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EPC9016

EPC9016

  • 厂商:

    EPC(宜普)

  • 封装:

    -

  • 描述:

    EPC2015 eGaN® Series Power Management, Half H-Bridge Driver (External FET) Evaluation Board

  • 数据手册
  • 价格&库存
EPC9016 数据手册
Figure 4: Typical Waveforms for VIN = 24 V to 1.2 V/25 A (1000kHz) Buck converter CH2: Switch node voltage (VSW) – CH4: PWM input voltage (VPWM) NOTE. The EPC9016 development board does not have any current or thermal protection on board. Figure 3: Proper Measurement of Switch Node – VSW Minimize loop EFFICIENT POWER CONVERSION EPC The EPC9016 development board showcases the EPC2015 eGaN FET. Although the electrical performance surpasses that for traditional silicon devices, their relatively smaller size does magnify the thermal management requirements. The EPC9016 is intended for bench evaluation with low ambient temperature and convection cooling. The addition of heat-sinking and forced air cooling can significantly increase the current rating of these devices, but care must be taken to not exceed the absolute maximum die temperature of 125°C. Place probe in large via at OUT Ground probe against TP3 THERMAL CONSIDERATIONS NOTE. When measuring the high frequency content switch node (OUT), care must be taken to avoid long ground leads. Measure the switch node (OUT) by placing the oscilloscope probe tip through the large via on the switch node (designed for this purpose) and grounding the probe directly across the GND terminals provided. See Figure 3 for proper scope probe technique. Rev. 1.0 Figure 2: Proper Connection and Measurement Setup EFFICIENT POWER CONVERSION PWM Input Figure 1: Block Diagram of EPC9016 Development Board – (For Efficiency Measurement) PWM Input VDD Gate Drive Regulator Switch Node + IIN OUT VIN Gate Drive Supply – VIN V LM5113 Gate Driver Half-Bridge with Bypass – 7 V – 12 V + < 28 V A + Gate Drive Supply (Note Polarity) VDD Supply VIN Supply eGaN® FET © EPC 2013 Rev. 1.0 EPC90016, 40 V DEVELOPMENT BOARD Bhasy Nair Global FAE Support Office: +1.972.805.8585 Mobile: +1.469.879.2424 bhasy.nair@epc-co.com Logic and Dead-time Adjust External Circuit Stephen Tsang Sales, Asia Mobile: +852.9408.8351 stephen.tsang@epc-co.com Please contact info@epc-co.com or your local sales representative Development Board EPC9016 Quick Start Guide Visit our website: www.epc-co.com 40 V Half-Bridge with Gate Drive, Using EPC2015 For More Information: Sign-up to receive EPC updates at bit.ly/EPCupdates or text “EPC” to 22828 Peter Cheng FAE Support, Asia Mobile: +886.938.009.706 peter.cheng@epc-co.com EPC Products are distributed through Digi-Key. www.digikey.com Development Board / Demonstration Board Notification The EPC9016 board is intended for product evaluation purposes only and is not intended for commercial use. As an evaluation tool, it is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corporation (EPC) makes no guarantee that the purchased board is 100% RoHS compliant. No Licenses are implied or granted under any patent right or other intellectual property whatsoever. EPC assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or any other intellectual property rights of any kind. EPC reserves the right at any time, without notice, to change said circuitry and specifications. Quick Start Procedure EPC Renee Yawger WW Marketing Office: +1.908.475.5702 Mobile: +1.908.619.9678 renee.yawger@epc-co.com Development board EPC9016 is easy to set up to evaluate the performance of the EPC2015 eGaN FET. Refer to Figure 2 for proper connect and measurement setup and follow the procedure below: 1. With power off, connect the input power supply bus to +VIN (J5, J6) and ground / return to –VIN (J7, J8). 2. With power off, connect the switch node of the half bridge OUT (J3, J4) to your circuit as required. 3. With power off, connect the gate drive input to +VDD (J1, Pin-1) and ground return to –VDD (J1, Pin-2). 4. With power off, connect the input PWM control signal to PWM (J2, Pin-1) and ground return to any of the remaining J2 pins. 5. Turn on the gate drive supply – make sure the supply is between 7 V and 12 V range. 6. Turn on the bus voltage to the required value (do not exceed the absolute maximum voltage of 40 V on VOUT). 7. Turn on the controller / PWM input source and probe switching node to see switching operation. 8. Once operational, adjust the bus voltage and load PWM control within the operating range and observe the output switching behavior, efficiency and other parameters. 9. For shutdown, please follow steps in reverse. Do not use probe ground lead eGaN® FET © EPC 2013 EPC90016, 40 V DEVELOPMENT BOARD Contact us: DESCRIPTION www.epc-co.com The EPC9016 development board features the 40 V EPC2015 enhancement mode (eGaN ®) field effect transistor (FET) operating up to a 25 A maximum output current in a half bridge configuration with onboard gate drives. The purpose of this development board is to simplify the evaluation process of the EPC2015 eGaN FET by including all the critical components on a single board that can be easily connected into any existing converter. device and two parallel bottom devices and is recommended for high step-down ratio buck applications. The board contains all critical components and the printed circuit board (PCB) layout is designed for optimal switching performance. There are also various probe points to facilitate simple waveform measurement and evaluate eGaN FET efficiency. A complete block diagram of the circuit is given in Figure 1. The EPC9016 development board is 2” x 1.5” and features three EPC2015 eGaN FETs in a half bridge configuration using the Texas Instruments LM5113 gate driver. The design features a single top For more information on the EPC2015s eGaN FET please refer to the datasheet available from EPC at www.epc-co.com. The datasheet should be read in conjunction with this quick start guide. Table 1: Performance Summary (TA = 25°C) SYMBOL PARAMETER VDD Gate Drive Input Supply Range CONDITIONS MIN 7 MAX 12 UNITS V 28* V VIN Bus Input Voltage Range VOUT Switch Node Output Voltage 40 V IOUT Switch Node Output Current 25* A VPWM PWM Logic Input Voltage Threshold 3.5 6 V 1.5 Input ‘High’ Input ‘Low’ 0 Minimum ‘High’ State Input Pulse Width VPWM rise and fall time < 10ns 60 ns Minimum ‘Low’ State Input Pulse Width VPWM rise and fall time < 10ns 200# ns * Assumes inductive load, maximum current depends on die temperature – actual maximum current with be subject to switching frequency, bus voltage and thermals. # Limited by time needed to ‘refresh’ high side bootstrap supply voltage. V Figure 4: Typical Waveforms for VIN = 24 V to 1.2 V/25 A (1000kHz) Buck converter CH2: Switch node voltage (VSW) – CH4: PWM input voltage (VPWM) NOTE. The EPC9016 development board does not have any current or thermal protection on board. Figure 3: Proper Measurement of Switch Node – VSW Minimize loop EFFICIENT POWER CONVERSION EPC The EPC9016 development board showcases the EPC2015 eGaN FET. Although the electrical performance surpasses that for traditional silicon devices, their relatively smaller size does magnify the thermal management requirements. The EPC9016 is intended for bench evaluation with low ambient temperature and convection cooling. The addition of heat-sinking and forced air cooling can significantly increase the current rating of these devices, but care must be taken to not exceed the absolute maximum die temperature of 125°C. Place probe in large via at OUT Ground probe against TP3 THERMAL CONSIDERATIONS NOTE. When measuring the high frequency content switch node (OUT), care must be taken to avoid long ground leads. Measure the switch node (OUT) by placing the oscilloscope probe tip through the large via on the switch node (designed for this purpose) and grounding the probe directly across the GND terminals provided. See Figure 3 for proper scope probe technique. Rev. 1.0 Figure 2: Proper Connection and Measurement Setup EFFICIENT POWER CONVERSION PWM Input Figure 1: Block Diagram of EPC9016 Development Board – (For Efficiency Measurement) PWM Input VDD Gate Drive Regulator Switch Node + IIN OUT VIN Gate Drive Supply – VIN V LM5113 Gate Driver Half-Bridge with Bypass – 7 V – 12 V + < 28 V A + Gate Drive Supply (Note Polarity) VDD Supply VIN Supply eGaN® FET © EPC 2013 Rev. 1.0 EPC90016, 40 V DEVELOPMENT BOARD Bhasy Nair Global FAE Support Office: +1.972.805.8585 Mobile: +1.469.879.2424 bhasy.nair@epc-co.com Logic and Dead-time Adjust External Circuit Stephen Tsang Sales, Asia Mobile: +852.9408.8351 stephen.tsang@epc-co.com Please contact info@epc-co.com or your local sales representative Development Board EPC9016 Quick Start Guide Visit our website: www.epc-co.com 40 V Half-Bridge with Gate Drive, Using EPC2015 For More Information: Sign-up to receive EPC updates at bit.ly/EPCupdates or text “EPC” to 22828 Peter Cheng FAE Support, Asia Mobile: +886.938.009.706 peter.cheng@epc-co.com EPC Products are distributed through Digi-Key. www.digikey.com Development Board / Demonstration Board Notification The EPC9016 board is intended for product evaluation purposes only and is not intended for commercial use. As an evaluation tool, it is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corporation (EPC) makes no guarantee that the purchased board is 100% RoHS compliant. No Licenses are implied or granted under any patent right or other intellectual property whatsoever. EPC assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or any other intellectual property rights of any kind. EPC reserves the right at any time, without notice, to change said circuitry and specifications. Quick Start Procedure EPC Renee Yawger WW Marketing Office: +1.908.475.5702 Mobile: +1.908.619.9678 renee.yawger@epc-co.com Development board EPC9016 is easy to set up to evaluate the performance of the EPC2015 eGaN FET. Refer to Figure 2 for proper connect and measurement setup and follow the procedure below: 1. With power off, connect the input power supply bus to +VIN (J5, J6) and ground / return to –VIN (J7, J8). 2. With power off, connect the switch node of the half bridge OUT (J3, J4) to your circuit as required. 3. With power off, connect the gate drive input to +VDD (J1, Pin-1) and ground return to –VDD (J1, Pin-2). 4. With power off, connect the input PWM control signal to PWM (J2, Pin-1) and ground return to any of the remaining J2 pins. 5. Turn on the gate drive supply – make sure the supply is between 7 V and 12 V range. 6. Turn on the bus voltage to the required value (do not exceed the absolute maximum voltage of 40 V on VOUT). 7. Turn on the controller / PWM input source and probe switching node to see switching operation. 8. Once operational, adjust the bus voltage and load PWM control within the operating range and observe the output switching behavior, efficiency and other parameters. 9. For shutdown, please follow steps in reverse. Do not use probe ground lead eGaN® FET © EPC 2013 EPC90016, 40 V DEVELOPMENT BOARD Contact us: DESCRIPTION www.epc-co.com The EPC9016 development board features the 40 V EPC2015 enhancement mode (eGaN ®) field effect transistor (FET) operating up to a 25 A maximum output current in a half bridge configuration with onboard gate drives. The purpose of this development board is to simplify the evaluation process of the EPC2015 eGaN FET by including all the critical components on a single board that can be easily connected into any existing converter. device and two parallel bottom devices and is recommended for high step-down ratio buck applications. The board contains all critical components and the printed circuit board (PCB) layout is designed for optimal switching performance. There are also various probe points to facilitate simple waveform measurement and evaluate eGaN FET efficiency. A complete block diagram of the circuit is given in Figure 1. The EPC9016 development board is 2” x 1.5” and features three EPC2015 eGaN FETs in a half bridge configuration using the Texas Instruments LM5113 gate driver. The design features a single top For more information on the EPC2015s eGaN FET please refer to the datasheet available from EPC at www.epc-co.com. The datasheet should be read in conjunction with this quick start guide. Table 1: Performance Summary (TA = 25°C) SYMBOL PARAMETER VDD Gate Drive Input Supply Range CONDITIONS MIN 7 MAX 12 UNITS V 28* V VIN Bus Input Voltage Range VOUT Switch Node Output Voltage 40 V IOUT Switch Node Output Current 25* A VPWM PWM Logic Input Voltage Threshold 3.5 6 V 1.5 Input ‘High’ Input ‘Low’ 0 Minimum ‘High’ State Input Pulse Width VPWM rise and fall time < 10ns 60 ns Minimum ‘Low’ State Input Pulse Width VPWM rise and fall time < 10ns 200# ns * Assumes inductive load, maximum current depends on die temperature – actual maximum current with be subject to switching frequency, bus voltage and thermals. # Limited by time needed to ‘refresh’ high side bootstrap supply voltage. V NOTE. The EPC9016 development board does not have any current or thermal protection on board. Figure 4: Typical Waveforms for VIN = 24 V to 1.2 V/25 A (1000kHz) Buck converter CH2: Switch node voltage (VSW) – CH4: PWM input voltage (VPWM) Figure 3: Proper Measurement of Switch Node – VSW EFFICIENT POWER CONVERSION EPC The EPC9016 development board showcases the EPC2015 eGaN FET. Although the electrical performance surpasses that for traditional silicon devices, their relatively smaller size does magnify the thermal management requirements. The EPC9016 is intended for bench evaluation with low ambient temperature and convection cooling. The addition of heat-sinking and forced air cooling can significantly increase the current rating of these devices, but care must be taken to not exceed the absolute maximum die temperature of 125°C. Minimize loop Place probe in large via at OUT Ground probe against TP3 THERMAL CONSIDERATIONS NOTE. When measuring the high frequency content switch node (OUT), care must be taken to avoid long ground leads. Measure the switch node (OUT) by placing the oscilloscope probe tip through the large via on the switch node (designed for this purpose) and grounding the probe directly across the GND terminals provided. See Figure 3 for proper scope probe technique. Do not use probe ground lead eGaN® FET © EPC 2013 Rev. 1.0 EPC90016, 40 V DEVELOPMENT BOARD Figure 2: Proper Connection and Measurement Setup EFFICIENT POWER CONVERSION EPC PWM Input Figure 1: Block Diagram of EPC9016 Development Board – (For Efficiency Measurement) External Circuit – VIN V Switch Node + IIN OUT VIN Supply + < 28 V A + Gate Drive Supply (Note Polarity) – eGaN® FET © EPC 2013 Rev. 1.0 EPC90016, 40 V DEVELOPMENT BOARD Contact us: Renee Yawger WW Marketing Office: +1.908.475.5702 Mobile: +1.908.619.9678 renee.yawger@epc-co.com LM5113 Gate Driver VIN VDD Supply Half-Bridge with Bypass 7 V – 12 V Stephen Tsang Sales, Asia Mobile: +852.9408.8351 stephen.tsang@epc-co.com Logic and Dead-time Adjust Gate Drive Regulator Gate Drive Supply Bhasy Nair Global FAE Support Office: +1.972.805.8585 Mobile: +1.469.879.2424 bhasy.nair@epc-co.com PWM Input VDD Development Board EPC9016 Quick Start Guide For More Information: Please contact info@epc-co.com or your local sales representative Visit our website: www.epc-co.com 40 V Half-Bridge with Gate Drive, Using EPC2015 Sign-up to receive EPC updates at bit.ly/EPCupdates or text “EPC” to 22828 Peter Cheng FAE Support, Asia Mobile: +886.938.009.706 peter.cheng@epc-co.com Development board EPC9016 is easy to set up to evaluate the performance of the EPC2015 eGaN FET. Refer to Figure 2 for proper connect and measurement setup and follow the procedure below: 1. With power off, connect the input power supply bus to +VIN (J5, J6) and ground / return to –VIN (J7, J8). 2. With power off, connect the switch node of the half bridge OUT (J3, J4) to your circuit as required. 3. With power off, connect the gate drive input to +VDD (J1, Pin-1) and ground return to –VDD (J1, Pin-2). 4. With power off, connect the input PWM control signal to PWM (J2, Pin-1) and ground return to any of the remaining J2 pins. 5. Turn on the gate drive supply – make sure the supply is between 7 V and 12 V range. 6. Turn on the bus voltage to the required value (do not exceed the absolute maximum voltage of 40 V on VOUT). 7. Turn on the controller / PWM input source and probe switching node to see switching operation. 8. Once operational, adjust the bus voltage and load PWM control within the operating range and observe the output switching behavior, efficiency and other parameters. 9. For shutdown, please follow steps in reverse. Quick Start Procedure DESCRIPTION www.epc-co.com For more information on the EPC2015s eGaN FET please refer to the datasheet available from EPC at www.epc-co.com. The datasheet should be read in conjunction with this quick start guide. The EPC9016 development board is 2” x 1.5” and features three EPC2015 eGaN FETs in a half bridge configuration using the Texas Instruments LM5113 gate driver. The design features a single top device and two parallel bottom devices and is recommended for high step-down ratio buck applications. The board contains all critical components and the printed circuit board (PCB) layout is designed for optimal switching performance. There are also various probe points to facilitate simple waveform measurement and evaluate eGaN FET efficiency. A complete block diagram of the circuit is given in Figure 1. The EPC9016 development board features the 40 V EPC2015 enhancement mode (eGaN ®) field effect transistor (FET) operating up to a 25 A maximum output current in a half bridge configuration with onboard gate drives. The purpose of this development board is to simplify the evaluation process of the EPC2015 eGaN FET by including all the critical components on a single board that can be easily connected into any existing converter. Table 1: Performance Summary (TA = 25°C) SYMBOL PARAMETER V Gate Drive Input Supply Range CONDITIONS DD EPC Products are distributed through Digi-Key. www.digikey.com Switch Node Output Current OUT Switch Node Output Voltage VOUT Bus Input Voltage Range VIN I VPWM Development Board / Demonstration Board Notification The EPC9016 board is intended for product evaluation purposes only and is not intended for commercial use. As an evaluation tool, it is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corporation (EPC) makes no guarantee that the purchased board is 100% RoHS compliant. No Licenses are implied or granted under any patent right or other intellectual property whatsoever. EPC assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or any other intellectual property rights of any kind. PWM Logic Input Voltage Threshold Minimum ‘High’ State Input Pulse Width Minimum ‘Low’ State Input Pulse Width MIN 7 MAX 12 28* 40 25* 0 Input ‘Low’ 3.5 Input ‘High’ V PWM rise and fall time < 10ns VPWM rise and fall time < 10ns 6 1.5 60 UNITS V V V A V V ns 200# ns * Assumes inductive load, maximum current depends on die temperature – actual maximum current with be subject to switching frequency, bus voltage and thermals. # Limited by time needed to ‘refresh’ high side bootstrap supply voltage. EPC reserves the right at any time, without notice, to change said circuitry and specifications. NOTE. The EPC9016 development board does not have any current or thermal protection on board. Figure 4: Typical Waveforms for VIN = 24 V to 1.2 V/25 A (1000kHz) Buck converter CH2: Switch node voltage (VSW) – CH4: PWM input voltage (VPWM) Figure 3: Proper Measurement of Switch Node – VSW EFFICIENT POWER CONVERSION EPC The EPC9016 development board showcases the EPC2015 eGaN FET. Although the electrical performance surpasses that for traditional silicon devices, their relatively smaller size does magnify the thermal management requirements. The EPC9016 is intended for bench evaluation with low ambient temperature and convection cooling. The addition of heat-sinking and forced air cooling can significantly increase the current rating of these devices, but care must be taken to not exceed the absolute maximum die temperature of 125°C. Minimize loop Place probe in large via at OUT Ground probe against TP3 THERMAL CONSIDERATIONS NOTE. When measuring the high frequency content switch node (OUT), care must be taken to avoid long ground leads. Measure the switch node (OUT) by placing the oscilloscope probe tip through the large via on the switch node (designed for this purpose) and grounding the probe directly across the GND terminals provided. See Figure 3 for proper scope probe technique. Do not use probe ground lead eGaN® FET © EPC 2013 Rev. 1.0 EPC90016, 40 V DEVELOPMENT BOARD Figure 2: Proper Connection and Measurement Setup EFFICIENT POWER CONVERSION EPC PWM Input Figure 1: Block Diagram of EPC9016 Development Board – (For Efficiency Measurement) PWM Input VDD Logic and Dead-time Adjust Gate Drive Regulator LM5113 Gate Driver External Circuit – VIN V Switch Node + IIN OUT VIN Gate Drive Supply – VIN Supply + < 28 V A + Gate Drive Supply (Note Polarity) VDD Supply Half-Bridge with Bypass 7 V – 12 V eGaN® FET © EPC 2013 Rev. 1.0 EPC90016, 40 V DEVELOPMENT BOARD Development Board EPC9016 Quick Start Guide For More Information: 40 V Half-Bridge with Gate Drive, Using EPC2015 Please contact info@epc-co.com or your local sales representative Visit our website: www.epc-co.com Sign-up to receive EPC updates at bit.ly/EPCupdates or text “EPC” to 22828 Development board EPC9016 is easy to set up to evaluate the performance of the EPC2015 eGaN FET. Refer to Figure 2 for proper connect and measurement setup and follow the procedure below: 1. With power off, connect the input power supply bus to +VIN (J5, J6) and ground / return to –VIN (J7, J8). 2. With power off, connect the switch node of the half bridge OUT (J3, J4) to your circuit as required. 3. With power off, connect the gate drive input to +VDD (J1, Pin-1) and ground return to –VDD (J1, Pin-2). 4. With power off, connect the input PWM control signal to PWM (J2, Pin-1) and ground return to any of the remaining J2 pins. 5. Turn on the gate drive supply – make sure the supply is between 7 V and 12 V range. 6. Turn on the bus voltage to the required value (do not exceed the absolute maximum voltage of 40 V on VOUT). 7. Turn on the controller / PWM input source and probe switching node to see switching operation. 8. Once operational, adjust the bus voltage and load PWM control within the operating range and observe the output switching behavior, efficiency and other parameters. 9. For shutdown, please follow steps in reverse. Quick Start Procedure DESCRIPTION www.epc-co.com For more information on the EPC2015s eGaN FET please refer to the datasheet available from EPC at www.epc-co.com. The datasheet should be read in conjunction with this quick start guide. The EPC9016 development board is 2” x 1.5” and features three EPC2015 eGaN FETs in a half bridge configuration using the Texas Instruments LM5113 gate driver. The design features a single top device and two parallel bottom devices and is recommended for high step-down ratio buck applications. The board contains all critical components and the printed circuit board (PCB) layout is designed for optimal switching performance. There are also various probe points to facilitate simple waveform measurement and evaluate eGaN FET efficiency. A complete block diagram of the circuit is given in Figure 1. The EPC9016 development board features the 40 V EPC2015 enhancement mode (eGaN ®) field effect transistor (FET) operating up to a 25 A maximum output current in a half bridge configuration with onboard gate drives. The purpose of this development board is to simplify the evaluation process of the EPC2015 eGaN FET by including all the critical components on a single board that can be easily connected into any existing converter. Table 1: Performance Summary (TA = 25°C) SYMBOL PARAMETER V Gate Drive Input Supply Range CONDITIONS DD EPC Products are distributed through Digi-Key. www.digikey.com Switch Node Output Current OUT Switch Node Output Voltage VOUT Bus Input Voltage Range VIN I VPWM Development Board / Demonstration Board Notification The EPC9016 board is intended for product evaluation purposes only and is not intended for commercial use. As an evaluation tool, it is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corporation (EPC) makes no guarantee that the purchased board is 100% RoHS compliant. No Licenses are implied or granted under any patent right or other intellectual property whatsoever. EPC assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or any other intellectual property rights of any kind. PWM Logic Input Voltage Threshold Minimum ‘High’ State Input Pulse Width Minimum ‘Low’ State Input Pulse Width MIN 7 MAX 12 28* 40 25* 0 Input ‘Low’ 3.5 Input ‘High’ V PWM rise and fall time < 10ns VPWM rise and fall time < 10ns 6 1.5 60 UNITS V V V A V V ns 200# ns * Assumes inductive load, maximum current depends on die temperature – actual maximum current with be subject to switching frequency, bus voltage and thermals. # Limited by time needed to ‘refresh’ high side bootstrap supply voltage. EPC reserves the right at any time, without notice, to change said circuitry and specifications. Table 2 : Bill of Material Item Qty Reference Part Description Manufacturer / Part # 1 3 C4, C10, C11, Capacitor, 1uF, 10%, 25V, X5R Murata, GRM188R61E105KA12D 2 2 C16, C17 Capacitor, 100pF, 5%, 50V, NP0 Kemet, C0402C101K5GACTU 3 2 C9, C19 Capacitor, 0.1uF, 10%, 25V, X5R TDK, C1005X5R1E104K 4 3 C21, C22, C23 Capacitor, 4.7uF, 10%, 50V, X5R TDK, C2012X5R1H475K125AB 5 2 D1, D2 Schottky Diode, 30V Diodes Inc., SDM03U40-7 6 3 J1, J2, J9 Connector 2pins of Tyco, 4-103185-0 7 1 J3, J4, J5, J6, J7, J8 Connector FCI, 68602-224HLF 8 3 Q1, Q2, Q3 eGaN® FET EPC, EPC2015 9 1 R1 Resistor, 10.0K, 5%, 1/8W Stackpole, RMCF0603FT10K0 10 2 R2, R15 Resistor, 0 Ohm, 1/8W Stackpole, RMCF0603ZT0R00 11 1 R4 Resistor, 22 Ohm, 1%, 1/8W Stackpole, RMCF0603FT22R0 12 1 R5 Resistor, 47 Ohm, 1%, 1/8W Stackpole, RMCF0603FT47R0 13 6 R19, R20, R21, R22, R23, R24 Resistor, 0 Ohm, 1/16W Stackpole, RMCF0402ZT0R00 14 2 TP1, TP2 Test Point Keystone Elect, 5015 15 1 TP3 Connector 1/40th of Tyco, 4-103185-0 16 1 U1 I.C., Logic Fairchild, NC7SZ00L6X 17 1 U2 I.C., Gate driver Texas Instruments, LM5113TME 18 1 U3 I.C., Regulator Microchip, MCP1703T-5002E/MC 19 1 U4 I.C., Logic Fairchild, NC7SZ08L6X 20 0 R14 Optional Resistor 21 0 D3 Optional Diode 22 0 P1, P2 Optional Potentiometer 1 2 4 3 5 6 7 - 12 Vdc J1 A 1 2 CON2 C10 1uF, 25V 8 U3 IN 7 NC MCP1703 OUT 1 NC 2 6 NC NC 3 NC GND 4 C11 1uF, 25V C4 1uF, 25V 9 GND 5 A VCC J6 CON4 Y NC7SZ00L6X R2 Zero U4 A VDD P1 Optional B Y GND P2 Optional J3 CON4 SW OUT 0.1uF, 25V C9 U2 SDM03U40 R4 22.0 2 D2 C 2 D1 NC7SZ08L6X PWM2 B 4 3 2 1 Q1 EPC2015 GND CON2 1 2 3 4 28V Max B R1 10k R14 SDM03U40 R5 Optional 47.0 R19 Zero R22 Zero J4 CON4 C16 100pF 0.1uF, 25V C19 LM5113TM R21 Zero R24 Zero (Optional) C CON1 Q3 EPC2015 Zero R23 C17 100pF R15 Zero TP3 1 Q2 EPC2015 Zero R20 C21 C22 C23 4.7uF, 50V D3 Optional J7 CON4 1 2 3 4 B CON2 J9 1 2 VCC VDD 1 2 3 4 U1 A 1 2 4 3 2 1 J2 J5 CON4 1 PWM1 TP2 Keystone 5015 TP1 Keystone 5015 4 3 2 1 1 GND J8 CON4 D D 40V Half-Bridge with Gate Drive, using EPC2015 Rev 1.0 1 2 3 4 5 6 Table 2 : Bill of Material Item Qty Reference Part Description Manufacturer / Part # 1 3 C4, C10, C11, Capacitor, 1uF, 10%, 25V, X5R Murata, GRM188R61E105KA12D 2 2 C16, C17 Capacitor, 100pF, 5%, 50V, NP0 Kemet, C0402C101K5GACTU 3 2 C9, C19 Capacitor, 0.1uF, 10%, 25V, X5R TDK, C1005X5R1E104K 4 3 C21, C22, C23 Capacitor, 4.7uF, 10%, 50V, X5R TDK, C2012X5R1H475K125AB 5 2 D1, D2 Schottky Diode, 30V Diodes Inc., SDM03U40-7 6 3 J1, J2, J9 Connector 2pins of Tyco, 4-103185-0 7 1 J3, J4, J5, J6, J7, J8 Connector FCI, 68602-224HLF 8 3 Q1, Q2, Q3 eGaN® FET EPC, EPC2015 9 1 R1 Resistor, 10.0K, 5%, 1/8W Stackpole, RMCF0603FT10K0 10 2 R2, R15 Resistor, 0 Ohm, 1/8W Stackpole, RMCF0603ZT0R00 11 1 R4 Resistor, 22 Ohm, 1%, 1/8W Stackpole, RMCF0603FT22R0 12 1 R5 Resistor, 47 Ohm, 1%, 1/8W Stackpole, RMCF0603FT47R0 13 6 R19, R20, R21, R22, R23, R24 Resistor, 0 Ohm, 1/16W Stackpole, RMCF0402ZT0R00 14 2 TP1, TP2 Test Point Keystone Elect, 5015 15 1 TP3 Connector 1/40th of Tyco, 4-103185-0 16 1 U1 I.C., Logic Fairchild, NC7SZ00L6X 17 1 U2 I.C., Gate driver Texas Instruments, LM5113TME 18 1 U3 I.C., Regulator Microchip, MCP1703T-5002E/MC 19 1 U4 I.C., Logic Fairchild, NC7SZ08L6X 20 0 R14 Optional Resistor 21 0 D3 Optional Diode 22 0 P1, P2 Optional Potentiometer 1 2 4 3 5 6 7 - 12 Vdc J1 A 1 2 CON2 C10 1uF, 25V 8 U3 IN 7 NC MCP1703 OUT 1 NC 2 6 NC NC 3 NC GND 4 C11 1uF, 25V C4 1uF, 25V 9 GND 5 A VCC J6 CON4 Y NC7SZ00L6X R2 Zero U4 A VDD P1 Optional B Y GND P2 Optional J3 CON4 SW OUT 0.1uF, 25V C9 U2 SDM03U40 R4 22.0 2 D2 C 2 D1 NC7SZ08L6X PWM2 B 4 3 2 1 Q1 EPC2015 GND CON2 1 2 3 4 28V Max B R1 10k R14 SDM03U40 R5 Optional 47.0 R19 Zero R22 Zero J4 CON4 C16 100pF 0.1uF, 25V C19 LM5113TM R21 Zero R24 Zero (Optional) C CON1 Q3 EPC2015 Zero R23 C17 100pF R15 Zero TP3 1 Q2 EPC2015 Zero R20 C21 C22 C23 4.7uF, 50V D3 Optional J7 CON4 1 2 3 4 B CON2 J9 1 2 VCC VDD 1 2 3 4 U1 A 1 2 4 3 2 1 J2 J5 CON4 1 PWM1 TP2 Keystone 5015 TP1 Keystone 5015 4 3 2 1 1 GND J8 CON4 D D 40V Half-Bridge with Gate Drive, using EPC2015 Rev 1.0 1 2 3 4 5 6 Figure 4: Typical Waveforms for VIN = 24 V to 1.2 V/25 A (1000kHz) Buck converter CH2: Switch node voltage (VSW) – CH4: PWM input voltage (VPWM) NOTE. The EPC9016 development board does not have any current or thermal protection on board. Figure 3: Proper Measurement of Switch Node – VSW Minimize loop EFFICIENT POWER CONVERSION EPC The EPC9016 development board showcases the EPC2015 eGaN FET. Although the electrical performance surpasses that for traditional silicon devices, their relatively smaller size does magnify the thermal management requirements. The EPC9016 is intended for bench evaluation with low ambient temperature and convection cooling. The addition of heat-sinking and forced air cooling can significantly increase the current rating of these devices, but care must be taken to not exceed the absolute maximum die temperature of 125°C. Place probe in large via at OUT Ground probe against TP3 THERMAL CONSIDERATIONS NOTE. When measuring the high frequency content switch node (OUT), care must be taken to avoid long ground leads. Measure the switch node (OUT) by placing the oscilloscope probe tip through the large via on the switch node (designed for this purpose) and grounding the probe directly across the GND terminals provided. See Figure 3 for proper scope probe technique. Development board EPC9016 is easy to set up to evaluate the performance of the EPC2015 eGaN FET. Refer to Figure 2 for proper connect and measurement setup and follow the procedure below: 1. With power off, connect the input power supply bus to +VIN (J5, J6) and ground / return to –VIN (J7, J8). 2. With power off, connect the switch node of the half bridge OUT (J3, J4) to your circuit as required. 3. With power off, connect the gate drive input to +VDD (J1, Pin-1) and ground return to –VDD (J1, Pin-2). 4. With power off, connect the input PWM control signal to PWM (J2, Pin-1) and ground return to any of the remaining J2 pins. 5. Turn on the gate drive supply – make sure the supply is between 7 V and 12 V range. 6. Turn on the bus voltage to the required value (do not exceed the absolute maximum voltage of 40 V on VOUT). 7. Turn on the controller / PWM input source and probe switching node to see switching operation. 8. Once operational, adjust the bus voltage and load PWM control within the operating range and observe the output switching behavior, efficiency and other parameters. 9. For shutdown, please follow steps in reverse. Rev. 1.0 Figure 2: Proper Connection and Measurement Setup EFFICIENT POWER CONVERSION PWM Input EPC Figure 1: Block Diagram of EPC9016 Development Board – (For Efficiency Measurement) PWM Input VDD Quick Start Procedure Do not use probe ground lead eGaN® FET © EPC 2013 EPC90016, 40 V DEVELOPMENT BOARD Logic and Dead-time Adjust Gate Drive Regulator – VIN V LM5113 Gate Driver Switch Node + IIN OUT VIN Gate Drive Supply External Circuit Half-Bridge with Bypass – 7 V – 12 V + < 28 V A + Gate Drive Supply (Note Polarity) VDD Supply VIN Supply eGaN® FET © EPC 2013 Rev. 1.0 EPC90016, 40 V DEVELOPMENT BOARD Development Board EPC9016 Quick Start Guide For More Information: Please contact info@epc-co.com or your local sales representative Visit our website: www.epc-co.com Sign-up to receive EPC updates at bit.ly/EPCupdates or text “EPC” to 22828 40 V Half-Bridge with Gate Drive, Using EPC2015 DESCRIPTION The EPC9016 development board features the 40 V EPC2015 enhancement mode (eGaN ®) field effect transistor (FET) operating up to a 25 A maximum output current in a half bridge configuration with onboard gate drives. The purpose of this development board is to simplify the evaluation process of the EPC2015 eGaN FET by including all the critical components on a single board that can be easily connected into any existing converter. device and two parallel bottom devices and is recommended for high step-down ratio buck applications. The board contains all critical components and the printed circuit board (PCB) layout is designed for optimal switching performance. There are also various probe points to facilitate simple waveform measurement and evaluate eGaN FET efficiency. A complete block diagram of the circuit is given in Figure 1. The EPC9016 development board is 2” x 1.5” and features three EPC2015 eGaN FETs in a half bridge configuration using the Texas Instruments LM5113 gate driver. The design features a single top For more information on the EPC2015s eGaN FET please refer to the datasheet available from EPC at www.epc-co.com. The datasheet should be read in conjunction with this quick start guide. Table 1: Performance Summary (TA = 25°C) SYMBOL PARAMETER VDD Gate Drive Input Supply Range EPC Products are distributed through Digi-Key. www.digikey.com Development Board / Demonstration Board Notification The EPC9016 board is intended for product evaluation purposes only and is not intended for commercial use. As an evaluation tool, it is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corporation (EPC) makes no guarantee that the purchased board is 100% RoHS compliant. No Licenses are implied or granted under any patent right or other intellectual property whatsoever. EPC assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or any other intellectual property rights of any kind. EPC reserves the right at any time, without notice, to change said circuitry and specifications. www.epc-co.com CONDITIONS MIN 7 MAX 12 UNITS V 28* V VIN Bus Input Voltage Range VOUT Switch Node Output Voltage 40 V IOUT Switch Node Output Current 25* A VPWM PWM Logic Input Voltage Threshold 3.5 6 V 1.5 Input ‘High’ Input ‘Low’ 0 Minimum ‘High’ State Input Pulse Width VPWM rise and fall time < 10ns 60 ns Minimum ‘Low’ State Input Pulse Width VPWM rise and fall time < 10ns 200# ns * Assumes inductive load, maximum current depends on die temperature – actual maximum current with be subject to switching frequency, bus voltage and thermals. # Limited by time needed to ‘refresh’ high side bootstrap supply voltage. V
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