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EM482M1644VTB-7FE

EM482M1644VTB-7FE

  • 厂商:

    EOREX

  • 封装:

  • 描述:

    EM482M1644VTB-7FE - 128Mb (2M×4Bank×16) Synchronous DRAM - Eorex Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
EM482M1644VTB-7FE 数据手册
eorex Features • Fully Synchronous to Positive Clock Edge • Single 3.3V ±0.3V Power Supply • LVTTL Compatible with Multiplexed Address • Programmable Burst Length (B/L) - 1, 2, 4, 8 or Full Page • Programmable CAS Latency (C/L) - 2 or 3 • Data Mask (DQM) for Read / Write Masking • Programmable Wrap Sequence – Sequential (B/L = 1/2/4/8/full Page) – Interleave (B/L = 1/2/4/8) • Burst Read with Single-bit Write Operation • All Inputs are Sampled at the Rising Edge of the System Clock • Auto Refresh and Self Refresh • 4,096 Refresh Cycles / 64ms (15.6us) EM488M1644VTB 128Mb (2M×4Bank×16) Synchronous DRAM Description The EM488M1644VTB is Synchronous Dynamic Random Access Memory (SDRAM) organized as 2Meg words x 4 banks by 16 bits. All inputs and outputs are synchronized with the positive edge of the clock. The 128Mb SDRAM uses synchronized pipelined architecture to achieve high speed data transfer rates and is designed to operate at 3.3V low power memory system. It also provides auto refresh with power saving / down mode. All inputs and outputs voltage levels are compatible with LVTTL. Available packages:TSOPII 54P 400mil. Ordering Information Part No EM488M1644VTB-75F EM488M1644VTB-7F EM488M1644VTB-6F Organization 8M X 16 8M X 16 8M X 16 Max. Freq 133MHz @CL3 143MHz @CL3 166MHz @CL3 Package 54pin TSOP(ll) 54pin TSOP(ll) 54pin TSOP(ll) Grade Commercial Commercial Commercial Pb Free Free Free * EOREX reserves the right to change products or specification without notice. Dec. 2006 1/17 www.eorex.com eorex Pin Assignment EM488M1644VTB 54pin TSOP-II / (400mil × 875mil) / (0.8mm Pin pitch) Dec. 2006 2/17 www.eorex.com eorex Pin Description (Simplified) Pin 38 19 Name CLK /CS EM488M1644VTB Function (System Clock) Master clock input (Active on the positive rising edge) (Chip Select) Selects chip when active (Clock Enable) Activates the CLK when “H” and deactivates when “L”. CKE should be enabled at least one cycle prior to new command. Disable input buffers for power down in standby. ( Address) Row address (A0 to A11) is determined by A0 to A11 level at the bank active command cycle CLK rising edge. CA (CA0 to CA8) is determined by A0 to A8 level at the read or write command cycle CLK rising edge. And this column address becomes burst access start address. A10 defines the pre-charge mode. When A10= High at the pre-charge command cycle, all banks are pre-charged. But when A10= Low at the pre-charge command cycle, only the bank that is selected by BA0/BA1 is pre-charged. (Bank Address) Selects which bank is to be active. (Row Address Strobe) Latches Row Addresses on the positive rising edge of the CLK with /RAS “L”. Enables row access & pre-charge. (Column Address Strobe) Latches Column Addresses on the positive rising edge of the CLK with /CAS low. Enables column access. (Write Enable) Latches Column Addresses on the positive rising edge of the CLK with /CAS low. Enables column access. (Data Input/Output Mask) DQM controls I/O buffers. (Data Input/Output) DQ pins have the same function as I/O pins on a conventional DRAM. (Power Supply/Ground) VDD and VSS are power supply pins for internal circuits. (Power Supply/Ground) VDDQ and VSSQ are power supply pins for the output buffers. (No Connection) This pin is recommended to be left No Connection on the device. 37 CKE 23~26, 22, 29~35 A0~A11 20, 21 18 BA0, BA1 /RAS 17 /CAS 16 39/15 2, 4, 5, 7, 8, 10, 11, 13, 42, 44, 45, 47, 48, 50, 51, 53 1,14,27/ 28,41,54 3, 9, 43, 49/ 6, 12, 46, 52 36,40 /WE UDQM/LDQM DQ0~DQ15 VDD/VSS VDDQ/VSSQ NC Dec. 2006 3/17 www.eorex.com eorex Absolute Maximum Rating Symbol VIN, VOUT VDD, VDDQ TOP TSTG PD IOS Item Input, Output Voltage Power Supply Voltage Operating Temperature Range Storage Temperature Range Power Dissipation Short Circuit Current EM488M1644VTB Rating -0.3 ~ +4.6 -0.3 ~ +4.6 Commercial 0 ~ +70 Extended -25 ~ +85 -55 ~ +150 1 50 Units V V ° C ° C W mA Note: Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Capacitance (VCC=3.3V, f=1MHz, TA=25° C) Symbol CCLK CI CO Parameter Clock Capacitance Input Capacitance for CLK, CKE, Address, /CS, /RAS, /CAS, /WE, DQML, DQMU Input/Output Capacitance Min. 2.5 2.5 4.0 Typ. Max. 3.5 4.0 6.5 Units pF pF pF Recommended DC Operating Conditions (TA=-0° ~+70°C) C Symbol VDD VDDQ VIH VIL Parameter Power Supply Voltage Power Supply Voltage (for I/O Buffer) Input Logic High Voltage Input Logic Low Voltage Min. 3.0 3.0 2.0 -0.3 Typ. 3.3 3.3 Max. 3.6 3.6 VDD+0.3 0.8 Units V V V V Note: * All voltages referred to VSS. * VIH (max.) = 5.6V for pulse width 3ns * VIL (min.) = -2.0V for pulse width 3ns Dec. 2006 4/17 www.eorex.com eorex Recommended DC Operating Conditions (VDD=3.3V±0.3V, TA=0°C ~ 70° C) Symbol ICC1 ICC2P ICC2PS ICC2N Parameter Operating Current (Note 1) EM488M1644VTB Test Conditions Burst length=1, tRC≥tRC(min.), IOL=0mA, One bank active CKE≤VIL(max.), tCK=15ns CKE≤VIL(max.), tCK= ∞ CKE≥VIL(min.), tCK=15ns, /CS≥VIH(min.) Input signals are changed one time during 30ns CKE≥VIL(min.), tCK= ∞ , Input signals are stable CKE≤VIL(max.), tCK=15ns CKE≤VIL(max.), tCK= ∞ CKE≥VIL(min.), tCK=15ns, /CS≥VIH(min.) Input signals are changed one time during 30ns CKE≥VIL(min.), tCK= ∞ , Input signals are stable tCCD≥2CLKs, IOL=0mA tRC≥tRC(min.) CKE≤0.2V Max. 75 1 1 20 Units mA mA mA mA Precharge Standby Current in Power Down Mode Precharge Standby Current in Non-power Down Mode ICC2NS ICC3P ICC3PS ICC3N Active Standby Current in Power Down Mode 15 7 5 45 mA mA mA mA Active Standby Current in Non-power Down Mode ICC3NS ICC4 ICC5 ICC6 Operating Current (Burst Mode) (Note 2) (Note 3) 35 110 150 2 mA mA mA mA Refresh Current Self Refresh Current *All voltages referenced to VSS. Note 1: ICC1 depends on output loading and cycle rates. Specified values are obtained with the output open. Input signals are changed only one time during tCK (min.) Note 2: ICC4 depends on output loading and cycle rates. Specified values are obtained with the output open. Input signals are changed only one time during tCK (min.) Note 3: Input signals are changed only one time during tCK (min.) Recommended DC Operating Conditions (Continued) Symbol IIL IOL VOH VOL Parameter Input Leakage Current Output Leakage Current High Level Output Voltage Low Level Output Voltage Test Conditions 0≤VI≤VDDQ, VDDQ=VDD All other pins not under test=0V 0≤VO≤VDDQ, DOUT is disabled IO=-4mA IO=+4mA Min. -0.5 -0.5 2.4 0.4 Typ. Max. +0.5 +0.5 Units uA uA V V Dec. 2006 5/17 www.eorex.com eorex Block Diagram Auto/Self Refresh Counter EM488M1644VTB A0 A1 A2 A3 Row Add. Buffer A4 A5 A6 A7 A8 A9 A10 A11 Address Register Row Decoder DQM Memory Array Write DQM Control Data In S/A & I/O Gating Col. Decoder Data Out DOi BA0 BA1 Col. Add. Buffer Read DQM Control Mode Register Set Col. Add. Counter Burst Counter Timing Register CLK CKE /CS /RAS /CAS /WE DQM Dec. 2006 6/17 www.eorex.com eorex AC Operating Test Conditions (VDD=3.3V±0.3V, TA=0°C ~70° C) Item Output Reference Level Output Load Input Signal Level Transition Time of Input Signals Input Reference Level EM488M1644VTB Conditions 1.4V/1.4V See diagram as below 2.4V/0.4V 2ns 1.4V AC Operating Test Characteristics (VDD=3.3V±0.3V, TA=0°C ~70° C) Symbol tCK tAC tCH tCL tOH tHZ tLZ tIH tIS Parameter Clock Cycle Time Access Time form CLK CLK High Level Width CLK Low Level Width Data-out Hold Time Data-out High Impedance Time (Note 5) CL=3 CL=2 CL=3 CL=2 -7.5 Min. Max. 7.5 10 5.4 6 2.5 2.5 -7 Min. 7 10 5.4 6 2.5 2.5 2.5 2.5 2.5 2 6 2 0 0.8 1.5 Max. Min. 6 10 -6 Max. Uni ts ns 5.4 6 ns ns ns ns 6 ns ns ns ns CL=3 CL=2 CL=3 CL=2 2.5 2.5 0 1 1.5 6 2.5 0 0.8 1.5 Data-out Low Impedance Time Input Hold Time Input Setup Time * All voltages referenced to VSS. Note 5: tHZ defines the time at which the output achieve the open circuit condition and is not referenced to output voltage levels. Dec. 2006 7/17 www.eorex.com eorex (VDD=3.3V±0.3V, TA=0°C ~70° C) Symbol tRC tRAS tRP tRCD tRRD tCCD tDPL tBDL tROH tREF Parameter ACTIVE to ACTIVE Command (Note 6) Period ACTIVE to PRECHARGE (Note 6) Command Period PRECHARGE to ACTIVE (Note 6) Command Period ACTIVE to READ/WRITE Delay (Note 6) Time ACTIVE(one) to ACTIVE(another) (Note 6) Command READ/WRITE Command to READ/WRITE Command Date-in to PRECHARGE Command Date-in to BURST Stop Command Data-out to High CL=3 Impedance from CL=2 PRECHARGE Command Refresh Time (4,096 cycle) -7.5 Min. Max. 67 45 20 20 15 1 2 1 3 2 64 100k EM488M1644VTB AC Operating Test Characteristics (Continued) -7 Min. 62 42 20 20 14 1 2 1 3 2 64 100k Max. Min. 60 42 20 20 12 1 2 1 3 2 64 100k -6 Max. Units ns ns ns ns ns CLK CLK CLK CLK ms * All voltages referenced to VSS. Note 6: These parameters account for the number of clock cycles and depend on the operating frequency of the clock, as follows: The number of clock cycles = Specified value of timing/clock period (Count Fractions as a whole number) Recommended Power On and Initialization The following power on and initialization sequence guarantees the device is preconditioned to each user’s specific needs. (Like a conventional DRAM) During power on, all VDD and VDDQ pins must be built up simultaneously to the specified voltage when the input signals are held in the “NOP” state. The power on voltage must not exceed VDD+0.3V on any of the input pins or VDD supplies. (CLK signal started at same time) After power on, an initial pause of 200 µs is required followed by a precharge of all banks using the precharge command. To prevent data contention on the DQ bus during power on, it is required that the DQM and CKE pins be held high during the initial pause period. Once all banks have been precharged, the Mode Register Set Command must be issued to initialize the Mode Register. A minimum of eight Auto Refresh cycles (CBR) are also required, and these may be done before or after programming the Mode Register. Dec. 2006 8/17 www.eorex.com eorex Simplified State Diagram EM488M1644VTB Self Refresh SE LF Mode Register Set MRS SE LF Ex it IDLE E CK REF CBR Refresh E CK Power Down CKE Row Active T BS ad e R CKE Read Active Power Down Write WRITE Suspend CKE WRITE CKE Read Write READ CKE CKE READ Suspend WRITEA Suspend CKE WRITEA CKE READA CKE CKE READA Suspend POWER ON Precharge Precharge Manual Input Automatic Sequence Dec. 2006 9/17 www.eorex.com eorex Address Input for Mode Register Set BA1 BA0 A11 A10 A9 A8 A7 A6 A5 Operation Mode EM488M1644VTB A4 A3 BT A2 A1 A0 CAS Latency Burst Length Burst Length Sequential 1 2 4 8 Reserved Reserved Reserved Full Page Interleave 1 2 4 8 Reserved Reserved Reserved Reserved A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 Burst Type Interleave Sequential A3 1 0 CAS Latency Reserved Reserved 2 3 Reserved Reserved Reserved Reserved A6 0 0 0 0 1 1 1 1 A5 0 0 1 1 0 0 1 1 A4 0 1 0 1 0 1 0 1 BA1 0 0 BA0 0 0 A11 0 0 A10 0 0 A9 0 1 A8 0 0 A7 0 0 Operation Mode Normal Burst Read with Single-bit Write Dec. 2006 10/17 www.eorex.com eorex Burst Type (A3) Burst Length 2 A2 X X X 4 X X X 0 0 0 8 0 1 1 1 1 Full Page* n A1 X X 0 0 1 1 0 0 1 1 0 0 1 1 n A0 0 0 0 1 0 1 0 1 0 1 0 1 0 1 n 01 10 0123 1230 2301 3012 01234567 12345670 23456701 34567012 45670123 56701234 67012345 70123456 EM488M1644VTB Sequential Addressing Interleave Addressing 01 10 0123 1032 2301 3210 01234567 10325476 23016745 32107654 45670123 54761032 67452301 76543210 - Cn Cn+1 Cn+2…… * Page length is a function of I/O organization and column addressing ×16 (CA0 ~ CA8): Full page = 512bits 1. Command Truth Table Command Ignore Command No Operation Burst Stop Read Read with Auto Pre-charge Write Write with Auto Pre-charge Bank Activate Pre-charge Select Bank Pre-charge All Banks Mode Register Set Symbol DESL NOP BSTH READ READA WRIT W RITA ACT PRE PALL MRS CKE n-1 n H H H H H H H H H H H X X X X X X X X X X X /CS H L L L L L L L L L L /RAS X H H H H H L L L L L /CAS X H H L L L H H H H L /WE X H L H H L H H L L L BA0, BA1 X X X V V V V V V X L A10 X X X L H L H V L H L A11, A9~A10 X X X V V V V V X X V H = High level, L = Low level, X = High or Low level (Don't care), V = Valid data input Dec. 2006 11/17 www.eorex.com eorex 2. DQM Truth Table Command Data Write/Output Enable Data Mask/Output Disable Upper Byte Write Enable/Output Enable Read Read with Auto Pre-charge Write Write with Auto Pre-charge Bank Activate Pre-charge Select Bank Pre-charge All Banks Mode Register Set Symbol ENB MASK BSTH READ READA WRIT WRITA ACT PRE PALL MRS EM488M1644VTB CKE n-1 H H H H H H H H H H H n X X X X X X X X X X X /CS H L L L L L L L L L L H = High level, L = Low level, X = High or Low level (Don't care), V = Valid data input 3. CKE Truth Table Item Activating Any Clock Suspend Idle Idle Self Refresh Idle Power Down Command Clock Suspend Mode Entry Clock Suspend Mode Clock Suspend Mode Exit CBR Refresh Command Self Refresh Entry Self Refresh Exit Power Down Entry Power Down Exit REF SELF Symbol CKE n-1 n H L L L L H H L L H L H H L H H L H /CS X X X L L L H X X /RAS X X X L L H X X X /CAS X X X L L H X X X /WE X X X H H H X X X Addr. X X X X X X X X X Remark H = High level, L = Low level, X = High or Low level (Don't care) Dec. 2006 12/17 www.eorex.com eorex 4. Operative Command Table (Note 7) Current State /CS H L L Idle L L L L L H L L Row Active L L L L L H L L L Read L L L L L H L L L Write L L L L L L L L L L L H H L L L H L H L BA/CA/A10 BA/RA BA, A10 X Op-Code W RIT/WRITA ACT PRE/PALL REF/SELF MRS EM488M1644VTB /R X H H H L L L L X H H H L L L L X H H H L L L L L X H H H /C X H L L H H L L X H L L H H L L X H H L L H H L L X H H L /W X X H L H L H L X X H L H L H L X H L H L H L H L X H L H Addr. X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code X X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code X X X BA/CA/A10 Command DESL NOP or BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP or BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA Action Nop or power down Nop or power down ILLEGAL (Note 9) (Note 9) (Note 8) (Note 8) ILLEGAL Row activating Nop Refresh or self refresh (Note 10) Mode register accessing Nop Nop (Note 11) Begin read: Determine AP Begin write: Determine AP ILLEGAL (Note 9) (Note 12) (Note 11) Pre-charge ILLEGAL ILLEGAL Continue burst to end → Row active Continue burst to end → Row active Burst stop → Row active Terminate burst, new read: (Note 13) Determine AP Terminate burst, start write: Determine AP (Note 9) ILLEGAL (Note 10) (Note 13, 14) (Note 10) Terminate burst, pre-charging ILLEGAL ILLEGAL Continue burst to end → Write recovering Continue burst to end → Write recovering Burst stop → Row active Terminate burst, start read: (Note 13, 14) Determine AP 7, 8 Terminate burst, new write: Determine AP 7 (Note 9) ILLEGAL (Note 15) (Note 13) Terminate burst, pre-charging ILLEGAL ILLEGAL Remark H = High level, L = Low level, X = High or Low level (Don't care) Dec. 2006 13/17 www.eorex.com eorex Current State /CS H L Read with AP L L L L L L L H L Write with AP L L L L L L L H L L L Pre-charging L L L L L H L L L Row Activating L L L L L EM488M1644VTB 4. Operative Command Table (Continued) (Note 7) /R X H H H H L L L L X H H H H L L L L X H H H H L L L L X H H H H L L L L /C X H H L L H H L L X H H L L H H L L X H H L L H H L L X H H L L H H L L /W X H L H L H L H L X H L H L H L H L X H L H L H L H L X H L H L H L H L Addr. X X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code X X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code X X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code X X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code Command DESL NOP BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS Action Continue burst to end → Pre-charging Continue burst to end → Pre-charging ILLEGAL (Note 9) ILLEGAL ILLEGAL ILLEGAL (Note 9) (Note 9) (Note 9) ILLEGAL ILLEGAL ILLEGAL Burst to end → Write recovering with auto pre-charge Continue burst to end → Write recovering with auto pre-charge ILLEGAL (Note 9) ILLEGAL ILLEGAL ILLEGAL (Note 9) (Note 9) (Note 9) ILLEGAL ILLEGAL ILLEGAL Nop → Enter idle after tRP Nop → Enter idle after tRP ILLEGAL (Note 9) ILLEGAL ILLEGAL (Note 9) (Note 9) ILLEGAL Nop → Enter idle after tRP ILLEGAL ILLEGAL Nop → Enter idle after tRCD Nop → Enter idle after tRCD ILLEGAL (Note 9) ILLEGAL ILLEGAL ILLEGAL (Note 9) (Note 9, 16) (Note 9) ILLEGAL ILLEGAL ILLEGAL Remark H = High level, L = Low level, X = High or Low level (Don't care), AP = Auto Pre-charge Dec. 2006 14/17 www.eorex.com eorex Current State /CS H L L L L L L L L H L L L L L L L L H L L L L H L L L L EM488M1644VTB 4. Operative Command Table (Continued) (Note 7) /R X H H H H L L L L X H H H H L L L L X H H L L X H H H L /C X H H L L H H L L X H H L L H H L L X H L H L X H H L X /W X H L H L H L H L X H L H L H L H L X X X X X X H L X X Addr. X X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code X X X BA/CA/A10 BA/CA/A10 BA/RA BA, A10 X Op-Code X X X X X X X X X X Command DESL NOP BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA W RIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP/BST READ/WRIT ACT/PRE/PALL REF/SELF/MRS DESL NOP BST READ/WRIT ACT/PRE/PALL/ REF/SELF/MRS Action Nop → Enter row active after tDPL Nop → Enter row active after tDPL Nop → Enter row active after tDPL Start read, Determine AP (Note 14) New write, Determine AP ILLEGAL (Note 9) (Note 9) Write Recovering Write Recovering with AP ILLEGAL ILLEGAL ILLEGAL Nop → Enter pre-charge after tDPL Nop → Enter pre-charge after tDPL Nop → Enter pre-charge after tDPL (Note 9, 14) ILLEGAL ILLEGAL (Note 9) (Note 9) Refreshing Mode Register Accessing ILLEGAL ILLEGAL ILLEGAL ILLEGAL Nop → Enter idle after tRC Nop → Enter idle after tRC ILLEGAL ILLEGAL ILLEGAL Nop Nop ILLEGAL ILLEGAL ILLEGAL Remark H = High level, L = Low level, X = High or Low level (Don't care), AP = Auto Pre-charge Note 7: All entries assume that CKE was active (High level) during the preceding clock cycle. Note 8: If all banks are idle, and CKE is inactive (Low level), SDRAM will enter Power down mode. All input buffers except CKE will be disabled. Note 9: Illegal to bank in specified states; Function may be legal in the bank indicated by Bank Address (BA), depending on the state of that bank. Note 10: If all banks are idle, and CKE is inactive (Low level), SDRAM will enter Self refresh mode. All input buffers except CKE will be disabled. Note 11: Illegal if tRCD is not satisfied. Note 12: Illegal if tRAS is not satisfied. Note 13: Must satisfy burst interrupt condition. Note 14: Must satisfy bus contention, bus turn around, and/or write recovery requirements. Note 15: Must mask preceding data which don't satisfy tDPL. Note 16: Illegal if tRRD is not satisfied. Dec. 2006 15/17 www.eorex.com eorex 5. Command Truth Table for CKE Current State CKE n-1 n H Self Refresh L L L L L H H H H H H H H H Power Down L L H H H H H H H H H H L Row Active H L H Any State Other than Listed above H L L X H H H H L H H H H L L L L X H L H H H H H L L L L L X X X H L H L EM488M1644VTB /CS X H L L L X H L L L H L L L X X X H L L L L H L L L L X X X X X X X /R X X H H L X X H H L X H H L X X X X H L L L X H L L L X X X X X X X /C X X H L X X X H L X X H L X X X X X X H L L X X H L L X X X X X X X /W X X X X X X X X X X X X X X X X X X X X H L X X X H L X X X X X X X Addr. X X X X X X X X X X X X X X X X X Action INVALID, CLK(n-1) would exit self refresh Self refresh recovery Self refresh recovery ILLEGAL ILLEGAL Maintain self refresh Idle after tRC Idle after tRC ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL INVALID, CLK(n-1) would exit power down Exit power down → Idle Maintain power down mode Refer to operations in Operative Command Table Self Refresh Recovery X Op-Code Refresh Refer to operations in Operative Command Table Both Banks Idle X Op-Code X X X X X X Self refresh Refer to operations in Operative Command Table (Note 17) Power down Refer to operations in Operative Command Table (Note 17) Power down Refer to operations in Operative Command Table Begin clock suspend next cycle (Note 18) (Note 17) Exit clock suspend next cycle Maintain clock suspend Remark: H = High level, L = Low level, X = High or Low level (Don't care) Notes 17: Self refresh can be entered only from the both banks idle state. Power down can be entered only from both banks idle or row active state. Notes 18: Must be legal command as defined in Operative Command Table Dec. 2006 16/17 www.eorex.com eorex Package Description EM488M1644VTB DIM A A1 A2 b c D e E E1 L R R1 MILLIMETERS MIN. − 0.05 0.95 0.30 0.12 22.09 11.56 10.03 0.40 0.12 0.12 NOM. − − 1.00 − − 22.22 0.80 BASIC 11.76 10.16 0.50 − 11.96 10.29 0.60 0.25 0.455 0.395 0.016 0.005 0.005 MAX. 1.20 0.15 1.05 0.45 0.21 22.35 MIN. − 0.002 0.037 0.012 0.005 0.870 INCHES NOM. − − 0.039 − − 0.875 0.0315 BASIC 0.463 0.400 0.020 − 0.471 0.405 0.024 0.010 MAX. 0.047 0.006 0.041 0.018 0.008 0.880 − − − − * Controlling dimension: millimeters * Dimension D does not include mold protrusion. Mold protrusion shall not exceed 0.15mm (0.006”) per side. Dimension E1 does not include interlead protrusion. Interlead protrusion shall not exceed 0.25mm (0.01”) per side. * Dimension b does not include dambar protrusions/intrusion. Allowable dambar protrusion shall not cause the lead to be wider than the MAX b dimension by more than 0.13mm. Dambar intrusion shall not cause the lead to be narrower than the MIN b dimension by more than 0.07mm. Dec. 2006 17/17 www.eorex.com
EM482M1644VTB-7FE
### 物料型号 - 型号:EM488M1644VTB - 类型:128Mb (2M×4Bank×16) Synchronous DRAM

### 器件简介 - 组织:2Meg words x 4 banks by 16 bits - 电源电压:单3.3V ±0.3V电源供电 - 兼容性:LVTTL兼容,多路复用地址 - 特点:全同步于正时钟边沿,可编程突发长度和CAS延迟,数据掩码用于读写掩蔽等

### 引脚分配 - 引脚数量:54pin TSOP-II (400mil × 875mil) / (0.8mm Pin pitch) - 主要引脚功能:系统时钟输入(CLK)、芯片选择(/CS)、时钟使能(CKE)、行地址和列地址(A0~A11)、银行地址(BA0, BA1)、行地址选通(/RAS)、列地址选通(/CAS)、写使能(WE)、数据输入/输出掩码(UDQM/LDQM)、数据输入/输出(DQ0~DQ15)、电源供应/地(VDD/Vss)等

### 参数特性 - 工作频率:133MHz @CL3、143MHz @CL3、166MHz @CL3 - 刷新周期:4,096 Refresh Cycles / 64ms (15.6us) - 电容值: - 时钟电容:2.5 - 3.5 pF - 输入电容:2.5 - 4.0 pF - 输入/输出电容:4.0 - 6.5 pF - 最大功耗:1W - 短路电流:50mA

### 功能详解 - 操作模式:常规操作、突发读取带单比特写入、自动刷新和自刷新等 - 突发类型:连续和交错,可编程突发长度(B/L) - 1, 2, 4, 8 或全页 - CAS延迟:可编程CAS延迟(C/L) - 2 或 3

### 应用信息 - 应用领域:适用于需要3.3V低功耗内存系统的高速数据传输应用

### 封装信息 - 封装类型:TSOPII 54P 400mil - 封装尺寸:详细尺寸图和英寸/毫米对照表
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