Development Board
EPC9005C
Quick Start Guide
40 V Half-Bridge with Gate Drive,
Using EPC2014C
DESCRIPTION
The EPC9005C development board is a 40 V maximum device voltage, 7 A maximum output
current, half bridge with onboard gate drives, featuring the EPC2014C enhancement mode
(eGaN®) field effect transistor (FET). The purpose of this development board is to simplify the
evaluation process of the EPC2014C eGaN FET by including all the critical components on a
single board that can be easily connected into any existing converter.
The EPC9005C development board is 2” x 1.5” and contains two EPC2014C eGaN FET in a half
bridge configuration using Texas Instruments LM5113 gate driver, supply and bypass capacitors.
The board contains all critical components and layout for optimal switching performance.
There are also various probe points to facilitate simple waveform measurement and efficiency
calculation. A complete block diagram of the circuit is given in Figure 1.
For more information on the EPC2014Cs eGaN FET please refer to the datasheet available from
EPC at www.epc-co.com. The datasheet should be read in conjunction with this quick start guide.
Table 1: Performance Summary (TA = 25°C)
SYMBOL
PARAMETER
VDD
Gate Drive Input Supply Range
VIN
CONDITIONS
MIN
MAX
UNITS
7
12
V
Bus Input Voltage Range
24*
V
VOUT
Switch Node Output Voltage
40
V
IOUT
Switch Node Output Current
7*
A
VPWM
PWM Logic Input Voltage
Threshold
Input ‘High’
Input ‘Low’
3.5
0
6
1.5
V
V
Minimum ‘High’ State Input Pulse
Width
VPWM rise and fall time < 10ns
30
ns
Minimum ‘Low’ State Input Pulse
Width
VPWM rise and fall time < 10ns
100#
ns
* Assumes inductive load, maximum current depends on die temperature – actual maximum current with be subject to switching
frequency, bus voltage and thermals.
# Limited by time needed to ‘refresh’ high side bootstrap supply voltage.
For More Information:
Please contact info@epc-co.com
or your local sales representative
Visit our website:
www.epc-co.com
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bit.ly/EPCupdates
or text “EPC” to 22828
EPC Products are distributed
through Digi-Key.
www.digikey.com
Development Board / Demonstration Board Notification
The EPC9005C board is intended for product evaluation purposes only and is not intended for commercial use. As an evaluation tool, it is not designed for compliance with the European Union directive on electromagnetic
compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient
Power Conversion Corporation (EPC) makes no guarantee that the purchased board is 100% RoHS compliant. No Licenses are implied or granted under any patent right or other intellectual property whatsoever. EPC assumes no
liability for applications assistance, customer product design, software performance, or infringement of patents or any other intellectual property rights of any kind.
EPC reserves the right at any time, without notice, to change said circuitry and specifications.
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015
QUICK START GUIDE
EPC9005C
QUICK START PROCEDURE
Development board EPC9005C is easy to set up to evaluate the
performance of the EPC2014C eGaN FET. Refer to Figure 2 for proper
connect and measurement setup and follow the procedure below:
1. With power off, connect the input power supply bus to +VIN (J5, J6)
and ground / return to –VIN (J7, J8).
2. With power off, connect the switch node of the half bridge OUT
(J3, J4) to your circuit as required.
3. With power off, connect the gate drive input to +VDD (J1, Pin-1)
and ground return to –VDD (J1, Pin-2).
4. With power off, connect the input PWM control signal to PWM (J2,
Pin-1) and ground return to any of the remaining J2 pins.
5. Turn on the gate drive supply – make sure the supply is between 7
V and 12 V range.
VDD
PWM
Input
Gate Drive
Regulator
Logic and
Dead-time
Adjust
6. Turn on the bus voltage to the required value (do not exceed the
absolute maximum voltage of 40 V on VOUT).
7. Turn on the controller / PWM input source and probe switching
node to see switching operation.
8. Once operational, adjust the bus voltage and load PWM control
within the operating range and observe the output switching
behavior, efficiency and other parameters.
9. For shutdown, please follow steps in reverse.
NOTE. When measuring the high frequency content switch node (OUT), care must
be taken to avoid long ground leads. Measure the switch node (OUT) by placing the
oscilloscope probe tip through the large via on the switch node (designed for this
purpose) and grounding the probe directly across the GND terminals provided. See
Figure 3 for proper scope probe technique.
Gate Drive
Supply
Half-Bridge with Bypass
VIN
LM5113
Gate
Driver
OUT
Figure 1: Block Diagram of EPC9005C Development Board
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015 |
| PAGE 2
QUICK START GUIDE
EPC9005C
QUICK START PROCEDURE
7 V – 12 V
5C,
–
40
VDD Supply
+
Gate Drive Supply
(Note Polarity)
A
IIN
+
Switch Node
VIN V
+
< 24 V
VIN Supply
–
–
(For Efficiency
Measurement)
External Circuit
PWM Input
EPC
EFFICIENT POWER CONVERSION
Figure 2: Proper Connection and Measurement Setup
5C,
40
Do not use probe ground lead
Do not let probe tip touch
back of low-side die!
Ground probe
against TP3
EPC
EFFICIENT POWER CONVERSION
Minimize loop
Place probe in large via at OUT
Figure 3: Proper Measurement of Switch Node – OUT
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015 |
| PAGE 3
QUICK START GUIDE
EPC9005C
Figure 4: Typical Waveforms for VIN = 24 V to 1.2 V/7 A (1000kHz) Buck converter
CH1: VPWM Input voltage – CH2: (IOUT) Switch node current – CH4: (VOUT) Switch node voltage
THERMAL PERFORMANCE
The EPC9005C development board showcases the EPC2014C eGaN
FET. Although the electrical performance surpasses that for traditional
silicon devices, their relatively smaller size does magnify the thermal
management requirements. The EPC9005C is intended for bench
evaluation with low ambient temperature and convection cooling.
Table 2: Bill of Materials
Item
Qty
The addition of heat-sinking and forced air cooling can significantly
increase the current rating of these devices, but care must be taken
to not exceed the absolute maximum die temperature of 125°C.
NOTE. The EPC9005C development board does not have any current or
thermal protection on board.
Reference
Part Description
Manufacturer / Part #
1
4
C4, C10, C11, C13
Capacitor, 1uF, 10%, 25V, X5R
Murata, GRM188R61E105KA12D
2
2
C6, C7
Capacitor, 100pF, 5%, 50V, NP0
TDK, C1608C0G1H101J
3
1
C12
Capacitor, 0.1uF, 10%, 25V, X5R
TDK, C1608X5R1E104K
4
2
C16, C17
Capacitor, 4.7uF, 20%, 50V, X5R
Taiyo Yuden, UMK325BJ475M
5
2
D1, D2
Schottky Diode, 30V
Diodes Inc., SDM03U40-7
6
3
J1, J2, J9, TP3 (See Note 1)
Connector
FCI, 68001-236HLF
7
1
J3, J4, J5, J6, J7, J8
Connector
FCI, 68602-224HLF
8
2
Q1, Q2
eGaN® FET
EPC, EPC2014C
9
1
R1
Resistor, 10.0K, 5%, 1/8W
Stackpole, RMCF0603FT10K0
10
2
R2, R15
Resistor, 0 Ohm, 1/10W
Panasonic, ERJ-3GEY0R00V
11
1
R4
Resistor, 22 Ohm, 1%, 1/8W
Stackpole, RMCF0603FT22R0
12
1
R5
Resistor, 33 Ohm, 1%, 1/8W
Stackpole, RMCF0603FT33R0
13
2
R11, R12
1 Ohm, 1%, 1/8W
Stackpole, RMCF0402TFT1R00
14
2
TP1, TP2
Test Point
Keystone Elect, 5015
15
1
U1
I.C., Logic
Fairchild, NC7SZ00L6X
16
1
U2
I.C., Gate driver
Texas Instruments, LM5113
17
1
U3
I.C., Regulator
Microchip, MCP1703T-5002E/MC
18
1
U4
I.C., Logic
19
0
R13, R14
Optional Resistor
20
0
C15, C19
Optional Capacitor
21
0
D5, D6
Optional Diode
22
0
P1, P2
Optional Potentiometer
400 LFM
Fairchild, NC7SZ08L6X
Note 1: 36 pin header to be cut as follows J1: cut 2 pins used, J2 & J9: cut 4 pins used, TP3: cut 1 pin used
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| PAGE 4
QUICK START GUIDE
EPC9005C
1
2
4
3
5
6
7 - 12 Vdc
A
U3
J1
1
2
CON2
8
C10
7
1uF, 25V
6
OUT
NC
NC
NC
NC
NC
GND
VCC
1
C11
2
3
C4
4
1uF, 25V
1uF, 25V
9
5
IN
GND
A
TP2
Keystone 5015
1
5
GND
Y 4
0.1uF,
25V
4
3
2
1
HB
VDD
HOH
C15
33
C17
4.7uF,
50V
4.7uF, 50V
Opt.
R12
Q2
1 Ohm
EPC2014C
R13
Opt.
C19
Optional
TP3
1
(Optional)
CON1
J7
CON4
C
1
2
3
4
C7
D6
C16
Opt.
100p
SDM03U40
R5
Optional
Opt.
D5
C6
D2
R15
Zero
SW OUT
J4
CON4
LOH
22
U2
LM5113
GND
LOL
C13
SDM03U40
R4
2
J3
CON4
1uF, 25V
D1
Y
NC7SZ08L6X
P2
Optional
2
VSS
P1
Optional
1
2
3
4
VDD
GND
R14
B
U4
B
PWM2
J6
CON4
EPC2014C
C12
HS
R2
Zero
Q1
R11 1 Ohm
HOL
3
A
C
1
2
3
4
24V Max
5
B
NC7SZ00L6X
CON2
1
VCC
6
J5
CON4
4
3
2
1
2
VDD
LI
R1
10k
U1
A
HI
B
J2
1
2
CON2
J9
1
2
PWM1
MCP1703
100p
1
4
3
2
1
GND
TP1
Keystone 5015
J8
CON4
D
D
40V Half-Bridge with Gate Drive, using EPC2014C
Rev 2.0
1
2
3
4
5
6
Figure 5: Development Board Schematic
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2015 |
| PAGE 5