Multilayer Ceramic Capacitors
Series/Type:
B37931
The following products presented in this data sheet are being withdrawn.
Ordering Code
B37931K9224K060
B37931K9224K070
B37931K0224K060
Substitute Product
Date of Withdrawal
2008-08-01
2008-08-01
2008-08-01
Deadline Last
Orders
2009-07-31
2009-07-31
2009-07-31
Last Shipments
2009-10-31
2009-10-31
2009-10-31
Ordering Code
B37931K0224K070
B37931K5104K060
B37931K5104K070
B37941K9224K060
B37941K9224K070
B37941K9334K060
B37941K9334K070
B37941K9474K060
B37941K9474K070
B37941K9105K062
B37941K9105K072
B37941K0224K060
B37941K0224K070
B37941K0334K060
B37941K0334K070
B37941K0474K060
B37941K0474K070
B37941K0105K062
B37941K0105K072
B37941K5224K060
B37941K5224K070
B37941K5334K062
B37941K5334K072
B37941K5474K062
B37941K5474K072
B37941K5105K062
B37941K5105K072
B37872K9105K062
B37872K9105K072
B37872K9225K062
B37872K9225K072
B37872K0105K062
B37872K0105K072
B37872K0225K062
B37872K0225K072
B37872K5105K062
B37872K5105K072
Substitute Product
Date of Withdrawal
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
Deadline Last
Orders
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
Last Shipments
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
For further information please contact your nearest EPCOS sales office, which will also support you in selecting a
suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales.
Multilayer ceramic capacitors
Chip
HighCV; X7R
Ordering code system
B37941
K
5
105
K
0
62
Packaging
60
62
70
72
^
^
^
^
cardboard tape, 180-mm reel
blister tape, 180-mm reel
cardboard tape, 360-mm reel
blister tape, 360-mm reel
Internal coding
Capacitance tolerance
K ^ ±10% (standard)
Capacitance, coded
(example)
Rated voltage
Termination
474 ^ 47 · 104 pF = 470 nF
105 ^ 10 · 105 pF = 1 mF
Rated voltage [VDC]
Code
Standard:
16
9
Temperature characteristic
X7R
0603 / 1608
0805 / 2012
1206 / 3216
B37931
B37941
B37872
Please read Cautions and warnings and
Important notes at the end of this document.
50
5
K ^ nickel barrier for all case sizes
Type and size
Chip size
(inch / mm)
25
0
2
10/06
Chip
Multilayer ceramic capacitors
HighCV; X7R
Features
■
■
■
■
■
Characteristic of class 2 dielectric
Highest possible capacitance to rated voltage ratio
High capacitance values up to 2.2 mF
Voltage rating from 16 V to 50 V
To AEC-Q200
Applications
■ Coupling and bypass filters
Termination
■ For soldering: Nickel barrier terminations (Ni)
Options
■ Other capacitance values on request
Delivery mode
■ Cardboard and blister tape (blister tape for chip thickness ³1.2 ± 0.1 mm)
Electrical data
Temperature characteristic
Max. relative capacitance change
within –55 °C to +125 °C
Climatic category (IEC 60068-1)
Standard
Dielectric
Rated voltage1)
Test voltage
Capacitance range
Dissipation factor (limit value)
X7R
DC/C
VR
Vtest
CR
tan d
Insulation resistance 2) at +25 °C
Time constant 2) at +25 °C
Operating temperature range
Ageing 3)
Rins
t
Top
1) Note: No operation on AC line.
2) For CR >10 nF the time constant t = C · Rins is given.
3) Refer to chapter “General technical information”, “Ageing”.
Please read Cautions and warnings and
Important notes at the end of this document.
3
10/06
±15
55/125/56
EIA
Class 2
16; 25; 50
2.5 · VR/5 s
100 nF … 2.2 mF
500
–55 … +125
yes
%
VDC
VDC
MW
s
°C
High
CV
Multilayer ceramic capacitors
HighCV; X7R
Capacitance tolerances
Code letter
K
(standard)
Tolerance
±10%
Dimensional drawing
s
b
k
k
KKE0329-N
Dimensions (mm)
Case size
(inch) 0603
(mm) 1608
0805
2012
1206
3216
l
1.6 ± 0.15
2.00 ± 0.20 3.2 ± 0.20
b
0.8 ± 0.10
1.25 ± 0.15 1.6 ± 0.15
s
0.8 ± 0.10
1.35 max.
k
0.1 –0.4
0.13 –0.75 0.25 –0.75
1.80 max.
Tolerances to CECC 32101-801
Please read Cautions and warnings and
Important notes at the end of this document.
4
10/06
Multilayer ceramic capacitors
High
CV
HighCV; X7R
Recommended solder pad
C
A
D
KKE0308-1
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
Type
A
C
D
0603/1608
single chip
0.6 … 0.7
1.8 … 2.20
0.6 … 0.8
0805/2012
single chip
0.6 … 0.7
2.2 … 2.60
0.8 … 1.1
1206/3216
single chip
0.8 … 0.9
3.8 … 4.32
1.0 … 1.4
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
Type
A
C
D
0603/1608
single chip
0.8 … 0.9
2.2 … 2.8
0.6 … 0.8
0805/2012
single chip
0.9 … 1.0
2.8 … 3.2
0.8 … 1.1
1206/3216
single chip
1.0 … 1.1
4.2 … 4.8
1.0 … 1.4
Termination
Termination
(nickel barrier)
Ceramic body
Inner electrode
Ni
Substrate electrode
Intermediate electrode
External electrode
Cu
Ni
Sn
KKE0342-F
Please read Cautions and warnings and
Important notes at the end of this document.
5
10/06
High
CV
Multilayer ceramic capacitors
HighCV; X7R
Product range for HighCV chip capacitors, X7R
Size1)
inch
mm
Type
VR (VDC)
CR
100
nF
220
nF
330
nF
470
nF
16
0603
1608
0805
2012
1206
3216
B37931
B37941
B37872
25
50
16
25
1.0 mF
2.2 mF
1) l ´ b (inch) / l ´ b (mm)
Please read Cautions and warnings and
Important notes at the end of this document.
6
10/06
50
16
25
50
Multilayer ceramic capacitors
High
CV
HighCV; X7R; 0603 to 1206
Ordering codes and packing for HighCV, X7R, 16, 25 and 50 VDC,
nickel barrier terminations
mm
Cardboard tape,
Æ 180-mm reel
** ^ 60
pcs/reel
Cardboard tape,
Æ 360-mm reel
** ^ 70
pcs/reel
0.8 ± 0.1
4000
16000
0.8 ± 0.1
4000
16000
0.8 ± 0.1
4000
16000
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
1.2 ± 0.1
4000
4000
4000
3000 2)
16000
16000
16000
12000 3)
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
1.2 ± 0.1
4000
4000
4000
3000 2)
16000
16000
16000
12000 3)
0.8 ± 0.1
1.2 ± 0.1
1.2 ± 0.1
1.2 ± 0.1
4000
3000 2)
3000 2)
3000 2)
16000
12000 3)
12000 3)
12000 3)
1.2 ± 0.1
1.2 ± 0.1
3000 2)
3000 2)
12000 3)
12000 3)
1.2 ± 0.1
1.2 ± 0.1
3000 2)
3000 2)
12000 3)
12000 3)
1.2 ± 0.1
3000 2)
12000 3)
Chip thickness
CR1)
Ordering code
Case size 0603, 16 VDC
220. nF
B37931K9224K0**
Case size 0603, 25 VDC
220. nF
B37931K0224K0**
Case size 0603, 50 VDC
100. nF
B37931K5104K0**
Case size 0805, 16 VDC
220. nF
330. nF
470. nF
1.0 mF
B37941K9224K0**
B37941K9334K0**
B37941K9474K0**
B37941K9105K0**
Case size 0805, 25 VDC
220. nF
330. nF
470. nF
1.0 mF
B37941K0224K0**
B37941K0334K0**
B37941K0474K0**
B37941K0105K0**
Case size 0805, 50 VDC
220. nF
330. nF
470. nF
1.0 mF
B37941K5224K0**
B37941K5334K0**
B37941K5474K0**
B37941K5105K0**
Case size 1206, 16 VDC
1.0 mF
2.2 mF
B37872K9105K0**
B37872K9225K0**
Case size 1206, 25 VDC
1.0 mF
2.2 mF
B37872K0105K0**
B37872K0225K0**
Case size 1206, 50 VDC
1.0 mF
B37872K5105K0**
1) Other capacitance values on request.
2) Blister tape, 180-mm reel, ordering code ** ^ 62
3) Blister tape, 330-mm reel, ordering code ** ^ 72
Please read Cautions and warnings and
Important notes at the end of this document.
7
10/06
Multilayer ceramic capacitors
High
CV
HighCV; X7R
Typical characteristics for HighCV X7R 1)
Capacitance change DC/C25 versus
temperature T
∆C
C 25
Capacitance change DC/C0 versus
superimposed DC voltage V
KKE0395-6
15
%
∆C
C0
5
0
KKE0396-E
20
%
0
_ 10
_5
_ 20
_ 10
_ 15
_ 20
_ 25
_ 30
_ 35
_ 40
_ 45
_ 50
_ 60 _ 40 _ 20 0 20 40 60 80 100 C 140
˚
1 µF/50 V/size 1206
_ 30
_ 40
_ 50
_ 60
1 µF/25 V/size 0805
_ 70
_ 80
_ 90
_ 100
0
5 10 15 20 25 30 35 40
T
Capacitance change DC/C1 versus
time t
∆C
C1
Dissipation factor tan d versus
temperature T
KKE0397-M
10
%
V 50
V
10
_1
KKE0494-4
tan δ
5
0
_5
10
_2
_ 10
_ 15
_ 20
10
0
10
1
10
2
10
3
10
4
h 10
10
5
_3
_ 60 _ 40 _ 20 0 20 40 60 80 100 C 140
˚
T
t
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
8
10/06
Multilayer ceramic capacitors
HighCV; X7R
High
CV
Typical characteristics for HighCV X7R 1)
Insulation resistance Rins versus
temperature T
Impedance |Z| and ESR versus
frequency f
KKE0495-C
10 4
MΩ
KKE0398-V
10 4
Ω
R ins
220 nF/25 V/size 0603
Z , ESR
10
10 2
3
10 1
10 0
1 µF/50 V/size 1206
1 µF/25 V/size 0805
2.2 µF/25 V/size 1206
10 2
10
10
10 1
20
10
40
60
80
˚C
100
_1
_2
_3
10
130
Z
ESR
_4
10
_3
10
_2
10
_1
T
Impedance |Z| and ESR versus
frequency f
Impedance |Z| and ESR versus
frequency f
KKE0399-4
10 4
Ω
1 µF/25 V/size 0805
Z , ESR
2.2 µF/25 V/size 1206
Z , ESR
10 2
10 2
10 1
10 1
10 0
10 0
10
10
KKE0400-B
10 4
Ω
10
10 0 10 1 10 2 MHz 10 4
f
_1
10
_2
_3
10
Z
ESR
_4
10
_3
10
_2
10
10
_1
10
0
10
1
10
2
MHz 10
f
10
4
_1
_2
_3
10
Z
ESR
_4
10
_3
10
_2
10
_1
10 0 10 1 10 2 MHz 10 4
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
9
10/06
Multilayer ceramic capacitors
Cautions and warnings
Notes on the selection of ceramic capacitors
In the selection of ceramic capacitors, the following criteria must be considered:
1. Depending on the application, ceramic capacitors used to meet high quality requirements should
at least satisfy the specifications to AEC-Q200. They must meet quality requirements going
beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of
critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS
and airbag equipment or durable industrial goods).
2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at
positions with stranding potential, to reduce the probability of short circuits following a fracture,
two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated
series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single
component.
3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the requirements to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R
ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these
capacitors should not be used as discrete components (see the chapter “Effects on mechanical,
thermal and electrical stress”, point 1.4).
4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the
chapter “Effects on mechanical, thermal and electrical stress”, point 1.4).
5. An application-specific derating or continuous operating voltage must be considered in order to
cushion (unexpected) additional stresses (see the chapter “Reliability”).
The following should be considered in circuit board design
1. If technically feasible in the application, preference should be given to components having an
optimal geometrical design.
2. At least FR4 circuit board material should be used.
3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.
4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the
circuit board. High bending forces may be exerted there when the panels are separated and during further processing of the board (such as when incorporating it into a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit
board.
6. No screw connections should be used to fix the board or to connect several boards. Components should not be placed near screw holes. If screw connections are unavoidable, they must
be cushioned (for instance by rubber pads).
10
10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
11
10/06
Multilayer ceramic capacitors
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third
parties in the event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as “hazardous”). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,
PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
12
10/06