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 Intel® Joule™ Module Datasheet September 2016 Revision 1.1 September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 1 No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. This document contains information on products, services, and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications, and roadmaps. The products and services described may contain defects or errors known as errata, which may cause deviations from published specifications. Current characterized errata are available on request. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a nonexclusive, royalty-free license to any patent claim thereafter drafted that includes subject matter disclosed herein. Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and confirm whether referenced data are accurate. Intel technologies may require enabled hardware, specific software, or services activation. Check with your system manufacturer or retailer. Copies of documents that have an order number and are referenced in this document may be obtained by calling 1-800-548-4725 or by visiting www.intel.com/ design/literature.htm. The Intel Joule Module, Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2016 Intel Corporation. All rights reserved September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 2  Revision History Revision 1.1 1.0 Description Update wireless communication statement for end-use equipment integration Initial release September 2016 Document number: 566641 rev. 1.1 Date September 2018 August 2016 Intel® Joule™ Datasheet Page 3  Contents 1 Introduction ............................................................................................................................................................................. 8 1.1 Acronyms................................................................................................................. 8 1.2 Reference documents ................................................................................................ 9 2 System on a Module Overview ............................................................................................................................................ 9 2.1 Intel® Joule™ configurations ...................................................................................... 9 2.2 Intel® Joule™ feature summary.................................................................................10 2.3 Expansion board requirements ...................................................................................10 2.3.1 Method for connecting module to expansion board ..........................................10 2.3.2 Method to provide +VSYS power to the module ..............................................10 2.3.3 Required strapping of module pins ................................................................11 2.3.4 BIOS installed onto module..........................................................................11 2.4 Expansion board recommendations.............................................................................11 2.4.1 External EEPROM for multipurpose pin configuration data.................................11 2.4.2 Power button .............................................................................................11 2.4.3 DnX button................................................................................................11 2.4.4 Real time clock (RTC) backup power source ...................................................11 2.4.5 UART debugging.........................................................................................11 3 Power Delivery, Signaling, and Reset .............................................................................................................................. 12 3.1 Main power supply (VSYS).........................................................................................12 3.2 Power on signaling ...................................................................................................12 3.2.1 +VDC_IN power sensing..............................................................................12 3.2.2 +VBUS power sensing.................................................................................12 3.2.3 Power good ...............................................................................................12 3.3 Hard shutdown via power button ................................................................................12 3.4 System voltage rail specifications ...............................................................................13 4 Graphics Specifications....................................................................................................................................................... 13 4.1 Intel® Gen9LP features ............................................................................................13 4.2 Graphic encoder and decoder support .........................................................................14 4.3 HDMI* signal group specifications ..............................................................................14 5 Wireless Connectivity .......................................................................................................................................................... 15 5.1 Intel® Dual Band Wireless-AC 8260 highlights...............................................................15 5.1.1 Wi-Fi features ............................................................................................15 5.2 Bluetooth® highlights ................................................................................................15 5.2.1 Supported Bluetooth® profiles ......................................................................15 5.3 Security ..................................................................................................................16 5.4 Wireless antenna connectors......................................................................................16 5.5 The Intel® Dual Band Wireless-AC 8260 support site......................................................16 6 SD Card Interface.................................................................................................................................................................. 17 6.1 SD card interface features .........................................................................................17 6.1.1 SD card signal group specifications ...............................................................17 7 Module Connectors .............................................................................................................................................................. 17 7.1 Module dimensions ...................................................................................................17 7.2 Module to expansion board connectors ........................................................................18 7.2.1 Module electrostatic discharge......................................................................18 7.2.2 J6 connector interface signals ......................................................................18 7.2.3 J7 connector interface signals ......................................................................20 8 I2C Interfaces......................................................................................................................................................................... 22 8.1 I2C features ............................................................................................................22 8.2 I2C default configuration ...........................................................................................22 8.3 I2C signal group specifications ...................................................................................22 September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 4  9 Clock Specifications............................................................................................................................................................. 22 9.1 RTC backup battery ..................................................................................................22 10 UART Specifications............................................................................................................................................................. 23 10.1 UART availability ......................................................................................................23 11 I2S Specifications ................................................................................................................................................................. 23 11.1 I2S signal group specifications ...................................................................................23 11.1.1 I2S available formats ..................................................................................23 11.2 Digital microphone ports ...........................................................................................24 12 GPIO Specifications.............................................................................................................................................................. 24 12.1 Dedicated GPIO lines ................................................................................................24 12.2 Reconfigurable interfaces buses as GPIO .....................................................................24 12.3 GPIO internal pull UP / pull DOWN resistors .................................................................24 12.4 Linux* GPIO to function mapping ...............................................................................25 13 Pulse Width Modulators ..................................................................................................................................................... 26 13.1 PWM frequency formula: ...........................................................................................26 13.2 PWM duty cycle formula:...........................................................................................26 14 Universal Serial Bus ............................................................................................................................................................. 26 14.1 Available USB ports ..................................................................................................26 September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 5 Tables 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Acronyms and terminology ...................................................................................... 8 Intel® Joule™ configurations ................................................................................... 9 Intel® Joule™ features ..........................................................................................10 Required strapping of module pins ...........................................................................11 Boot decision per voltage supply condition ................................................................12 Module power rails.................................................................................................13 Graphics engine encoders and decoders supported.....................................................14 J6 connector pin descriptions ..................................................................................18 J7 connector pin descriptions ..................................................................................20 I2C mapping.........................................................................................................22 Available UARTS....................................................................................................23 I2S available configuration formats ..........................................................................23 Linux* GPIO number to module signal ......................................................................25 PWM programming examples ..................................................................................26 USB port types......................................................................................................26 September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 6  Figures 1 2 Wireless antenna connector location ...........................................................................16 Module physical connectors .......................................................................................17 September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 7 Introduction 1 Introduction This datasheet outlines the technical features of the Intel® Joule™ system-on-module (SoM) that combines high-performance compute and graphics with large memory and wireless connectivity in a tiny footprint. 1.1 Acronyms Table 1 Acronyms and terminology Acronyms Description DVS Dynamic Voltage Scaling eMMC* embedded Multimedia Card, a lower cost type of boot ROM GPIO General Purpose Input/Output HDMI* High-Definition Multimedia Interface I2C IIC - Inter-Integrated Circuit I2S Inter-IC Sound IA Intel Architecture ISH Integrated Sensor Hub LPDDR Low Power Double Data Rate LPSS Low Power Subsystem OSC Oscillator PCB Printed Circuit Board PMIC Power Management Integrated Circuit RTC Real Time Clock SCU System Controller Unit SDIO Secure Digital Input/Output SOC System on Chip; combines compute, graphics and interface in a single device SOM System on Module; contains the SOC and additional components in a single package SPI Serial Peripheral Interface (Bus) TAP Test Access Port TBD To Be Defined - information not available in this release UART / HSUART UART - as used in this document, UART ports are to be assumed as only supporting Rxd, TxD signals HSUART - is a full function UART with Clear to Send and Return to Send handshakes for High Speed transfers ULPI UTMI+ Low Pin Interface XTAL Crystal September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 8  System on a Module Overview 1.2 Reference documents Intel Documents Intel Document Number or Internet Address Intel® Joule™ Platform Mechanical Descriptor 568978 Intel® Joule™ Expansion Board Datasheet 569056 - pending release at time of this publication Intel® Joule™ Expansion Board Design Guide 566861 - pending release at time of this publication Intel® Joule™ Thermal Management Guide 568457 - pending release at time of this publication Intel® Joule™ Product Website https://software.intel.com/en-us/iot/hardware/joule Intel® Joule™ Online User Guide https://software.intel.com/en-us/intel-joule-getting-started Intel® Joule™ Online Community https://communities.intel.com/community/tech/intel-joule Intel® Joule™ FCC and FAA Regulatory Information http://www.intel.com/content/www/us/en/support/boards-and-kits/000022313.html Industry Specifications Internet Address JEDEC Standard LPDDR4 Specification http://www.jedec.org Universal Serial Bus Specification (USB) http://www.usb.org/developers/doc USB* On-The-Go (OTG) and Embedded Host http://www.usb.org/developers/onthego HDMI* Specification v1.4b http://www.hdmi.org/manufacturer/specification.aspx Note: Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and confirm whether referenced data are accurate. 2 System on a Module Overview The Intel® Joule™ system-on-module (SoM) is available in multiple configurations that share the same footprint and interface connector placement. This enables accelerated product designed by providing multiple levels of compute power, graphics, memory and communication options in a single common footprint that can scale with end-product requirements. 2.1 Intel® Joule™ configurations Table 2 Intel® Joule™ configurations Module CPU Clock Graphic Clock Memory and Storage Intel® Joule™ 550x 1.5 GHz 300 MHz 3GB RAM & 8GB eMMC Flash Intel® Joule™ 570x 1.7 GHz; Turbo Boost up to 2.4GHz 450 MHz base, 650 MHz Turbo 4GB RAM & 16GB eMMC Flash September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 9 System on a Module Overview 2.2 Intel® Joule™ feature summary Table 3 Intel® Joule™ features Domain Attribute Value Notes Compute System on a Chip 14nm Intel® Atom™ quad-core 4 cores supporting 2 threads per core Address Bus Size 64-Bit (x86-64) Cache 4MB L1 2MB per core-pair RAM Type and Speed LPDDR4 (4 lanes, 3200 MT/sec) Integrated Package on Package Graphics Execution Units 12EUs (2x6) on 550x and 18EUs (3x6) on 570x Open Graphics Libraries Open GL 3.1ES, Open GL4.3 & Open CL 2.0 Display HDMI Output HDMI 1.4b 1080p at 60fps via expansion board connectors Storage Type Supported eMMC 5.0 Max eMMC speed of 400 MB/second Expansion Connector Module to expansion board Two, 2x50 pin connectors Hirose Electric Co LTD* Part Number DF40C-100DP-0.4V Audio Number of DMIC 2 Routed via expansion board connectors Number and Speed of I2S One I2S at 9.6 MHz USB USB 3.0 compliant 1 Type C OTG and 1 Host USB 3, Port 0 is dedicated to Type C USB 3, Port 1 is multiplexed with PCIe PCIe* Number of Ports / lanes 1 port / 1 lane Multiplexed with USB3, Port1 Max Speed 5 Gb/s I2C 5 ports (3 LPSS, 2 ISH as LPSS) Master Mode; max 3.4Mb/s UARTS 3 full and 1 half Maximum rate of 115.2 kb/s for half speed and 3.6864 Mb/s maximum for full speed mode(s) SIO SPI 2 ports, 5 chip selects Up to 25MHz SDIO Number of ports 1 For SD Card interface GPIO Dedicated GPIO lines 8 Up to 48 when remapping interface pins Additional GPIO lines Up to 48 Interfaces pins can be remapped within BIOS (tool release pending) Wi-Fi and Bluetooth® PWM 4 Integrated wireless module Intel® Dual Band Wireless-AC 8260 Bands Dual Band MIMO 2x2 Standards IEEE 802.11agn + ac, BT 4.2 core 2.4 and 5GHz Security WPA, WPA2, WPS2, 802.11w, WMM, WMM-PS, WFD, Miracast, Passpoint Dual mode, BT 4.1 Core Over 15 profiles supported Antenna Dual MHF4 connectors on module Connection A1 is Wi-Fi only while connection A2 services both BT and Wi-Fi WPA2, AES-CCMP encryption Power Manager Integrated PMIC Whiskey Cove Not user programmable 2.3 Expansion board requirements The Intel® Joule™ Expansion Board Design Guide (See Section 1.2) provides design recommendations for designing customer expansion boards. At a minimum, the following elements are required to enable successful module boot and operation. 2.3.1 Method for connecting module to expansion board The module must be securely mounted to an expansion board in a method that maintains full engagement of the board-toboard interface connectors. See the Intel® Joule™ Platform Mechanical Descriptor for more information. 2.3.2 Method to provide +VSYS power to the module The subject is covered in Section 3 September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 10  System on a Module Overview 2.3.3 Required strapping of module pins These module pin strappings must be implemented for boot during rising edge of PMIC_PWRGOOD (J6, pin 33). Table 4 Required strapping of module pins Signal Name Location Default Requirement GPIO_UART_TXD J6, pin 93 Internal 20k pull down Must be Hi-z or pulled down to GND when PMIC_PWRGOOD asserts ISH_UART0_RTS J7, pin 11 Internal 20k pull up Must be Hi-z or pulled up to VDD1 when PMIC_PWRGOOD asserts ISH_UART0_TXD J7, pin 15 Internal 20k pull down Must be Hi-z or pulled down to GND when PMIC_PWRGOOD asserts SSP0_SPI_FS1 J7, pin 79 Internal 20k pull up Must be Hi-z or pulled up to VDD1 when PMIC_PWRGOOD asserts 2.3.4 BIOS installed onto module The module requires a Basic Input Output System (BIOS) code to installed in the device firmware in order to complete the boot and initialization process. The reference configuration loaded during module production can be overwritten with either an updated, approved reference BIOS or a custom BIOS developed by other users, customers or partners. Caution: Turning off the device during a BIOS update can cause data corruption and loss of functionality. Warning: End-use equipment integrating the device has to be authorized as required by the U.S. Federal Communications Commission ("FCC") or it has to be operated in accordance with the FCC's rules on operation of unauthorized devices (47 C.F.R. § 2.805), including obtaining approval from any licensed spectrum operator, if the end-use equipment will use such operator's spectrum Hyperlink: Regulatory Information for the Intel® Joule™ Compute Module 2.4 Expansion board recommendations 2.4.1 External EEPROM for multipurpose pin configuration data An external EEPROM (recommend ST Microelectronics M24M02-DR* or equivalent) connected to I2C port 0 will hold a specific configuration of the multipurpose pins. During boot, if the BIOS does not find an EEPROM device attached to I2C port 0, then the module will load the default configuration that is stored in BIOS. 2.4.2 Power button Connect an active low power button to J6 pin 9 to trigger a reset or to power cycle the board. 2.4.3 DnX button Connect an active high (VDD1) signal to J6, pin 78 to initiate a Download and Execute routine that will update the BIOS via USB 2.0, port 0. This DnX button signal is the only way to initiate the Download and Execute update process. 2.4.4 Real time clock (RTC) backup power source See section Section 9.1 2.4.5 UART debugging Include a method to access UART port 2 on the module during boot to collect debug information as this is the only way to access debug messages generated during the power on and boot sequences. September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 11 Power Delivery, Signaling, and Reset 3 Power Delivery, Signaling, and Reset 3.1 Main power supply (VSYS) The Intel® Joule™ module requires VSYS source routed through 12 pins, 6 on each board-to-board connector, that must all be connected in common to balance the current path. This is the only power input path; voltage detection at +VDC_IN or USB VBUS will trigger module boot. Caution: It is NOT possible to supply VSYS directly from any USB power supply, as the USB operating specification of 4.75V to 5.25V may exceed the safe operational range of the module. Table 5 Boot decision per voltage supply condition +VDC_IN +VBUS VSYS Action No Boot 0 VDC 0 VDC >VSYS (min) 0 VDC >+VBUS (min) >VSYS (min) Cold Boot >+VDC_IN (min) 0 VDC >VSYS (min) Cold Boot >+VDC_IN (min) >+VBUS (min) >VSYS (min) Cold Boot 3.2 Power on signaling 3.2.1 +VDC_IN power sensing +VDC_IN is the signal that indicates when the module is being powered from an external power source. When no RTC battery is present, the system will boot when both +VDC_IN and VSYS are at a valid level. If an RTC battery is present, the operating system can configure the wake source register of the PMIC to either boot when +VDC_IN is present, or to wait for a signal on the power button line. 3.2.2 +VBUS power sensing The +VBUS pin is used by the module to detect if power is present on the USB connector of the attached expansion board. If the +VBUS pin is within the voltage range specified in Table 5, then the module will initiate a boot. 3.2.3 Power good The module will assert the PMIC_PWRGOOD signal HIGH after the VDD1 and VDD3 rails are within specification. 3.3 Hard shutdown via power button The Intel® Joule™ module has a single Power Button pin (PMIC_PWRBTN_N) that will trigger a shutdown of the module when held LOW for longer than 10 seconds. September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 12  Graphics Specifications 3.4 System voltage rail specifications The outputs shown below are only intended to signal or enable other subsystems and not to drive loads. Table 6 Module power rails Rail Name Voltage Current Min Typ Max Units +VSYS 3.6 4 5 +VDD3 3.1 3.3 +VBUS 4 +V5P0V_VCONN Usage Max Units V 4 A Input Powers the core logic and radios. Recommend using 5V if using the CSI cameras. 3.45 V 300 mA Output General use. Powers on prior to VDD1 5 20 V 20 uA Input Voltage sense for VBUS power 4.75 5 5.25 V 300 mA Input Voltage for USB-C VCONN to CC1 or CC2 +VDD1 1.71 1.8 1.89 V 300 mA Output General use. Power on after +VDD3 +VDC_IN 4 12 20 V 20 20 uA Input Voltage sense for +VDC_IN power +VRTC 2.05 3.3 V 20 500 uA Input RTC backup voltage - supplies voltage to RTC logic when the system is not-powered. +VBATTERY 0 5 V 1 slot. Design supports flipping polarity on the frame signal. 0-left , 1-right 50/50 0%. 0% Left justified master 2 192K,96K, 16,24 48K 2 0 0-left, 1right 50/50 0% I2S slave 3 192K,96K, 16,24 48K,44.1K 2 0 0-left, 1right 50/50 0% Left justified slave 3 192K,96K, 16,24 48K 2 0 0-left, 1right 50/50 0% Right justified Rising edge frame sensitive. Design supports more frame- to-data offset options. Not supported. September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 23 GPIO Specifications 11.2 Digital microphone ports Intel® Joule™ supports microphones that use the PDM digital microphone standard and attached to the module through the AVS_M interface. Two microphones can share one data line by using time domain multiplexing to the two slots. PDM microphones are enabled and disabled by the clock signal. Absence of clock signal will switch microphone to sleep mode, which can be utilized in system power management. Additionally the microphones can be power-gated to cut the power consumption to zero when microphones are not used. Refer to the Intel® Joule™ Expansion Board Design Guide for the specifications and PCB routing guidance for this interface. 12 GPIO Specifications 12.1 Dedicated GPIO lines The Intel® Joule™ module provides 8 dedicated GPIO lines (GPIO_0 - 6, GPIO_17 and GPIO_22) connected to the core processor. 12.2 Reconfigurable interfaces buses as GPIO Many interface lines on the module can be reconfigured as GPIO lines by defining a configuration table stored within an EEPROM device on the expansion board. The BIOS loads a default configuration (see BIOS release notes for more details) if the EEPROM appears empty or is found unreadable by the BIOS. The configuration EEPROM is only read at cold boot and the configuration is retained during reset. Specific outputs can be can be set or cleared before entering a sleep state. 12.3 GPIO internal pull UP / pull DOWN resistors Each GPIO line can employ an internal pull UP or pull DOWN resistor, this is also defined within the configuration table and stored in the expansion board EEPROM device and read by the BIOS at cold boot. See the Intel® Joule™ BIOS Guide for pull UP and pull DOWN configuration details and the Intel® Joule™ Expansion Board Design Guide for the specifications and PCB routing guidance of the GPIO interfaces. September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 24  GPIO Specifications 12.4 Linux* GPIO to function mapping Default configuration for Linux* GPIO number to signal on the Intel® Joule™ module. Table 13 Linux* GPIO number to module signal Linux* GPIO Module Signal Name Linux* GPIO 270 DISPLAY_0_BIAS_EN 413 SPI_0_FS2 271 DISPLAY_0_BKLTEN 414 SPI_0_MOSI 272 BLDRW_0_PWM 415 SPI_0_MISO 315 I2C_0_SDA 416 SPI_1_CLK 316 I2C_0_SCL 417 SPI_1_FS0 317 I2C_1_SDA 419 SPI_1_FS2 318 IC2_1_SCL 421 SPI_1_MISO 319 I2C_2_SDA 422 SPI_1_MOSI 320 I2C_2_SCL 446 BTN_N 331 ISH_I2C_0_SDA 456 DISPLAY_0_RST_N 332 ISH_I2C_0_SCL 462 UART_0_TXD 333 ISH_1_SDA 463 PWM0 334 ISH_1_SCL 464 PMW1 365 PMIC_PWRGOOD 465 PMW2 366 PMIC_RESET_N 466 PMW3 367 PMIC_SLPCLK_1 467 UART_0_RXD 378 I2S_1_MCLK 469 UART_0_RTS 379 I2S_1_BCLK 470 UART_0_CTS 380 I2S_1_WS_SYNC 471 UART_1_RXD 381 I2S_1_RXD 472 UART_1_TXD 382 I2S_1_TXD 483 ISH_UART_1_RXD 383 AVS_M_CLK_A1 484 ISH_UART_1_TXD 384 AVS_M_CLK_B1 485 ISH_UART_1_RTS 385 AVS_M_DATA_1 486 ISH_UART_1_CTS 410 SPI_0_CLK 491 FLASH_RST_N 411 SPI_0_FS0 492 FLASH_TORCH 412 SPI_0_FS1 493 FLASH_TRIGGER September 2016 Document number: 566641 rev. 1.1 Module Signal Name Intel® Joule™ Datasheet Page 25 Pulse Width Modulators 13 Pulse Width Modulators The default BIOS configuration table defines four dedicated PWM outputs as PWM_0, PWM_1, PWM_2, and PWM_3, each with programmable frequency and duty cycle. Table 14 shows examples of hardware (register) based PWM programming: The PWM variables that control frequency and duty cycle are controlled by the BASE_UNIT_INT, BASE_UNIT_FRAC, and ON_TIME_DIVISOR register settings and the following equations: 13.1 PWM frequency formula: 13.2 PWM duty cycle formula: Note: Consult specific operating system documents if manipulating PWM settings at the OS level. Table 14 PWM programming examples Integer part of BASE_UNIT_INT (bits 29:22) Fractional part of BASE_UNIT_FRAC (bits 21:8) Decimal base unit value ON_TIME_DIVISOR (bits 7:0) Base unit type PWM frequency (Hz) PWM period (uSec) Duty Cycle 0000_0000b 00_0100_0000_0000b 0.0625 0000_1000b fractional 4,688 213 50% 0000_0000b 00_0010_0000_0000b 0.03125 0000_0100b fractional 2,344 427 50% 0000_0000b 00_0001_0000_0000b 0.015625 0000_0001b fractional 1,172 853 50% 14 Universal Serial Bus 14.1 Available USB ports The Intel® Joule™ module provides two USB 3.0 ports; one Type C (OTG) and one USB 3.0 host mode and a USB 2 host port. Table 15 USB port types Signal name Port Description USB2_0_DP 0 USB 2 data positive USB2_0_DN USB3_1_RX_DP USB 2 data negative 1 USB 3 receive data positive USB3_1_RX_DN USB 3 receive data negative USB3_1_TX_DP USB 3 transmit data positive USB3_1_TX_DN USB 3 transmit data negative Refer to the Intel® Joule™ Expansion Board Design Guide for the specifications and PCB routing guidance for this interface. September 2016 Document number: 566641 rev. 1.1 Intel® Joule™ Datasheet Page 26