B57423V2473H062

NTC thermistors for temperature measurement SMD NTC thermistors, case size 0805 (2012), standard series Series/Type: B574**V2/ B57620C5 Date: June 2012 The following products presented in this data sheet are being withdrawn. Ordering Code B57411V2470+062 B57411V2331+062 B57411V2221+062 Substitute Product Date of Withdrawal 2012-11-09 2012-11-09 2012-11-09 Deadline Last Orders 2013-03-01 2013-03-01 2013-03-01 Last Shipments 2013-06-01 2013-06-01 2013-06-01 © EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Ordering Code B57411V2151+062 B57411V2101+062 B57421V2681+062 B57421V2471+062 Substitute Product Date of Withdrawal 2012-11-09 2012-11-09 2012-11-09 2012-11-09 Deadline Last Orders 2013-03-01 2013-03-01 2013-03-01 2013-03-01 Last Shipments 2013-06-01 2013-06-01 2013-06-01 2013-06-01 For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales. Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) Applications Temperature measurement and compensation Standard series Dimensional drawing Features Multilayer SMD NTC with inner electrodes Nickel barrier termination Excellent long-term aging stability in high temperature environment UL approval (E69802) Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request. Dimensions in mm Approx. weight 13 mg Delivery mode Blister tape, 180-mm reel (standard); 330-mm reel (on request) General technical data Operating temperature range Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity Top (at 25 °C, on PCB) P251) ∆RR/RR TR (on PCB) δth1) (on PCB) τc1) Cth1) 1) Depends on mounting situation Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 21 55 ... 125 210 ±3, ±5 25 approx. 3.5 approx. 10 approx. 35 °C mW % °C mW/K s mJ/K Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) Standard series Electrical specification and ordering codes R25 Ω 47 100 150 220 330 470 680 1.0 k 1.0 k 1.5 k 2.2 k 3.3 k 4.7 k 4.7 k 6.8 k 10 k 10 k 10 k 10 k 15 k 22 k 22 k 33 k 33 k 47 k 47 k 100 k 470 k 680 k No. of R/T characteristic 8500 8501 8501 8501 8501 8502 8502 1010 8502 8502 8502 8502 8500 8507 8507 1011 8500 8502 8507 8502 8502 8507 8502 8507 8502 8507 8507 8507 8507 B25/50 K 3590 3500 3500 3500 3500 3940 3940 3470 3940 3940 3940 3940 3590 4386 4386 3660 3590 3940 4386 3940 3940 4386 3940 4386 3940 4386 4386 4386 4386 B25/85 K 3635 3540 3540 3540 3540 3980 3980 3514 3980 3980 3980 3980 3635 4455 4455 3720 3635 3980 4455 3980 3980 4455 3980 4455 3980 4455 4455 4455 4455 + = Resistance tolerance H = ±3% J = ±5% Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 21 B25/100 K 3650 ±3% 3550 ±3% 3550 ±3% 3550 ±3% 3550 ±3% 4000 ±3% 4000 ±3% 3530 ±3% 4000 ±3% 4000 ±3% 4000 ±3% 4000 ±3% 3650 ±3% 4480 ±3% 4480 ±3% 3730 ±3% 3650 ±3% 4000 ±3% 4480 ±3% 4000 ±3% 4000 ±3% 4480 ±3% 4000 ±3% 4480 ±3% 4000 ±3% 4480 ±3% 4480 ±3% 4480 ±3% 4480 ±3% Ordering code B57411V2470+062 B57411V2101+062 B57411V2151+062 B57411V2221+062 B57411V2331+062 B57421V2471+062 B57421V2681+062 B57620C5102+062 B57421V2102+062 B57421V2152+062 B57421V2222+062 B57421V2332+062 B57401V2472+062 B57471V2472+062 B57471V2682+062 B57620C5103+062 B57401V2103+062 B57421V2103+062 B57471V2103+062 B57421V2153+062 B57421V2223+062 B57471V2223+062 B57421V2333+062 B57471V2333+062 B57421V2473+062 B57471V2473+062 B57471V2104+062 B57471V2474+062 B57471V2684+062 Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) Standard series Reliability data SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. Test Standard Storage in dry heat IEC 60068-2-2 JIS C 0021 Storage in damp heat, steady state Rapid temperature cycling Endurance Solderability Storage at upper category temperature T: (125 ±2) °C t: 1000 h IEC Temperature of air: (40 ±2) °C 60068-2-78 Relative humidity of air: JIS C 0022 (93 +2/3)% Duration: 56 days2) IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature: 125 °C JIS C 0025 Number of cycles: 1003) Pmax: 210 mW T: (65 ±2) °C t: 1000 h IEC Solderability: 60068-2-58 (215 ±3) °C, (3 ±0.3) s JIS C 0054 (245 ±5) °C, (3 ±0.3) s Resistance drift after soldering 1) 2) 3) 4) 5) Test conditions Resistance to soldering heat: (260 ±5) °C, (10 ±1) s Reflow soldering profile Wave soldering profile ∆R25/R25 (typical) < 2%1) < 2%2) < 2%3) < 2%4) 95% of terminations wetted < 1%5) Except B57620C5102+062 ∆R25/R25 (typical): < 6%, B57620C5103+062 ∆R25/R25 (typical): < 3% Except B57620C5102+062 and B57620C5103+062 duration: 21 days, ∆R25/R25 (typical): < 3% Except B57620C5102+062 and B57620C5103+062 number of cycles: 10, ∆R25/R25 (typical): < 3% Except B57620C5102+062 and B57620C5103+062 ∆R25/R25 (typical): < 5% Except B57620C5102+062 and B57620C5103+062 ∆R25/R25 (typical): < 5% Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 21 Remarks Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) Standard series R/T characteristics R/T No. T (°C) 1010 1011 8500 B25/100 = 3530 K B25/100 = 3730 K B25/100 = 3650 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 52.826 38.643 28.574 21.346 16.1 6.4 6.1 5.9 5.7 5.5 70.014 49.906 36.015 26.296 19.411 6.9 6.7 6.4 6.2 6.0 63.917 45.889 33.344 24.504 18.201 6.8 6.5 6.3 6.1 5.8 30.0 25.0 20.0 15.0 10.0 12.256 9.4071 7.2862 5.6835 4.4698 5.4 5.2 5.0 4.9 4.7 14.479 10.903 8.2923 6.3591 4.9204 5.8 5.6 5.4 5.2 5.1 13.657 10.347 7.9114 6.1019 4.7454 5.6 5.5 5.3 5.1 4.9 5.0 0.0 5.0 10.0 15.0 3.5385 2.8222 2.2649 1.83 1.4872 4.6 4.5 4.3 4.2 4.1 3.8279 3.0029 2.3773 1.8959 1.5207 4.9 4.8 4.6 4.5 4.3 3.7198 2.938 2.3372 1.8722 1.5096 4.8 4.6 4.5 4.4 4.2 20.0 25.0 30.0 35.0 40.0 1.2161 1.0000 0.82677 0.68708 0.57401 4.0 3.9 3.8 3.6 3.5 1.228 1.0000 0.81779 0.67341 0.55747 4.2 4.1 3.9 3.8 3.7 1.2249 1.0000 0.82111 0.67798 0.56279 4.1 4.0 3.9 3.8 3.7 45.0 50.0 55.0 60.0 65.0 0.48181 0.40638 0.34427 0.29296 0.25035 3.5 3.4 3.3 3.2 3.1 0.46357 0.3874 0.32368 0.272 0.23041 3.6 3.6 3.5 3.4 3.3 0.46958 0.39374 0.33171 0.28073 0.23863 3.6 3.5 3.4 3.3 3.2 70.0 75.0 80.0 85.0 90.0 0.21478 0.18501 0.15995 0.13881 0.12088 3.0 2.9 2.9 2.8 2.7 0.19604 0.16735 0.14342 0.12347 0.10668 3.2 3.1 3.0 3.0 2.8 0.2037 0.17459 0.15022 0.12975 0.11247 3.1 3.0 3.0 2.9 2.8 95.0 100.0 105.0 110.0 115.0 0.10563 0.092597 0.081442 0.071842 0.063571 2.7 2.6 2.5 2.5 2.4 0.092734 0.080903 0.070616 0.061826 0.054282 2.8 2.8 2.7 2.6 2.6 0.097838 0.085396 0.074781 0.065691 0.057883 2.8 2.7 2.6 2.6 2.5 120.0 125.0 130.0 135.0 140.0 0.056407 0.050196    2.4 2.3    0.047793 0.042249    2.5 2.4            0.051153 0.045335 0.040289 0.0359 0.032071 2.4 2.4 2.3 2.3 2.2 0.028723 0.025786 2.2 2.1 145.0 150.0 Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 21 Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) Standard series R/T characteristics R/T No. T (°C) 8501 8502 8507 B25/100 = 3550 K B25/100 = 4000 K B25/100 = 4480 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 56.633 41.134 30.209 22.42 16.807 6.5 6.3 6.1 5.9 5.7 96.158 66.892 47.127 33.606 24.243 7.4 7.1 6.9 6.6 6.4 30.0 25.0 20.0 15.0 10.0 12.721 9.7156 7.4854 5.8152 4.5537 5.5 5.3 5.1 5.0 4.8 17.681 13.032 9.702 7.2923 5.5314 6.2 6.0 5.8 5.6 5.4 23.213 16.686 12.115 8.8803 6.5692 6.7 6.5 6.3 6.1 5.9 5.0 0.0 5.0 10.0 15.0 3.5931 2.8558 2.2857 1.8416 1.4934 4.7 4.5 4.4 4.3 4.1 4.2325 3.2657 2.54 1.9907 1.5716 5.3 5.1 4.9 4.8 4.7 4.9025 3.6896 2.7994 2.1406 1.6492 5.8 5.6 5.4 5.3 5.1 20.0 25.0 30.0 35.0 40.0 1.2184 1.0000 0.82537 0.68495 0.57139 4.0 3.9 3.8 3.7 3.6 1.2494 1.0000 0.80552 0.65288 0.53229 4.5 4.4 4.3 4.1 4.0 1.2798 1.0000 0.78663 0.62277 0.4961 5.0 4.9 4.7 4.6 4.5 45.0 50.0 55.0 60.0 65.0 0.47905 0.40358 0.34158 0.2904 0.24795 3.5 3.4 3.3 3.2 3.1 0.43645 0.35981 0.29819 0.24837 0.20787 3.9 3.8 3.7 3.6 3.5 0.39757 0.32044 0.2597 0.21161 0.17331 4.4 4.3 4.1 4.0 3.9 70.0 75.0 80.0 85.0 90.0 0.21259 0.183 0.15813 0.13715 0.11938 3.0 3.0 2.9 2.8 2.7 0.17479 0.14763 0.12523 0.10667 0.091227 3.4 3.3 3.2 3.2 3.1 0.14265 0.11799 0.098035 0.081823 0.068589 3.8 3.8 3.7 3.6 3.5 95.0 100.0 105.0 110.0 115.0 0.10427 0.091375 0.080333 0.070846 0.062666 2.7 2.6 2.5 2.5 2.4 0.078319 0.067488 0.058363 0.050647 0.044098 3.0 2.9 2.9 2.8 2.7 0.057735 0.048796 0.041403 0.035263 0.030143 3.4 3.3 3.2 3.2 3.1 120.0 125.0 130.0 135.0 140.0 0.055592 0.049454    2.4 2.3        0.03852 0.033752 0.029663 0.026146 0.023111 2.7 2.6 2.6 2.5 2.4 0.025858 0.022258 0.019223 0.016655 0.014476 3.0 3.0 2.9 2.8 2.8 0.020484 0.018203 2.4 2.3 0.012619 0.011033 2.7 2.7 145.0 150.0 Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 21 142.71 96.913 66.637 46.366 32.629 7.9 7.6 7.4 7.1 6.9 Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) Taping and packing 1 Taping of SMD NTC thermistors 1.1 Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3) Dimensions (mm) Case size 0402 (8-mm tape) Case size 0603 (8-mm tape) Tolerance A0 × B0 0.60 × 1.15 0.95 × 1.80 ±0.2 T2 0.70 1.10 T 0.60 0.90 max. D0 1.50 1.50 ±0.10 P0 4.00 4.00 ±0.101) P2 2.00 2.00 ±0.05 P1 2.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.75 1.75 ±0.10 F 3.50 3.50 ±0.05 G 0.75 0.75 min. 1) ≤0.2 mm over 10 sprocket holes. Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 21 Standard series Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) 1.2 Blister tape for case size 0805 and 1206 (taping to IEC 60286-3) Dimensions (mm) Case size 0805 (8-mm tape) Case size 1206 (8-mm tape) Tolerance A0 × B0 1.60 × 2.40 1.90 × 3.50 ±0.2 K0 1.40 1.40 max. T2 2.5 2.5 max. D0 1.50 1.50 +0.10/–0 D1 1.00 1.00 min. P0 4.00 4.00 ±0.102) P2 2.00 2.00 ±0.05 P1 4.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.75 1.75 ±0.10 F 3.50 3.50 ±0.05 G 0.75 0.75 min. 2) ≤0.2 mm over 10 sprocket holes. Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 21 Standard series Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) 1.3 Standard series Reel packing Packing survey Case size Chip 8-mm tape thickness3) Reel dimensions Packing units mm mm pcs./reel Blister Card- A board Tol. W1 Tol. W2 180-mm 330-mm reel reel 0402 0.5 x 180 3/+0 8.4 +1.5/0 14.4 max. 10000  0603 0.8 x 180 3/+0 8.4 +1.5/0 14.4 max. 4000  330 ±2.0 12.4 +1.5/0 18.4 max.  16000 0805 0.8 x 8.4 12.4 +1.5/0 +1.5/0 14.4 max. 18.4 max. 16000 x 3/+0 ±2.0 4000 1.2 180 330 3000 12000 0.8 x 180 2/+0 8.4 +1.5/0 14.4 max. 4000  1.2 x 180 2/+0 8.4 +1.5/0 14.4 max. 2000  1206 3) Chip thickness depends on the resistance value. Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 21 Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) 2 Standard series Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 21 Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) B574**V2/ B57620C5 Standard series Mounting instructions 1 Soldering 1.1 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB. The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metalization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods. Note: SMD NTCs with AgPd termination are not approved for lead-free soldering. Figure 1 SMD NTC thermistors, structure of nickel barrier termination 1.1.1 Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.1.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges ≤1/3. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 260 ±5 10 ±1 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1 Please read Cautions and warnings and Important notes at the end of this document. Page 11 of 21 Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) Wave soldering Temperature characteristic at component terminal with dual wave soldering Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document. Page 12 of 21 Standard series Temperature measurement and compensation B574**V2/ B57620C5 SMD NTC thermistors, case size 0805 (2012) Standard series Reflow soldering Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D Profile feature Preheat and soak - Temperature min - Temperature max - Time Average ramp-up rate Liquidous temperature Time at liquidous Peak package body temperature Time (tP)3) within 5 °C of specified classification temperature (Tc) Average ramp-down rate Time 25 °C to peak temperature Tsmin Tsmax tsmin to tsmax Tsmax to Tp TL tL Tp1) Tp to Tsmax Sn-Pb eutectic assembly Pb-free assembly 100 °C 150 °C 60 ... 120 s 3 °C/ s max. 183 °C 60 ... 150 s 220 °C ... 235 °C2) 150 °C 200 °C 60 ... 180 s 3 °C/ s max. 217 °C 60 ... 150 s 245 °C ... 260 °C2) 20 s3) 30 s3) 6 °C/ s max. maximum 6 min 6 °C/ s max. maximum 8 min 1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum. Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Please read Cautions and warnings and Important notes at the end of this document. Page 13 of 21 Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) B574**V2/ B57620C5 Standard series Solder joint profiles for silver/nickel/tin terminations 1.1.3 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.1.4 Notes Iron soldering should be avoided, hot air methods are recommended for repair purposes. Please read Cautions and warnings and Important notes at the end of this document. Page 14 of 21 Temperature measurement and compensation SMD NTC thermistors, case size 0805 (2012) 2 B574**V2/ B57620C5 Standard series Conductive adhesion An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 4 Sealing and potting When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. 5 Cleaning If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are permissible. 6 Storage In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: 25 °C up to 45 °C Relative humidity (without condensation): ≤75% annual mean