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EPC9005C

EPC9005C

  • 厂商:

    EPC(宜普)

  • 封装:

    -

  • 描述:

    BOARD DEV FOR EPC2014C

  • 数据手册
  • 价格&库存
EPC9005C 数据手册
Development Board EPC9005C Quick Start Guide 40 V Half-Bridge with Gate Drive, Using EPC2014C DESCRIPTION The EPC9005C development board is a 40 V maximum device voltage, 7 A maximum output current, half bridge with onboard gate drives, featuring the EPC2014C enhancement mode (eGaN®) field effect transistor (FET). The purpose of this development board is to simplify the evaluation process of the EPC2014C eGaN FET by including all the critical components on a single board that can be easily connected into any existing converter. The EPC9005C development board is 2” x 1.5” and contains two EPC2014C eGaN FET in a half bridge configuration using Texas Instruments LM5113 gate driver, supply and bypass capacitors. The board contains all critical components and layout for optimal switching performance. There are also various probe points to facilitate simple waveform measurement and efficiency calculation. A complete block diagram of the circuit is given in Figure 1. For more information on the EPC2014Cs eGaN FET please refer to the datasheet available from EPC at www.epc-co.com. The datasheet should be read in conjunction with this quick start guide. Table 1: Performance Summary (TA = 25°C) SYMBOL PARAMETER VDD Gate Drive Input Supply Range VIN CONDITIONS MIN MAX UNITS 7 12 V Bus Input Voltage Range 24* V VOUT Switch Node Output Voltage 40 V IOUT Switch Node Output Current 7* A VPWM PWM Logic Input Voltage Threshold Input ‘High’ Input ‘Low’ 3.5 0 6 1.5 V V Minimum ‘High’ State Input Pulse Width VPWM rise and fall time < 10ns 30 ns Minimum ‘Low’ State Input Pulse Width VPWM rise and fall time < 10ns 100# ns * Assumes inductive load, maximum current depends on die temperature – actual maximum current with be subject to switching frequency, bus voltage and thermals. # Limited by time needed to ‘refresh’ high side bootstrap supply voltage. For More Information: Please contact info@epc-co.com or your local sales representative Visit our website: www.epc-co.com Sign-up to receive EPC updates at bit.ly/EPCupdates or text “EPC” to 22828 EPC Products are distributed through Digi-Key. www.digikey.com Development Board / Demonstration Board Notification The EPC9005C board is intended for product evaluation purposes only and is not intended for commercial use. As an evaluation tool, it is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corporation (EPC) makes no guarantee that the purchased board is 100% RoHS compliant. No Licenses are implied or granted under any patent right or other intellectual property whatsoever. EPC assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or any other intellectual property rights of any kind. EPC reserves the right at any time, without notice, to change said circuitry and specifications. EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015 QUICK START GUIDE EPC9005C QUICK START PROCEDURE Development board EPC9005C is easy to set up to evaluate the performance of the EPC2014C eGaN FET. Refer to Figure 2 for proper connect and measurement setup and follow the procedure below: 1. With power off, connect the input power supply bus to +VIN (J5, J6) and ground / return to –VIN (J7, J8). 2. With power off, connect the switch node of the half bridge OUT (J3, J4) to your circuit as required. 3. With power off, connect the gate drive input to +VDD (J1, Pin-1) and ground return to –VDD (J1, Pin-2). 4. With power off, connect the input PWM control signal to PWM (J2, Pin-1) and ground return to any of the remaining J2 pins. 5. Turn on the gate drive supply – make sure the supply is between 7 V and 12 V range. VDD PWM Input Gate Drive Regulator Logic and Dead-time Adjust 6. Turn on the bus voltage to the required value (do not exceed the absolute maximum voltage of 40 V on VOUT). 7. Turn on the controller / PWM input source and probe switching node to see switching operation. 8. Once operational, adjust the bus voltage and load PWM control within the operating range and observe the output switching behavior, efficiency and other parameters. 9. For shutdown, please follow steps in reverse. NOTE. When measuring the high frequency content switch node (OUT), care must be taken to avoid long ground leads. Measure the switch node (OUT) by placing the oscilloscope probe tip through the large via on the switch node (designed for this purpose) and grounding the probe directly across the GND terminals provided. See Figure 3 for proper scope probe technique. Gate Drive Supply Half-Bridge with Bypass VIN LM5113 Gate Driver OUT Figure 1: Block Diagram of EPC9005C Development Board EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015 | | PAGE 2 QUICK START GUIDE EPC9005C QUICK START PROCEDURE 7 V – 12 V 5C, – 40 VDD Supply + Gate Drive Supply (Note Polarity) A IIN + Switch Node VIN V + < 24 V VIN Supply – – (For Efficiency Measurement) External Circuit PWM Input EPC EFFICIENT POWER CONVERSION Figure 2: Proper Connection and Measurement Setup 5C, 40 Do not use probe ground lead Do not let probe tip touch back of low-side die! Ground probe against TP3 EPC EFFICIENT POWER CONVERSION Minimize loop Place probe in large via at OUT Figure 3: Proper Measurement of Switch Node – OUT EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015 | | PAGE 3 QUICK START GUIDE EPC9005C Figure 4: Typical Waveforms for VIN = 24 V to 1.2 V/7 A (1000kHz) Buck converter CH1: VPWM Input voltage – CH2: (IOUT) Switch node current – CH4: (VOUT) Switch node voltage THERMAL PERFORMANCE The EPC9005C development board showcases the EPC2014C eGaN FET. Although the electrical performance surpasses that for traditional silicon devices, their relatively smaller size does magnify the thermal management requirements. The EPC9005C is intended for bench evaluation with low ambient temperature and convection cooling. Table 2: Bill of Materials Item Qty The addition of heat-sinking and forced air cooling can significantly increase the current rating of these devices, but care must be taken to not exceed the absolute maximum die temperature of 125°C. NOTE. The EPC9005C development board does not have any current or thermal protection on board. Reference Part Description Manufacturer / Part # 1 4 C4, C10, C11, C13 Capacitor, 1uF, 10%, 25V, X5R Murata, GRM188R61E105KA12D 2 2 C6, C7 Capacitor, 100pF, 5%, 50V, NP0 TDK, C1608C0G1H101J 3 1 C12 Capacitor, 0.1uF, 10%, 25V, X5R TDK, C1608X5R1E104K 4 2 C16, C17 Capacitor, 4.7uF, 20%, 50V, X5R Taiyo Yuden, UMK325BJ475M 5 2 D1, D2 Schottky Diode, 30V Diodes Inc., SDM03U40-7 6 3 J1, J2, J9, TP3 (See Note 1) Connector FCI, 68001-236HLF 7 1 J3, J4, J5, J6, J7, J8 Connector FCI, 68602-224HLF 8 2 Q1, Q2 eGaN® FET EPC, EPC2014C 9 1 R1 Resistor, 10.0K, 5%, 1/8W Stackpole, RMCF0603FT10K0 10 2 R2, R15 Resistor, 0 Ohm, 1/10W Panasonic, ERJ-3GEY0R00V 11 1 R4 Resistor, 22 Ohm, 1%, 1/8W Stackpole, RMCF0603FT22R0 12 1 R5 Resistor, 33 Ohm, 1%, 1/8W Stackpole, RMCF0603FT33R0 13 2 R11, R12 1 Ohm, 1%, 1/8W Stackpole, RMCF0402TFT1R00 14 2 TP1, TP2 Test Point Keystone Elect, 5015 15 1 U1 I.C., Logic Fairchild, NC7SZ00L6X 16 1 U2 I.C., Gate driver Texas Instruments, LM5113 17 1 U3 I.C., Regulator Microchip, MCP1703T-5002E/MC 18 1 U4 I.C., Logic 19 0 R13, R14 Optional Resistor 20 0 C15, C19 Optional Capacitor 21 0 D5, D6 Optional Diode 22 0 P1, P2 Optional Potentiometer 400 LFM Fairchild, NC7SZ08L6X Note 1: 36 pin header to be cut as follows J1: cut 2 pins used, J2 & J9: cut 4 pins used, TP3: cut 1 pin used EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015 | | PAGE 4 QUICK START GUIDE EPC9005C 1 2 4 3 5 6 7 - 12 Vdc A U3 J1 1 2 CON2 8 C10 7 1uF, 25V 6 OUT NC NC NC NC NC GND VCC 1 C11 2 3 C4 4 1uF, 25V 1uF, 25V 9 5 IN GND A TP2 Keystone 5015 1 5 GND Y 4 0.1uF, 25V 4 3 2 1 HB VDD HOH C15 33 C17 4.7uF, 50V 4.7uF, 50V Opt. R12 Q2 1 Ohm EPC2014C R13 Opt. C19 Optional TP3 1 (Optional) CON1 J7 CON4 C 1 2 3 4 C7 D6 C16 Opt. 100p SDM03U40 R5 Optional Opt. D5 C6 D2 R15 Zero SW OUT J4 CON4 LOH 22 U2 LM5113 GND LOL C13 SDM03U40 R4 2 J3 CON4 1uF, 25V D1 Y NC7SZ08L6X P2 Optional 2 VSS P1 Optional 1 2 3 4 VDD GND R14 B U4 B PWM2 J6 CON4 EPC2014C C12 HS R2 Zero Q1 R11 1 Ohm HOL 3 A C 1 2 3 4 24V Max 5 B NC7SZ00L6X CON2 1 VCC 6 J5 CON4 4 3 2 1 2 VDD LI R1 10k U1 A HI B J2 1 2 CON2 J9 1 2 PWM1 MCP1703 100p 1 4 3 2 1 GND TP1 Keystone 5015 J8 CON4 D D 40V Half-Bridge with Gate Drive, using EPC2014C Rev 2.0 1 2 3 4 5 6 Figure 5: Development Board Schematic EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015 | | PAGE 5
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