Development Board
EPC9063
Quick Start Guide
EPC2107
100 V Half Bridge with Sync FET Bootstrap Gate Drive
Revision 1.0
QUICK START GUIDE
Development Board EPC9063
DESCRIPTION
The EPC9063 development board is a 100 V maximum device voltage,
1.5 A maximum output current, half bridge with onboard gate drives,
featuring the EPC2107 enhancement mode (eGaN®) half bridge. The
gate driver has been configured with a synchronous FET bootstrap
circuit included in the EPC2107 device that eliminates high side device
losses induced by the reverse recovery losses of the internal bootstrap
diode of the gate driver. The purpose of this development board is to
simplify the evaluation process of the EPC2107 eGaN half bridge by
including all the critical components on a single board that can be easily
connected into any existing converter. The inclusion of the synchronous
FET bootstrap circuit enables significant increase in operating frequency
capability of the half bridge circuit.
Table 1: Performance Summary (TA = 25°C) EPC9063
Symbol
Parameter
VDD
Gate Drive Input Supply Range
12
V
VIN
Bus Input Voltage Range
80*
V
VOUT
Switch Node Output Voltage
100
V
IOUT
Switch Node Output Current
1.5*
A
VPWM
PWM Logic Input Voltage
Threshold
Minimum ‘High’ State Input
Pulse Width
Minimum ‘Low’ State Input
Pulse Width
6
1.5
V
V
ns
ns
5. With power off, connect the input PWM control signal to PWM
(J70, Pin-1) and ground return to either Pin-2 or Pin-4 of J70.
6. Turn on the gate drive supply – make sure the supply is within the
7.5 V and 12 V range.
7. Turn on the controller / PWM input source.
8. Turn on the bus voltage to the required value (do not exceed the
absolute maximum voltage of 80 V on VOUT) and probe switching
node to observe switching operation.
Development board EPC9063 is easy to set up to evaluate the performance
of the EPC2107 eGaN half bridge. Refer to figure 2 for proper connect and
measurement setup and follow the procedure below:
9. Once operational, adjust the bus voltage and load PWM control
within the operating range and observe the output switching
behavior, efficiency and other parameters.
1. Configure the board for either ZVS class D (LZVS and J2) operation OR
Buck converter (Lbuck) operation.
10. For shutdown, please follow steps in reverse.
NOTE. When measuring the high frequency content switch node, care must be taken to
avoid long ground leads. Measure the switch node by placing the oscilloscope probe tip
through the large via on the switch node (designed for this purpose) and grounding the
probe directly across the GND terminal provided. See figure 3 for proper scope probe
technique.
2. With power off, connect the input power supply bus to +VIN (J1)
and ground / return to –VIN (J4).
3. For ZVS class D operation, with power off, connect a HF load to the HF
output (RF-J2 OR Vsw-J3 and GND-J4). For Buck converter operation, with
power off, connect a DC load to the DC output (+VOUT-J5 and GND-J4).
5V
Q1C
Gate Drive
Regulator
VIN
RDamp
HF
Output
Logic and
Dead-time
Adjust
DENH*
LZVS
Q1A
Level Shift
CDECP
DC
Output
LBuck
COUT
D4V7
Q1B
GND
2 |
Input ‘High’
3.5
Input ‘Low’
0
VPWM rise and
fall time < 10ns 40
VPWM rise and
fall time < 10ns 160#
Units
4. With power off, connect the gate drive input to +VDD (J90, Pin-1) and
ground return to –VDD (J90, Pin-2).
QUICK START PROCEDURE
EPC9063 development board photo
7.5
Max
# Limited by time needed to ‘refresh’ high side bootstrap supply voltage.
For more information on the EPC2107 eGaN half bridge please refer to
the datasheet available from EPC at www.epc-co.com. The datasheet
should be read in conjunction with this quick start guide.
PWM
Min
*Assumes inductive load, maximum current depends on die temperature – actual maximum current
with be subject to switching frequency, bus voltage and thermals.
The EPC9063 development board is 2” x 1.5” and has one EPC2107 eGaN
device in a half bridge configuration using Texas Instruments LM5113
gate driver with supply and bypass capacitors. The board contains all
critical components and layout for optimal switching performance.
There are also various probe points to facilitate simple waveform
measurement and efficiency calculation. The board includes pads for
the inclusion of customer components to facilitate testing in a Buck
converter or ZVS Class D amplifier configurations. A complete block
diagram of the circuit is given in figure 1.
VDD
Conditions
RBleed
RON
CENH
DOFF
CBypass
CZVS
PGND
Turn-on delay
Turn-off immediate
Figure 1: Block diagram of EPC9063 development board
| EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016
QUICK START GUIDE
Development Board EPC9063
7.5 - 12 VDC
>
Main voltage
measurement
+
Switch-node
oscilloscope probe
VIN supply
(note polarity)
Ground post
High frequency
connection
Dead-time
setting
(if installed)
+
80 VDCmax
VMain supply
(note polarity)
SMA (optional)
DC output
Control
signal
inputs
V
DC output
measurement
Figure 2: Proper connection and measurement setup
Do not use probe
ground lead
Ground probe
against post
Place probe tip
in large via
Minimize loop
Figure 3: Proper measurement of the switch nodes
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 |
| 3
QUICK START GUIDE
Development Board EPC9063
MEASUREMENT CONSIDERATIONS
The EPC9063 development board has been provided with specially
designed high frequency (up to 1 GHz minimum) capable measurement
connections using MMCX connectors located at J11 & J12 with direct
access to the gate signals of both the upper and lower FETs. These
nodes can be measured directly using the Tektronix IsoVu probe
shown in figure 4. Figure 5 shows typical gate waveforms measured
using the IsoVu probe.
Please contact EPC for special instructions on using these connections.
To prevent an unterminated transmission line hanging on the gate it is
recommended to remove resistors R1 & R2 when not using this feature.
The maximum impedance loading of these nodes is 2.5 kΩ.
Tektronix is a leading manufacturer of power test solutions for design
validation, characterization, and performance testing. EPC partnered
with Tektronix to define the requirements for accurate measurements
on GaN devices which led to the development of the Tektronix IsoVu
measurement system. IsoVu is a galvanically isolated differential
measurement system with 1 GHz bandwidth, 1 Million to 1 (120 dB)
common mode rejection ratio, 50 V differential, and 2000 V common
mode voltage range. Previously impossible differential measurements
such as the high-side VGS are now possible because of IsoVu’s high
common mode rejection across bandwidth.
IsoVu allows you to:
• Characterize the time alignment of high side and low side events
• Optimize and tune switching characteristics such as edge rates,
overshoot, ringing and dead time
• See the interactions due to parasitic coupling between the high and
low side transistors
Figure 4: Tektronix IsoVu measurement setup.
• Make isolated high frequency current measurements using low
impedance sense resistors
This native connection between the high and low side gate-source
nodes to an IsoVu probe tip cable has less than 2 pF common mode
loading and completely eliminates ground loops due to its galvanic
isolation. These MMCX connectors offer a shielded coaxial environment
to the test point which minimizes noise pickup.
• Improve reliability through accurate characterization across all
operating conditions
EPC would like to acknowledge Tektronix (http://www.tek.com/
isolated-measurement-systems) for their support of this project.
VSW
VSW
GHS
GLS
GLS
GHS
Figure 5: Upper gate and lower gate measurements using the Tektronix IsoVu and
switch-node voltage measurement using the TPP1000 probe.
4 |
| EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016
QUICK START GUIDE
Development Board EPC9063
THERMAL CONSIDERATIONS
The EPC9063 development board showcases the EPC2107 eGaN half
bridge with integrated synchronous bootstrap. Although the electrical
performance surpasses that for traditional silicon devices, their relatively
smaller size does magnify the thermal management requirements.
The EPC9063 is intended for bench evaluation with low ambient
temperature and convection cooling. The addition of heat-sinking and
forced air cooling can significantly increase the current rating of these
devices, but care must be taken to not exceed the absolute maximum
die temperature of 150°C. A heatsink kit can be used with this board and
the assembly is shown in figure 6. Contact EPC for more information on
the heatsink kit.
NOTE. The EPC9063 development board does not have any current or thermal protection
on board.
2–56 x 1/2 inch
nylon screw
Heat sink shim
Heat-sink Shim
(Copper shown)
Heat sink
(15 mm x 15 mm x 14.5 mm)
Thermal interface material
for device 15 mm x 15 mm.
adhesive on both sides
of thermal pad
Cross-section
plane
OPTIONAL interface frame
heat sink rests on frame
(thickness = die thickness)
Mounting holes
center line
EPC die
2–56 nylon
hex nut
Figure 6: Assembly of the heatsink kit
Table 2: EPC9063 Board
Item
Qty
Reference
Part Description
Manufacturer
Part Number
1
3
C1, C2, C3
10 nF, 100 V
TDK
C1005X7S2A103K050BB
2
3
C4, C5, C6
1 µF 100 V
TDK
C2012X7S2A105K125AB
3
1
C7
1 µF 100 V
TDK
C2012X7S2A105K125AB
4
1
C40
4.7 µF, 10 V
Samsung
CL05A475MP5NRNC
5
3
C41, C44, C46
100 nF, 25 V
TDK
C1005X7R1E104K050BB
6
2
C42, C43
22 pF, 50 V
Kemet
C0402C220J5GACTU
7
1
C45
22 nF, 25 V
TDK
C1005X7R1E223K050BB
8
2
C71, C72
100 nF, 25 V
TDK
C1608X7R1E104K
9
3
C95, C96, C97
1 µF, 25 V
TDK
C1608X7R1E105K
10
1
D40
40 V 300 mA
ST
BAT54KFILM
11
1
D41
5 V1, 150 mW
Bournes
CD0603-Z5V1
12
2
D44, D45
40 V 30 mA
Diodes Inc.
SDM03U40-7
13
2
D74, D75
40 V 30 mA
Diodes Inc.
SDM03U40
14
1
GP1
.1" Male Vert. 1 pos
Würth
61300111121
15
4
J1, J3, J4, J5
2x2 .1" Male Vert.
TE Connectivity
5-146256-2
16
1
J70
.1" Male Vert. 4 pos
Tyco
4-103185-0-04
17
1
J90
.1" Male Vert. 2 pos
Würth
61300211121
18
1
Q1
100 V 240 mΩ with SB
EPC
EPC2107
19
2
R1, R2
0Ω
Stackpole
RMCF0402ZT0R00
20
1
R44
4 Ω7
Panasonic
ERJ-2GEJ4R7X
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 |
| 5
QUICK START GUIDE
Development Board EPC9063
Table 2: EPC9063 Board cont.
Item
Qty
Reference
Part Description
Manufacturer
Part Number
21
1
R45
20 Ω
Stackpole
RMCF0402JT20R0
22
1
R46
27 k
Panasonic
ERJ-2GEJ273X
23
1
R70
10 k
Yageo
RC0603JR-0710KL
24
1
R74
430 Ω
Panasonic
ERJ-2RKF4300X
25
1
R75
180 Ω
Panasonic
ERJ-2RKF1800X
26
4
TP1, TP2, TP3, TP4
SMD probe loop
Keystone
5015
27
1
U40
100 V eGaN driver
Texas Instruments
LM5113TM
28
1
U71
2 In AND
Fairchild
NC7SZ08L6X
29
1
U72
2 In NAND
Fairchild
NC7SZ00L6X
30
1
U95
5.0 V 250 mA DFN
Microchip
MCP1703T-5002E/MC
Reference
Part Description
Part Description
Part Number
Optional Components
Item
Qty
1
1
J2
SMA Board Edge
Linx
CONREVSMA013.062
2
2
J11, J12
MMCX SMD
Molex
0734152063
3
1
Lbuck
example 10 μH, 3.5 A
Wϋrth
744314101
4
1
Lzvs
example 500 nH
CoilCraft
2929SQ-501JEB
5
2
P74, P75
1k
Murata
PV37W102C01B00
6
2
R71, R72
0Ω
Panasonic
ERJ-3GEY0R00V
7
1
R73
10 k
Yageo
RC0603JR-0710KL
Heatsink Kit
6 |
Item
Qty
Part Description
Manufacturer
Part Number
1
2
Screw Mach Phil 2-56 x 1/2 Nylon
B&F Fastener Supply
NY PMS 256 0050 PH
2
1
Heatsink mounting shim
Custom - Request from EPC
PCBshim
3
1
Heat-sink 15mm x 15mm x 14.5mm
Advanced Thermal Sol
ATS-54150K-C2-R0
4
1
Thermal interface pad with adhesive
Wakefield
173-7-1212A
5
2
Nylon washer
Keystone Electronics
3347
6
2
Washer Flat #2 Stainless Steel
B&F Fastener Supply
FWSS 002
7
2
Washer internal tooth #2 Stainless Steel
B&F Fastener Supply
INT LWSS 002
8
2
Hex Nut 3/16" 2-56 Stainless Steel
B&F Fastener Supply
HNSS256
8
2
Hex Nut 3/16" Nylon 2-56
B&F Fastner
NY HN 256
| EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016
U95
MCP 1703T-5002E/MC
5.0V 250mA DFN
V7in
1
2
V7in
IN
C95
1µF, 25V
.1" Male Vert.
G ND
J90
QUICK START GUIDE
Q1B
EP C2107
100V 220mE with SB
5V
OUT
C96
1µF, 25V
C97
1µF, 25V
5V
1
R44
2
5VHS1
4E7
C44
100nF, 25V
D41
CD0603- Z5V1
C41
100nF, 25V
Gbtst
Logic Supply Regulator
GRret1
D44
SDM03U40- 7
Synchronous Boostrap Power Supply
Vm ain
Vm ain
1
4.7V
2
C71
100nF, 25V
C42
22pF, 50V
PWM2
1
PWM1
A
U72
NC7SZ00L 6X
2
Deadtime Left
P75
R1
0E
EMP TY
4.7V
GL H1
GL H1
L _Sig
C43
22pF, 50V
180E
1
PWM2
R75
GL H1
GRret1
H_Sig
5V
5VHS1
5V
DNP 1k
C72
100nF, 25V
Gate Driver
Q1A
EP C2107
100V 220m E
with SB
GRH1
PH1
ProbeHole
C4
1µF 100V
TP 3
L _Sig
J1
1
2
3
4
2x2 .1" Male Vert.
Main Supply Input
Vm ain
C5
1µF 100V
Output
1
SMD probe loop
L zvs
DNP 500nH
J5
ZVS Tank Circuit
GRret1
5V
1
2
3
4
Output
L buck
DNP
2x2 .1" Male Vert.
C6
1µF 100V
R2
0E
EMP TY
C7
1µF 100V
Buck Output
J3
J12
MMCX SMD
EMP TY
1
2
3
4
TP 4
1
2x2 .1" Male Vert.
SMD probe loop
HS1
DNP
SW Output
TP 2
D75
SDM03U40
PWM2
GRret1
GL H1
C40
4.7µF, 10V
B
R73
DNP
D40
BAT54K FIL M
C3
10nF, 100V
Vm ain
J11
MMCX SMD
EMP TY
Vm ain
GRH1
GRH1
1 R71
2
DNP 0E
PWM1
C2
10nF, 100V
1
U40
L M5113TM
DNP 1k
PWM1
D45
SDM03U40- 7
R45
20E
1
5V
H_Sig
D74
SDM03U40
J70
.1" Male Vert.
1
2
3
4
P74
C1
10nF, 100V
Vm ain
1
SMD probe loop
2
1
R70
10k
430E
Deadtime Right
Y
B
TP 1
R46
27k
1
A
C45
22nF, 25V
Vm ain
1
PWM1
C46
100nF, 25V
2
2
U71
NC7SZ08L 6X
PWM1
R74
Vm ain
2
1
2
5V
2
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 |
Logic Supply
7.5VDC - 12VDC
1
HF
J2
SMA Board Edge
SMD probe loop
1 R72
2
DNP 0E
GP 1
1
.1" Male Vert.
Ground Post
HF Output
J4
2x2 .1" Male Vert.
GND
Figure 7: EPC9063 Schematic
Development Board EPC9063
1
2
3
4
| 7
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Demonstration Board Warning and Disclaimer
The EPC9063 board is intended for product evaluation purposes only and is not intended for commercial use. Replace components on the Evaluation Board only with those parts shown on the parts
list (or Bill of Materials) in the Quick Start Guide. Contact an authorized EPC representative with any questions.
This board is intended to be used by certified professionals, in a lab environment, following proper safety procedures. Use at your own risk.
As an evaluation tool, this board is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are
at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corporation (EPC) makes
no guarantee that the purchased board is 100% RoHS compliant.
The Evaluation board (or kit) is for demonstration purposes only and neither the Board nor this Quick Start Guide constitute a sales contract or create any kind of warranty, whether express or implied,
as to the applications or products involved.
Disclaimer: EPC reserves the right at any time, without notice, to make changes to any products described herein to improve reliability, function, or design. EPC does not assume any liability arising
out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, or other intellectual property whatsoever, nor the rights of others.
