B32559S8223

Film Capacitors Metallized Polyester Film Capacitors (MKT) Series/Type: Date: B32559S May 2009 © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Metallized polyester film capacitors (MKT) xDSL applications, compliant with ITU-T K.45/K.20 B32559S Typical applications Enhanced types for xDSL applications, suitable for test conditions according to ITU-T K.45 and ITU-T K.20. Climatic Max. operating temperature: 125 °C Climatic category (IEC 60068-1): 55/125/56 Construction Dielectric: polyethylene terephthalate (polyester, PET) Stacked-film technology Heat shrinkable tube special xDSL types B32559S*9xx: polyolefin 300 µm ±100 µm, 125 °C Features Very small dimensions Self-healing properties High pulse strength Terminals Lead spacing 5.0 mm Crimped wire leads, lead-free tinned, lead length (6 1) mm Straight wire leads, lead-free tinned, lead length (6 1) mm Special lead length available on request Marking Manufacturer's logo, rated capacitance (coded), capacitance tolerance (code letter), rated AC voltage, date of manufacture (coded) Delivery mode Bulk (untaped) Taped (Ammo pack or reel) For notes on taping, refer to chapter "Taping and packing". Detail specifications Homologated to IEC 60384-2 Dimensional drawing Dimensions in mm Lead spacing ±0.4 5.0 Lead diameter d1 0.5 Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 18 B32559S xDSL applications, compliant with ITU-T K.45/K.20 Overview of available types Lead spacing 5.0 mm Type B32559S Lead straight / crimped configuration Page VR (V DC) VRMS (V AC) CR (µF) 0.0056 0.0082 0.010 0.012 0.015 0.018 0.022 0.027 4 630 400 Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 18 B32559S xDSL applications, compliant with ITU-T K.45/K.20 Ordering codes and packing units VR VRMS CR f ≤60 Hz V DC V AC µF 630 400 0.0056 0.0082 0.010 0.012 0.015 0.018 0.022 0.027 Max. dimensions w×h×l mm 4.0 × 8.5 × 7.0 4.0 × 9.0 × 7.0 4.5 × 10.0 × 7.0 4.5 × 10.0 × 7.0 4.5 × 10.0 × 7.0 5.0 × 10.0 × 7.0 5.5 × 13.0 × 7.0 6.0 × 13.5 × 7.0 Ordering code (composition see below) B32559S8562+*** B32559S8822+*** B32559S8103+*** B32559S8123+*** B32559S8153+*** B32559S8183+*** B32559S8223+*** B32559S8273+*** Ammo pack pcs./MOQ 1600 2000 1800 1800 1800 1700 1600 1600 Reel pcs./MOQ 1600 1600 1500 1500 1500 1400 1400 1400 Untaped pcs./MOQ 1200 1600 1400 1400 1400 1300 1200 1200 MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request. B32559S8...+9xx complies with ITU-T K.45 and ITU-T K.20. Composition of ordering code + = Capacitance tolerance code: M = ±20% K = ±10% J = ±5% *** = Packaging code: 900 = Untaped crimped (lead length 6 1 mm) 902 = Untaped straight (lead length 6 1 mm) 904 = Ammo pack crimped 907 = Ammo pack straight 908 = Reel pack crimped 910 = Reel pack straight Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 18 B32559S xDSL applications, compliant with ITU-T K.45/K.20 Technical data Max. operating temperature Top,max +125 °C Upper category temperature Tmax +125 °C Lower category temperature Tmin 55 °C Rated temperature TR +85 °C Dissipation factor tan δ (in 10-3) at CR ≤ 0.1 µF at 20 °C 1 kHz 8 (upper limit values) 10 kHz 15 100 kHz 30 VR CR ≤ 0.33 µF Insulation resistance Rins or time constant τ = CR Rins ≥ 250 V DC 7500 MΩ at 20 °C, rel. humidity ≤ 65% (minimum as-delivered values) DC test voltage 1500 V DC, 2 s TA (°C) DC voltage derating AC voltage derating Category voltage VC (continuous operation with VDC TA ≤ 85 VC = VR VC,RMS = VRMS or VAC at f ≤ 60 Hz) 85 2 upper limit value Insulation resistance Rins < 150 MΩ (CR ≤ 0.33 µF) or time constant τ = CR Rins < 50 s (CR > 0.33 µF) Soldering conditions Maximum solder bath temperature 260 °C Maximum soldering time 4s Operating temperature range Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 18 B32559S xDSL applications, compliant with ITU-T K.45/K.20 Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/µs. "k0" represents the maximum permissible pulse characteristic of the waveform applied to the capacitor, expressed in V2/µs. Note: The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the capacitor. dV/dt and k0 values VR (V DC) 63 100 250 400 630 VRMS (V AC) 40 63 160 200 400 dV/dt in V/µs 250 300 400 600 800 k0 in V2/µs 30 000 60 000 200 000 500 000 1 000 000 Impedance Z versus frequency f (typical values) Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 18 B32559S xDSL applications, compliant with ITU-T K.45/K.20 Permissible AC voltage VRMS versus frequency f (for sinusoidal waveforms, TA ≤55 °C) For TA >55 °C, please refer to "General technical information", section 3.2.3. Lead spacing 5 mm 630 V DC/400 V AC Permissible AC current IRMS versus frequency f Lead spacing 5 mm 630 V DC/400 V AC Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 18 B32559S xDSL applications, compliant with ITU-T K.45/K.20 Mounting guidelines 1 1.1 Soldering Solderability of leads The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. Solder bath temperature Soldering time Immersion depth Evaluation criteria: Visual inspection 1.2 235 ±5 °C 2.0 ±0.5 s 2.0 +0/ 0.5 mm from capacitor body or seating plane Wetting of wire surface by new solder ≥90%, free-flowing solder Resistance to soldering heat Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A. Conditions: Series Solder bath temperature Soldering time 10 ±1 s MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C coated uncoated (lead spacing > 10 mm) MFP MKP (lead spacing > 7.5 mm) MKT boxed (case 2.5 × 6.5 × 7.2 mm) MKP (lead spacing ≤ 7.5 mm) MKT uncoated (lead spacing ≤ 10 mm) insulated (B32559) 5 ±1 s