Multilayer ceramic capacitors
Chip capacitors, HQF
Date:
October 2006
Data Sheet
ã EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the
information contained therein without EPCOS’ prior express consent is prohibited.
Multilayer ceramic capacitors
Chip
HQF
Ordering code system
B37923
K
5
100
J
0
60
Packaging
60 ^ cardboard tape, 180-mm reel
70 ^ cardboard tape, 330-mm reel
Decimal place for cap. values 10 nF the time constant t = C · Rins is given.
Please read Cautions and warnings and
Important notes at the end of this document.
3
10/06
C0H
55/125/56
EIA
Class 1
50
2.5 · VR/5 s
0.3 pF … 82 pF
0 ± 60 · 10 –6/K
105
>104
>1000
>100
–55 … +125
none
VDC
VDC
MW
MW
s
s
°C
Multilayer ceramic capacitors
HQF
HQF
Capacitance tolerances
CR
CR £ 3.9 pF
4.7 pF £ CR £ 8.2 pF
Code letter
B
(standard)
C
B
C
(standard)
D
Tolerance
± 0.1 pF
± 0.25 pF
± 0.1 pF
± 0.25 pF
± 0.5 pF
CR
CR ³ 10 pF
Code letter
F
G
J
(standard)
K
Tolerance
±1%
± 2%
± 5%
±10%
Dimensional drawing
s
b
k
k
KKE0329-N
Dimensions (mm)
Case size
(inch)
(mm)
0402
1005
0603
1608
l
1.0 ± 0.10
1.6 ± 0.15
b
0.5 ± 0.05
0.8 ± 0.10
s
0.5 ± 0.05
0.8 ± 0.10
k
0.1 –0.40
0.1 –0.40
Tolerances to CECC 32101-801
Please read Cautions and warnings and
Important notes at the end of this document.
4
10/06
Multilayer ceramic capacitors
HQF
HQF
Recommended solder pad
C
A
D
KKE0308-1
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
Type
A
C
D
0402/1005
single chip
0.35 … 0.45
1.0 … 1.4
0.4 … 0.6
0603/1608
single chip
0.60 … 0.70
1.8 … 2.2
0.6 … 0.8
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
Type
A
C
D
0603/1608
single chip
0.8 … 0.9
2.2 … 2.8
0.6 … 0.8
Termination
Termination
(nickel barrier)
Ceramic body
Inner electrode
Cu
Substrate electrode
Intermediate electrode
External electrode
Cu
Ni
Sn
KKE0486-D
Please read Cautions and warnings and
Important notes at the end of this document.
5
10/06
HQF
Multilayer ceramic capacitors
HQF
Product range for HQF chip capacitors
Size1)
inch
mm
Type
VR (VDC)
CR
0402
1005
0603
1608
B37923
B37933
50
50
0.3 pF
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.2 pF
1.5 pF
1.8 pF
2.2 pF
2.7 pF
3.3 pF
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
10. pF
12. pF
15. pF
18. pF
22. pF
27. pF
82. pF
1) l ´ b (inch) / l ´ b (mm)
Please read Cautions and warnings and
Important notes at the end of this document.
6
10/06
Multilayer ceramic capacitors
HQF
HQF; 0402
Ordering codes and packing for HQF capacitors, 50 VDC, nickel barrier terminations
Case size 0402, 50 VDC
Chip thickness
CR
0.3 pF
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.2 pF
1.5 pF
1.8 pF
2.2 pF
2.7 pF
3.3 pF
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
10. pF
12. pF
15. pF
18. pF
22. pF
Ordering code1)
B37923K5000B3**
B37923K5000B4**
B37923K5000B5**
B37923K5000B6**
B37923K5000B7**
B37923K5000B8**
B37923K5000B9**
B37923K5010B0**
B37923K5010B2**
B37923K5010B5**
B37923K5010B8**
B37923K5020B2**
B37923K5020B7**
B37923K5030B3**
B37923K5030B9**
B37923K5040C7**
B37923K5050C6**
B37923K5060C8**
B37923K5080C2**
B37923K5100J0**
B37923K5120J0**
B37923K5150J0**
B37923K5180J0**
B37923K5220J0**
mm
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
Cardboard tape,
Æ 180-mm reel
** ^ 60
pcs/reel
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
1) The table contains the ordering codes for the standard capacitance tolerance.
For other available capacitance tolerances see page 154.
Please read Cautions and warnings and
Important notes at the end of this document.
7
10/06
Cardboard tape,
Æ 330-mm reel
** ^ 70
pcs/reel
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
HQF
Multilayer ceramic capacitors
HQF; 0603
Ordering codes and packing for HQF capacitors, 50 VDC, nickel barrier terminations
Case size 0603, 50 VDC
Chip thickness
CR
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.2 pF
1.5 pF
1.8 pF
2.2 pF
2.7 pF
3.3 pF
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
10. pF
12. pF
15. pF
18. pF
22. pF
27. pF
82. pF
Ordering code1)
B37933K5000B4**
B37933K5000B5**
B37933K5000B6**
B37933K5000B7**
B37933K5000B8**
B37933K5000B9**
B37933K5010B0**
B37933K5010B2**
B37933K5010B5**
B37933K5010B8**
B37933K5020B2**
B37933K5020B7**
B37933K5030B3**
B37933K5030B9**
B37933K5040C7**
B37933K5050C6**
B37933K5060C8**
B37933K5080C2**
B37933K5100J0**
B37933K5120J0**
B37933K5150J0**
B37933K5180J0**
B37933K5220J0**
B37933K5270J0**
B37933K5820J0**
mm
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
0.8 ± 0.1
Cardboard tape,
Æ 180-mm reel
** ^ 60
pcs/reel
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
1) The table contains the ordering codes for the standard capacitance tolerance.
For other available capacitance tolerances see page 154.
Please read Cautions and warnings and
Important notes at the end of this document.
8
10/06
Cardboard tape,
Æ 330-mm reel
** ^ 70
pcs/reel
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
Multilayer ceramic capacitors
HQF
HQF; 0402
Typical RF performance for HQF capacitors, case size 0402, 50 VDC
fres1)
MHz
ESR @ 1 GHz2)
mW
Q @ 1 GHz2)
ESR @ fres 2)
mW
0.3
23400
560
920
710
0.4
20350
490
805
605
0.5
19700
440
720
535
0.6
17400
405
650
485
0.7
15100
375
600
445
0.8
14450
355
560
415
0.9
12600
335
520
385
1.0
12000
320
490
365
1.2
10600
295
440
330
1.5
8900
265
390
290
1.8
7100
245
350
265
2.2
6400
225
310
235
2.7
6000
205
275
210
3.3
5500
185
245
190
3.9
5350
170
225
175
4.7
4650
155
200
155
5.6
3950
145
175
140
6.8
4100
130
155
125
8.2
3650
120
140
115
10
3350
110
120
105
12
3350
102
104
94
15
2600
92
88
82
18
2300
84
70
74
22
2200
78
56
66
Capacitance
pF
1) Measured with impedance analyser E 4991A, parts not soldered.
2) Measured with network analyser HP 8753D, parts soldered.
Please read Cautions and warnings and
Important notes at the end of this document.
9
10/06
HQF
Multilayer ceramic capacitors
HQF; 0603
Typical RF performance for HQF capacitors, case size 0603, 50 VDC
fres1)
MHz
ESR @ 1 GHz 2)
mW
Q @ 1 GHz 2)
ESR @ fres2)
mW
0.4
17800
445
860
595
0.5
17100
400
805
540
0.6
13600
385
755
510
0.7
12200
345
635
440
0.8
11400
325
595
410
0.9
10600
315
560
390
1.0
9600
300
525
365
1.2
8800
275
455
335
1.5
7900
250
395
300
1.8
6900
240
360
285
2.2
5750
215
305
250
2.7
5100
200
270
235
3.3
4700
185
235
210
3.9
4150
175
210
200
4.7
3550
165
185
185
5.6
3130
150
160
170
6.8
2850
140
135
155
8.2
2730
130
115
140
10
2580
120
96
130
12
2400
110
76
118
15
2150
102
62
108
18
2050
96
50
100
22
1870
88
34
90
27
1780
80
26
82
Capacitance
pF
Capacitance
pF
fres1)
MHz
ESR @ 300 MHz 2)
mW
Q@
300 MHz 2)
ESR @ fres2)
mW
82
930
52
105
52
1) Measured with impedance analyser E 4991A, parts not soldered.
2) Measured with network analyser HP 8753D, parts soldered.
Please read Cautions and warnings and
Important notes at the end of this document.
10
10/06
Multilayer ceramic capacitors
HQF
HQF; 0402
Typical characteristics for case size 0402 1)
ESR versus capacitance C
(for not soldered parts)
ESR versus capacitance C
at self-resonant frequency (for soldered parts)
KKE0477-E
10 0
KKE0480-Y
10 0
Ω
Ω
ESR
ESR
3 GHz
1 GHz
10
_1
10
_1
100 MHz
10
_2
10
_1
10
0
10
1
10
pF
10
2
_2
10
_1
10 0
10 1
pF
C
10 2
C
Self-resonant frequency fres versus
capacitance C
ESR versus frequency f
KKE0481-7
10 1
KKE0479-V
10 5
MHz
Ω
fres
ESR
10 4
10 0
0.4 pF
10
10
3.3 pF
12 pF
22 pF
_1
10 3
_2
10
2
10
3
MHz 10
10 2 _ 1
10
4
10 0
10 1
pF
10 2
C
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
11
10/06
HQF
Multilayer ceramic capacitors
HQF; 0402
Typical characteristics for case size 0402 1)
Q factor versus
capacitance C
Q factor versus
frequency f
KKE0478-M
10 4
KKE0482-F
10 4
Q
Q
10 3
100 MHz
10
3
0.4 pF
10
2
3.3 pF
12 pF
10 1
10 2
1 GHz
3 GHz
10 1 _ 1
10
10
0
10
1
pF
22 pF
10 0
10
10
2
_1
10 2
C
10 3
MHz 10 4
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
12
10/06
Multilayer ceramic capacitors
HQF
HQF; 0603
Typical characteristics for case size 0603 1)
ESR versus capacitance C
(for not soldered parts)
ESR versus capacitance C
at self-resonant frequency (for soldered parts)
KKE0471-Z
10 0
KKE0474-P
10 0
Ω
Ω
ESR
ESR
3 GHz
1 GHz
10
_1
10
300 MHz
_1
100 MHz
10
_2
10
_1
10 0
10 1
10
10 2
pF
_2
10
_1
10 0
10 1
pF
10 2
C
C
Self-resonant frequency fres versus
capacitance C
ESR versus frequency f
KKE0475-X
10 1
KKE0473-G
10 5
MHz
Ω
fres
ESR
0.4 pF
10 4
10 0
3.3 pF
10
_1
10 3
12 pF
27 pF
10
_2
10 2
10 3
10 2 _ 1
10
MHz 10 4
10 0
10 1
10 2
pF 10 3
C
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
13
10/06
HQF
Multilayer ceramic capacitors
HQF; 0603
Typical characteristics for case size 0603 1)
Q factor versus
capacitance C
Q factor versus
frequency f
KKE0472-8
10 4
KKE0476-6
10 4
Q
Q
10 3
100 MHz
10 3
0.4 pF
10
2
1 GHz
300 MHz
10
2
3.3 pF
12 pF
27 pF
10 1
3 GHz
10 0
10 1 _ 1
10
10 0
10 1
pF
10
10 2
_1
10 2
C
10 3
MHz 10 4
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
14
10/06
Multilayer ceramic capacitors
Cautions and warnings
Notes on the selection of ceramic capacitors
In the selection of ceramic capacitors, the following criteria must be considered:
1. Depending on the application, ceramic capacitors used to meet high quality requirements should
at least satisfy the specifications to AEC-Q200. They must meet quality requirements going
beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of
critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS
and airbag equipment or durable industrial goods).
2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at
positions with stranding potential, to reduce the probability of short circuits following a fracture,
two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated
series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single
component.
3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the requirements to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R
ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these
capacitors should not be used as discrete components (see the chapter “Effects on mechanical,
thermal and electrical stress”, point 1.4).
4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the
chapter “Effects on mechanical, thermal and electrical stress”, point 1.4).
5. An application-specific derating or continuous operating voltage must be considered in order to
cushion (unexpected) additional stresses (see the chapter “Reliability”).
The following should be considered in circuit board design
1. If technically feasible in the application, preference should be given to components having an
optimal geometrical design.
2. At least FR4 circuit board material should be used.
3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.
4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the
circuit board. High bending forces may be exerted there when the panels are separated and during further processing of the board (such as when incorporating it into a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit
board.
6. No screw connections should be used to fix the board or to connect several boards. Components should not be placed near screw holes. If screw connections are unavoidable, they must
be cushioned (for instance by rubber pads).
15
10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
16
10/06
Multilayer ceramic capacitors
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third
parties in the event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as “hazardous”). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,
PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
17
10/06