Figure 4: Typical Waveforms for VIN = 48 V to 5 V/7 A (1000kHz) Buck converter
CH1: VPWM Input voltage – CH2: (IOUT) Switch node current – CH4: (VOUT) Switch node voltage
NOTE. The EPC9010 development board does not have any current or thermal protection on board.
Figure 3: Proper Measurement of Switch Node – OUT
Minimize loop
EFFICIENT POWER CONVERSION
EPC
The EPC9010 development board showcases the EPC2016 eGaN FET. Although the electrical performance surpasses that for traditional silicon
devices, their relatively smaller size does magnify the thermal management requirements. The EPC9010 is intended for bench evaluation with low
ambient temperature and convection cooling. The addition of heat-sinking and forced air cooling can significantly increase the current rating of
these devices, but care must be taken to not exceed the absolute maximum die temperature of 125°C.
Place probe in large via at OUT
Ground probe
against TP3
THERMAL CONSIDERATIONS
NOTE. When measuring the high frequency content switch node (OUT), care must be taken to avoid long ground leads. Measure the switch node (OUT) by placing the
oscilloscope probe tip through the large via on the switch node (designed for this purpose) and grounding the probe directly across the GND terminals provided. See
Figure 3 for proper scope probe technique.
Figure 2: Proper Connection and Measurement Setup
EFFICIENT POWER CONVERSION
Figure 1: Block Diagram of EPC9010 Development Board
PWM Input
–
(For Efficiency
Measurement)
VDD
Logic and
Dead-time
Adjust
LM5113
Gate
Driver
Gate Drive Gate Drive Supply
Regulator
–
VIN V
OUT
VIN
Half-Bridge with Bypass
Switch Node
+
IIN
VIN Supply
+
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