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B37947K9103J62

B37947K9103J62

  • 厂商:

    TDK(东电化)

  • 封装:

    0805

  • 描述:

    贴片电容(MLCC) 0805 10nF ±5% 16V C0G(NP0)

  • 数据手册
  • 价格&库存
B37947K9103J62 数据手册
Multilayer Ceramic Capacitors Series/Type: B37937, B37947 The following products presented in this data sheet are being withdrawn. Ordering Code B37947K9102J060 B37947K9102J070 B37947K9152J060 Substitute Product Date of Withdrawal 2007-12-21 2007-12-21 2007-12-21 Deadline Last Orders 2008-03-31 2008-03-31 2008-03-31 Last Shipments 2008-06-30 2008-06-30 2008-06-30 Ordering Code B37947K9152J070 B37947K9222J062 B37947K9222J072 B37947K9472J062 B37947K9472J072 B37937K9561J060 B37937K9561J070 B37937K9681J060 B37937K9681J070 B37937K9102J060 B37937K9102J070 B37947K9103G* B37947K9103F* B37947K9682G* B37947K9562J* B37937K9227J* B37937K9222G* B37937K9182J* B37947K9682J072 B37947K9682J062 B37947K9332J072 B37947K9332J062 B37947K9103J072 B37947K9103J062 B37937K9222J070 B37937K9222J060 B37937K9152J070 B37937K9152J060 Substitute Product Date of Withdrawal 2007-12-21 2007-12-21 2007-12-21 2007-12-21 2007-12-21 2007-12-21 2007-12-21 2007-12-21 2007-12-21 2007-12-21 2007-12-21 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 2007-10-26 Deadline Last Orders 2008-03-31 2008-03-31 2008-03-31 2008-03-31 2008-03-31 2008-03-31 2008-03-31 2008-03-31 2008-03-31 2008-03-31 2008-03-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 2008-01-31 Last Shipments 2008-06-30 2008-06-30 2008-06-30 2008-06-30 2008-06-30 2008-06-30 2008-06-30 2008-06-30 2008-06-30 2008-06-30 2008-06-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 2008-04-30 For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales. Multilayer ceramic capacitors Chip CPPS Ordering code system B37937 K 9 102 J 0 60 Packaging 60 62 70 72 ^ ^ ^ ^ cardboard tape, 180-mm reel blister tape, 180-mm reel cardboard tape, 330-mm reel blister tape, 330-mm reel Internal coding Capacitance tolerance J ^ ± 5% (standard) K ^ ±10% Capacitance, coded (example) Rated voltage Termination 102 ^ 10 · 102 pF = 1 nF 103 ^ 10 · 103 pF = 10 nF Rated voltage [VDC] Code 16 9 K ^ nickel barrier for all case sizes Type and size Chip size (inch / mm) Temperature characteristic CPPS 0603 / 1608 0805 / 2012 B37937 B37947 Please read Cautions and warnings and Important notes at the end of this document. 2 10/06 Chip Multilayer ceramic capacitors CPPS Features ■ ■ ■ ■ ■ ■ ■ Replacement of PPS film capacitors Class 1 characteristic with high capacitance values High insulation resistance Excellent DC characteristic Excellent temperature characteristic No piezoelectric effects No ageing effects Applications ■ ■ ■ ■ ■ Wireless communication Loop filter PLL filter Telecom (mobile phones, Bluetooth, ADSL/XDSL) Automotive (keyless entry) Termination ■ For soldering: Nickel barrier terminations (Ni) Options ■ Alternative capacitance tolerances available on request Delivery mode ■ Cardboard and blister tape (blister tape for chip thickness ³1.2 ± 0.1 mm), 180-mm and 330-mm reel available Electrical data Temperature characteristic Climatic category (IEC 60068-1) Standard Dielectric Rated voltage Test voltage Capacitance range / E series Temperature coefficient Dissipation factor (limit value) Insulation resistance1) at + 25 °C Insulation resistance1) at +125 °C Time constant1) at + 25 °C Time constant1) at +125 °C Operating temperature range Ageing VR Vtest CR tan d Rins Rins t t Top 1) For CR >10 nF the time constant t = C · Rins is given. Please read Cautions and warnings and Important notes at the end of this document. 3 10/06 C0G 55/125/56 EIA Class 1 16 2.5 · VR/5 s 560 pF … 10 nF (E6) 0 ± 30 · 10 –6/K 105 >104 >1000 >100 –55 … +125 none VDC VDC MW MW s s °C Multilayer ceramic capacitors CPPS CPPS Capacitance tolerances Code letter J (standard) K Tolerance ± 5% ±10% Dimensional drawing s b k k KKE0329-N Dimensions (mm) Case size (inch) (mm) 0603 1608 0805 2012 l 1.6 ± 0.15 2.00 ± 0.20 b 0.8 ± 0.10 1.25 ± 0.15 s 0.8 ± 0.10 1.30 max. k 0.1 –0.40 0.13 –0.75 Tolerances to CECC 32101-801 Please read Cautions and warnings and Important notes at the end of this document. 4 10/06 Multilayer ceramic capacitors CPPS CPPS Recommended solder pad C A D KKE0308-1 Recommended dimensions (mm) for reflow soldering Case size (inch/mm) Type A C D 0603/1608 0805/2012 single chip single chip 0.6 … 0.7 0.6 … 0.7 1.8 … 2.2 2.2 … 2.6 0.6 … 0.8 0.8 … 1.1 Termination Termination (nickel barrier) Ceramic body Inner electrode Substrate electrode Intermediate electrode External electrode AgPd Ag Ni Sn KKE0484-W Please read Cautions and warnings and Important notes at the end of this document. 5 10/06 CPPS Multilayer ceramic capacitors CPPS Product range for CPPS chip capacitors Size1) inch mm Type VR (VDC) CR 0603 1608 0805 2012 B37937 B37947 16 16 560. pF 680. pF 1.0 nF 1.5 nF 2.2 nF 3.3 nF 4.7 nF 6.8 nF 10. nF 1) l ´ b (inch) / l ´ b (mm) Please read Cautions and warnings and Important notes at the end of this document. 6 10/06 Multilayer ceramic capacitors CPPS CPPS; 0603 and 0805 Ordering codes and packing for CPPS capacitors, 16 VDC, nickel barrier terminations mm Cardboard tape, Æ 180-mm reel ** ^ 60 pcs/reel Cardboard tape, Æ 330-mm reel ** ^ 70 pcs/reel 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 4000 4000 4000 4000 4000 16000 16000 16000 16000 16000 0.6 ± 0.1 0.8 ± 0.1 1.2 ± 0.1 1.2 ± 0.1 1.2 ± 0.1 1.2 ± 0.1 1.2 ± 0.1 5000 4000 3000 3) 3000 3) 3000 3) 3000 3) 3000 3) 20000 16000 12000 4) 12000 4) 12000 4) 12000 4) 12000 4) Chip thickness CR1) Ordering code 2) Case size 0603, 16 VDC 560. pF 680. pF 1.0 nF 1.5 nF 2.2 nF B37937K9561J0** B37937K9681J0** B37937K9102J0** B37937K9152J0** B37937K9222J0** Case size 0805, 16 VDC 1.0 nF 1.5 nF 2.2 nF 3.3 nF 4.7 nF 6.8 nF 10. nF B37947K9102J0** B37947K9152J0** B37947K9222J0** B37947K9332J0** B37947K9472J0** B37947K9682J0** B37947K9103J0** 1) Other capacitance values on request. 2) The table contains the ordering codes for the standard capacitance tolerance. For other available capacitance tolerances see page 168. 3) Blister tape, 180-mm reel, ordering code ** ^ 62 4) Blister tape, 330-mm reel, ordering code ** ^ 72 Please read Cautions and warnings and Important notes at the end of this document. 7 10/06 CPPS Multilayer ceramic capacitors CPPS Typical characteristics 1) Capacitance change DC/C25 versus temperature T (tolerance range ) Capacitance change DC/C0 versus superimposed DC voltage V KKE0483-N 0.5 ∆C % C 25 KKE0460-J 0.5 0.3 ∆C % C0 0.3 0.2 0.2 0.1 0.1 0 0 _ 0.1 _ 0.1 _ 0.2 _ 0.2 _ 0.3 _ 0.3 _ 0.4 _ 0.4 _ 0.5 _ 55 _ 40 _ 20 0 20 40 60 80 ˚C _ 0.5 120 0 2 4 6 8 10 T 12 14 V 16 V Dissipation factor tan d versus temperature T Impedance |Z| versus frequency f KKE0488-U 10 3 10 _2 KKE0118-V Ω tan δ Z 10 2 10 1 nF _3 10 1 4.7 nF 10 0 10 10 nF 10 10 _4 _1 _2 10 0 10 1 10 2 10 MHz 10 3 f _5 _ 60 _ 40 _ 20 0 20 40 60 80 100 C 140 ˚ T 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Please read Cautions and warnings and Important notes at the end of this document. 8 10/06 Multilayer ceramic capacitors CPPS CPPS Typical characteristics 1) Capacitance change DC/C1 versus time t Insulation resistance Rins versus temperature T KKE0129-B 10 8 MΩ KKE0100-S 5 ∆C % C1 0 R ins 10 6 _5 10 5 _ 10 10 4 _ 15 10 3 10 2 0 20 40 60 80 100 _ 20 10 0 ˚C 140 T 10 1 10 2 h 10 3 t 1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance. Please read Cautions and warnings and Important notes at the end of this document. 9 10/06 Multilayer ceramic capacitors Cautions and warnings Notes on the selection of ceramic capacitors In the selection of ceramic capacitors, the following criteria must be considered: 1. Depending on the application, ceramic capacitors used to meet high quality requirements should at least satisfy the specifications to AEC-Q200. They must meet quality requirements going beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS and airbag equipment or durable industrial goods). 2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at positions with stranding potential, to reduce the probability of short circuits following a fracture, two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single component. 3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the requirements to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these capacitors should not be used as discrete components (see the chapter “Effects on mechanical, thermal and electrical stress”, point 1.4). 4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the chapter “Effects on mechanical, thermal and electrical stress”, point 1.4). 5. An application-specific derating or continuous operating voltage must be considered in order to cushion (unexpected) additional stresses (see the chapter “Reliability”). The following should be considered in circuit board design 1. If technically feasible in the application, preference should be given to components having an optimal geometrical design. 2. At least FR4 circuit board material should be used. 3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed. 4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the circuit board. High bending forces may be exerted there when the panels are separated and during further processing of the board (such as when incorporating it into a housing). 5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit board. 6. No screw connections should be used to fix the board or to connect several boards. Components should not be placed near screw holes. If screw connections are unavoidable, they must be cushioned (for instance by rubber pads). 10 10/06 Multilayer ceramic capacitors Cautions and warnings The following should be considered in the placement process 1. Ensure correct positioning of the ceramic capacitor on the solder pad. 2. Caution when using casting, injection-molded and molding compounds and cleaning agents, as these may damage the capacitor. 3. Support the circuit board and reduce the placement forces. 4. A board should not be straightened (manually) if it has been distorted by soldering. 5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking). 6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or snap-in components): danger of bending and fracture. 7. When testing, transporting, packing or incorporating the board, avoid any deformation of the board not to damage the components. 8. Avoid the use of excessive force when plugging a connector into a device soldered onto the board. 9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible for them (see the chapter “Soldering directions”). 10. When soldering the most gentle solder profile feasible should be selected (heating time, peak temperature, cooling time) in order to avoid thermal stresses and damage. 11. Ensure the correct solder meniscus height and solder quantity. 12. Ensure correct dosing of the cement quantity. 13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder process: they were developed only for conductive adhesion technology. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. 11 10/06 Multilayer ceramic capacitors Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of passive electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of a passive electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as “hazardous”). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 12 10/06
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