Stratix Device Handbook, Volume 1
101 Innovation Drive
San Jose, CA 95134
(408) 544-7000
http://www.altera.com
S5V1-3.4
Copyright © 2006 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Altera products are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights. Altera warrants
performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make
changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera
Corporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services.
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Altera Corporation
Contents
Chapter Revision Dates .......................................................................... vii
About This Handbook .............................................................................. ix
How to Find Information ........................................................................................................................ ix
How to Contact Altera ............................................................................................................................. ix
Typographic Conventions ........................................................................................................................ x
Section I. Stratix Device Family Data Sheet
Revision History ............................................................................................................................ Part I–1
Chapter 1. Introduction
Introduction ............................................................................................................................................ 1–1
Features ................................................................................................................................................... 1–2
Chapter 2. Stratix Architecture
Functional Description .......................................................................................................................... 2–1
Logic Array Blocks ................................................................................................................................ 2–3
LAB Interconnects ............................................................................................................................ 2–4
LAB Control Signals ......................................................................................................................... 2–5
Logic Elements ....................................................................................................................................... 2–6
LUT Chain & Register Chain .......................................................................................................... 2–8
addnsub Signal ................................................................................................................................. 2–8
LE Operating Modes ........................................................................................................................ 2–8
Clear & Preset Logic Control ........................................................................................................ 2–13
MultiTrack Interconnect ..................................................................................................................... 2–14
TriMatrix Memory ............................................................................................................................... 2–21
Memory Modes ............................................................................................................................... 2–22
Clear Signals .................................................................................................................................... 2–24
Parity Bit Support ........................................................................................................................... 2–24
Shift Register Support .................................................................................................................... 2–25
Memory Block Size ......................................................................................................................... 2–26
Independent Clock Mode .............................................................................................................. 2–44
Input/Output Clock Mode ........................................................................................................... 2–46
Read/Write Clock Mode ............................................................................................................... 2–49
Single-Port Mode ............................................................................................................................ 2–51
Multiplier Block .............................................................................................................................. 2–57
Adder/Output Blocks ................................................................................................................... 2–61
Modes of Operation ....................................................................................................................... 2–64
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Contents
Stratix Device Handbook, Volume 1
DSP Block Interface ........................................................................................................................ 2–70
PLLs & Clock Networks ..................................................................................................................... 2–73
Global & Hierarchical Clocking ................................................................................................... 2–73
Enhanced & Fast PLLs ................................................................................................................... 2–81
Enhanced PLLs ............................................................................................................................... 2–87
Fast PLLs ........................................................................................................................................ 2–100
I/O Structure ...................................................................................................................................... 2–104
Double-Data Rate I/O Pins ......................................................................................................... 2–111
External RAM Interfacing ........................................................................................................... 2–115
Programmable Drive Strength ................................................................................................... 2–119
Open-Drain Output ...................................................................................................................... 2–120
Slew-Rate Control ........................................................................................................................ 2–120
Bus Hold ........................................................................................................................................ 2–121
Programmable Pull-Up Resistor ................................................................................................ 2–122
Advanced I/O Standard Support .............................................................................................. 2–122
Differential On-Chip Termination ............................................................................................. 2–127
MultiVolt I/O Interface ............................................................................................................... 2–129
High-Speed Differential I/O Support ............................................................................................ 2–130
Dedicated Circuitry ...................................................................................................................... 2–137
Byte Alignment ............................................................................................................................. 2–140
Power Sequencing & Hot Socketing ............................................................................................... 2–140
Chapter 3. Configuration & Testing
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support ............................................................................ 3–1
SignalTap II Embedded Logic Analyzer ............................................................................................ 3–5
Configuration ......................................................................................................................................... 3–5
Operating Modes .............................................................................................................................. 3–5
Configuring Stratix FPGAs with JRunner .................................................................................... 3–7
Configuration Schemes ................................................................................................................... 3–7
Partial Reconfiguration .................................................................................................................... 3–7
Remote Update Configuration Modes .......................................................................................... 3–8
Stratix Automated Single Event Upset (SEU) Detection ................................................................ 3–12
Custom-Built Circuitry .................................................................................................................. 3–13
Software Interface ........................................................................................................................... 3–13
Temperature Sensing Diode ............................................................................................................... 3–13
Chapter 4. DC & Switching Characteristics
Operating Conditions ........................................................................................................................... 4–1
Power Consumption ........................................................................................................................... 4–17
Timing Model ....................................................................................................................................... 4–19
Preliminary & Final Timing .......................................................................................................... 4–19
Performance .................................................................................................................................... 4–20
Internal Timing Parameters .......................................................................................................... 4–22
External Timing Parameters ......................................................................................................... 4–33
Stratix External I/O Timing .......................................................................................................... 4–36
I/O Timing Measurement Methodology .................................................................................... 4–60
External I/O Delay Parameters .................................................................................................... 4–66
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Contents
Contents
Maximum Input & Output Clock Rates ...................................................................................... 4–76
High-Speed I/O Specification ........................................................................................................... 4–87
PLL Specifications ................................................................................................................................ 4–94
DLL Specifications ............................................................................................................................. 4–102
Chapter 5. Reference & Ordering Information
Software .................................................................................................................................................. 5–1
Device Pin-Outs ..................................................................................................................................... 5–1
Ordering Information ........................................................................................................................... 5–1
Index
Altera Corporation
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Contents
vi
Stratix Device Handbook, Volume 1
Altera Corporation
Chapter Revision Dates
The chapters in this book, Stratix Device Handbook, Volume 1, were revised on the following dates.
Where chapters or groups of chapters are available separately, part numbers are listed.
Chapter 1. Introduction
Revised:
Part number:
July 2005
S51001-3.2
Chapter 2. Stratix Architecture
Revised:
July 2005
Part number: S51002-3.2
Chapter 3. Configuration & Testing
Revised:
July 2005
Part number: S51003-1.3
Chapter 4. DC & Switching Characteristics
Revised:
January 2006
Part number: S51004-3.4
Chapter 5. Reference & Ordering Information
Revised:
September 2004
Part number: S51005-2.1
Altera Corporation
vii
Chapter Revision Dates
viii
Stratix Device Handbook, Volume 1
Altera Corporation
About This Handbook
This handbook provides comprehensive information about the Altera®
Stratix family of devices.
How to Find
Information
How to Contact
Altera
Information Type
Technical support
Product literature
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provide a link to the pages.
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For the most up-to-date information about Altera products, go to the
Altera world-wide web site at www.altera.com. For technical support on
this product, go to www.altera.com/mysupport. For additional
information about Altera products, consult the sources shown below.
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All Other Locations
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ix
Typographic Conventions
Typographic
Conventions
Visual Cue
Stratix Device Handbook, Volume 1
This document uses the typographic conventions shown below.
Meaning
Bold Type with Initial
Capital Letters
Command names, dialog box titles, checkbox options, and dialog box options are
shown in bold, initial capital letters. Example: Save As dialog box.
bold type
External timing parameters, directory names, project names, disk drive names,
filenames, filename extensions, and software utility names are shown in bold
type. Examples: fMAX, \qdesigns directory, d: drive, chiptrip.gdf file.
Italic Type with Initial Capital
Letters
Document titles are shown in italic type with initial capital letters. Example: AN 75:
High-Speed Board Designs.
Italic type
Internal timing parameters and variables are shown in italic type.
Examples: tPIA, n + 1.
Variable names are enclosed in angle brackets (< >) and shown in italic type.
Example: , .pof file.
Initial Capital Letters
Keyboard keys and menu names are shown with initial capital letters. Examples:
Delete key, the Options menu.
“Subheading Title”
References to sections within a document and titles of on-line help topics are
shown in quotation marks. Example: “Typographic Conventions.”
Courier type
Signal and port names are shown in lowercase Courier type. Examples: data1,
tdi, input. Active-low signals are denoted by suffix n, e.g., resetn.
Anything that must be typed exactly as it appears is shown in Courier type. For
example: c:\qdesigns\tutorial\chiptrip.gdf. Also, sections of an
actual file, such as a Report File, references to parts of files (e.g., the AHDL
keyword SUBDESIGN), as well as logic function names (e.g., TRI) are shown in
Courier.
1., 2., 3., and
a., b., c., etc.
Numbered steps are used in a list of items when the sequence of the items is
important, such as the steps listed in a procedure.
■
Bullets are used in a list of items when the sequence of the items is not important.
●
•
v
The checkmark indicates a procedure that consists of one step only.
1
The hand points to information that requires special attention.
r
The angled arrow indicates you should press the Enter key.
f
The feet direct you to more information on a particular topic.
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Altera Corporation
Section I. Stratix Device
Family Data Sheet
This section provides the data sheet specifications for Stratix® devices.
They contain feature definitions of the internal architecture,
configuration and JTAG boundary-scan testing information, DC
operating conditions, AC timing parameters, a reference to power
consumption, and ordering information for Stratix devices.
This section contains the following chapters:
Revision History
Chapter
1
■
Chapter 1, Introduction
■
Chapter 2, Stratix Architecture
■
Chapter 3, Configuration & Testing
■
Chapter 4, DC & Switching Characteristics
■
Chapter 5, Reference & Ordering Information
The table below shows the revision history for Chapters 1 through 5.
Date/Version
Changes Made
July 2005, v3.2
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Minor content changes.
September 2004, v3.1
●
Updated Table 1–6 on page 1–5.
April 2004, v3.0
●
Main section page numbers changed on first page.
Changed PCI-X to PCI-X 1.0 in “Features” on page 1–2.
Global change from SignalTap to SignalTap II.
The DSP blocks in “Features” on page 1–2 provide dedicated
implementation of multipliers that are now “faster than 300 MHz.”
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January 2004, v2.2
●
Updated -5 speed grade device information in Table 1-6.
October 2003, v2.1
●
Add -8 speed grade device information.
July 2003, v2.0
●
Format changes throughout chapter.
Altera Corporation
Section I–1
Stratix Device Family Data Sheet
Chapter
Date/Version
2
July 2005 v3.2
Stratix Device Handbook, Volume 1
Changes Made
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November 2003, v2.2
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October 2003, v2.1
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Section I–2
Added “Clear Signals” section.
Updated “Power Sequencing & Hot Socketing” section.
Format changes.
Updated fast regional clock networks description on page 2–73.
Deleted the word preliminary from the “specification for the maximum
time to relock is 100 µs” on page 2–90.
Added information about differential SSTL and HSTL outputs in
“External Clock Outputs” on page 2–92.
Updated notes in Figure 2–55 on page 2–93.
Added information about m counter to “Clock Multiplication &
Division” on page 2–101.
Updated Note 1 in Table 2–58 on page 2–101.
Updated description of “Clock Multiplication & Division” on
page 2–88.
Updated Table 2–22 on page 2–102.
Added references to AN 349 and AN 329 to “External RAM
Interfacing” on page 2–115.
Table 2–25 on page 2–116: updated the table, updated Notes 3 and
4. Notes 4, 5, and 6, are now Notes 5, 6, and 7, respectively.
Updated Table 2–26 on page 2–117.
Added information about PCI Compliance to page 2–120.
Table 2–32 on page 2–126: updated the table and deleted Note 1.
Updated reference to device pin-outs now being available on the web
on page 2–130.
Added Notes 4 and 5 to Table 2–36 on page 2–130.
Updated Note 3 in Table 2–37 on page 2–131.
Updated Note 5 in Table 2–41 on page 2–135.
Added note 3 to rows 11 and 12 in Table 2–18.
Deleted “Stratix and Stratix GX Device PLL Availability” table.
Added I/O standards row in Table 2–28 that support max and min
strength.
Row clk [1,3,8,10] was removed from Table 2–30.
Added checkmarks in Enhanced column for LVPECL, 3.3-V PCML,
LVDS, and HyperTransport technology rows in Table 2–32.
Removed the Left and Right I/O Banks row in Table 2–34.
Changed RCLK values in Figures 2–50 and 2–51.
External RAM Interfacing section replaced.
Added 672-pin BGA package information in Table 2–37.
Removed support for series and parallel on-chip termination.
Termination Technology renamed differential on-chip termination.
Updated the number of channels per PLL in Tables 2-38 through 242.
Updated Figures 2–65 and 2–67.
Updated DDR I information.
Updated Table 2–22.
Added Tables 2–25, 2–29, 2–30, and 2–72.
Updated Figures 2–59, 2–65, and 2–67.
Updated the Lock Detect section.
Altera Corporation
Stratix Device Family Data Sheet
Chapter
Date/Version
2
July 2003, v2.0
Changes Made
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July 2005, v1.3
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Updated “Operating Modes” section.
Updated “Temperature Sensing Diode” section.
Updated “IEEE Std. 1149.1 (JTAG) Boundary-Scan Support” section.
Updated “Configuration” section.
January 2005, v1.2
●
Updated limits for JTAG chain of devices.
September 2004, v1.1
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4
Added reference on page 2-73 to Figures 2-50 and 2-51 for RCLK
connections.
Updated ranges for EPLL post-scale and pre-scale dividers on page
2-85.
Updated PLL Reconfiguration frequency from 25 to 22 MHz on page
2-87.
New requirement to assert are set signal each PLL when it has to reacquire lock on either a new clock after loss of lock (page 2-96).
Updated max input frequency for CLK[1,3,8,10] from 462 to 500,
Table 2-24.
Renamed impedance matching to series termination throughout.
Updated naming convention for DQS pins on page 2-112 to match pin
tables.
Added DDR SDRAM Performance Specification on page 2-117.
Added external reference resistor values for terminator technology
(page 2-136).
Added Terminator Technology Specification on pages 2-137 and 2138.
Updated Tables 2-45 to 2-49 to reflect PLL cross-bank support for
high speed differential channels at full speed.
Wire bond package performance specification for “high” speed
channels was increased to 624 Mbps from 462 Mbps throughout
chapter.
●
Added new section, “Stratix Automated Single Event Upset (SEU)
Detection” on page 3–12.
Updated description of “Custom-Built Circuitry” on page 3–13.
April 2003, v1.0
●
No new changes in Stratix Device Handbook v2.0.
January 2006, v3.4
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Added Table 4–135.
July 2005, v3.3
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Updated Tables 4–6 and 4–30.
Updated Tables 4–103 through 4–108.
Updated Tables 4–114 through 4–124.
Updated Table 4–129.
Added Table 4–130.
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Altera Corporation
Section I–3
Stratix Device Family Data Sheet
Stratix Device Handbook, Volume 1
Chapter
Date/Version
Changes Made
4
January 2005, 3.2
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Updated rise and fall input values.
September 2004, v3.1
●
Updated Note 3 in Table 4–8 on page 4–4.
Updated Table 4–10 on page 4–6.
Updated Table 4–20 on page 4–12 through Table 4–23 on
page 4–13. Added rows VIL(AC) and VIH(AC) to each table.
Updated Table 4–26 on page 4–14 through Table 4–29 on
page 4–15.
Updated Table 4–31 on page 4–16.
Updated description of “External Timing Parameters” on page 4–33.
Updated Table 4–36 on page 4–20.
Added signals tOUTCO, TXZ, and TZX to Figure 4–4 on page 4–33.
Added rows tM512CLKENSU and tM512CLKENH to Table 4–40 on
page 4–24.
Added rows tM4CLKENSU and tM4CLKENH to Table 4–41 on page 4–24.
Updated Note 2 in Table 4–54 on page 4–35.
Added rows tMRAMCLKENSU and tMRAMCLKENH to Table 4–42 on
page 4–25.
Updated Table 4–46 on page 4–29.
Updated Table 4–47 on page 4–29.
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Section I–4
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Stratix Device Family Data Sheet
Chapter
Date/Version
4
Changes Made
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Table 4–48 on page 4–30: added rows tM512CLKSENSU and tM512CLKENH,
and updated symbol names.
Updated power-up current (ICCINT) required to power a Stratix
device on page 4–17.
Updated Table 4–37 on page 4–22 through Table 4–43 on
page 4–27.
Table 4–49 on page 4–31: added rows tM4KCLKENSU, tM4KCLKENH,
tM4KBESU, and tM4KBEH, deleted rows tM4KRADDRASU and tM4KRADDRH, and
updated symbol names.
Table 4–50 on page 4–31: added rows tMRAMCLKENSU, tMRAMCLKENH,
tMRAMBESU, and tMRAMBEH, deleted rows tMRAMADDRASU and
tMRAMRADDRH, and updated symbol names.
Table 4–52 on page 4–34: updated table, deleted “Conditions”
column, and added rows tXZ and tZX.
Table 4–52 on page 4–34: updated table, deleted “Conditions”
column, and added rows tXZ and tZX.
Table 4–53 on page 4–34: updated table and added rows tXZPLL and
tZXPLL.
Updated Note 2 in Table 4–53 on page 4–34.
Table 4–54 on page 4–35: updated table, deleted “Conditions”
column, and added rows tXZPLL and tZXPLL.
Updated Note 2 in Table 4–54 on page 4–35.
Deleted Note 2 from Table 4–55 on page 4–36 through Table 4–66 on
page 4–41.
Updated Table 4–55 on page 4–36 through Table 4–96 on
page 4–56. Added rows TXZ, TZX, TXZPLL, and TZXPLL.
Added Note 4 to Table 4–101 on page 4–62.
Deleted Note 1 from Table 4–67 on page 4–42 through Table 4–84 on
page 4–50.
Added new section “I/O Timing Measurement Methodology” on
page 4–60.
Deleted Note 1 from Table 4–67 on page 4–42 through Table 4–84 on
page 4–50.
Deleted Note 2 from Table 4–85 on page 4–51 through Table 4–96 on
page 4–56.
Added Note 4 to Table 4–101 on page 4–62.
Table 4–102 on page 4–64: updated table and added Note 4.
Updated description of “External I/O Delay Parameters” on
page 4–66.
Added Note 1 to Table 4–109 on page 4–73 and Table 4–110 on
page 4–74.
Updated Table 4–103 on page 4–66 through Table 4–110 on
page 4–74.
Deleted Note 2 from Table 4–103 on page 4–66 through Table 4–106
on page 4–69.
Added new paragraph about output adder delays on page 4–68.
Updated Table 4–110 on page 4–74.
Added Note 1 to Table 4–111 through Table 4–113 on page 4–75.
Section I–5
Stratix Device Family Data Sheet
Chapter
Stratix Device Handbook, Volume 1
Date/Version
4
Changes Made
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April 2004, v3.0
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Table 4–129 on page 4–96: updated table and added Note 10.
Updated Table 4–131 and Table 4–132 on page 4–100.
Updated Table 4–110 on page 4–74.
Updated Table 4–123 on page 4–85.
Updated Table 4–124 on page 4–87. through Table 4–126 on
page 4–92.
Added Note 10 to Table 4–129 on page 4–96.
Moved Table 4–127 on page 4–94 to correct order in the chapter.
Updated Table 4–131 on page 4–100 through Table 4–132 on
page 4–100.
Deleted tXZ and tZX from Figure 4–4.
Waveform was added to Figure 4–6.
The minimum and maximum duty cycle values in Note 3 of Table 4–8
were moved to a new Table 4–9.
Changes were made to values in SSTL-3 Class I and II rows in
Table 4–17.
Note 1 was added to Table 4–34.
Added tSU_R and tSU_C rows in Table 4–38.
Changed Table 4–55 title from “EP1S10 Column Pin Fast Regional
Clock External I/O Timing Parameters” to “EP1S10 External I/O
Timing on Column Pins Using Fast Regional Clock Networks.”
Changed values in Tables 4–46, 4–48 to 4–51, 4–128, and 4–131.
Added tARESET row in Tables 4–127 to 4–132.
Deleted -5 Speed Grade column in Tables 4–117 to 4–119 and 4–122
to 4–123.
Fixed differential waveform in Figure 4–1.
Added “Definition of I/O Skew” section.
Added tSU and tCO_C rows and made changes to values in tPRE and
tCLKHL rows in Table 4–46.
Values changed in the tSU and tH rows in Table 4–47.
Values changed in the tM4KCLKHL row in Table 4–49.
Values changed in the tMRAMCLKHL row in Table 4–50.
Added Table 4–51 to “Internal Timing Parameters” section.
The timing information is preliminary in Tables 4–55 through 4–96.
Table 4–111 was separated into 3 tables: Tables 4–111 to 4–113.
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Updated Tables 4–127 through 4–129.
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November 2003, v2.2
Section I–6
Updated Table 4–123 on page 4–85 through Table 4–126 on
page 4–92.
Updated Note 3 in Table 4–123 on page 4–85.
Table 4–125 on page 4–88: moved to correct order in chapter, and
updated table.
Updated Table 4–126 on page 4–92.
Updated Table 4–127 on page 4–94.
Updated Table 4–128 on page 4–95.
Altera Corporation
Stratix Device Family Data Sheet
Chapter
Date/Version
4
October 2003, v2.1
Changes Made
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5
Added -8 speed grade information.
Updated performance information in Table 4–36.
Updated timing information in Tables 4–55 through 4–96.
Updated delay information in Tables 4–103 through 4–108.
Updated programmable delay information in Tables 4–100 and
4–103.
Updated clock rates in Tables 4–114 through 4–123.
Updated speed grade information in the introduction on page 4-1.
Corrected figures 4-1 & 4-2 and Table 4-9 to reflect how VID and VOD
are specified.
Added note 6 to Table 4-32.
Updated Stratix Performance Table 4-35.
Updated EP1S60 and EP1S80 timing parameters in Tables 4-82 to 493. The Stratix timing models are final for all devices.
Updated Stratix IOE programmable delay chains in Tables 4-100 to 4101.
Added single-ended I/O standard output pin delay adders for loading
in Table 4-102.
Added spec for FPLL[10..7]CLK pins in Tables 4-104 and 4-107.
Updated high-speed I/O specification for J=2 in Tables 4-114 and 4115.
Updated EPLL specification and fast PLL specification in Tables 4116 to 4-120.
September 2004, v2.1
●
Updated reference to device pin-outs on page 5–1 to indicate that
device pin-outs are no longer included in this manual and are now
available on the Altera web site.
April 2003, v1.0
●
No new changes in Stratix Device Handbook v2.0.
Altera Corporation
Section I–7
Stratix Device Family Data Sheet
Section I–8
Stratix Device Handbook, Volume 1
Altera Corporation
1. Introduction
S51001-3.2
Introduction
The Stratix® family of FPGAs is based on a 1.5-V, 0.13-µm, all-layer copper
SRAM process, with densities of up to 79,040 logic elements (LEs) and up
to 7.5 Mbits of RAM. Stratix devices offer up to 22 digital signal
processing (DSP) blocks with up to 176 (9-bit × 9-bit) embedded
multipliers, optimized for DSP applications that enable efficient
implementation of high-performance filters and multipliers. Stratix
devices support various I/O standards and also offer a complete clock
management solution with its hierarchical clock structure with up to
420-MHz performance and up to 12 phase-locked loops (PLLs).
The following shows the main sections in the Stratix Device Family Data
Sheet:
Section
Page
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
Logic Array Blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
Logic Elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
MultiTrack Interconnect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–14
TriMatrix Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–21
Digital Signal Processing Block . . . . . . . . . . . . . . . . . . . . . . . . 2–52
PLLs & Clock Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–73
I/O Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–104
High-Speed Differential I/O Support. . . . . . . . . . . . . . . . . . 2–130
Power Sequencing & Hot Socketing . . . . . . . . . . . . . . . . . . . 2–140
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support. . . . . . . . . . 3–1
SignalTap II Embedded Logic Analyzer . . . . . . . . . . . . . . . . . 3–5
Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
Temperature Sensing Diode. . . . . . . . . . . . . . . . . . . . . . . . . . . 3–13
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–17
Timing Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–19
Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Device Pin-Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Altera Corporation
July 2005
1–1
Features
Features
The Stratix family offers the following features:
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
10,570 to 79,040 LEs; see Table 1–1
Up to 7,427,520 RAM bits (928,440 bytes) available without reducing
logic resources
TriMatrixTM memory consisting of three RAM block sizes to
implement true dual-port memory and first-in first-out (FIFO)
buffers
High-speed DSP blocks provide dedicated implementation of
multipliers (faster than 300 MHz), multiply-accumulate functions,
and finite impulse response (FIR) filters
Up to 16 global clocks with 22 clocking resources per device region
Up to 12 PLLs (four enhanced PLLs and eight fast PLLs) per device
provide spread spectrum, programmable bandwidth, clock switchover, real-time PLL reconfiguration, and advanced multiplication
and phase shifting
Support for numerous single-ended and differential I/O standards
High-speed differential I/O support on up to 116 channels with up
to 80 channels optimized for 840 megabits per second (Mbps)
Support for high-speed networking and communications bus
standards including RapidIO, UTOPIA IV, CSIX, HyperTransportTM
technology, 10G Ethernet XSBI, SPI-4 Phase 2 (POS-PHY Level 4),
and SFI-4
Differential on-chip termination support for LVDS
Support for high-speed external memory, including zero bus
turnaround (ZBT) SRAM, quad data rate (QDR and QDRII) SRAM,
double data rate (DDR) SDRAM, DDR fast cycle RAM (FCRAM),
and single data rate (SDR) SDRAM
Support for 66-MHz PCI (64 and 32 bit) in -6 and faster speed-grade
devices, support for 33-MHz PCI (64 and 32 bit) in -8 and faster
speed-grade devices
Support for 133-MHz PCI-X 1.0 in -5 speed-grade devices
Support for 100-MHz PCI-X 1.0 in -6 and faster speed-grade devices
Support for 66-MHz PCI-X 1.0 in -7 speed-grade devices
Support for multiple intellectual property megafunctions from
Altera MegaCore® functions and Altera Megafunction Partners
Program (AMPPSM) megafunctions
Support for remote configuration updates
1–2
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Introduction
Table 1–1. Stratix Device Features — EP1S10, EP1S20, EP1S25, EP1S30
Feature
EP1S10
EP1S20
EP1S25
EP1S30
10,570
18,460
25,660
32,470
M512 RAM blocks (32 × 18 bits)
94
194
224
295
M4K RAM blocks (128 × 36 bits)
60
82
138
171
LEs
M-RAM blocks (4K × 144 bits)
1
2
2
4
920,448
1,669,248
1,944,576
3,317,184
DSP blocks
6
10
10
12
Embedded multipliers (1)
48
80
80
96
Total RAM bits
PLLs
Maximum user I/O pins
6
6
6
10
426
586
706
726
Table 1–2. Stratix Device Features — EP1S40, EP1S60, EP1S80
Feature
LEs
EP1S40
EP1S60
EP1S80
41,250
57,120
79,040
M512 RAM blocks (32 × 18 bits)
384
574
767
M4K RAM blocks (128 × 36 bits)
183
292
364
M-RAM blocks (4K × 144 bits)
Total RAM bits
4
6
9
3,423,744
5,215,104
7,427,520
DSP blocks
14
18
22
Embedded multipliers (1)
112
144
176
PLLs
12
12
12
Maximum user I/O pins
822
1,022
1,238
Note to Tables 1–1 and 1–2:
(1)
This parameter lists the total number of 9 × 9-bit multipliers for each device. For the total number of 18 × 18-bit
multipliers per device, divide the total number of 9 × 9-bit multipliers by 2. For the total number of 36 × 36-bit
multipliers per device, divide the total number of 9 × 9-bit multipliers by 8.
Altera Corporation
July 2005
1–3
Stratix Device Handbook, Volume 1
Features
Stratix devices are available in space-saving FineLine BGA® and ball-grid
array (BGA) packages (see Tables 1–3 through 1–5). All Stratix devices
support vertical migration within the same package (for example, you
can migrate between the EP1S10, EP1S20, and EP1S25 devices in the 672pin BGA package). Vertical migration means that you can migrate to
devices whose dedicated pins, configuration pins, and power pins are the
same for a given package across device densities. For I/O pin migration
across densities, you must cross-reference the available I/O pins using
the device pin-outs for all planned densities of a given package type to
identify which I/O pins are migrational. The Quartus® II software can
automatically cross reference and place all pins except differential pins
for migration when given a device migration list. You must use the pinouts for each device to verify the differential placement migration. A
future version of the Quartus II software will support differential pin
migration.
Table 1–3. Stratix Package Options & I/O Pin Counts
484-Pin
FineLine
BGA
672-Pin
FineLine
BGA
780-Pin
FineLine
BGA
345
335
345
426
EP1S20
426
361
EP1S25
473
Device
EP1S10
672-Pin
BGA
956-Pin
BGA
426
586
473
597
1,020-Pin
FineLine
BGA
1,508-Pin
FineLine
BGA
706
EP1S30
683
597
726
EP1S40
683
615
773
822
EP1S60
683
773
1,022
EP1S80
683
773
1,203
Note to Table 1–3:
(1)
All I/O pin counts include 20 dedicated clock input pins (clk[15..0]p, clk0n, clk2n, clk9n, and clk11n)
that can be used for data inputs.
Table 1–4. Stratix BGA Package Sizes
Dimension
672 Pin
956 Pin
Pitch (mm)
1.27
1.27
(mm2)
1,225
1,600
35 × 35
40 × 40
Area
Length × width (mm × mm)
1–4
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Introduction
Table 1–5. Stratix FineLine BGA Package Sizes
484 Pin
672 Pin
780 Pin
1,020 Pin
1,508 Pin
Pitch (mm)
Dimension
1.00
1.00
1.00
1.00
1.00
(mm2)
529
729
841
1,089
1,600
23 × 23
27 × 27
29 × 29
33 × 33
40 × 40
Area
Length × width
(mm × mm)
Stratix devices are available in up to four speed grades, -5, -6, -7, and -8,
with -5 being the fastest. Table 1–6 shows Stratix device speed-grade
offerings.
Table 1–6. Stratix Device Speed Grades
484-Pin
FineLine
BGA
672-Pin
FineLine
BGA
780-Pin
FineLine
BGA
-6, -7
-5, -6, -7
-6, -7
-5, -6, -7
EP1S20
-6, -7
-5, -6, -7
EP1S25
-6, -7
Device
EP1S10
672-Pin
BGA
956-Pin
BGA
-6, -7
-5, -6, -7
-6, -7, -8
-5, -6, -7
1,020-Pin
FineLine
BGA
1,508-Pin
FineLine
BGA
-5, -6, -7
EP1S30
-5, -6, -7
-5, -6, -7, -8
-5, -6, -7
EP1S40
-5, -6, -7
-5, -6, -7, -8
-5, -6, -7
EP1S60
-6, -7
-5, -6, -7
-6, -7
EP1S80
-6, -7
-5, -6, -7
-5, -6, -7
Altera Corporation
July 2005
-5, -6, -7
1–5
Stratix Device Handbook, Volume 1
Features
1–6
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
2. Stratix Architecture
S51002-3.2
Functional
Description
Stratix® devices contain a two-dimensional row- and column-based
architecture to implement custom logic. A series of column and row
interconnects of varying length and speed provide signal interconnects
between logic array blocks (LABs), memory block structures, and DSP
blocks.
The logic array consists of LABs, with 10 logic elements (LEs) in each
LAB. An LE is a small unit of logic providing efficient implementation of
user logic functions. LABs are grouped into rows and columns across the
device.
M512 RAM blocks are simple dual-port memory blocks with 512 bits plus
parity (576 bits). These blocks provide dedicated simple dual-port or
single-port memory up to 18-bits wide at up to 318 MHz. M512 blocks are
grouped into columns across the device in between certain LABs.
M4K RAM blocks are true dual-port memory blocks with 4K bits plus
parity (4,608 bits). These blocks provide dedicated true dual-port, simple
dual-port, or single-port memory up to 36-bits wide at up to 291 MHz.
These blocks are grouped into columns across the device in between
certain LABs.
M-RAM blocks are true dual-port memory blocks with 512K bits plus
parity (589,824 bits). These blocks provide dedicated true dual-port,
simple dual-port, or single-port memory up to 144-bits wide at up to
269 MHz. Several M-RAM blocks are located individually or in pairs
within the device’s logic array.
Digital signal processing (DSP) blocks can implement up to either eight
full-precision 9 × 9-bit multipliers, four full-precision 18 × 18-bit
multipliers, or one full-precision 36 × 36-bit multiplier with add or
subtract features. These blocks also contain 18-bit input shift registers for
digital signal processing applications, including FIR and infinite impulse
response (IIR) filters. DSP blocks are grouped into two columns in each
device.
Each Stratix device I/O pin is fed by an I/O element (IOE) located at the
end of LAB rows and columns around the periphery of the device. I/O
pins support numerous single-ended and differential I/O standards.
Each IOE contains a bidirectional I/O buffer and six registers for
registering input, output, and output-enable signals. When used with
Altera Corporation
July 2005
2–1
Functional Description
dedicated clocks, these registers provide exceptional performance and
interface support with external memory devices such as DDR SDRAM,
FCRAM, ZBT, and QDR SRAM devices.
High-speed serial interface channels support transfers at up to 840 Mbps
using LVDS, LVPECL, 3.3-V PCML, or HyperTransport technology I/O
standards.
Figure 2–1 shows an overview of the Stratix device.
Figure 2–1. Stratix Block Diagram
M512 RAM Blocks for
Dual-Port Memory, Shift
Registers, & FIFO Buffers
DSP Blocks for
Multiplication and Full
Implementation of FIR Filters
M4K RAM Blocks
for True Dual-Port
Memory & Other Embedded
Memory Functions
IOEs Support DDR, PCI, GTL+, SSTL-3,
SSTL-2, HSTL, LVDS, LVPECL, PCML,
HyperTransport & other I/O Standards
IOEs
IOEs
IOEs
IOEs
LABs
LABs
LABs
LABs
LABs
IOEs
LABs
IOEs
LABs
LABs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
M-RAM Block
LABs
LABs
DSP
Block
2–2
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
The number of M512 RAM, M4K RAM, and DSP blocks varies by device
along with row and column numbers and M-RAM blocks. Table 2–1 lists
the resources available in Stratix devices.
Table 2–1. Stratix Device Resources
Device
M512 RAM
M4K RAM
Columns/Blocks Columns/Blocks
M-RAM
Blocks
DSP Block
Columns/Blocks
LAB
Columns
LAB Rows
EP1S10
4 / 94
2 / 60
1
2/6
40
30
EP1S20
6 / 194
2 / 82
2
2 / 10
52
41
EP1S25
6 / 224
3 / 138
2
2 / 10
62
46
EP1S30
7 / 295
3 / 171
4
2 / 12
67
57
EP1S40
8 / 384
3 / 183
4
2 / 14
77
61
EP1S60
10 / 574
4 / 292
6
2 / 18
90
73
EP1S80
11 / 767
4 / 364
9
2 / 22
101
91
Logic Array
Blocks
Altera Corporation
July 2005
Each LAB consists of 10 LEs, LE carry chains, LAB control signals, local
interconnect, LUT chain, and register chain connection lines. The local
interconnect transfers signals between LEs in the same LAB. LUT chain
connections transfer the output of one LE’s LUT to the adjacent LE for fast
sequential LUT connections within the same LAB. Register chain
connections transfer the output of one LE’s register to the adjacent LE’s
register within an LAB. The Quartus® II Compiler places associated logic
within an LAB or adjacent LABs, allowing the use of local, LUT chain,
and register chain connections for performance and area efficiency.
Figure 2–2 shows the Stratix LAB.
2–3
Stratix Device Handbook, Volume 1
Logic Array Blocks
Figure 2–2. Stratix LAB Structure
Row Interconnects of
Variable Speed & Length
Direct link
interconnect from
adjacent block
Direct link
interconnect from
adjacent block
Direct link
interconnect to
adjacent block
Direct link
interconnect to
adjacent block
Local Interconnect
LAB
Three-Sided Architecture—Local
Interconnect is Driven from Either Side by
Columns & LABs, & from Above by Rows
Column Interconnects of
Variable Speed & Length
LAB Interconnects
The LAB local interconnect can drive LEs within the same LAB. The LAB
local interconnect is driven by column and row interconnects and LE
outputs within the same LAB. Neighboring LABs, M512 RAM blocks,
M4K RAM blocks, or DSP blocks from the left and right can also drive an
LAB’s local interconnect through the direct link connection. The direct
link connection feature minimizes the use of row and column
interconnects, providing higher performance and flexibility. Each LE can
drive 30 other LEs through fast local and direct link interconnects.
Figure 2–3 shows the direct link connection.
2–4
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Figure 2–3. Direct Link Connection
Direct link interconnect from
left LAB, TriMatrix memory
block, DSP block, or IOE output
Direct link interconnect from
right LAB, TriMatrix memory
block, DSP block, or IOE output
Direct link
interconnect
to right
Direct link
interconnect
to left
Local
Interconnect
LAB
LAB Control Signals
Each LAB contains dedicated logic for driving control signals to its LEs.
The control signals include two clocks, two clock enables, two
asynchronous clears, synchronous clear, asynchronous preset/load,
synchronous load, and add/subtract control signals. This gives a
maximum of 10 control signals at a time. Although synchronous load and
clear signals are generally used when implementing counters, they can
also be used with other functions.
Each LAB can use two clocks and two clock enable signals. Each LAB’s
clock and clock enable signals are linked. For example, any LE in a
particular LAB using the labclk1 signal will also use labclkena1. If
the LAB uses both the rising and falling edges of a clock, it also uses both
LAB-wide clock signals. De-asserting the clock enable signal will turn off
the LAB-wide clock.
Each LAB can use two asynchronous clear signals and an asynchronous
load/preset signal. The asynchronous load acts as a preset when the
asynchronous load data input is tied high.
Altera Corporation
July 2005
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Stratix Device Handbook, Volume 1
Logic Elements
With the LAB-wide addnsub control signal, a single LE can implement a
one-bit adder and subtractor. This saves LE resources and improves
performance for logic functions such as DSP correlators and signed
multipliers that alternate between addition and subtraction depending
on data.
The LAB row clocks [7..0] and LAB local interconnect generate the LABwide control signals. The MultiTrackTM interconnect’s inherent low skew
allows clock and control signal distribution in addition to data. Figure 2–4
shows the LAB control signal generation circuit.
Figure 2–4. LAB-Wide Control Signals
Dedicated
Row LAB
Clocks
8
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Logic Elements
labclkena2
labclkena1
labclk1
labclk2
labclr2
syncload
asyncload
or labpre
labclr1
addnsub
synclr
The smallest unit of logic in the Stratix architecture, the LE, is compact
and provides advanced features with efficient logic utilization. Each LE
contains a four-input LUT, which is a function generator that can
implement any function of four variables. In addition, each LE contains a
programmable register and carry chain with carry select capability. A
single LE also supports dynamic single bit addition or subtraction mode
selectable by an LAB-wide control signal. Each LE drives all types of
interconnects: local, row, column, LUT chain, register chain, and direct
link interconnects. See Figure 2–5.
2–6
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Figure 2–5. Stratix LE
Register chain
routing from
previous LE
LAB-wide
Register Bypass
Synchronous
Load
LAB-wide
Packed
Synchronous
Register Select
Clear
LAB Carry-In
Carry-In1
addnsub
Carry-In0
Programmable
Register
LUT chain
routing to next LE
data1
data2
data3
Look-Up
Table
(LUT)
Carry
Chain
Synchronous
Load and
Clear Logic
PRN/ALD
D
Q
ADATA
Row, column,
and direct link
routing
data4
ENA
CLRN
labclr1
labclr2
labpre/aload
Chip-Wide
Reset
Asynchronous
Clear/Preset/
Load Logic
Row, column,
and direct link
routing
Local Routing
Clock &
Clock Enable
Select
Register
Feedback
Register chain
output
labclk1
labclk2
labclkena1
labclkena2
Carry-Out0
Carry-Out1
LAB Carry-Out
Each LE’s programmable register can be configured for D, T, JK, or SR
operation. Each register has data, true asynchronous load data, clock,
clock enable, clear, and asynchronous load/preset inputs. Global signals,
general-purpose I/O pins, or any internal logic can drive the register’s
clock and clear control signals. Either general-purpose I/O pins or
internal logic can drive the clock enable, preset, asynchronous load, and
asynchronous data. The asynchronous load data input comes from the
data3 input of the LE. For combinatorial functions, the register is
bypassed and the output of the LUT drives directly to the outputs of the
LE.
Each LE has three outputs that drive the local, row, and column routing
resources. The LUT or register output can drive these three outputs
independently. Two LE outputs drive column or row and direct link
routing connections and one drives local interconnect resources. This
allows the LUT to drive one output while the register drives another
output. This feature, called register packing, improves device utilization
because the device can use the register and the LUT for unrelated
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July 2005
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Stratix Device Handbook, Volume 1
Logic Elements
functions. Another special packing mode allows the register output to
feed back into the LUT of the same LE so that the register is packed with
its own fan-out LUT. This provides another mechanism for improved
fitting. The LE can also drive out registered and unregistered versions of
the LUT output.
LUT Chain & Register Chain
In addition to the three general routing outputs, the LEs within an LAB
have LUT chain and register chain outputs. LUT chain connections allow
LUTs within the same LAB to cascade together for wide input functions.
Register chain outputs allow registers within the same LAB to cascade
together. The register chain output allows an LAB to use LUTs for a single
combinatorial function and the registers to be used for an unrelated shift
register implementation. These resources speed up connections between
LABs while saving local interconnect resources. See “MultiTrack
Interconnect” on page 2–14 for more information on LUT chain and
register chain connections.
addnsub Signal
The LE’s dynamic adder/subtractor feature saves logic resources by
using one set of LEs to implement both an adder and a subtractor. This
feature is controlled by the LAB-wide control signal addnsub. The
addnsub signal sets the LAB to perform either A + B or A – B. The LUT
computes addition, and subtraction is computed by adding the two’s
complement of the intended subtractor. The LAB-wide signal converts to
two’s complement by inverting the B bits within the LAB and setting
carry-in = 1 to add one to the least significant bit (LSB). The LSB of an
adder/subtractor must be placed in the first LE of the LAB, where the
LAB-wide addnsub signal automatically sets the carry-in to 1. The
Quartus II Compiler automatically places and uses the adder/subtractor
feature when using adder/subtractor parameterized functions.
LE Operating Modes
The Stratix LE can operate in one of the following modes:
■
■
Normal mode
Dynamic arithmetic mode
Each mode uses LE resources differently. In each mode, eight available
inputs to the LE—the four data inputs from the LAB local interconnect;
carry-in0 and carry-in1 from the previous LE; the LAB carry-in
from the previous carry-chain LAB; and the register chain connection—
are directed to different destinations to implement the desired logic
function. LAB-wide signals provide clock, asynchronous clear,
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July 2005
Stratix Architecture
asynchronous preset load, synchronous clear, synchronous load, and
clock enable control for the register. These LAB-wide signals are available
in all LE modes. The addnsub control signal is allowed in arithmetic
mode.
The Quartus II software, in conjunction with parameterized functions
such as library of parameterized modules (LPM) functions, automatically
chooses the appropriate mode for common functions such as counters,
adders, subtractors, and arithmetic functions. If required, you can also
create special-purpose functions that specify which LE operating mode to
use for optimal performance.
Normal Mode
The normal mode is suitable for general logic applications and
combinatorial functions. In normal mode, four data inputs from the LAB
local interconnect are inputs to a four-input LUT (see Figure 2–6). The
Quartus II Compiler automatically selects the carry-in or the data3
signal as one of the inputs to the LUT. Each LE can use LUT chain
connections to drive its combinatorial output directly to the next LE in the
LAB. Asynchronous load data for the register comes from the data3
input of the LE. LEs in normal mode support packed registers.
Figure 2–6. LE in Normal Mode
sload
sclear
(LAB Wide) (LAB Wide)
aload
(LAB Wide)
Register chain
connection
addnsub (LAB Wide)
(1)
data1
data2
data3
cin (from cout
of previous LE)
4-Input
LUT
ALD/PRE
ADATA Q
D
Row, column, and
direct link routing
ENA
CLRN
Row, column, and
direct link routing
clock (LAB Wide)
ena (LAB Wide)
data4
Local routing
aclr (LAB Wide)
LUT chain
connection
Register
chain output
Register Feedback
Note to Figure 2–6:
(1)
This signal is only allowed in normal mode if the LE is at the end of an adder/subtractor chain.
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July 2005
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Stratix Device Handbook, Volume 1
Logic Elements
Dynamic Arithmetic Mode
The dynamic arithmetic mode is ideal for implementing adders, counters,
accumulators, wide parity functions, and comparators. An LE in dynamic
arithmetic mode uses four 2-input LUTs configurable as a dynamic
adder/subtractor. The first two 2-input LUTs compute two summations
based on a possible carry-in of 1 or 0; the other two LUTs generate carry
outputs for the two chains of the carry select circuitry. As shown in
Figure 2–7, the LAB carry-in signal selects either the carry-in0 or
carry-in1 chain. The selected chain’s logic level in turn determines
which parallel sum is generated as a combinatorial or registered output.
For example, when implementing an adder, the sum output is the
selection of two possible calculated sums: data1 + data2 + carry-in0
or data1 + data2 + carry-in1. The other two LUTs use the data1 and
data2 signals to generate two possible carry-out signals—one for a carry
of 1 and the other for a carry of 0. The carry-in0 signal acts as the carry
select for the carry-out0 output and carry-in1 acts as the carry select
for the carry-out1 output. LEs in arithmetic mode can drive out
registered and unregistered versions of the LUT output.
The dynamic arithmetic mode also offers clock enable, counter enable,
synchronous up/down control, synchronous clear, synchronous load,
and dynamic adder/subtractor options. The LAB local interconnect data
inputs generate the counter enable and synchronous up/down control
signals. The synchronous clear and synchronous load options are LABwide signals that affect all registers in the LAB. The Quartus II software
automatically places any registers that are not used by the counter into
other LABs. The addnsub LAB-wide signal controls whether the LE acts
as an adder or subtractor.
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July 2005
Stratix Architecture
Figure 2–7. LE in Dynamic Arithmetic Mode
LAB Carry-In
sload
sclear
(LAB Wide) (LAB Wide)
Register chain
connection
Carry-In0
Carry-In1
addnsub
(LAB Wide)
(1)
data1
data2
data3
LUT
LUT
aload
(LAB Wide)
ALD/PRE
ADATA Q
D
Row, column, and
direct link routing
ENA
CLRN
Row, column, and
direct link routing
clock (LAB Wide)
ena (LAB Wide)
LUT
Local routing
aclr (LAB Wide)
LUT chain
connection
LUT
Register
chain output
Register Feedback
Carry-Out0
Carry-Out1
Note to Figure 2–7:
(1)
The addnsub signal is tied to the carry input for the first LE of a carry chain only.
Carry-Select Chain
The carry-select chain provides a very fast carry-select function between
LEs in arithmetic mode. The carry-select chain uses the redundant carry
calculation to increase the speed of carry functions. The LE is configured
to calculate outputs for a possible carry-in of 1 and carry-in of 0 in
parallel. The carry-in0 and carry-in1 signals from a lower-order bit
feed forward into the higher-order bit via the parallel carry chain and feed
into both the LUT and the next portion of the carry chain. Carry-select
chains can begin in any LE within an LAB.
The speed advantage of the carry-select chain is in the parallel precomputation of carry chains. Since the LAB carry-in selects the
precomputed carry chain, not every LE is in the critical path. Only the
propagation delay between LAB carry-in generation (LE 5 and LE 10) are
now part of the critical path. This feature allows the Stratix architecture to
implement high-speed counters, adders, multipliers, parity functions,
and comparators of arbitrary width.
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July 2005
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Logic Elements
Figure 2–8 shows the carry-select circuitry in an LAB for a 10-bit full
adder. One portion of the LUT generates the sum of two bits using the
input signals and the appropriate carry-in bit; the sum is routed to the
output of the LE. The register can be bypassed for simple adders or used
for accumulator functions. Another portion of the LUT generates carryout bits. An LAB-wide carry in bit selects which chain is used for the
addition of given inputs. The carry-in signal for each chain, carry-in0
or carry-in1, selects the carry-out to carry forward to the carry-in
signal of the next-higher-order bit. The final carry-out signal is routed to
an LE, where it is fed to local, row, or column interconnects.
The Quartus II Compiler automatically creates carry chain logic during
design processing, or you can create it manually during design entry.
Parameterized functions such as LPM functions automatically take
advantage of carry chains for the appropriate functions.
The Quartus II Compiler creates carry chains longer than 10 LEs by
linking LABs together automatically. For enhanced fitting, a long carry
chain runs vertically allowing fast horizontal connections to TriMatrix™
memory and DSP blocks. A carry chain can continue as far as a full
column.
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July 2005
Stratix Architecture
Figure 2–8. Carry Select Chain
LAB Carry-In
0
1
A1
B1
LE1
A2
B2
LE2
Sum1
LAB Carry-In
Carry-In0
Carry-In1
A3
B3
LE3
A4
B4
LE4
A5
B5
LE5
0
Sum2
Sum3
LUT
data1
data2
Sum
LUT
Sum4
LUT
Sum5
LUT
1
A6
B6
LE6
A7
B7
LE7
A8
B8
LE8
A9
B9
LE9
A10
B10
LE10
Sum6
Carry-Out0
Carry-Out1
Sum7
Sum8
Sum9
Sum10
LAB Carry-Out
Clear & Preset Logic Control
LAB-wide signals control the logic for the register’s clear and preset
signals. The LE directly supports an asynchronous clear and preset
function. The register preset is achieved through the asynchronous load
of a logic high. The direct asynchronous preset does not require a NOTgate push-back technique. Stratix devices support simultaneous preset/
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July 2005
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Stratix Device Handbook, Volume 1
MultiTrack Interconnect
asynchronous load, and clear signals. An asynchronous clear signal takes
precedence if both signals are asserted simultaneously. Each LAB
supports up to two clears and one preset signal.
In addition to the clear and preset ports, Stratix devices provide a chipwide reset pin (DEV_CLRn) that resets all registers in the device. An
option set before compilation in the Quartus II software controls this pin.
This chip-wide reset overrides all other control signals.
MultiTrack
Interconnect
In the Stratix architecture, connections between LEs, TriMatrix memory,
DSP blocks, and device I/O pins are provided by the MultiTrack
interconnect structure with DirectDriveTM technology. The MultiTrack
interconnect consists of continuous, performance-optimized routing lines
of different lengths and speeds used for inter- and intra-design block
connectivity. The Quartus II Compiler automatically places critical design
paths on faster interconnects to improve design performance.
DirectDrive technology is a deterministic routing technology that ensures
identical routing resource usage for any function regardless of placement
within the device. The MultiTrack interconnect and DirectDrive
technology simplify the integration stage of block-based designing by
eliminating the re-optimization cycles that typically follow design
changes and additions.
The MultiTrack interconnect consists of row and column interconnects
that span fixed distances. A routing structure with fixed length resources
for all devices allows predictable and repeatable performance when
migrating through different device densities. Dedicated row
interconnects route signals to and from LABs, DSP blocks, and TriMatrix
memory within the same row. These row resources include:
■
■
■
■
Direct link interconnects between LABs and adjacent blocks.
R4 interconnects traversing four blocks to the right or left.
R8 interconnects traversing eight blocks to the right or left.
R24 row interconnects for high-speed access across the length of the
device.
The direct link interconnect allows an LAB, DSP block, or TriMatrix
memory block to drive into the local interconnect of its left and right
neighbors and then back into itself. Only one side of a M-RAM block
interfaces with direct link and row interconnects. This provides fast
communication between adjacent LABs and/or blocks without using row
interconnect resources.
The R4 interconnects span four LABs, three LABs and one M512 RAM
block, two LABs and one M4K RAM block, or two LABs and one DSP
block to the right or left of a source LAB. These resources are used for fast
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July 2005
Stratix Architecture
row connections in a four-LAB region. Every LAB has its own set of R4
interconnects to drive either left or right. Figure 2–9 shows R4
interconnect connections from an LAB. R4 interconnects can drive and be
driven by DSP blocks and RAM blocks and horizontal IOEs. For LAB
interfacing, a primary LAB or LAB neighbor can drive a given R4
interconnect. For R4 interconnects that drive to the right, the primary
LAB and right neighbor can drive on to the interconnect. For R4
interconnects that drive to the left, the primary LAB and its left neighbor
can drive on to the interconnect. R4 interconnects can drive other R4
interconnects to extend the range of LABs they can drive. R4
interconnects can also drive C4 and C16 interconnects for connections
from one row to another. Additionally, R4 interconnects can drive R24
interconnects.
Figure 2–9. R4 Interconnect Connections
Adjacent LAB can
Drive onto Another
LAB's R4 Interconnect
C4, C8, and C16
Column Interconnects (1)
R4 Interconnect
Driving Right
R4 Interconnect
Driving Left
LAB
Neighbor
Primary
LAB (2)
LAB
Neighbor
Notes to Figure 2–9:
(1)
(2)
C4 interconnects can drive R4 interconnects.
This pattern is repeated for every LAB in the LAB row.
The R8 interconnects span eight LABs, M512 or M4K RAM blocks, or DSP
blocks to the right or left from a source LAB. These resources are used for
fast row connections in an eight-LAB region. Every LAB has its own set
of R8 interconnects to drive either left or right. R8 interconnect
connections between LABs in a row are similar to the R4 connections
shown in Figure 2–9, with the exception that they connect to eight LABs
to the right or left, not four. Like R4 interconnects, R8 interconnects can
drive and be driven by all types of architecture blocks. R8 interconnects
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July 2005
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MultiTrack Interconnect
can drive other R8 interconnects to extend their range as well as C8
interconnects for row-to-row connections. One R8 interconnect is faster
than two R4 interconnects connected together.
R24 row interconnects span 24 LABs and provide the fastest resource for
long row connections between LABs, TriMatrix memory, DSP blocks, and
IOEs. The R24 row interconnects can cross M-RAM blocks. R24 row
interconnects drive to other row or column interconnects at every fourth
LAB and do not drive directly to LAB local interconnects. R24 row
interconnects drive LAB local interconnects via R4 and C4 interconnects.
R24 interconnects can drive R24, R4, C16, and C4 interconnects.
The column interconnect operates similarly to the row interconnect and
vertically routes signals to and from LABs, TriMatrix memory, DSP
blocks, and IOEs. Each column of LABs is served by a dedicated column
interconnect, which vertically routes signals to and from LABs, TriMatrix
memory and DSP blocks, and horizontal IOEs. These column resources
include:
■
■
■
■
■
LUT chain interconnects within an LAB
Register chain interconnects within an LAB
C4 interconnects traversing a distance of four blocks in up and down
direction
C8 interconnects traversing a distance of eight blocks in up and
down direction
C16 column interconnects for high-speed vertical routing through
the device
Stratix devices include an enhanced interconnect structure within LABs
for routing LE output to LE input connections faster using LUT chain
connections and register chain connections. The LUT chain connection
allows the combinatorial output of an LE to directly drive the fast input
of the LE right below it, bypassing the local interconnect. These resources
can be used as a high-speed connection for wide fan-in functions from
LE 1 to LE 10 in the same LAB. The register chain connection allows the
register output of one LE to connect directly to the register input of the
next LE in the LAB for fast shift registers. The Quartus II Compiler
automatically takes advantage of these resources to improve utilization
and performance. Figure 2–10 shows the LUT chain and register chain
interconnects.
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July 2005
Stratix Architecture
Figure 2–10. LUT Chain & Register Chain Interconnects
Local Interconnect
Routing Among LEs
in the LAB
LUT Chain
Routing to
Adjacent LE
LE 1
Register Chain
Routing to Adjacent
LE's Register Input
LE 2
Local
Interconnect
LE 3
LE 4
LE 5
LE 6
LE 7
LE 8
LE 9
LE 10
The C4 interconnects span four LABs, M512, or M4K blocks up or down
from a source LAB. Every LAB has its own set of C4 interconnects to drive
either up or down. Figure 2–11 shows the C4 interconnect connections
from an LAB in a column. The C4 interconnects can drive and be driven
by all types of architecture blocks, including DSP blocks, TriMatrix
memory blocks, and vertical IOEs. For LAB interconnection, a primary
LAB or its LAB neighbor can drive a given C4 interconnect.
C4 interconnects can drive each other to extend their range as well as
drive row interconnects for column-to-column connections.
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July 2005
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Stratix Device Handbook, Volume 1
MultiTrack Interconnect
Figure 2–11. C4 Interconnect Connections Note (1)
C4 Interconnect
Drives Local and R4
Interconnects
up to Four Rows
C4 Interconnect
Driving Up
LAB
Row
Interconnect
Adjacent LAB can
drive onto neighboring
LAB's C4 interconnect
Local
Interconnect
C4 Interconnect
Driving Down
Note to Figure 2–11:
(1)
Each C4 interconnect can drive either up or down four rows.
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Stratix Architecture
C8 interconnects span eight LABs, M512, or M4K blocks up or down from
a source LAB. Every LAB has its own set of C8 interconnects to drive
either up or down. C8 interconnect connections between the LABs in a
column are similar to the C4 connections shown in Figure 2–11 with the
exception that they connect to eight LABs above and below. The C8
interconnects can drive and be driven by all types of architecture blocks
similar to C4 interconnects. C8 interconnects can drive each other to
extend their range as well as R8 interconnects for column-to-column
connections. C8 interconnects are faster than two C4 interconnects.
C16 column interconnects span a length of 16 LABs and provide the
fastest resource for long column connections between LABs, TriMatrix
memory blocks, DSP blocks, and IOEs. C16 interconnects can cross MRAM blocks and also drive to row and column interconnects at every
fourth LAB. C16 interconnects drive LAB local interconnects via C4 and
R4 interconnects and do not drive LAB local interconnects directly.
All embedded blocks communicate with the logic array similar to LABto-LAB interfaces. Each block (i.e., TriMatrix memory and DSP blocks)
connects to row and column interconnects and has local interconnect
regions driven by row and column interconnects. These blocks also have
direct link interconnects for fast connections to and from a neighboring
LAB. All blocks are fed by the row LAB clocks, labclk[7..0].
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July 2005
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MultiTrack Interconnect
Table 2–2 shows the Stratix device’s routing scheme.
Table 2–2. Stratix Device Routing Scheme
Direct Link
Interconnect
v
R4 Interconnect
v
R8 Interconnect
v
v
v
v
R24
Interconnect
v
C4 Interconnect
v
C8 Interconnect
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
M4K RAM Block
v
v
v
v
v
v
v
v
M-RAM Block
v
v
Row IOE
v
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v
v
v
v
v
v
v
v
Column IOE
v
v
v
DSP Blocks
v
v
v
v
v
v
M512 RAM
Block
LE
v
v
v
C16
Interconnect
v
v
Row IOE
v
Column IOE
Local
Interconnect
DSP Blocks
v
M-RAM Block
v
Register Chain
M4K RAM Block
LUT Chain
M512 RAM Block
LE
C16 Interconnect
C8 Interconnect
C4 Interconnect
R24 Interconnect
R8 Interconnect
R4 Interconnect
Direct Link Interconnect
Local Interconnect
LUT Chain
Source
Register Chain
Destination
v
v
v
v
v
v
v
v
v
v
v
Altera Corporation
July 2005
Stratix Architecture
TriMatrix
Memory
TriMatrix memory consists of three types of RAM blocks: M512, M4K,
and M-RAM blocks. Although these memory blocks are different, they
can all implement various types of memory with or without parity,
including true dual-port, simple dual-port, and single-port RAM, ROM,
and FIFO buffers. Table 2–3 shows the size and features of the different
RAM blocks.
Table 2–3. TriMatrix Memory Features (Part 1 of 2)
Memory Feature
Maximum
performance
M512 RAM Block M4K RAM Block
(32 × 18 Bits)
(128 × 36 Bits)
(1)
True dual-port
memory
(1)
(1)
v
v
Simple dual-port
memory
v
v
v
Single-port memory
v
v
v
Shift register
v
v
ROM
v
v
(2)
FIFO buffer
v
v
v
v
v
Parity bits
v
v
v
Mixed clock mode
v
v
v
Memory initialization
v
v
Simple dual-port
memory mixed width
support
v
v
v
v
v
Byte enable
True dual-port
memory mixed width
support
Altera Corporation
July 2005
M-RAM Block
(4K × 144 Bits)
Power-up conditions
Outputs cleared
Outputs cleared
Outputs
unknown
Register clears
Input and output
registers
Input and output
registers
Output registers
Mixed-port readduring-write
Unknown
output/old data
Unknown
output/old data
Unknown output
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TriMatrix Memory
Table 2–3. TriMatrix Memory Features (Part 2 of 2)
Memory Feature
Configurations
M512 RAM Block M4K RAM Block
(32 × 18 Bits)
(128 × 36 Bits)
512 × 1
256 × 2
128 × 4
64 × 8
64 × 9
32 × 16
32 × 18
4K × 1
2K × 2
1K × 4
512 × 8
512 × 9
256 × 16
256 × 18
128 × 32
128 × 36
M-RAM Block
(4K × 144 Bits)
64K × 8
64K × 9
32K × 16
32K × 18
16K × 32
16K × 36
8K × 64
8K × 72
4K × 128
4K × 144
Notes to Table 2–3:
(1)
(2)
See Table 4–36 for maximum performance information.
The M-RAM block does not support memory initializations. However, the
M-RAM block can emulate a ROM function using a dual-port RAM bock. The
Stratix device must write to the dual-port memory once and then disable the
write-enable ports afterwards.
1
Violating the setup or hold time on the address registers could
corrupt the memory contents. This applies to both read and
write operations.
Memory Modes
TriMatrix memory blocks include input registers that synchronize writes
and output registers to pipeline designs and improve system
performance. M4K and M-RAM memory blocks offer a true dual-port
mode to support any combination of two-port operations: two reads, two
writes, or one read and one write at two different clock frequencies.
Figure 2–12 shows true dual-port memory.
Figure 2–12. True Dual-Port Memory Configuration
A
dataA[ ]
addressA[ ]
wrenA
clockA
clockenA
qA[ ]
aclrA
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B
dataB[ ]
addressB[ ]
wrenB
clockB
clockenB
qB[ ]
aclrB
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July 2005
Stratix Architecture
In addition to true dual-port memory, the memory blocks support simple
dual-port and single-port RAM. Simple dual-port memory supports a
simultaneous read and write and can either read old data before the write
occurs or just read the don’t care bits. Single-port memory supports nonsimultaneous reads and writes, but the q[] port will output the data once
it has been written to the memory (if the outputs are not registered) or
after the next rising edge of the clock (if the outputs are registered). For
more information, see Chapter 2, TriMatrix Embedded Memory Blocks in
Stratix & Stratix GX Devices of the Stratix Device Handbook, Volume 2.
Figure 2–13 shows these different RAM memory port configurations for
TriMatrix memory.
Figure 2–13. Simple Dual-Port & Single-Port Memory Configurations
Simple Dual-Port Memory
data[ ]
wraddress[ ]
wren
inclock
inclocken
inaclr
rdaddress[ ]
rden
q[ ]
outclock
outclocken
outaclr
Single-Port Memory (1)
data[ ]
address[ ]
wren
inclock
inclocken
inaclr
q[ ]
outclock
outclocken
outaclr
Note to Figure 2–13:
(1)
Two single-port memory blocks can be implemented in a single M4K block as long
as each of the two independent block sizes is equal to or less than half of the M4K
block size.
The memory blocks also enable mixed-width data ports for reading and
writing to the RAM ports in dual-port RAM configuration. For example,
the memory block can be written in ×1 mode at port A and read out in ×16
mode from port B.
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July 2005
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TriMatrix Memory
TriMatrix memory architecture can implement pipelined RAM by
registering both the input and output signals to the RAM block. All
TriMatrix memory block inputs are registered providing synchronous
write cycles. In synchronous operation, the memory block generates its
own self-timed strobe write enable (WREN) signal derived from the global
or regional clock. In contrast, a circuit using asynchronous RAM must
generate the RAM WREN signal while ensuring its data and address
signals meet setup and hold time specifications relative to the WREN
signal. The output registers can be bypassed. Flow-through reading is
possible in the simple dual-port mode of M512 and M4K RAM blocks by
clocking the read enable and read address registers on the negative clock
edge and bypassing the output registers.
Two single-port memory blocks can be implemented in a single M4K
block as long as each of the two independent block sizes is equal to or less
than half of the M4K block size.
The Quartus II software automatically implements larger memory by
combining multiple TriMatrix memory blocks. For example, two
256 × 16-bit RAM blocks can be combined to form a 256 × 32-bit RAM
block. Memory performance does not degrade for memory blocks using
the maximum number of words available in one memory block. Logical
memory blocks using less than the maximum number of words use
physical blocks in parallel, eliminating any external control logic that
would increase delays. To create a larger high-speed memory block, the
Quartus II software automatically combines memory blocks with LE
control logic.
Clear Signals
When applied to input registers, the asynchronous clear signal for the
TriMatrix embedded memory immediately clears the input registers.
However, the output of the memory block does not show the effects until
the next clock edge. When applied to output registers, the asynchronous
clear signal clears the output registers and the effects are seen
immediately.
Parity Bit Support
The memory blocks support a parity bit for each byte. The parity bit,
along with internal LE logic, can implement parity checking for error
detection to ensure data integrity. You can also use parity-size data words
to store user-specified control bits. In the M4K and M-RAM blocks, byte
enables are also available for data input masking during write operations.
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Stratix Architecture
Shift Register Support
You can configure embedded memory blocks to implement shift registers
for DSP applications such as pseudo-random number generators, multichannel filtering, auto-correlation, and cross-correlation functions. These
and other DSP applications require local data storage, traditionally
implemented with standard flip-flops, which can quickly consume many
logic cells and routing resources for large shift registers. A more efficient
alternative is to use embedded memory as a shift register block, which
saves logic cell and routing resources and provides a more efficient
implementation with the dedicated circuitry.
The size of a w × m × n shift register is determined by the input data
width (w), the length of the taps (m), and the number of taps (n). The size
of a w × m × n shift register must be less than or equal to the maximum
number of memory bits in the respective block: 576 bits for the M512
RAM block and 4,608 bits for the M4K RAM block. The total number of
shift register outputs (number of taps n × width w) must be less than the
maximum data width of the RAM block (18 for M512 blocks, 36 for M4K
blocks). To create larger shift registers, the memory blocks are cascaded
together.
Data is written into each address location at the falling edge of the clock
and read from the address at the rising edge of the clock. The shift register
mode logic automatically controls the positive and negative edge
clocking to shift the data in one clock cycle. Figure 2–14 shows the
TriMatrix memory block in the shift register mode.
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TriMatrix Memory
Figure 2–14. Shift Register Memory Configuration
w × m × n Shift Register
m-Bit Shift Register
w
w
m-Bit Shift Register
w
w
n Number
of Taps
m-Bit Shift Register
w
w
m-Bit Shift Register
w
w
Memory Block Size
TriMatrix memory provides three different memory sizes for efficient
application support. The large number of M512 blocks are ideal for
designs with many shallow first-in first-out (FIFO) buffers. M4K blocks
provide additional resources for channelized functions that do not
require large amounts of storage. The M-RAM blocks provide a large
single block of RAM ideal for data packet storage. The different-sized
blocks allow Stratix devices to efficiently support variable-sized memory
in designs.
The Quartus II software automatically partitions the user-defined
memory into the embedded memory blocks using the most efficient size
combinations. You can also manually assign the memory to a specific
block size or a mixture of block sizes.
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Stratix Architecture
M512 RAM Block
The M512 RAM block is a simple dual-port memory block and is useful
for implementing small FIFO buffers, DSP, and clock domain transfer
applications. Each block contains 576 RAM bits (including parity bits).
M512 RAM blocks can be configured in the following modes:
■
■
■
■
■
Simple dual-port RAM
Single-port RAM
FIFO
ROM
Shift register
When configured as RAM or ROM, you can use an initialization file to
pre-load the memory contents.
The memory address depths and output widths can be configured as
512 × 1, 256 × 2, 128 × 4, 64 × 8 (64 × 9 bits with parity), and 32 × 16
(32 × 18 bits with parity). Mixed-width configurations are also possible,
allowing different read and write widths. Table 2–4 summarizes the
possible M512 RAM block configurations.
Table 2–4. M512 RAM Block Configurations (Simple Dual-Port RAM)
Write Port
Read Port
512 × 1
256 × 2
128 × 4
64 × 8
32 × 16
512 × 1
v
v
v
v
v
256 × 2
v
v
v
v
v
128 × 4
v
v
v
64 × 8
v
v
32 × 16
v
v
64 × 9
32 × 18
64 × 9
32 × 18
v
v
v
v
v
v
When the M512 RAM block is configured as a shift register block, a shift
register of size up to 576 bits is possible.
The M512 RAM block can also be configured to support serializer and
deserializer applications. By using the mixed-width support in
combination with DDR I/O standards, the block can function as a
SERDES to support low-speed serial I/O standards using global or
regional clocks. See “I/O Structure” on page 2–104 for details on
dedicated SERDES in Stratix devices.
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TriMatrix Memory
M512 RAM blocks can have different clocks on its inputs and outputs.
The wren, datain, and write address registers are all clocked together
from one of the two clocks feeding the block. The read address, rden, and
output registers can be clocked by either of the two clocks driving the
block. This allows the RAM block to operate in read/write or
input/output clock modes. Only the output register can be bypassed. The
eight labclk signals or local interconnect can drive the inclock,
outclock, wren, rden, inclr, and outclr signals. Because of the
advanced interconnect between the LAB and M512 RAM blocks, LEs can
also control the wren and rden signals and the RAM clock, clock enable,
and asynchronous clear signals. Figure 2–15 shows the M512 RAM block
control signal generation logic.
The RAM blocks within Stratix devices have local interconnects to allow
LEs and interconnects to drive into RAM blocks. The M512 RAM block
local interconnect is driven by the R4, R8, C4, C8, and direct link
interconnects from adjacent LABs. The M512 RAM blocks can
communicate with LABs on either the left or right side through these row
interconnects or with LAB columns on the left or right side with the
column interconnects. Up to 10 direct link input connections to the M512
RAM block are possible from the left adjacent LABs and another
10 possible from the right adjacent LAB. M512 RAM outputs can also
connect to left and right LABs through 10 direct link interconnects. The
M512 RAM block has equal opportunity for access and performance to
and from LABs on either its left or right side. Figure 2–16 shows the M512
RAM block to logic array interface.
2–28
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Figure 2–15. M512 RAM Block Control Signals
Dedicated
Row LAB
Clocks
8
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Altera Corporation
July 2005
outclocken
inclocken
inclock
outclock
outclr
wren
rden
inclr
2–29
Stratix Device Handbook, Volume 1
TriMatrix Memory
Figure 2–16. M512 RAM Block LAB Row Interface
C4 and C8
Interconnects
R4 and R8
Interconnects
10
Direct link
interconnect
to adjacent LAB
Direct link
interconnect
to adjacent LAB
dataout
M512 RAM
Block
Direct link
interconnect
from adjacent LAB
Direct link
interconnect
from adjacent LAB
Control
Signals
datain
address
Clocks
2
8
Small RAM Block Local
Interconnect Region
LAB Row Clocks
M4K RAM Blocks
The M4K RAM block includes support for true dual-port RAM. The M4K
RAM block is used to implement buffers for a wide variety of applications
such as storing processor code, implementing lookup schemes, and
implementing larger memory applications. Each block contains
4,608 RAM bits (including parity bits). M4K RAM blocks can be
configured in the following modes:
■
■
■
■
■
■
True dual-port RAM
Simple dual-port RAM
Single-port RAM
FIFO
ROM
Shift register
When configured as RAM or ROM, you can use an initialization file to
pre-load the memory contents.
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Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
The memory address depths and output widths can be configured as
4,096 × 1, 2,048 × 2, 1,024 × 4, 512 × 8 (or 512 × 9 bits), 256 × 16 (or
256 × 18 bits), and 128 × 32 (or 128 × 36 bits). The 128 × 32- or 36-bit
configuration is not available in the true dual-port mode. Mixed-width
configurations are also possible, allowing different read and write
widths. Tables 2–5 and 2–6 summarize the possible M4K RAM block
configurations.
Table 2–5. M4K RAM Block Configurations (Simple Dual-Port)
Write Port
Read Port
4K × 1
2K × 2
1K × 4 512 × 8 256 × 16
128 × 32 512 × 9 256 × 18
4K × 1
v
v
v
v
v
v
2K × 2
v
v
v
v
v
v
1K × 4
v
v
v
v
v
v
512 × 8
v
v
v
v
v
v
256 × 16
v
v
v
v
v
v
128 × 32
v
v
v
v
v
v
128 × 36
512 × 9
v
v
v
256 × 18
v
v
v
128 × 36
v
v
v
Table 2–6. M4K RAM Block Configurations (True Dual-Port)
Port B
Port A
4K × 1
2K × 2
1K × 4
512 × 8
256 × 16
512 × 9
256 × 18
4K × 1
v
v
v
v
v
2K × 2
v
v
v
v
v
1K × 4
v
v
v
v
v
512 × 8
v
v
v
v
v
256 × 16
v
v
v
v
v
512 × 9
v
v
256 × 18
v
v
When the M4K RAM block is configured as a shift register block, you can
create a shift register up to 4,608 bits (w × m × n).
Altera Corporation
July 2005
2–31
Stratix Device Handbook, Volume 1
TriMatrix Memory
M4K RAM blocks support byte writes when the write port has a data
width of 16, 18, 32, or 36 bits. The byte enables allow the input data to be
masked so the device can write to specific bytes. The unwritten bytes
retain the previous written value. Table 2–7 summarizes the byte
selection.
Table 2–7. Byte Enable for M4K Blocks Notes (1), (2)
byteena[3..0]
datain ×18
datain ×36
[0] = 1
[8..0]
[8..0]
[1] = 1
[17..9]
[17..9]
[2] = 1
–
[26..18]
[3] = 1
–
[35..27]
Notes to Table 2–7:
(1)
(2)
Any combination of byte enables is possible.
Byte enables can be used in the same manner with 8-bit words, i.e., in × 16 and
× 32 modes.
The M4K RAM blocks allow for different clocks on their inputs and
outputs. Either of the two clocks feeding the block can clock M4K RAM
block registers (renwe, address, byte enable, datain, and output
registers). Only the output register can be bypassed. The eight labclk
signals or local interconnects can drive the control signals for the A and B
ports of the M4K RAM block. LEs can also control the clock_a,
clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and
clocken_b signals, as shown in Figure 2–17.
The R4, R8, C4, C8, and direct link interconnects from adjacent LABs
drive the M4K RAM block local interconnect. The M4K RAM blocks can
communicate with LABs on either the left or right side through these row
resources or with LAB columns on either the right or left with the column
resources. Up to 10 direct link input connections to the M4K RAM Block
are possible from the left adjacent LABs and another 10 possible from the
right adjacent LAB. M4K RAM block outputs can also connect to left and
right LABs through 10 direct link interconnects each. Figure 2–18 shows
the M4K RAM block to logic array interface.
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Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Figure 2–17. M4K RAM Block Control Signals
Dedicated
Row LAB
Clocks
8
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
alcr_a
clocken_a
clock_b
renwe_b
Local
Interconnect
Local
Interconnect
clock_a
renwe_a
alcr_b
clocken_b
Figure 2–18. M4K RAM Block LAB Row Interface
C4 and C8
Interconnects
Direct link
interconnect
to adjacent LAB
R4 and R8
Interconnects
10
Direct link
interconnect
to adjacent LAB
dataout
Direct link
interconnect
from adjacent LAB
M4K RAM
Block
Direct link
interconnect
from adjacent LAB
Byte enable
Control
Signals
Clocks
address
datain
8
M4K RAM Block Local
Interconnect Region
Altera Corporation
July 2005
LAB Row Clocks
2–33
Stratix Device Handbook, Volume 1
TriMatrix Memory
M-RAM Block
The largest TriMatrix memory block, the M-RAM block, is useful for
applications where a large volume of data must be stored on-chip. Each
block contains 589,824 RAM bits (including parity bits). The M-RAM
block can be configured in the following modes:
■
■
■
■
True dual-port RAM
Simple dual-port RAM
Single-port RAM
FIFO RAM
You cannot use an initialization file to initialize the contents of a M-RAM
block. All M-RAM block contents power up to an undefined value. Only
synchronous operation is supported in the M-RAM block, so all inputs
are registered. Output registers can be bypassed. The memory address
and output width can be configured as 64K × 8 (or 64K × 9 bits), 32K × 16
(or 32K × 18 bits), 16K × 32 (or 16K × 36 bits), 8K × 64 (or 8K × 72 bits), and
4K × 128 (or 4K × 144 bits). The 4K × 128 configuration is unavailable in
true dual-port mode because there are a total of 144 data output drivers
in the block. Mixed-width configurations are also possible, allowing
different read and write widths. Tables 2–8 and 2–9 summarize the
possible M-RAM block configurations:
Table 2–8. M-RAM Block Configurations (Simple Dual-Port)
Write Port
Read Port
64K × 9
32K × 18
16K × 36
8K × 72
64K × 9
v
v
v
v
32K × 18
v
v
v
v
16K × 36
v
v
v
v
8K × 72
v
v
v
v
4K × 144
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Stratix Device Handbook, Volume 1
4K × 144
v
Altera Corporation
July 2005
Stratix Architecture
Table 2–9. M-RAM Block Configurations (True Dual-Port)
Port B
Port A
64K × 9
32K × 18
16K × 36
8K × 72
64K × 9
v
v
v
v
32K × 18
v
v
v
v
16K × 36
v
v
v
v
8K × 72
v
v
v
v
The read and write operation of the memory is controlled by the WREN
signal, which sets the ports into either read or write modes. There is no
separate read enable (RE) signal.
Writing into RAM is controlled by both the WREN and byte enable
(byteena) signals for each port. The default value for the byteena
signal is high, in which case writing is controlled only by the WREN signal.
The byte enables are available for the ×18, ×36, and ×72 modes. In the
×144 simple dual-port mode, the two sets of byteena signals
(byteena_a and byteena_b) are combined to form the necessary
16 byte enables. Tables 2–10 and 2–11 summarize the byte selection.
Table 2–10. Byte Enable for M-RAM Blocks Notes (1), (2)
Altera Corporation
July 2005
byteena[3..0]
datain ×18
datain ×36
datain ×72
[0] = 1
[8..0]
[8..0]
[8..0]
[1] = 1
[17..9]
[17..9]
[17..9]
[2] = 1
–
[26..18]
[26..18]
[3] = 1
–
[35..27]
[35..27]
[4] = 1
–
–
[44..36]
[5] = 1
–
–
[53..45]
[6] = 1
–
–
[62..54]
[7] = 1
–
–
[71..63]
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Stratix Device Handbook, Volume 1
TriMatrix Memory
Table 2–11. M-RAM Combined Byte Selection for ×144 Mode Notes (1), (2)
byteena[15..0]
datain ×144
[0] = 1
[8..0]
[1] = 1
[17..9]
[2] = 1
[26..18]
[3] = 1
[35..27]
[4] = 1
[44..36]
[5] = 1
[53..45]
[6] = 1
[62..54]
[7] = 1
[71..63]
[8] = 1
[80..72]
[9] = 1
[89..81]
[10] = 1
[98..90]
[11] = 1
[107..99]
[12] = 1
[116..108]
[13] = 1
[125..117]
[14] = 1
[134..126]
[15] = 1
[143..135]
Notes to Tables 2–10 and 2–11:
(1)
(2)
Any combination of byte enables is possible.
Byte enables can be used in the same manner with 8-bit words, i.e., in × 16, × 32,
× 64, and × 128 modes.
Similar to all RAM blocks, M-RAM blocks can have different clocks on
their inputs and outputs. All input registers—renwe, datain, address,
and byte enable registers—are clocked together from either of the two
clocks feeding the block. The output register can be bypassed. The eight
labclk signals or local interconnect can drive the control signals for the
A and B ports of the M-RAM block. LEs can also control the clock_a,
clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and
clocken_b signals as shown in Figure 2–19.
2–36
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Figure 2–19. M-RAM Block Control Signals
Dedicated
Row LAB
Clocks
8
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
clocken_b
clocken_a
clock_a
clock_b
renwe_b
aclr_b
aclr_a
renwe_a
One of the M-RAM block’s horizontal sides drive the address and control
signal (clock, renwe, byteena, etc.) inputs. Typically, the horizontal side
closest to the device perimeter contains the interfaces. The one exception
is when two M-RAM blocks are paired next to each other. In this case, the
side of the M-RAM block opposite the common side of the two blocks
contains the input interface. The top and bottom sides of any M-RAM
block contain data input and output interfaces to the logic array. The top
side has 72 data inputs and 72 data outputs for port B, and the bottom side
has another 72 data inputs and 72 data outputs for port A. Figure 2–20
shows an example floorplan for the EP1S60 device and the location of the
M-RAM interfaces.
Altera Corporation
July 2005
2–37
Stratix Device Handbook, Volume 1
TriMatrix Memory
Figure 2–20. EP1S60 Device with M-RAM Interface Locations Note (1)
Independent M-RAM blocks
interface to top, bottom, and side facing
device perimeter for easy access
to horizontal I/O pins.
M-RAM pairs interface to
top, bottom, and side opposite
of block-to-block border.
DSP
Blocks
M-RAM
Block
M-RAM
Block
M-RAM
Block
M-RAM
Block
M-RAM
Block
M-RAM
Block
M512
Blocks
M4K
Blocks
LABs
DSP
Blocks
Note to Figure 2–20:
(1)
Device shown is an EP1S60 device. The number and position of M-RAM blocks varies in other devices.
The M-RAM block local interconnect is driven by the R4, R8, C4, C8, and
direct link interconnects from adjacent LABs. For independent M-RAM
blocks, up to 10 direct link address and control signal input connections
to the M-RAM block are possible from the left adjacent LABs for M-RAM
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Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
blocks facing to the left, and another 10 possible from the right adjacent
LABs for M-RAM blocks facing to the right. For column interfacing, every
M-RAM column unit connects to the right and left column lines, allowing
each M-RAM column unit to communicate directly with three columns of
LABs. Figures 2–21 through 2–23 show the interface between the M-RAM
block and the logic array.
Altera Corporation
July 2005
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Stratix Device Handbook, Volume 1
TriMatrix Memory
Figure 2–21. Left-Facing M-RAM to Interconnect Interface Notes (1), (2)
M512 RAM Block Columns
Row Unit Interface
Allows LAB Rows to
Drive Address and
Control Signals to
M-RAM Block
LABs in Column
M-RAM Boundary
Column Interface Block
Drives to and from
C4 and C8 Interconnects
B1
B2
B3
B4
B5
B6
A4
A5
A6
Port B
R11
R10
R9
R8
R7
M-RAM Block
R6
R5
R4
R3
R2
R1
Port A
A1
A2
A3
Column Interface Block
Allows LAB Columns to
Drive datain and dataout to
and from M-RAM Block
LABs in Row
M-RAM Boundary
LAB Interface
Blocks
Notes to Figure 2–21:
(1)
(2)
Only R24 and C16 interconnects cross the M-RAM block boundaries.
The right-facing M-RAM block has interface blocks on the right side, but none on the left. B1 to B6 and A1 to A6
orientation is clipped across the vertical axis for right-facing M-RAM blocks.
2–40
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Figure 2–22. M-RAM Row Unit Interface to Interconnect
C4 and C8 Interconnects
R4 and R8 Interconnects
M-RAM Block
LAB
10
Direct Link
Interconnects
Up to 24
addressa
addressb
renwe_a
renwe_b
byteenaA[ ]
byteenaB[ ]
clocken_a
clocken_b
clock_a
clock_b
aclr_a
aclr_b
Row Interface Block
M-RAM Block to
LAB Row Interface
Block Interconnect Region
Altera Corporation
July 2005
2–41
Stratix Device Handbook, Volume 1
TriMatrix Memory
Figure 2–23. M-RAM Column Unit Interface to Interconnect
C4 and C8 Interconnects
LAB
LAB
LAB
M-RAM Block to
LAB Row Interface
Block Interconnect
Region
Column Interface
Block
12
12
datain
dataout
M-RAM Block
2–42
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Table 2–12 shows the input and output data signal connections for the
column units (B1 to B6 and A1 to A6). It also shows the address and
control signal input connections to the row units (R1 to R11).
Table 2–12. M-RAM Row & Column Interface Unit Signals
Altera Corporation
July 2005
Unit Interface Block
Input SIgnals
R1
addressa[7..0]
R2
addressa[15..8]
R3
byte_enable_a[7..0]
renwe_a
R4
-
R5
-
R6
clock_a
clocken_a
clock_b
clocken_b
R7
-
R8
-
R9
byte_enable_b[7..0]
renwe_b
R10
addressb[15..8]
Output Signals
R11
addressb[7..0]
B1
datain_b[71..60]
dataout_b[71..60]
B2
datain_b[59..48]
dataout_b[59..48]
B3
datain_b[47..36]
dataout_b[47..36]
B4
datain_b[35..24]
dataout_b[35..24]
B5
datain_b[23..12]
dataout_b[23..12]
B6
datain_b[11..0]
dataout_b[11..0]
A1
datain_a[71..60]
dataout_a[71..60]
A2
datain_a[59..48]
dataout_a[59..48]
A3
datain_a[47..36]
dataout_a[47..36]
A4
datain_a[35..24]
dataout_a[35..24]
A5
datain_a[23..12]
dataout_a[23..12]
A6
datain_a[11..0]
dataout_a[11..0]
2–43
Stratix Device Handbook, Volume 1
TriMatrix Memory
Independent Clock Mode
The memory blocks implement independent clock mode for true dualport memory. In this mode, a separate clock is available for each port
(ports A and B). Clock A controls all registers on the port A side, while
clock B controls all registers on the port B side. Each port, A and B, also
supports independent clock enables and asynchronous clear signals for
port A and B registers. Figure 2–24 shows a TriMatrix memory block in
independent clock mode.
2–44
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
(1)
(2)
Altera Corporation
July 2005
clockA
clkenA
wrenA
addressA[ ]
byteenaA[ ]
dataA[ ]
8
ENA
D
ENA
D
ENA
D
ENA
D
8 LAB Row Clocks
Q
Q
Q
Q
Write
Pulse
Generator
Q
Data Out
Write/Read
Enable
Address A
qA[ ]
B
Data In
qB[ ]
Q
D
ENA
Data Out
Write/Read
Enable
Address B
Byte Enable B
Memory Block
256 ´ 16 (2)
512 ´ 8
1,024 ´ 4
2,048 ´ 2
4,096 ´ 1
Byte Enable A
ENA
D
A
Data In
Write
Pulse
Generator
Q
Q
Q
Q
D
ENA
D
ENA
D
ENA
D
ENA
8
clockB
clkenB
wrenB
addressB[ ]
byteenaB[ ]
dataB[ ]
Stratix Architecture
Figure 2–24. Independent Clock Mode Notes (1), (2)
Notes to Figure 2–24
All registers shown have asynchronous clear ports.
Violating the setup or hold time on the address registers could corrupt the memory
contents. This applies to both read and write operations.
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Stratix Device Handbook, Volume 1
TriMatrix Memory
Input/Output Clock Mode
Input/output clock mode can be implemented for both the true and
simple dual-port memory modes. On each of the two ports, A or B, one
clock controls all registers for inputs into the memory block: data input,
wren, and address. The other clock controls the block’s data output
registers. Each memory block port, A or B, also supports independent
clock enables and asynchronous clear signals for input and output
registers. Figures 2–25 and 2–26 show the memory block in input/output
clock mode.
2–46
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
(1)
(2)
Altera Corporation
July 2005
clockA
clkenA
wrenA
addressA[ ]
byteenaA[ ]
dataA[ ]
8
ENA
D
ENA
D
ENA
D
ENA
D
8 LAB Row Clocks
Q
Q
Q
Q
Write
Pulse
Generator
Q
Data Out
Write/Read
Enable
Address A
ENA
D
A
qA[ ]
Data In
B
qB[ ]
Q
D
ENA
Data Out
Write/Read
Enable
Address B
Byte Enable B
Memory Block
256 × 16 (2)
512 × 8
1,024 × 4
2,048 × 2
4,096 × 1
Byte Enable A
Data In
Write
Pulse
Generator
Q
Q
Q
Q
ENA
D
ENA
D
ENA
D
ENA
D
8
clockB
clkenB
wrenB
addressB[ ]
byteenaB[ ]
dataB[ ]
Stratix Architecture
Figure 2–25. Input/Output Clock Mode in True Dual-Port Mode Notes (1), (2)
Notes to Figure 2–25:
All registers shown have asynchronous clear ports.
Violating the setup or hold time on the address registers could corrupt the memory
contents. This applies to both read and write operations.
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Stratix Device Handbook, Volume 1
TriMatrix Memory
Figure 2–26. Input/Output Clock Mode in Simple Dual-Port Mode Notes (1), (2)
8 LAB Row
Clocks
Memory Block
256 ´ 16
Data In
512 ´ 8
1,024 ´ 4
2,048 ´ 2
4,096 ´ 1
8
data[ ]
D
Q
ENA
address[ ]
D
Q
ENA
Read Address
Data Out
byteena[ ]
D
Q
ENA
Byte Enable
wraddress[ ]
D
Q
ENA
Write Address
D
Q
ENA
Read Enable
D
Q
ENA
To MultiTrack
Interconnect
rden
wren
outclken
inclken
wrclock
D
Q
ENA
Write
Pulse
Generator
Write Enable
rdclock
Notes to Figure 2–26:
(1)
(2)
All registers shown except the rden register have asynchronous clear ports.
Violating the setup or hold time on the address registers could corrupt the memory contents. This applies to both
read and write operations.
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Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Read/Write Clock Mode
The memory blocks implement read/write clock mode for simple dualport memory. You can use up to two clocks in this mode. The write clock
controls the block’s data inputs, wraddress, and wren. The read clock
controls the data output, rdaddress, and rden. The memory blocks
support independent clock enables for each clock and asynchronous clear
signals for the read- and write-side registers. Figure 2–27 shows a
memory block in read/write clock mode.
Altera Corporation
July 2005
2–49
Stratix Device Handbook, Volume 1
TriMatrix Memory
Figure 2–27. Read/Write Clock Mode in Simple Dual-Port Mode Notes (1), (2)
8 LAB Row
Clocks
Memory Block
256 × 16
512 × 8
1,024 × 4
Data In
2,048 × 2
4,096 × 1
8
data[ ]
D
Q
ENA
Data Out
address[ ]
D
Q
ENA
Read Address
wraddress[ ]
D
Q
ENA
Write Address
byteena[ ]
D
Q
ENA
Byte Enable
D
Q
ENA
Read Enable
D
Q
ENA
To MultiTrack
Interconnect
rden
wren
outclken
inclken
wrclock
D
Q
ENA
Write
Pulse
Generator
Write Enable
rdclock
Notes to Figure 2–27:
(1)
(2)
All registers shown except the rden register have asynchronous clear ports.
Violating the setup or hold time on the address registers could corrupt the memory contents. This applies to both
read and write operations.
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Altera Corporation
July 2005
Stratix Architecture
Single-Port Mode
The memory blocks also support single-port mode, used when
simultaneous reads and writes are not required. See Figure 2–28. A single
block in a memory block can support up to two single-port mode RAM
blocks in the M4K RAM blocks if each RAM block is less than or equal to
2K bits in size.
Figure 2–28. Single-Port Mode Note (1)
8 LAB Row
Clocks
RAM/ROM
256 × 16
512 × 8
1,024 × 4
Data In
2,048 × 2
4,096 × 1
8
data[ ]
D
Q
ENA
Data Out
address[ ]
D
Q
ENA
Address
D
Q
ENA
To MultiTrack
Interconnect
wren
Write Enable
outclken
inclken
inclock
D
Q
ENA
Write
Pulse
Generator
outclock
Note to Figure 2–28:
(1)
Violating the setup or hold time on the address registers could corrupt the memory contents. This applies to both
read and write operations.
Altera Corporation
July 2005
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Stratix Device Handbook, Volume 1
Digital Signal Processing Block
Digital Signal
Processing
Block
The most commonly used DSP functions are finite impulse response (FIR)
filters, complex FIR filters, infinite impulse response (IIR) filters, fast
Fourier transform (FFT) functions, direct cosine transform (DCT)
functions, and correlators. All of these blocks have the same fundamental
building block: the multiplier. Additionally, some applications need
specialized operations such as multiply-add and multiply-accumulate
operations. Stratix devices provide DSP blocks to meet the arithmetic
requirements of these functions.
Each Stratix device has two columns of DSP blocks to efficiently
implement DSP functions faster than LE-based implementations. Larger
Stratix devices have more DSP blocks per column (see Table 2–13). Each
DSP block can be configured to support up to:
■
■
■
Eight 9 × 9-bit multipliers
Four 18 × 18-bit multipliers
One 36 × 36-bit multiplier
As indicated, the Stratix DSP block can support one 36 × 36-bit multiplier
in a single DSP block. This is true for any matched sign multiplications
(either unsigned by unsigned or signed by signed), but the capabilities for
dynamic and mixed sign multiplications are handled differently. The
following list provides the largest functions that can fit into a single DSP
block.
■
■
■
■
■
■
■
■
■
■
36 × 36-bit unsigned by unsigned multiplication
36 × 36-bit signed by signed multiplication
35 × 36-bit unsigned by signed multiplication
36 × 35-bit signed by unsigned multiplication
36 × 35-bit signed by dynamic sign multiplication
35 × 36-bit dynamic sign by signed multiplication
35 × 36-bit unsigned by dynamic sign multiplication
36 × 35-bit dynamic sign by unsigned multiplication
35 × 35-bit dynamic sign multiplication when the sign controls for
each operand are different
36 × 36-bit dynamic sign multiplication when the same sign control
is used for both operands
1
This list only shows functions that can fit into a single DSP block.
Multiple DSP blocks can support larger multiplication
functions.
Figure 2–29 shows one of the columns with surrounding LAB rows.
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July 2005
Stratix Architecture
Figure 2–29. DSP Blocks Arranged in Columns
DSP Block
Column
8 LAB
Rows
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July 2005
DSP Block
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Table 2–13 shows the number of DSP blocks in each Stratix device.
Table 2–13. DSP Blocks in Stratix Devices Notes (1), (2)
DSP Blocks
Total 9 × 9
Multipliers
Total 18 × 18
Multipliers
Total 36 × 36
Multipliers
EP1S10
6
48
24
6
EP1S20
10
80
40
10
EP1S25
10
80
40
10
Device
EP1S30
12
96
48
12
EP1S40
14
112
56
14
EP1S60
18
144
72
18
EP1S80
22
176
88
22
Notes to Table 2–13:
(1)
(2)
Each device has either the number of 9 × 9-, 18 × 18-, or 36 × 36-bit multipliers
shown. The total number of multipliers for each device is not the sum of all the
multipliers.
The number of supported multiply functions shown is based on signed/signed
or unsigned/unsigned implementations.
DSP block multipliers can optionally feed an adder/subtractor or
accumulator within the block depending on the configuration. This
makes routing to LEs easier, saves LE routing resources, and increases
performance, because all connections and blocks are within the DSP
block. Additionally, the DSP block input registers can efficiently
implement shift registers for FIR filter applications.
Figure 2–30 shows the top-level diagram of the DSP block configured for
18 × 18-bit multiplier mode. Figure 2–31 shows the 9 × 9-bit multiplier
configuration of the DSP block.
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Stratix Architecture
Figure 2–30. DSP Block Diagram for 18 × 18-Bit Configuration
Optional Serial Shift Register
Inputs from Previous
DSP Block
Multiplier Stage
D
Optional Stage Configurable
as Accumulator or Dynamic
Adder/Subtractor
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Output Selection
Multiplexer
Q
ENA
CLRN
Adder/
Subtractor/
Accumulator
1
D
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Q
ENA
CLRN
Summation
D
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Q
Summation Stage
for Adding Four
Multipliers Together
Optional Output
Register Stage
ENA
CLRN
Adder/
Subtractor/
Accumulator
2
D
Optional Serial
Shift Register
Outputs to
Next DSP Block
in the Column
Q
ENA
CLRN
D
D
ENA
CLRN
Q
ENA
CLRN
Altera Corporation
July 2005
Q
Optional Pipeline
Register Stage
Optional Input Register
Stage with Parallel Input or
Shift Register Configuration
to MultiTrack
Interconnect
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Figure 2–31. DSP Block Diagram for 9 × 9-Bit Configuration
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
Adder/
Subtractor/
1a
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
CLRN
Summation
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
Adder/
Subtractor/
1b
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
Output
Selection
Multiplexer
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
D
Q
ENA
CLRN
Adder/
Subtractor/
2a
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
CLRN
Summation
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
Adder/
Subtractor/
2b
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
CLRN
To MultiTrack
Interconnect
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Stratix Architecture
The DSP block consists of the following elements:
■
■
Multiplier block
Adder/output block
Multiplier Block
The DSP block multiplier block consists of the input registers, a
multiplier, and pipeline register for pipelining multiply-accumulate and
multiply-add/subtract functions as shown in Figure 2–32.
Figure 2–32. Multiplier Sub-Block within Stratix DSP Block
sign_a (1)
sign_b (1)
aclr[3..0]
clock[3..0]
ena[3..0]
shiftin A
shiftin B
D
Data A
Q
ENA
CLRN
D
ENA
Q
CLRN
D
Data B
Q
ENA
Result
to Adder
blocks
Optional
Multiply-Accumulate
and Multiply-Add
Pipeline
CLRN
shiftout B
shiftout A
Note to Figure 2–32:
(1)
These signals can be unregistered or registered once to match data path pipelines if required.
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Input Registers
A bank of optional input registers is located at the input of each multiplier
and multiplicand inputs to the multiplier. When these registers are
configured for parallel data inputs, they are driven by regular routing
resources. You can use a clock signal, asynchronous clear signal, and a
clock enable signal to independently control each set of A and B inputs for
each multiplier in the DSP block. You select these control signals from a
set of four different clock[3..0], aclr[3..0], and ena[3..0]
signals that drive the entire DSP block.
You can also configure the input registers for a shift register application.
In this case, the input registers feed the multiplier and drive two
dedicated shift output lines: shiftoutA and shiftoutB. The shift
outputs of one multiplier block directly feed the adjacent multiplier block
in the same DSP block (or the next DSP block) as shown in Figure 2–33, to
form a shift register chain. This chain can terminate in any block, that is,
you can create any length of shift register chain up to 224 registers. You
can use the input shift registers for FIR filter applications. One set of shift
inputs can provide data for a filter, and the other are coefficients that are
optionally loaded in serial or parallel. When implementing 9 × 9- and
18 × 18-bit multipliers, you do not need to implement external shift
registers in LAB LEs. You implement all the filter circuitry within the DSP
block and its routing resources, saving LE and general routing resources
for general logic. External registers are needed for shift register inputs
when using 36 × 36-bit multipliers.
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Stratix Architecture
Figure 2–33. Multiplier Sub-Blocks Using Input Shift Register Connections
Note (1)
Data A
D
Q
ENA
A[n] × B[n]
CLRN
D
Data B
Q
D
ENA
Q
CLRN
ENA
CLRN
Data B
Data A
D
Q
ENA
A[n Ð 1] × B[n Ð 1]
CLRN
D
Q
D
ENA
Q
CLRN
ENA
CLRN
Data B
Data A
D
Q
ENA
A[n Ð 2] × B[n Ð 2]
CLRN
D
Q
D
ENA
Q
CLRN
ENA
CLRN
Note to Figure 2–33:
(1)
Altera Corporation
July 2005
Either Data A or Data B input can be set to a parallel input for constant coefficient
multiplication.
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Table 2–14 shows the summary of input register modes for the DSP block.
Table 2–14. Input Register Modes
Register Input Mode
9×9
18 × 18
36 × 36
Parallel input
v
v
v
Shift register input
v
v
Multiplier
The multiplier supports 9 × 9-, 18 × 18-, or 36 × 36-bit multiplication. Each
DSP block supports eight possible 9 × 9-bit or smaller multipliers. There
are four multiplier blocks available for multipliers larger than 9 × 9 bits
but smaller than 18 × 18 bits. There is one multiplier block available for
multipliers larger than 18 × 18 bits but smaller than or equal to 36 × 36
bits. The ability to have several small multipliers is useful in applications
such as video processing. Large multipliers greater than 18 × 18 bits are
useful for applications such as the mantissa multiplication of a singleprecision floating-point number.
The multiplier operands can be signed or unsigned numbers, where the
result is signed if either input is signed as shown in Table 2–15. The
sign_a and sign_b signals provide dynamic control of each operand’s
representation: a logic 1 indicates the operand is a signed number, a logic
0 indicates the operand is an unsigned number. These sign signals affect
all multipliers and adders within a single DSP block and you can register
them to match the data path pipeline. The multipliers are full precision
(that is, 18 bits for the 18-bit multiply, 36-bits for the 36-bit multiply, and
so on) regardless of whether sign_a or sign_b set the operands as
signed or unsigned numbers.
Table 2–15. Multiplier Signed Representation
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Data A
Data B
Result
Unsigned
Unsigned
Unsigned
Unsigned
Signed
Signed
Signed
Unsigned
Signed
Signed
Signed
Signed
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July 2005
Stratix Architecture
Pipeline/Post Multiply Register
The output of 9 × 9- or 18 × 18-bit multipliers can optionally feed a register
to pipeline multiply-accumulate and multiply-add/subtract functions.
For 36 × 36-bit multipliers, this register will pipeline the multiplier
function.
Adder/Output Blocks
The result of the multiplier sub-blocks are sent to the adder/output block
which consist of an adder/subtractor/accumulator unit, summation unit,
output select multiplexer, and output registers. The results are used to
configure the adder/output block as a pure output, accumulator, a simple
two-multiplier adder, four-multiplier adder, or final stage of the 36-bit
multiplier. You can configure the adder/output block to use output
registers in any mode, and must use output registers for the accumulator.
The system cannot use adder/output blocks independently of the
multiplier. Figure 2–34 shows the adder and output stages.
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Figure 2–34. Adder/Output Blocks Note (1)
Accumulator Feedback
accum_sload0 (2)
Result A
addnsub1 (2)
overflow0
Adder/
Subtractor/
Accumulator1
Output Selection
Multiplexer
Result B
signa (2)
Summation
Output
Register Block
signb (2)
Result C
addnsub3 (2)
Adder/
Subtractor/
Accumulator2
overflow1
Result D
accum_sload1 (2)
Accumulator Feedback
Notes to Figure 2–34:
(1)
(2)
Adder/output block shown in Figure 2–34 is in 18 × 18-bit mode. In 9 × 9-bit mode, there are four adder/subtractor
blocks and two summation blocks.
These signals are either not registered, registered once, or registered twice to match the data path pipeline.
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Stratix Architecture
Adder/Subtractor/Accumulator
The adder/subtractor/accumulator is the first level of the adder/output
block and can be used as an accumulator or as an adder/subtractor.
Adder/Subtractor
Each adder/subtractor/accumulator block can perform addition or
subtraction using the addnsub independent control signal for each firstlevel adder in 18 × 18-bit mode. There are two addnsub[1..0] signals
available in a DSP block for any configuration. For 9 × 9-bit mode, one
addnsub[1..0] signal controls the top two one-level adders and
another addnsub[1..0] signal controls the bottom two one-level
adders. A high addnsub signal indicates addition, and a low signal
indicates subtraction. The addnsub control signal can be unregistered or
registered once or twice when feeding the adder blocks to match data
path pipelines.
The signa and signb signals serve the same function as the multiplier
block signa and signb signals. The only difference is that these signals
can be registered up to two times. These signals are tied to the same
signa and signb signals from the multiplier and must be connected to
the same clocks and control signals.
Accumulator
When configured for accumulation, the adder/output block output feeds
back to the accumulator as shown in Figure 2–34. The
accum_sload[1..0] signal synchronously loads the multiplier result
to the accumulator output. This signal can be unregistered or registered
once or twice. Additionally, the overflow signal indicates the
accumulator has overflowed or underflowed in accumulation mode. This
signal is always registered and must be externally latched in LEs if the
design requires a latched overflow signal.
Summation
The output of the adder/subtractor/accumulator block feeds to an
optional summation block. This block sums the outputs of the DSP block
multipliers. In 9 × 9-bit mode, there are two summation blocks providing
the sums of two sets of four 9 × 9-bit multipliers. In 18 × 18-bit mode, there
is one summation providing the sum of one set of four 18 × 18-bit
multipliers.
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Output Selection Multiplexer
The outputs from the various elements of the adder/output block are
routed through an output selection multiplexer. Based on the DSP block
operational mode and user settings, the multiplexer selects whether the
output from the multiplier, the adder/subtractor/accumulator, or
summation block feeds to the output.
Output Registers
Optional output registers for the DSP block outputs are controlled by four
sets of control signals: clock[3..0], aclr[3..0], and ena[3..0].
Output registers can be used in any mode.
Modes of Operation
The adder, subtractor, and accumulate functions of a DSP block have four
modes of operation:
■
■
■
■
Simple multiplier
Multiply-accumulator
Two-multipliers adder
Four-multipliers adder
1
Each DSP block can only support one mode. Mixed modes in the
same DSP block is not supported.
Simple Multiplier Mode
In simple multiplier mode, the DSP block drives the multiplier sub-block
result directly to the output with or without an output register. Up to four
18 × 18-bit multipliers or eight 9 × 9-bit multipliers can drive their results
directly out of one DSP block. See Figure 2–35.
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Stratix Architecture
Figure 2–35. Simple Multiplier Mode
signa (1)
signb (1)
aclr
clock
ena
shiftin A
shiftin B
D
Data A
Q
Data Out
ENA
CLRN
D
ENA
Q
D
ENA
Q
CLRN
CLRN
D
Data B
Q
ENA
CLRN
shiftout B
shiftout A
Note to Figure 2–35:
(1)
These signals are not registered or registered once to match the data path pipeline.
DSP blocks can also implement one 36 × 36-bit multiplier in multiplier
mode. DSP blocks use four 18 × 18-bit multipliers combined with
dedicated adder and internal shift circuitry to achieve 36-bit
multiplication. The input shift register feature is not available for the
36 × 36-bit multiplier. In 36 × 36-bit mode, the device can use the register
that is normally a multiplier-result-output register as a pipeline stage for
the 36 × 36-bit multiplier. Figure 2–36 shows the 36 × 36-bit multiply
mode.
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Figure 2–36. 36 × 36 Multiply Mode
signa (1)
signb (1)
aclr
clock
ena
A[17..0]
D
Q
ENA
CLRN
D
Q
ENA
CLRN
B[17..0]
D
Q
ENA
CLRN
A[35..18]
D
Q
CLRN
D
Q
ENA
36 × 36
Multiplier
Adder
CLRN
B[35..18]
D
Data Out
D
Q
ENA
ENA
CLRN
Q
signa (2)
ENA
signb (2)
CLRN
A[35..18]
D
Q
ENA
CLRN
D
Q
ENA
CLRN
B[17..0]
D
Q
ENA
CLRN
A[17..0]
D
Q
ENA
CLRN
D
Q
ENA
CLRN
B[35..18]
D
Q
ENA
CLRN
Notes to Figure 2–36:
(1)
(2)
These signals are not registered or registered once to match the pipeline.
These signals are not registered, registered once, or registered twice for latency to match the pipeline.
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Stratix Architecture
Multiply-Accumulator Mode
In multiply-accumulator mode (see Figure 2–37), the DSP block drives
multiplied results to the adder/subtractor/accumulator block configured
as an accumulator. You can implement one or two multiply-accumulators
up to 18 × 18 bits in one DSP block. The first and third multiplier subblocks are unused in this mode, because only one multiplier can feed one
of two accumulators. The multiply-accumulator output can be up to 52
bits—a maximum of a 36-bit result with 16 bits of accumulation. The
accum_sload and overflow signals are only available in this mode.
The addnsub signal can set the accumulator for decimation and the
overflow signal indicates underflow condition.
Figure 2–37. Multiply-Accumulate Mode
signa (1)
signb (1)
aclr
clock
ena
Shiftin A
Shiftin B
D
Data A
Q
ENA
CLRN
D
Q
ENA
Accumulator
D
Q
ENA
Data Out
CLRN
CLRN
D
Data B
Q
overflow
ENA
CLRN
Shiftout B Shiftout A
addnsub (2)
signa (2)
signb (2)
accum_sload (2)
Notes to Figure 2–37:
(1)
(2)
These signals are not registered or registered once to match the data path pipeline.
These signals are not registered, registered once, or registered twice for latency to match the data path pipeline.
Two-Multipliers Adder Mode
The two-multipliers adder mode uses the adder/subtractor/accumulator
block to add or subtract the outputs of the multiplier block, which is
useful for applications such as FFT functions and complex FIR filters. A
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single DSP block can implement two sums or differences from two
18 × 18-bit multipliers each or four sums or differences from two 9 × 9-bit
multipliers each.
You can use the two-multipliers adder mode for complex multiplications,
which are written as:
(a + jb) × (c + jd) = [(a × c) – (b × d)] + j × [(a × d) + (b × c)]
The two-multipliers adder mode allows a single DSP block to calculate
the real part [(a × c) – (b × d)] using one subtractor and the imaginary part
[(a × d) + (b × c)] using one adder, for data widths up to 18 bits. Two
complex multiplications are possible for data widths up to 9 bits using
four adder/subtractor/accumulator blocks. Figure 2–38 shows an 18-bit
two-multipliers adder.
Figure 2–38. Two-Multipliers Adder Mode Implementing Complex Multiply
18
DSP Block
18
A
36
18
18
C
18
37
(A × C) − (B × D)
(Real Part)
Subtractor
18
B
36
18
18
D
18
A
36
18
D
37
Adder
18
B
(A × D) + (B × C)
(Imaginary Part)
36
18
C
Four-Multipliers Adder Mode
In the four-multipliers adder mode, the DSP block adds the results of two
first -stage adder/subtractor blocks. One sum of four 18 × 18-bit
multipliers or two different sums of two sets of four 9 × 9-bit multipliers
can be implemented in a single DSP block. The product width for each
multiplier must be the same size. The four-multipliers adder mode is
useful for FIR filter applications. Figure 2–39 shows the four multipliers
adder mode.
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Stratix Architecture
Figure 2–39. Four-Multipliers Adder Mode
signa (1)
signb (1)
aclr
clock
ena
shiftin A
shiftin B
D
Data A
Q
ENA
CLRN
D
ENA
Q
Adder/Subtractor
CLRN
D
Data B
Q
ENA
CLRN
D
Data A
Q
D
ENA
ENA
CLRN
D
ENA
Q
CLRN
D
Data B
Q
addnsub1 (2)
signa (2)
signb (2)
Q
Data Out
Summation
CLRN
addnsub3 (2)
ENA
CLRN
D
Data A
Q
ENA
CLRN
D
ENA
Q
Adder/Subtractor
CLRN
D
Data B
Q
ENA
CLRN
D
Data A
Q
ENA
CLRN
D
ENA
Q
CLRN
D
Data B
Q
ENA
CLRN
shiftout B
shiftout A
Notes to Figure 2–39:
(1)
(2)
These signals are not registered or registered once to match the data path pipeline.
These signals are not registered, registered once, or registered twice for latency to match the data path pipeline.
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For FIR filters, the DSP block combines the four-multipliers adder mode
with the shift register inputs. One set of shift inputs contains the filter
data, while the other holds the coefficients loaded in serial or parallel. The
input shift register eliminates the need for shift registers external to the
DSP block (i.e., implemented in LEs). This architecture simplifies filter
design since the DSP block implements all of the filter circuitry.
One DSP block can implement an entire 18-bit FIR filter with up to four
taps. For FIR filters larger than four taps, DSP blocks can be cascaded with
additional adder stages implemented in LEs.
Table 2–16 shows the different number of multipliers possible in each
DSP block mode according to size. These modes allow the DSP blocks to
implement numerous applications for DSP including FFTs, complex FIR,
FIR, and 2D FIR filters, equalizers, IIR, correlators, matrix multiplication
and many other functions.
Table 2–16. Multiplier Size & Configurations per DSP block
DSP Block Mode
9×9
18 × 18
36 × 36 (1)
Multiplier
Eight multipliers with
eight product outputs
Four multipliers with four
product outputs
One multiplier with one
product output
Multiply-accumulator
Two multiply and
accumulate (52 bits)
Two multiply and
accumulate (52 bits)
–
Two-multipliers adder
Four sums of two
multiplier products each
Two sums of two
multiplier products each
–
Four-multipliers adder
Two sums of four
multiplier products each
One sum of four multiplier
products each
–
Note to Table 2–16:
(1)
The number of supported multiply functions shown is based on signed/signed or unsigned/unsigned
implementations.
DSP Block Interface
Stratix device DSP block outputs can cascade down within the same DSP
block column. Dedicated connections between DSP blocks provide fast
connections between the shift register inputs to cascade the shift register
chains. You can cascade DSP blocks for 9 × 9- or 18 × 18-bit FIR filters
larger than four taps, with additional adder stages implemented in LEs.
If the DSP block is configured as 36 × 36 bits, the adder, subtractor, or
accumulator stages are implemented in LEs. Each DSP block can route the
shift register chain out of the block to cascade two full columns of DSP
blocks.
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Stratix Architecture
The DSP block is divided into eight block units that interface with eight
LAB rows on the left and right. Each block unit can be considered half of
an 18 × 18-bit multiplier sub-block with 18 inputs and 18 outputs. A local
interconnect region is associated with each DSP block. Like an LAB, this
interconnect region can be fed with 10 direct link interconnects from the
LAB to the left or right of the DSP block in the same row. All row and
column routing resources can access the DSP block’s local interconnect
region. The outputs also work similarly to LAB outputs as well. Nine
outputs from the DSP block can drive to the left LAB through direct link
interconnects and nine can drive to the right LAB though direct link
interconnects. All 18 outputs can drive to all types of row and column
routing. Outputs can drive right- or left-column routing. Figures 2–40
and 2–41 show the DSP block interfaces to LAB rows.
Figure 2–40. DSP Block Interconnect Interface
DSP Block
MultiTrack
Interconnect
OA[17..0]
MultiTrack
Interconnect
A1[17..0]
OB[17..0]
B1[17..0]
OC[17..0]
A2[17..0]
OD[17..0]
B2[17..0]
OE[17..0]
A3[17..0]
OF[17..0]
B3[17..0]
OG[17..0]
A4[17..0]
OH[17..0]
B4[17..0]
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Figure 2–41. DSP Block Interface to Interconnect
C4 and C8
Interconnects
Direct Link Interconnect
from Adjacent LAB
R4 and R8 Interconnects
Nine Direct Link Outputs
to Adjacent LABs
Direct Link Interconnect
from Adjacent LAB
18
DSP Block
Row Structure
LAB
10
LAB
9
9
10
3
Control
18
18
[17..0]
[17..0]
Row Interface
Block
DSP Block to
LAB Row Interface
Block Interconnect Region
18 Inputs per Row
18 Outputs per Row
A bus of 18 control signals feeds the entire DSP block. These signals
include clock[0..3] clocks, aclr[0..3] asynchronous clears,
ena[1..4] clock enables, signa, signb signed/unsigned control
signals, addnsub1 and addnsub3 addition and subtraction control
signals, and accum_sload[0..1] accumulator synchronous loads. The
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clock signals are routed from LAB row clocks and are generated from
specific LAB rows at the DSP block interface. The LAB row source for
control signals, data inputs, and outputs is shown in Table 2–17.
Table 2–17. DSP Block Signal Sources & Destinations
LAB Row at
Interface
PLLs & Clock
Networks
Control Signals
Generated
Data Inputs
Data Outputs
1
signa
A1[17..0]
OA[17..0]
2
aclr0
accum_sload0
B1[17..0]
OB[17..0]
3
addnsub1
clock0
ena0
A2[17..0]
OC[17..0]
4
aclr1
clock1
ena1
B2[17..0]
OD[17..0]
5
aclr2
clock2
ena2
A3[17..0]
OE[17..0]
6
sign_b
clock3
ena3
B3[17..0]
OF[17..0]
7
clear3
accum_sload1
A4[17..0]
OG[17..0]
8
addnsub3
B4[17..0]
OH[17..0]
Stratix devices provide a hierarchical clock structure and multiple PLLs
with advanced features. The large number of clocking resources in
combination with the clock synthesis precision provided by enhanced
and fast PLLs provides a complete clock management solution.
Global & Hierarchical Clocking
Stratix devices provide 16 dedicated global clock networks, 16 regional
clock networks (four per device quadrant), and 8 dedicated fast regional
clock networks (for EP1S10, EP1S20, and EP1S25 devices), and
16 dedicated fast regional clock networks (for EP1S30 EP1S40, and
EP1S60, and EP1S80 devices). These clocks are organized into a
hierarchical clock structure that allows for up to 22 clocks per device
region with low skew and delay. This hierarchical clocking scheme
provides up to 48 unique clock domains within Stratix devices.
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There are 16 dedicated clock pins (CLK[15..0]) to drive either the global
or regional clock networks. Four clock pins drive each side of the device,
as shown in Figure 2–42. Enhanced and fast PLL outputs can also drive
the global and regional clock networks.
Global Clock Network
These clocks drive throughout the entire device, feeding all device
quadrants. The global clock networks can be used as clock sources for all
resources within the device—IOEs, LEs, DSP blocks, and all memory
blocks. These resources can also be used for control signals, such as clock
enables and synchronous or asynchronous clears fed from the external
pin. The global clock networks can also be driven by internal logic for
internally generated global clocks and asynchronous clears, clock
enables, or other control signals with large fanout. Figure 2–42 shows the
16 dedicated CLK pins driving global clock networks.
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Figure 2–42. Global Clocking Note (1)
CLK[15..12]
Global Clock [15..0]
CLK[3..0]
Global Clock [15..0]
CLK[11..8]
CLK[7..4]
Note to Figure 2–42:
(1)
The corner fast PLLs can also be driven through the global or regional clock
networks. The global or regional clock input to the fast PLL can be driven by an
output from another PLL, a pin-driven global or regional clock, or internallygenerated global signals.
Regional Clock Network
There are four regional clock networks within each quadrant of the Stratix
device that are driven by the same dedicated CLK[15..0] input pins or
from PLL outputs. From a top view of the silicon, RCLK[0..3] are in the
top left quadrant, RCLK[8..11] are in the top-right quadrant,
RCLK[4..7] are in the bottom-left quadrant, and RCLK[12..15] are in
the bottom-right quadrant. The regional clock networks only pertain to
the quadrant they drive into. The regional clock networks provide the
lowest clock delay and skew for logic contained within a single quadrant.
RCLK cannot be driven by internal logic. The CLK clock pins
symmetrically drive the RCLK networks within a particular quadrant, as
shown in Figure 2–43. See Figures 2–50 and 2–51 for RCLK connections
from PLLs and CLK pins.
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Figure 2–43. Regional Clocks
RCLK[2..3]
RCLK[11..10]
CLK[15..12]
RCLK[9..8]
RCLK[1..0]
CLK[3..0]
CLK[11..8]
RCLK[14..15]
RCLK[4..5]
CLK[7..4]
Regional Clocks Only Drive a Device
Quadrant from Specified CLK Pins or
PLLs within that Quadrant
RCLK[6..7]
RCLK[12..13]
Fast Regional Clock Network
In EP1S25, EP1S20, and EP1S10 devices, there are two fast regional clock
networks, FCLK[1..0], within each quadrant, fed by input pins that can
connect to fast regional clock networks (see Figure 2–44). In EP1S30 and
larger devices, there are two fast regional clock networks within each
half-quadrant (see Figure 2–45). Dual-purpose FCLK pins drive the fast
clock networks. All devices have eight FCLK pins to drive fast regional
clock networks. Any I/O pin can drive a clock or control signal onto any
fast regional clock network with the addition of a delay. This signal is
driven via the I/O interconnect. The fast regional clock networks can also
be driven from internal logic elements.
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Figure 2–44. EP1S25, EP1S20 & EP1S10 Device Fast Clock Pin Connections to
Fast Regional Clocks
FCLK[1..0]
FCLK[7..6]
2
(1), (2)
2
(1), (2)
2
2
FCLK[1..0]
FCLK[1..0]
FCLK[1..0]
FCLK[1..0]
2
(1), (2)
2
(1), (2)
2
FCLK[3..2]
2
FCLK[5..4]
Notes to Figure 2–44:
(1)
(2)
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July 2005
This is a set of two multiplexers.
In addition to the FCLK pin inputs, there is also an input from the I/O interconnect.
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Figure 2–45. EP1S30 Device Fast Regional Clock Pin Connections to Fast
Regional Clocks
FCLK1
FCLK0
(1), (2)
FCLK7
FCLK6
(1), (2)
(1), (2)
(1), (2)
fclk[1..0]
(1), (2)
(1), (2)
(1), (2)
FCLK3
FCLK2
(1), (2)
FCLK5
FCLK4
Notes to Figure 2–45:
(1)
(2)
This is a set of two multiplexers.
In addition to the FCLK pin inputs, there is also an input from the I/O interconnect.
Combined Resources
Within each region, there are 22 distinct dedicated clocking resources
consisting of 16 global clock lines, four regional clock lines, and two fast
regional clock lines. Multiplexers are used with these clocks to form eight
bit busses to drive LAB row clocks, column IOE clocks, or row IOE clocks.
Another multiplexer is used at the LAB level to select two of the eight row
clocks to feed the LE registers within the LAB. See Figure 2–46.
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Figure 2–46. Regional Clock Bus
Clocks Available
to a Quadrant
or Half-Quadrant
Vertical I/O Cell
IO_CLK[7..0]
Global Clock Network [15..0]
Regional Clock Network [3..0]
Clock [21..0]
Lab Row Clock [7..0]
Fast Regional Clock Network [1..0]
Horizontal I/O
Cell IO_CLK[7..0]
IOE clocks have horizontal and vertical block regions that are clocked by
eight I/O clock signals chosen from the 22 quadrant or half-quadrant
clock resources. Figures 2–47 and 2–48 show the quadrant and halfquadrant relationship to the I/O clock regions, respectively. The vertical
regions (column pins) have less clock delay than the horizontal regions
(row pins).
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Figure 2–47. EP1S10, EP1S20 & EP1S25 Device I/O Clock Groups
IO_CLKA[7..0]
IO_CLKB[7..0]
8
8
I/O Clock Regions
8
22 Clocks in
the Quadrant
22 Clocks in
the Quadrant
IO_CLKH[7..0]
IO_CLKC[7..0]
8
8
IO_CLKG[7..0]
IO_CLKD[7..0]
22 Clocks in
the Quadrant
22 Clocks in
the Quadrant
8
8
8
IO_CLKF[7..0]
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Figure 2–48. EP1S30, EP1S40, EP1S60, EP1S80 Device I/O Clock Groups
IO_CLKA[7:0]
IO_CLKB[7:0]
8
IO_CLKC[7:0]
8
IO_CLKD[7:0]
8
8
I/O Clock Regions
8
8
IO_CLKE[7:0]
IO_CLKP[7:0]
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
8
8
IO_CLKF[7:0]
IO_CLKO[7:0]
8
8
IO_CLKN[7:0]
IO_CLKG[7:0]
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
8
8
IO_CLKH[7:0]
IO_CLKM[7:0]
8
8
IO_CLKL[7:0]
8
IO_CLKK[7:0]
8
IO_CLKJ[7:0]
IO_CLKI[7:0]
You can use the Quartus II software to control whether a clock input pin
is either global, regional, or fast regional. The Quartus II software
automatically selects the clocking resources if not specified.
Enhanced & Fast PLLs
Stratix devices provide robust clock management and synthesis using up
to four enhanced PLLs and eight fast PLLs. These PLLs increase
performance and provide advanced clock interfacing and clockfrequency synthesis. With features such as clock switchover, spread
spectrum clocking, programmable bandwidth, phase and delay control,
and PLL reconfiguration, the Stratix device’s enhanced PLLs provide you
with complete control of your clocks and system timing. The fast PLLs
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provide general purpose clocking with multiplication and phase shifting
as well as high-speed outputs for high-speed differential I/O support.
Enhanced and fast PLLs work together with the Stratix high-speed I/O
and advanced clock architecture to provide significant improvements in
system performance and bandwidth.
The Quartus II software enables the PLLs and their features without
requiring any external devices. Table 2–18 shows the PLLs available for
each Stratix device.
Table 2–18. Stratix Device PLL Availability
Fast PLLs
Enhanced PLLs
Device
1
2
3
4
EP1S10
v
v
v
EP1S20
v
v
EP1S25
v
v
EP1S30
v
v
5(1)
6(1)
v
v
v
v
v
v
v
v
v
v
7
8
9
10
v
v
v
v (3)
v (3)
v (3)
v (3)
v
v
v (3)
v (3)
v (3)
v
v
11(2)
12(2)
EP1S40
v
v
v
v
v (3)
EP1S60
v
v
v
v
v
v
v
v
v
v
v
v
EP1S80
v
v
v
v
v
v
v
v
v
v
v
v
v(3) v(3)
Notes to Table 2–18:
(1)
(2)
(3)
PLLs 5 and 6 each have eight single-ended outputs or four differential outputs.
PLLs 11 and 12 each have one single-ended output.
EP1S30 and EP1S40 devices do not support these PLLs in the 780-pin FineLine BGA® package.
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Table 2–19 shows the enhanced PLL and fast PLL features in Stratix
devices.
Table 2–19. Stratix PLL Features
Feature
Enhanced PLL
Fast PLL
Clock multiplication and division
m/(n × post-scale counter) (1)
m/(post-scale counter) (2)
Phase shift
Down to 156.25-ps increments (3), (4)
Down to 125-ps increments (3), (4)
Delay shift
250-ps increments for ±3 ns
Clock switchover
v
PLL reconfiguration
v
Programmable bandwidth
v
Spread spectrum clocking
v
Programmable duty cycle
v
v
Number of internal clock outputs
6
3 (5)
Number of external clock outputs
Four differential/eight singled-ended
or one single-ended (6)
(7)
Number of feedback clock inputs
2 (8)
Notes to Table 2–19:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
For enhanced PLLs, m, n, range from 1 to 512 and post-scale counters g, l, e range from 1 to 1024 with 50% duty
cycle. With a non-50% duty cycle the post-scale counters g, l, e range from 1 to 512.
For fast PLLs, m and post-scale counters range from 1 to 32.
The smallest phase shift is determined by the voltage controlled oscillator (VCO) period divided by 8.
For degree increments, Stratix devices can shift all output frequencies in increments of at least 45° . Smaller degree
increments are possible depending on the frequency and divide parameters.
PLLs 7, 8, 9, and 10 have two output ports per PLL. PLLs 1, 2, 3, and 4 have three output ports per PLL.
Every Stratix device has two enhanced PLLs (PLLs 5 and 6) with either eight single-ended outputs or four
differential outputs each. Two additional enhanced PLLs (PLLs 11 and 12) in EP1S80, EP1S60, and EP1S40 devices
each have one single-ended output. Devices in the 780 pin FineLine BGA packages do not support PLLs 11 and 12.
Fast PLLs can drive to any I/O pin as an external clock. For high-speed differential I/O pins, the device uses a data
channel to generate txclkout.
Every Stratix device has two enhanced PLLs with one single-ended or differential external feedback input per PLL.
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Figure 2–49 shows a top-level diagram of the Stratix device and PLL
floorplan.
Figure 2–49. PLL Locations
CLK[15..12]
5
11
FPLL7CLK
7
10
FPLL10CLK
CLK[3..0]
1
2
4
3
CLK[8..11]
8
9
FPLL9CLK
PLLs
FPLL8CLK
6
12
CLK[7..4]
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Figure 2–50 shows the global and regional clocking from the PLL outputs
and the CLK pins.
Figure 2–50. Global & Regional Clock Connections from Side Pins & Fast PLL Outputs Note (1), (2)
RCLK1
RCLK0
FPLL7CLK
G1
G0
G3
G2
G8
G9
G10
G11
RCLK9
RCLK8
l0
l0
PLL 7 l1
CLK0
CLK1
l1 PLL 10
g0
g0
l0
l0
PLL 1 l1
l1 PLL 4
g0
CLK2
CLK3
CLK10
CLK11
g0
l02
PLL 2 l1
g0
2l0
l1 PLL 3
g0
l0
FPLL8CLK
FPLL10CLK
CLK8
CLK9
l0
PLL 8 l1
g0
l1 PLL 9
g0
RCLK4
RCLK5
Regional
Clocks
FPLL9CLK
RCLK14
Global
Clocks
RCLK15
Regional
Clocks
Notes to Figure 2–50:
(1)
(2)
PLLs 1 to 4 and 7 to 10 are fast PLLs. PLLs 5, 6, 11, and 12 are enhanced PLLs.
The global or regional clocks in a fast PLL’s quadrant can drive the fast PLL input. A pin or other PLL must drive
the global or regional source. The source cannot be driven by internally generated logic before driving the fast PLL.
Figure 2–51 shows the global and regional clocking from enhanced PLL
outputs and top CLK pins.
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Figure 2–51. Global & Regional Clock Connections from Top Clock Pins & Enhanced PLL Outputs Note (1)
PLL5_OUT[3..0] CLK14 (1)
PLL5_FB
CLK15 (2)
CLK12 (1)
CLK13 (2)
E[0..3]
PLL 5
PLL 11
L0 L1 G0 G1 G2 G3
G0 G1 G2 G3 L0 L1
PLL11_OUT
RCLK10
RCLK11
Regional
Clocks
RCLK2
RCLK3
G12
G13
G14
G15
Global
Clocks
Regional
Clocks
G4
G5
G6
G7
RCLK6
RCLK7
RCLK12
RCLK13
PLL12_OUT
L0 L1 G0 G1 G2 G3
G0 G1 G2 G3 L0 L1
PLL 6
PLL6_OUT[3..0]
PLL 12
PLL6_FB
CLK4 (1)
CLK6 (1)
CLK7 (2)
CLK5 (2)
Notes to Figure 2–51:
(1)
(2)
(3)
(4)
PLLs 1 to 4 and 7 to 10 are fast PLLs. PLLs 5, 6, 11, and 12 are enhanced PLLs.
CLK4, CLK6, CLK12, and CLK14 feed the corresponding PLL’s inclk0 port.
CLK5, CLK7, CLK13, and CLK15 feed the corresponding PLL’s inclk1 port.
The EP1S40 device in the 780-pin FineLine BGA package does not support PLLs 11 and 12.
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Enhanced PLLs
Stratix devices contain up to four enhanced PLLs with advanced clock
management features. Figure 2–52 shows a diagram of the enhanced PLL.
Figure 2–52. Stratix Enhanced PLL
Programmable
Time Delay on
Each PLL Port
Post-Scale
Counters
VCO Phase Selection
Selectable at Each
PLL Output Port
From Adjacent PLL
/l0
Δt
/l1
Δt
Regional
Clocks
Clock
Switch-Over
Circuitry
Spread
Spectrum
Phase Frequency
Detector
INCLK0
4
Δt
/n
PFD
Charge
Pump
8
Loop
Filter
VCO
INCLK1
(1)
FBIN
Δt
/m
/g0
Δt
/g1
Δt
/g2
Δt
/g3
Δt
Global
Clocks
I/O buffers (2)
To I/O buffers or general
routing
Lock Detect
& Filter
VCO Phase Selection
Affecting All Outputs
/e0
Δt
/e1
Δt
/e2
Δt
/e3
Δt
4
I/O Buffers (3)
Notes to Figure 2–52:
(1)
(2)
(3)
(4)
External feedback is available in PLLs 5 and 6.
This single-ended external output is available from the g0 counter for PLLs 11 and 12.
These four counters and external outputs are available in PLLs 5 and 6.
This connection is only available on EP1S40 and larger Stratix devices. For example, PLLs 5 and 11 are adjacent and
PLLs 6 and 12 are adjacent. The EP1S40 device in the 780-pin FineLine BGA package does not support PLLs 11
and 12.
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Clock Multiplication & Division
Each Stratix device enhanced PLL provides clock synthesis for PLL
output ports using m/(n × post-scale counter) scaling factors. The input
clock is divided by a pre-scale divider, n, and is then multiplied by the m
feedback factor. The control loop drives the VCO to match fIN × (m/n).
Each output port has a unique post-scale counter that divides down the
high-frequency VCO. For multiple PLL outputs with different
frequencies, the VCO is set to the least common multiple of the output
frequencies that meets its frequency specifications. Then, the post-scale
dividers scale down the output frequency for each output port. For
example, if output frequencies required from one PLL are 33 and 66 MHz,
set the VCO to 330 MHz (the least common multiple in the VCO’s range).
There is one pre-scale counter, n, and one multiply counter, m, per PLL,
with a range of 1 to 512 on each. There are two post-scale counters (l) for
regional clock output ports, four counters (g) for global clock output
ports, and up to four counters (e) for external clock outputs, all ranging
from 1 to 1024 with a 50% duty cycle setting. The post-scale counters
range from 1 to 512 with any non-50% duty cycle setting. The Quartus II
software automatically chooses the appropriate scaling factors according
to the input frequency, multiplication, and division values entered.
Clock Switchover
To effectively develop high-reliability network systems, clocking schemes
must support multiple clocks to provide redundancy. For this reason,
Stratix device enhanced PLLs support a flexible clock switchover
capability. Figure 2–53 shows a block diagram of the switchover
circuit.The switchover circuit is configurable, so you can define how to
implement it. Clock-sense circuitry automatically switches from the
primary to secondary clock for PLL reference when the primary clock
signal is not present.
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Figure 2–53. Clock Switchover Circuitry
CLK0_BAD
CLK1_BAD
Active Clock
SMCLKSW
Clock
Sense
Switch-Over
State Machine
CLKLOSS
CLKSWITCH
Δt
INCLK0
MUXOUT
INCLK1
n Counter
PFD
FBCLK
Enhanced PLL
There are two possible ways to use the clock switchover feature.
■
■
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Use automatic switchover circuitry for switching between inputs of
the same frequency. For example, in applications that require a
redundant clock with the same frequency as the primary clock, the
switchover state machine generates a signal that controls the
multiplexer select input on the bottom of Figure 2–53. In this case, the
secondary clock becomes the reference clock for the PLL.
Use the clkswitch input for user- or system-controlled switch
conditions. This is possible for same-frequency switchover or to
switch between inputs of different frequencies. For example, if
inclk0 is 66 MHz and inclk1 is 100 MHz, you must control the
switchover because the automatic clock-sense circuitry cannot
monitor primary and secondary clock frequencies with a frequency
difference of more than ±20%. This feature is useful when clock
sources can originate from multiple cards on the backplane,
requiring a system-controlled switchover between frequencies of
operation. You can use clkswitch together with the lock signal to
trigger the switch from a clock that is running but becomes unstable
and cannot be locked onto.
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During switchover, the PLL VCO continues to run and will either slow
down or speed up, generating frequency drift on the PLL outputs. The
clock switchover transitions without any glitches. After the switch, there
is a finite resynchronization period to lock onto new clock as the VCO
ramps up. The exact amount of time it takes for the PLL to relock relates
to the PLL configuration and may be adjusted by using the
programmable bandwidth feature of the PLL. The specification for the
maximum time to relock is 100 µs.
f
For more information on clock switchover, see AN 313, Implementing
Clock Switchover in Stratix & Stratix GX Devices.
PLL Reconfiguration
The PLL reconfiguration feature enables system logic to change Stratix
device enhanced PLL counters and delay elements without reloading a
Programmer Object File (.pof). This provides considerable flexibility for
frequency synthesis, allowing real-time PLL frequency and output clock
delay variation. You can sweep the PLL output frequencies and clock
delay in prototype environments. The PLL reconfiguration feature can
also dynamically or intelligently control system clock speeds or tCO
delays in end systems.
Clock delay elements at each PLL output port implement variable delay.
Figure 2–54 shows a diagram of the overall dynamic PLL control feature
for the counters and the clock delay elements. The configuration time is
less than 20 μs for the enhanced PLL using a input shift clock rate of
22 MHz. The charge pump, loop filter components, and phase shifting
using VCO phase taps cannot be dynamically adjusted.
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Figure 2–54. Dynamically Programmable Counters & Delays in Stratix Device Enhanced PLLs
Counters and Clock
Delay Settings are
Programmable
fREF
Δt
÷n
All Output Counters and
Clock Delay Settings can
be Programmed Dynamically
PFD
Charge
Pump
Loop
Filter
VCO
÷g
Δt
÷l
Δt
÷e
Δt
scandata
scanclk
÷m
Δt
scanaclr
PLL reconfiguration data is shifted into serial registers from the logic
array or external devices. The PLL input shift data uses a reference input
shift clock. Once the last bit of the serial chain is clocked in, the register
chain is synchronously loaded into the PLL configuration bits. The shift
circuitry also provides an asynchronous clear for the serial registers.
f
For more information on PLL reconfiguration, see AN 282: Implementing
PLL Reconfiguration in Stratix & Stratix GX Devices.
Programmable Bandwidth
You have advanced control of the PLL bandwidth using the
programmable control of the PLL loop characteristics, including loop
filter and charge pump. The PLL’s bandwidth is a measure of its ability to
track the input clock and jitter. A high-bandwidth PLL can quickly lock
onto a reference clock and react to any changes in the clock. It also will
allow a wide band of input jitter spectrum to pass to the output. A lowbandwidth PLL will take longer to lock, but it will attenuate all highfrequency jitter components. The Quartus II software can adjust PLL
characteristics to achieve the desired bandwidth. The programmable
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bandwidth is tuned by varying the charge pump current, loop filter
resistor value, high frequency capacitor value, and m counter value. You
can manually adjust these values if desired. Bandwidth is programmable
from 200 kHz to 1.5 MHz.
External Clock Outputs
Enhanced PLLs 5 and 6 each support up to eight single-ended clock
outputs (or four differential pairs). Differential SSTL and HSTL outputs
are implemented using 2 single-ended output buffers which are
programmed to have opposite polarity. In Quartus II software, simply
assign the appropriate differential I/O standard and the software will
implement the inversion. See Figure 2–55.
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Figure 2–55. External Clock Outputs for PLLs 5 & 6
From IOE (1), (2)
pll_out0p (3), (4)
(3)
e0 Counter
From IOE (1)
From IOE (1)
pll_out0n (3), (4)
pll_out1p (3), (4)
e1 Counter
4
From IOE (1)
From IOE (1)
pll_out1n (3), (4)
pll_out2p (3), (4)
e2 Counter
pll_out2n (3), (4)
From IOE (1)
From IOE (1)
pll_out3p (3), (4)
e3 Counter
From IOE (1)
pll_out3n (3), (4)
Notes to Figure 2–55:
(1)
(2)
(3)
(4)
The design can use each external clock output pin as a general-purpose output pin from the logic array. These pins
are multiplexed with IOE outputs.
Two single-ended outputs are possible per output counter⎯either two outputs of the same frequency and phase or
one shifted 180° .
EP1S10, EP1S20, and EP1S25 devices in 672-pin BGA and 484- and 672-pin FineLine BGA packages only have two
pairs of external clocks (i.e., pll_out0p, pll_out0n, pll_out1p, and pll_out1n).
Differential SSTL and HSTL outputs are implemented using two single-ended output buffers, which are
programmed to have opposite polarity.
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Any of the four external output counters can drive the single-ended or
differential clock outputs for PLLs 5 and 6. This means one counter or
frequency can drive all output pins available from PLL 5 or PLL 6. Each
pair of output pins (four pins total) has dedicated VCC and GND pins to
reduce the output clock’s overall jitter by providing improved isolation
from switching I/O pins.
For PLLs 5 and 6, each pin of a single-ended output pair can either be in
phase or 180° out of phase. The clock output pin pairs support the same
I/O standards as standard output pins (in the top and bottom banks) as
well as LVDS, LVPECL, 3.3-V PCML, HyperTransport technology,
differential HSTL, and differential SSTL. Table 2–20 shows which I/O
standards the enhanced PLL clock pins support. When in single-ended or
differential mode, the two outputs operate off the same power supply.
Both outputs use the same standards in single-ended mode to maintain
performance. You can also use the external clock output pins as user
output pins if external enhanced PLL clocking is not needed.
Table 2–20. I/O Standards Supported for Enhanced PLL Pins (Part 1 of 2)
Input
Output
I/O Standard
INCLK
FBIN
PLLENABLE
EXTCLK
LVTTL
v
v
v
v
LVCMOS
v
v
v
v
2.5 V
v
v
v
1.8 V
v
v
v
1.5 V
v
v
v
3.3-V PCI
v
v
v
3.3-V PCI-X 1.0
v
v
v
LVPECL
v
v
v
3.3-V PCML
v
v
v
LVDS
v
v
v
HyperTransport technology
v
v
v
Differential HSTL
v
v
v
Differential SSTL
3.3-V GTL
v
v
v
3.3-V GTL+
v
v
v
1.5-V HSTL Class I
v
v
v
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Stratix Architecture
Table 2–20. I/O Standards Supported for Enhanced PLL Pins (Part 2 of 2)
Input
Output
I/O Standard
INCLK
FBIN
PLLENABLE
EXTCLK
1.5-V HSTL Class II
v
v
v
1.8-V HSTL Class I
v
v
v
1.8-V HSTL Class II
v
v
v
SSTL-18 Class I
v
v
v
SSTL-18 Class II
v
v
v
SSTL-2 Class I
v
v
v
SSTL-2 Class II
v
v
v
SSTL-3 Class I
v
v
v
SSTL-3 Class II
v
v
v
AGP (1× and 2× )
v
v
v
CTT
v
v
v
Enhanced PLLs 11 and 12 support one single-ended output each (see
Figure 2–56). These outputs do not have their own VCC and GND signals.
Therefore, to minimize jitter, do not place switching I/O pins next to this
output pin.
Figure 2–56. External Clock Outputs for Enhanced PLLs 11 & 12
g0
Counter
CLK13n, I/O, PLL11_OUT
or CLK6n, I/O, PLL12_OUT (1)
From Internal
Logic or IOE
Note to Figure 2–56:
(1)
For PLL 11, this pin is CLK13n; for PLL 12 this pin is CLK7n.
Stratix devices can drive any enhanced PLL driven through the global
clock or regional clock network to any general I/O pin as an external
output clock. The jitter on the output clock is not guaranteed for these
cases.
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Clock Feedback
The following four feedback modes in Stratix device enhanced PLLs
allow multiplication and/or phase and delay shifting:
■
Zero delay buffer: The external clock output pin is phase-aligned
with the clock input pin for zero delay. Altera recommends using the
same I/O standard on the input clock and the output clocks for
optimum performance.
■
External feedback: The external feedback input pin, FBIN, is phasealigned with the clock input, CLK, pin. Aligning these clocks allows
you to remove clock delay and skew between devices. This mode is
only possible for PLLs 5 and 6. PLLs 5 and 6 each support feedback
for one of the dedicated external outputs, either one single-ended or
one differential pair. In this mode, one e counter feeds back to the PLL
FBIN input, becoming part of the feedback loop. Altera recommends
using the same I/O standard on the input clock, the FBIN pin, and
the output clocks for optimum performance.
■
Normal mode: If an internal clock is used in this mode, it is phasealigned to the input clock pin. The external clock output pin will
have a phase delay relative to the clock input pin if connected in this
mode. You define which internal clock output from the PLL should
be phase-aligned to the internal clock pin.
■
No compensation: In this mode, the PLL will not compensate for any
clock networks or external clock outputs.
Phase & Delay Shifting
Stratix device enhanced PLLs provide advanced programmable phase
and clock delay shifting. These parameters are set in the Quartus II
software.
Phase Delay
The Quartus II software automatically sets the phase taps and counter
settings according to the phase shift entry. You enter a desired phase shift
and the Quartus II software automatically sets the closest setting
achievable. This type of phase shift is not reconfigurable during system
operation. For phase shifting, enter a phase shift (in degrees or time units)
for each PLL clock output port or for all outputs together in one shift. You
can select phase-shifting values in time units with a resolution of 156.25
to 416.66 ps. This resolution is a function of frequency input and the
multiplication and division factors (that is, it is a function of the VCO
period), with the finest step being equal to an eighth (×0.125) of the VCO
period. Each clock output counter can choose a different phase of the
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Stratix Architecture
VCO period from up to eight taps for individual fine step selection. Also,
each clock output counter can use a unique initial count setting to achieve
individual coarse shift selection in steps of one VCO period. The
combination of coarse and fine shifts allows phase shifting for the entire
input clock period.
The equation to determine the precision of the phase shifting in degrees
is: 45° ÷ post-scale counter value. Therefore, the maximum step size is
45° , and smaller steps are possible depending on the multiplication and
division ratio necessary on the output counter port.
This type of phase shift provides the highest precision since it is the least
sensitive to process, supply, and temperature variation.
Clock Delay
In addition to the phase shift feature, the ability to fine tune the Δt clock
delay provides advanced time delay shift control on each of the four PLL
outputs. There are time delays for each post-scale counter (e, g, or l) from
the PLL, the n counter, and m counter. Each of these can shift in 250-ps
increments for a range of 3.0 ns. The m delay shifts all outputs earlier in
time, while n delay shifts all outputs later in time. Individual delays on
post-scale counters (e, g, and l) provide positive delay for each output.
Table 2–21 shows the combined delay for each output for normal or zero
delay buffer mode where Δte, Δtg, or Δtl is unique for each PLL output.
The tOUTPUT for a single output can range from –3 ns to +6 ns. The total
delay shift difference between any two PLL outputs, however, must be
less than ±3 ns. For example, shifts on two outputs of –1 and +2 ns is
allowed, but not –1 and +2.5 ns because these shifts would result in a
difference of 3.5 ns. If the design uses external feedback, the Δte delay will
remove delay from outputs, represented by a negative sign (see
Table 2–21). This effect occurs because the Δte delay is then part of the
feedback loop.
Table 2–21. Output Clock Delay for Enhanced PLLs
Normal or Zero Delay Buffer Mode
ΔteOUTPUT = Δtn −Δtm + Δte
ΔtgOUTPUT = Δtn −Δtm + Δtg
ΔtlOUTPUT = Δtn −Δtm + Δtl
External Feedback Mode
ΔteOUTPUT = Δtn −Δtm −Δte (1)
ΔtgOUTPUT = Δtn −Δtm + Δtg
ΔtlOUTPUT = Δtn −Δtm + Δtl
Note to Table 2–21:
(1)
Altera Corporation
July 2005
Δte removes delay from outputs in external feedback mode.
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PLLs & Clock Networks
The variation due to process, voltage, and temperature is about ±15% on
the delay settings. PLL reconfiguration can control the clock delay shift
elements, but not the VCO phase shift multiplexers, during system
operation.
Spread-Spectrum Clocking
Stratix device enhanced PLLs use spread-spectrum technology to reduce
electromagnetic interference generation from a system by distributing the
energy over a broader frequency range. The enhanced PLL typically
provides 0.5% down spread modulation using a triangular profile. The
modulation frequency is programmable. Enabling spread-spectrum for a
PLL affects all of its outputs.
Lock Detect
The lock output indicates that there is a stable clock output signal in
phase with the reference clock. Without any additional circuitry, the lock
signal may toggle as the PLL begins tracking the reference clock. You may
need to gate the lock signal for use as a system control. The lock signal
from the locked port can drive the logic array or an output pin.
Whenever the PLL loses lock (for example, inclk jitter, clock switchover,
PLL reconfiguration, power supply noise, and so on), the PLL must be
reset with the areset signal to guarantee correct phase relationship
between the PLL output clocks. If the phase relationship between the
input clock versus output clock, and between different output clocks
from the PLL is not important in the design, then the PLL need not be
reset.
f
See the Stratix FPGA Errata Sheet for more information on implementing
the gated lock signal in a design.
Programmable Duty Cycle
The programmable duty cycle allows enhanced PLLs to generate clock
outputs with a variable duty cycle. This feature is supported on each
enhanced PLL post-scale counter (g0..g3, l0..l3, e0..e3). The duty cycle
setting is achieved by a low and high time count setting for the post-scale
dividers. The Quartus II software uses the frequency input and the
required multiply or divide rate to determine the duty cycle choices.
Advanced Clear & Enable Control
There are several control signals for clearing and enabling PLLs and their
outputs. You can use these signals to control PLL resynchronization and
gate PLL output clocks for low-power applications.
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The pllenable pin is a dedicated pin that enables/disables PLLs. When
the pllenable pin is low, the clock output ports are driven by GND and
all the PLLs go out of lock. When the pllenable pin goes high again, the
PLLs relock and resynchronize to the input clocks. You can choose which
PLLs are controlled by the pllenable signal by connecting the
pllenable input port of the altpll megafunction to the common
pllenable input pin.
The areset signals are reset/resynchronization inputs for each PLL. The
areset signal should be asserted every time the PLL loses lock to
guarantee correct phase relationship between the PLL output clocks.
Users should include the areset signal in designs if any of the following
conditions are true:
■
■
PLL Reconfiguration or Clock switchover enables in the design.
Phase relationships between output clocks need to be maintained
after a loss of lock condition
The device input pins or logic elements (LEs) can drive these input
signals. When driven high, the PLL counters will reset, clearing the PLL
output and placing the PLL out of lock. The VCO will set back to its
nominal setting (~700 MHz). When driven low again, the PLL will
resynchronize to its input as it relocks. If the target VCO frequency is
below this nominal frequency, then the output frequency will start at a
higher value than desired as the PLL locks. If the system cannot tolerate
this, the clkena signal can disable the output clocks until the PLL locks.
The pfdena signals control the phase frequency detector (PFD) output
with a programmable gate. If you disable the PFD, the VCO operates at
its last set value of control voltage and frequency with some long-term
drift to a lower frequency. The system continues running when the PLL
goes out of lock or the input clock is disabled. By maintaining the last
locked frequency, the system has time to store its current settings before
shutting down. You can either use your own control signal or a clkloss
status signal to trigger pfdena.
The clkena signals control the enhanced PLL regional and global
outputs. Each regional and global output port has its own clkena signal.
The clkena signals synchronously disable or enable the clock at the PLL
output port by gating the outputs of the g and l counters. The clkena
signals are registered on the falling edge of the counter output clock to
enable or disable the clock without glitches. Figure 2–57 shows the
waveform example for a PLL clock port enable. The PLL can remain
locked independent of the clkena signals since the loop-related counters
are not affected. This feature is useful for applications that require a low
power or sleep mode. Upon re-enabling, the PLL does not need a
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PLLs & Clock Networks
resynchronization or relock period. The clkena signal can also disable
clock outputs if the system is not tolerant to frequency overshoot during
resynchronization.
The extclkena signals work in the same way as the clkena signals, but
they control the external clock output counters (e0, e1, e2, and e3). Upon
re-enabling, the PLL does not need a resynchronization or relock period
unless the PLL is using external feedback mode. In order to lock in
external feedback mode, the external output must drive the board trace
back to the FBIN pin.
Figure 2–57. extclkena Signals
COUNTER
OUTPUT
CLKENA
CLKOUT
Fast PLLs
Stratix devices contain up to eight fast PLLs with high-speed serial
interfacing ability, along with general-purpose features. Figure 2–58
shows a diagram of the fast PLL.
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Stratix Architecture
Figure 2–58. Stratix Device Fast PLL
Post-Scale
Counters
diffioclk1 (2)
÷l0
VCO Phase Selection
Selectable at each PLL
Output Port
Global or
regional clock (1)
Clock
Input
Phase
Frequency
Detector
Global or
regional clock
txload_en (3)
rxload_en (3)
÷l1
Global or
regional clock
diffioclk2 (2)
PFD
Charge
Pump
8
Loop
Filter
VCO
÷g0
Global or
regional clock
÷m
Notes to Figure 2–58:
(1)
(2)
(3)
The global or regional clock input can be driven by an output from another PLL or any dedicated CLK or FCLK pin.
It cannot be driven by internally-generated global signals.
In high-speed differential I/O support mode, this high-speed PLL clock feeds the SERDES. Stratix devices only
support one rate of data transfer per fast PLL in high-speed differential I/O support mode.
This signal is a high-speed differential I/O support SERDES control signal.
Clock Multiplication & Division
Stratix device fast PLLs provide clock synthesis for PLL output ports
using m/(post scaler) scaling factors. The input clock is multiplied by the
m feedback factor. Each output port has a unique post scale counter to
divide down the high-frequency VCO. There is one multiply divider, m,
per fast PLL with a range of 1 to 32. There are two post scale L dividers
for regional and/or LVDS interface clocks, and g0 counter for global clock
output port; all range from 1 to 32.
In the case of a high-speed differential interface, set the output counter to
1 to allow the high-speed VCO frequency to drive the SERDES. When
used for clocking the SERDES, the m counter can range from 1 to 30. The
VCO frequency is equal to fIN×m, where VCO frequency must be between
300 and 1000 MHz.
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External Clock Inputs
Each fast PLL supports single-ended or differential inputs for source
synchronous transmitters or for general-purpose use. Sourcesynchronous receivers support differential clock inputs. The fast PLL
inputs are fed by CLK[0..3], CLK[8..11], and FPLL[7..10]CLK
pins, as shown in Figure 2–50 on page 2–85.
Table 2–22 shows the I/O standards supported by fast PLL input pins.
Table 2–22. Fast PLL Port I/O Standards (Part 1 of 2)
Input
I/O Standard
INCLK
PLLENABLE
LVTTL
v
v
LVCMOS
v
v
2.5 V
v
1.8 V
v
1.5 V
v
3.3-V PCI
3.3-V PCI-X 1.0
LVPECL
v
3.3-V PCML
v
LVDS
v
HyperTransport technology
v
Differential HSTL
v
Differential SSTL
3.3-V GTL
3.3-V GTL+
v
1.5-V HSTL Class I
v
1.5-V HSTL Class II
1.8-V HSTL Class I
v
1.8-V HSTL Class II
SSTL-18 Class I
v
SSTL-18 Class II
SSTL-2 Class I
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Table 2–22. Fast PLL Port I/O Standards (Part 2 of 2)
Input
I/O Standard
INCLK
SSTL-2 Class II
v
SSTL-3 Class I
v
SSTL-3 Class II
v
PLLENABLE
AGP (1× and 2× )
v
CTT
Table 2–23 shows the performance on each of the fast PLL clock inputs
when using LVDS, LVPECL, 3.3-V PCML, or HyperTransport technology.
Table 2–23. LVDS Performance on Fast PLL Input
Fast PLL Clock Input
CLK0, CLK2, CLK9, CLK11,
FPLL7CLK, FPLL8CLK, FPLL9CLK,
FPLL10CLK
CLK1, CLK3, CLK8, CLK10
Maximum Input Frequency (MHz)
717(1)
645
Note to Table 2–23:
(1)
See the chapter DC & Switching Characteristics of the Stratix Device Handbook,
Volume 1 for more information.
External Clock Outputs
Each fast PLL supports differential or single-ended outputs for sourcesynchronous transmitters or for general-purpose external clocks. There
are no dedicated external clock output pins. Any I/O pin can be driven
by the fast PLL global or regional outputs as an external output pin. The
I/O standards supported by any particular bank determines what
standards are possible for an external clock output driven by the fast PLL
in that bank.
Phase Shifting
Stratix device fast PLLs have advanced clock shift capability that enables
programmable phase shifts. You can enter a phase shift (in degrees or
time units) for each PLL clock output port or for all outputs together in
one shift. You can perform phase shifting in time units with a resolution
range of 125 to 416.66 ps. This resolution is a function of the VCO period,
with the finest step being equal to an eighth (×0.125) of the VCO period.
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I/O Structure
Control Signals
The fast PLL has the same lock output, pllenable input, and areset
input control signals as the enhanced PLL.
If the input clock stops and causes the PLL to lose lock, then the PLL must
be reset for correct phase shift operation.
For more information on high-speed differential I/O support, see “HighSpeed Differential I/O Support” on page 2–130.
I/O Structure
IOEs provide many features, including:
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Dedicated differential and single-ended I/O buffers
3.3-V, 64-bit, 66-MHz PCI compliance
3.3-V, 64-bit, 133-MHz PCI-X 1.0 compliance
Joint Test Action Group (JTAG) boundary-scan test (BST) support
Differential on-chip termination for LVDS I/O standard
Programmable pull-up during configuration
Output drive strength control
Slew-rate control
Tri-state buffers
Bus-hold circuitry
Programmable pull-up resistors
Programmable input and output delays
Open-drain outputs
DQ and DQS I/O pins
Double-data rate (DDR) Registers
The IOE in Stratix devices contains a bidirectional I/O buffer, six
registers, and a latch for a complete embedded bidirectional single data
rate or DDR transfer. Figure 2–59 shows the Stratix IOE structure. The
IOE contains two input registers (plus a latch), two output registers, and
two output enable registers. The design can use both input registers and
the latch to capture DDR input and both output registers to drive DDR
outputs. Additionally, the design can use the output enable (OE) register
for fast clock-to-output enable timing. The negative edge-clocked OE
register is used for DDR SDRAM interfacing. The Quartus II software
automatically duplicates a single OE register that controls multiple
output or bidirectional pins.
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Stratix Architecture
Figure 2–59. Stratix IOE Structure
Logic Array
OE Register
D
OE
Q
OE Register
D
Q
Output Register
Output A
D
Q
CLK
Output Register
Output B
D
Q
Input Register
D
Q
Input A
Input B
Input Register
D
Q
Input Latch
D
Q
ENA
The IOEs are located in I/O blocks around the periphery of the Stratix
device. There are up to four IOEs per row I/O block and six IOEs per
column I/O block. The row I/O blocks drive row, column, or direct link
interconnects. The column I/O blocks drive column interconnects.
Figure 2–60 shows how a row I/O block connects to the logic array.
Figure 2–61 shows how a column I/O block connects to the logic array.
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Figure 2–60. Row I/O Block Connection to the Interconnect
R4, R8 & R24
Interconnects
C4, C8 & C16
Interconnects
I/O Interconnect
I/O Block Local
Interconnect
16 Control Signals
from I/O Interconnect (1)
16
28 Data & Control
Signals from
Logic Array (2)
28
LAB
Horizontal
I/O Block
io_dataouta[3..0]
io_dataoutb[3..0]
Direct Link
Interconnect
to Adjacent LAB
Direct Link
Interconnect
to Adjacent LAB
io_clk[7:0]
LAB Local
Interconnect
Horizontal I/O
Block Contains
up to Four IOEs
Notes to Figure 2–60:
(1)
(2)
The 16 control signals are composed of four output enables io_boe[3..0], four clock enables io_bce[3..0],
four clocks io_clk[3..0], and four clear signals io_bclr[3..0].
The 28 data and control signals consist of eight data out lines: four lines each for DDR applications
io_dataouta[3..0] and io_dataoutb[3..0], four output enables io_coe[3..0], four input clock enables
io_cce_in[3..0], four output clock enables io_cce_out[3..0], four clocks io_cclk[3..0], and four clear
signals io_cclr[3..0].
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Figure 2–61. Column I/O Block Connection to the Interconnect
42 Data &
Control Signals
from Logic Array (2)
16 Control
Signals from I/O
Interconnect (1)
Vertical I/O
Block Contains
up to Six IOEs
Vertical I/O Block
16
42
io_clk[7..0]
IO_datain[3:0]
I/O Block
Local Interconnect
I/O Interconnect
R4, R8 & R24
Interconnects
LAB
LAB Local
Interconnect
LAB
LAB
C4, C8 & C16
Interconnects
Notes to Figure 2–61:
(1)
(2)
The 16 control signals are composed of four output enables io_boe[3..0], four clock enables io_bce[3..0],
four clocks io_bclk[3..0], and four clear signals io_bclr[3..0].
The 42 data and control signals consist of 12 data out lines; six lines each for DDR applications
io_dataouta[5..0] and io_dataoutb[5..0], six output enables io_coe[5..0], six input clock enables
io_cce_in[5..0], six output clock enables io_cce_out[5..0], six clocks io_cclk[5..0], and six clear
signals io_cclr[5..0].
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I/O Structure
Stratix devices have an I/O interconnect similar to the R4 and C4
interconnect to drive high-fanout signals to and from the I/O blocks.
There are 16 signals that drive into the I/O blocks composed of four
output enables io_boe[3..0], four clock enables io_bce[3..0], four
clocks io_bclk[3..0], and four clear signals io_bclr[3..0]. The
pin’s datain signals can drive the IO interconnect, which in turn drives
the logic array or other I/O blocks. In addition, the control and data
signals can be driven from the logic array, providing a slower but more
flexible routing resource. The row or column IOE clocks, io_clk[7..0],
provide a dedicated routing resource for low-skew, high-speed clocks.
I/O clocks are generated from regional, global, or fast regional clocks (see
“PLLs & Clock Networks” on page 2–73). Figure 2–62 illustrates the
signal paths through the I/O block.
Figure 2–62. Signal Path through the I/O Block
Row or Column
io_clk[7..0]
io_boe[3..0]
From I/O
Interconnect
To Other
IOEs
io_bce[3..0]
io_bclk[3..0]
io_bclr[3..0]
To Logic
Array
io_datain0
io_datain1
oe
ce_in
ce_out
io_coe
io_cce_in
Control
Signal
Selection
aclr/apreset
IOE
sclr/spreset
io_cce_out
From Logic
Array
clk_in
io_cclr
clk_out
io_cclk
io_dataout0
io_dataout1
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Each IOE contains its own control signal selection for the following
control signals: oe, ce_in, ce_out, aclr/preset, sclr/preset,
clk_in, and clk_out. Figure 2–63 illustrates the control signal
selection.
Figure 2–63. Control Signal Selection per IOE
io_bclk[3..0]
io_bce[3..0]
io_bclr[3..0]
io_boe[3..0]
Dedicated I/O
Clock [7..0]
I/O Interconnect
[15..0]
Local
Interconnect
io_coe
Local
Interconnect
io_cclr
Local
Interconnect
io_cce_out
Local
Interconnect
io_cce_in
Local
Interconnect
io_cclk
ce_out
clk_out
clk_in
ce_in
sclr/preset
aclr/preset
oe
In normal bidirectional operation, the input register can be used for input
data requiring fast setup times. The input register can have its own clock
input and clock enable separate from the OE and output registers. The
output register can be used for data requiring fast clock-to-output
performance. The OE register can be used for fast clock-to-output enable
timing. The OE and output register share the same clock source and the
same clock enable source from local interconnect in the associated LAB,
dedicated I/O clocks, and the column and row interconnects. Figure 2–64
shows the IOE in bidirectional configuration.
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July 2005
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I/O Structure
Figure 2–64. Stratix IOE in Bidirectional I/O Configuration Note (1)
Column or Row
Interconnect
ioe_clk[7..0]
I/O Interconnect
[15..0]
OE
OE Register
D
Output
tZX Delay
Q
clkout
Output
Enable Clock
Enable Delay
ce_out
ENA
CLRN/PRN
OE Register
tCO Delay
VCCIO
Output Clock
Enable Delay
Optional
PCI Clamp
VCCIO
Programmable
Pull-Up
Resistor
aclr/prn
Chip-Wide Reset
Logic Array
to Output
Register Delay
Output Register
D
sclr/preset
Q
ENA
CLRN/PRN
Output
Pin Delay
Drive Strength Control
Open-Drain Output
Slew Control
Input Pin to
Logic Array Delay
Input Register
D
clkin
ce_in
Input Clock
Enable Delay
Input Pin to
Input Register Delay
Bus-Hold
Circuit
Q
ENA
CLRN/PRN
Note to Figure 2–64:
(1)
All input signals to the IOE can be inverted at the IOE.
The Stratix device IOE includes programmable delays that can be
activated to ensure zero hold times, input IOE register-to-logic array
register transfers, or logic array-to-output IOE register transfers.
A path in which a pin directly drives a register may require the delay to
ensure zero hold time, whereas a path in which a pin drives a register
through combinatorial logic may not require the delay. Programmable
delays exist for decreasing input-pin-to-logic-array and IOE input
register delays. The Quartus II Compiler can program these delays to
automatically minimize setup time while providing a zero hold time.
Programmable delays can increase the register-to-pin delays for output
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and/or output enable registers. A programmable delay exists to increase
the tZX delay to the output pin, which is required for ZBT interfaces.
Table 2–24 shows the programmable delays for Stratix devices.
Table 2–24. Stratix Programmable Delay Chain
Programmable Delays
Quartus II Logic Option
Input pin to logic array delay
Decrease input delay to internal cells
Input pin to input register delay
Decrease input delay to input register
Output pin delay
Increase delay to output pin
Output enable register tCO delay
Increase delay to output enable pin
Output tZX delay
Increase tZX delay to output pin
Output clock enable delay
Increase output clock enable delay
Input clock enable delay
Increase input clock enable delay
Logic array to output register delay
Decrease input delay to output register
Output enable clock enable delay
Increase output enable clock enable delay
The IOE registers in Stratix devices share the same source for clear or
preset. You can program preset or clear for each individual IOE. You can
also program the registers to power up high or low after configuration is
complete. If programmed to power up low, an asynchronous clear can
control the registers. If programmed to power up high, an asynchronous
preset can control the registers. This feature prevents the inadvertent
activation of another device’s active-low input upon power-up. If one
register in an IOE uses a preset or clear signal then all registers in the IOE
must use that same signal if they require preset or clear. Additionally a
synchronous reset signal is available for the IOE registers.
Double-Data Rate I/O Pins
Stratix devices have six registers in the IOE, which support DDR
interfacing by clocking data on both positive and negative clock edges.
The IOEs in Stratix devices support DDR inputs, DDR outputs, and
bidirectional DDR modes.
When using the IOE for DDR inputs, the two input registers clock double
rate input data on alternating edges. An input latch is also used within the
IOE for DDR input acquisition. The latch holds the data that is present
during the clock high times. This allows both bits of data to be
synchronous with the same clock edge (either rising or falling).
Figure 2–65 shows an IOE configured for DDR input. Figure 2–66 shows
the DDR input timing diagram.
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July 2005
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Figure 2–65. Stratix IOE in DDR Input I/O Configuration Note (1)
Column or Row
Interconnect
VCCIO
ioe_clk[7..0] (1)
I/O Interconnect
[15..0] (1)
To DQS Local
Bus (3)
DQS Local
Bus (1), (2)
Optional
PCI Clamp
VCCIO
Programmable
Pull-Up
Resistor
Input Pin to
Input Register Delay
sclr
Input Register
D
Q
clkin
Output Clock
Enable Delay
ENA
CLRN/PRN
Bus-Hold
Circuit
aclr/prn
Chip-Wide Reset
Latch
Input Register
D
Q
ENA
CLRN/PRN
D
Q
ENA
CLRN/PRN
Notes to Figure 2–65:
(1)
(2)
(3)
All input signals to the IOE can be inverted at the IOE.
This signal connection is only allowed on dedicated DQ function pins.
This signal is for dedicated DQS function pins only.
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Figure 2–66. Input Timing Diagram in DDR Mode
Data at
input pin
A0
B1
A1
B2
A2
B3
A3
B4
CLK
A'
A1
A2
A3
B'
B1
B2
B3
Input To
Logic Array
When using the IOE for DDR outputs, the two output registers are
configured to clock two data paths from LEs on rising clock edges. These
output registers are multiplexed by the clock to drive the output pin at a
×2 rate. One output register clocks the first bit out on the clock high time,
while the other output register clocks the second bit out on the clock low
time. Figure 2–67 shows the IOE configured for DDR output. Figure 2–68
shows the DDR output timing diagram.
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July 2005
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I/O Structure
Figure 2–67. Stratix IOE in DDR Output I/O Configuration Notes (1), (2)
Column or Row
Interconnect
IOE_CLK[7..0]
I/O Interconnect
[15..0]
OE Register
D
Q
Output
tZX Delay
clkout
ENA
CLRN/PRN
OE Register
tCO Delay
Output
Enable Clock
Enable Delay
Output Clock
Enable Delay
aclr/prn
VCCIO
Optional
PCI Clamp
Chip-Wide Reset
OE Register
D
VCCIO
Q
sclr
ENA
CLRN/PRN
Logic Array
to Output
Register Delay
Programmable
Pull-Up
Resistor
Output Register
D
Q
Output
Pin Delay
ENA
CLRN/PRN
Logic Array
to Output
Register Delay
Used for
DDR SDRAM
Output Register
D
clk
Drive Strength Control
Open-Drain Output
Slew Control
Q
ENA
CLRN/PRN
Bus-Hold
Circuit
Notes to Figure 2–67:
(1)
(2)
All input signals to the IOE can be inverted at the IOE.
The tristate is by default active high. It can, however, be designed to be active low.
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Stratix Architecture
Figure 2–68. Output Timing Diagram in DDR Mode
CLK
A
A1
A2
A3
A4
B
B1
B2
B3
B4
From Internal
Registers
B1
DDR output
A1
B2
A2
B3
A3
The Stratix IOE operates in bidirectional DDR mode by combining the
DDR input and DDR output configurations. Stratix device I/O pins
transfer data on a DDR bidirectional bus to support DDR SDRAM. The
negative-edge-clocked OE register holds the OE signal inactive until the
falling edge of the clock. This is done to meet DDR SDRAM timing
requirements.
External RAM Interfacing
Stratix devices support DDR SDRAM at up to 200 MHz (400-Mbps data
rate) through dedicated phase-shift circuitry, QDR and QDRII SRAM
interfaces up to 167 MHz, and ZBT SRAM interfaces up to 200 MHz.
Stratix devices also provide preliminary support for reduced latency
DRAM II (RLDRAM II) at rates up to 200 MHz through the dedicated
phase-shift circuitry.
1
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Altera Corporation
July 2005
In addition to the required signals for external memory
interfacing, Stratix devices offer the optional clock enable signal.
By default the Quartus II software sets the clock enable signal
high, which tells the output register to update with new values.
The output registers hold their own values if the design sets the
clock enable signal low. See Figure 2–64.
To find out more about the DDR SDRAM specification, see the JEDEC
web site (www.jedec.org). For information on memory controller
megafunctions for Stratix devices, see the Altera web site
(www.altera.com). See AN 342: Interfacing DDR SDRAM with Stratix &
Stratix GX Devices for more information on DDR SDRAM interface in
Stratix. Also see AN 349: QDR SRAM Controller Reference Design for
Stratix & Stratix GX Devices and AN 329: ZBT SRAM Controller Reference
Design for Stratix & Stratix GX Devices.
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Tables 2–25 and 2–26 show the performance specification for DDR
SDRAM, RLDRAM II, QDR SRAM, QDRII SRAM, and ZBT SRAM
interfaces in EP1S10 through EP1S40 devices and in EP1S60 and EP1S80
devices. The DDR SDRAM and QDR SRAM numbers in Table 2–25 have
been verified with hardware characterization with third-party DDR
SDRAM and QDR SRAM devices over temperature and voltage
extremes.
Table 2–25. External RAM Support in EP1S10 through EP1S40 Devices
Maximum Clock Rate (MHz)
DDR Memory Type
I/O
Standard
-5 Speed
Grade
-6 Speed Grade
Flip-Chip Flip-Chip
-7 Speed Grade
-8 Speed Grade
WireBond
FlipChip
WireBond
FlipChip
WireBond
DDR SDRAM (1), (2)
SSTL-2
200
167
133
133
100
100
100
DDR SDRAM - side
banks (2), (3), (4)
SSTL-2
150
133
110
133
100
100
100
RLDRAM II (4)
1.8-V HSTL
200
(5)
(5)
(5)
(5)
(5)
(5)
QDR SRAM (6)
1.5-V HSTL
167
167
133
133
100
100
100
QDRII SRAM (6)
1.5-V HSTL
200
167
133
133
100
100
100
ZBT SRAM (7)
LVTTL
200
200
200
167
167
133
133
Notes to Table 2–25:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
These maximum clock rates apply if the Stratix device uses DQS phase-shift circuitry to interface with DDR
SDRAM. DQS phase-shift circuitry is only available in the top and bottom I/O banks (I/O banks 3, 4, 7, and 8).
For more information on DDR SDRAM, see AN 342: Interfacing DDR SDRAM with Stratix & Stratix GX Devices.
DDR SDRAM is supported on the Stratix device side I/O banks (I/O banks 1, 2, 5, and 6) without dedicated DQS
phase-shift circuitry. The read DQS signal is ignored in this mode.
These performance specifications are preliminary.
This device does not support RLDRAM II.
For more information on QDR or QDRII SRAM, see AN 349: QDR SRAM Controller Reference Design for Stratix &
Stratix GX Devices.
For more information on ZBT SRAM, see AN 329: ZBT SRAM Controller Reference Design for Stratix & Stratix GX
Devices.
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Stratix Architecture
Table 2–26. External RAM Support in EP1S60 & EP1S80 Devices
Maximum Clock Rate (MHz)
DDR Memory Type
I/O Standard
DDR SDRAM (1), (2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
SSTL-2
167
167
133
DDR SDRAM - side banks (2), (3) SSTL-2
150
133
133
QDR SRAM (4)
1.5-V HSTL
133
133
133
QDRII SRAM (4)
1.5-V HSTL
167
167
133
ZBT SRAM (5)
LVTTL
200
200
167
Notes to Table 2–26:
(1)
(2)
(3)
(4)
(5)
These maximum clock rates apply if the Stratix device uses DQS phase-shift circuitry to interface with DDR
SDRAM. DQS phase-shift circuitry is only available in the top and bottom I/O banks (I/O banks 3, 4, 7, and 8).
For more information on DDR SDRAM, see AN 342: Interfacing DDR SDRAM with Stratix & Stratix GX Devices.
DDR SDRAM is supported on the Stratix device side I/O banks (I/O banks 1, 2, 5, and 6) without dedicated DQS
phase-shift circuitry. The read DQS signal is ignored in this mode. Numbers are preliminary.
For more information on QDR or QDRII SRAM, see AN 349: QDR SRAM Controller Reference Design for Stratix &
Stratix GX Devices.
For more information on ZBT SRAM, see AN 329: ZBT SRAM Controller Reference Design for Stratix & Stratix GX
Devices.
In addition to six I/O registers and one input latch in the IOE for
interfacing to these high-speed memory interfaces, Stratix devices also
have dedicated circuitry for interfacing with DDR SDRAM. In every
Stratix device, the I/O banks at the top (I/O banks 3 and 4) and bottom
(I/O banks 7 and 8) of the device support DDR SDRAM up to 200 MHz.
These pins support DQS signals with DQ bus modes of ×8, ×16, or ×32.
Table 2–27 shows the number of DQ and DQS buses that are supported
per device.
Table 2–27. DQS & DQ Bus Mode Support
Number of ×8
Groups
Number of ×16
Groups
Number of ×32
Groups
672-pin BGA
672-pin FineLine BGA
12 (2)
0
0
484-pin FineLine BGA
780-pin FineLine BGA
16 (3)
0
4
484-pin FineLine BGA
18(4)
7 (5)
4
672-pin BGA
672-pin FineLine BGA
16(3)
7 (5)
4
780-pin FineLine BGA
20
7 (5)
4
Device
EP1S10
EP1S20
(Part 1 of 2) Note (1)
Package
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July 2005
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I/O Structure
Table 2–27. DQS & DQ Bus Mode Support
(Part 2 of 2) Note (1)
Number of ×8
Groups
Number of ×16
Groups
Number of ×32
Groups
16 (3)
8
4
780-pin FineLine BGA
1,020-pin FineLine BGA
20
8
4
EP1S30
956-pin BGA
780-pin FineLine BGA
1,020-pin FineLine BGA
20
8
4
EP1S40
956-pin BGA
1,020-pin FineLine BGA
1,508-pin FineLine BGA
20
8
4
EP1S60
956-pin BGA
1,020-pin FineLine BGA
1,508-pin FineLine BGA
20
8
4
EP1S80
956-pin BGA
1,508-pin FineLine BGA
1,923-pin FineLine BGA
20
8
4
Device
EP1S25
Package
672-pin BGA
672-pin FineLine BGA
Notes to Table 2–27:
(1)
(2)
(3)
(4)
(5)
See the Selectable I/O Standards in Stratix & Stratix GX Devices chapter in the Stratix Device Handbook, Volume 2
for VREF guidelines.
These packages have six groups in I/O banks 3 and 4 and six groups in I/O banks 7 and 8.
These packages have eight groups in I/O banks 3 and 4 and eight groups in I/O banks 7 and 8.
This package has nine groups in I/O banks 3 and 4 and nine groups in I/O banks 7 and 8.
These packages have three groups in I/O banks 3 and 4 and four groups in I/O banks 7 and 8.
A compensated delay element on each DQS pin automatically aligns
input DQS synchronization signals with the data window of their
corresponding DQ data signals. The DQS signals drive a local DQS bus in
the top and bottom I/O banks. This DQS bus is an additional resource to
the I/O clocks and is used to clock DQ input registers with the DQS
signal.
Two separate single phase-shifting reference circuits are located on the
top and bottom of the Stratix device. Each circuit is driven by a system
reference clock through the CLK pins that is the same frequency as the
DQS signal. Clock pins CLK[15..12]p feed the phase-shift circuitry on
the top of the device and clock pins CLK[7..4]p feed the phase-shift
circuitry on the bottom of the device. The phase-shifting reference circuit
on the top of the device controls the compensated delay elements for all
10 DQS pins located at the top of the device. The phase-shifting reference
circuit on the bottom of the device controls the compensated delay
elements for all 10 DQS pins located on the bottom of the device. All
10 delay elements (DQS signals) on either the top or bottom of the device
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shift by the same degree amount. For example, all 10 DQS pins on the top
of the device can be shifted by 90° and all 10 DQS pins on the bottom of
the device can be shifted by 72°. The reference circuits require a maximum
of 256 system reference clock cycles to set the correct phase on the DQS
delay elements. Figure 2–69 illustrates the phase-shift reference circuit
control of each DQS delay shift on the top of the device. This same circuit
is duplicated on the bottom of the device.
Figure 2–69. Simplified Diagram of the DQS Phase-Shift Circuitry
Input
Reference
Clock
Phase
Comparator
Up/Down
Counter
Delay Chains
6
Control Signals
to DQS Pins
See the External Memory Interfaces chapter in the Stratix Device Handbook,
Volume 2 for more information on external memory interfaces.
Programmable Drive Strength
The output buffer for each Stratix device I/O pin has a programmable
drive strength control for certain I/O standards. The LVTTL and
LVCMOS standard has several levels of drive strength that the user can
control. SSTL-3 Class I and II, SSTL-2 Class I and II, HSTL Class I and II,
and 3.3-V GTL+ support a minimum setting, the lowest drive strength
that guarantees the IOH/IOL of the standard. Using minimum settings
provides signal slew rate control to reduce system noise and signal
overshoot.
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Table 2–28 shows the possible settings for the I/O standards with drive
strength control.
Table 2–28. Programmable Drive Strength
I/O Standard
IOH / IOL Current Strength Setting (mA)
3.3-V LVTTL
24 (1), 16, 12, 8, 4
3.3-V LVCMOS
24 (2), 12 (1), 8, 4, 2
2.5-V LVTTL/LVCMOS
16 (1), 12, 8, 2
1.8-V LVTTL/LVCMOS
12 (1), 8, 2
1.5-V LVCMOS
8 (1), 4, 2
GTL/GTL+
1.5-V HSTL Class I and II
1.8-V HSTL Class I and II
SSTL-3 Class I and II
SSTL-2 Class I and II
SSTL-18 Class I and II
Support max and min strength
Notes to Table 2–28:
(1)
(2)
This is the Quartus II software default current setting.
I/O banks 1, 2, 5, and 6 do not support this setting.
Quartus II software version 4.2 and later will report current strength as
“PCI Compliant” for 3.3-V PCI, 3.3-V PCI-X 1.0, and Compact PCI I/O
standards.
Stratix devices support series on-chip termination (OCT) using
programmable drive strength. For more information, contact your Altera
Support Representative.
Open-Drain Output
Stratix devices provide an optional open-drain (equivalent to an opencollector) output for each I/O pin. This open-drain output enables the
device to provide system-level control signals (e.g., interrupt and writeenable signals) that can be asserted by any of several devices.
Slew-Rate Control
The output buffer for each Stratix device I/O pin has a programmable
output slew-rate control that can be configured for low-noise or highspeed performance. A faster slew rate provides high-speed transitions for
high-performance systems. However, these fast transitions may
introduce noise transients into the system. A slow slew rate reduces
system noise, but adds a nominal delay to rising and falling edges. Each
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I/O pin has an individual slew-rate control, allowing you to specify the
slew rate on a pin-by-pin basis. The slew-rate control affects both the
rising and falling edges.
Bus Hold
Each Stratix device I/O pin provides an optional bus-hold feature. The
bus-hold circuitry can weakly hold the signal on an I/O pin at its lastdriven state. Since the bus-hold feature holds the last-driven state of the
pin until the next input signal is present, an external pull-up or pull-down
resistor is not needed to hold a signal level when the bus is tri-stated.
Table 2–29 shows bus hold support for different pin types.
Table 2–29. Bus Hold Support
Pin Type
I/O pins
Bus Hold
v
CLK[15..0]
CLK[0,1,2,3,8,9,10,11]
FCLK
v
FPLL[7..10]CLK
The bus-hold circuitry also pulls undriven pins away from the input
threshold voltage where noise can cause unintended high-frequency
switching. You can select this feature individually for each I/O pin. The
bus-hold output drives no higher than VCCIO to prevent overdriving
signals. If the bus-hold feature is enabled, the programmable pull-up
option cannot be used. Disable the bus-hold feature when using opendrain outputs with the GTL+ I/O standard or when the I/O pin has been
configured for differential signals.
The bus-hold circuitry uses a resistor with a nominal resistance (RBH) of
approximately 7 kΩ to weakly pull the signal level to the last-driven state.
See the DC & Switching Characteristics chapter of the Stratix Device
Handbook, Volume 1 for the specific sustaining current driven through this
resistor and overdrive current used to identify the next-driven input
level. This information is provided for each VCCIO voltage level.
The bus-hold circuitry is active only after configuration. When going into
user mode, the bus-hold circuit captures the value on the pin present at
the end of configuration.
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Programmable Pull-Up Resistor
Each Stratix device I/O pin provides an optional programmable pull-up
resistor during user mode. If this feature is enabled for an I/O pin, the
pull-up resistor (typically 25 kΩ) weakly holds the output to the VCCIO
level of the output pin’s bank. Table 2–30 shows which pin types support
the weak pull-up resistor feature.
Table 2–30. Programmable Weak Pull-Up Resistor Support
Pin Type
I/O pins
Programmable Weak Pull-Up Resistor
v
CLK[15..0]
FCLK
v
FPLL[7..10]CLK
Configuration pins
JTAG pins
v (1)
Note to Table 2–30:
(1)
TDO pins do not support programmable weak pull-up resistors.
Advanced I/O Standard Support
Stratix device IOEs support the following I/O standards:
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
LVTTL
LVCMOS
1.5 V
1.8 V
2.5 V
3.3-V PCI
3.3-V PCI-X 1.0
3.3-V AGP (1× and 2×)
LVDS
LVPECL
3.3-V PCML
HyperTransport
Differential HSTL (on input/output clocks only)
Differential SSTL (on output column clock pins only)
GTL/GTL+
1.5-V HSTL Class I and II
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■
■
■
■
■
1.8-V HSTL Class I and II
SSTL-3 Class I and II
SSTL-2 Class I and II
SSTL-18 Class I and II
CTT
Table 2–31 describes the I/O standards supported by Stratix devices.
Table 2–31. Stratix Supported I/O Standards
Type
Input Reference
Voltage (VREF)
(V)
Output Supply
Voltage (VCCIO)
(V)
Board
Termination
Voltage (VTT)
(V)
LVTTL
Single-ended
N/A
3.3
N/A
LVCMOS
Single-ended
N/A
3.3
N/A
2.5 V
Single-ended
N/A
2.5
N/A
1.8 V
Single-ended
N/A
1.8
N/A
1.5 V
Single-ended
N/A
1.5
N/A
3.3-V PCI
Single-ended
N/A
3.3
N/A
3.3-V PCI-X 1.0
I/O Standard
Single-ended
N/A
3.3
N/A
LVDS
Differential
N/A
3.3
N/A
LVPECL
Differential
N/A
3.3
N/A
3.3-V PCML
Differential
N/A
3.3
N/A
HyperTransport
Differential
N/A
2.5
N/A
Differential HSTL (1)
Differential
0.75
1.5
0.75
Differential SSTL (2)
Differential
1.25
2.5
1.25
GTL
Voltage-referenced
0.8
N/A
1.20
GTL+
Voltage-referenced
1.0
N/A
1.5
1.5-V HSTL Class I and II
Voltage-referenced
0.75
1.5
0.75
1.8-V HSTL Class I and II
Voltage-referenced
0.9
1.8
0.9
SSTL-18 Class I and II
Voltage-referenced
0.90
1.8
0.90
SSTL-2 Class I and II
Voltage-referenced
1.25
2.5
1.25
SSTL-3 Class I and II
Voltage-referenced
1.5
3.3
1.5
AGP (1× and 2° )
Voltage-referenced
1.32
3.3
N/A
CTT
Voltage-referenced
1.5
3.3
1.5
Notes to Table 2–31:
(1)
(2)
This I/O standard is only available on input and output clock pins.
This I/O standard is only available on output column clock pins.
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July 2005
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Stratix Device Handbook, Volume 1
I/O Structure
f
For more information on I/O standards supported by Stratix devices, see
the Selectable I/O Standards in Stratix & Stratix GX Devices chapter of the
Stratix Device Handbook, Volume 2.
Stratix devices contain eight I/O banks in addition to the four enhanced
PLL external clock out banks, as shown in Figure 2–70. The four I/O
banks on the right and left of the device contain circuitry to support highspeed differential I/O for LVDS, LVPECL, 3.3-V PCML, and
HyperTransport inputs and outputs. These banks support all I/O
standards listed in Table 2–31 except PCI I/O pins or PCI-X 1.0, GTL,
SSTL-18 Class II, and HSTL Class II outputs. The top and bottom I/O
banks support all single-ended I/O standards. Additionally, Stratix
devices support four enhanced PLL external clock output banks,
allowing clock output capabilities such as differential support for SSTL
and HSTL. Table 2–32 shows I/O standard support for each I/O bank.
2–124
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Figure 2–70. Stratix I/O Banks Notes (1), (2), (3)
DQS5T
9
DQS4T
PLL11
(5)
DQS1T
DQS0T
10
Bank 4
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
(5)
I/O Banks 1, 2, 5, and 6 Support All
Single-Ended I/O Standards Except
Differential HSTL Output Clocks,
Differential SSTL-2 Output Clocks,
HSTL Class II, GTL, SSTL-18 Class II,
PCI, PCI-X 1.0, and AGP 1×/2×
PLL2
Bank 1
DQS2T
I/O Banks 3, 4, 9 & 10 Support
All Single-Ended I/O Standards
PLL1
Bank 8
PLL3
DQS8B
DQS7B
DQS6B
DQS5B
(5)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
11
VREF5B8 VREF4B8 VREF3B8 VREF2B8 VREF1B8
DQS9B
PLL4
I/O Banks 7, 8, 11 & 12 Support
All Single-Ended I/O Standards
(5)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
PLL8
DQS3T
VREF1B4 VREF2B4 VREF3B4 VREF4B4 VREF5B4 PLL10
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (4)
Bank 2
VREF1B2 VREF2B2 VREF3B2 VREF4B2
Bank 3
VREF1B1 VREF2B1 VREF3B1 VREF4B1
PLL5
12
PLL6
Bank 5
DQS6T
VREF4B5 VREF3B5 VREF2B5 VREF1B5
DQS7T
Bank 6
DQS8T
VREF1B3 VREF2B3 VREF3B3 VREF4B3 VREF5B3
VREF4B6 VREF3B6 VREF2B6 VREF1B6
DQS9T
PLL7
Bank 7
PLL12
VREF5B7 VREF4B7 VREF3B7 VREF2B7 VREF1B7
DQS4B
DQS3B
DQS2B
DQS1B
PLL9
DQS0B
Notes to Figure 2–70:
(1)
(2)
(3)
(4)
(5)
Figure 2–70 is a top view of the silicon die. This will correspond to a top-down view for non-flip-chip packages, but
will be a reverse view for flip-chip packages.
Figure 2–70 is a graphic representation only. See the device pin-outs on the web (www.altera.com) and the
Quartus II software for exact locations.
Banks 9 through 12 are enhanced PLL external clock output banks.
If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the
I/O standards except HSTL Class I and II, GTL, SSTL-18 Class II, PCI, PCI-X 1.0, and AGP 1× /2× .
For guidelines for placing single-ended I/O pads next to differential I/O pads, see the Selectable I/O Standards in
Stratix and Stratix GX Devices chapter in the Stratix Device Handbook, Volume 2.
Altera Corporation
July 2005
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Stratix Device Handbook, Volume 1
I/O Structure
Table 2–32 shows I/O standard support for each I/O bank.
Table 2–32. I/O Support by Bank (Part 1 of 2)
Top & Bottom Banks
(3, 4, 7 & 8)
Left & Right Banks
(1, 2, 5 & 6)
Enhanced PLL External
Clock Output Banks
(9, 10, 11 & 12)
LVTTL
v
v
v
LVCMOS
v
v
v
2.5 V
v
v
v
1.8 V
v
v
v
1.5 V
v
v
v
3.3-V PCI
v
3.3-V PCI-X 1.0
v
I/O Standard
v
v
LVPECL
v
v
3.3-V PCML
v
v
LVDS
v
v
HyperTransport technology
v
v
Differential HSTL (clock
inputs)
v
v
Differential HSTL (clock
outputs)
v
Differential SSTL (clock
outputs)
v
3.3-V GTL
v
3.3-V GTL+
v
v
v
v
1.5-V HSTL Class I
v
v
v
1.5-V HSTL Class II
v
1.8-V HSTL Class I
v
1.8-V HSTL Class II
v
SSTL-18 Class I
v
SSTL-18 Class II
v
SSTL-2 Class I
v
v
v
v
v
v
v
v
v
SSTL-2 Class II
v
v
v
SSTL-3 Class I
v
v
v
2–126
Stratix Device Handbook, Volume 1
v
Altera Corporation
July 2005
Stratix Architecture
Table 2–32. I/O Support by Bank (Part 2 of 2)
Top & Bottom Banks
(3, 4, 7 & 8)
Left & Right Banks
(1, 2, 5 & 6)
Enhanced PLL External
Clock Output Banks
(9, 10, 11 & 12)
SSTL-3 Class II
v
v
v
AGP (1× and 2× )
v
CTT
v
I/O Standard
v
v
v
Each I/O bank has its own VCCIO pins. A single device can support 1.5-,
1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different standard
independently. Each bank also has dedicated VREF pins to support any
one of the voltage-referenced standards (such as SSTL-3) independently.
Each I/O bank can support multiple standards with the same VCCIO for
input and output pins. Each bank can support one voltage-referenced
I/O standard. For example, when VCCIO is 3.3 V, a bank can support
LVTTL, LVCMOS, 3.3-V PCI, and SSTL-3 for inputs and outputs.
Differential On-Chip Termination
Stratix devices provide differential on-chip termination (LVDS I/O
standard) to reduce reflections and maintain signal integrity. Differential
on-chip termination simplifies board design by minimizing the number
of external termination resistors required. Termination can be placed
inside the package, eliminating small stubs that can still lead to
reflections. The internal termination is designed using transistors in the
linear region of operation.
Stratix devices support internal differential termination with a nominal
resistance value of 137.5 Ω for LVDS input receiver buffers. LVPECL
signals require an external termination resistor. Figure 2–71 shows the
device with differential termination.
Altera Corporation
July 2005
2–127
Stratix Device Handbook, Volume 1
I/O Structure
Figure 2–71. LVDS Input Differential On-Chip Termination
Transmitting
Device
Receiving Device with
Differential Termination
Z0
+
+
RD
Ð
Ð
Z0
I/O banks on the left and right side of the device support LVDS receiver
(far-end) differential termination.
Table 2–33 shows the Stratix device differential termination support.
Table 2–33. Differential Termination Supported by I/O Banks
Differential Termination Support
I/O Standard Support
Differential termination (1), (2)
Top & Bottom
Banks (3, 4, 7 & 8)
Left & Right Banks
(1, 2, 5 & 6)
v
LVDS
Notes to Table 2–33:
(1)
(2)
Clock pin CLK0, CLK2, CLK9, CLK11, and pins FPLL[7..10]CLK do not support differential termination.
Differential termination is only supported for LVDS because of a 3.3-V VC C I O .
Table 2–34 shows the termination support for different pin types.
Table 2–34. Differential Termination Support Across Pin Types
Pin Type
RD
Top and bottom I/O banks (3, 4, 7, and 8)
DIFFIO_RX[]
v
CLK[0,2,9,11],CLK[4-7],CLK[12-15]
CLK[1,3,8,10]
v
FCLK
FPLL[7..10]CLK
The differential on-chip resistance at the receiver input buffer is
118 Ω ±20 %.
2–128
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
However, there is additional resistance present between the device ball
and the input of the receiver buffer, as shown in Figure 2–72. This
resistance is because of package trace resistance (which can be calculated
as the resistance from the package ball to the pad) and the parasitic layout
metal routing resistance (which is shown between the pad and the
intersection of the on-chip termination and input buffer).
Figure 2–72. Differential Resistance of LVDS Differential Pin Pair (RD)
Pad
Package Ball
0.3 Ω
9.3 Ω
0.3 Ω
9.3 Ω
LVDS
Input Buffer
RD
Differential On-Chip
Termination Resistor
Table 2–35 defines the specification for internal termination resistance for
commercial devices.
Table 2–35. Differential On-Chip Termination
Resistance
Symbol
RD (2)
Description
Internal differential termination for LVDS
Conditions
Unit
Min
Typ
Max
Commercial (1), (3)
110
135
165
W
Industrial (2), (3)
100
135
170
W
Notes to Table 2–35:
(1)
(2)
(3)
Data measured over minimum conditions (Tj = 0 C, VC C I O +5%) and maximum conditions (Tj = 85 C,
VC C I O = –5%).
Data measured over minimum conditions (Tj = –40 C, VCCIO +5%) and maximum conditions (Tj = 100 C,
VCCIO = –5%).
LVDS data rate is supported for 840 Mbps using internal differential termination.
MultiVolt I/O Interface
The Stratix architecture supports the MultiVolt I/O interface feature,
which allows Stratix devices in all packages to interface with systems of
different supply voltages.
The Stratix VCCINT pins must always be connected to a 1.5-V power
supply. With a 1.5-V VCCINT level, input pins are 1.5-V, 1.8-V, 2.5-V, and
3.3-V tolerant. The VCCIO pins can be connected to either a 1.5-V, 1.8-V,
2.5-V, or 3.3-V power supply, depending on the output requirements.
Altera Corporation
July 2005
2–129
Stratix Device Handbook, Volume 1
High-Speed Differential I/O Support
The output levels are compatible with systems of the same voltage as the
power supply (i.e., when VCCIO pins are connected to a 1.5-V power
supply, the output levels are compatible with 1.5-V systems). When
VCCIO pins are connected to a 3.3-V power supply, the output high is
3.3 V and is compatible with 3.3-V or 5.0-V systems.
Table 2–36 summarizes Stratix MultiVolt I/O support.
Table 2–36. Stratix MultiVolt I/O Support Note (1)
Input Signal (5)
VCCIO (V)
Output Signal (6)
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
1.5
v
v
v (2)
v (2)
v
1.8
v (2)
v
v (2)
v (2)
v (3)
v
2.5
v
v
v (3)
v (3)
v
3.3
v (2)
v
v (3)
v (3)
v (3)
v (4)
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
v
v
Notes to Table 2–36:
(1)
(2)
(3)
(4)
(5)
(6)
To drive inputs higher than VCCIO but less than 4.1 V, disable the PCI clamping diode. However, to drive 5.0-V
inputs to the device, enable the PCI clamping diode to prevent VI from rising above 4.0 V.
The input pin current may be slightly higher than the typical value.
Although VCCIO specifies the voltage necessary for the Stratix device to drive out, a receiving device powered at a
different level can still interface with the Stratix device if it has inputs that tolerate the VCCIO value.
Stratix devices can be 5.0-V tolerant with the use of an external resistor and the internal PCI clamp diode.
This is the external signal that is driving the Stratix device.
This represents the system voltage that Stratix supports when a VCCIO pin is connected to a specific voltage level.
For example, when VCCIO is 3.3 V and if the I/O standard is LVTTL/LVCMOS, the output high of the signal
coming out from Stratix is 3.3 V and is compatible with 3.3-V or 5.0-V systems.
High-Speed
Differential I/O
Support
Stratix devices contain dedicated circuitry for supporting differential
standards at speeds up to 840 Mbps. The following differential I/O
standards are supported in the Stratix device: LVDS, LVPECL,
HyperTransport, and 3.3-V PCML.
There are four dedicated high-speed PLLs in the EP1S10 to EP1S25
devices and eight dedicated high-speed PLLs in the EP1S30 to EP1S80
devices to multiply reference clocks and drive high-speed differential
SERDES channels.
f
See the Stratix device pin-outs at www.altera.com for additional high
speed DIFFIO pin information for Stratix devices.
2–130
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Table 2–37 shows the number of channels that each fast PLL can clock in
EP1S10, EP1S20, and EP1S25 devices. Tables 2–38 through Table 2–41
show this information for EP1S30, EP1S40, EP1S60, and EP1S80 devices.
Table 2–37. EP1S10, EP1S20 & EP1S25 Device Differential Channels (Part 1 of 2) Note (1)
Device
EP1S10
Package
Transmitter/
Receiver
484-pin FineLine BGA Transmitter (2)
Receiver
672-pin FineLine BGA Transmitter (2)
672-pin BGA
Receiver
780-pin FineLine BGA Transmitter (2)
Receiver
EP1S20
484-pin FineLine BGA Transmitter (2)
Receiver
672-pin FineLine BGA Transmitter (2)
672-pin BGA
Receiver
780-pin FineLine BGA Transmitter (2)
Receiver
Altera Corporation
July 2005
Total
Channels
20
20
36
36
44
44
24
20
48
50
66
66
Maximum
Speed
(Mbps)
Center Fast PLLs
PLL 1
PLL 2
PLL 3
PLL 4
840 (4)
5
5
5
5
840 (3)
10
10
10
10
840 (4)
5
5
5
5
840 (3)
10
10
10
10
624 (4)
9
9
9
9
624 (3)
18
18
18
18
624 (4)
9
9
9
9
624 (3)
18
18
18
18
840 (4)
11
11
11
11
840 (3)
22
22
22
22
840 (4)
11
11
11
11
840 (3)
22
22
22
22
840 (4)
6
6
6
6
840 (3)
12
12
12
12
840 (4)
5
5
5
5
840 (3)
10
10
10
10
624 (4)
12
12
12
12
624 (3)
24
24
24
24
624 (4)
13
12
12
13
624 (3)
25
25
25
25
840 (4)
17
16
16
17
840 (3)
33
33
33
33
840 (4)
17
16
16
17
840 (3)
33
33
33
33
2–131
Stratix Device Handbook, Volume 1
High-Speed Differential I/O Support
Table 2–37. EP1S10, EP1S20 & EP1S25 Device Differential Channels (Part 2 of 2) Note (1)
Device
EP1S25
Transmitter/
Receiver
Package
672-pin FineLine BGA Transmitter (2)
672-pin BGA
Receiver
780-pin FineLine BGA Transmitter (2)
Receiver
1,020-pin FineLine
BGA
Transmitter (2)
Receiver
Total
Channels
56
58
70
66
78
78
Maximum
Speed
(Mbps)
Center Fast PLLs
PLL 1
PLL 2
PLL 3
PLL 4
624 (4)
14
14
14
14
624 (3)
28
28
28
28
624 (4)
14
15
15
14
624 (3)
29
29
29
29
840 (4)
18
17
17
18
840 (3)
35
35
35
35
840 (4)
17
16
16
17
840 (3)
33
33
33
33
840 (4)
19
20
20
19
840 (3)
39
39
39
39
840 (4)
19
20
20
19
840 (3)
39
39
39
39
Notes to Table 2–37:
(1)
(2)
(3)
(4)
The first row for each transmitter or receiver reports the number of channels driven directly by the PLL. The second
row below it shows the maximum channels a PLL can drive if cross bank channels are used from the adjacent center
PLL. For example, in the 484-pin FineLine BGA EP1S10 device, PLL 1 can drive a maximum of five channels at
840 Mbps or a maximum of 10 channels at 840 Mbps. The Quartus II software may also merge receiver and
transmitter PLLs when a receiver is driving a transmitter. In this case, one fast PLL can drive both the maximum
numbers of receiver and transmitter channels.
The number of channels listed includes the transmitter clock output (tx_outclock) channel. If the design requires
a DDR clock, it can use an extra data channel.
These channels span across two I/O banks per side of the device. When a center PLL clocks channels in the opposite
bank on the same side of the device it is called cross-bank PLL support. Both center PLLs can clock cross-bank
channels simultaneously if, for example, PLL_1 is clocking all receiver channels and PLL_2 is clocking all
transmitter channels. You cannot have two adjacent PLLs simultaneously clocking cross-bank receiver channels or
two adjacent PLLs simultaneously clocking transmitter channels. Cross-bank allows for all receiver channels on
one side of the device to be clocked on one clock while all transmitter channels on the device are clocked on the
other center PLL. Crossbank PLLs are supported at full-speed, 840 Mbps. For wire-bond devices, the full-speed is
624 Mbps.
These values show the channels available for each PLL without crossing another bank.
When you span two I/O banks using cross-bank support, you can route
only two load enable signals total between the PLLs. When you enable
rx_data_align, you use both rxloadena and txloadena of a PLL.
That leaves no loadena for the second PLL.
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Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
The only way you can use the rx_data_align is if one of the following
is true:
■
■
The receiver PLL is only clocking receive channels (no resources for
the transmitter)
If all channels can fit in one I/O bank
Table 2–38. EP1S30 Differential Channels Note (1)
Package
780-pin
FineLine
BGA
956-pin
BGA
1,020-pin
FineLine
BGA
Transmitter
Total
/Receiver Channels
Transmitter
(4)
70
Receiver
66
Transmitter
(4)
80
Receiver
80
Transmitter
(4)
Receiver
80 (2) (7)
80 (2) (7)
Maximum
Center Fast PLLs
Corner Fast PLLs (2), (3)
Speed
(Mbps) PLL1 PLL2 PLL3 PLL4 PLL7 PLL8 PLL9 PLL10
840
18
17
17
18
(6)
(6)
(6)
(6)
840 (5)
35
35
35
35
(6)
(6)
(6)
(6)
840
17
16
16
17
(6)
(6)
(6)
(6)
840 (5)
33
33
33
33
(6)
(6)
(6)
(6)
840
19
20
20
19
20
20
20
20
840 (5)
39
39
39
39
20
20
20
20
840
20
20
20
20
19
20
20
19
840 (5)
40
40
40
40
19
20
20
19
840
19
(1)
20
20
19
(1)
20
20
20
20
840 (5),(8)
39
(1)
39
(1)
39
(1)
39
(1)
20
20
20
20
840
20
20
20
20
19 (1)
20
20
19 (1)
840 (5),(8)
40
40
40
40
19 (1)
20
20
19 (1)
Table 2–39. EP1S40 Differential Channels (Part 1 of 2) Note (1)
Package
780-pin
FineLine
BGA
Transmitter/
Total
Receiver Channels
Transmitter
(4)
68
Receiver
66
Altera Corporation
July 2005
Maximum
Speed
(Mbps)
Center Fast PLLs
Corner Fast PLLs (2), (3)
PLL1 PLL2 PLL3 PLL4 PLL7 PLL8 PLL9 PLL10
840
18
16
16
18
(6)
(6)
(6)
(6)
840 (5)
34
34
34
34
(6)
(6)
(6)
(6)
840
17
16
16
17
(6)
(6)
(6)
(6)
840 (5)
33
33
33
33
(6)
(6)
(6)
(6)
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Stratix Device Handbook, Volume 1
High-Speed Differential I/O Support
Table 2–39. EP1S40 Differential Channels (Part 2 of 2) Note (1)
Package
956-pin
BGA
1,020-pin
FineLine
BGA
Transmitter/
Total
Receiver Channels
Transmitter
(4)
80
Receiver
Transmitter
(4)
Receiver
1,508-pin
FineLine
BGA
Transmitter
(4)
Receiver
Maximum
Speed
(Mbps)
Center Fast PLLs
Corner Fast PLLs (2), (3)
PLL1 PLL2 PLL3 PLL4 PLL7 PLL8 PLL9 PLL10
840
18
17
17
18
20
20
20
20
840 (5)
35
35
35
35
20
20
20
20
80
840
20
20
20
20
18
17
17
18
840 (5)
40
40
40
40
18
17
17
18
80 (10)
(7)
840
18
(2)
17
(3)
17
(3)
18
(2)
20
20
20
20
840 (5), (8)
35
(5)
35
(5)
35
(5)
35
(5)
20
20
20
20
840
20
20
20
20
18
(2)
17
(3)
17
(3)
18 (2)
840 (5), (8)
40
40
40
40
18
(2)
17
(3)
17
(3)
18 (2)
840
18
(2)
17
(3)
17
(3)
18
(2)
20
20
20
20
840 (5), (8)
35
(5)
35
(5)
35
(5)
35
(5)
20
20
20
20
840
20
20
20
20
18
(2)
17
(3)
17
(3)
18 (2)
840 (5), (8)
40
40
40
40
18
(2)
17
(3)
17
(3)
18 (2)
80 (10)
(7)
80 (10)
(7)
80 (10)
(7)
Table 2–40. EP1S60 Differential Channels (Part 1 of 2) Note (1)
Package
956-pin
BGA
Transmitter/
Total
Receiver Channels
Transmitter
(4)
80
Receiver
80
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Stratix Device Handbook, Volume 1
Maximum
Center Fast PLLs
Corner Fast PLLs (2), (3)
Speed
PLL1 PLL2 PLL3 PLL4 PLL7 PLL8 PLL9 PLL10
(Mbps)
840
12
10
10
12
20
20
20
20
840 (5), (8)
22
22
22
22
20
20
20
20
840
20
20
20
20
12
10
10
12
840 (5), (8)
40
40
40
40
12
10
10
12
Altera Corporation
July 2005
Stratix Architecture
Table 2–40. EP1S60 Differential Channels (Part 2 of 2) Note (1)
Package
1,020-pin
FineLine
BGA
Transmitter/
Total
Receiver Channels
Transmitter
(4)
Receiver
1,508-pin
FineLine
BGA
Transmitter
(4)
Receiver
80 (12)
(7)
80 (10)
(7)
80 (36)
(7)
80 (36)
(7)
Maximum
Center Fast PLLs
Corner Fast PLLs (2), (3)
Speed
PLL1 PLL2 PLL3 PLL4 PLL7 PLL8 PLL9 PLL10
(Mbps)
840
12
(2)
10
(4)
10
(4)
12
(2)
20
20
20
20
840 (5), (8)
22
(6)
22
(6)
22
(6)
22
(6)
20
20
20
20
840
20
20
20
20
12
(8)
10
(10)
10
(10)
12 (8)
840 (5), (8)
40
40
40
40
12
(8)
10
(10)
10
(10)
12 (8)
840
12
(8)
10
(10)
10
(10)
12
(8)
20
20
20
20
840 (5),(8)
22
(18)
22
(18)
22
(18)
22
(18)
20
20
20
20
840
20
20
20
20
12
(8)
10
(10)
10
(10)
12 (8)
840 (5),(8)
40
40
40
40
12
(8)
10
(10)
10
(10)
12 (8)
Table 2–41. EP1S80 Differential Channels (Part 1 of 2) Note (1)
Package
956-pin
BGA
1,020-pin
FineLine
BGA
Transmitter/
Total
Receiver Channels
Maximum
Center Fast PLLs
Corner Fast PLLs (2), (3)
Speed
(Mbps) PLL1 PLL2 PLL3 PLL4 PLL7 PLL8 PLL9 PLL10
Transmitter
(4)
80 (40)
(7)
840
10
10
10
10
20
20
20
20
840 (5),(8)
20
20
20
20
20
20
20
20
Receiver
80
840
20
20
20
20
10
10
10
10
840 (5),(8)
40
40
40
40
10
10
10
10
Transmitter
(4)
92 (12)
(7)
840
10
(2)
10
(4)
10
(4)
10
(2)
20
20
20
20
840 (5),(8)
20
(6)
20
(6)
20
(6)
20
(6)
20
20
20
20
840
20
20
20
20
10
(2)
10
(3)
10 (3)
10 (2)
840 (5),(8)
40
40
40
40
10
(2)
10
(3)
10 (3)
10 (2)
Receiver
Altera Corporation
July 2005
90 (10)
(7)
2–135
Stratix Device Handbook, Volume 1
High-Speed Differential I/O Support
Table 2–41. EP1S80 Differential Channels (Part 2 of 2) Note (1)
Package
1,508-pin
FineLine
BGA
Transmitter/
Total
Receiver Channels
Transmitter
(4)
Receiver
80 (72)
(7)
80 (56)
(7)
Maximum
Center Fast PLLs
Corner Fast PLLs (2), (3)
Speed
(Mbps) PLL1 PLL2 PLL3 PLL4 PLL7 PLL8 PLL9 PLL10
840
10
(10)
10
(10)
10
(10)
10
(10)
20
(8)
20
(8)
20 (8)
20 (8)
840 (5),(8)
20
(20)
20
(20)
20
(20)
20
(20)
20
(8)
20
(8)
20 (8)
20 (8)
840
20
20
20
20
10
(14)
10
(14)
10
(14)
10
(14)
840 (5),(8)
40
40
40
40
10
(14)
10
(14)
10
(14)
10
(14)
Notes to Tables 2–38 through 2–41:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
The first row for each transmitter or receiver reports the number of channels driven directly by the PLL. The second
row below it shows the maximum channels a PLL can drive if cross bank channels are used from the adjacent center
PLL. For example, in the 780-pin FineLine BGA EP1S30 device, PLL 1 can drive a maximum of 18 transmitter
channels at 840 Mbps or a maximum of 35 transmitter channels at 840 Mbps. The Quartus II software may also
merge transmitter and receiver PLLs when a receiver is driving a transmitter. In this case, one fast PLL can drive
both the maximum numbers of receiver and transmitter channels.
Some of the channels accessible by the center fast PLL and the channels accessible by the corner fast PLL overlap.
Therefore, the total number of channels is not the addition of the number of channels accessible by PLLs 1, 2, 3, and
4 with the number of channels accessible by PLLs 7, 8, 9, and 10. For more information on which channels overlap,
see the Stratix device pin-outs at www.altera.com.
The corner fast PLLs in this device support a data rate of 840 Mbps for channels labeled “high” speed in the device
pin-outs at www.altera.com.
The numbers of channels listed include the transmitter clock output (tx_outclock) channel. An extra data
channel can be used if a DDR clock is needed.
These channels span across two I/O banks per side of the device. When a center PLL clocks channels in the opposite
bank on the same side of the device it is called cross-bank PLL support. Both center PLLs can clock cross-bank
channels simultaneously if say PLL_1 is clocking all receiver channels and PLL_2 is clocking all transmitter
channels. You cannot have two adjacent PLLs simultaneously clocking cross-bank receiver channels or two adjacent
PLLs simultaneously clocking transmitter channels. Cross-bank allows for all receiver channels on one side of the
device to be clocked on one clock while all transmitter channels on the device are clocked on the other center PLL.
Crossbank PLLs are supported at full-speed, 840 Mbps. For wire-bond devices, the full-speed is 624 Mbps.
PLLs 7, 8, 9, and 10 are not available in this device.
The number in parentheses is the number of slow-speed channels, guaranteed to operate at up to 462 Mbps. These
channels are independent of the high-speed differential channels. For the location of these channels, see the device
pin-outs at www.altera.com.
See the Stratix device pin-outs at www.altera.com. Channels marked “high” speed are 840 MBps and “low” speed
channels are 462 MBps.
The high-speed differential I/O circuitry supports the following high
speed I/O interconnect standards and applications:
■
■
■
■
UTOPIA IV
SPI-4 Phase 2 (POS-PHY Level 4)
SFI-4
10G Ethernet XSBI
2–136
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
■
■
RapidIO
HyperTransport
Dedicated Circuitry
Stratix devices support source-synchronous interfacing with LVDS,
LVPECL, 3.3-V PCML, or HyperTransport signaling at up to 840 Mbps.
Stratix devices can transmit or receive serial channels along with a
low-speed or high-speed clock. The receiving device PLL multiplies the
clock by a integer factor W (W = 1 through 32). For example, a
HyperTransport application where the data rate is 800 Mbps and the
clock rate is 400 MHz would require that W be set to 2. The SERDES factor
J determines the parallel data width to deserialize from receivers or to
serialize for transmitters. The SERDES factor J can be set to 4, 7, 8, or 10
and does not have to equal the PLL clock-multiplication W value. For a J
factor of 1, the Stratix device bypasses the SERDES block. For a J factor of
2, the Stratix device bypasses the SERDES block, and the DDR input and
output registers are used in the IOE. See Figure 2–73.
Figure 2–73. High-Speed Differential I/O Receiver / Transmitter Interface Example
R4, R8, and R24
Interconnect
8
840 Mbps
+
–
Data
+
–
8
840 Mbps
8
Data
Dedicated
Receiver
Interface
8×
105 MHz
Dedicated
Transmitter
Interface
Local
Interconnect
Fast
PLL
rx_load_en
8×
tx_load_en
Regional or
global clock
An external pin or global or regional clock can drive the fast PLLs, which
can output up to three clocks: two multiplied high-speed differential I/O
clocks to drive the SERDES block and/or external pin, and a low-speed
clock to drive the logic array.
Altera Corporation
July 2005
2–137
Stratix Device Handbook, Volume 1
High-Speed Differential I/O Support
The Quartus II MegaWizard® Plug-In Manager only allows the
implementation of up to 20 receiver or 20 transmitter channels for each
fast PLL. These channels operate at up to 840 Mbps. The receiver and
transmitter channels are interleaved such that each I/O bank on the left
and right side of the device has one receiver channel and one transmitter
channel per LAB row. Figure 2–74 shows the fast PLL and channel layout
in EP1S10, EP1S20, and EP1S25 devices. Figure 2–75 shows the fast PLL
and channel layout in the EP1S30 to EP1S80 devices.
Figure 2–74. Fast PLL & Channel Layout in the EP1S10, EP1S20 or EP1S25 Devices Note (1)
Up to 20 Receiver and
Transmitter Channels (2)
Transmitter
Up to 20 Receiver and
Transmitter Channels (2)
Transmitter
Receiver
Receiver
CLKIN
Fast
PLL 1
CLKIN
Fast
PLL 2
(3)
Transmitter
Receiver
Up to 20 Receiver and
Transmitter Channels (2)
Fast
PLL 4
CLKIN
Fast
PLL 3
CLKIN
(3)
Transmitter
Receiver
Up to 20 Receiver and
Transmitter Channels (2)
Notes to Figure 2–74:
(1)
(2)
(3)
Wire-bond packages support up to 624 Mbps.
See Table 2–41 for the number of channels each device supports.
There is a multiplexer here to select the PLL clock source. If a PLL uses this multiplexer to clock channels outside of
its bank quadrant, those clocked channels support up to 840 Mbps for “high” speed channels and 462 Mbps for
“low” speed channels, as labeled in the device pin-outs at www.altera.com.
2–138
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Stratix Architecture
Figure 2–75. Fast PLL & Channel Layout in the EP1S30 to EP1S80 Devices Note (1)
FPLL7CLK
Fast
PLL 7
Fast
PLL 10
Up to 20 Receiver and
20 Transmitter
Channels in 20 Rows (2)
Transmitter
FPLL10CLK
Transmitter
Receiver
Receiver
Up to 20 Receiver and
20 Transmitter
Channels in 20 Rows (2)
Transmitter
Transmitter
Receiver
CLKIN
CLKIN
Receiver
Fast
PLL 1
(3)
(3)
Fast
PLL 2
Fast
PLL 4
CLKIN
Fast
PLL 3
CLKIN
Transmitter
Transmitter
Receiver
Receiver
Up to 20 Receiver and
20 Transmitter
Channels in 20 Rows (2)
Transmitter
Transmitter
Receiver
FPLL8CLK
Receiver
Fast
PLL 8
Up to 20 Receiver and
20 Transmitter
Channels in 20 Rows (2)
Fast
PLL 9
FPLL9CLK
Notes to Figure 2–75:
(1)
(2)
(3)
Wire-bond packages support up to 624 Mbps.
See Table 2–38 through 2–41 for the number of channels each device supports.
There is a multiplexer here to select the PLL clock source. If a PLL uses this multiplexer to clock channels outside of
its bank quadrant, those clocked channels support up to 840 Mbps for “high” speed channels and 462 Mbps for
“low” speed channels as labeled in the device pin-outs at www.altera.com.
Altera Corporation
July 2005
2–139
Stratix Device Handbook, Volume 1
Power Sequencing & Hot Socketing
The transmitter external clock output is transmitted on a data channel.
The txclk pin for each bank is located in between data transmitter pins.
For ×1 clocks (e.g., 622 Mbps, 622 MHz), the high-speed PLL clock
bypasses the SERDES to drive the output pins. For half-rate clocks (e.g.,
622 Mbps, 311 MHz) or any other even-numbered factor such as 1/4, 1/7,
1/8, or 1/10, the SERDES automatically generates the clock in the
Quartus II software.
For systems that require more than four or eight high-speed differential
I/O clock domains, a SERDES bypass implementation is possible using
IOEs.
Byte Alignment
For high-speed source synchronous interfaces such as POS-PHY 4, XSBI,
RapidIO, and HyperTransport technology, the source synchronous clock
rate is not a byte- or SERDES-rate multiple of the data rate. Byte
alignment is necessary for these protocols since the source synchronous
clock does not provide a byte or word boundary since the clock is one half
the data rate, not one eighth. The Stratix device’s high-speed differential
I/O circuitry provides dedicated data realignment circuitry for usercontrolled byte boundary shifting. This simplifies designs while saving
LE resources. An input signal to each fast PLL can stall deserializer
parallel data outputs by one bit period. You can use an LE-based state
machine to signal the shift of receiver byte boundaries until a specified
pattern is detected to indicate byte alignment.
Power
Sequencing &
Hot Socketing
Because Stratix devices can be used in a mixed-voltage environment, they
have been designed specifically to tolerate any possible power-up
sequence. Therefore, the VCCIO and VCCINT power supplies may be
powered in any order.
Although you can power up or down the VCCIO and VCCINT power
supplies in any sequence, you should not power down any I/O banks
that contain configuration pins while leaving other I/O banks powered
on. For power up and power down, all supplies (VCCINT and all VCCIO
power planes) must be powered up and down within 100 ms of each
other. This prevents I/O pins from driving out.
Signals can be driven into Stratix devices before and during power up
without damaging the device. In addition, Stratix devices do not drive
out during power up. Once operating conditions are reached and the
device is configured, Stratix devices operate as specified by the user. For
more information, see Hot Socketing in the Selectable I/O Standards in
Stratix & Stratix GX Devices chapter in the Stratix Device Handbook,
Volume 2.
2–140
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
3. Configuration & Testing
S51003-1.3
IEEE Std. 1149.1
(JTAG)
Boundary-Scan
Support
All Stratix® devices provide JTAG BST circuitry that complies with the
IEEE Std. 1149.1a-1990 specification. JTAG boundary-scan testing can be
performed either before or after, but not during configuration. Stratix
devices can also use the JTAG port for configuration together with either
the Quartus® II software or hardware using either Jam Files (.jam) or Jam
Byte-Code Files (.jbc).
Stratix devices support IOE I/O standard setting reconfiguration through
the JTAG BST chain. The JTAG chain can update the I/O standard for all
input and output pins any time before or during user mode through the
CONFIG_IO instruction. You can use this ability for JTAG testing before
configuration when some of the Stratix pins drive or receive from other
devices on the board using voltage-referenced standards. Since the Stratix
device may not be configured before JTAG testing, the I/O pins may not
be configured for appropriate electrical standards for chip-to-chip
communication. Programming those I/O standards via JTAG allows you
to fully test the I/O connection to other devices.
The enhanced PLL reconfiguration bits are part of the JTAG chain before
configuration and after power-up. After device configuration, the PLL
reconfiguration bits are not part of the JTAG chain.
The JTAG pins support 1.5-V/1.8-V or 2.5-V/3.3-V I/O standards. The
TDO pin voltage is determined by the VCCIO of the bank where it resides.
The VCCSEL pin selects whether the JTAG inputs are 1.5-V, 1.8-V, 2.5-V, or
3.3-V compatible.
Stratix devices also use the JTAG port to monitor the logic operation of the
device with the SignalTap® II embedded logic analyzer. Stratix devices
support the JTAG instructions shown in Table 3–1.
The Quartus II software has an Auto Usercode feature where you can
choose to use the checksum value of a programming file as the JTAG user
code. If selected, the checksum is automatically loaded to the USERCODE
register. In the Settings dialog box in the Assignments menu, click Device
& Pin Options, then General, and then turn on the Auto Usercode
option.
Altera Corporation
July 2005
3–1
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support
Table 3–1. Stratix JTAG Instructions
JTAG Instruction
Instruction Code
Description
SAMPLE/PRELOAD 00 0000 0101
Allows a snapshot of signals at the device pins to be captured and
examined during normal device operation, and permits an initial
data pattern to be output at the device pins. Also used by the
SignalTap II embedded logic analyzer.
EXTEST (1)
00 0000 0000
Allows the external circuitry and board-level interconnects to be
tested by forcing a test pattern at the output pins and capturing test
results at the input pins.
BYPASS
11 1111 1111
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation.
USERCODE
00 0000 0111
Selects the 32-bit USERCODE register and places it between the
TDI and TDO pins, allowing the USERCODE to be serially shifted
out of TDO.
IDCODE
00 0000 0110
Selects the IDCODE register and places it between TDI and TDO,
allowing the IDCODE to be serially shifted out of TDO.
HIGHZ (1)
00 0000 1011
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation, while
tri-stating all of the I/O pins.
CLAMP (1)
00 0000 1010
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation while
holding I/O pins to a state defined by the data in the boundary-scan
register.
ICR instructions
Used when configuring an Stratix device via the JTAG port with a
MasterBlasterTM, ByteBlasterMVTM, or ByteBlasterTM II download
cable, or when using a Jam File or Jam Byte-Code File via an
embedded processor or JRunner.
PULSE_NCONFIG
00 0000 0001
Emulates pulsing the nCONFIG pin low to trigger reconfiguration
even though the physical pin is unaffected.
CONFIG_IO
00 0000 1101
Allows configuration of I/O standards through the JTAG chain for
JTAG testing. Can be executed before, after, or during
configuration. Stops configuration if executed during configuration.
Once issued, the CONFIG_IO instruction will hold nSTATUS low
to reset the configuration device. nSTATUS is held low until the
device is reconfigured.
SignalTap II
instructions
Monitors internal device operation with the SignalTap II embedded
logic analyzer.
Note to Table 3–1:
(1)
Bus hold and weak pull-up resistor features override the high-impedance state of HIGHZ, CLAMP, and EXTEST.
3–2
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Configuration & Testing
The Stratix device instruction register length is 10 bits and the USERCODE
register length is 32 bits. Tables 3–2 and 3–3 show the boundary-scan
register length and device IDCODE information for Stratix devices.
Table 3–2. Stratix Boundary-Scan Register Length
Device
Boundary-Scan Register Length
EP1S10
1,317
EP1S20
1,797
EP1S25
2,157
EP1S30
2,253
EP1S40
2,529
EP1S60
3,129
EP1S80
3,777
Table 3–3. 32-Bit Stratix Device IDCODE
IDCODE (32 Bits) (1)
Device
Version (4 Bits)
Part Number (16 Bits)
Manufacturer Identity
(11 Bits)
LSB (1 Bit) (2)
EP1S10
0000
0010 0000 0000 0001
000 0110 1110
1
EP1S20
0000
0010 0000 0000 0010
000 0110 1110
1
EP1S25
0000
0010 0000 0000 0011
000 0110 1110
1
EP1S30
0000
0010 0000 0000 0100
000 0110 1110
1
EP1S40
0000
0010 0000 0000 0101
000 0110 1110
1
EP1S60
0000
0010 0000 0000 0110
000 0110 1110
1
EP1S80
0000
0010 0000 0000 0111
000 0110 1110
1
Notes to Tables 3–2 and 3–3:
(1)
(2)
The most significant bit (MSB) is on the left.
The IDCODE’s least significant bit (LSB) is always 1.
Altera Corporation
July 2005
3–3
Stratix Device Handbook, Volume 1
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support
Figure 3–1 shows the timing requirements for the JTAG signals.
Figure 3–1. Stratix JTAG Waveforms
TMS
TDI
t JCP
t JCH
t JCL
t JPSU
t JPH
TCK
tJPZX
t JPXZ
t JPCO
TDO
tJSH
tJSSU
Signal
to Be
Captured
Signal
to Be
Driven
tJSCO
tJSZX
tJSXZ
Table 3–4 shows the JTAG timing parameters and values for Stratix
devices.
Table 3–4. Stratix JTAG Timing Parameters & Values
Symbol
Parameter
Min
Max
Unit
tJCP
TCK clock period
100
ns
tJCH
TCK clock high time
50
ns
tJCL
TCK clock low time
50
ns
tJPSU
JTAG port setup time
20
ns
tJPH
JTAG port hold time
45
ns
tJPCO
JTAG port clock to output
25
ns
tJPZX
JTAG port high impedance to valid output
25
ns
tJPXZ
JTAG port valid output to high impedance
25
ns
tJSSU
Capture register setup time
20
tJSH
Capture register hold time
45
tJSCO
Update register clock to output
35
ns
tJSZX
Update register high impedance to valid output
35
ns
tJSXZ
Update register valid output to high impedance
35
ns
3–4
Stratix Device Handbook, Volume 1
ns
ns
Altera Corporation
July 2005
Configuration & Testing
1
f
Stratix, Stratix II, Cyclone®, and Cyclone II devices must be
within the first 17 devices in a JTAG chain. All of these devices
have the same JTAG controller. If any of the Stratix, Stratix II,
Cyclone, and Cyclone II devices are in the 18th or after they will
fail configuration. This does not affect SignalTap II.
For more information on JTAG, see the following documents:
■
■
AN 39: IEEE Std. 1149.1 (JTAG) Boundary-Scan Testing in Altera Devices
Jam Programming & Test Language Specification
SignalTap II
Embedded Logic
Analyzer
Stratix devices feature the SignalTap II embedded logic analyzer, which
monitors design operation over a period of time through the IEEE Std.
1149.1 (JTAG) circuitry. You can analyze internal logic at speed without
bringing internal signals to the I/O pins. This feature is particularly
important for advanced packages, such as FineLine BGA® packages,
because it can be difficult to add a connection to a pin during the
debugging process after a board is designed and manufactured.
Configuration
The logic, circuitry, and interconnects in the Stratix architecture are
configured with CMOS SRAM elements. Altera® devices are
reconfigurable. Because every device is tested with a high-coverage
production test program, you do not have to perform fault testing and can
focus on simulation and design verification.
Stratix devices are configured at system power-up with data stored in an
Altera serial configuration device or provided by a system controller.
Altera offers in-system programmability (ISP)-capable configuration
devices that configure Stratix devices via a serial data stream. Stratix
devices can be configured in under 100 ms using 8-bit parallel data at
100 MHz. The Stratix device’s optimized interface allows
microprocessors to configure it serially or in parallel, and synchronously
or asynchronously. The interface also enables microprocessors to treat
Stratix devices as memory and configure them by writing to a virtual
memory location, making reconfiguration easy. After a Stratix device has
been configured, it can be reconfigured in-circuit by resetting the device
and loading new data. Real-time changes can be made during system
operation, enabling innovative reconfigurable computing applications.
Operating Modes
The Stratix architecture uses SRAM configuration elements that require
configuration data to be loaded each time the circuit powers up. The
process of physically loading the SRAM data into the device is called
configuration. During initialization, which occurs immediately after
Altera Corporation
July 2005
3–5
Stratix Device Handbook, Volume 1
Configuration
configuration, the device resets registers, enables I/O pins, and begins to
operate as a logic device. The I/O pins are tri-stated during power-up,
and before and during configuration. Together, the configuration and
initialization processes are called command mode. Normal device
operation is called user mode.
SRAM configuration elements allow Stratix devices to be reconfigured incircuit by loading new configuration data into the device. With real-time
reconfiguration, the device is forced into command mode with a device
pin. The configuration process loads different configuration data,
reinitializes the device, and resumes user-mode operation. You can
perform in-field upgrades by distributing new configuration files either
within the system or remotely.
PORSEL is a dedicated input pin used to select POR delay times of 2 ms
or 100 ms during power-up. When the PORSEL pin is connected to
ground, the POR time is 100 ms; when the PORSEL pin is connected to
VCC, the POR time is 2 ms.
The nIO_PULLUP pin enables a built-in weak pull-up resistor to pull all
user I/O pins to VCCIO before and during device configuration. If
nIO_PULLUP is connected to VCC during configuration, the weak pullups on all user I/O pins are disabled. If connected to ground, the pull-ups
are enabled during configuration. The nIO_PULLUP pin can be pulled to
1.5, 1.8, 2.5, or 3.3 V for a logic level high.
VCCSEL is a dedicated input that is used to choose whether all dedicated
configuration and JTAG input pins can accept 1.5 V/1.8 V or 2.5 V/3.3 V
during configuration. A logic low sets 3.3 V/2.5 V, and a logic high sets
1.8 V/1.5 V. VCCSEL affects the following pins: TDI, TMS, TCK, TRST,
MSEL0, MSEL1, MSEL2, nCONFIG, nCE, DCLK, PLL_ENA, CONF_DONE,
nSTATUS. The VCCSEL pin can be pulled to 1.5, 1.8, 2.5, or 3.3 V for a logic
level high.
The VCCSEL signal does not control the dual-purpose configuration pins
such as the DATA[7..0] and PPA pins (nWS, nRS, CS, nCS, and
RDYnBSY). During configuration, these dual-purpose pins will drive out
voltage levels corresponding to the VCCIO supply voltage that powers the
I/O bank containing the pin. After configuration, the dual-purpose pins
use I/O standards specified in the user design.
TDO and nCEO drive out at the same voltages as the VCCIO supply that
powers the I/O bank containing the pin. Users must select the VCCIO
supply for bank containing TDO accordingly. For example, when using
the ByteBlaster™ MV cable, the VCCIO for the bank containing TDO must
be powered up at 3.3 V.
3–6
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Configuration & Testing
Configuring Stratix FPGAs with JRunner
JRunner is a software driver that configures Altera FPGAs, including
Stratix FPGAs, through the ByteBlaster II or ByteBlasterMV cables in
JTAG mode. The programming input file supported is in Raw Binary File
(.rbf) format. JRunner also requires a Chain Description File (.cdf)
generated by the Quartus II software. JRunner is targeted for embedded
JTAG configuration. The source code is developed for the Windows NT
operating system (OS), but can be customized to run on other platforms.
For more information on the JRunner software driver, see the JRunner
Software Driver: An Embedded Solution to the JTAG Configuration
White Paper and the source files on the Altera web site (www.altera.com).
Configuration Schemes
You can load the configuration data for a Stratix device with one of five
configuration schemes (see Table 3–5), chosen on the basis of the target
application. You can use a configuration device, intelligent controller, or
the JTAG port to configure a Stratix device. A configuration device can
automatically configure a Stratix device at system power-up.
Multiple Stratix devices can be configured in any of five configuration
schemes by connecting the configuration enable (nCE) and configuration
enable output (nCEO) pins on each device.
Table 3–5. Data Sources for Configuration
Configuration Scheme
Data Source
Configuration device
Enhanced or EPC2 configuration device
Passive serial (PS)
MasterBlaster, ByteBlasterMV, or ByteBlaster II
download cable or serial data source
Passive parallel
asynchronous (PPA)
Parallel data source
Fast passive parallel
Parallel data source
JTAG
MasterBlaster, ByteBlasterMV, or ByteBlaster II
download cable, a microprocessor with a Jam or
JBC file, or JRunner
Partial Reconfiguration
The enhanced PLLs within the Stratix device family support partial
reconfiguration of their multiply, divide, and time delay settings without
reconfiguring the entire device. You can use either serial data from the
logic array or regular I/O pins to program the PLL’s counter settings in a
serial chain. This option provides considerable flexibility for frequency
Altera Corporation
July 2005
3–7
Stratix Device Handbook, Volume 1
Configuration
synthesis, allowing real-time variation of the PLL frequency and delay.
The rest of the device is functional while reconfiguring the PLL. See the
Stratix Architecture chapter of the Stratix Device Handbook, Volume 1 for
more information on Stratix PLLs.
Remote Update Configuration Modes
Stratix devices also support remote configuration using an Altera
enhanced configuration device (e.g., EPC16, EPC8, and EPC4 devices)
with page mode selection. Factory configuration data is stored in the
default page of the configuration device. This is the default configuration
that contains the design required to control remote updates and handle
or recover from errors. You write the factory configuration once into the
flash memory or configuration device. Remote update data can update
any of the remaining pages of the configuration device. If there is an error
or corruption in a remote update configuration, the configuration device
reverts back to the factory configuration information.
There are two remote configuration modes: remote and local
configuration. You can use the remote update configuration mode for all
three configuration modes: serial, parallel synchronous, and parallel
asynchronous. Configuration devices (for example, EPC16 devices) only
support serial and parallel synchronous modes. Asynchronous parallel
mode allows remote updates when an intelligent host is used to configure
the Stratix device. This host must support page mode settings similar to
an EPC16 device.
Remote Update Mode
When the Stratix device is first powered up in remote update
programming mode, it loads the configuration located at page address
“000.” The factory configuration should always be located at page
address “000,” and should never be remotely updated. The factory
configuration contains the required logic to perform the following
operations:
■
■
■
Determine the page address/load location for the next application’s
configuration data
Recover from a previous configuration error
Receive new configuration data and write it into the configuration
device
The factory configuration is the default and takes control if an error
occurs while loading the application configuration.
3–8
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Configuration & Testing
While in the factory configuration, the factory-configuration logic
performs the following operations:
■
■
■
Loads a remote update-control register to determine the page
address of the new application configuration
Determines whether to enable a user watchdog timer for the
application configuration
Determines what the watchdog timer setting should be if it is
enabled
The user watchdog timer is a counter that must be continually reset
within a specific amount of time in the user mode of an application
configuration to ensure that valid configuration occurred during a remote
update. Only valid application configurations designed for remote
update can reset the user watchdog timer in user mode. If a valid
application configuration does not reset the user watchdog timer in a
specific amount of time, the timer updates a status register and loads the
factory configuration. The user watchdog timer is automatically disabled
for factory configurations.
If an error occurs in loading the application configuration, the
configuration logic writes a status register to specify the cause of the error.
Once this occurs, the Stratix device automatically loads the factory
configuration, which reads the status register and determines the reason
for reconfiguration. Based on the reason, the factory configuration will
take appropriate steps and will write the remote update control register
to specify the next application configuration page to be loaded.
When the Stratix device successfully loads the application configuration,
it enters into user mode. The Stratix device then executes the main
application of the user. Intellectual property (IP), such as a Nios® (16-bit
ISA) and Nios® II (32-bit ISA) embedded processors, can help the Stratix
device determine when remote update is coming. The Nios embedded
processor or user logic receives incoming data, writes it to the
configuration device, and loads the factory configuration. The factory
configuration will read the remote update status register and determine
the valid application configuration to load. Figure 3–2 shows the Stratix
remote update. Figure 3–3 shows the transition diagram for remote
update mode.
Altera Corporation
July 2005
3–9
Stratix Device Handbook, Volume 1
Configuration
Figure 3–2. Stratix Device Remote Update
(1)
Watchdog
Timer
New Remote
Configuration Data
Configuration
Device
Application Configuration
Page 7
Page 6
Application Configuration
Stratix Device
Factory Configuration
Page 0
Configuration Device Updates
Stratix Device with Factory
Configuration (to Handle Update)
or New Application Configuration
Note to Figure 3–2:
(1)
When the Stratix device is configured with the factory configuration, it can handle update data from EPC16, EPC8,
or EPC4 configuration device pages and point to the next page in the configuration device.
3–10
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Configuration & Testing
Figure 3–3. Remote Update Transition Diagram Notes (1), (2)
Application 1
Configuration
Power-Up
Configuration
Error
Configuration
Error
Reload an
Application
Factory
Configuration
Reload an
Application
Configuration
Error
Application n
Configuration
Notes to Figure 3–3:
(1)
(2)
Remote update of Application Configuration is controlled by a Nios embedded processor or user logic programmed
in the Factory or Application configurations.
Up to seven pages can be specified allowing up to seven different configuration applications.
Altera Corporation
July 2005
3–11
Stratix Device Handbook, Volume 1
Stratix Automated Single Event Upset (SEU) Detection
Local Update Mode
Local update mode is a simplified version of the remote update. This
feature is intended for simple systems that need to load a single
application configuration immediately upon power up without loading
the factory configuration first. Local update designs have only one
application configuration to load, so it does not require a factory
configuration to determine which application configuration to use.
Figure 3–4 shows the transition diagram for local update mode.
Figure 3–4. Local Update Transition Diagram
Power-Up
or nCONFIG
nCONFIG
Application
Configuration
Configuration
Error
Configuration
Error
nCONFIG
Factory
Configuration
Stratix
Automated
Single Event
Upset (SEU)
Detection
Stratix devices offer on-chip circuitry for automated checking of single
event upset (SEU) detection. FPGA devices that operate at high elevations
or in close proximity to earth’s North or South Pole require periodic
checks to ensure continued data integrity. The error detection cyclic
redundancy check (CRC) feature controlled by the Device & Pin Options
dialog box in the Quartus II software uses a 32-bit CRC circuit to ensure
data reliability and is one of the best options for mitigating SEU.
3–12
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
Configuration & Testing
For Stratix, the CRC is computed by the Quartus II software and
downloaded into the device as a part of the configuration bit stream. The
CRC_ERROR pin reports a soft error when configuration SRAM data is
corrupted, triggering device reconfiguration.
Custom-Built Circuitry
Dedicated circuitry is built in the Stratix devices to perform error
detection automatically. You can use the built-in dedicated circuitry for
error detection using CRC feature in Stratix devices, eliminating the need
for external logic. This circuitry will perform error detection
automatically when enabled. This error detection circuitry in Stratix
devices constantly checks for errors in the configuration SRAM cells
while the device is in user mode. You can monitor one external pin for the
error and use it to trigger a re-configuration cycle. Select the desired time
between checks by adjusting a built-in clock divider.
Software Interface
In the Quartus II software version 4.1 and later, you can turn on the
automated error detection CRC feature in the Device & Pin Options
dialog box. This dialog box allows you to enable the feature and set the
internal frequency of the CRC between 400 kHz to 100 MHz. This controls
the rate that the CRC circuitry verifies the internal configuration SRAM
bits in the FPGA device.
For more information on CRC, see AN 357: Error Detection Using CRC in
Altera FPGA Devices.
Temperature
Sensing Diode
Stratix devices include a diode-connected transistor for use as a
temperature sensor in power management. This diode is used with an
external digital thermometer device such as a MAX1617A or MAX1619
from MAXIM Integrated Products. These devices steer bias current
through the Stratix diode, measuring forward voltage and converting this
reading to temperature in the form of an 8-bit signed number (7 bits plus
sign). The external device’s output represents the junction temperature of
the Stratix device and can be used for intelligent power management.
The diode requires two pins (tempdiodep and tempdioden) on the
Stratix device to connect to the external temperature-sensing device, as
shown in Figure 3–5. The temperature sensing diode is a passive element
and therefore can be used before the Stratix device is powered.
Altera Corporation
July 2005
3–13
Stratix Device Handbook, Volume 1
Temperature Sensing Diode
Figure 3–5. External Temperature-Sensing Diode
Stratix Device
Temperature-Sensing
Device
tempdiodep
tempdioden
Table 3–6 shows the specifications for bias voltage and current of the
Stratix temperature sensing diode.
Table 3–6. Temperature-Sensing Diode Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Unit
IBIAS high
80
100
120
μA
IBIAS low
8
10
12
μA
VBP – VBN
VBN
Series resistance
3–14
Stratix Device Handbook, Volume 1
0.3
0.9
0.7
V
V
3
W
Altera Corporation
July 2005
Configuration & Testing
The temperature-sensing diode works for the entire operating range
shown in Figure 3–6.
Figure 3–6. Temperature vs. Temperature-Sensing Diode Voltage
0.95
0.90
100 μA Bias Current
10 μA Bias Current
0.85
0.80
0.75
Voltage
(Across Diode)
0.70
0.65
0.60
0.55
0.50
0.45
0.40
–55
–30
–5
20
45
70
95
120
Temperature ( C)
Altera Corporation
July 2005
3–15
Stratix Device Handbook, Volume 1
Temperature Sensing Diode
3–16
Stratix Device Handbook, Volume 1
Altera Corporation
July 2005
4. DC & Switching
Characteristics
S51004-3.4
Stratix® devices are offered in both commercial and industrial grades.
Industrial devices are offered in -6 and -7 speed grades and commercial
devices are offered in -5 (fastest), -6, -7, and -8 speed grades. This section
specifies the operation conditions for operating junction temperature,
VCCINT and VCCIO voltage levels, and input voltage requirements. The
voltage specifications in this section are specified at the pins of the device
(and not the power supply). If the device operates outside these ranges,
then all DC and AC specifications are not guaranteed. Furthermore, the
reliability of the device may be affected. The timing parameters in this
chapter apply to both commercial and industrial temperature ranges
unless otherwise stated.
Operating
Conditions
Tables 4–1 through 4–8 provide information on absolute maximum
ratings.
Table 4–1. Stratix Device Absolute Maximum Ratings Notes (1), (2)
Symbol
VCCINT
Parameter
Supply voltage
Conditions
With respect to ground
VCCIO
Minimum
Maximum
Unit
–0.5
2.4
V
–0.5
4.6
V
VI
DC input voltage (3)
–0.5
4.6
V
IOUT
DC output current, per pin
–25
40
mA
TSTG
Storage temperature
No bias
TJ
Junction temperature
BGA packages under bias
–65
150
°C
135
°C
Table 4–2. Stratix Device Recommended Operating Conditions (Part 1 of 2)
Symbol
VCCINT
Parameter
Supply voltage for internal
logic and input buffers
Altera Corporation
January 2006
Conditions
(4)
Minimum
Maximum
Unit
1.425
1.575
V
4–1
Operating Conditions
Table 4–2. Stratix Device Recommended Operating Conditions (Part 2 of 2)
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
3.00 (3.135)
3.60 (3.465)
V
Supply voltage for output
buffers, 3.3-V operation
(4), (5)
Supply voltage for output
buffers, 2.5-V operation
(4)
2.375
2.625
V
Supply voltage for output
buffers, 1.8-V operation
(4)
1.71
1.89
V
Supply voltage for output
buffers, 1.5-V operation
(4)
1.4
1.6
V
VI
Input voltage
(3), (6)
–0.5
4.0
V
VO
Output voltage
0
VCCIO
V
TJ
Operating junction
temperature
0
85
°C
–40
100
°C
VCCIO
For commercial use
For industrial use
Table 4–3. Stratix Device DC Operating Conditions Note (7) (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
II
Input pin leakage
current
VI = VCCIOmax to 0 V (8)
–10
10
μA
IOZ
Tri-stated I/O pin
leakage current
VO = VCCIOmax to 0 V (8)
–10
10
μA
ICC0
VCC supply current
(standby) (All
memory blocks in
power-down mode)
VI = ground, no load, no
toggling inputs
mA
EP1S10. VI = ground, no
load, no toggling inputs
37
mA
EP1S20. VI = ground, no
load, no toggling inputs
65
mA
EP1S25. VI = ground, no
load, no toggling inputs
90
mA
EP1S30. VI = ground, no
load, no toggling inputs
114
mA
EP1S40. VI = ground, no
load, no toggling inputs
145
mA
EP1S60. VI = ground, no
load, no toggling inputs
200
mA
EP1S80. VI = ground, no
load, no toggling inputs
277
mA
4–2
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–3. Stratix Device DC Operating Conditions Note (7) (Part 2 of 2)
Symbol
RCONF
Parameter
Conditions
Minimum
Value of I/O pin pull- VCCIO = 3.0 V (9)
up resistor before
VCCIO = 2.375 V (9)
and during
VCCIO = 1.71 V (9)
configuration
Typical
Maximum
Unit
20
50
kΩ
30
80
kΩ
60
150
kΩ
Table 4–4. LVTTL Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
3.0
3.6
V
VCCIO
Output supply voltage
VI H
High-level input voltage
1.7
4.1
V
VIL
Low-level input voltage
–0.5
0.7
V
VOH
High-level output voltage
IOH = –4 to –24 mA (10)
VOL
Low-level output voltage
IOL = 4 to 24 mA (10)
2.4
V
0.45
V
Minimum
Maximum
Unit
3.0
3.6
V
Table 4–5. LVCMOS Specifications
Symbol
Parameter
Conditions
VCCIO
Output supply voltage
VIH
High-level input voltage
1.7
4.1
V
VIL
Low-level input voltage
–0.5
0.7
V
VOH
High-level output voltage
VCCIO = 3.0,
IOH = –0.1 mA
VOL
Low-level output voltage
VCCIO = 3.0,
IOL = 0.1 mA
VCCIO – 0.2
V
0.2
V
Minimum
Maximum
Unit
2.375
2.625
V
1.7
4.1
V
–0.5
0.7
V
Table 4–6. 2.5-V I/O Specifications
Symbol
Parameter
Conditions
VCCIO
Output supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –1 mA (10)
VOL
Low-level output voltage
IOL = 1 mA (10)
Altera Corporation
January 2006
2.0
V
0.4
V
4–3
Stratix Device Handbook, Volume 1
Operating Conditions
Table 4–7. 1.8-V I/O Specifications
Symbol
Parameter
VCCIO
Output supply voltage
VI H
High-level input voltage
Conditions
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –2 to –8 mA (10)
VOL
Low-level output voltage
IOL = 2 to 8 mA (10)
Minimum
Maximum
Unit
1.65
1.95
V
0.65 × VCCIO
2.25
V
–0.3
0.35 × VCCIO
VCCIO – 0.45
V
V
0.45
V
Minimum
Maximum
Unit
1.4
1.6
V
0.65 × VCCIO
VCCIO + 0.3
V
–0.3
0.35 × VCCIO
V
Table 4–8. 1.5-V I/O Specifications
Symbol
Parameter
VCCIO
Output supply voltage
VI H
High-level input voltage
Conditions
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –2 mA (10)
VOL
Low-level output voltage
IOL = 2 mA (10)
0.75 × VCCIO
V
0.25 × VCCIO
V
Notes to Tables 4–1 through 4–8:
(1)
(2)
See the Operating Requirements for Altera Devices Data Sheet.
Conditions beyond those listed in Table 4–1 may cause permanent damage to a device. Additionally, device
operation at the absolute maximum ratings for extended periods of time may have adverse affects on the device.
(3) Minimum DC input is –0.5 V. During transitions, the inputs may undershoot to –2.0 V for input currents less than
100 mA and periods shorter than 20 ns, or overshoot to the voltage shown in Table 4–9, based on input duty cycle
for input currents less than 100 mA. The overshoot is dependent upon duty cycle of the signal. The DC case is
equivalent to 100% duty cycle.
(4) Maximum VCC rise time is 100 ms, and VCC must rise monotonically.
(5) VCCIO maximum and minimum conditions for LVPECL, LVDS, and 3.3-V PCML are shown in parentheses.
(6) All pins, including dedicated inputs, clock, I/O, and JTAG pins, may be driven before VCCINT and VCCIO are
powered.
(7) Typical values are for TA = 25°C, VCCINT = 1.5 V, and VCCIO = 1.5 V, 1.8 V, 2.5 V, and 3.3 V.
(8) This value is specified for normal device operation. The value may vary during power-up. This applies for all
VCCIO settings (3.3, 2.5, 1.8, and 1.5 V).
(9) Pin pull-up resistance values will lower if an external source drives the pin higher than VCCIO.
(10) Drive strength is programmable according to the values shown in the Stratix Architecture chapter of the Stratix
Device Handbook, Volume 1.
Table 4–9. Overshoot Input Voltage with Respect to Duty Cycle (Part 1 of 2)
4–4
Stratix Device Handbook, Volume 1
Vin (V)
Maximum Duty Cycle (%)
4.0
100
4.1
90
4.2
50
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–9. Overshoot Input Voltage with Respect to Duty Cycle (Part 2 of 2)
Vin (V)
Maximum Duty Cycle (%)
4.3
30
4.4
17
4.5
10
Figures 4–1 and 4–2 show receiver input and transmitter output
waveforms, respectively, for all differential I/O standards (LVDS, 3.3-V
PCML, LVPECL, and HyperTransport technology).
Figure 4–1. Receiver Input Waveforms for Differential I/O Standards
Single-Ended Waveform
Positive Channel (p) = VIH
VID
Negative Channel (n) = VIL
VCM
Ground
Differential Waveform
VID
p−n=0V
VID
Altera Corporation
January 2006
4–5
Stratix Device Handbook, Volume 1
Operating Conditions
Figure 4–2. Transmitter Output Waveforms for Differential I/O Standards
Single-Ended Waveform
Positive Channel (p) = VOH
VOD
Negative Channel (n) = VOL
VCM
Ground
Differential Waveform
VOD
p−n=0V
VOD
Tables 4–10 through 4–33 recommend operating conditions,
DC operating conditions, and capacitance for 1.5-V Stratix
devices.
Table 4–10. 3.3-V LVDS I/O Specifications (Part 1 of 2)
Symbol
Parameter
VCCIO
I/O supply voltage
VID (6)
Input differential voltage
swing (single-ended)
4–6
Stratix Device Handbook, Volume 1
Conditions
Minimum
Typical
Maximum
Unit
3.135
3.3
3.465
V
0.1 V ≤VCM < 1.1 V
W = 1 through 10
300
1,000
mV
1.1 V ≤VCM ≤1.6 V
W=1
200
1,000
mV
1.1 V ≤VCM ≤1.6 V
W = 2 through10
100
1,000
mV
1.6 V < VCM ≤1.8 V
W = 1 through 10
300
1,000
mV
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–10. 3.3-V LVDS I/O Specifications (Part 2 of 2)
Symbol
VICM
Parameter
Input common mode
voltage (6)
Conditions
Typical
Maximum
Unit
LVDS
0.3 V ≤VID ≤1.0 V
W = 1 through 10
100
1,100
mV
LVDS
0.3 V ≤VID ≤1.0 V
W = 1 through 10
1,600
1,800
mV
LVDS
0.2 V ≤VID ≤1.0 V
W=1
1,100
1,600
mV
LVDS
0.1 V ≤VID ≤1.0 V
W = 2 through 10
1,100
1,600
mV
550
mV
50
mV
1,375
mV
50
mV
110
Ω
VOD (1)
Output differential voltage
(single-ended)
RL = 100 Ω
Δ VOD
Change in VOD between
high and low
RL = 100 Ω
VOCM
Output common mode
voltage
RL = 100 Ω
Δ VOCM
Change in VOCM between
high and low
RL = 100 Ω
RL
Receiver differential input
discrete resistor (external
to Stratix devices)
Altera Corporation
January 2006
Minimum
250
375
1,125
90
1,200
100
4–7
Stratix Device Handbook, Volume 1
Operating Conditions
Table 4–11. 3.3-V PCML Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
3.135
3.3
3.465
V
VCCIO
I/O supply voltage
VID (peakto-peak)
Input differential voltage
swing (single-ended)
300
600
mV
VICM
Input common mode
voltage
1.5
3.465
V
VOD
Output differential voltage
(single-ended)
300
500
mV
Δ VOD
Change in VOD between
high and low
50
mV
VOCM
Output common mode
voltage
3.3
V
Δ VOCM
Change in VOCM between
high and low
50
mV
2.5
370
2.85
VT
Output termination voltage
R1
Output external pull-up
resistors
45
VCCIO
50
55
V
Ω
R2
Output external pull-up
resistors
45
50
55
Ω
Minimum
Typical
Maximum
Unit
3.135
3.3
3.465
V
300
1,000
mV
1
2
V
Table 4–12. LVPECL Specifications
Symbol
Parameter
Conditions
VCCIO
I/O supply voltage
VID (peakto-peak)
Input differential voltage
swing (single-ended)
VICM
Input common mode
voltage
VOD
Output differential voltage
(single-ended)
RL = 100 Ω
525
700
970
mV
VOCM
Output common mode
voltage
RL = 100 Ω
1.5
1.7
1.9
V
RL
Receiver differential input
resistor
90
100
110
Ω
4–8
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–13. HyperTransport Technology Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
2.375
2.5
2.625
V
VCCIO
I/O supply voltage
VID (peakto-peak)
Input differential voltage
swing (single-ended)
300
900
mV
VICM
Input common mode
voltage
300
900
mV
VOD
Output differential voltage
(single-ended)
RL = 100 Ω
820
mV
Δ VOD
Change in VOD between
high and low
RL = 100 Ω
50
mV
VOCM
Output common mode
voltage
RL = 100 Ω
780
mV
Δ VOCM
Change in VOCM between
high and low
RL = 100 Ω
50
mV
RL
Receiver differential input
resistor
380
485
440
650
90
100
110
Ω
Minimum
Typical
Maximum
Unit
3.0
3.3
3.6
V
Table 4–14. 3.3-V PCI Specifications
Symbol
Parameter
Conditions
VCCIO
Output supply voltage
VIH
High-level input voltage
0.5 ×
VCCIO
VCCIO +
0.5
V
VIL
Low-level input voltage
–0.5
0.3 ×
VCCIO
V
VOH
High-level output voltage
IOUT = –500 μA
VOL
Low-level output voltage
IOUT = 1,500 μA
Altera Corporation
January 2006
0.9 ×
VCCIO
V
0.1 ×
VCCIO
V
4–9
Stratix Device Handbook, Volume 1
Operating Conditions
Table 4–15. PCI-X 1.0 Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
3.0
3.6
V
VCCIO
Output supply voltage
VIH
High-level input voltage
0.5 ×
VCCIO
VCCIO +
0.5
V
VIL
Low-level input voltage
–0.5
0.35 ×
VCCIO
V
VIPU
Input pull-up voltage
0.7 ×
VCCIO
V
VOH
High-level output voltage
IOUT = –500 μA
0.9 ×
VCCIO
V
VOL
Low-level output voltage
IOUT = 1,500 μA
0.1 ×
VCCIO
V
Table 4–16. GTL+ I/O Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VTT
Termination voltage
1.35
1.5
1.65
V
VREF
Reference voltage
0.88
1.0
1.12
V
VIH
High-level input voltage
VIL
Low-level input voltage
VOL
Low-level output voltage
VREF + 0.1
V
IOL = 34 mA (3)
VREF – 0.1
V
0.65
V
Table 4–17. GTL I/O Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VTT
Termination voltage
1.14
1.2
1.26
V
VREF
Reference voltage
0.74
0.8
0.86
V
VIH
High-level input voltage
VIL
Low-level input voltage
VOL
Low-level output voltage
4–10
Stratix Device Handbook, Volume 1
VREF +
0.05
IOL = 40 mA (3)
V
VREF –
0.05
V
0.4
V
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–18. SSTL-18 Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.65
1.8
1.95
V
VREF
Reference voltage
0.8
0.9
1.0
V
VREF – 0.04
VREF
VREF + 0.04
VTT
Termination voltage
VIH(DC)
High-level DC input voltage
VIL(DC)
Low-level DC input voltage
VIH(AC)
High-level AC input voltage
VREF +
0.125
VREF – 0.125
VREF +
0.275
VIL(AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –6.7 mA
(3)
VOL
Low-level output voltage
IOL = 6.7 mA (3)
V
V
V
V
VREF – 0.275
VTT + 0.475
V
V
VTT – 0.475
V
Typical
Maximum
Unit
Table 4–19. SSTL-18 Class II Specifications
Symbol
Parameter
Conditions
Minimum
VCCIO
Output supply voltage
1.65
1.8
1.95
V
VREF
Reference voltage
0.8
0.9
1.0
V
VTT
Termination voltage
VREF – 0.04
VREF
VREF + 0.04
V
VIH(DC)
High-level DC input voltage
VIL(DC)
Low-level DC input voltage
VIH(AC)
High-level AC input voltage
VIL(AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –13.4 mA
(3)
VOL
Low-level output voltage
IOL = 13.4 mA (3)
Altera Corporation
January 2006
VREF +
0.125
V
VREF – 0.125
VREF +
0.275
V
V
VREF – 0.275
VTT + 0.630
V
V
VTT – 0.630
V
4–11
Stratix Device Handbook, Volume 1
Operating Conditions
Table 4–20. SSTL-2 Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
2.375
2.5
2.625
V
VREF – 0.04
VREF
VREF + 0.04
V
1.15
1.25
VCCIO
Output supply voltage
VTT
Termination voltage
VREF
Reference voltage
1.35
V
VIH(DC)
High-level DC input voltage
VREF + 0.18
3.0
V
VIL(DC)
Low-level DC input voltage
–0.3
VREF – 0.18
V
VIH(AC)
High-level AC input voltage
VREF + 0.35
VIL(AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –8.1 mA
(3)
VOL
Low-level output voltage
IOL = 8.1 mA (3)
V
VREF – 0.35
VTT + 0.57
V
V
VTT – 0.57
V
Maximum
Unit
Table 4–21. SSTL-2 Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
VCCIO
Output supply voltage
VTT
Termination voltage
2.375
2.5
2.625
V
VREF – 0.04
VREF
VREF + 0.04
V
VREF
Reference voltage
1.15
1.25
1.35
V
VIH(DC)
High-level DC input voltage
VREF + 0.18
VCCIO + 0.3
V
VIL(DC)
Low-level DC input voltage
–0.3
VREF – 0.18
V
VIH(AC)
High-level AC input voltage
VREF + 0.35
VIL(AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –16.4 mA
(3)
VOL
Low-level output voltage
IOL = 16.4 mA (3)
V
VREF – 0.35
VTT + 0.76
V
V
VTT – 0.76
V
Table 4–22. SSTL-3 Class I Specifications (Part 1 of 2)
Symbol
Parameter
VCCIO
Output supply voltage
Conditions
Minimum
Typical
Maximum
Unit
3.0
3.3
3.6
V
VTT
Termination voltage
VREF – 0.05
VREF
VREF + 0.05
V
VREF
Reference voltage
1.3
1.5
1.7
V
VIH(DC)
High-level DC input voltage
VREF + 0.2
VCCIO + 0.3
V
VIL(DC)
Low-level DC input voltage
–0.3
VREF – 0.2
V
VIH(AC)
High-level AC input voltage
VREF + 0.4
4–12
Stratix Device Handbook, Volume 1
V
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–22. SSTL-3 Class I Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
VIL(AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –8 mA (3)
VOL
Low-level output voltage
IOL = 8 mA (3)
Minimum
Typical
Maximum
Unit
VREF – 0.4
V
VTT + 0.6
V
VTT – 0.6
V
Table 4–23. SSTL-3 Class II Specifications
Symbol
Parameter
VCCIO
Output supply voltage
Conditions
Minimum
Typical
Maximum
Unit
3.0
3.3
3.6
V
VTT
Termination voltage
VREF – 0.05
VREF
VREF + 0.05
V
VREF
Reference voltage
1.3
1.5
1.7
V
VIH(DC)
High-level DC input voltage
VREF + 0.2
VCCIO + 0.3
V
VREF – 0.2
V
VIL(DC)
Low-level DC input voltage
–0.3
VIH(AC)
High-level AC input voltage
VREF + 0.4
VIL(AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –16 mA (3)
VOL
Low-level output voltage
IOL = 16 mA (3)
V
VREF – 0.4
VT T + 0.8
V
V
VTT – 0.8
V
Maximum
Unit
Table 4–24. 3.3-V AGP 2× Specifications
Symbol
Parameter
Conditions
Minimum
Typical
3.15
3.3
VCCIO
Output supply voltage
3.45
V
VREF
Reference voltage
0.39 × VCCIO
0.41 × VCCIO
V
VIH
High-level input voltage (4)
0.5 × VCCIO
VCCIO + 0.5
V
VIL
Low-level input voltage (4)
0.3 × VCCIO
V
VOH
High-level output voltage
IOUT = –0.5 mA
VOL
Low-level output voltage
IOUT = 1.5 mA
0.9 × VCCIO
3.6
V
0.1 × VCCIO
V
Table 4–25. 3.3-V AGP 1× Specifications (Part 1 of 2)
Symbol
Parameter
VCCIO
Output supply voltage
VIH
High-level input voltage (4)
VIL
Low-level input voltage (4)
Altera Corporation
January 2006
Conditions
Minimum
Typical
Maximum
Unit
3.15
3.3
3.45
V
VCCIO + 0.5
V
0.3 × VCCIO
V
0.5 × VCCIO
4–13
Stratix Device Handbook, Volume 1
Operating Conditions
Table 4–25. 3.3-V AGP 1× Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
VOH
High-level output voltage
IOUT = –0.5 mA
VOL
Low-level output voltage
IOUT = 1.5 mA
Minimum
Typical
0.9 × VCCIO
Maximum
Unit
3.6
V
0.1 × VCCIO
V
Table 4–26. 1.5-V HSTL Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.4
1.5
1.6
V
VREF
Input reference voltage
0.68
0.75
0.9
V
VTT
Termination voltage
0.7
0.75
0.8
V
VIH (DC)
DC high-level input voltage
VREF + 0.1
VIL (DC)
DC low-level input voltage
–0.3
VIH (AC)
AC high-level input voltage
VREF + 0.2
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = –8 mA (3)
VOL
Low-level output voltage
IOL = 8 mA (3)
V
VREF – 0.1
V
VREF – 0.2
V
V
VCCIO – 0.4
V
0.4
V
Table 4–27. 1.5-V HSTL Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
1.5
1.6
V
VCCIO
Output supply voltage
1.4
VREF
Input reference voltage
0.68
0.75
0.9
V
VTT
Termination voltage
0.7
0.75
0.8
V
VIH (DC)
DC high-level input voltage
VREF + 0.1
VIL (DC)
DC low-level input voltage
–0.3
VIH (AC)
AC high-level input voltage
VREF + 0.2
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = –16 mA (3)
VOL
Low-level output voltage
IOL = 16 mA (3)
4–14
Stratix Device Handbook, Volume 1
V
VREF – 0.1
V
VREF – 0.2
V
V
VCCIO – 0.4
V
0.4
V
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–28. 1.8-V HSTL Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.65
1.80
1.95
V
VREF
Input reference voltage
0.70
0.90
0.95
V
VTT
Termination voltage
VIH (DC)
DC high-level input voltage
VCCIO ×
0.5
V
VREF + 0.1
VIL (DC)
DC low-level input voltage
–0.5
VIH (AC)
AC high-level input voltage
VREF + 0.2
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = –8 mA (3)
VOL
Low-level output voltage
IOL = 8 mA (3)
V
VREF – 0.1
V
V
VREF – 0.2
VCCIO – 0.4
V
V
0.4
V
Maximum
Unit
Table 4–29. 1.8-V HSTL Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
VCCIO
Output supply voltage
1.65
1.80
1.95
V
VREF
Input reference voltage
0.70
0.90
0.95
V
VTT
Termination voltage
VIH (DC)
DC high-level input voltage
VREF + 0.1
VIL (DC)
DC low-level input voltage
–0.5
VIH (AC)
AC high-level input voltage
VREF + 0.2
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = –16 mA (3)
VOL
Low-level output voltage
IOL = 16 mA (3)
VCCIO ×
0.5
V
V
VREF – 0.1
V
VREF – 0.2
V
V
VCCIO – 0.4
V
0.4
V
Table 4–30. 1.5-V Differential HSTL Class I & Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
1.5
1.6
V
VCCIO
I/O supply voltage
1.4
VDIF (DC)
DC input differential
voltage
0.2
VCM (DC)
DC common mode input
voltage
0.68
VDIF (AC)
AC differential input
voltage
0.4
Altera Corporation
January 2006
V
0.9
V
V
4–15
Stratix Device Handbook, Volume 1
Operating Conditions
Table 4–31. CTT I/O Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
2.05
3.3
3.6
V
VTT/VREF
Termination and input
reference voltage
1.35
1.5
1.65
V
VIH
High-level input voltage
VREF + 0.2
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –8 mA
VOL
Low-level output voltage
IOL = 8 mA
IO
Output leakage current
(when output is high Z)
GND ≤VOUT ≤
VCCIO
V
VREF – 0.2
VREF + 0.4
V
V
VREF – 0.4
V
10
μA
–10
Table 4–32. Bus Hold Parameters
VCCIO Level
Parameter
Conditions
1.5 V
Min
1.8 V
Max
Min
Max
2.5 V
Min
Unit
3.3 V
Max
Min
Max
VIN > VIL
(maximum)
25
30
50
70
μA
High sustaining VIN < VIH
current
(minimum)
-25
–30
–50
–70
μA
Low sustaining
current
Low overdrive
current
0 V < VIN <
VCCIO
160
200
300
500
μA
High overdrive
current
0 V < VIN <
VCCIO
-160
–200
–300
–500
μA
2.0
V
Bus-hold trip
point
0.5
4–16
Stratix Device Handbook, Volume 1
1.0
0.68
1.07
0.7
1.7
0.8
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–33. Stratix Device Capacitance Note (5)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
CIOTB
Input capacitance on I/O pins in I/O banks
3, 4, 7, and 8.
11.5
pF
CIOLR
Input capacitance on I/O pins in I/O banks
1, 2, 5, and 6, including high-speed
differential receiver and transmitter pins.
8.2
pF
CCLKTB
Input capacitance on top/bottom clock input
pins: CLK[4:7] and CLK[12:15].
11.5
pF
CCLKLR
Input capacitance on left/right clock inputs:
CLK1, CLK3, CLK8, CLK10.
7.8
pF
CCLKLR+
Input capacitance on left/right clock inputs:
CLK0, CLK2, CLK9, and CLK11.
4.4
pF
Notes to Tables 4–10 through 4–33:
(1)
(2)
(3)
(4)
(5)
(6)
When tx_outclock port of altlvds_tx megafunction is 717 MHz, VO D ( m i n ) = 235 mV on the output clock pin.
Pin pull-up resistance values will lower if an external source drives the pin higher than VCCIO.
Drive strength is programmable according to the values shown in the Stratix Architecture chapter of the Stratix
Device Handbook, Volume 1.
VREF specifies the center point of the switching range.
Capacitance is sample-tested only. Capacitance is measured using time-domain reflections (TDR). Measurement
accuracy is within ±0.5 pF.
VIO and VCM have multiple ranges and values for J=1 through 10.
Power
Consumption
Altera® offers two ways to calculate power for a design: the Altera web
power calculator and the PowerGaugeTM feature in the Quartus® II
software.
The interactive power calculator on the Altera web site is typically used
prior to designing the FPGA in order to get a magnitude estimate of the
device power. The Quartus II software PowerGauge feature allows you to
apply test vectors against your design for more accurate power
consumption modeling.
In both cases, these calculations should only be used as an estimation of
power, not as a specification.
Stratix devices require a certain amount of power-up current to
successfully power up because of the small process geometry on which
they are fabricated.
Table 4–34 shows the maximum power-up current (ICCINT) required to
power a Stratix device. This specification is for commercial operating
conditions. Measurements were performed with an isolated Stratix
device on the board to characterize the power-up current of an isolated
Altera Corporation
January 2006
4–17
Stratix Device Handbook, Volume 1
Power Consumption
device. Decoupling capacitors were not used in this measurement. To
factor in the current for decoupling capacitors, sum up the current for
each capacitor using the following equation:
I = C (dV/dt)
If the regulator or power supply minimum output current is more than
the Stratix device requires, then the device may consume more current
than the maximum current listed in Table 4–34. However, the device does
not require any more current to successfully power up than what is listed
in Table 4–34.
Table 4–34. Stratix Power-Up Current (ICCINT) Requirements Note (1)
Power-Up Current Requirement
Device
Unit
Typical
Maximum
EP1S10
250
700
mA
EP1S20
400
1,200
mA
EP1S25
500
1,500
mA
EP1S30
550
1,900
mA
EP1S40
650
2,300
mA
EP1S60
800
2,600
mA
EP1S80
1,000
3,000
mA
Note to Table 4–34:
(1)
The maximum test conditions are for 0° C and typical test conditions are for
40° C.
The exact amount of current consumed varies according to the process,
temperature, and power ramp rate. Stratix devices typically require less
current during power up than shown in Table 4–34. The user-mode
current during device operation is generally higher than the power-up
current.
The duration of the ICCINT power-up requirement depends on the VCCINT
voltage supply rise time. The power-up current consumption drops when
the VCCINT supply reaches approximately 0.75 V.
4–18
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Timing Model
The DirectDrive™ technology and MultiTrack™ interconnect ensure
predictable performance, accurate simulation, and accurate timing
analysis across all Stratix device densities and speed grades. This section
describes and specifies the performance, internal, external, and PLL
timing specifications.
All specifications are representative of worst-case supply voltage and
junction temperature conditions.
Preliminary & Final Timing
Timing models can have either preliminary or final status. The Quartus II
software issues an informational message during the design compilation
if the timing models are preliminary. Table 4–35 shows the status of the
Stratix device timing models.
Preliminary status means the timing model is subject to change. Initially,
timing numbers are created using simulation results, process data, and
other known parameters. These tests are used to make the preliminary
numbers as close to the actual timing parameters as possible.
Final timing numbers are based on actual device operation and testing.
These numbers reflect the actual performance of the device under worstcase voltage and junction temperature conditions.
Table 4–35. Stratix Device Timing Model Status
Device
Altera Corporation
January 2006
Preliminary
Final
EP1S10
v
EP1S20
v
EP1S25
v
EP1S30
v
EP1S40
v
EP1S60
v
EP1S80
v
4–19
Stratix Device Handbook, Volume 1
Timing Model
Performance
Table 4–36 shows Stratix performance for some common designs. All
performance values were obtained with Quartus II software compilation
of LPM, or MegaCore® functions for the FIR and FFT designs.
Table 4–36. Stratix Performance (Part 1 of 2) Notes (1), (2)
Resources Used
Applications
LE
16-to-1 multiplexer (1)
TriMatrix
memory
M-RAM
block
TriMatrix
DSP
LEs Memory
Blocks
Blocks
-5
Speed
Grade
-6
Speed
Grade
-7
Speed
Grade
-8
Speed
Grade
Units
22
407.83
324.56
288.68
228.67
MHz
0
0
32-to-1 multiplexer (3)
46
0
0
318.26
255.29
242.89
185.18
MHz
16-bit counter
16
0
0
422.11
422.11
390.01
348.67
MHz
64-bit counter
64
0
0
321.85
290.52
261.23
220.5
MHz
0
1
0
317.76
277.62
241.48
205.21
MHz
30
1
0
319.18
278.86
242.54
206.14
MHz
Simple dual-port RAM
128 × 36 bit
0
1
0
290.86
255.55
222.27
188.89
MHz
True dual-port RAM
128 × 18 bit
0
1
0
290.86
255.55
222.27
188.89
MHz
FIFO 128 × 36 bit
34
1
0
290.86
255.55
222.27
188.89
MHz
Single port
RAM 4K × 144 bit
1
1
0
255.95
223.06
194.06
164.93
MHz
Simple dual-port
RAM 4K × 144 bit
0
1
0
255.95
233.06
194.06
164.93
MHz
True dual-port
RAM 4K × 144 bit
0
1
0
255.95
233.06
194.06
164.93
MHz
Single port
RAM 8K × 72 bit
0
1
0
278.94
243.19
211.59
179.82
MHz
Simple dual-port
RAM 8K × 72 bit
0
1
0
255.95
223.06
194.06
164.93
MHz
True dual-port
RAM 8K × 72 bit
0
1
0
255.95
223.06
194.06
164.93
MHz
Single port
RAM 16K × 36 bit
0
1
0
280.66
254.32
221.28
188.00
MHz
Simple dual-port
RAM 16K × 36 bit
0
1
0
269.83
237.69
206.82
175.74
MHz
Simple dual-port RAM
TriMatrix
32 × 18 bit
memory
M512 block
FIFO 32 × 18 bit
TriMatrix
memory
M4K block
Performance
4–20
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–36. Stratix Performance (Part 2 of 2) Notes (1), (2)
Resources Used
Applications
TriMatrix
memory
M-RAM
block
DSP block
Larger
Designs
TriMatrix
DSP
LEs Memory
Blocks
Blocks
Performance
-5
Speed
Grade
-6
Speed
Grade
-7
Speed
Grade
-8
Speed
Grade
Units
True dual-port
RAM 16K × 36 bit
0
1
0
269.83
237.69
206.82
175.74
MHz
Single port
RAM 32K × 18 bit
0
1
0
275.86
244.55
212.76
180.83
MHz
Simple dual-port
RAM 32K × 18 bit
0
1
0
275.86
244.55
212.76
180.83
MHz
True dual-port
RAM 32K × 18 bit
0
1
0
275.86
244.55
212.76
180.83
MHz
Single port
RAM 64K × 9 bit
0
1
0
287.85
253.29
220.36
187.26
MHz
Simple dual-port
RAM 64K × 9 bit
0
1
0
287.85
253.29
220.36
187.26
MHz
True dual-port
RAM 64K × 9 bit
0
1
0
287.85
253.29
220.36
187.26
MHz
9 × 9-bit multiplier (3)
0
0
1
335.0
293.94
255.68
217.24
MHz
18 × 18-bit multiplier
(4)
0
0
1
278.78
237.41
206.52
175.50
MHz
36 × 36-bit multiplier
(4)
0
0
1
148.25
134.71
117.16
99.59
MHz
36 × 36-bit multiplier
(5)
0
0
1
278.78
237.41
206.52
175.5
MHz
18-bit, 4-tap FIR filter
0
0
1
278.78
237.41
206.52
175.50
MHz
8-bit, 16-tap parallel
FIR filter
58
0
4
141.26
133.49
114.88
100.28
MHz
8-bit, 1,024-point FFT
function
870
5
1
261.09
235.51
205.21
175.22
MHz
Notes to Table 4–36:
(1)
(2)
(3)
(4)
(5)
These design performance numbers were obtained using the Quartus II software.
Numbers not listed will be included in a future version of the data sheet.
This application uses registered inputs and outputs.
This application uses registered multiplier input and output stages within the DSP block.
This application uses registered multiplier input, pipeline, and output stages within the DSP
block.
Altera Corporation
January 2006
4–21
Stratix Device Handbook, Volume 1
Timing Model
Internal Timing Parameters
Internal timing parameters are specified on a speed grade basis
independent of device density. Tables 4–37 through 4–42 describe the
Stratix device internal timing microparameters for LEs, IOEs, TriMatrix™
memory structures, DSP blocks, and MultiTrack interconnects.
Table 4–37. LE Internal Timing Microparameter Descriptions
Symbol
Parameter
tSU
LE register setup time before clock
tH
LE register hold time after clock
tCO
LE register clock-to-output delay
tLUT
LE combinatorial LUT delay for data-in to data-out
tCLR
Minimum clear pulse width
tPRE
Minimum preset pulse width
tCLKHL
Register minimum clock high or low time. The maximum core
clock frequency can be calculated by 1/(2 × tCLKHL).
Table 4–38. IOE Internal Timing Microparameter Descriptions
Symbol
Parameter
tSU_R
Row IOE input register setup time
tSU_C
Column IOE input register setup time
tH
IOE input and output register hold time after clock
tCO_R
Row IOE input and output register clock-to-output delay
tC O _ C
Column IOE input and output register clock-to-output delay
tPIN2COMBOUT_R
Row input pin to IOE combinatorial output
tPIN2COMBOUT_C
Column input pin to IOE combinatorial output
tCOMBIN2PIN_R
Row IOE data input to combinatorial output pin
tCOMBIN2PIN_C
Column IOE data input to combinatorial output pin
tCLR
Minimum clear pulse width
tPRE
Minimum preset pulse width
tCLKHL
Register minimum clock high or low time. The maximum I/O
clock frequency can be calculated by 1/(2 × tCLKHL).
Performance may also be affected by I/O timing, use of PLL,
and I/O programmable settings.
4–22
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–39. DSP Block Internal Timing Microparameter Descriptions
Symbol
Altera Corporation
January 2006
Parameter
tSU
Input, pipeline, and output register setup time before clock
tH
Input, pipeline, and output register hold time after clock
tCO
Input, pipeline, and output register clock-to-output delay
tINREG2PIPE9
Input Register to DSP Block pipeline register in 9 × 9-bit
mode
tINREG2PIPE18
Input Register to DSP Block pipeline register in 18 × 18-bit
mode
tPIPE2OUTREG2ADD
DSP Block Pipeline Register to output register delay in TwoMultipliers Adder mode
tPIPE2OUTREG4ADD
DSP Block Pipeline Register to output register delay in FourMultipliers Adder mode
tPD9
Combinatorial input to output delay for 9 × 9
tPD18
Combinatorial input to output delay for 18 × 18
tPD36
Combinatorial input to output delay for 36 × 36
tCLR
Minimum clear pulse width
tCLKHL
Register minimum clock high or low time. This is a limit on
the min time for the clock on the registers in these blocks.
The actual performance is dependent upon the internal
point-to-point delays in the blocks and may give slower
performance as shown in Table 4–36 on page 4–20 and as
reported by the timing analyzer in the Quartus II software.
4–23
Stratix Device Handbook, Volume 1
Timing Model
Table 4–40. M512 Block Internal Timing Microparameter Descriptions
Symbol
Parameter
tM512RC
Synchronous read cycle time
tM512WC
Synchronous write cycle time
tM512WERESU
Write or read enable setup time before clock
tM512WEREH
Write or read enable hold time after clock
tM512CLKENSU
Clock enable setup time before clock
tM512CLKENH
Clock enable hold time after clock
tM512DATASU
Data setup time before clock
tM512DATAH
Data hold time after clock
tM512WADDRSU
Write address setup time before clock
tM512WADDRH
Write address hold time after clock
tM512RADDRSU
Read address setup time before clock
tM512RADDRH
Read address hold time after clock
tM512DATACO1
Clock-to-output delay when using output registers
tM512DATACO2
Clock-to-output delay without output registers
tM512CLKHL
Register minimum clock high or low time. This is a limit on
the min time for the clock on the registers in these blocks.
The actual performance is dependent upon the internal
point-to-point delays in the blocks and may give slower
performance as shown in Table 4–36 on page 4–20 and as
reported by the timing analyzer in the Quartus II software.
tM512CLR
Minimum clear pulse width
Table 4–41. M4K Block Internal Timing Microparameter Descriptions (Part
1 of 2)
Symbol
Parameter
tM4KRC
Synchronous read cycle time
tM4KWC
Synchronous write cycle time
tM4KWERESU
Write or read enable setup time before clock
tM4KWEREH
Write or read enable hold time after clock
tM4KCLKENSU
Clock enable setup time before clock
tM4KCLKENH
Clock enable hold time after clock
tM4KBESU
Byte enable setup time before clock
tM4KBEH
Byte enable hold time after clock
tM4KDATAASU
A port data setup time before clock
4–24
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–41. M4K Block Internal Timing Microparameter Descriptions (Part
2 of 2)
Symbol
Parameter
tM4KDATAAH
A port data hold time after clock
tM4KADDRASU
A port address setup time before clock
tM4KADDRAH
A port address hold time after clock
tM4KDATABSU
B port data setup time before clock
tM4KDATABH
B port data hold time after clock
tM4KADDRBSU
B port address setup time before clock
tM4KADDRBH
B port address hold time after clock
tM4KDATACO1
Clock-to-output delay when using output registers
tM4KDATACO2
Clock-to-output delay without output registers
tM4KCLKHL
Register minimum clock high or low time. This is a limit on
the min time for the clock on the registers in these blocks.
The actual performance is dependent upon the internal
point-to-point delays in the blocks and may give slower
performance as shown inTable 4–36 on page 4–20 and as
reported by the timing analyzer in the Quartus II software.
tM4KCLR
Minimum clear pulse width
Table 4–42. M-RAM Block Internal Timing Microparameter
Descriptions (Part 1 of 2)
Symbol
Altera Corporation
January 2006
Parameter
tMRAMRC
Synchronous read cycle time
tMRAMWC
Synchronous write cycle time
tMRAMWERESU
Write or read enable setup time before clock
tMRAMWEREH
Write or read enable hold time after clock
tMRAMCLKENSU
Clock enable setup time before clock
tMRAMCLKENH
Clock enable hold time after clock
tMRAMBESU
Byte enable setup time before clock
tMRAMBEH
Byte enable hold time after clock
tMRAMDATAASU
A port data setup time before clock
tMRAMDATAAH
A port data hold time after clock
tMRAMADDRASU
A port address setup time before clock
tMRAMADDRAH
A port address hold time after clock
tMRAMDATABSU
B port setup time before clock
4–25
Stratix Device Handbook, Volume 1
Timing Model
Table 4–42. M-RAM Block Internal Timing Microparameter
Descriptions (Part 2 of 2)
Symbol
Parameter
tMRAMDATABH
B port hold time after clock
tMRAMADDRBSU
B port address setup time before clock
tMRAMADDRBH
B port address hold time after clock
tMRAMDATACO1
Clock-to-output delay when using output registers
tMRAMDATACO2
Clock-to-output delay without output registers
tMRAMCLKHL
Register minimum clock high or low time. This is a limit on
the min time for the clock on the registers in these blocks.
The actual performance is dependent upon the internal
point-to-point delays in the blocks and may give slower
performance as shown in Table 4–36 on page 4–20 and as
reported by the timing analyzer in the Quartus II software.
tMRAMCLR
Minimum clear pulse width.
4–26
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Figure 4–3 shows the TriMatrix memory waveforms for the M512, M4K,
and M-RAM timing parameters shown in Tables 4–40 through 4–42.
Figure 4–3. Dual-Port RAM Timing Microparameter Waveform
wrclock
tWEREH
tWERESU
wren
tWADDRH
tWADDRSU
wraddress
an-1
an
a0
a1
a2
a3
a4
a5
a6
din4
din5
din6
tDATAH
data-in
din-1
din
tDATASU
rdclock
tWEREH
tWERESU
rden
tRC
rdaddress
bn
b1
b0
b2
b3
tDATACO1
reg_data-out
doutn-1
doutn-2
doutn
dout0
tDATACO2
unreg_data-out
doutn
doutn-1
dout0
Internal timing parameters are specified on a speed grade basis
independent of device density. Tables 4–44 through 4–50 show the
internal timing microparameters for LEs, IOEs, TriMatrix memory
structures, DSP blocks, and MultiTrack interconnects.
Table 4–43. Routing Delay Internal Timing Microparameter
Descriptions (Part 1 of 2)
Symbol
Altera Corporation
January 2006
Parameter
tR4
Delay for an R4 line with average loading; covers a distance of four
LAB columns.
tR8
Delay for an R8 line with average loading; covers a distance of eight
LAB columns.
tR24
Delay for an R24 line with average loading; covers a distance of 24
LAB columns.
4–27
Stratix Device Handbook, Volume 1
Timing Model
Table 4–43. Routing Delay Internal Timing Microparameter
Descriptions (Part 2 of 2)
Symbol
Parameter
tC4
Delay for a C4 line with average loading; covers a distance of four
LAB rows.
tC8
Delay for a C8 line with average loading; covers a distance of eight
LAB rows.
tC16
Delay for a C16 line with average loading; covers a distance of 16
LAB rows.
tLOCAL
Local interconnect delay, for connections within a LAB, and for the
final routing hop of connections to LABs, DSP blocks, RAM blocks
and I/Os.
Table 4–44. LE Internal Timing Microparameters
-5
-6
-7
-8
Parameter
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tSU
10
10
11
13
ps
tH
100
100
114
135
ps
tCO
156
tLUT
176
366
202
459
238
527
ps
621
ps
tCLR
100
100
114
135
ps
tPRE
100
100
114
135
ps
tCLKHL
1000
1111
1190
1400
ps
Table 4–45. IOE Internal TSU Microparameter by Device Density (Part 1 of 2)
-5
Device
Min
EP1S10
EP1S20
EP1S25
EP1S30
-6
-7
-8
Unit
Symbol
Max
Min
Max
Min
Max
Min
Max
tSU_R
76
80
80
80
ps
tSU_C
176
80
80
80
ps
tSU_R
76
80
80
80
ps
tSU_C
76
80
80
80
ps
tSU_R
276
280
280
280
ps
tSU_C
276
280
280
280
ps
tSU_R
76
80
80
80
ps
tSU_C
176
180
180
180
ps
4–28
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–45. IOE Internal TSU Microparameter by Device Density (Part 2 of 2)
-5
Device
Min
EP1S40
EP1S60
EP1S80
-6
-7
-8
Unit
Symbol
Max
Min
Max
Min
Max
Min
Max
tSU_R
76
80
80
80
ps
tSU_C
376
380
380
380
ps
tSU_R
276
280
280
280
ps
tS U _ C
276
280
280
280
ps
tSU_R
426
430
430
430
ps
tSU_C
76
80
80
80
ps
Table 4–46. IOE Internal Timing Microparameters
-5
-6
-7
-8
Symbol
Unit
Min
tH
Max
68
Min
Max
71
Min
Max
82
Min
Max
96
ps
tCO_R
171
179
206
242
ps
tCO_C
171
179
206
242
ps
tPIN2COMBOUT_R
1,234
1,295
1,490
1,753
ps
tPIN2COMBOUT_C
1,087
1,141
1,312
1,544
ps
tCOMBIN2PIN_R
3,894
4,089
4,089
4,089
ps
tCOMBIN2PIN_C
4,299
4,494
4,494
4,494
ps
tCLR
276
tPRE
tCLKHL
289
333
392
ps
260
273
313
369
ps
1,000
1,111
1,190
1,400
ps
Table 4–47. DSP Block Internal Timing Microparameters (Part 1 of 2)
-5
-6
-7
-8
Symbol
Unit
Min
tSU
0
tH
67
tCO
Max
Min
Max
0
Min
Max
0
75
Min
Max
0
86
ps
101
ps
142
158
181
214
ps
tINREG2PIPE9
2,613
2,982
3,429
4,035
ps
tINREG2PIPE18
3,390
3,993
4,591
5,402
ps
Altera Corporation
January 2006
4–29
Stratix Device Handbook, Volume 1
Timing Model
Table 4–47. DSP Block Internal Timing Microparameters (Part 2 of 2)
-5
-6
-7
-8
Symbol
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tPIPE2OUTREG2ADD
2,002
2,203
2,533
2,980
ps
tPIPE2OUTREG4ADD
2,899
3,189
3,667
4,314
ps
tPD9
3,709
4,081
4,692
5,520
ps
tPD18
4,795
5,275
6,065
7,135
ps
tPD36
7,495
tCLR
tCLKHL
8,245
9,481
11,154
ps
450
500
575
676
ps
1,350
1,500
1,724
2,029
ps
Table 4–48. M512 Block Internal Timing Microparameters
-5
-6
-7
-8
Symbol
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tM512RC
3,340
3,816
4,387
5,162
ps
tM512WC
3,138
3,590
4,128
4,860
ps
tM512WERESU
110
123
141
166
ps
tM512WEREH
34
38
43
51
ps
tM512CLKENSU
215
215
247
290
ps
tM512CLKENH
–70
–70
–81
–95
ps
tM512DATASU
110
123
141
166
ps
tM512DATAH
34
38
43
51
ps
tM512WADDRSU
110
123
141
166
ps
tM512WADDRH
34
38
43
51
ps
tM512RADDRSU
110
123
141
166
ps
tM512RADDRH
34
38
43
51
ps
tM512DATACO1
424
472
541
637
ps
tM512DATACO2
3,366
3,846
4,421
5,203
ps
tM512CLKHL
tM512CLR
1,000
1,111
1,190
1,400
ps
170
189
217
255
ps
4–30
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–49. M4K Block Internal Timing Microparameters
-5
-6
-7
-8
Symbol
Unit
Min
Max
tM4KRC
Min
Max
3,807
tM4KWC
Min
Max
4,320
2,556
Min
Max
4,967
2,840
5,844
3,265
3,842
ps
ps
tM4KWERESU
131
149
171
202
ps
tM4KWEREH
34
38
43
51
ps
tM4KCLKENSU
193
215
247
290
ps
tM4KCLKENH
–63
–70
–81
–95
ps
tM4KBESU
131
149
171
202
ps
tM4KBEH
34
38
43
51
ps
tM4KDATAASU
131
149
171
202
ps
tM4KDATAAH
34
38
43
51
ps
tM4KADDRASU
131
149
171
202
ps
tM4KADDRAH
34
38
43
51
ps
tM4KDATABSU
131
149
171
202
ps
tM4KDATABH
34
38
43
51
ps
tM4KADDRBSU
131
149
171
202
ps
tM4KADDRBH
34
38
43
51
ps
tM4KDATACO1
571
tM4KDATACO2
tM4KCLKHL
tM4KCLR
635
3,984
729
4,507
858
5,182
6,097
ps
ps
1,000
1,111
1,190
1,400
ps
170
189
217
255
ps
Table 4–50. M-RAM Block Internal Timing Microparameters (Part 1 of 2)
-5
-6
-7
-8
Symbol
Unit
Min
tMRAMRC
Max
Min
4,364
tMRAMWC
Max
Min
4,838
3,654
Max
Min
5,562
4,127
Max
6,544
4,746
5,583
ps
ps
tMRAMWERESU
25
25
28
33
ps
tMRAMWEREH
18
20
23
27
ps
tMRAMCLKENSU
99
111
127
150
ps
tMRAMCLKENH
–48
–53
–61
–72
ps
Altera Corporation
January 2006
4–31
Stratix Device Handbook, Volume 1
Timing Model
Table 4–50. M-RAM Block Internal Timing Microparameters (Part 2 of 2)
-5
-6
-7
-8
Symbol
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tMRAMBESU
25
25
28
33
ps
tMRAMBEH
18
20
23
27
ps
tMRAMDATAASU
25
25
28
33
ps
tMRAMDATAAH
18
20
23
27
ps
tMRAMADDRASU
25
25
28
33
ps
tMRAMADDRAH
18
20
23
27
ps
tMRAMDATABSU
25
25
28
33
ps
tMRAMDATABH
18
20
23
27
ps
tMRAMADDRBSU
25
25
28
33
ps
tMRAMADDRBH
18
20
23
27
ps
tMRAMDATACO1
1,038
tMRAMDATACO2
1,053
4,362
tMRAMCLKHL
1,210
4,939
1,424
5,678
ps
6,681
ps
1,000
1,111
1,190
1,400
ps
135
150
172
202
ps
tMRAMCLR
Table 4–51. Routing Delay Internal Timing Parameters
-5
-6
-7
-8
Unit
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
tR 4
268
295
339
390
ps
tR 8
371
349
401
461
ps
tR 2 4
465
512
588
676
ps
tC 4
440
484
557
641
ps
tC 8
577
634
730
840
ps
tC 1 6
445
489
563
647
ps
tL O C A L
313
345
396
455
ps
Routing delays vary depending on the load on that specific routing line.
The Quartus II software reports the routing delay information when
running the timing analysis for a design.
4–32
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
External Timing Parameters
External timing parameters are specified by device density and speed
grade. Figure 4–4 shows the pin-to-pin timing model for bidirectional
IOE pin timing. All registers are within the IOE.
Figure 4–4. External Timing in Stratix Devices
OE Register
D
PRN
Q
Dedicated
Clock
CLRN
Output Register
D
PRN
Q
tINSU
tINH
tOUTCO
tXZ
tZX
Bidirectional
Pin
CLRN
Input Register
D
PRN
Q
CLRN
All external timing parameters reported in this section are defined with
respect to the dedicated clock pin as the starting point. All external I/O
timing parameters shown are for 3.3-V LVTTL I/O standard with the
24-mA current strength and fast slew rate. For external I/O timing using
standards other than LVTTL or for different current strengths, use the I/O
standard input and output delay adders in Tables 4–103 through 4–108.
Altera Corporation
January 2006
4–33
Stratix Device Handbook, Volume 1
Timing Model
Table 4–52 shows the external I/O timing parameters when using fast
regional clock networks.
Table 4–52. Stratix Fast Regional Clock External I/O Timing Parameters
Notes (1), (2)
Symbol
Parameter
tINSU
Setup time for input or bidirectional pin using IOE input register with
fast regional clock fed by FCLK pin
tINH
Hold time for input or bidirectional pin using IOE input register with
fast regional clock fed by FCLK pin
tOUTCO
Clock-to-output delay output or bidirectional pin using IOE output
register with fast regional clock fed by FCLK pin
tXZ
Synchronous IOE output enable register to output pin disable delay
using fast regional clock fed by FCLK pin
tZX
Synchronous IOE output enable register to output pin enable delay
using fast regional clock fed by FCLK pin
Notes to Table 4–52:
(1)
(2)
These timing parameters are sample-tested only.
These timing parameters are for column and row IOE pins. You should use the
Quartus II software to verify the external timing for any pin.
Table 4–53 shows the external I/O timing parameters when using
regional clock networks.
Table 4–53. Stratix Regional Clock External I/O Timing Parameters (Part 1
of 2) Notes (1), (2)
Symbol
Parameter
tINSU
Setup time for input or bidirectional pin using IOE input register with
regional clock fed by CLK pin
tINH
Hold time for input or bidirectional pin using IOE input register with
regional clock fed by CLK pin
tOUTCO
Clock-to-output delay output or bidirectional pin using IOE output
register with regional clock fed by CLK pin
tINSUPLL
Setup time for input or bidirectional pin using IOE input register with
regional clock fed by Enhanced PLL with default phase setting
tINHPLL
Hold time for input or bidirectional pin using IOE input register with
regional clock fed by Enhanced PLL with default phase setting
tOUTCOPLL
Clock-to-output delay output or bidirectional pin using IOE output
register with regional clock Enhanced PLL with default phase setting
4–34
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–53. Stratix Regional Clock External I/O Timing Parameters (Part 2
of 2) Notes (1), (2)
Symbol
Parameter
tXZPLL
Synchronous IOE output enable register to output pin disable delay
using regional clock fed by Enhanced PLL with default phase setting
tZXPLL
Synchronous IOE output enable register to output pin enable delay
using regional clock fed by Enhanced PLL with default phase setting
Notes to Table 4–53:
(1)
(2)
These timing parameters are sample-tested only.
These timing parameters are for column and row IOE pins. You should use the
Quartus II software to verify the external timing for any pin.
Table 4–54 shows the external I/O timing parameters when using global
clock networks.
Table 4–54. Stratix Global Clock External I/O Timing Parameters Notes (1),
(2)
Symbol
Parameter
tINSU
Setup time for input or bidirectional pin using IOE input register with
global clock fed by CLK pin
tINH
Hold time for input or bidirectional pin using IOE input register with
global clock fed by CLK pin
tOUTCO
Clock-to-output delay output or bidirectional pin using IOE output
register with global clock fed by CLK pin
tINSUPLL
Setup time for input or bidirectional pin using IOE input register with
global clock fed by Enhanced PLL with default phase setting
tINHPLL
Hold time for input or bidirectional pin using IOE input register with
global clock fed by Enhanced PLL with default phase setting
tOUTCOPLL
Clock-to-output delay output or bidirectional pin using IOE output
register with global clock Enhanced PLL with default phase setting
tXZPLL
Synchronous IOE output enable register to output pin disable delay
using global clock fed by Enhanced PLL with default phase setting
tZXPLL
Synchronous IOE output enable register to output pin enable delay
using global clock fed by Enhanced PLL with default phase setting
Notes to Table 4–54:
(1)
(2)
Altera Corporation
January 2006
These timing parameters are sample-tested only.
These timing parameters are for column and row IOE pins. You should use the
Quartus II software to verify the external timing for any pin.
4–35
Stratix Device Handbook, Volume 1
Timing Model
Stratix External I/O Timing
These timing parameters are for both column IOE and row IOE pins. In
EP1S30 devices and above, you can decrease the tSU time by using the
FPLLCLK, but may get positive hold time in EP1S60 and EP1S80 devices.
You should use the Quartus II software to verify the external devices for
any pin.
Tables 4–55 through 4–60 show the external timing parameters on column
and row pins for EP1S10 devices.
Table 4–55. EP1S10 External I/O Timing on Column Pins Using Fast Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
Max
Max
tINSU
2.238
2.325
2.668
NA
ns
tINH
0.000
0.000
0.000
NA
ns
tOUTCO
2.240
4.549
2.240
4.836
2.240
5.218
NA
NA
ns
tXZ
2.180
4.423
2.180
4.704
2.180
5.094
NA
NA
ns
tZX
2.180
4.423
2.180
4.704
2.180
5.094
NA
NA
ns
Table 4–56. EP1S10 External I/O Timing on Column Pins Using Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
-8 Speed Grade
Parameter
Unit
Max
Max
2.054
Max
tINSU
1.992
2.359
tINH
0.000
tOUTCO
2.395
4.795
2.395
5.107
2.395
5.527
NA
NA
ns
tXZ
2.335
4.669
2.335
4.975
2.335
5.403
NA
NA
ns
tZX
2.335
4.669
2.335
4.975
2.335
5.403
NA
NA
ns
tINSUPLL
0.975
0.985
1.097
NA
tINHPLL
0.000
0.000
0.000
NA
NA
ns
tOUTCOPLL
1.262
2.636
1.262
2.680
1.262
2.769
NA
NA
ns
tXZPLL
1.202
2.510
1.202
2.548
1.202
2.645
NA
NA
ns
tZXPLL
1.202
2.510
1.202
2.548
1.202
2.645
NA
NA
ns
0.000
4–36
Stratix Device Handbook, Volume 1
NA
0.000
ns
NA
ns
ns
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–57. EP1S10 External I/O Timing on Column Pins Using Global Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
1.692
Max
1.940
Max
tINSU
1.647
tINH
0.000
tOUTCO
2.619
5.184
2.619
5.515
2.619
5.999
NA
NA
ns
tXZ
2.559
5.058
2.559
5.383
2.559
5.875
NA
NA
ns
tZX
2.559
5.058
2.559
5.383
2.559
5.875
NA
NA
ns
tINSUPLL
1.239
1.229
1.374
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.109
2.372
1.109
2.436
1.109
2.492
NA
NA
ns
tXZPLL
1.049
2.246
1.049
2.304
1.049
2.368
NA
NA
ns
tZXPLL
1.049
2.246
1.049
2.304
1.049
2.368
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
Table 4–58. EP1S10 External I/O Timing on Row Pin Using Fast Regional Clock Network Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.759
Max
tINSU
2.212
tINH
0.000
tOUTCO
2.391
4.838
2.391
5.159
2.391
5.569
NA
NA
ns
tXZ
2.418
4.892
2.418
5.215
2.418
5.637
NA
NA
ns
tZX
2.418
4.892
2.418
5.215
2.418
5.637
NA
NA
ns
Altera Corporation
January 2006
2.403
Max
0.000
NA
0.000
ns
NA
ns
4–37
Stratix Device Handbook, Volume 1
Timing Model
Table 4–59. EP1S10 External I/O Timing on Row Pins Using Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.336
Max
2.685
Max
tINSU
2.161
tINH
0.000
tOUTCO
2.434
4.889
2.434
5.226
2.434
5.643
NA
NA
ns
tXZ
2.461
4.493
2.461
5.282
2.461
5.711
NA
NA
ns
tZX
2.461
4.493
2.461
5.282
2.461
5.711
NA
NA
ns
tINSUPLL
1.057
1.172
1.315
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.327
2.773
1.327
2.848
1.327
2.940
NA
NA
ns
tXZPLL
1.354
2.827
1.354
2.904
1.354
3.008
NA
NA
ns
tZXPLL
1.354
2.827
1.354
2.904
1.354
3.008
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
Table 4–60. EP1S10 External I/O Timing on Row Pins Using Global Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
1.944
Max
2.232
Max
tINSU
1.787
tINH
0.000
tOUTCO
2.647
5.263
2.647
5.618
2.647
6.069
NA
NA
ns
tXZ
2.674
5.317
2.674
5.674
2.674
6.164
NA
NA
ns
tZX
2.674
5.317
2.674
5.674
2.674
6.164
NA
NA
ns
tINSUPLL
1.371
1.1472
1.654
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.144
2.459
1.144
2.548
1.144
2.601
NA
NA
ns
tXZPLL
1.171
2.513
1.171
2.604
1.171
2.669
NA
NA
ns
tZXPLL
1.171
2.513
1.171
2.604
1.171
2.669
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
Note to Tables 4–55 to 4–60:
(1)
Only EP1S25, EP1S30, and EP1S40 have speed grade of -8.
4–38
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Tables 4–61 through 4–66 show the external timing parameters on column
and row pins for EP1S20 devices.
Table 4–61. EP1S20 External I/O Timing on Column Pins Using Fast Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.245
Max
2.576
Max
tINSU
2.065
tINH
0.000
tOUTCO
2.283
4.622
2.283
4.916
2.283
5.310
NA
NA
ns
tXZ
2.223
4.496
2.223
4.784
2.223
5.186
NA
NA
ns
tZX
2.223
4.496
2.223
4.784
2.223
5.186
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
Table 4–62. EP1S20 External I/O Timing on Column Pins Using Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
Max
Max
tINSU
1.541
1.680
1.931
NA
ns
tINH
0.000
0.000
0.000
NA
ns
tOUTCO
2.597
5.146
2.597
5.481
2.597
5.955
NA
NA
ns
tXZ
2.537
5.020
2.537
5.349
2.537
5.831
NA
NA
ns
tZX
2.537
5.020
2.537
5.349
2.537
5.831
NA
NA
ns
tINSUPLL
0.777
tINHPLL
0.000
tOUTCOPLL
1.296
2.690
1.296
2.801
1.296
2.876
NA
NA
ns
tXZPLL
1.236
2.564
1.236
2.669
1.236
2.752
NA
NA
ns
tZXPLL
1.236
2.564
1.236
2.669
1.236
2.752
NA
NA
ns
Altera Corporation
January 2006
0.818
0.937
0.000
NA
0.000
ns
NA
ns
4–39
Stratix Device Handbook, Volume 1
Timing Model
Table 4–63. EP1S20 External I/O Timing on Column Pins Using Global Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
1.479
Max
1.699
Max
tINSU
1.351
tINH
0.000
tOUTCO
2.732
5.380
2.732
5.728
2.732
6.240
NA
NA
ns
tXZ
2.672
5.254
2.672
5.596
2.672
6.116
NA
NA
ns
tZX
2.672
5.254
2.672
5.596
2.672
6.116
NA
NA
tINSUPLL
0.923
0.971
1.098
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.210
2.544
1.210
2.648
1.210
2.715
NA
NA
ns
tXZPLL
1.150
2.418
1.150
2.516
1.150
2.591
NA
NA
ns
tZXPLL
1.150
2.418
1.150
2.516
1.150
2.591
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
ns
Table 4–64. EP1S20 External I/O Timing on Row Pins Using Fast Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.207
Max
2.535
Max
tINSU
2.032
tINH
0.000
tOUTCO
2.492
5.018
2.492
5.355
2.492
5.793
NA
NA
ns
tXZ
2.519
5.072
2.519
5.411
2.519
5.861
NA
NA
ns
tZX
2.519
5.072
2.519
5.411
2.519
5.861
NA
NA
ns
0.000
4–40
Stratix Device Handbook, Volume 1
NA
0.000
ns
NA
ns
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–65. EP1S20 External I/O Timing on Row Pins Using Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
1.967
Max
2.258
Max
tINSU
1.815
tINH
0.000
tOUTCO
2.633
5.235
2.663
5.595
2.663
6.070
NA
NA
ns
tXZ
2.660
5.289
2.660
5.651
2.660
6.138
NA
NA
ns
tZX
2.660
5.289
2.660
5.651
2.660
6.138
NA
NA
tINSUPLL
1.060
1.112
1.277
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.325
2.770
1.325
2.908
1.325
2.978
NA
NA
ns
tXZPLL
1.352
2.824
1.352
2.964
1.352
3.046
NA
NA
ns
tZXPLL
1.352
2.824
1.352
2.964
1.352
3.046
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
ns
Table 4–66. EP1S20 External I/O Timing on Row Pins Using Global Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
1.887
Max
2.170
Max
tINSU
1.742
tINH
0.000
tOUTCO
2.674
5.308
2.674
5.675
2.674
6.158
NA
NA
ns
tXZ
2.701
5.362
2.701
5.731
2.701
6.226
NA
NA
ns
tZX
2.701
5.362
2.701
5.731
2.701
6.226
NA
NA
tINSUPLL
1.353
1.418
1.613
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.158
2.447
1.158
2.602
1.158
2.642
NA
NA
ns
tXZPLL
1.185
2.531
1.158
2.602
1.185
2.710
NA
NA
ns
tZXPLL
1.185
2.531
1.158
2.602
1.185
2.710
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
ns
Note to Tables 4–61 to 4–66:
(1)
Only EP1S25, EP1S30, and EP1S40 have a speed grade of -8.
Altera Corporation
January 2006
4–41
Stratix Device Handbook, Volume 1
Timing Model
Tables 4–67 through 4–72 show the external timing parameters on column
and row pins for EP1S25 devices.
Table 4–67. EP1S25 External I/O Timing on Column Pins Using Fast Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.613
Max
2.968
Max
tINSU
2.412
tINH
0.000
tOUTCO
2.196
4.475
2.196
4.748
2.196
5.118
2.196
5.603
ns
tXZ
2.136
4.349
2.136
4.616
2.136
4.994
2.136
5.488
ns
tZX
2.136
4.349
2.136
4.616
2.136
4.994
2.136
5.488
ns
0.000
3.468
0.000
ns
0.000
ns
Table 4–68. EP1S25 External I/O Timing on Column Pins Using Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
Max
Max
tINSU
1.535
1.661
1.877
2.125
ns
tINH
0.000
0.000
0.000
0.000
ns
tOUTCO
2.739
5.396
2.739
5.746
2.739
6.262
2.739
6.946
ns
tXZ
2.679
5.270
2.679
5.614
2.679
6.138
2.679
6.831
ns
tZX
2.679
5.270
2.679
5.614
2.679
6.138
2.679
6.831
ns
tINSUPLL
0.934
tINHPLL
0.000
tOUTCOPLL
1.316
2.733
1.316
2.839
1.316
2.921
1.316
3.110
ns
tXZPLL
1.256
2.607
1.256
2.707
1.256
2.797
1.256
2.995
ns
tZXPLL
1.256
2.607
1.256
2.707
1.256
2.797
1.256
2.995
ns
0.980
1.092
0.000
4–42
Stratix Device Handbook, Volume 1
1.231
0.000
ns
0.000
ns
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–69. EP1S25 External I/O Timing on Column Pins Using Global Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
1.471
Max
1.657
Max
tINSU
1.371
tINH
0.000
tOUTCO
2.809
5.516
2.809
5.890
2.809
6.429
2.809
7.155
ns
tXZ
2.749
5.390
2.749
5.758
2.749
6.305
2.749
7.040
ns
tZX
2.749
5.390
2.749
5.758
2.749
6.305
2.749
7.040
tINSUPLL
1.271
1.327
1.491
1.677
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.124
2.396
1.124
2.492
1.124
2.522
1.124
2.602
ns
tXZPLL
1.064
2.270
1.064
2.360
1.064
2.398
1.064
2.487
ns
tZXPLL
1.064
2.270
1.064
2.360
1.064
2.398
1.064
2.487
ns
0.000
1.916
0.000
ns
0.000
ns
ns
Table 4–70. EP1S25 External I/O Timing on Row Pins Using Fast Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
-8 Speed Grade
Parameter
Unit
Max
Max
2.990
Min
Max
tINSU
2.429
tINH
0.000
tOUTCO
2.376
4.821
2.376
5.131
2.376
5.538
2.376
6.063
ns
tXZ
2.403
4.875
2.403
5.187
2.403
5.606
2.403
6.145
ns
tZX
2.403
4.875
2.403
5.187
2.403
5.606
2.403
6.145
ns
Altera Corporation
January 2006
2.631
Max
0.000
3.503
0.000
ns
0.000
ns
4–43
Stratix Device Handbook, Volume 1
Timing Model
Table 4–71. EP1S25 External I/O Timing on Row Pins Using Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
1.927
Max
2.182
Max
tINSU
1.793
tINH
0.000
tOUTCO
2.759
5.457
2.759
5.835
2.759
6.346
2.759
7.024
ns
tXZ
2.786
5.511
2.786
5.891
2.786
6.414
2.786
7.106
ns
tZX
2.786
5.511
2.786
5.891
2.786
6.414
2.786
7.106
tINSUPLL
1.169
1.221
1.373
1.600
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.375
2.861
1.375
2.999
1.375
3.082
1.375
3.174
ns
tXZPLL
1.402
2.915
1.402
3.055
1.402
3.150
1.402
3.256
ns
tZXPLL
1.402
2.915
1.402
3.055
1.402
3.150
1.402
3.256
ns
0.000
2.542
0.000
ns
0.000
ns
ns
Table 4–72. EP1S25 External I/O Timing on Row Pins Using Global Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
1.779
Max
2.012
Max
tINSU
1.665
tINH
0.000
tOUTCO
2.834
5.585
2.834
5.983
2.834
6.516
2.834
7.194
ns
tXZ
2.861
5.639
2.861
6.039
2.861
6.584
2.861
7.276
ns
tZX
2.861
5.639
2.861
6.039
2.861
6.584
2.861
7.276
tINSUPLL
1.538
1.606
1.816
2.121
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.164
2.492
1.164
2.614
1.164
2.639
1.164
2.653
ns
tXZPLL
1.191
2.546
1.191
2.670
1.191
2.707
1.191
2.735
ns
tZXPLL
1.191
2.546
1.191
2.670
1.191
2.707
1.191
2.735
ns
0.000
4–44
Stratix Device Handbook, Volume 1
2.372
0.000
ns
0.000
ns
ns
Altera Corporation
January 2006
DC & Switching Characteristics
Tables 4–73 through 4–78 show the external timing parameters on column
and row pins for EP1S30 devices.
Table 4–73. EP1S30 External I/O Timing on Column Pins Using Fast Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Unit
Parameter
Max
Max
2.680
Max
3.062
Max
tINSU
2.502
tINH
0.000
tOUTCO
2.473
4.965
2.473
5.329
2.473
5.784
2.473
6.392
ns
tXZ
2.413
4.839
2.413
5.197
2.413
5.660
2.413
6.277
ns
tZX
2.413
4.839
2.413
5.197
2.413
5.660
2.413
6.277
ns
0.000
3.591
0.000
ns
0.000
ns
Table 4–74. EP1S30 External I/O Timing on Column Pins Using Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
Max
Max
tINSU
2.286
2.426
2.769
3.249
ns
tINH
0.000
0.000
0.000
0.000
ns
tOUTCO
2.641
5.225
2.641
5.629
2.641
6.130
2.641
6.796
ns
tXZ
2.581
5.099
2.581
5.497
2.581
6.006
2.581
6.681
ns
tZX
2.581
5.099
2.581
5.497
2.581
6.006
2.581
6.681
ns
tINSUPLL
1.200
tINHPLL
0.000
tOUTCOPLL
1.108
2.367
1.108
2.534
1.108
2.569
1.108
2.517
ns
tXZPLL
1.048
2.241
1.048
2.402
1.048
2.445
1.048
2.402
ns
tZXPLL
1.048
2.241
1.048
2.402
1.048
2.445
1.048
2.402
ns
1.185
1.344
0.000
1.662
0.000
ns
0.000
Table 4–75. EP1S30 External I/O Timing on Column Pins Using Global Clock Networks
ns
(Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
Max
Max
tINSU
1.935
2.029
2.310
2.709
ns
tINH
0.000
0.000
0.000
0.000
ns
tOUTCO
2.814
Altera Corporation
January 2006
5.532
2.814
5.980
2.814
6.536
2.814
7.274
ns
4–45
Stratix Device Handbook, Volume 1
Timing Model
Table 4–75. EP1S30 External I/O Timing on Column Pins Using Global Clock Networks
(Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Max
Min
Max
Min
Max
Min
Max
tXZ
2.754
5.406
2.754
5.848
2.754
6.412
2.754
7.159
tZX
2.754
5.406
2.754
5.848
2.754
6.412
2.754
7.159
tINSUPLL
1.265
1.236
1.403
1.756
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.068
2.302
1.068
2.483
1.068
2.510
1.068
2.423
ns
tXZPLL
1.008
2.176
1.008
2.351
1.008
2.386
1.008
2.308
ns
tZXPLL
1.008
2.176
1.008
2.351
1.008
2.386
1.008
2.308
ns
Parameter
Unit
ns
ns
Table 4–76. EP1S30 External I/O Timing on Row Pins Using Fast Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameters
Unit
Max
Max
Max
Max
tINSU
2.616
2.808
3.223
3.797
ns
tINH
0.000
0.000
0.000
0.000
ns
tOUTCO
2.542
5.114
2.542
5.502
2.542
5.965
2.542
6.581
ns
tXZ
2.569
5.168
2.569
5.558
2.569
6.033
2.569
6.663
ns
tZX
2.569
5.168
2.569
5.558
2.569
6.033
2.569
6.663
ns
4–46
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–77. EP1S30 External I/O Timing on Row Pins Using Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.467
Max
2.828
Max
tINSU
2.322
tINH
0.000
tOUTCO
2.731
5.408
2.731
5.843
2.731
6.360
2.731
7.036
ns
tXZ
2.758
5.462
2.758
5.899
2.758
6.428
2.758
7.118
ns
tZX
2.758
5.462
2.758
5.899
2.758
6.428
2.758
7.118
tINSUPLL
1.291
1.283
1.469
1.832
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.192
2.539
1.192
2.737
1.192
2.786
1.192
2.742
ns
tXZPLL
1.219
2.539
1.219
2.793
1.219
2.854
1.219
2.824
ns
tZXPLL
1.219
2.539
1.219
2.793
1.219
2.854
1.219
2.824
ns
0.000
3.342
0.000
ns
0.000
ns
ns
Table 4–78. EP1S30 External I/O Timing on Row Pins Using Global Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.398
Max
tINSU
1.995
tINH
0.000
tOUTCO
2.917
5.735
2.917
6.221
2.917
6.790
2.917
7.548
ns
tXZ
2.944
5.789
2.944
6.277
2.944
6.858
2.944
7.630
ns
tZX
2.944
5.789
2.944
6.277
2.944
6.858
2.944
7.630
tINSUPLL
1.337
1.312
1.508
1.902
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.164
2.493
1.164
2.708
1.164
2.747
1.164
2.672
ns
tXZPLL
1.191
2.547
1.191
2.764
1.191
2.815
1.191
2.754
ns
tZXPLL
1.191
2.547
1.191
2.764
1.191
2.815
1.191
2.754
ns
Altera Corporation
January 2006
2.089
Max
0.000
2.830
0.000
ns
0.000
ns
ns
4–47
Stratix Device Handbook, Volume 1
Timing Model
Tables 4–79 through 4–84 show the external timing parameters on column
and row pins for EP1S40 devices.
Table 4–79. EP1S40 External I/O Timing on Column Pins Using Fast Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.907
Max
3.290
Max
tINSU
2.696
tINH
0.000
tOUTCO
2.506
5.015
2.506
5.348
2.506
5.809
2.698
7.286
ns
tXZ
2.446
4.889
2.446
5.216
2.446
5.685
2.638
7.171
ns
tZX
2.446
4.889
2.446
5.216
2.446
5.685
2.638
7.171
ns
0.000
2.899
0.000
ns
0.000
ns
Table 4–80. EP1S40 External I/O Timing on Column Pins Using Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
Max
Max
tINSU
2.413
2.581
2.914
2.938
ns
tINH
0.000
0.000
0.000
0.000
ns
tOUTCO
2.668
5.254
2.668
5.628
2.668
6.132
2.869
7.307
ns
tXZ
2.608
5.128
2.608
5.496
2.608
6.008
2.809
7.192
ns
tZX
2.608
5.128
2.608
5.496
2.608
6.008
2.809
7.192
ns
tINSUPLL
1.385
tINHPLL
0.000
tOUTCOPLL
1.117
2.382
1.117
2.552
1.117
2.504
1.117
2.542
ns
tXZPLL
1.057
2.256
1,057
2.420
1.057
2.380
1.057
2.427
ns
tZXPLL
1.057
2.256
1,057
2.420
1.057
2.380
1.057
2.427
ns
1.376
1.609
0.000
4–48
Stratix Device Handbook, Volume 1
1.837
0.000
ns
0.000
ns
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–81. EP1S40 External I/O Timing on Column Pins Using Global Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.268
Max
2.558
Max
tINSU
2.126
tINH
0.000
tOUTCO
2.856
5.585
2.856
5.987
2.856
6.541
2.847
7.253
ns
tXZ
2.796
5.459
2.796
5.855
2.796
6.417
2.787
7.138
ns
tZX
2.796
5.459
2.796
5.855
2.796
6.417
2.787
7.138
tINSUPLL
1.466
1.455
1.711
1.906
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.092
2.345
1.092
2.510
1.092
2.455
1.089
2.473
ns
tXZPLL
1.032
2.219
1.032
2.378
1.032
2.331
1.029
2.358
ns
tZXPLL
1.032
2.219
1.032
2.378
1.032
2.331
1.029
2.358
ns
0.000
2.930
0.000
ns
0.000
ns
ns
Table 4–82. EP1S40 External I/O Timing on Row Pins Using Fast Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
3.083
Max
tINSU
2.472
tINH
0.000
tOUTCO
2.631
5.258
2.631
5.625
2.631
6.105
2.745
7.324
ns
tXZ
2.658
5.312
2.658
5.681
2.658
6.173
2.772
7.406
ns
tZX
2.658
5.312
2.658
5.681
2.658
6.173
2.772
7.406
ns
Altera Corporation
January 2006
2.685
Max
0.000
3.056
0.000
ns
0.000
ns
4–49
Stratix Device Handbook, Volume 1
Timing Model
Table 4–83. EP1S40 External I/O Timing on Row Pins Using Regional Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.526
Max
2.898
Max
tINSU
2.349
tINH
0.000
tOUTCO
2.725
5.381
2.725
5.784
2.725
6.290
2.725
7.426
ns
tXZ
2.752
5.435
2.752
5.840
2.752
6.358
2.936
7.508
ns
tZX
2.752
5.435
2.752
5.840
2.752
6.358
2.936
7.508
tINSUPLL
1.328
1.322
1.605
1.883
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.169
2.502
1.169
2.698
1.169
2.650
1.169
2.691
ns
tXZPLL
1.196
2.556
1.196
2.754
1.196
2.718
1.196
2.773
ns
tZXPLL
1.196
2.556
1.196
2.754
1.196
2.718
1.196
2.773
ns
0.000
2.952
0.000
ns
0.000
ns
ns
Table 4–84. EP1S40 External I/O Timing on Row Pins Using Global Clock Networks
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.171
Max
2.491
Max
tINSU
2.020
tINH
0.000
tOUTCO
2.912
5.710
2.912
6.139
2.912
6.697
2.931
7.480
ns
tXZ
2.939
5.764
2.939
6.195
2.939
6.765
2.958
7.562
ns
tZX
2.939
5.764
2.939
6.195
2.939
6.765
2.958
7.562
tINSUPLL
1.370
1.368
1.654
1.881
ns
tINHPLL
0.000
0.000
0.000
0.000
ns
tOUTCOPLL
1.144
2.460
1.144
2.652
1.144
2.601
1.170
2.693
ns
tXZPLL
1.171
2.514
1.171
2.708
1.171
2.669
1.197
2.775
ns
tZXPLL
1.171
2.514
1.171
2.708
1.171
2.669
1.197
2.775
ns
0.000
4–50
Stratix Device Handbook, Volume 1
2.898
0.000
ns
0.000
ns
ns
Altera Corporation
January 2006
DC & Switching Characteristics
Tables 4–85 through 4–90 show the external timing parameters on column
and row pins for EP1S60 devices.
Table 4–85. EP1S60 External I/O Timing on Column Pins Using Fast Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
3.277
Max
3.733
Max
tINSU
3.029
tINH
0.000
tOUTCO
2.446
4.871
2.446
5.215
2.446
5.685
NA
NA
ns
tXZ
2.386
4.745
2.386
5.083
2.386
5.561
NA
NA
ns
tZX
2.386
4.745
2.386
5.083
2.386
5.561
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
Table 4–86. EP1S60 External I/O Timing on Column Pins Using Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
Max
Max
tINSU
2.491
2.691
3.060
NA
ns
tINH
0.000
0.000
0.000
NA
ns
tOUTCO
2.767
5.409
2.767
5.801
2.767
6.358
NA
NA
ns
tXZ
2.707
5.283
2.707
5.669
2.707
6.234
NA
NA
ns
tZX
2.707
5.283
2.707
5.669
2.707
6.234
NA
NA
ns
tINSUPLL
1.233
tINHPLL
0.000
tOUTCOPLL
1.078
2.278
1.078
2.395
1.078
2.428
NA
NA
ns
tXZPLL
1.018
2.152
1.018
2.263
1.018
2.304
NA
NA
ns
tZXPLL
1.018
2.152
1.018
2.263
1.018
2.304
NA
NA
ns
Altera Corporation
January 2006
1.270
1.438
0.000
NA
0.000
ns
NA
ns
4–51
Stratix Device Handbook, Volume 1
Timing Model
Table 4–87. EP1S60 External I/O Timing on Column Pins Using Global Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.152
Max
2.441
Max
tINSU
2.000
tINH
0.000
tOUTCO
3.051
5.900
3.051
6.340
3.051
6.977
NA
NA
ns
tXZ
2.991
5.774
2.991
6.208
2.991
6.853
NA
NA
ns
tZX
2.991
5.774
2.991
6.208
2.991
6.853
NA
NA
tINSUPLL
1.315
1.362
1.543
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.029
2.196
1.029
2.303
1.029
2.323
NA
NA
ns
tXZPLL
0.969
2.070
0.969
2.171
0.969
2.199
NA
NA
ns
tZXPLL
0.969
2.070
0.969
2.171
0.969
2.199
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
ns
Table 4–88. EP1S60 External I/O Timing on Row Pins Using Fast Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
3.393
Max
3.867
Max
tINSU
3.144
tINH
0.000
tOUTCO
2.643
5.275
2.643
5.654
2.643
6.140
NA
NA
ns
tXZ
2.670
5.329
2.670
5.710
2.670
6.208
NA
NA
ns
tZX
2.670
5.329
2.670
5.710
2.670
6.208
NA
NA
ns
0.000
4–52
Stratix Device Handbook, Volume 1
NA
0.000
ns
NA
ns
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–89. EP1S60 External I/O Timing on Row Pins Using Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.990
Max
3.407
Max
tINSU
2.775
tINH
0.000
tOUTCO
2.867
5.644
2.867
6.057
2.867
6.600
NA
NA
ns
tXZ
2.894
5.698
2.894
6.113
2.894
6.668
NA
NA
ns
tZX
2.894
5.698
2.894
6.113
2.894
6.668
NA
NA
tINSUPLL
1.523
1.577
1.791
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.174
2.507
1.174
2.643
1.174
2.664
NA
NA
ns
tXZPLL
1.201
2.561
1.201
2.699
1.201
2.732
NA
NA
ns
tZXPLL
1.201
2.561
1.201
2.699
1.201
2.732
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
ns
Table 4–90. EP1S60 External I/O Timing on Row Pins Using Global Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.393
Max
2.721
Max
tINSU
2.232
tINH
0.000
tOUTCO
3.182
6.187
3.182
6.654
3.182
7.286
NA
NA
ns
tXZ
3.209
6.241
3.209
6.710
3.209
7.354
NA
NA
ns
tZX
3.209
6.241
3.209
6.710
3.209
7.354
NA
NA
tINSUPLL
1.651
1.612
1.833
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.154
2.469
1.154
2.608
1.154
2.622
NA
NA
ns
tXZPLL
1.181
2.523
1.181
2.664
1.181
2.690
NA
NA
ns
tZXPLL
1.181
2.523
1.181
2.664
1.181
2.690
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
ns
Note to Tables 4–85 to 4–90:
(1)
Only EP1S25, EP1S30, and EP1S40 devices have the -8 speed grade.
Altera Corporation
January 2006
4–53
Stratix Device Handbook, Volume 1
Timing Model
Tables 4–91 through 4–96 show the external timing parameters on column
and row pins for EP1S80 devices.
Table 4–91. EP1S80 External I/O Timing on Column Pins Using Fast Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
2.528
Max
2.900
Max
tINSU
2.328
tINH
0.000
tOUTCO
2.422
4.830
2.422
5.169
2.422
5.633
NA
NA
ns
tXZ
2.362
4.704
2.362
5.037
2.362
5.509
NA
NA
ns
tZX
2.362
4.704
2.362
5.037
2.362
5.509
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
Table 4–92. EP1S80 External I/O Timing on Column Pins Using Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
Max
Max
tINSU
1.760
1.912
2.194
NA
ns
tINH
0.000
0.000
0.000
NA
ns
tOUTCO
2.761
5.398
2.761
5.785
2.761
6.339
NA
NA
ns
tXZ
2.701
5.272
2.701
5.653
2.701
6.215
NA
NA
ns
tZX
2.701
5.272
2.701
5.653
2.701
6.215
NA
NA
ns
tINSUPLL
0.462
tINHPLL
0.000
tOUTCOPLL
1.661
2.849
1.661
2.859
1.661
2.881
NA
NA
ns
tXZPLL
1.601
2.723
1.601
2.727
1.601
2.757
NA
NA
ns
tZXPLL
1.601
2.723
1.601
2.727
1.601
2.757
NA
NA
ns
0.606
0.785
0.000
4–54
Stratix Device Handbook, Volume 1
NA
0.000
ns
NA
ns
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–93. EP1S80 External I/O Timing on Column Pins Using Global Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Parameter
Unit
Max
Max
0.976
Max
1.118
Max
tINSU
0.884
tINH
0.000
tOUTCO
3.267
6.274
3.267
6.721
3.267
7.415
NA
NA
ns
tXZ
3.207
6.148
3.207
6.589
3.207
7.291
NA
NA
ns
tZX
3.207
6.148
3.207
6.589
3.207
7.291
NA
NA
tINSUPLL
0.506
0.656
0.838
NA
ns
tINHPLL
0.000
0.000
0.000
NA
ns
tOUTCOPLL
1.635
2.805
1.635
2.809
1.635
2.828
NA
NA
ns
tXZPLL
1.575
2.679
1.575
2.677
1.575
2.704
NA
NA
ns
tZXPLL
1.575
2.679
1.575
2.677
1.575
2.704
NA
NA
ns
0.000
NA
0.000
ns
NA
ns
ns
Table 4–94. EP1S80 External I/O Timing on Row Pins Using Fast Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Parameter
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tINSU
2.792
2.993
3.386
NA
ns
tINH
0.000
0.000
0.000
NA
ns
tOUTCO
2.619
5.235
2.619
5.609
2.619
6.086
NA
NA
ns
tXZ
2.646
5.289
2.646
5.665
2.646
6.154
NA
NA
ns
tZX
2.646
5.289
2.646
5.665
2.646
6.154
NA
NA
ns
Altera Corporation
January 2006
4–55
Stratix Device Handbook, Volume 1
Timing Model
Table 4–95. EP1S80 External I/O Timing on Row Pins Using Regional Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Parameter
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tINSU
2.295
2.454
2.767
NA
ns
tINH
0.000
0.000
0.000
NA
ns
tOUTCO
2.917
5.732
2.917
6.148
2.917
6.705
NA
NA
ns
tXZ
2.944
5.786
2.944
6.204
2.944
6.773
NA
NA
ns
tZX
2.944
5.786
2.944
6.204
2.944
6.773
NA
NA
ns
tINSUPLL
1.011
tINHPLL
0.000
tOUTCOPLL
1.808
3.169
1.808
3.209
1.808
3.233
NA
NA
ns
tXZPLL
1.835
3.223
1.835
3.265
1.835
3.301
NA
NA
ns
tZXPLL
1.835
3.223
1.835
3.265
1.835
3.301
NA
NA
ns
1.161
1.372
0.000
NA
0.000
ns
NA
ns
Table 4–96. EP1S80 External I/O Timing on Rows Using Pin Global Clock Networks Note (1)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Min
Min
Min
Min
Symbol
Unit
Max
Max
Max
Max
tINSU
1.362
1.451
1.613
NA
ns
tINH
0.000
0.000
0.000
NA
ns
tOUTCO
3.457
6.665
3.457
7.151
3.457
7.859
NA
NA
ns
tXZ
3.484
6.719
3.484
7.207
3.484
7.927
NA
NA
ns
tZX
3.484
6.719
3.484
7.207
3.484
7.927
NA
NA
ns
tINSUPLL
o.994
tINHPLL
0.000
tOUTCOPLL
1.821
3.186
1.821
3.227
1.821
3.254
NA
NA
ns
tXZPLL
1.848
3.240
1.848
3.283
1.848
3.322
NA
NA
ns
tZXPLL
1.848
3.240
1.848
3.283
1.848
3.322
NA
NA
ns
1.143
1.351
0.000
NA
0.000
ns
NA
ns
Note to Tables 4–91 to 4–96:
(1)
Only EP1S25, EP1S30, and EP1S40 devices have the -8 speed grade.
4–56
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Definition of I/O Skew
I/O skew is defined as the absolute value of the worst-case difference in
clock-to-out times (tCO) between any two output registers fed by a
common clock source.
I/O bank skew is made up of the following components:
■
■
Clock network skews: This is the difference between the arrival times
of the clock at the clock input port of the two IOE registers.
Package skews: This is the package trace length differences between
(I/O pad A to I/O pin A) and (I/O pad B to I/O pin B).
Figure 4–5 shows an example of two IOE registers located in the same
bank, being fed by a common clock source. The clock can come from an
input pin or from a PLL output.
Figure 4–5. I/O Skew within an I/O Bank
I/O Bank
I/O Pin A
Common Source of GCLK
I/O Pin B
Fast Edge
I/O Pin A
Slow Edge
I/O Pin B
I/O Skew
Altera Corporation
January 2006
I/O Skew
4–57
Stratix Device Handbook, Volume 1
Timing Model
Figure 4–6 shows the case where four IOE registers are located in two
different I/O banks.
Figure 4–6. I/O Skew Across Two I/O Banks
I/O Bank
I/O Pin A
I/O Pin B
Common Source of GCLK
I/O Pin C
I/O Pin D
I/O Bank
I/O Pin Skew across
two Banks
I/O Pin A
I/O Pin B
I/O Pin C
I/O Pin D
Table 4–97 defines the timing parameters used to define the timing for
horizontal I/O pins (side banks 1, 2, 5, 6) and vertical I/O pins (top and
bottom banks 3, 4, 7, 8). The timing parameters define the skew within an
I/O bank, across two neighboring I/O banks on the same side of the
device, across all horizontal I/O banks, across all vertical I/O banks, and
the skew for the overall device.
Table 4–97. Output Pin Timing Skew Definitions (Part 1 of 2)
Symbol
Definition
tSB_HIO
Row I/O (HIO) within one I/O bank (1)
tSB_VIO
Column I/O (VIO) within one I/O bank (1)
tSS_HIO
Row I/O (HIO) same side of the device, across two
banks (2)
tSS_VIO
Column I/O (VIO) same side of the device, across two
banks (2)
4–58
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–97. Output Pin Timing Skew Definitions (Part 2 of 2)
Symbol
Definition
tLR_HIO
Across all HIO banks (1, 2, 5, 6); across four similar
type I/O banks
tTB_VIO
Across all VIO banks (3, 4, 7, 8); across four similar
type I/O banks
tOVERALL
Output timing skew for all I/O pins on the device.
Notes to Table 4–97:
(1)
(2)
See Figure 4–5 on page 4–57.
See Figure 4–6 on page 4–58.
Table 4–98 shows the I/O skews when using the same global or regional
clock to feed IOE registers in I/O banks around each device. These values
can be used for calculating the timing budget on the output (write) side
of a memory interface. These values already factor in the package skew.
Table 4–98. Output Skew for Stratix by Device Density
Skew (ps) (1)
Symbol
EP1S10 to EP1S30
EP1S40
EP1S60 & EP1S80
tSB_HIO
90
290
500
tSB_VIO
160
290
500
tSS_HIO
90
460
600
tSS_VIO
180
520
630
tLR_HIO
150
490
600
tTB_VIO
190
580
670
tOVERALL
430
630
880
Note to Table 4–98:
(1)
Altera Corporation
January 2006
The skew numbers in Table 4–98 account for worst case package skews.
4–59
Stratix Device Handbook, Volume 1
Timing Model
Skew on Input Pins
Table 4–99 shows the package skews that were considered to get the
worst case I/O skew value. You can use these values, for example, when
calculating the timing budget on the input (read) side of a memory
interface.
Table 4–99. Package Skew on Input Pins
Package Parameter
Pins in the same I/O bank
Worst-Case Skew (ps)
50
Pins in top/bottom (vertical I/O) banks
50
Pins in left/right side (horizontal I/O) banks
50
Pins across the entire device
100
PLL Counter & Clock Network Skews
Table 4–100 shows the clock skews between different clock outputs from
the Stratix device PLL.
Table 4–100. PLL Counter & Clock Network Skews
Parameter
Worst-Case Skew (ps)
Clock skew between two external clock outputs driven
by the same counter
100
Clock skew between two external clock outputs driven
by the different counters with the same settings
150
Dual-purpose PLL dedicated clock output used as I/O
pin vs. regular I/O pin
270 (1)
Clock skew between any two outputs of the PLL that
drive global clock networks
150
Note to Table 4–100:
(1)
The Quartus II software models 270 ps of delay on the PLL dedicated clock
output (PLL6_OUT[3..0]p/n and PLL5_OUT[3..0]p/n) pins both when
used as clocks and when used as I/O pins.
I/O Timing Measurement Methodology
Different I/O standards require different baseline loading techniques for
reporting timing delays. Altera characterizes timing delays with the
required termination and loading for each I/O standard. The timing
information is specified from the input clock pin up to the output pin of
4–60
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
the FPGA device. The Quartus II software calculates the I/O timing for
each I/O standard with a default baseline loading as specified by the I/O
standard.
Altera measures clock-to-output delays (tCO) at worst-case process,
minimum voltage, and maximum temperature (PVT) for the 3.3-V LVTTL
I/O standard with 24 mA (default case) current drive strength setting and
fast slew rate setting. I/O adder delays are measured to calculate the tCO
change at worst-case PVT across all I/O standards and current drive
strength settings with the default loading shown in Table 4–101 on
page 4–62. Timing derating data for additional loading is taken for tCO
across worst-case PVT for all I/O standards and drive strength settings.
These three pieces of data are used to predict the timing at the output pin.
tCO at pin = tOUTCO max for 3.3-V 24 mA LVTTL + I/O Adder +
Output Delay Adder for Loading
Simulation using IBIS models is required to determine the delays on the
PCB traces in addition to the output pin delay timing reported by the
Quartus II software and the timing model in the device handbook.
1.
Simulate the output driver of choice into the generalized test setup
using values from Table 4–101 on page 4–62.
2.
Record the time to VMEAS.
3.
Simulate the output driver of choice into the actual PCB trace and
load, using the appropriate IBIS input buffer model or an equivalent
capacitance value to represent the load.
4.
Record the time to VMEAS.
5.
Compare the results of steps 2 and 4. The increase or decrease in
delay should be added to or subtracted from the I/O Standard
Output Adder delays to yield the actual worst-case propagation
delay (clock-to-input) of the PCB trace.
The Quartus II software reports maximum timing with the conditions
shown in Table 4–101 on page 4–62 using the proceeding equation.
Figure 4–7 on page 4–62 shows the model of the circuit that is represented
by the Quartus II output timing.
Altera Corporation
January 2006
4–61
Stratix Device Handbook, Volume 1
Timing Model
Figure 4–7. Output Delay Timing Reporting Setup Modeled by Quartus II
VCCIO
Single-Ended Outputs
VCCIO
VTT
RUP
Output
Buffer
RT
RS
OUTPUT
VMEAS
CL
RDN
GND
GND
GND
Notes to Figure 4–7:
(1)
(2)
Output pin timing is reported at the output pin of the FPGA device. Additional
delays for loading and board trace delay need to be accounted for with IBIS model
simulations.
VCCINT is 1.42-V unless otherwise specified.
Table 4–101. Reporting Methodology For Maximum Timing For Single-Ended Output Pins (Part 1 of 2)
Notes (1), (2), (3)
Measurement
Point
Loading and Termination
I/O Standard
RUP
RDN
RS
RT
Ω
Ω
Ω
3.3-V LVTTL
–
–
2.5-V LVTTL
–
1.8-V LVTTL
–
Ω
VCCIO
(V)
VTT
(V)
CL
(pF)
VMEAS
0
–
2.950
2.95
10
1.500
–
0
–
2.370
2.37
10
1.200
–
0
–
1.650
1.65
10
0.880
1.5-V LVTTL
–
–
0
–
1.400
1.40
10
0.750
3.3-V LVCMOS
–
–
0
–
2.950
2.95
10
1.500
2.5-V LVCMOS
–
–
0
–
2.370
2.37
10
1.200
1.8-V LVCMOS
–
–
0
–
1.650
1.65
10
0.880
1.5-V LVCMOS
–
–
0
–
1.400
1.40
10
0.750
3.3-V GTL
–
–
0
25
2.950
1.14
30
0.740
2.5-V GTL
–
–
0
25
2.370
1.14
30
0.740
3.3-V GTL+
–
–
0
25
2.950
1.35
30
0.880
2.5-V GTL+
–
–
0
25
2.370
1.35
30
0.880
3.3-V SSTL-3 Class II
–
–
25
25
2.950
1.25
30
1.250
4–62
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–101. Reporting Methodology For Maximum Timing For Single-Ended Output Pins (Part 2 of 2)
Notes (1), (2), (3)
Measurement
Point
Loading and Termination
I/O Standard
RUP
RDN
RS
RT
Ω
Ω
Ω
Ω
VCCIO
(V)
VTT
(V)
CL
(pF)
VMEAS
3.3-V SSTL-3 Class I
–
–
25
50
2.950
1.250
30
1.250
2.5-V SSTL-2 Class II
–
–
25
25
2.370
1.110
30
1.110
2.5-V SSTL-2 Class I
–
–
25
50
2.370
1.110
30
1.110
1.8-V SSTL-18 Class II
–
–
25
25
1.650
0.760
30
0.760
1.8-V SSTL-18 Class I
–
–
25
50
1.650
0.760
30
0.760
1.5-V HSTL Class II
–
–
0
25
1.400
0.700
20
0.680
1.5-V HSTL Class I
–
–
0
50
1.400
0.700
20
0.680
1.8-V HSTL Class II
–
–
0
25
1.650
0.700
20
0.880
1.8-V HSTL Class I
–
–
0
50
1.650
0.700
20
0.880
3.3-V PCI (4)
–/25
25/–
0
–
2.950
2.950
10
0.841/1.814
3.3-V PCI-X 1.0 (4)
–/25
25/–
0
–
2.950
2.950
10
0.841/1.814
3.3-V Compact PCI (4)
–/25
25/–
0
–
2.950
2.950
10
0.841/1.814
3.3-V AGP 1X (4)
–/25
25/–
0
–
2.950
2.950
10
0.841/1.814
–
–
25
50
2.050
1.350
30
1.350
3.3-V CTT
Notes to Table 4–101:
(1)
(2)
(3)
(4)
Input measurement point at internal node is 0.5 × VCCINT.
Output measuring point for data is VMEAS.
Input stimulus edge rate is 0 to VCCINT in 0.5 ns (internal signal) from the driver preceding the IO buffer.
The first value is for output rising edge and the second value is for output falling edge. The hyphen (-) indicates
infinite resistance or disconnection.
Altera Corporation
January 2006
4–63
Stratix Device Handbook, Volume 1
Timing Model
Table 4–102 shows the reporting methodology used by the Quartus II
software for minimum timing information for output pins.
Table 4–102. Reporting Methodology For Minimum Timing For Single-Ended Output Pins (Part 1 of 2)
Notes (1), (2), (3)
Measurement
Point
Loading and Termination
I/O Standard
RUP
RDN
RS
RT
Ω
Ω
Ω
Ω
VCCIO
(V)
VTT
(V)
CL
(pF)
VMEAS
3.3-V LVTTL
–
–
0
–
3.600
3.600
10
1.800
2.5-V LVTTL
–
–
0
–
2.630
2.630
10
1.200
1.8-V LVTTL
–
–
0
–
1.950
1.950
10
0.880
1.5-V LVTTL
–
–
0
–
1.600
1.600
10
0.750
3.3-V LVCMOS
–
–
0
–
3.600
3.600
10
1.800
2.5-V LVCMOS
–
–
0
–
2.630
2.630
10
1.200
1.8-V LVCMOS
–
–
0
–
1.950
1.950
10
0.880
1.5-V LVCMOS
–
–
0
–
1.600
1.600
10
0.750
3.3-V GTL
–
–
0
25
3.600
1.260
30
0.860
2.5-V GTL
–
–
0
25
2.630
1.260
30
0.860
3.3-V GTL+
–
–
0
25
3.600
1.650
30
1.120
2.5-V GTL+
–
–
0
25
2.630
1.650
30
1.120
3.3-V SSTL-3 Class II
–
–
25
25
3.600
1.750
30
1.750
3.3-V SSTL-3 Class I
–
–
25
50
3.600
1.750
30
1.750
2.5-V SSTL-2 Class II
–
–
25
25
2.630
1.390
30
1.390
2.5-V SSTL-2 Class I
–
–
25
50
2.630
1.390
30
1.390
1.8-V SSTL-18 Class II
–
–
25
25
1.950
1.040
30
1.040
1.8-V SSTL-18 Class I
–
–
25
50
1.950
1.040
30
1.040
1.5-V HSTL Class II
–
–
0
25
1.600
0.800
20
0.900
1.5-V HSTL Class I
–
–
0
50
1.600
0.800
20
0.900
1.8-V HSTL Class II
–
–
0
25
1.950
0.900
20
1.000
1.8-V HSTL Class I
–
–
0
50
1.950
0.900
20
1.000
3.3-V PCI (4)
–/25
25/–
0
–
3.600
1.950
10
1.026/2.214
3.3-V PCI-X 1.0 (4)
–/25
25/–
0
–
3.600
1.950
10
1.026/2.214
3.3-V Compact PCI (4)
–/25
25/–
0
–
3.600
3.600
10
1.026/2.214
3.3-V AGP 1× (4)
–/25
25/–
0
–
3.600
3.600
10
1.026/2.214
4–64
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–102. Reporting Methodology For Minimum Timing For Single-Ended Output Pins (Part 2 of 2)
Notes (1), (2), (3)
Measurement
Point
Loading and Termination
I/O Standard
3.3-V CTT
RUP
RDN
RS
RT
Ω
Ω
Ω
Ω
VCCIO
(V)
VTT
(V)
CL
(pF)
VMEAS
–
–
25
50
3.600
1.650
30
1.650
Notes to Table 4–102:
(1)
(2)
(3)
(4)
Input measurement point at internal node is 0.5 × VCCINT.
Output measuring point for data is VMEAS. When two values are given, the first is the measurement point on the
rising edge and the other is for the falling edge.
Input stimulus edge rate is 0 to VCCINT in 0.5 ns (internal signal) from the driver preceding the I/O buffer.
The first value is for the output rising edge and the second value is for the output falling edge. The hyphen (-)
indicates infinite resistance or disconnection.
Figure 4–8 shows the measurement setup for output disable and output
enable timing. The TCHZ stands for clock to high Z time delay and is the
same as TXZ. The TCLZ stands for clock to low Z (driving) time delay and
is the same as TZX.
Figure 4–8. Measurement Setup for TXZ and TZX
CLK
T CHZ
200mV
OUT
VT =1.5V
R =50Ω
200mV
T CLZ
200mV
C TOTAL=10pF
OUT
200mV
Altera Corporation
January 2006
4–65
Stratix Device Handbook, Volume 1
Timing Model
External I/O Delay Parameters
External I/O delay timing parameters for I/O standard input and output
adders and programmable input and output delays are specified by
speed grade independent of device density. All of the timing parameters
in this section apply to both flip-chip and wire-bond packages.
Tables 4–103 and 4–104 show the input adder delays associated with
column and row I/O pins. If an I/O standard is selected other than 3.3-V
LVTTL or LVCMOS, add the selected delay to the external tINSU and
tINSUPLL I/O parameters shown in Tables 4–54 through 4–96.
Table 4–103. Stratix I/O Standard Column Pin Input Delay Adders
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Parameter
Unit
Min
LVCMOS
Max
0
Min
Max
0
Min
Max
0
Min
Max
0
ps
3.3-V LVTTL
0
0
0
0
ps
2.5-V LVTTL
19
19
22
26
ps
1.8-V LVTTL
221
232
266
313
ps
1.5-V LVTTL
352
369
425
500
ps
GTL
–45
–48
–55
–64
ps
GTL+
–75
–79
–91
–107
ps
3.3-V PCI
0
0
0
0
ps
3.3-V PCI-X 1.0
0
0
0
0
ps
Compact PCI
0
0
0
0
ps
AGP 1×
0
0
0
0
ps
AGP 2×
0
0
0
0
ps
CTT
120
126
144
170
ps
SSTL-3 Class I
–162
–171
–196
–231
ps
SSTL-3 Class II
–162
–171
–196
–231
ps
SSTL-2 Class I
–202
–213
–244
–287
ps
SSTL-2 Class II
–202
–213
–244
–287
ps
SSTL-18 Class I
78
81
94
110
ps
SSTL-18 Class II
78
81
94
110
ps
1.5-V HSTL Class I
–76
–80
–92
–108
ps
1.5-V HSTL Class II
–76
–80
–92
–108
ps
1.8-V HSTL Class I
–52
–55
–63
–74
ps
1.8-V HSTL Class II
–52
–55
–63
–74
ps
4–66
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–104. Stratix I/O Standard Row Pin Input Delay Adders
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Parameter
Unit
Min
Max
Min
Max
Min
Max
Min
Max
LVCMOS
0
0
0
0
ps
3.3-V LVTTL
0
0
0
0
ps
2.5-V LVTTL
21
22
25
29
ps
1.8-V LVTTL
181
190
218
257
ps
1.5-V LVTTL
300
315
362
426
ps
GTL+
–152
–160
–184
–216
ps
CTT
–168
–177
–203
–239
ps
SSTL-3 Class I
–193
–203
–234
–275
ps
SSTL-3 Class II
–193
–203
–234
–275
ps
SSTL-2 Class I
–262
–276
–317
–373
ps
SSTL-2 Class II
–262
–276
–317
–373
ps
SSTL-18 Class I
–105
–111
–127
–150
ps
SSTL-18 Class II
0
0
0
0
ps
1.5-V HSTL Class I
–151
–159
–183
–215
ps
1.8-V HSTL Class I
–126
–133
–153
–179
ps
LVDS
–149
–157
–180
–212
ps
LVPECL
–149
–157
–180
–212
ps
3.3-V PCML
–65
–69
–79
–93
ps
HyperTransport
77
–81
–93
–110
ps
Altera Corporation
January 2006
4–67
Stratix Device Handbook, Volume 1
Timing Model
Tables 4–105 through 4–108 show the output adder delays associated
with column and row I/O pins for both fast and slow slew rates. If an I/O
standard is selected other than 3.3-V LVTTL 4mA or LVCMOS 2 mA with
a fast slew rate, add the selected delay to the external tOUTCO, tOUTCOPLL,
tXZ, tZX, tXZPLL, and tZXPLL I/O parameters shown in Table 4–55 on
page 4–36 through Table 4–96 on page 4–56.
Table 4–105. Stratix I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Parameter
Unit
Min
LVCMOS
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
Max
Min
Max
Min
Max
Min
Max
2 mA
1,895
1,990
1,990
1,990
ps
4 mA
956
1,004
1,004
1,004
ps
8 mA
189
198
198
198
ps
12 mA
0
0
0
0
ps
24 mA
–157
–165
–165
–165
ps
4 mA
1,895
1,990
1,990
1,990
ps
8 mA
1,347
1,414
1,414
1,414
ps
12 mA
636
668
668
668
ps
16 mA
561
589
589
589
ps
24 mA
0
0
0
0
ps
2 mA
2,517
2,643
2,643
2,643
ps
8 mA
834
875
875
875
ps
12 mA
504
529
529
529
ps
16 mA
194
203
203
203
ps
2 mA
1,304
1,369
1,369
1,369
ps
8 mA
960
1,008
1,008
1,008
ps
12 mA
960
1,008
1,008
1,008
ps
2 mA
6,680
7,014
7,014
7,014
ps
4 mA
3,275
3,439
3,439
3,439
ps
8 mA
1,589
1,668
1,668
1,668
ps
16
17
17
17
ps
GTL
GTL+
9
9
9
9
ps
3.3-V PCI
50
52
52
52
ps
3.3-V PCI-X 1.0
50
52
52
52
ps
Compact PCI
50
52
52
52
ps
AGP 1×
50
52
52
52
ps
AGP 2×
1,895
1,990
1,990
1,990
ps
4–68
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–105. Stratix I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Parameter
Unit
Min
Max
Min
Max
Min
Max
Min
Max
CTT
973
1,021
1,021
1,021
ps
SSTL-3 Class I
719
755
755
755
ps
SSTL-3 Class II
146
153
153
153
ps
SSTL-2 Class I
678
712
712
712
ps
SSTL-2 Class II
223
234
234
234
ps
SSTL-18 Class I
1,032
1,083
1,083
1,083
ps
SSTL-18 Class II
447
469
469
469
ps
1.5-V HSTL Class I
660
693
693
693
ps
1.5-V HSTL Class II
537
564
564
564
ps
1.8-V HSTL Class I
304
319
319
319
ps
1.8-V HSTL Class II
231
242
242
242
ps
Table 4–106. Stratix I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
(Part 1 of 2)
-8 Speed Grade
Parameter
Unit
Min
LVCMOS
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
Altera Corporation
January 2006
Max
Min
Max
1,594
Min
Max
1,594
Min
Max
2 mA
1,518
1,594
ps
4 mA
746
783
783
783
ps
8 mA
96
100
100
100
ps
12 mA
0
0
0
0
ps
4 mA
1,518
1,594
1,594
1,594
ps
8 mA
1,038
1,090
1,090
1,090
ps
12 mA
521
547
547
547
ps
16 mA
414
434
434
434
ps
24 mA
0
0
0
0
ps
2 mA
2,032
2,133
2,133
2,133
ps
8 mA
699
734
734
734
ps
12 mA
374
392
392
392
ps
16 mA
165
173
173
173
ps
2 mA
3,714
3,899
3,899
3,899
ps
8 mA
1,055
1,107
1,107
1,107
ps
12 mA
830
871
871
871
ps
4–69
Stratix Device Handbook, Volume 1
Timing Model
Table 4–106. Stratix I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
(Part 2 of 2)
-8 Speed Grade
Parameter
Unit
Min
1.5-V LVTTL
Max
Min
Max
Min
Max
Min
Max
2 mA
5,460
5,733
5,733
5,733
ps
4 mA
2,690
2,824
2,824
2,824
ps
8 mA
1,398
1,468
1,468
1,468
ps
GTL+
6
6
6
6
ps
CTT
845
887
887
887
ps
SSTL-3 Class I
638
670
670
670
ps
SSTL-3 Class II
144
151
151
151
ps
SSTL-2 Class I
604
634
634
634
ps
SSTL-2 Class II
211
221
221
221
ps
SSTL-18 Class I
955
1,002
1,002
1,002
ps
1.5-V HSTL Class I
733
769
769
769
ps
1.8-V HSTL Class I
372
390
390
390
ps
LVDS
–196
–206
–206
–206
ps
LVPECL
–148
–156
–156
–156
ps
PCML
–147
–155
–155
–155
ps
HyperTransport
technology
–93
–98
–98
–98
ps
Note to Table 4–103 through 4–106:
(1)
These parameters are only available on row I/O pins.
Table 4–107. Stratix I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Parameter
Unit
Min
LVCMOS
Max
Min
Max
Min
Max
Min
Max
2 mA
1,822
1,913
1,913
1,913
ps
4 mA
684
718
718
718
ps
8 mA
233
245
245
245
ps
12 mA
1
1
1
1
ps
24 mA
–608
–638
–638
–638
ps
4–70
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–107. Stratix I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
Parameter
Unit
Min
3.3-V LVTTL
Max
Min
Max
Min
Max
Min
Max
4 mA
1,822
1,913
1,913
1,913
ps
8 mA
1,586
1,665
1,665
1,665
ps
12 mA
686
720
720
720
ps
16 mA
630
662
662
662
ps
24 mA
0
0
0
0
ps
2 mA
2,925
3,071
3,071
3,071
ps
2.5-V LVTTL
8 mA
1,496
1,571
1,571
1,571
ps
12 mA
937
984
984
984
ps
16 mA
1,003
1,053
1,053
1,053
ps
2 mA
7,101
7,456
7,456
7,456
ps
1.8-V LVTTL
8 mA
3,620
3,801
3,801
3,801
ps
12 mA
3,109
3,265
3,265
3,265
ps
1.5-V LVTTL
2 mA
10,941
11,488
11,488
11,488
ps
4 mA
7,431
7,803
7,803
7,803
ps
8 mA
5,990
6,290
6,290
6,290
ps
GTL
–959
–1,007
–1,007
–1,007
ps
GTL+
–438
–460
–460
–460
ps
3.3-V PCI
660
693
693
693
ps
3.3-V PCI-X 1.0
660
693
693
693
ps
Compact PCI
660
693
693
693
ps
AGP 1×
660
693
693
693
ps
AGP 2×
288
303
303
303
ps
CTT
631
663
663
663
ps
SSTL-3 Class I
301
316
316
316
ps
SSTL-3 Class II
–359
–377
–377
–377
ps
SSTL-2 Class I
523
549
549
549
ps
SSTL-2 Class II
–49
–51
–51
–51
ps
SSTL-18 Class I
2,315
2,431
2,431
2,431
ps
SSTL-18 Class II
723
759
759
759
ps
1.5-V HSTL Class I
1,687
1,771
1,771
1,771
ps
1.5-V HSTL Class II
1,095
1,150
1,150
1,150
ps
1.8-V HSTL Class I
599
629
678
744
ps
1.8-V HSTL Class II
87
102
102
102
ps
Altera Corporation
January 2006
4–71
Stratix Device Handbook, Volume 1
Timing Model
Table 4–108. Stratix I/O Standard Output Delay Adders for Slow Slew Rate on Row Pins
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
-8 Speed Grade
I/O Standard
Unit
Min
LVCMOS
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
Max
Min
Max
Min
Max
Min
Max
2 mA
1,571
1,650
1,650
1,650
ps
4 mA
594
624
624
624
ps
8 mA
208
218
218
218
ps
12 mA
0
0
0
0
ps
4 mA
1,571
1,650
1,650
1,650
ps
8 mA
1,393
1,463
1,463
1,463
ps
12 mA
596
626
626
626
ps
16 mA
562
590
590
590
ps
2 mA
2,562
2,690
2,690
2,690
ps
8 mA
1,343
1,410
1,410
1,410
ps
12 mA
864
907
907
907
ps
16 mA
945
992
992
992
ps
2 mA
6,306
6,621
6,621
6,621
ps
8 mA
3,369
3,538
3,538
3,538
ps
12 mA
2,932
3,079
3,079
3,079
ps
2 mA
9,759
10,247
10,247
10,247
ps
4 mA
6,830
7,172
7,172
7,172
ps
8 mA
5,699
5,984
5,984
5,984
ps
GTL+
–333
–350
–350
–350
ps
CTT
591
621
621
621
ps
1.5-V LVTTL
SSTL-3 Class I
267
280
280
280
ps
SSTL-3 Class II
–346
–363
–363
–363
ps
SSTL-2 Class I
481
505
505
505
ps
SSTL-2 Class II
–58
–61
–61
–61
ps
SSTL-18 Class I
2,207
2,317
2,317
2,317
ps
1.5-V HSTL Class I
1,966
2,064
2,064‘
2,064
ps
1.8-V HSTL Class I
1,208
1,268
1,460
1,720
ps
4–72
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Tables 4–109 and 4–110 show the adder delays for the column and row
IOE programmable delays. These delays are controlled with the
Quartus II software logic options listed in the Parameter column.
Table 4–109. Stratix IOE Programmable Delays on Column Pins Note (1)
-5 Speed Grade -6 Speed Grade -7 Speed Grade -8 Speed Grade
Parameter
Setting
Unit
Min
Decrease input delay
to internal cells
Max
Min
Max
Min
Max
Min
Max
Off
3,970
4,367
5,022
5,908
ps
Small
3,390
3,729
4,288
5,045
ps
Medium
2,810
3,091
3,554
4,181
ps
224
235
270
318
ps
Large
On
224
235
270
318
ps
Decrease input delay
to input register
Off
3,900
4,290
4,933
5,804
ps
On
0
0
0
0
ps
Decrease input delay
to output register
Off
1,240
1,364
1,568
1,845
ps
On
0
0
0
0
ps
Increase delay to
output pin
Off
0
0
0
0
ps
On
397
417
417
417
ps
Increase delay to
output enable pin
Off
0
0
0
0
ps
On
338
372
427
503
ps
Increase output clock
enable delay
Off
0
0
0
0
ps
Increase input clock
enable delay
Increase output
enable clock enable
delay
Increase tZX delay to
output pin
Altera Corporation
January 2006
Small
540
594
683
804
ps
Large
1,016
1,118
1,285
1,512
ps
On
1,016
1,118
1,285
1,512
ps
Off
0
0
0
0
ps
Small
540
594
683
804
ps
Large
1,016
1,118
1,285
1,512
ps
On
1,016
1,118
1,285
1,512
ps
Off
0
0
0
0
ps
Small
540
594
683
804
ps
Large
1,016
1,118
1,285
1,512
ps
On
1,016
1,118
1,285
1,512
ps
Off
0
0
0
0
ps
On
2,199
2,309
2,309
2,309
ps
4–73
Stratix Device Handbook, Volume 1
Timing Model
Table 4–110. Stratix IOE Programmable Delays on Row Pins Note (1)
-5 Speed Grade -6 Speed Grade -7 Speed Grade -8 Speed Grade
Parameter
Setting
Unit
Min
Decrease input delay
to internal cells
Max
Min
Max
Min
Max
Min
Max
Off
3,970
4,367
5,022
5,908
ps
Small
3,390
3,729
4,288
5,045
ps
Medium
2,810
3,091
3,554
4,181
ps
173
181
208
245
ps
Large
On
173
181
208
245
ps
Decrease input delay
to input register
Off
3,900
4,290
4,933
5,804
ps
On
0
0
0
0
ps
Decrease input delay
to output register
Off
1,240
1,364
1,568
1,845
ps
On
0
0
0
0
ps
Increase delay to
output pin
Off
0
0
0
0
ps
On
397
417
417
417
ps
Increase delay to
output enable pin
Off
0
0
0
0
ps
On
348
383
441
518
ps
Increase output clock
enable delay
Off
0
0
0
0
ps
Small
180
198
227
267
ps
Large
260
286
328
386
ps
On
260
286
328
386
ps
Off
0
0
0
0
ps
Small
180
198
227
267
ps
Large
260
286
328
386
ps
On
260
286
328
386
ps
Off
0
0
0
0
ps
Increase input clock
enable delay
Increase output
enable clock enable
delay
Increase tZX delay to
output pin
Small
540
594
683
804
ps
Large
1,016
1,118
1,285
1,512
ps
On
1,016
1,118
1,285
1,512
ps
Off
0
0
0
0
ps
On
1,993
2,092
2,092
2,092
ps
Note to Table 4–109 and Table 4–110:
(1)
The delay chain delays vary for different device densities. These timing values only apply to EP1S30 and EP1S40
devices. Reference the timing information reported by the Quartus II software for other devices.
4–74
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
The scaling factors for column output pin timing in Tables 4–111 to 4–113
are shown in units of time per pF unit of capacitance (ps/pF). Add this
delay to the tCO or combinatorial timing path for output or bidirectional
pins in addition to the I/O adder delays shown in Tables 4–103 through
4–108 and the IOE programmable delays in Tables 4–109 and 4–110.
Table 4–111. Output Delay Adder for Loading on LVTTL/LVCMOS Output Buffers Note (1)
Conditions
Parameter
Drive Strength
Output Pin Adder Delay (ps/pF)
Value
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
LVCMOS
24mA
15
–
–
-
8
16mA
25
18
–
–
–
12mA
30
25
25
–
15
8mA
50
35
40
35
20
4mA
60
–
–
80
30
2mA
–
75
120
160
60
Note to Table 4–111:
(1)
The timing information in this table is preliminary.
Table 4–112. Output Delay Adder for Loading on SSTL/HSTL Output Buffers
Note (1)
Output Pin Adder Delay (ps/pF)
Conditions
Class I
Class II
SSTL-3
SSTL-2
SSTL-1.8
1.5-V HSTL
25
25
25
25
25
20
25
20
Note to Table 4–112:
(1)
The timing information in this table is preliminary.
Table 4–113. Output Delay Adder for Loading on GTL+/GTL/CTT/PCI Output Buffers
Conditions
Note (1)
Output Pin Adder Delay (ps/pF)
Parameter
Value
GTL+
GTL
CTT
PCI
AGP
VCCIO Voltage
Level
3.3V
18
18
25
20
20
2.5V
15
18
-
-
-
Note to Table 4–113:
(1)
The timing information in this table is preliminary.
Altera Corporation
January 2006
4–75
Stratix Device Handbook, Volume 1
Timing Model
Maximum Input & Output Clock Rates
Tables 4–114 through 4–119 show the maximum input clock rate for
column and row pins in Stratix devices.
Table 4–114. Stratix Maximum Input Clock Rate for CLK[7..4] & CLK[15..12]
Pins in Flip-Chip Packages (Part 1 of 2)
I/O Standard
-5 Speed -6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Grade
Unit
LVTTL
422
422
390
390
MHz
2.5 V
422
422
390
390
MHz
1.8 V
422
422
390
390
MHz
1.5 V
422
422
390
390
MHz
LVCMOS
422
422
390
390
MHz
GTL
300
250
200
200
MHz
GTL+
300
250
200
200
MHz
SSTL-3 Class I
400
350
300
300
MHz
SSTL-3 Class II
400
350
300
300
MHz
SSTL-2 Class I
400
350
300
300
MHz
SSTL-2 Class II
400
350
300
300
MHz
SSTL-18 Class I
400
350
300
300
MHz
SSTL-18 Class II
400
350
300
300
MHz
1.5-V HSTL Class I
400
350
300
300
MHz
1.5-V HSTL Class II
400
350
300
300
MHz
1.8-V HSTL Class I
400
350
300
300
MHz
1.8-V HSTL Class II
400
350
300
300
MHz
3.3-V PCI
422
422
390
390
MHz
3.3-V PCI-X 1.0
422
422
390
390
MHz
Compact PCI
422
422
390
390
MHz
AGP 1×
422
422
390
390
MHz
AGP 2×
422
422
390
390
MHz
CTT
300
250
200
200
MHz
Differential 1.5-V HSTL
C1
400
350
300
300
MHz
LVPECL (1)
645
645
622
622
MHz
PCML (1)
300
275
275
275
MHz
4–76
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–114. Stratix Maximum Input Clock Rate for CLK[7..4] & CLK[15..12]
Pins in Flip-Chip Packages (Part 2 of 2)
I/O Standard
-5 Speed -6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Grade
Unit
LVDS (1)
645
645
622
622
MHz
HyperTransport
technology (1)
500
500
450
450
MHz
Table 4–115. Stratix Maximum Input Clock Rate for CLK[0, 2, 9, 11] Pins &
FPLL[10..7]CLK Pins in Flip-Chip Packages
I/O Standard
Altera Corporation
January 2006
-5 Speed -6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Grade
Unit
LVTTL
422
422
390
390
MHz
2.5 V
422
422
390
390
MHz
1.8 V
422
422
390
390
MHz
1.5 V
422
422
390
390
MHz
LVCMOS
422
422
390
390
MHz
GTL+
300
250
200
200
MHz
SSTL-3 Class I
400
350
300
300
MHz
SSTL-3 Class II
400
350
300
300
MHz
SSTL-2 Class I
400
350
300
300
MHz
SSTL-2 Class II
400
350
300
300
MHz
SSTL-18 Class I
400
350
300
300
MHz
SSTL-18 Class II
400
350
300
300
MHz
1.5-V HSTL Class I
400
350
300
300
MHz
1.8-V HSTL Class I
400
350
300
300
MHz
CTT
300
250
200
200
MHz
Differential 1.5-V HSTL
C1
400
350
300
300
MHz
LVPECL (1)
717
717
640
640
MHz
PCML (1)
400
375
350
350
MHz
LVDS (1)
717
717
640
640
MHz
HyperTransport
technology (1)
717
717
640
640
MHz
4–77
Stratix Device Handbook, Volume 1
Timing Model
Table 4–116. Stratix Maximum Input Clock Rate for CLK[1, 3, 8, 10] Pins in
Flip-Chip Packages
I/O Standard
-5 Speed -6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Grade
Unit
LVTTL
422
422
390
390
MHz
2.5 V
422
422
390
390
MHz
1.8 V
422
422
390
390
MHz
1.5 V
422
422
390
390
MHz
LVCMOS
422
422
390
390
MHz
GTL+
300
250
200
200
MHz
SSTL-3 Class I
400
350
300
300
MHz
SSTL-3 Class II
400
350
300
300
MHz
SSTL-2 Class I
400
350
300
300
MHz
SSTL-2 Class II
400
350
300
300
MHz
SSTL-18 Class I
400
350
300
300
MHz
SSTL-18 Class II
400
350
300
300
MHz
1.5-V HSTL Class I
400
350
300
300
MHz
1.8-V HSTL Class I
400
350
300
300
MHz
CTT
300
250
200
200
MHz
Differential 1.5-V HSTL
C1
400
350
300
300
MHz
LVPECL (1)
645
645
640
640
MHz
PCML (1)
300
275
275
275
MHz
LVDS (1)
645
645
640
640
MHz
HyperTransport
technology (1)
500
500
450
450
MHz
Table 4–117. Stratix Maximum Input Clock Rate for CLK[7..4] & CLK[15..12]
Pins in Wire-Bond Packages (Part 1 of 2)
I/O Standard
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
LVTTL
422
390
390
MHz
2.5 V
422
390
390
MHz
1.8 V
422
390
390
MHz
1.5 V
422
390
390
MHz
LVCMOS
422
390
390
MHz
GTL
250
200
200
MHz
4–78
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–117. Stratix Maximum Input Clock Rate for CLK[7..4] & CLK[15..12]
Pins in Wire-Bond Packages (Part 2 of 2)
I/O Standard
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
GTL+
250
200
200
MHz
SSTL-3 Class I
300
250
250
MHz
SSTL-3 Class II
300
250
250
MHz
SSTL-2 Class I
300
250
250
MHz
SSTL-2 Class II
300
250
250
MHz
SSTL-18 Class I
300
250
250
MHz
SSTL-18 Class II
300
250
250
MHz
1.5-V HSTL Class I
300
180
180
MHz
1.5-V HSTL Class II
300
180
180
MHz
1.8-V HSTL Class I
300
180
180
MHz
1.8-V HSTL Class II
300
180
180
MHz
3.3-V PCI
422
390
390
MHz
3.3-V PCI-X 1.0
422
390
390
MHz
Compact PCI
422
390
390
MHz
AGP 1×
422
390
390
MHz
AGP 2×
422
390
390
MHz
CTT
250
180
180
MHz
Differential 1.5-V HSTL
C1
300
180
180
MHz
LVPECL (1)
422
400
400
MHz
PCML (1)
215
200
200
MHz
LVDS (1)
422
400
400
MHz
HyperTransport
technology (1)
422
400
400
MHz
Table 4–118. Stratix Maximum Input Clock Rate for CLK[0, 2, 9, 11] Pins &
FPLL[10..7]CLK Pins in Wire-Bond Packages (Part 1 of 2)
I/O Standard
Altera Corporation
January 2006
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
LVTTL
422
390
390
MHz
2.5 V
422
390
390
MHz
1.8 V
422
390
390
MHz
1.5 V
422
390
390
MHz
4–79
Stratix Device Handbook, Volume 1
Timing Model
Table 4–118. Stratix Maximum Input Clock Rate for CLK[0, 2, 9, 11] Pins &
FPLL[10..7]CLK Pins in Wire-Bond Packages (Part 2 of 2)
I/O Standard
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
LVCMOS
422
390
390
MHz
GTL+
250
200
200
MHz
SSTL-3 Class I
350
300
300
MHz
SSTL-3 Class II
350
300
300
MHz
SSTL-2 Class I
350
300
300
MHz
SSTL-2 Class II
350
300
300
MHz
SSTL-18 Class I
350
300
300
MHz
SSTL-18 Class II
350
300
300
MHz
1.5-V HSTL Class I
350
300
300
MHz
1.8-V HSTL Class I
350
300
300
MHz
CTT
250
200
200
MHz
Differential 1.5-V HSTL
C1
350
300
300
MHz
LVPECL (1)
717
640
640
MHz
PCML (1)
375
350
350
MHz
LVDS (1)
717
640
640
MHz
HyperTransport
technology (1)
717
640
640
MHz
Table 4–119. Stratix Maximum Input Clock Rate for CLK[1, 3, 8, 10] Pins in
Wire-Bond Packages (Part 1 of 2)
I/O Standard
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
LVTTL
422
390
390
MHz
2.5 V
422
390
390
MHz
1.8 V
422
390
390
MHz
1.5 V
422
390
390
MHz
LVCMOS
422
390
390
MHz
GTL+
250
200
200
MHz
SSTL-3 Class I
350
300
300
MHz
SSTL-3 Class II
350
300
300
MHz
SSTL-2 Class I
350
300
300
MHz
SSTL-2 Class II
350
300
300
MHz
4–80
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–119. Stratix Maximum Input Clock Rate for CLK[1, 3, 8, 10] Pins in
Wire-Bond Packages (Part 2 of 2)
I/O Standard
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
SSTL-18 Class I
350
300
300
MHz
SSTL-18 Class II
350
300
300
MHz
1.5-V HSTL Class I
350
300
300
MHz
1.8-V HSTL Class I
350
300
300
MHz
CTT
250
200
200
MHz
Differential 1.5-V HSTL
C1
350
300
300
MHz
LVPECL (1)
645
622
622
MHz
PCML (1)
275
275
275
MHz
LVDS (1)
645
622
622
MHz
HyperTransport
technology (1)
500
450
450
MHz
Note to Tables 4–114 through 4–119:
(1)
These parameters are only available on row I/O pins.
Tables 4–120 through 4–123 show the maximum output clock rate for
column and row pins in Stratix devices.
Table 4–120. Stratix Maximum Output Clock Rate for PLL[5, 6, 11, 12] Pins
in Flip-Chip Packages (Part 1 of 2)
I/O Standard
Altera Corporation
January 2006
-5 Speed -6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Grade
Unit
LVTTL
350
300
250
250
MHz
2.5 V
350
300
300
300
MHz
1.8 V
250
250
250
250
MHz
1.5 V
225
200
200
200
MHz
LVCMOS
350
300
250
250
MHz
GTL
200
167
125
125
MHz
GTL+
200
167
125
125
MHz
SSTL-3 Class I
200
167
167
133
MHz
SSTL-3 Class II
200
167
167
133
MHz
SSTL-2 Class I (3)
200
200
167
167
MHz
SSTL-2 Class I (4)
200
200
167
167
MHz
SSTL-2 Class I (5)
150
134
134
134
MHz
4–81
Stratix Device Handbook, Volume 1
Timing Model
Table 4–120. Stratix Maximum Output Clock Rate for PLL[5, 6, 11, 12] Pins
in Flip-Chip Packages (Part 2 of 2)
I/O Standard
-5 Speed -6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Grade
Unit
SSTL-2 Class II (3)
200
200
167
167
MHz
SSTL-2 Class II (4)
200
200
167
167
MHz
SSTL-2 Class II (5)
150
134
134
134
MHz
SSTL-18 Class I
150
133
133
133
MHz
SSTL-18 Class II
150
133
133
133
MHz
1.5-V HSTL Class I
250
225
200
200
MHz
1.5-V HSTL Class II
225
200
200
200
MHz
1.8-V HSTL Class I
250
225
200
200
MHz
1.8-V HSTL Class II
225
200
200
200
MHz
3.3-V PCI
350
300
250
250
MHz
3.3-V PCI-X 1.0
350
300
250
250
MHz
Compact PCI
350
300
250
250
MHz
AGP 1×
350
300
250
250
MHz
AGP 2×
350
300
250
250
MHz
CTT
200
200
200
200
MHz
Differential 1.5-V HSTL
C1
225
200
200
200
MHz
Differential 1.8-V HSTL
Class I
250
225
200
200
MHz
Differential 1.8-V HSTL
Class II
225
200
200
200
MHz
Differential SSTL-2 (6)
200
200
167
167
MHz
LVPECL (2)
500
500
500
500
MHz
PCML (2)
350
350
350
350
MHz
LVDS (2)
500
500
500
500
MHz
HyperTransport
technology (2)
350
350
350
350
MHz
4–82
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–121. Stratix Maximum Output Clock Rate (Using I/O Pins) for PLL[1,
2, 3, 4] Pins in Flip-Chip Packages
I/O Standard
Altera Corporation
January 2006
-5 Speed -6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Grade
Unit
LVTTL
400
350
300
300
MHz
2.5 V
400
350
300
300
MHz
1.8 V
400
350
300
300
MHz
1.5 V
350
300
300
300
MHz
LVCMOS
400
350
300
300
MHz
GTL
200
167
125
125
MHz
GTL+
200
167
125
125
MHz
SSTL-3 Class I
167
150
133
133
MHz
SSTL-3 Class II
167
150
133
133
MHz
SSTL-2 Class I
150
133
133
133
MHz
SSTL-2 Class II
150
133
133
133
MHz
SSTL-18 Class I
150
133
133
133
MHz
SSTL-18 Class II
150
133
133
133
MHz
1.5-V HSTL Class I
250
225
200
200
MHz
1.5-V HSTL Class II
225
225
200
200
MHz
1.8-V HSTL Class I
250
225
200
200
MHz
1.8-V HSTL Class II
225
225
200
200
MHz
3.3-V PCI
250
225
200
200
MHz
3.3-V PCI-X 1.0
225
225
200
200
MHz
Compact PCI
400
350
300
300
MHz
AGP 1×
400
350
300
300
MHz
AGP 2×
400
350
300
300
MHz
CTT
300
250
200
200
MHz
LVPECL (2)
717
717
500
500
MHz
PCML (2)
420
420
420
420
MHz
LVDS (2)
717
717
500
500
MHz
HyperTransport
technology (2)
420
420
420
420
MHz
4–83
Stratix Device Handbook, Volume 1
Timing Model
Table 4–122. Stratix Maximum Output Clock Rate for PLL[5, 6, 11, 12] Pins
in Wire-Bond Packages (Part 1 of 2)
I/O Standard
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
LVTTL
175
150
150
MHz
2.5 V
175
150
150
MHz
1.8 V
175
150
150
MHz
1.5 V
175
150
150
MHz
LVCMOS
175
150
150
MHz
GTL
125
100
100
MHz
GTL+
125
100
100
MHz
SSTL-3 Class I
110
90
90
MHz
SSTL-3 Class II
133
125
125
MHz
SSTL-2 Class I
166
133
133
MHz
SSTL-2 Class II
133
100
100
MHz
SSTL-18 Class I
110
100
100
MHz
SSTL-18 Class II
110
100
100
MHz
1.5-V HSTL Class I
167
167
167
MHz
1.5-V HSTL Class II
167
133
133
MHz
1.8-V HSTL Class I
167
167
167
MHz
1.8-V HSTL Class II
167
133
133
MHz
3.3-V PCI
167
167
167
MHz
3.3-V PCI-X 1.0
167
133
133
MHz
Compact PCI
175
150
150
MHz
AGP 1×
175
150
150
MHz
AGP 2×
175
150
150
MHz
CTT
125
100
100
MHz
Differential 1.5-V HSTL
C1
167
133
133
MHz
Differential 1.8-V HSTL
Class I
167
167
167
MHz
Differential 1.8-V HSTL
Class II
167
133
133
MHz
Differential SSTL-2 (1)
110
100
100
MHz
LVPECL (2)
311
275
275
MHz
PCML (2)
250
200
200
MHz
4–84
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–122. Stratix Maximum Output Clock Rate for PLL[5, 6, 11, 12] Pins
in Wire-Bond Packages (Part 2 of 2)
I/O Standard
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
LVDS (2)
311
275
275
MHz
HyperTransport
technology (2)
311
275
275
MHz
Table 4–123. Stratix Maximum Output Clock Rate (Using I/O Pins) for PLL[1,
2, 3, 4] Pins in Wire-Bond Packages (Part 1 of 2)
I/O Standard
Altera Corporation
January 2006
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
LVTTL
200
175
175
MHz
2.5 V
200
175
175
MHz
1.8 V
200
175
175
MHz
1.5 V
200
175
175
MHz
LVCMOS
200
175
175
MHz
GTL
125
100
100
MHz
GTL+
125
100
100
MHz
SSTL-3 Class I
110
90
90
MHz
SSTL-3 Class II
150
133
133
MHz
SSTL-2 Class I
90
80
80
MHz
SSTL-2 Class II
110
100
100
MHz
SSTL-18 Class I
110
100
100
MHz
SSTL-18 Class II
110
100
100
MHz
1.5-V HSTL Class I
225
200
200
MHz
1.5-V HSTL Class II
200
167
167
MHz
1.8-V HSTL Class I
225
200
200
MHz
1.8-V HSTL Class II
200
167
167
MHz
3.3-V PCI
200
175
175
MHz
3.3-V PCI-X 1.0
200
175
175
MHz
Compact PCI
200
175
175
MHz
AGP 1×
200
175
175
MHz
AGP 2×
200
175
175
MHz
CTT
125
100
100
MHz
LVPECL (2)
311
270
270
MHz
PCML (2)
400
311
311
MHz
4–85
Stratix Device Handbook, Volume 1
Timing Model
Table 4–123. Stratix Maximum Output Clock Rate (Using I/O Pins) for PLL[1,
2, 3, 4] Pins in Wire-Bond Packages (Part 2 of 2)
I/O Standard
-6 Speed -7 Speed -8 Speed
Grade
Grade
Grade
Unit
LVDS (2)
400
311
311
MHz
HyperTransport
technology (2)
420
400
400
MHz
Notes to Tables 4–120 through 4–123:
(1)
(2)
(3)
Differential SSTL-2 outputs are only available on column clock pins.
These parameters are only available on row I/O pins.
SSTL-2 in maximum drive strength condition. See Table 4–101 on page 4–62 for
more information on exact loading conditions for each I/O standard.
(4)
(5)
(6)
SSTL-2 in minimum drive strength with 10pF output load condition.
SSTL-2 in minimum drive strength with > 10pF output load condition.
Differential SSTL-2 outputs are only supported on column clock pins.
4–86
Stratix Device Handbook, Volume 1
≤
Altera Corporation
January 2006
DC & Switching Characteristics
High-Speed I/O
Specification
Table 4–124 provides high-speed timing specifications definitions.
Table 4–124. High-Speed Timing Specifications & Terminology
High-Speed Timing Specification
Terminology
tC
High-speed receiver/transmitter input and output clock period.
fHSCLK
High-speed receiver/transmitter input and output clock frequency.
tRISE
Low-to-high transmission time.
tFALL
High-to-low transmission time.
Timing unit interval (TUI)
The timing budget allowed for skew, propagation delays, and data
sampling window. (TUI = 1/(Receiver Input Clock Frequency ×
Multiplication Factor) = tC/w).
fHSDR
Maximum LVDS data transfer rate (fHSDR = 1/TUI).
Channel-to-channel skew (TCCS)
The timing difference between the fastest and slowest output edges,
including tCO variation and clock skew. The clock is included in the TCCS
measurement.
Sampling window (SW)
The period of time during which the data must be valid to be captured
correctly. The setup and hold times determine the ideal strobe position
within the sampling window.
SW = tSW (max) – tSW (min).
Input jitter (peak-to-peak)
Peak-to-peak input jitter on high-speed PLLs.
Output jitter (peak-to-peak)
Peak-to-peak output jitter on high-speed PLLs.
tDUTY
Duty cycle on high-speed transmitter output clock.
tLOCK
Lock time for high-speed transmitter and receiver PLLs.
J
Deserialization factor (width of internal data bus).
W
PLL multiplication factor.
Altera Corporation
January 2006
4–87
Stratix Device Handbook, Volume 1
Table 4–125. High-Speed I/O Specifications for Flip-Chip Packages (Part 1 of 4) Notes (1), (2)
-5 Speed Grade
Symbol
fHSDR Device
operation
(LVDS,
LVPECL,
HyperTransport
technology)
-7 Speed Grade
-8 Speed Grade
Unit
Min
fHSCLK (Clock
frequency)
(LVDS,
LVPECL,
HyperTransport
technology)
fHSCLK = fHSDR /
W
-6 Speed Grade
Conditions
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
W = 4 to 30
(Serdes used)
10
210
10
210
10
156
10
115.5
MHz
W = 2 (Serdes
bypass)
50
231
50
231
50
231
50
231
MHz
W = 2 (Serdes
used)
150
420
150
420
150
312
150
231
MHz
W = 1 (Serdes
bypass)
100
462
100
462
100
462
100
462
MHz
W = 1 (Serdes
used)
300
717
300
717
300
624
300
462
MHz
J = 10
300
840
300
840
300
640
300
462
Mbps
J=8
300
840
300
840
300
640
300
462
Mbps
J=7
300
840
300
840
300
640
300
462
Mbps
J=4
300
840
300
840
300
640
300
462
Mbps
J=2
100
462
100
462
100
640
100
462
Mbps
J = 1 (LVDS
and LVPECL
only)
100
462
100
462
100
640
100
462
Mbps
High-Speed I/O Specification
4–88
Stratix Device Handbook, Volume 1
Tables 4–125 and 4–126 show the high-speed I/O timing for Stratix devices.
Altera Corporation
January 2006
-5 Speed Grade
Symbol
fHSDR Device
operation
(PCML)
4–89
Stratix Device Handbook, Volume 1
TCCS
-7 Speed Grade
-8 Speed Grade
Unit
Min
fHSCLK (Clock
frequency)
(PCML)
fHSCLK = fHSDR /
W
-6 Speed Grade
Conditions
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
W = 4 to 30
(Serdes used)
10
100
10
100
10
77.75
10
77.75
MHz
W = 2 (Serdes
bypass)
50
200
50
200
50
150
50
150
MHz
W = 2 (Serdes
used)
150
200
150
200
150
155.5
150
155.5
MHz
W = 1 (Serdes
bypass)
100
250
100
250
100
200
100
200
MHz
W = 1 (Serdes
used)
300
400
300
400
300
311
300
311
MHz
J = 10
300
400
300
400
300
311
300
311
Mbps
J=8
300
400
300
400
300
311
300
311
Mbps
J=7
300
400
300
400
300
311
300
311
Mbps
J=4
300
400
300
400
300
311
300
311
Mbps
J=2
100
400
100
400
100
300
100
300
Mbps
J=1
100
250
100
250
100
200
100
200
Mbps
300
ps
All
200
200
300
High-Speed I/O Specification
Altera Corporation
January 2006
Table 4–125. High-Speed I/O Specifications for Flip-Chip Packages (Part 2 of 4) Notes (1), (2)
-5 Speed Grade
Symbol
-7 Speed Grade
-8 Speed Grade
Unit
Min
SW
-6 Speed Grade
Conditions
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
PCML (J = 4, 7,
8, 10)
750
750
800
800
ps
PCML (J = 2)
900
900
1,200
1,200
ps
PCML (J = 1)
1,500
1,500
1,700
1,700
ps
LVDS and
LVPECL (J = 1)
500
500
550
550
ps
LVDS,
LVPECL,
HyperTransport
technology
(J = 2 through
10)
440
440
500
500
ps
Altera Corporation
January 2006
Input jitter
tolerance
(peak-to-peak)
All
250
250
250
250
ps
Output jitter
(peak-to-peak)
All
160
160
200
200
ps
Output tRISE
LVDS
80
110
120
80
110
120
80
110
120
80
110
120
ps
HyperTransport
technology
110
170
200
110
170
200
120
170
200
120
170
200
ps
LVPECL
90
130
150
90
130
150
100
135
150
100
135
150
ps
PCML
80
110
135
80
110
135
80
110
135
80
110
135
ps
LVDS
80
110
120
80
110
120
80
110
120
80
110
120
ps
HyperTransport
technology
110
170
200
110
170
200
110
170
200
110
170
200
ps
LVPECL
90
130
160
90
130
160
100
135
160
100
135
160
ps
PCML
105
140
175
105
140
175
110
145
175
110
145
175
ps
Output tFALL
High-Speed I/O Specification
4–90
Stratix Device Handbook, Volume 1
Table 4–125. High-Speed I/O Specifications for Flip-Chip Packages (Part 3 of 4) Notes (1), (2)
-5 Speed Grade
Symbol
tDUTY
LVDS (J = 2
through 10)
LVDS (J =1)
and LVPECL,
PCML,
HyperTransport
technology
tLOCK
-7 Speed Grade
-8 Speed Grade
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
47.5
50
52.5
47.5
50
52.5
47.5
50
52.5
47.5
50
52.5
%
45
50
55
45
50
55
45
50
55
45
50
55
%
100
μs
All
Notes to Table 4–125:
(1)
(2)
-6 Speed Grade
Conditions
When J = 4, 7, 8, and 10, the SERDES block is used.
When J = 2 or J = 1, the SERDES is bypassed.
100
100
100
High-Speed I/O Specification
Altera Corporation
January 2006
Table 4–125. High-Speed I/O Specifications for Flip-Chip Packages (Part 4 of 4) Notes (1), (2)
4–91
Stratix Device Handbook, Volume 1
-6 Speed Grade
Symbol
fHSCLK (Clock
frequency)
(LVDS,LVPECL,
HyperTransport
technology)
fHSCLK = fHSDR / W
W = 4 to 30 (Serdes used)
fHSDR Device operation,
(LVDS,LVPECL,
HyperTransport
technology)
Device operation,
fH S D R
(PCML)
Altera Corporation
January 2006
TCCS
-8 Speed Grade
Unit
Min
fH S C L K (Clock
frequency)
(PCML)
fHSCLK = fHSDR / W
-7 Speed Grade
Conditions
10
Typ
Max
Min
156
10
Typ
Max
Min
115.5
10
Typ
Max
115.5
MHz
W = 2 (Serdes bypass)
50
231
50
231
50
231
MHz
W = 2 (Serdes used)
150
312
150
231
150
231
MHz
W = 1 (Serdes bypass)
100
311
100
270
100
270
MHz
W = 1 (Serdes used)
300
624
300
462
300
462
MHz
J = 10
300
624
300
462
300
462
Mbps
J=8
300
624
300
462
300
462
Mbps
J=7
300
624
300
462
300
462
Mbps
J=4
300
624
300
462
300
462
Mbps
J=2
100
462
100
462
100
462
Mbps
J = 1 (LVDS and LVPECL
only)
100
311
100
270
100
270
Mbps
W = 4 to 30 (Serdes used)
10
77.75
W = 2 (Serdes bypass)
50
150
W = 2 (Serdes used)
150
155.5
MHz
50
77.5
50
77.5
MHz
MHz
W = 1 (Serdes bypass)
100
200
W = 1 (Serdes used)
300
311
MHz
J = 10
300
311
Mbps
J=8
300
311
Mbps
J=7
300
311
Mbps
J=4
300
311
Mbps
J=2
100
300
100
155
100
155
Mbps
J=1
100
200
100
155
100
155
Mbps
400
ps
All
400
100
155
400
100
155
MHz
High-Speed I/O Specification
4–92
Stratix Device Handbook, Volume 1
Table 4–126. High-Speed I/O Specifications for Wire-Bond Packages (Part 1 of 2)
-6 Speed Grade
Symbol
-8 Speed Grade
Unit
Min
SW
-7 Speed Grade
Conditions
PCML (J = 4, 7, 8, 10) only
Typ
Max
Min
Typ
Max
Min
Typ
Max
800
800
800
ps
PCML (J = 2) only
1,200
1,200
1,200
ps
PCML (J = 1) only
1,700
1,700
1,700
ps
LVDS and LVPECL (J = 1)
only
550
550
550
ps
LVDS, LVPECL,
HyperTransport technology
(J = 2 through 10) only
500
500
500
ps
Input jitter tolerance
(peak-to-peak)
All
250
250
250
ps
Output jitter (peak-topeak)
All
200
200
200
ps
Output tR I S E
LVDS
120
ps
4–93
Stratix Device Handbook, Volume 1
Output tFA L L
tD U T Y
110
120
80
110
120
80
110
HyperTransport technology
120
170
200
120
170
200
120
170
200
ps
LVPECL
100
135
150
100
135
150
100
135
150
ps
PCML
80
110
135
80
110
135
80
110
135
ps
LVDS
80
110
120
80
110
120
80
110
120
ps
HyperTransport
110
170
200
110
170
200
110
170
200
ps
LVPECL
100
135
160
100
135
160
100
135
160
ps
PCML
110
145
175
110
145
175
110
145
175
ps
LVDS (J = 2 through10) only
47.5
50
52.5
47.5
50
52.5
47.5
50
52.5
%
45
50
55
45
50
55
45
50
55
%
100
μs
LVDS (J =1) and LVPECL,
PCML, HyperTransport
technology
tL O C K
80
All
100
100
High-Speed I/O Specification
Altera Corporation
January 2006
Table 4–126. High-Speed I/O Specifications for Wire-Bond Packages (Part 2 of 2)
PLL Specifications
PLL
Specifications
Tables 4–127 through 4–129 describe the Stratix device enhanced PLL
specifications.
Table 4–127. Enhanced PLL Specifications for -5 Speed Grades (Part 1 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
3
(1), (2)
684
MHz
3
420
MHz
fIN
Input clock frequency
fINPFD
Input frequency to PFD
fINDUTY
Input clock duty cycle
40
60
%
fEINDUTY
External feedback clock input duty
cycle
40
60
%
tINJITTER
Input clock period jitter
±200 (3)
ps
tEINJITTER
External feedback clock period jitter
±200 (3)
ps
tFCOMP
External feedback clock
compensation time (4)
6
ns
fOUT
Output frequency for internal global
or regional clock
0.3
500
MHz
fOUT_EXT
Output frequency for external clock
(3)
0.3
526
MHz
tOUTDUTY
Duty cycle for external clock output
(when set to 50%)
45
55
%
tJITTER
Period jitter for external clock output
(6)
±100 ps for >200-MHz outclk
±20 mUI for 200-MHz outclk
±20 mUI for 200-MHz outclk
±20 mUI for 200-MHz outclk
±20 mUI for 200
MHz. See the Stratix FPGA Errata Sheet for more information on the PLL.
Altera Corporation
January 2006
4–99
Stratix Device Handbook, Volume 1
PLL Specifications
Tables 4–131 through 4–133 describe the Stratix device fast PLL
specifications.
Table 4–131. Fast PLL Specifications for -5 & -6 Speed Grade Devices
Symbol
Parameter
Min
Max
Unit
fIN
CLKIN frequency (1), (2), (3)
10
717
MHz
fINPFD
Input frequency to PFD
10
500
MHz
fOUT
Output frequency for internal global or
regional clock (3)
9.375
420
MHz
fOUT_DIFFIO
Output frequency for external clock
driven out on a differential I/O data
channel (2)
(5)
(5)
fVCO
VCO operating frequency
300
1,000
MHz
tINDUTY
CLKIN duty cycle
40
60
%
±200
ps
55
%
(5)
ps
tINJITTER
Period jitter for CLKIN pin
tDUTY
Duty cycle for DFFIO 1× CLKOUT pin (6)
tJITTER
Period jitter for DIFFIO clock out (6)
tLOCK
Time required for PLL to acquire lock
10
100
μs
m
Multiplication factors for m counter (6)
1
32
Integer
l0, l1, g0
Multiplication factors for l0, l1, and g0
counter (7), (8)
1
32
Integer
tARESET
Minimum pulse width on areset
signal
10
45
ns
Table 4–132. Fast PLL Specifications for -7 Speed Grades (Part 1 of 2)
Symbol
Parameter
Min
Max
Unit
fIN
CLKIN frequency (1), (3)
10
640
MHz
fINPFD
Input frequency to PFD
10
500
MHz
fOUT
Output frequency for internal global or
regional clock (4)
9.375
420
MHz
fOUT_DIFFIO
Output frequency for external clock
driven out on a differential I/O data
channel
(5)
(5)
MHz
fVCO
VCO operating frequency
300
700
MHz
tINDUTY
CLKIN duty cycle
40
60
%
tINJITTER
Period jitter for CLKIN pin
±200
ps
tDUTY
Duty cycle for DFFIO 1× CLKOUT pin (6)
55
%
4–100
Stratix Device Handbook, Volume 1
45
Altera Corporation
January 2006
DC & Switching Characteristics
Table 4–132. Fast PLL Specifications for -7 Speed Grades (Part 2 of 2)
Symbol
Parameter
tJITTER
Period jitter for DIFFIO clock out (6)
tLOCK
Time required for PLL to acquire lock
Min
10
Max
Unit
(5)
ps
100
μs
m
Multiplication factors for m counter (7)
1
32
Integer
l0, l1, g0
Multiplication factors for l0, l1, and g0
counter (7), (8)
1
32
Integer
tARESET
Minimum pulse width on areset
signal
10
ns
Table 4–133. Fast PLL Specifications for -8 Speed Grades (Part 1 of 2)
Symbol
Parameter
fIN
CLKIN frequency (1), (3)
fINPFD
Input frequency to PFD
fOUT
Output frequency for internal global or
regional clock (4)
fOUT_DIFFIO
Min
Max
Unit
10
460
MHz
10
500
MHz
9.375
420
MHz
Output frequency for external clock
driven out on a differential I/O data
channel
(5)
(5)
MHz
fVCO
VCO operating frequency
300
700
MHz
tINDUTY
CLKIN duty cycle
40
60
%
tINJITTER
Period jitter for CLKIN pin
±200
ps
tDUTY
Duty cycle for DFFIO 1× CLKOUT pin (6)
45
55
%
tJITTER
Period jitter for DIFFIO clock out (6)
(5)
ps
tLOCK
Time required for PLL to acquire lock
10
100
μs
m
Multiplication factors for m counter (7)
1
32
Integer
l0, l1, g0
Multiplication factors for l0, l1, and g0
counter (7), (8)
1
32
Integer
Altera Corporation
January 2006
4–101
Stratix Device Handbook, Volume 1
DLL Specifications
Table 4–133. Fast PLL Specifications for -8 Speed Grades (Part 2 of 2)
Symbol
tARESET
Parameter
Min
Minimum pulse width on areset
signal
Max
Unit
10
ns
Notes to Tables 4–131 through 4–133:
(1)
(2)
See “Maximum Input & Output Clock Rates” on page 4–76.
PLLs 7, 8, 9, and 10 in the EP1S80 device support up to 717-MHz input and output.
(3)
Use this equation (fO U T = fI N * ml(n × post-scale counter)) in conjunction with the specified fI N P F D and fV C O
ranges to determine the allowed PLL settings.
When using the SERDES, high-speed differential I/O mode supports a maximum output frequency of 210 MHz
to the global or regional clocks (that is, the maximum data rate 840 Mbps divided by the smallest SERDES J factor
of 4).
(4)
(5)
(6)
(7)
(8)
Refer to the section “High-Speed I/O Specification” on page 4–87 for more information.
This parameter is for high-speed differential I/O mode only.
These counters have a maximum of 32 if programmed for 50/50 duty cycle. Otherwise, they have a maximum
of 16.
High-speed differential I/O mode supports W = 1 to 16 and J = 4, 7, 8, or 10.
DLL
Specifications
Table 4–134 reports the jitter for the DLL in the DQS phase shift reference
circuit.
Table 4–134. DLL Jitter for DQS Phase Shift Reference Circuit
Frequency (MHz)
f
DLL Jitter (ps)
197 to 200
± 100
160 to 196
± 300
100 to 159
± 500
For more information on DLL jitter, see the DDR SRAM section in the
Stratix Architecture chapter of the Stratix Device Handbook, Volume 1.
Table 4–135 lists the Stratix DLL low frequency limit for full phase shift
across all PVT conditions. The Stratix DLL can be used below these
frequencies, but it will not achieve the full phase shift requested across all
4–102
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
DC & Switching Characteristics
process and operating conditions. Run the timing analyzer in the
Quartus II software at the fast and slow operating conditions to see the
phase shift range that is achieved below these frequencies.
Table 4–135. Stratix DLL Low Frequency Limit for Full Phase Shift
Altera Corporation
January 2006
Phase Shift
Minimum Frequency for
Full Phase Shift
Unit
72°
119
MHz
90°
149
MHz
4–103
Stratix Device Handbook, Volume 1
DLL Specifications
4–104
Stratix Device Handbook, Volume 1
Altera Corporation
January 2006
5. Reference & Ordering
Information
S51005-2.1
Software
Stratix® devices are supported by the Altera® Quartus® II design
software, which provides a comprehensive environment for system-on-aprogrammable-chip (SOPC) design. The Quartus II software includes
HDL and schematic design entry, compilation and logic synthesis, full
simulation and advanced timing analysis, SignalTap® II logic analyzer,
and device configuration. See the Design Software Selector Guide for more
details on the Quartus II software features.
The Quartus II software supports the Windows XP/2000/NT/98, Sun
Solaris, Linux Red Hat v7.1 and HP-UX operating systems. It also
supports seamless integration with industry-leading EDA tools through
the NativeLink® interface.
Device Pin-Outs
Stratix device pin-outs can be found on the Altera web site
(www.altera.com).
Ordering
Information
Figure 5–1 describes the ordering codes for Stratix devices. For more
information on a specific package, see the Package Information for Stratix
Devices chapter.
Altera Corporation
September 2004
5–1
Ordering Information
Figure 5–1. Stratix Device Packaging Ordering Information
EP1S
80
F
1508
C
Family Signature
7
ES
Optional Suffix
EP1S: Stratix
Indicates specific device options or
shipment method.
ES: Engineering sample
Device Type
10
20
25
30
40
60
80
Speed Grade
5, 6, or 7, with 5 being the fastest
Operating Temperature
C: Commercial temperature (tJ = 0˚ C to 85˚ C)
I: Industrial temperature (tJ = -40˚ C to 100˚ C)
Package Type
B: Ball-grid array (BGA)
F: FineLine BGA
5–2
Stratix Device Handbook, Volume 1
Pin Count
Number of pins for a particular BGA or FineLine BGA package
Altera Corporation
September 2004
Index
A
Accumulator 2–63
Adder/Output Blocks 2–61
Adder/Subtractor
2–63
Accumulator
2–63
AGP 1x Specifications 4–13
AGP 2x Specifications 4–13
Architecture 2–1
36 x 36 Multiply Mode 2–66
addnsub Signal 2–8
Block Diagram 2–2
Bus Hold 2–121
Byte Alignment 2–140
Carry-Select Chain 2–11
Clear & Preset Logic Control 2–13
Combined Resources 2–78
Dedicated Circuitry 2–137
Device Resources 2–3
Device Routing Scheme 2–20
Digital Signal Processing Block 2–52
Direct Link Connection 2–5
Dynamic Arithmetic Mode 2–10
in LE 2–11
Four-Multipliers
Adder Mode 2–68
Functional Description 2–1
LAB
Interconnects 2–4
Logic Array Blocks 2–3
Structure 2–4
LE Operating Modes 2–8
Logic Elements 2–6
Modes of Operation 2–64
Multiplier Size & Configurations per DSP
block 2–70
Multiply-Accumulator Mode 2–67
MultiTrack Interconnect 2–14
Normal Mode 2–9
in LE 2–9
Altera Corporation
Open-Drain Output 2–120
Power Sequencing & Hot Socketing 2–140
Programmable Drive Strength 2–119
Programmable Pull-Up Resistor 2–122
Simple Multiplier Mode 2–64
Single-Port Mode 2–51
Slew-Rate Control 2–120
Two-Multipliers
Adder Mode 2–67
Adder Mode Implementing Complex
Multiply 2–68
C
Class I Specifications 4–11, 4–12
Class II Specifications 4–11, 4–12, 4–13
Clocks
Clock Feedback 2–96
Clock Multiplication & Division 2–88, 2–101
Clock Switchover
2–88
Delay 2–97
EP1S10, EP1S20 & EP1S25
Device I/O Clock Groups
2–80
EP1S25, EP1S20 & EP1S10 Device Fast Clock
Pin Connections to Fast Regional
Clocks 2–77
EP1S30 Device Fast Regional Clock Pin Connections to Fast Regional Clocks 2–78
EP1S30, EP1S40, EP1S60, EP1S80
Device I/O Clock Groups
2–81
External Clock
Inputs 2–102
Outputs 2–92, 2–103
Outputs for Enhanced PLLs 11 & 12 2–95
Outputs for PLLs 5 & 6 2–93
Fast Regional Clock External I/O Timing
Parameters 4–34
Fast Regional Clock Network 2–76
Index–1
Stratix Device Handbook, Volume 1
Global & Hierarchical Clocking 2–73
Global & Regional Clock Connections
from Side Pins & Fast PLL Outputs 2–85
from Top Clock Pins & Enhanced PLL
Outputs 2–86
Global Clock External I/O Timing
Parameters 4–35
Global Clock Network 2–74
Global Clocking 2–75
Independent Clock Mode 2–44
Input/Output
Clock Mode
2–46
Simple Dual-Port Mode 2–48
True Dual-Port Mode 2–47
Maximum Input & Output Clock Rates 4–76
Maximum Input Clock Rate
for CLK
(0, 2, 9, 11) Pins in
Flip-Chip
Packages
Wire-Bond
Packages
4–77
4–79
(1, 3, 8, 10) Pins in
Flip-Chip
Packages
Wire-Bond
Packages
4–78
(5, 6, 11, 12) Pins in
Flip-Chip
Index–2
4–84
Phase & Delay Shifting 2–96
Phase Delay 2–96
PLL Clock Networks 2–73
Read/Write Clock Mode
2–49
in Simple Dual-Port Mode 2–50
Regional Clock 2–75
External I/O Timing Parameters 4–34
Regional Clock Bus 2–79
Regional Clock Network 2–75
Spread-Spectrum Clocking 2–98
Configuration 3–5
32-Bit IDCODE 3–3
and Testing 3–1
Data Sources for Configuration 3–7
Local Update Mode 3–12
Local Update Transition Diagram 3–12
Operating Modes 3–5
Partial Reconfiguration 3–7
Remote Update 3–8
Remote Update Transition Diagram 3–11
Schemes 3–7
SignalTap II Embedded Logic Analyzer 3–5
Stratix FPGAs with JRunner 3–7
Control Signals 2–104
D
4–76
4–78
Maximum Output Clock Rate
for PLL
(1, 2, 3, 4) Pins in
Flip-Chip
Packages
Wire-Bond
Packages
4–81
4–80
(7..4) & CLK(15..12) Pins in
Flip-Chip
Packages
Wire-Bond
Packages
Packages
Wire-Bond
Packages
4–83
4–85
DC Switching
Absolute Maximum Ratings 4–1
Bus Hold Parameters 4–16
Capacitance 4–17
DC & Switching Characteristics 4–1
External Timing Parameters 4–33
Operating Conditions 4–1
Performance 4–20
Power Consumption 4–17
Recommended Operating Conditions 4–1
DDR
Double-Data Rate I/O Pins 2–111
Device Features
EP1S10, EP1S20, EP1S25, EP1S30, 1–3
EP1S40, EP1S60, EP1S80, 1–3
Altera Corporation
Stratix Device Handbook, Volume 1
Differential HSTL Specifications 4–15
DSP
Block Diagram
Configuration
for 18 x 18-Bit 2–55
for 9 x 9-Bit 2–56
Block Interconnect Interface 2–71
Block Interface 2–70
Block Signal Sources & Destinations 2–73
Blocks
Arranged in Columns 2–53
in Stratix Devices 2–54
Input Register Modes 2–60
Input Registers 2–58
Multiplier
2–60
Block 2–57
Signed Representation 2–60
Sub-Block 2–57
Sub-Blocks Using Input Shift Register
Connections 2–59
Pipeline/Post Multiply Register 2–61
E
EP1S10 Devices
Column Pin
Fast Regional Clock External I/O
Parameters 4–36
Global Clock External I/O
Parameters 4–37
Regional Clock External I/O
Parameters 4–36
Row Pin
Fast Regional Clock External I/O
Parameters 4–37
Global Clock External I/O
Parameters 4–38
Regional Clock External I/O
Parameters 4–38
EP1S20 Devices
Column Pin
Fast Regional Clock External I/O
Parameters 4–39
Global Clock External I/O
Parameters 4–40
Regional Clock External I/O
Altera Corporation
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Parameters 4–39
Row Pin
Fast Regional Clock External I/O
Parameters 4–40
Global Clock External I/O
Parameters 4–41
Regional Clock External I/O
Parameters 4–41
EP1S25 Devices
Column Pin
Fast Regional Clock External I/O
Parameters 4–42
Global Clock External I/O
Parameters 4–43
Regional Clock External I/O
Parameters 4–42
Row Pin
Fast Regional Clock External I/O
Parameters 4–43
Global Clock External I/O
Parameters 4–44
Regional Clock External I/O
Parameters 4–44
EP1S30 Devices
Column Pin
Fast Regional Clock External I/O
Parameters 4–45
Global Clock External I/O
Parameters 4–45
Regional Clock External I/O
Parameters 4–45
Row Pin
Fast Regional Clock External I/O
Parameters 4–46
Global Clock External I/O
Parameters 4–47
Regional Clock External I/O
Parameters 4–47
EP1S40 Devices
Column Pin
Fast Regional Clock External I/O
Parameters 4–48
Global Clock External I/O
Parameters 4–49
Regional Clock External I/O
Parameters 4–48
Row Pin
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Index–3
Stratix Device Handbook, Volume 1
Fast Regional Clock External I/O
Parameters 4–49
Global Clock External I/O
Parameters 4–50
Regional Clock External I/O
Parameters 4–50
EP1S60 Devices
Column Pin
Fast Regional Clock External I/O
Parameters 4–51
Global Clock External I/O
Parameters 4–52
Regional Clock External I/O
Parameters 4–51
M-RAM
Interface Locations 2–38
Row Pin
Fast Regional Clock External I/O
Parameters 4–52
Global Clock External I/O
Parameters 4–53
Regional Clock External I/O
Parameters 4–53
EP1S80 Devices
Column Pin
Fast Regional Clock External I/O
Parameters 4–54
Global Clock External I/O
Parameters 4–55
Regional Clock External I/O
Parameters 4–54
Global Clock External I/O
Parameters 4–56
Row Pin
Fast Regional Clock External I/O
Parameters 4–55
Regional Clock External I/O
Parameters 4–56
H
HSTL
Class I Specifications 4–14, 4–15
Class II Specifications 4–14, 4–15
Index–4
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
Timing
I
I/O
Standards
1.5-V 4–14, 4–15
I/O Specifications 4–4
1.8-V
I/O Specifications 4–4
2.5-V
I/O Specifications 4–3
3.3-V 4–13
LVDS I/O Specifications 4–6
PCI Specifications 4–9
PCML Specifications 4–8
Advanced I/O Standard Support 2–122
Column I/O Block Connection to the
Interconnect 2–107
Column Pin
Input Delay Adders 4–66
Control Signal Selection per IOE 2–109
CTT I/O Specifications 4–16
Differential
LVDS
Input
On-Chip
Termination 2–128
External I/O Delay Parameters 4–66
GTL+ I/O Specifications 4–10
High-Speed
Differential
I/O
Support 2–130
HyperTransport
Technology
Specifications 4–9
I/O Banks 2–125
I/O Structure 2–104
I/O Support by Bank 2–126
IOE Structure 2–105
LVCMOS Specifications 4–3
LVDS Performance on Fast PLL
Input 2–103
LVPECL Specifications 4–8
LVTTL Specifications 4–3
MultiVolt I/O Interface 2–129
MultiVolt I/O Support 2–130
Output Delay Adders for Fast Slew Rate
on Column Pins 4–68
Output Delay Adders for Fast Slew Rate
on Row Pins 4–69
Output Delay Adders for Slow Slew Rate
on Column Pins 4–70
Package Options & I/O Pin Counts 1–4
Receiver Input Waveforms for Differential
Altera Corporation
Stratix Device Handbook, Volume 1
I/O Standards 4–5
I/O Block Connection to the
Interconnect 2–106
Row Pin
Input Delay Adders 4–67
Signal Path through the I/O Block 2–108
SSTL-18 4–11
SSTL-2 4–12
SSTL-3 4–12, 4–13
Stratix IOE in Bidirectional I/O
Configuration 2–110
Supported I/O Standards 2–123
Transmitter Output Waveforms for Differential I/O Standards 4–6
Interconnect
C4 Connections 2–18
DSP Block Interface to Interconnect 2–72
Left-Facing
M-RAM
to
Interconnect
Interface 2–40
LUT
Chain
Register
Chain
Interconnects 2–17
M-RAM
Column
Unit
Interface
to
Interconnect 2–42
Row Unit Interface to Interconnect 2–41
R4 Connections 2–15
IOE
Internal Timing Microparameters 4–29
Row
J
JTAG
Boundary-Scan
Register Length 3–3
Support 3–1
Stratix JTAG
Instructions 3–2
Waveforms 3–4
L
LAB
Control Signals 2–5
Wide Control Signals 2–6
LUT
Chain & Register Chain 2–8
Altera Corporation
M
Memory Architecture
Byte Enable for M4K
RAM Block
2–32
Byte Enable for M-RAM
Block
2–35
External RAM Interfacing 2–115
M4K
Block Internal Timing
Microparameter
Descriptions 4–24
Microparameters 4–31
RAM Block
2–30
Configurations (Simple DualPort) 2–31
Configurations
(True
DualPort) 2–31
Control Signals 2–33
LAB Row Interface 2–33
M512
Block Internal Timing
Microparameter
Descriptions 4–24
Microparameters 4–30
RAM Block
Architecture 2–27
Configurations (Simple Dual-Port
RAM) 2–27
Control Signals 2–29
LAB Row Interface 2–30
Memory Block Size 2–26
Memory Modes 2–21
M-RAM
Block
2–34
Configurations (Simple DualPort) 2–34
Configurations
(True
DualPort) 2–35
Block Control Signals 2–37
Block Internal Timing
Microparameter
Descriptions 4–25
Combined Byte Selection for x144
Index–5
Stratix Device Handbook, Volume 1
Mode 2–36
&
Column
Interface
Unit
Signals 2–43
Parity Bit Support 2–24
Shift Register
Memory Configuration 2–26
Support 2–25
Simple Dual-Port & Single-Port Memory
Configurations 2–23
Stratix
IOE
in
DDR
Input
I/O
Configuration 2–112
Stratix IOE in DDR Output I/O
Configuration 2–114
TriMatrix Memory 2–21
True
Dual-Port
Memory
Configuration 2–22
Port I/O Standards 2–102
I/O Standards Supported for Enhanced PLL
Pins 2–94
Lock Detect & Programmable Gated
Locked 2–98
PLL Locations 2–84
Programmable Bandwidth 2–91
Programmable Delay Chain 2–111
Programmable Duty Cycle 2–98
Reconfiguration 2–90
Row
O
Ordering Information 5–1
Device Pin-Outs 5–1
Packaging Ordering Information 5–2
Reference & Ordering Information 5–1
Output Registers 2–64
Output Selection Multiplexer 2–64
P
Packaging
BGA Package Sizes 1–4
Device Speed Grades 1–5
FineLine BGA Package Sizes 1–5
PCI-X 1.0 Specifications 4–10
Phase Shifting 2–103
PLL
Advanced Clear & Enable Control 2–98
Dynamically Programmable Counters & Delays in Stratix Device Enhanced
PLLs 2–91
Enhanced
Fast PLLs 2–81
Fast PLL 2–100
Channel Layout EP1S10, EP1S20 or
EP1S25 Devices 2–138
Channel Layout EP1S30 to EP1S80
Devices 2–139
Index–6
T
Testing
Temperature Sensing Diode 3–13
Electrical Characteristics 3–14
External 3–14
Temperature vs. Temperature-Sensing Diode
Voltage 3–15
Timing
DSP
Block Internal Timing
Microparameter
Descriptions 4–23
Microparameters 4–29
Dual-Port RAM Timing Microparameter
Waveform 4–27
External Timing in Stratix Devices 4–33
High-Speed I/O Timing 4–87
High-Speed
Timing
Specifications
&
Terminology 4–87
Internal Parameters 4–22
IOE Internal Timing Microparameter
Descriptions 4–22
LE Internal Timing Microparameters 4–28
Logic Elements Internal Timing Microparameter Descriptions 4–22
Model 4–19
PLL Timing 4–94
Preliminary & Final 4–19
Stratix Device Timing Model Status 4–19
Stratix JTAG
Timing Parameters & Values 3–4
TriMatrix Memory
TriMatrix Memory Features 2–21
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