B37933K5010C560

Multilayer ceramic capacitors Chip capacitors, HQF Date: October 2006 Data Sheet ã EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited. Multilayer ceramic capacitors Chip HQF Ordering code system B37923 K 5 100 J 0 60 Packaging 60 ^ cardboard tape, 180-mm reel 70 ^ cardboard tape, 330-mm reel Decimal place for cap. values 10 nF the time constant t = C · Rins is given. Please read Cautions and warnings and Important notes at the end of this document. 3 10/06 C0H 55/125/56 EIA Class 1 50 2.5 · VR/5 s 0.3 pF … 82 pF 0 ± 60 · 10 –6/K 105 >104 >1000 >100 –55 … +125 none VDC VDC MW MW s s °C Multilayer ceramic capacitors HQF HQF Capacitance tolerances CR CR £ 3.9 pF 4.7 pF £ CR £ 8.2 pF Code letter B (standard) C B C (standard) D Tolerance ± 0.1 pF ± 0.25 pF ± 0.1 pF ± 0.25 pF ± 0.5 pF CR CR ³ 10 pF Code letter F G J (standard) K Tolerance ±1% ± 2% ± 5% ±10% Dimensional drawing s b k k KKE0329-N Dimensions (mm) Case size (inch) (mm) 0402 1005 0603 1608 l 1.0 ± 0.10 1.6 ± 0.15 b 0.5 ± 0.05 0.8 ± 0.10 s 0.5 ± 0.05 0.8 ± 0.10 k 0.1 –0.40 0.1 –0.40 Tolerances to CECC 32101-801 Please read Cautions and warnings and Important notes at the end of this document. 4 10/06 Multilayer ceramic capacitors HQF HQF Recommended solder pad C A D KKE0308-1 Recommended dimensions (mm) for reflow soldering Case size (inch/mm) Type A C D 0402/1005 single chip 0.35 … 0.45 1.0 … 1.4 0.4 … 0.6 0603/1608 single chip 0.60 … 0.70 1.8 … 2.2 0.6 … 0.8 Recommended dimensions (mm) for wave soldering Case size (inch/mm) Type A C D 0603/1608 single chip 0.8 … 0.9 2.2 … 2.8 0.6 … 0.8 Termination Termination (nickel barrier) Ceramic body Inner electrode Cu Substrate electrode Intermediate electrode External electrode Cu Ni Sn KKE0486-D Please read Cautions and warnings and Important notes at the end of this document. 5 10/06 HQF Multilayer ceramic capacitors HQF Product range for HQF chip capacitors Size1) inch mm Type VR (VDC) CR 0402 1005 0603 1608 B37923 B37933 50 50 0.3 pF 0.4 pF 0.5 pF 0.6 pF 0.7 pF 0.8 pF 0.9 pF 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10. pF 12. pF 15. pF 18. pF 22. pF 27. pF 82. pF 1) l ´ b (inch) / l ´ b (mm) Please read Cautions and warnings and Important notes at the end of this document. 6 10/06 Multilayer ceramic capacitors HQF HQF; 0402 Ordering codes and packing for HQF capacitors, 50 VDC, nickel barrier terminations Case size 0402, 50 VDC Chip thickness CR 0.3 pF 0.4 pF 0.5 pF 0.6 pF 0.7 pF 0.8 pF 0.9 pF 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10. pF 12. pF 15. pF 18. pF 22. pF Ordering code1) B37923K5000B3** B37923K5000B4** B37923K5000B5** B37923K5000B6** B37923K5000B7** B37923K5000B8** B37923K5000B9** B37923K5010B0** B37923K5010B2** B37923K5010B5** B37923K5010B8** B37923K5020B2** B37923K5020B7** B37923K5030B3** B37923K5030B9** B37923K5040C7** B37923K5050C6** B37923K5060C8** B37923K5080C2** B37923K5100J0** B37923K5120J0** B37923K5150J0** B37923K5180J0** B37923K5220J0** mm 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 Cardboard tape, Æ 180-mm reel ** ^ 60 pcs/reel 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 1) The table contains the ordering codes for the standard capacitance tolerance. For other available capacitance tolerances see page 154. Please read Cautions and warnings and Important notes at the end of this document. 7 10/06 Cardboard tape, Æ 330-mm reel ** ^ 70 pcs/reel 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 HQF Multilayer ceramic capacitors HQF; 0603 Ordering codes and packing for HQF capacitors, 50 VDC, nickel barrier terminations Case size 0603, 50 VDC Chip thickness CR 0.4 pF 0.5 pF 0.6 pF 0.7 pF 0.8 pF 0.9 pF 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10. pF 12. pF 15. pF 18. pF 22. pF 27. pF 82. pF Ordering code1) B37933K5000B4** B37933K5000B5** B37933K5000B6** B37933K5000B7** B37933K5000B8** B37933K5000B9** B37933K5010B0** B37933K5010B2** B37933K5010B5** B37933K5010B8** B37933K5020B2** B37933K5020B7** B37933K5030B3** B37933K5030B9** B37933K5040C7** B37933K5050C6** B37933K5060C8** B37933K5080C2** B37933K5100J0** B37933K5120J0** B37933K5150J0** B37933K5180J0** B37933K5220J0** B37933K5270J0** B37933K5820J0** mm 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 Cardboard tape, Æ 180-mm reel ** ^ 60 pcs/reel 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 1) The table contains the ordering codes for the standard capacitance tolerance. For other available capacitance tolerances see page 154. Please read Cautions and warnings and Important notes at the end of this document. 8 10/06 Cardboard tape, Æ 330-mm reel ** ^ 70 pcs/reel 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 Multilayer ceramic capacitors HQF HQF; 0402 Typical RF performance for HQF capacitors, case size 0402, 50 VDC fres1) MHz ESR @ 1 GHz2) mW Q @ 1 GHz2) ESR @ fres 2) mW 0.3 23400 560 920 710 0.4 20350 490 805 605 0.5 19700 440 720 535 0.6 17400 405 650 485 0.7 15100 375 600 445 0.8 14450 355 560 415 0.9 12600 335 520 385 1.0 12000 320 490 365 1.2 10600 295 440 330 1.5 8900 265 390 290 1.8 7100 245 350 265 2.2 6400 225 310 235 2.7 6000 205 275 210 3.3 5500 185 245 190 3.9 5350 170 225 175 4.7 4650 155 200 155 5.6 3950 145 175 140 6.8 4100 130 155 125 8.2 3650 120 140 115 10 3350 110 120 105 12 3350 102 104 94 15 2600 92 88 82 18 2300 84 70 74 22 2200 78 56 66 Capacitance pF 1) Measured with impedance analyser E 4991A, parts not soldered. 2) Measured with network analyser HP 8753D, parts soldered. Please read Cautions and warnings and Important notes at the end of this document. 9 10/06 HQF Multilayer ceramic capacitors HQF; 0603 Typical RF performance for HQF capacitors, case size 0603, 50 VDC fres1) MHz ESR @ 1 GHz 2) mW Q @ 1 GHz 2) ESR @ fres2) mW 0.4 17800 445 860 595 0.5 17100 400 805 540 0.6 13600 385 755 510 0.7 12200 345 635 440 0.8 11400 325 595 410 0.9 10600 315 560 390 1.0 9600 300 525 365 1.2 8800 275 455 335 1.5 7900 250 395 300 1.8 6900 240 360 285 2.2 5750 215 305 250 2.7 5100 200 270 235 3.3 4700 185 235 210 3.9 4150 175 210 200 4.7 3550 165 185 185 5.6 3130 150 160 170 6.8 2850 140 135 155 8.2 2730 130 115 140 10 2580 120 96 130 12 2400 110 76 118 15 2150 102 62 108 18 2050 96 50 100 22 1870 88 34 90 27 1780 80 26 82 Capacitance pF Capacitance pF fres1) MHz ESR @ 300 MHz 2) mW Q@ 300 MHz 2) ESR @ fres2) mW 82 930 52 105 52 1) Measured with impedance analyser E 4991A, parts not soldered. 2) Measured with network analyser HP 8753D, parts soldered. Please read Cautions and warnings and Important notes at the end of this document. 10 10/06 Multilayer ceramic capacitors HQF HQF; 0402 Typical characteristics for case size 0402 1) ESR versus capacitance C (for not soldered parts) ESR versus capacitance C at self-resonant frequency (for soldered parts) KKE0477-E 10 0 KKE0480-Y 10 0 Ω Ω ESR ESR 3 GHz 1 GHz 10 _1 10 _1 100 MHz 10 _2 10 _1 10 0 10 1 10 pF 10 2 _2 10 _1 10 0 10 1 pF C 10 2 C Self-resonant frequency fres versus capacitance C ESR versus frequency f KKE0481-7 10 1 KKE0479-V 10 5 MHz Ω fres ESR 10 4 10 0 0.4 pF 10 10 3.3 pF 12 pF 22 pF _1 10 3 _2 10 2 10 3 MHz 10 10 2 _ 1 10 4 10 0 10 1 pF 10 2 C f 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Please read Cautions and warnings and Important notes at the end of this document. 11 10/06 HQF Multilayer ceramic capacitors HQF; 0402 Typical characteristics for case size 0402 1) Q factor versus capacitance C Q factor versus frequency f KKE0478-M 10 4 KKE0482-F 10 4 Q Q 10 3 100 MHz 10 3 0.4 pF 10 2 3.3 pF 12 pF 10 1 10 2 1 GHz 3 GHz 10 1 _ 1 10 10 0 10 1 pF 22 pF 10 0 10 10 2 _1 10 2 C 10 3 MHz 10 4 f 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Please read Cautions and warnings and Important notes at the end of this document. 12 10/06 Multilayer ceramic capacitors HQF HQF; 0603 Typical characteristics for case size 0603 1) ESR versus capacitance C (for not soldered parts) ESR versus capacitance C at self-resonant frequency (for soldered parts) KKE0471-Z 10 0 KKE0474-P 10 0 Ω Ω ESR ESR 3 GHz 1 GHz 10 _1 10 300 MHz _1 100 MHz 10 _2 10 _1 10 0 10 1 10 10 2 pF _2 10 _1 10 0 10 1 pF 10 2 C C Self-resonant frequency fres versus capacitance C ESR versus frequency f KKE0475-X 10 1 KKE0473-G 10 5 MHz Ω fres ESR 0.4 pF 10 4 10 0 3.3 pF 10 _1 10 3 12 pF 27 pF 10 _2 10 2 10 3 10 2 _ 1 10 MHz 10 4 10 0 10 1 10 2 pF 10 3 C f 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Please read Cautions and warnings and Important notes at the end of this document. 13 10/06 HQF Multilayer ceramic capacitors HQF; 0603 Typical characteristics for case size 0603 1) Q factor versus capacitance C Q factor versus frequency f KKE0472-8 10 4 KKE0476-6 10 4 Q Q 10 3 100 MHz 10 3 0.4 pF 10 2 1 GHz 300 MHz 10 2 3.3 pF 12 pF 27 pF 10 1 3 GHz 10 0 10 1 _ 1 10 10 0 10 1 pF 10 10 2 _1 10 2 C 10 3 MHz 10 4 f 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Please read Cautions and warnings and Important notes at the end of this document. 14 10/06 Multilayer ceramic capacitors Cautions and warnings Notes on the selection of ceramic capacitors In the selection of ceramic capacitors, the following criteria must be considered: 1. Depending on the application, ceramic capacitors used to meet high quality requirements should at least satisfy the specifications to AEC-Q200. They must meet quality requirements going beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS and airbag equipment or durable industrial goods). 2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at positions with stranding potential, to reduce the probability of short circuits following a fracture, two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single component. 3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the requirements to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these capacitors should not be used as discrete components (see the chapter “Effects on mechanical, thermal and electrical stress”, point 1.4). 4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the chapter “Effects on mechanical, thermal and electrical stress”, point 1.4). 5. An application-specific derating or continuous operating voltage must be considered in order to cushion (unexpected) additional stresses (see the chapter “Reliability”). The following should be considered in circuit board design 1. If technically feasible in the application, preference should be given to components having an optimal geometrical design. 2. At least FR4 circuit board material should be used. 3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed. 4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the circuit board. High bending forces may be exerted there when the panels are separated and during further processing of the board (such as when incorporating it into a housing). 5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit board. 6. No screw connections should be used to fix the board or to connect several boards. Components should not be placed near screw holes. If screw connections are unavoidable, they must be cushioned (for instance by rubber pads). 15 10/06 Multilayer ceramic capacitors Cautions and warnings The following should be considered in the placement process 1. Ensure correct positioning of the ceramic capacitor on the solder pad. 2. Caution when using casting, injection-molded and molding compounds and cleaning agents, as these may damage the capacitor. 3. Support the circuit board and reduce the placement forces. 4. A board should not be straightened (manually) if it has been distorted by soldering. 5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking). 6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or snap-in components): danger of bending and fracture. 7. When testing, transporting, packing or incorporating the board, avoid any deformation of the board not to damage the components. 8. Avoid the use of excessive force when plugging a connector into a device soldered onto the board. 9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible for them (see the chapter “Soldering directions”). 10. When soldering the most gentle solder profile feasible should be selected (heating time, peak temperature, cooling time) in order to avoid thermal stresses and damage. 11. Ensure the correct solder meniscus height and solder quantity. 12. Ensure correct dosing of the cement quantity. 13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder process: they were developed only for conductive adhesion technology. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. 16 10/06 Multilayer ceramic capacitors Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of passive electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of a passive electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as “hazardous”). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 17 10/06