integrates MOSFET
switches, small-signal control circuits, compensation
and an integrated inductor in an advanced
12x13x3mm QFN module. It offers high efficiency,
excellent line and load regulation. The EN23F2QI
operates over a wide input voltage range and is
specifically designed to meet the precise voltage and
fast transient requirements of high-performance
products. The EN23F2QI features frequency
synchronization to an external clock, power OK
output voltage monitor, programmable soft-start along
with thermal shutdown, current limit and over current
protection. The device’s advanced circuit design, ultra
high switching frequency and proprietary integrated
inductor technology delivers high-quality, ultra
compact, non-isolated DC-DC conversion.
The Altera Enpirion solution significantly helps in
system design and productivity by offering greatly
simplified board design, layout and manufacturing
requirements. In addition, overall system level
reliability is improved given the small number of
components required with the Altera Enpirion
solution.
All Altera Enpirion products are RoHS compliant,
halogen free and are compatible with lead-free
manufacturing environments.
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Integrated Inductor, MOSFETs, Controller
Total Solution Size Estimate 308mm2
Wide Input Voltage Range: 4.5V – 13.2V
1% Initial Output Voltage Accuracy
Master/Slave Parallel Operation (up to 4 devices)
Frequency Synchronization (External Clock)
Output Enable Pin and Power OK Signal
Programmable Soft-Start Time
Pin Compatible with the EN23F0QI
Under Voltage Lockout Protection (UVLO)
Over Current and Short Circuit Protection
Pre-Bias Startup Protection
Thermal Soft-Shutdown Protection
RoHS compliant, MSL level 3, 260oC reflow
Applications
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Space Constrained Applications
Distributed Power Architectures
Output Voltage Ripple Sensitive Applications
Beat Frequency Sensitive Applications
Servers, Embedded Computing Systems,
LAN/SAN Adapter Cards, RAID Storage Systems,
Industrial Automation, Test and Measurement,
and Telecommunications
0.1µF
BTMP VDDB
PVIN
ON
OFF
3x
22µF
1206
80
Optional
SW
CA
4.7Ω
EAIN
ENABLE
REA
1000pF
RA
COUT
R CA
AVINO
1µF
AVIN
1µF
47nF
VFB
SS
M/S
EN_PB
PGND
FQADJ
RFS
PGND
AGND
CBULK
70
60
50
VOUT = 3.3V
40
VOUT = 2.5V
30
VOUT = 1.8V
20
VOUT = 1.2V
VOUT = 1.0V
10
RCLX
RB
June 2, 2015
CONDITIONS
VIN = 12.0V
AVIN = 3.3V
Dual Supply
0
0
RCLX
Figure 1. Simplified Application Circuit
10301
90
VOUT
BGND
VOUT
EN23F2QI
4.75k
100
EFFICIENCY (%)
PG
VIN
Efficiency vs. Output Current
0.47µF
1
2
3
4 5 6 7 8 9 10 11 12 13 14 15
OUTPUT CURRENT (A)
Figure 2. Highest Efficiency in Smallest Solution
Size
Rev C
EN23F2QI
Ordering Information
Part Number
EN23F2QI
EVB-EN23F2QI
Package Markings
EN23F2QI
EN23F2QI
TAMBIENT Rating (°C)
-40 to +85
Package Description
92-pin (12mm x 13mm x 3mm) QFN T&R
QFN Evaluation Board
Packing and Marking Information: www.altera.com/support/reliability/packing/rel-packing-and-marking.html
AVIN
ENABLE
POK
71
AGND
73
M/S
75
74
72
VFB
76
EN_PB
82
SS
NC(SW)
83
EAIN
NC(SW)
84
78
NC(SW)
85
77
NC(SW)
86
RCLX
NC(SW)
87
79
NC(SW)
88
NC
NC(SW)
89
FQADJ
NC(SW)
90
81
NC(SW)
91
80
NC(SW)
92
Pin Assignments (Top View)
NC
1
NC
2
69
S_IN
NC
3
68
BGND
NC
4
67
VDDB
NC
5
66
BTMP
NC
6
65
PG
NC
7
64
AVINO
KEEP OUT
70
S_OUT
8
63
PVIN
9
62
PVIN
NC
10
61
PVIN
NC
11
60
PVIN
NC
12
59
PVIN
NC
13
58
PVIN
NC
14
57
PVIN
NC
15
56
PVIN
NC
16
55
PVIN
NC
17
54
PVIN
PVIN
KEEP OUT
NC
NC
93
PGND
KEEP OUT
46
PGND
PGND
44
45
PGND
41
PGND
42
40
PGND
43
39
NC(SW)
PGND
38
NC(SW)
NC(SW)
PGND
36
37
VOUT
NC
35
VOUT
VOUT
34
PVIN
33
PVIN
47
VOUT
48
24
32
23
NC
31
NC
VOUT
PVIN
30
PVIN
49
29
50
22
VOUT
21
NC
VOUT
NC
28
PVIN
VOUT
51
26
20
27
PVIN
NC
VOUT
52
VOUT
53
19
25
18
VOUT
NC
NC
Figure 3: Pin Out Diagram (Top View)
NOTE A: NC pins are not to be electrically connected to each other or to any external signal, ground, or voltage. All pins
including NC pins must be soldered to the PCB. Failure to follow this guideline may result in part malfunction or damage.
NOTE B: Shaded area highlights exposed metal below the package that is not to be mechanically or electrically
connected to the PCB. Refer to Figure 15 for details.
NOTE C: White ‘dot’ on top left is pin 1 indicator on top of the device package.
www.altera.com/enpirion Page 2
10301
June 2, 2015
Rev C
EN23F2QI
Pin Description
I/O Legend:
PIN
P=Power
NAME
G=Ground
NC=No Connect
I/O
1-24,
36, 81
NC
NC
25-35
VOUT
O
37-39,
83-92
NC(SW)
NC
40-46
PGND
G
47-63
PVIN
P
64
AVINO
O
65
66
PG
BTMP
I/O
I/O
67
VDDB
O
68
BGND
G
69
S_IN
I
70
S_OUT
O
71
POK
O
72
ENABLE
I
73
AVIN
P
74
AGND
G
75
M/S
I
76
VFB
I/O
77
EAIN
I
78
SS
I/O
79
RCLX
I/O
80
FQADJ
I/O
I=Input O=Output
I/O=Input/Output
FUNCTION
NO CONNECT – These pins may be internally connected. Do not connect them to each
other or to any other electrical signal. Failure to follow this guideline may result in device
damage.
Regulated converter output. Connect these pins to the load and place output capacitors
between these pins and PGND pins 40-43.
Switching node – These pins are internally connected to the common switching node of the
internal MOSFETs. In applications where the total output capacitance exceeds 50% of the
maximum allowed, a “snubber” circuit consisting of a series 4.7Ω resistor and a 680pF
capacitor should be connected from the NC(SW) pin to the PGND. See Output Capacitor
Selection for details.
Input/output power ground. Connect these pins to the ground electrode of the input and
output filter capacitors. See VOUT and PVIN pin descriptions for more details.
Input power supply. Connect to input power supply. Decouple with input capacitor to PGND
pins 44-46.
Internal 3.4V linear regulator output. Connect this pin to AVIN for applications where
operation from a single input voltage (PVIN) is required. If AVINO is being used, place a
1µF, X5R/X7R, capacitor between AVINO and AGND as close as possible to AVINO.
PMOS Gate. Place a 0.1µF, X7R, capacitor between this pin and BTMP.
See pin 65 description.
Internal regulated voltage used for the internal control circuitry. Place a 0.47µF, X5R/X7R,
capacitor between this pin and BGND.
Ground for VDDB. Do not connect BGND to any other ground. See pin 67 description.
Digital synchronization input. This pin accepts either an input clock to phase lock the
internal switching frequency or a S_OUT signal from another EN23F2QI. Leave this pin
floating if not used.
Digital synchronization output. PWM signal is output on this pin. Leave this pin floating if not
used.
Power OK is an open drain transistor (pulled up to AVIN or similar voltage) used for power
system state indication. POK is logic high when VOUT is within -10% of VOUT nominal.
Leave this pin floating if not used.
Output enable. Applying a logic high to this pin enables the output and initiates a soft-start.
Applying a logic low disables the output. ENABLE logic cannot be higher than AVIN (refer to
Absolute Maximum Ratings). Do not leave floating. See Power Up/Down Sequencing
section for details.
3.4V Input power supply for the controller. Place a 1µF, X5R/X7R, capacitor between AVIN
and AGND.
Analog ground. This is the ground return for the controller. All AGND pins need to be
connected to a quiet ground.
A logic level low configures the device as Master and a logic level high configures the
device as a Slave. Connect to ground in standalone mode.
External feedback input. The feedback loop is closed through this pin. A voltage divider at
VOUT is used to set the output voltage. The mid-point of the divider is connected to VFB. A
phase lead network from this pin to VOUT is also required to stabilize the loop.
Optional error amplifier input. Allows for customization of the control loop for performance
optimization. Leave this pin floating if not used.
Soft-start node. The soft-start capacitor is connected between this pin and AGND. The
value of this capacitor determines the startup time. See Soft-Start Operation in the
Functional Description section for details.
Over-current protection setting. Placement of a resistor on this pin will adjust the overcurrent protection threshold. See Table 2 for the recommended RCLX Value to set OCP at
the nominal value specified in the Electrical Characteristics table.
Adding a resistor (RFS) to this pin will adjust the switching frequency of the EN23F2QI. See
Table 1 for suggested resistor values on RFS for various PVIN/VOUT combinations to
maximize efficiency. Do not leave this pin floating.
www.altera.com/enpirion Page 3
10301
June 2, 2015
Rev C
EN23F2QI
PIN
NAME
I/O
82
EN_PB
I
93
PGND
G
FUNCTION
Enable pre-bias protection. Connect EN_PB directly to AVIN to enable the Pre-Bias
Protection feature. Pull EN_PB directly to ground to disable the feature. Do not leave this
pin floating. See Pre-Bias Operation for details.
Not a perimeter pin. Device thermal pad to be connected to the system GND plane for heatsinking purposes. See Layout Recommendations
Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating
conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
PARAMETER
SYMBOL
MIN
MAX
UNITS
Pin Voltages – PVIN, VOUT, PG
-0.5
15
V
Pin Voltages – ENABLE, S_IN, M/S, POK, EN_PB
-0.5
AVIN + 0.3
V
Pin Voltages – AVINO, AVIN, ENABLE, S_IN, S_OUT, M/S
-0.5
6.0
V
Pin Voltages – VFB, SS, EAIN, RCLX, FQADJ, VDDB, BTMP
-0.5
2.75
V
Dual Supply PVIN Rising and Falling Slew Rate (Note 1)
25
V/ms
Single Supply PVIN Rising and Falling Slew Rate (Note 1, 2)
10
V/ms
150
°C
150
°C
260
°C
2000
V
500
V
Storage Temperature Range
TSTG
Maximum Operating Junction Temperature
-65
TJ-ABS Max
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A
ESD Rating (based on Human Body Model)
ESD Rating (based on CDM)
Recommended Operating Conditions
SYMBOL
MIN
MAX
UNITS
Input Voltage Range
PARAMETER
PVIN
4.5
13.2
V
AVIN: Controller Supply Voltage
AVIN
2.5
5.5
V
Output Voltage Range (Note 3)
VOUT
0.75
3.3
V
Output Current (Note 4)
IOUT
0
15
A
Operating Ambient Temperature
TA
-40
+85
°C
Operating Junction Temperature
TJ
-40
+125
°C
Thermal Characteristics
PARAMETER
SYMBOL
TYP
UNITS
Thermal Shutdown
TSD
150
°C
Thermal Shutdown Hysteresis
TSDH
35
°C
Thermal Resistance: Junction to Ambient (0 LFM) (Note 4)
θJA
13
°C/W
Thermal Resistance: Junction to Case (0 LFM)
θJC
1
°C/W
Note 1: PVIN rising and falling slew rates cannot be outside of specification. PVIN should rise monotonically into
regulation. Filter PVIN with proper input bulk capacitance so that the input AC ripple in regulation is less than ±1V of the
regulation voltage. See Input Capacitor Selection for details.
Note 2: For accurate power up sequencing, use a fast ENABLE logic (>3V/100µs) after both AVIN and PVIN are high.
Tying ENABLE to AVIN may result in a startup delay due to a slow ENABLE logic.
Note 3: Dropout: Maximum VOUT ≤ VIN - 2.5V
Note 4: Based on 2oz. external copper layers and proper thermal design in line with EIJ/JEDEC JESD51-7 standard for
high thermal conductivity boards.
www.altera.com/enpirion Page 4
10301
June 2, 2015
Rev C
EN23F2QI
Electrical Characteristics
NOTE: VIN=12V, Minimum and Maximum values are over operating ambient temperature range unless otherwise noted.
Typical values are at TA = 25°C.
PARAMETER
MAX
UNITS
Operating Input Voltage
SYMBOL
PVIN
TEST CONDITIONS
MIN
4.5
TYP
13.2
V
Controller Input Voltage
AVIN
3
5.5
V
AVIN Under Voltage
Lock-out rising
AVINUVLOR
Voltage above which UVLO is not
asserted
2.5
2.75
3
V
AVIN Under Voltage
Lock-out falling
AVINOVLOF
Voltage below which UVLO is
asserted
2.1
2.35
2.6
V
AVIN UVLO Hysteresis
AVINHYS
400
mV
AVIN Pin Input Current
IAVIN
14
mA
Internal LDO Output
AVINO
3.4
V
Shut-Down Supply
Current
IPVINS
PVIN=12V, AVIN=3.4V, ENABLE=0V
1
mA
IAVINS
PVIN=12V, AVIN=3.4V, ENABLE=0V
Feedback node voltage at:
PVIN = 12V, ILOAD = 0, TA = 25°C
Feedback node voltage at:
4.5V ≤ PVIN ≤ 13.2V
0A ≤ ILOAD ≤ 15A, TA = -40 to 85°C
VFB pin input leakage current
(Note 5)
75
µA
Feedback Pin Voltage
VFB
Feedback Pin Voltage
VFB
Feedback Pin Input
Leakage Current
IFB
VOUT Rise Time
Soft Start Capacitor
Range
Output Capacitance
Range
Continuous Output
Current
OCP Trip Point
tRISE
CSS_RANGE
COUT
IOUT_MAX_CONT
IOCP
CSS = 47nF
(Note 5, Note 6 and Note 7)
0.594
0.60
0.606
V
0.588
0.60
0.612
V
5
nA
-5
1.96
2.8
3.64
ms
Note 5
10
47
68
nF
VIN = 12V
VOUT = 3.3V; RFS = 22kΩ
See Table 3 for other output voltages
(Note 5)
80
200
800
µF
VIN = 12V
VOUT ≤ 1.0V; RFS = 3.01kΩ
See Table 3 for other output voltages
(Note 5)
80
200
2200
µF
15
A
Subject to thermal derating
VIN = 12V
0
15.2
20
A
100
mA
Short Circuit Average
Input Current
IIN_OCP
ENABLE Logic High
VENABLE_HIGH
4.5V ≤ VIN ≤ 13.2V;
1.25
AVIN
V
ENABLE Logic Low
VENABLE_LOW
4.5V ≤ VIN ≤ 13.2V;
0
0.95
V
ENABLE Hysteresis
ENHYS
ENABLE Lockout Time
ENABLE Pin Input
Current
TENLOCKOUT
IENABLE
Short = 10mΩ (Note 8)
fsw = 1MHz (Note 5)
AVIN = 5.5V
ENABLE = 1.8V;
ENABLE = 3.4V;
ENABLE = 5.5V;
200
mV
8
ms
5
11
23
8
18
32
µA
www.altera.com/enpirion Page 5
10301
June 2, 2015
Rev C
EN23F2QI
PARAMETER
Switching Frequency
SYMBOL
FSW
TEST CONDITIONS
RFS =3.01kΩ
External SYNC Clock
Frequency Lock Range
FPLL_LOCK
Range of SYNC clock frequency (See
Table 1)
S_IN Threshold – Low
VS_IN_LO
S_IN Clock Logic Low Level (Note 5)
S_IN Threshold – High
VS_IN_HI
S_IN Clock Logic High Level (Note 5)
S_OUT Threshold –
Low
VS_OUT_LO
S_OUT Clock Logic Low Level
(Note 5)
S_OUT Threshold –
High
VS_OUT_HI
S_OUT Clock Logic High Level
(Note 5)
POKLT
Percentage of Nominal Output
Voltage for POK to be Low
POK Lower Threshold
MIN
TYP
MAX
1.0
0.9
1.8
1.8
UNITS
MHz
1.8
MHz
0.8
V
2.5
V
0.8
V
2.5
V
90
%
POK Output Low
Voltage
VPOKL
With 4mA Current Sink into POK
0.4
V
POK Output Hi Voltage
VPOKH
PVIN range: 4.5V ≤ PVIN ≤ 15V
AVIN
V
1
µA
0.8
V
POK pin VOH leakage
current
IPOKL
POK High (Note 5)
M/S Pin Logic Low
VT-LOW
Tie Pin to GND (Master Mode)
M/S Pin Logic High
VT-HIGH
Pull up to AVIN Through an External
Resistor REXT (Slave Mode)
M/S Pin Input Current
Note
Note
Note
Note
5:
6:
7:
8:
IM/S
REXT = 15kΩ;
AVIN = 3.4V;
AVIN = 5.5V;
1.8
V
65
175
µA
Parameter not production tested but is guaranteed by design.
Rise time calculation begins when AVIN > VUVLO and ENABLE = HIGH.
VOUT Rise Time Accuracy does not include soft-start capacitor tolerance.
Output short circuit condition was performed with load impedance that is greater than or equal to 10mΩ.
www.altera.com/enpirion Page 6
10301
June 2, 2015
Rev C
EN23F2QI
Typical Performance Curves
Efficiency vs. Output Current
100
90
90
80
80
EFFICIENCY (%)
EFFICIENCY (%)
Efficiency vs. Output Current
100
70
60
50
VOUT = 3.3V
40
VOUT = 2.5V
30
VOUT = 1.8V
20
VOUT = 1.2V
10
VOUT = 1.0V
CONDITIONS
VIN = 12.0V
Single Supply
70
60
50
VOUT = 3.3V
40
VOUT = 2.5V
30
VOUT = 1.8V
20
VOUT = 1.2V
0
0
0
1
2
3
0
4 5 6 7 8 9 10 11 12 13 14 15
OUTPUT CURRENT (A)
MAXIMUM OUTPUT CURRENT (A)
MAXIMUM OUTPUT CURRENT (A)
Output Current De-rating
16
15
14
13
12
11
10
CONDITIONS
VIN = 12V
TJMAX = 125°C
θJA = 13°C/W
13x12x3mm QFN
No Air Flow
9
8
7
6
VOUT = 1.0V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
5
16.0
15.0
14.0
13.0
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
3
4 5 6 7 8 9 10 11 12 13 14 15
OUTPUT CURRENT (A)
CONDITIONS
VIN = 12V
TJMAX = 125°C
θJA = 10.5°C/W
13x12x3mm QFN
Air Flow (200fpm)
VOUT = 1.0V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
Output Current De-rating
with Heat Sink
MAXIMUM OUTPUT CURRENT (A)
MAXIMUM OUTPUT CURRENT (A)
2
25 30 35 40 45 50 55 60 65 70 75 80 85
AMBIENT TEMPERATURE (°C)
Output Current De-rating
with Air Flow (400fpm)
CONDITIONS
VIN = 12V
TJMAX = 125°C
θJA = 9°C/W
13x12x3mm QFN
Air Flow (400fpm)
1
Output Current De-rating
with Air Flow (200fpm)
25 30 35 40 45 50 55 60 65 70 75 80 85
AMBIENT TEMPERATURE (°C)
16.0
15.0
14.0
13.0
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
VOUT = 1.0V
10
CONDITIONS
VIN = 12.0V
AVIN = 3.3V
Dual Supply
VOUT = 1.0V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
25 30 35 40 45 50 55 60 65 70 75 80 85
AMBIENT TEMPERATURE (°C)
16.0
15.0
14.0
13.0
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
CONDITIONS
VIN = 12V
TJMAX = 125°C
θJA = 12°C/W
13x12x3mm QFN
No Air Flow
Heat Sink - Wakefield
Thermal Solutions
P/N 651-B
VOUT = 1.0V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
25 30 35 40 45 50 55 60 65 70 75 80 85
AMBIENT TEMPERATURE (°C)
www.altera.com/enpirion Page 7
10301
June 2, 2015
Rev C
EN23F2QI
Typical Performance Curves
16.0
15.0
14.0
13.0
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
CONDITIONS
VIN = 12V
TJMAX = 125°C
θJA = 9.5°C/W
13x12x3mm QFN
Air Flow (200fpm)
Heat Sink - Wakefield
Thermal Solutions
P/N 651-B
Output Current De-rating
w/ Heat Sink and Air Flow (400fpm)
MAXIMUM OUTPUT CURRENT (A)
MAXIMUM OUTPUT CURRENT (A)
Output Current De-rating
w/ Heat Sink and Air Flow (200fpm)
VOUT = 1.0V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
16.0
15.0
14.0
13.0
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
25 30 35 40 45 50 55 60 65 70 75 80 85
AMBIENT TEMPERATURE (°C)
CONDITIONS
VIN = 12V
TJMAX = 125°C
θJA = 8°C/W
13x12x3mm QFN
Air Flow (400fpm)
Heat Sink - Wakefield
Thermal Solutions
P/N 651-B
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
Output Voltage vs. Output Current
Max VOUT at 15A vs. Temperature
1.005
OUTPUT VOLTAGE (V)
MAXIMUM OUTPUT VOLTAGE (V)
VOUT = 1.2V
25 30 35 40 45 50 55 60 65 70 75 80 85
AMBIENT TEMPERATURE (°C)
3.50
3.00
2.50
2.00
CONDITIONS
VIN = 12V
LOAD = 15A
No Air Flow
No Heat Sink
1.50
1.00
1.004
VIN = 8V
1.003
VIN = 10V
1.002
VIN = 12V
1.001
1.000
0.999
0.998
0.997
CONDITIONS
CONDITIONS
VOUT_NOM
VIN ==5.0V
1.0V
0.996
0.50
0.995
40
45
50
55
60
65
70
AMBIENT TEMPERATURE (°C)
75
80
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
OUTPUT CURRENT (A)
Output Voltage vs. Output Current
Output Voltage vs. Output Current
1.205
1.805
1.204
VIN = 8V
1.203
VIN = 10V
1.202
VIN = 12V
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
VOUT = 1.0V
1.201
1.200
1.199
1.198
1.197
1.196
1.804
VIN = 8V
1.803
VIN = 10V
1.802
VIN = 12V
1.801
1.800
1.799
1.798
1.797
CONDITIONS
CONDITIONS
VOUT_NOM
VIN ==5.0V
1.2V
1.796
1.195
CONDITIONS
VOUT_NOM = 1.8V
Note: Air flow or heat sink may be required for
higher currents. See derating curves.
1.795
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
OUTPUT CURRENT (A)
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
OUTPUT CURRENT (A)
www.altera.com/enpirion Page 8
10301
June 2, 2015
Rev C
EN23F2QI
Typical Performance Curves
Output Voltage vs. Output Current
Output Voltage vs. Temperature
1.204
2.504
VIN = 8V
2.503
VIN = 10V
2.502
VIN = 12V
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.505
2.501
2.500
2.499
2.498
CONDITIONS
VOUT_NOM = 2.5V
Note: Air flow or heat sink may be required for
higher currents. See derating curves.
2.497
2.496
CONDITIONS
VIN = 8V
VOUT_NOM = 1.2V
1.203
1.202
1.201
1.200
LOAD = 0A
1.199
LOAD = 4A
1.198
LOAD = 8A
1.197
LOAD = 12A
1.196
2.495
-40
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
OUTPUT CURRENT (A)
Output Voltage vs. Temperature
1.204
1.202
OUTPUT VOLTAGE (V)
CONDITIONS
VIN = 10V
VOUT_NOM = 1.2V
1.203
1.201
1.200
LOAD = 0A
1.199
LOAD = 4A
1.198
CONDITIONS
VIN = 12V
VOUT_NOM = 1.2V
1.203
1.202
1.201
1.200
LOAD = 0A
1.199
LOAD = 4A
1.198
LOAD = 8A
1.197
LOAD = 8A
1.197
LOAD = 12A
1.196
LOAD = 12A
1.196
-40
-15
10
35
60
AMBIENT TEMPERATURE ( C)
85
-40
1.202
1.201
1.200
LOAD = 0A
1.199
LOAD = 4A
1.198
LOAD = 8A
1.197
LOAD = 12A
1.196
-40
-15
10
35
60
AMBIENT TEMPERATURE ( C)
85
INDIVIDUAL OUTPUT CURRENT (A)
CONDITIONS
VIN = 14V
VOUT_NOM = 1.2V
1.203
-15
10
35
60
AMBIENT TEMPERATURE ( C)
85
Parallel Current Share Breakdown
Output Voltage vs. Temperature
1.204
OUTPUT VOLTAGE (V)
85
Output Voltage vs. Temperature
1.204
OUTPUT VOLTAGE (V)
-15
10
35
60
AMBIENT TEMPERATURE ( C)
20
17.5
MASTER
15
SLAVE
12.5
IDEAL
10
7.5
CONDITIONS
EN23F0QI
VIN = 12V
VOUT = 1.2V
5
2.5
0
0
5
10
15
20
TOTAL OUTPUT CURRENT (A)
25
www.altera.com/enpirion Page 9
10301
June 2, 2015
Rev C
EN23F2QI
Typical Performance Characteristics
Enable Startup/Shutdown Waveform (0A)
Enable Startup/Shutdown Waveform (5A)
ENABLE
ENABLE
VOUT
VOUT
POK
POK
LOAD
LOAD
CONDITIONS
VIN = 12V, VOUT = 3.3V, Load = 0A, Css = 47nF
CIN = 3x22µF(1206), COUT = 100µF(1206) + 3x47µF(1206)
CONDITIONS
VIN = 12V, VOUT = 3.3V, Load = 5A, Css = 47nF
CIN = 3x22µF(1206), COUT = 100µF(1206) + 3x47µF(1206)
Enable Startup/Shutdown Waveform (10A)
Enable Startup/Shutdown Waveform (15A)
ENABLE
ENABLE
VOUT
VOUT
POK
POK
LOAD
LOAD
CONDITIONS
VIN = 12V, VOUT = 3.3V, Load = 10A, Css = 47nF
CIN = 3x22µF(1206), COUT = 100µF(1206) + 3x47µF(1206)
CONDITIONS
VIN = 12V, VOUT = 3.3V, Load = 15A, Css = 47nF
CIN = 3x22µF(1206), COUT = 100µF(1206) + 3x47µF(1206)
Power Up Waveform (0A)
Power Up Waveform (15A)
PVIN
PVIN
VOUT
VOUT
POK
POK
LOAD
LOAD
CONDITIONS
VIN = 12V, VOUT = 3.3V, Load = 15A, Css = 47nF,
CIN = 3x22µF(1206), COUT = 100µF(1206) + 3x47µF(1206)
CONDITIONS
VIN = 12V, VOUT = 3.3V, Load = 0A, Css = 47nF,
CIN = 3x22µF(1206), COUT = 100µF(1206) + 3x47µF(1206)
www.altera.com/enpirion Page 10
10301
June 2, 2015
Rev C
EN23F2QI
Typical Performance Characteristics
Output Ripple at 20MHz Bandwidth
VOUT = 1V
(AC Coupled)
Output Ripple at 20MHz Bandwidth
VOUT = 1V
(AC Coupled)
LOAD = 0A
VOUT = 1.8V
(AC Coupled)
VOUT = 1.8V
(AC Coupled)
VOUT = 3.3V
(AC Coupled)
VOUT = 3.3V
(AC Coupled)
20mV / DIV
20mV / DIV
CONDITIONS
VIN = 12V, CIN = 3x22µF (1206), COUT = 3x47µF + 100µF (1206)
CONDITIONS
VIN = 12V, CIN = 3x22µF (1206), COUT = 3x47µF + 100µF (1206)
Output Ripple at 500MHz Bandwidth
Output Ripple at 500MHz Bandwidth
VOUT = 1V
(AC Coupled)
VOUT = 1V
(AC Coupled)
LOAD = 0A
LOAD = 2A
VOUT = 1.8V
(AC Coupled)
VOUT = 1.8V
(AC Coupled)
VOUT = 3.3V
(AC Coupled)
VOUT = 3.3V
(AC Coupled)
20mV / DIV
20mV / DIV
CONDITIONS
VIN = 12V, CIN = 3x22µF (1206), COUT = 3x47µF + 100µF (1206)
CONDITIONS
VIN = 12V, CIN = 3x22µF (1206), COUT = 3x47µF + 100µF (1206)
Output Ripple at 500MHz Bandwidth
VOUT = 1V
(AC Coupled)
LOAD = 10A
Output Ripple at 500MHz Bandwidth
VOUT = 1V
(AC Coupled)
LOAD = 6A
VOUT = 1.8V
(AC Coupled)
LOAD = 10A
VOUT = 1.8V
(AC Coupled)
VOUT = 3.3V
(AC Coupled)
VOUT = 3.3V
(AC Coupled)
20mV / DIV
20mV / DIV
CONDITIONS
VIN = 12V, CIN = 3x22µF (1206), COUT = 3x47µF + 100µF (1206)
CONDITIONS
VIN = 12V, CIN = 3x22µF (1206), COUT = 3x47µF + 100µF (1206)
www.altera.com/enpirion Page 11
10301
June 2, 2015
Rev C
EN23F2QI
Typical Performance Characteristics
Load Transient from 0 to 5A (VOUT =3.3V)
Load Transient from 0 to 10A (VOUT =3.3V)
VOUT
(AC Coupled)
VOUT
(AC Coupled)
LOAD
CONDITIONS
VIN = 12V, VOUT = 3.3V
CIN = 3 x 22µF (1206)
COUT = 3 x 47µF (1206) + 100µF (1206)
Using Best Performance Configuration
LOAD
Load Transient from 0 to 5A (VOUT =1V)
Load Transient from 0 to 15A (VOUT =3.3V)
VOUT
(AC Coupled)
LOAD
VOUT
(AC Coupled)
CONDITIONS
VIN = 12V, VOUT = 3.3V
CIN = 3 x 22µF (1206)
COUT = 3 x 47µF (1206) + 100µF (1206)
Using Best Performance Configuration
LOAD
Load Transient from 0 to 10A (VOUT =1V)
CONDITIONS
VIN = 12V, VOUT = 1.0V
CIN = 3 x 22µF (1206)
COUT = 3 x 47µF (1206) + 100µF (1206)
Using Best Performance Configuration
Load Transient from 0 to 15A (VOUT =1V)
VOUT
(AC Coupled)
LOAD
CONDITIONS
VIN = 12V, VOUT = 3.3V
CIN = 3 x 22µF (1206)
COUT = 3 x 47µF (1206) + 100µF (1206)
Using Best Performance Configuration
VOUT
(AC Coupled)
CONDITIONS
VIN = 12V, VOUT = 1.0V
CIN = 3 x 22µF (1206)
COUT = 3 x 47µF (1206) + 100µF (1206)
Using Best Performance Configuration
LOAD
CONDITIONS
VIN = 12V, VOUT = 1.0V
CIN = 3 x 22µF (1206)
COUT = 3 x 47µF (1206) + 100µF (1206)
Using Best Performance Configuration
www.altera.com/enpirion Page 12
10301
June 2, 2015
Rev C
EN23F2QI
Typical Performance Characteristics
Pre-Bias Shutdown Waveform
Pre-Bias Startup Waveform
PVIN = 12V
PVIN = 12V
ENABLE
ENABLE
VOUT
VOUT
Max Pre-Bias
4.5V)
prior to being enabled.
• Since the ENABLE pin is tied to the resistor
divider to PVIN, an open drain (such as the
POK signal of another regulator or
Sequencer) should be tied to ENABLE in
order to keep the device disabled while the
PVIN rail rises into regulation.
• Once the PVIN rail is in regulation, the
ENABLE may be pulled high through the
resistor divider.
• The ENABLE rise time must be faster than
3V/100us.
The output will start up from the Pre-Bias voltage
into regulation monotonically if the instructions are
followed; otherwise, the Pre-Bias Protection feature
may not function properly and the device will
startup into a Pre-Bias output voltage. Starting up
www.altera.com/enpirion Page 15
10301
June 2, 2015
Rev C
EN23F2QI
0.1µF
Need Fast
ENABLE Logic
(>3V/100us)
VIN
PG
0.47µF
BTMP VDDB
PVIN
10k
EN23F2QI
4.75k
3x
22µF
1206
VOUT
BGND
VOUT
EAIN
ENABLE
2.26k
AVINO
1µF
REA
3x
47µF
1206
RA
AVIN
1µF
RCA
VFB
EN_PB
SS
M/S
FQADJ AGND
RFS
Rfs vs. SW Frequency
1.800
1.600
1.400
1.200
1.000
RCLX
CONDITIONS
VIN = 6V to 12V
VOUT = 0.8V to 3.3V
0.800
0.600
0
PGND
PGND
47nF
CA
performance of the EN23F2QI. Using higher RFS
resistor values are allowed. Do not use lower RFS
values than recommendations as that may set the
frequency too low and cause inductor saturation.
When synchronizing multiple devices, use the
highest recommended switching frequency of the
devices.
SWITCHING FREQUENCY (MHz)
into a Pre-Bias voltage without the Pre-Bias
Protection feature enabled can lead to device
damage. When using the Pre-Bias feature, the
device must be disabled using the ENABLE pin
prior to PVIN falling out of regulation ( V OUT> 1.8V, COUT = 3x47µF/1206
RA = 100 kΩ
COUT = 3x47µF (1206) + 100µF(1206)
RA = 200 kΩ
PVIN (V)
13.2V
12V
10V
8V
6.6V
5V
VOUT
(V)
CA
(pF)
RCA
(kΩ)
REA
(kΩ)
Ripple
(m V)
Deviation
(m V)
1.0V
27
15
200
25.6
1.2V
27
15
200
24
1.5V
27
15
200
26.4
60
1.8V
15
15
86
28.4
70
2.5V
15
15
86
31.6
3.3V
15
15
86
1.0V
27
15
200
1.2V
27
15
1.5V
27
15
1.8V
15
2.5V
15
3.3V
15
1.0V
PVIN
(V)
VOUT
(V)
CA
(pF)
RCA
(kΩ)
REA
(kΩ)
Ripple
(m V)
Deviation
(m V)
40
1.0V
12
36
Open
15
78
42
1.2V
12
36
Open
18
93
1.5V
12
36
Open
22
104
1.8V
12
36
Open
25
130
86
2.5V
15
27
Open
32
162
37.3
96
3.3V
10
27
Open
46
200
21.6
42
1.0V
22
27
Open
15
84
200
22.7
48
1.2V
22
27
Open
18
97
200
25.2
70
1.5V
18
27
Open
21
118
15
86
25.8
72
1.8V
18
27
Open
24
130
15
86
30
82
2.5V
22
27
Open
30
172
15
86
30.8
110
3.3V
15
27
Open
43
213
27
5
86
18.8
46
1.0V
56
20
Open
15
85
1.2V
27
5
86
20.4
54
1.2V
47
20
Open
17
100
1.5V
27
5
86
22
60
1.5V
39
20
Open
20
120
1.8V
15
15
86
23.6
78
1.8V
33
20
Open
22
140
2.5V
15
15
86
26.5
92
2.5V
33
20
Open
29
177
3.3V
15
15
86
28.9
132
3.3V
22
20
Open
41
230
1.0V
27
5
86
17.2
64
1.0V
200
10
Open
14
83
1.2V
27
5
86
18.7
64
1.2V
200
10
Open
16
90
1.5V
27
5
86
20.1
70
1.5V
150
10
Open
19
107
13.2V
12V
10V
8V
1.8V
15
5
86
20.9
100
1.8V
82
10
Open
20
138
2.5V
15
5
86
23.6
120
2.5V
68
10
Open
27
178
3.3V
15
5
86
22.8
156
3.3V
39
10
Open
36
239
1.0V
27
1
86
13.8
74
1.0V
200
10
Open
13
99
1.2V
27
1
86
15.2
76
1.2V
200
10
Open
15
105
1.5V
27
1
86
16.4
88
1.5V
200
10
Open
17
118
1.8V
15
5
86
19.6
116
1.8V
150
10
Open
19
138
2.5V
15
5
86
20.4
148
2.5V
100
10
Open
24
183
3.3V
15
5
86
21.1
204
3.3V
56
10
Open
32
250
1.0V
27
1
86
12.4
92
1.0V
200
10
Open
12
123
1.2V
27
1
86
13.4
100
1.2V
200
10
Open
13
132
1.5V
27
1
86
14.3
120
1.5V
200
10
Open
16
145
1.8V
15
5
86
15.4
160
1.8V
200
10
Open
17
156
6.6V
5V
2.5V
15
5
86
15.5
204
2.5V
100
10
Open
20
216
3.3V
15
5
86
12.9
300
3.3V
100
10
Open
21
253
Table 4: RA, CA, RCA and REA Values for Various PVIN/VOUT Combinations: Best Performance vs. Smallest Solution
Size. Use the equations in Figure 10 to calculate RB. Output ripple is measured at no load and nominal deviation is for a
15A load transient step. For compensation values of output voltage in between the specified output voltages, choose
compensation values of the lower output voltage setting.
www.altera.com/enpirion Page 21
10301
June 2, 2015
Rev C
EN23F2QI
Thermal Considerations
Thermal considerations are important power supply
design facts that cannot be avoided in the real
world. Whenever there are power losses in a
system, the heat that is generated by the power
dissipation needs to be accounted for. The Altera
Enpirion PowerSoC helps alleviate some of those
concerns.
η = POUT / PIN = 80% = 0.8
The Altera Enpirion EN23F2QI DC-DC converter is
packaged in a 13x12x3mm 92-pin QFN package.
The QFN package is constructed with copper lead
frames that have an exposed thermal pad. The
exposed thermal pad on the package should be
soldered directly on to a copper ground pad on the
printed circuit board (PCB) to act as a heat sink.
The recommended maximum junction temperature
for continuous operation is 125°C. Continuous
operation above 125°C may reduce long-term
reliability. The device has a thermal overload
protection circuit designed to turn off the device at
an approximate junction temperature value of
150°C.
PD = PIN – POUT
The following example and calculations illustrate
the thermal performance of the EN23F2QI.
Example:
VIN = 12V
VOUT = 1.2V
PIN ≈ 18W / 0.8 ≈ 22.5W
The power dissipation (PD ) is the power loss in the
system and can be calculated by subtracting the
output power from the input power.
≈ 22.5W – 18W ≈ 4.5W
With the power dissipation known, the temperature
rise in the device may be estimated based on the
theta JA value (θJA). The θJA parameter estimates
how much the temperature will rise in the device for
every watt of power dissipation. The EN23F2QI has
a θJA value of 13 ºC/W without airflow.
Determine the change in temperature (ΔT) based
on PD and θJA.
ΔT = PD x θJA
ΔT ≈ 4.5W x 13°C/W = 58.5°C ≈ 59°C
The junction temperature (T J ) of the device is
approximately the ambient temperature (T A) plus
the change in temperature. We assume the initial
ambient temperature to be 25°C.
T J = T A + ΔT
T J ≈ 25°C + 59°C ≈ 84°C
IOUT = 15A
First calculate the output power.
POUT = 1.2V x 15A = 18W
Next, determine the input power based on the
efficiency (η) shown in Figure 12.
Efficiency vs. Output Current
100
80
70
60
50
VOUT = 3.3V
40
VOUT = 2.5V
30
VOUT = 1.8V
20
VOUT = 1.2V
VOUT = 1.0V
10
The maximum operating junction temperature
(T JMAX) of the device is 125°C, so the device can
operate at a higher ambient temperature. The
maximum ambient temperature (T AMAX) allowed can
be calculated.
T AMAX = T JMAX – PD x θJA
≈ 125°C – 59°C ≈ 66°C
The maximum ambient temperature the device can
reach is 66°C given the input and output conditions.
Note that the efficiency will be slightly lower at
higher temperatures and this calculation is an
estimate. Check De-rating Curves for guaranteed
maximum output current over temperature.
90
EFFICIENCY (%)
PIN = POUT / η
CONDITIONS
VIN = 12.0V
AVIN = 3.3V
Dual Supply
0
0
1
2
3
4 5 6 7 8 9 10 11 12 13 14 15
OUTPUT CURRENT (A)
Figure 12: Efficiency vs. Output Current
For VIN = 12V, VOUT = 1.2V at 15A, η ≈ 80%
www.altera.com/enpirion Page 22
10301
June 2, 2015
Rev C
EN23F2QI
Engineering Schematic
Figure 13: Engineering Schematic
www.altera.com/enpirion Page 23
10301
June 2, 2015
Rev C
EN23F2QI
Layout Recommendation
Figure 14: Top Layer Layout with Critical Components
(Top View). See Figure 13 for corresponding schematic.
This layout only shows the critical components and top
layer traces for minimum footprint in single-supply mode.
Alternate circuit configurations & other low-power pins
need to be connected and routed according to customer
application. Please see the Gerber files at
www.altera.com/enpirion for details on all layers.
Recommendation 1: Input and output filter
capacitors should be placed on the same side of the
PCB, and as close to the EN23F2QI package as
possible. They should be connected to the device with
very short and wide traces. Do not use thermal reliefs
or spokes when connecting the capacitor pads to the
respective nodes. The +V and GND traces between
the capacitors and the EN23F2QI should be as close
to each other as possible so that the gap between the
two nodes is minimized, even under the capacitors.
Recommendation 2: The PGND connections for the
input and output capacitors on layer 1 need to have a
slit between them in order to provide some separation
between input and output current loops.
Recommendation 3: The system ground plane
should be the first layer immediately below the
surface layer. This ground plane should be
continuous and un-interrupted below the converter
and the input/output capacitors.
Recommendation 4: The thermal pad underneath
the component must be connected to the system
ground plane through as many vias as possible. The
drill diameter of the vias should be 0.33mm, and the
vias must have at least 1 oz. copper plating on the
inside wall, making the finished hole size around 0.200.26mm. Do not use thermal reliefs or spokes to
connect the vias to the ground plane. This connection
provides the path for heat dissipation from the
converter.
Recommendation 5: Multiple small vias (the same
size as the thermal vias discussed in recommendation
4) should be used to connect ground terminal of the
input capacitor and output capacitors to the system
ground plane. It is preferred to put these vias along
the edge of the GND copper closest to the +V copper.
These vias connect the input/output filter capacitors to
the GND plane, and help reduce parasitic inductances
in the input and output current loops. If vias cannot be
placed under the capacitors, then place them on both
sides of the slit in the top layer PGND copper.
Recommendation 6: AVIN is the power supply for
the small-signal control circuits. AVINO powers AVIN
in single supply mode. AVIN and AVINO should have
a decoupling capacitor close to each of their pins.
Refer to Figure 14.
Recommendation 7: The layer 1 metal under the
device must not be more than shown in Figure 14.
Refer to the section regarding Exposed Metal on
Bottom of Package. As with any switch-mode DC/DC
converter, try not to run sensitive signal or control
lines underneath the converter package on other
layers.
Recommendation 8: The VOUT sense point should be
just after the last output filter capacitor. Keep the
sense trace short in order to avoid noise coupling into
the node. Contact Altera MySupport for any remote
sensing applications.
Recommendation 9: Keep RA, CA, RB, and RCA close
to the VFB pin (Refer to Figure 14). The VFB pin is a
high-impedance, sensitive node. Keep the trace to
this pin as short as possible. Whenever possible,
connect RB directly to the AGND instead of going
through the GND plane.
Recommendation 10: Follow all the layout
recommendations as close as possible to optimize
performance. Altera provides schematic and layout
reviews for all customer designs. Contact Altera
for
detailed
support
MySupport
(www.altera.com/mysupport).
www.altera.com/enpirion Page 24
10301
June 2, 2015
Rev C
EN23F2QI
Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom of Package
Lead-frames offer many advantages in thermal performance, in reduced electrical lead resistance, and in
overall foot print. However, they do require some special considerations.
In the assembly process lead frame construction requires that, for mechanical support, some of the lead-frame
cantilevers be exposed at the point where wire-bond or internal passives are attached. This results in several
small pads being exposed on the bottom of the package, as shown in Figure 15.
Only the thermal pad and the perimeter pads are to be mechanically or electrically connected to the PC board.
The PCB top layer under the EN23F2QI should be clear of any metal (copper pours, traces, or vias) except for
the thermal pad. The “shaded-out” area in Figure 15 represents the area that should be clear of any metal on
the top layer of the PCB. Any layer 1 metal under the shaded-out area runs the risk of undesirable shorted
connections even if it is covered by soldermask.
The solder stencil aperture should be smaller than the PCB ground pad. This will prevent excess solder from
causing bridging between adjacent pins or other exposed metal under the package. Please consult the
Enpirion Manufacturing Application Note for more details and recommendations.
Figure 15: Lead-Frame exposed metal (Bottom View)
Shaded area highlights exposed metal that is not to be mechanically or electrically connected to the PCB.
www.altera.com/enpirion Page 25
10301
June 2, 2015
Rev C
EN23F2QI
Recommended PCB Footprint
Figure 16: EN23F2QI PCB Footprint (Top View)
The solder stencil aperture for the thermal pad (shown in blue) is based on Altera’s manufacturing recommendations.
www.altera.com/enpirion Page 26
10301
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EN23F2QI
Package and Mechanical
Figure 17: EN23F2QI Package Dimensions (Bottom View)
Packing and Marking Information: www.altera.com/support/reliability/packing/rel-packing-and-marking.html
Contact Information
Altera Corporation
101 Innovation Drive
San Jose, CA 95134
Phone: 408-544-7000
www.altera.com
© 2013 Altera Corporation—Confidential. All rights reserved. ALTERA, ARRIA, CYCLONE, ENPIRION, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX
words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as
trademarks or service marks are the property of their respective holders as described at www.altera.com/common/legal.html. Altera warrants performance of its semiconductor
products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without
notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in
writing by Altera. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for
products or services.
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