B57551G1103G007

NTC thermistors for temperature measurement Glass-encapsulated sensors with insulation Series/Type: Date: B57551G, B57551G1 February 2009 © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 Applications Temperature measurement Features Glass-encapsulated NTC thermistor, heat-resistant and highly stable Coating of glass body and leads for electrical insulation For temperature measurement up to 260 °C Short response time Small dimensions Leads: dumet wires (copper-clad FeNi) Options Leads: nickel-plated dumet wires Alternative dimensions available on request Delivery mode Bulk General technical data Climatic category Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity Insulation resistance1) Test voltage1) (IEC 60068-1) (at 25 °C) Dimensional drawing Dimensions in mm (in air) (in air) (V = 100 V DC) (t = 1 s) P25 ∆RR/RR TR δth τc Cth Rins Vtest 55/260/56 32 ±1, ±2, ±3 25 approx. 0.8 approx. 9 approx. 7.2 ≥ 100 500 mW % °C mW/K s mJ/K MΩ V DC 1) Medium: NaCl-solution; Temperature: Room temperature Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 15 Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 Electrical specification and ordering codes R25 Ω 2k 2k 10 k 10 k 10 k 10 k 30 k 30 k 100 k 100 k No. of R/T characteristic 8401 8401 8307 8307 7003 7003 7002 7002 8304 8304 B25/85 K 3420 3420 3478 3478 3612 3612 3973 3973 4072 4072 B0/100 K 3390 ±1% 3390 ±1% 3450 3450 3586 3586 3944 3944 4036 4036 B25/100 K 3436 3436 3492 ±1% 3492 ±1% 3625 ±1% 3625 ±1% 3988 ±1% 3988 ±1% 4092 ±1% 4092 ±1% Ordering code B57551G0202+000 B57551G0202+002 B57551G1103+000 B57551G1103+002 B57551G1103+005 B57551G1103+007 B57551G1303+005 B57551G1303+007 B57551G1104+000 B57551G1104+002 + = Resistance tolerance F = ±1% G = ±2% H = ±3% The last three digits of the ordering code denote: 000 and 005 = dumet wires 002 and 007 = nickel-plated wires Reliability data Test Storage in dry heat Standard IEC 60068-2-2 Test conditions ∆R25/R25 (typical) < 3% Remarks No visible damage Storage in damp heat, steady state Rapid temperature cycling Storage at upper category temperature T: 260 °C t: 1000 h IEC Temperature of air: 85 °C 60068-2-67 Relative humidity of air: 85% Duration: 56 days IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature: 200 °C Number of cycles: 1000 < 2% No visible damage No visible damage < 2% Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 15 Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 R/T characteristics R/T No. T (°C) 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 105.0 110.0 115.0 120.0 125.0 130.0 135.0 140.0 145.0 150.0 155.0 7002 7003 8304 B25/100 = 3988 K B25/100 = 3625 K B25/100 = 4092 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 96.33 66.866 47.037 33.508 24.156 17.613 12.98 9.6643 7.2656 5.5129 4.22 3.2575 2.5348 1.9876 1.5699 1.2488 1.0000 0.80594 0.65355 0.53312 0.43735 0.36074 0.29911 0.24925 0.20872 0.17558 0.14837 0.12592 0.10731 0.091816 0.078862 0.067988 0.058824 0.051071 0.044489 0.03888 0.034084 0.02997 0.02643 0.023373 0.020727 0.018429 0.016427 7.4 7.2 6.9 6.7 6.4 6.2 6.0 5.8 5.6 5.4 5.3 5.1 4.9 4.8 4.6 4.5 4.4 4.3 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.2 3.1 3.0 2.9 2.9 2.8 2.7 2.7 2.6 2.5 2.5 2.4 2.4 2.3 2.3 63.225 45.46 33.07 24.324 18.081 13.575 10.29 7.8716 6.0739 4.7258 3.7062 2.9287 2.3311 1.8684 1.5075 1.224 1.0000 0.82176 0.67909 0.56422 0.47122 0.3955 0.33355 0.2826 0.24049 0.20553 0.17637 0.15195 0.13141 0.11406 0.099352 0.086837 0.076149 0.066989 0.059112 0.052316 0.046433 0.041327 0.03688 0.032998 0.029598 0.026612 0.023984 6.7 6.5 6.3 6.0 5.8 5.6 5.4 5.3 5.1 4.9 4.8 4.6 4.5 4.4 4.2 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 2.9 2.9 2.8 2.7 2.7 2.6 2.5 2.5 2.4 2.4 2.3 2.3 2.2 2.2 2.1 2.1 100.11 69.56 48.945 34.853 25.102 18.275 13.443 9.9853 7.4867 5.6636 4.3212 3.324 2.5769 2.0127 1.5834 1.2542 1.0000 0.80239 0.64776 0.52598 0.4295 0.35262 0.291 0.24136 0.20114 0.16841 0.14164 0.11963 0.10147 0.086407 0.073867 0.063383 0.054584 0.04717 0.040901 0.035581 0.03105 0.027179 0.023861 0.021008 0.018548 0.016419 0.014573 7.4 7.2 6.9 6.7 6.5 6.2 6.0 5.9 5.7 5.5 5.3 5.2 5.0 4.9 4.7 4.6 4.5 4.3 4.2 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.3 3.2 3.1 3.0 3.0 2.9 2.8 2.8 2.7 2.6 2.6 2.5 2.5 2.4 2.4 Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 15 Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 R/T No. T (°C) 160.0 165.0 170.0 175.0 180.0 185.0 190.0 195.0 200.0 205.0 210.0 215.0 220.0 225.0 230.0 235.0 240.0 245.0 250.0 255.0 260.0 265.0 270.0 275.0 280.0 285.0 290.0 295.0 300.0 7002 7003 8304 B25/100 = 3988 K B25/100 = 3625 K B25/100 = 4092 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 0.014679 2.2 0.021665 2.0 0.012967 2.3 0.013149 2.2 0.019613 2.0 0.011566 2.3 0.011806 0.010623 0.0095804 0.0086582 0.0078408 0.0071148 0.0064685 0.005892 0.0053767 0.0049152 0.0045011 0.0041287 0.0037934 0.0034908 0.0032173 0.0029697 0.0027451 0.0025412 0.0023556 0.0021865 0.0020323 0.0018913 0.0017623 0.0016441 0.0015357 0.001436 0.0013444 2.1 2.1 2.0 2.0 2.0 1.9 1.9 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.6 1.5 1.5 1.5 1.5 1.4 1.4 1.4 1.4 1.3 1.3 0.017793 0.016176 0.014735 0.013448 0.012297 0.011265 0.010338 0.009504 0.0087516 0.0080718 0.0074567 0.0068989 0.0063925 0.0059318 0.005512 0.005129 0.004779 0.0044586 0.004165 0.0038955 0.0036478 0.0034199 0.0032098 0.003016 0.002837 0.0026714 0.002518 1.9 1.9 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.5 1.5 1.5 1.5 1.4 1.4 1.4 1.4 1.3 1.3 1.3 1.3 1.2 1.2 1.2 1.2 0.010341 0.0092664 0.0083224 0.0074907 0.0067564 0.0061064 0.0055299 0.0050175 0.0045611 0.0041537 0.0037895 0.0034631 0.0031701 0.0029067 0.0026693 0.0024551 0.0022615 0.0020862 0.0019273 0.0017829 0.0016516 0.0015319 0.0014228 0.0013231 0.0012319 0.0011483 0.0010716 2.2 2.2 2.1 2.1 2.0 2.0 2.0 1.9 1.9 1.9 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.5 1.5 1.5 1.5 1.4 1.4 1.4 1.4 Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 15 Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 R/T characteristics R/T No. T (°C) 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 105.0 110.0 115.0 120.0 125.0 130.0 135.0 140.0 145.0 150.0 155.0 8307 8401 B25/100 = 3492 K B0/100 = 3390 K RT/R25 α (%/K) RT/R25 α (%/K) 52.624 38.452 28.401 21.194 15.972 12.149 9.3246 7.2181 5.6332 4.4308 3.5112 2.8024 2.252 1.8216 1.4827 1.2142 1.0000 0.82818 0.68954 0.57703 0.48525 0.41 0.34798 0.29663 0.25392 0.21824 0.1883 0.16307 0.14174 0.12362 0.10818 0.094973 0.08364 0.073881 0.06545 0.058144 0.051794 0.046259 0.04142 0.037179 0.033451 0.030166 0.027264 6.4 6.2 6.0 5.8 5.6 5.4 5.2 5.0 4.9 4.7 4.6 4.4 4.3 4.2 4.1 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.2 3.1 3.0 2.9 2.8 2.8 2.7 2.6 2.6 2.5 2.5 2.4 2.3 2.3 2.2 2.2 2.1 2.1 2.0 2.0 48.237 35.488 26.39 19.825 15.037 11.511 8.8893 6.9218 5.4326 4.2961 3.422 2.7445 2.2158 1.8002 1.4714 1.2097 1.0000 0.8311 0.69427 0.58282 0.49158 0.41652 0.35446 0.30292 0.25994 0.22392 0.19363 0.16805 0.14636 0.1279 0.11214 0.098635 0.087023 0.077007 0.06834 0.060818 0.05427 0.048554 0.043551 0.039159 0.035294 0.031885 0.02887 6.2 6.0 5.8 5.6 5.4 5.3 5.1 4.9 4.8 4.6 4.5 4.3 4.2 4.1 4.0 3.9 3.8 3.6 3.5 3.5 3.4 3.3 3.2 3.1 3.0 2.9 2.9 2.8 2.7 2.7 2.6 2.5 2.5 2.4 2.4 2.3 2.3 2.2 2.2 2.1 2.1 2.0 2.0 Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 15 Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 R/T No. T (°C) 160.0 165.0 170.0 175.0 180.0 185.0 190.0 195.0 200.0 205.0 210.0 215.0 220.0 225.0 230.0 235.0 240.0 245.0 250.0 255.0 260.0 265.0 270.0 275.0 280.0 285.0 290.0 295.0 300.0 8307 8401 B25/100 = 3492 K B0/100 = 3390 K RT/R25 α (%/K) RT/R25 α (%/K) 0.024694 2.0 0.026197 1.9 0.022414 1.9 0.023822 1.9 0.020385 0.018577 0.016961 0.015514 0.014216 0.013049 0.011999 0.011051 0.010194 0.0094181 0.0087144 0.0080751 0.0074933 0.0069631 0.0064791 0.0060366 0.0056316 0.0052602 0.0049193 0.0046059 0.0043173 0.0040514 0.003806 0.0035793 0.0033696 0.0031753 0.0029952 1.9 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.5 1.5 1.5 1.5 1.4 1.4 1.4 1.4 1.3 1.3 1.3 1.3 1.2 1.2 1.2 1.2 1.2 0.021707 0.01982 0.018132 0.016619 0.01526 0.014038 0.012936 0.011941 0.011041 0.010225 0.0094848 0.0088113 0.0081978 0.0076382 0.0071268 0.006659 0.0062302 0.0058368 0.0054753 0.0051426 0.004836 0.0045532 0.004292 0.0040504 0.0038266 0.0036192 0.0034267 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.5 1.5 1.5 1.4 1.4 1.4 1.3 1.3 1.3 1.3 1.2 1.2 1.2 1.2 1.1 1.1 1.1 1.1 Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 15 Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 Mounting instructions 1 1.1 Soldering Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Dip soldering Bath temperature Soldering time Distance from thermistor max. 260 °C max. 4 s min. 6 mm Iron soldering max. 360 °C max. 2 s min. 6 mm Under more severe soldering conditions the resistance may change. 1.2 Leadless NTC thermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content should be used. In addition, soldering methods should be employed which permit short soldering times. 2 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 3 Robustness of terminations (leaded types) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The bending radius should be at least 0.75 mm. Tensile strength: Test Ua1: Leads 0.25 < 0.35 < 0.50 < 0.80 < ∅ ≤0.25 mm = 1.0 N ∅ ≤0.35 mm = 2.5 N ∅ ≤0.50 mm = 5.0 N ∅ ≤0.80 mm = 10.0 N ∅ ≤1.25 mm = 20.0 N Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 15 Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 Bending strength: Test Ub: Two 90°-bends in opposite directions at a weight of 0.25 kg. Torsional strength: Test Uc: severity 2 The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body. The bending radius of the leads should be approx. 0.75 mm. Two torsions of 180° each (severity 2). When subjecting leads to mechanical stress, the following should be observed: Tensile stress on leads During mounting and operation tensile forces on the leads are to be avoided. Bending of leads Bending of the leads directly on the thermistor body is not permissible. A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet. The bending radius should be at least 0.75 mm. Twisting of leads The twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the thermistor body. 4 Sealing and potting When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. 5 Cleaning If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are permissible. 6 Storage In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 15 Temperature measurement Glass-encapsulated sensors with insulation B57551G, B57551G1 G551/G1551 The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: Relative humidity (without condensation): 25 °C up to 45 °C ≤75% annual mean