NTC thermistors for
temperature measurement
Glass-encapsulated sensors,
standard type
Series/Type:
B57560G1
Date:
January 2018
© EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
Applications
Temperature measurement
Dimensional drawing
Features
Glass-encapsulated, heat-resistive and
highly stable
For temperature measurement up to
300 °C
Leads: dumet wires (copper-clad FeNi)
Options
Leads: nickel-plated dumet wires
Alternative dimensions available on request
Delivery mode
Bulk
Dimensions in mm
Approx. weight 120 mg
General technical data
Climatic category
Max. power
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
Please read Cautions and warnings and
Important notes at the end of this document.
(IEC 60068-1)
(at 25 °C)
(in air)
(in air)
P25
∆RR/RR
TR
δth
τc
Cth
Page 2 of 26
55/300/56
50
±2, ±3
25
approx. 1.3
approx. 15
approx. 20
mW
%
°C
mW/K
s
mJ/K
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
Electrical specification and ordering codes
R25
Ω
2k
2.056 k
5k
10 k
10 k
20 k
50 k
100 k
230 k
No. of R/T
characteristic
8323
7007
8328
8307
7003
8334
8346
8304
8352
B25/85
K
3405
3545
3483
3478
3612
3991
3991
4072
4257
B0/100
K
3378
3516
3456
3450
3586
3965
3965
4036
4216
B25/100
K
3420 ±1%
3560 ±1%
3497 ±1%
3492 ±1%
3625 ±1%
4006 ±1%
4006 ±1%
4092 ±1%
4280 ±1%
Ordering code
B57560G1202+000
B57560G1212+000
B57560G1502+000
B57560G1103+000
B57560G1103+005
B57560G1203+000
B57560G1503+000
B57560G1104+000
B57560G1234+000
+ = Resistance tolerance
G = ±2%
H = ±3%
Note
For ordering code B57560G1202+000 and B57560G1212+000 the R/T curve is defined for short
wire length (5 mm). In dependence of the real wire length of the glass-encapsulated sensor the
wire resistance can be considered for temperatures higher than 100 °C additionally with following
equation:
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
Reliability data
Test
Standard
Storage in
dry heat
IEC
60068-2-2
Storage in damp
heat, steady state
Rapid temperature
cycling
Test conditions
Storage at upper
category temperature
T: 300 °C
t: 1000 h
IEC
Temperature of air: 85 °C
60068-2-67 Relative humidity of air: 85%
Duration: 1000 h
IEC
Lower test temperature: 55 °C
60068-2-14 Upper test temperature: 200 °C
Number of cycles: 1000
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 26
∆R25/R25
(typical)
< 3%
Remarks
< 2%
No visible
damage
< 2%
No visible
damage
No visible
damage
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
Reliability data according to AEC-Q200, Rev. D
Test
Standard
High temperature
exposure (storage)
Operational life
MIL-STD-202,
method 108
MIL-STD-202,
method 108
Temperature
cycling
Terminal strength
(leaded)
Test conditions
Storage at T = +125 °C
t = 1000 h
1000 h / +125 °C
Test voltage max. 0.3 V DC on
NTC1)
JESD 22,
Lower test temperature: 55 °C
method JA-104 Upper test temperature: 125 °C
1000 cycles
Dwell time: max. 30 min at each
temperature
Transition time in air: max. 1 min
MIL-STD-202, Test leaded device integrity
method 211
Condition A: 2.27 N2)
Mechanical shock
MIL-STD-202,
method 213,
condition C
Vibration
MIL-STD-202,
method 204
Acceleration: 40 g 2)
Pulse duration: 6 ms
Number of bumps: 3, each
direction
Acceleration: 5 g
t = 20 min
12 cycles in each of 3 directions
Frequency range: 10 ... 2000 Hz
∆R25/R25
(typical)
< 2%
< 2%
Remarks
No visible
damage
No visible
damage
< 2%
No visible
damage
< 1%
No visible
damage
< 1%
No visible
damage
< 1%
No visible
damage
1) Self heating of the NTC thermistor must not exceed 0.2 K, steady state. Test conditions deviating from AEC-Q200, Rev. D.
2) Deviating from AEC-Q200, Rev. D.
Note
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
R/T characteristics
R/T No.
T (°C)
7003
7007
8304
B25/100 = 3625 K
B25/100 = 3560 K
B25/100 = 4092 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
63.225
45.46
33.07
24.324
18.081
6.7
6.5
6.3
6.0
5.8
55.806
40.684
29.967
22.292
16.742
6.4
6.2
6.0
5.8
5.6
30.0
25.0
20.0
15.0
10.0
13.575
10.29
7.8716
6.0739
4.7258
5.6
5.4
5.3
5.1
4.9
12.689
9.7016
7.4804
5.8147
4.5551
5.5
5.3
5.1
5.0
4.8
18.275
13.443
9.9853
7.4867
5.6636
6.2
6.0
5.9
5.7
5.5
5.0
0.0
5.0
10.0
15.0
3.7062
2.9287
2.3311
1.8684
1.5075
4.8
4.6
4.5
4.4
4.2
3.5950
2.8577
2.2872
1.8427
1.4941
4.7
4.5
4.4
4.3
4.1
4.3212
3.324
2.5769
2.0127
1.5834
5.3
5.2
5.0
4.9
4.7
20.0
25.0
30.0
35.0
40.0
1.224
1.0000
0.82176
0.67909
0.56422
4.1
4.0
3.9
3.8
3.7
1.2188
1.0000
0.82513
0.68452
0.57082
4.0
3.9
3.8
3.7
3.6
1.2542
1.0000
0.80239
0.64776
0.52598
4.6
4.5
4.3
4.2
4.1
45.0
50.0
55.0
60.0
65.0
0.47122
0.3955
0.33355
0.2826
0.24049
3.6
3.5
3.4
3.3
3.2
0.47839
0.40285
0.34081
0.28961
0.24716
3.5
3.4
3.3
3.2
3.1
0.4295
0.35262
0.291
0.24136
0.20114
4.0
3.9
3.8
3.7
3.6
70.0
75.0
80.0
85.0
90.0
0.20553
0.17637
0.15195
0.13141
0.11406
3.1
3.0
2.9
2.9
2.8
0.21180
0.18222
0.15737
0.13642
0.11867
3.0
3.0
2.9
2.8
2.8
0.16841
0.14164
0.11963
0.10147
0.086407
3.5
3.4
3.3
3.3
3.2
95.0
100.0
105.0
110.0
115.0
0.099352
0.086837
0.076149
0.066989
0.059112
2.7
2.7
2.6
2.5
2.5
0.10359
0.090762
0.079765
0.070311
0.062158
2.7
2.6
2.6
2.5
2.4
0.073867
0.063383
0.054584
0.04717
0.040901
3.1
3.0
3.0
2.9
2.8
120.0
125.0
130.0
135.0
140.0
0.052316
0.046433
0.041327
0.03688
0.032998
2.4
2.4
2.3
2.3
2.2
0.055106
0.048989
0.043668
0.039026
0.034966
2.4
2.3
2.3
2.2
2.2
0.035581
0.03105
0.027179
0.023861
0.021008
2.8
2.7
2.6
2.6
2.5
145.0
150.0
155.0
0.029598
0.026612
0.023984
2.2
2.1
2.1
0.031405
0.028274
0.025514
2.1
2.1
2.0
0.018548
0.016419
0.014573
2.5
2.4
2.4
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 26
100.11
69.56
48.945
34.853
25.102
7.4
7.2
6.9
6.7
6.5
Temperature measurement
B57560G1
Glass-encapsulated sensors
R/T No.
T (°C)
160.0
165.0
7003
G1560
7007
8304
B25/100 = 3625 K
B25/100 = 3560 K
B25/100 = 4092 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
0.021665
2.0
0.023075
2.0
0.012967
2.3
0.019613
2.0
0.020914
1.9
0.011566
2.3
170.0
175.0
180.0
185.0
190.0
0.017793
0.016176
0.014735
0.013448
0.012297
1.9
1.9
1.8
1.8
1.8
0.018996
0.017288
0.015765
0.014404
0.013185
1.9
1.9
1.8
1.8
1.8
0.010341
0.0092664
0.0083224
0.0074907
0.0067564
2.2
2.2
2.1
2.1
2.0
195.0
200.0
205.0
210.0
215.0
0.011265
0.010338
0.009504
0.0087516
0.0080718
1.7
1.7
1.7
1.6
1.6
0.012091
0.011106
0.010220
0.0094192
0.0086951
1.7
1.7
1.6
1.6
1.6
0.0061064
0.0055299
0.0050175
0.0045611
0.0041537
2.0
2.0
1.9
1.9
1.9
220.0
225.0
230.0
235.0
240.0
0.0074567
0.0068989
0.0063925
0.0059318
0.005512
1.6
1.5
1.5
1.5
1.5
0.0080391
0.0074438
0.0069025
0.0064096
0.0059601
1.6
1.5
1.5
1.5
1.4
0.0037895
0.0034631
0.0031701
0.0029067
0.0026693
1.8
1.8
1.8
1.7
1.7
245.0
250.0
255.0
260.0
265.0
0.005129
0.004779
0.0044586
0.004165
0.0038955
1.4
1.4
1.4
1.4
1.3
0.0055495
0.0051738
0.0048296
0.0045138
0.0042237
1.4
1.4
1.4
1.3
1.3
0.0024551
0.0022615
0.0020862
0.0019273
0.0017829
1.7
1.6
1.6
1.6
1.5
270.0
275.0
280.0
285.0
290.0
0.0036478
0.0034199
0.0032098
0.003016
0.002837
1.3
1.3
1.3
1.2
1.2
0.0039567
0.0037108
0.0034840
0.0032745
0.0030807
1.3
1.3
1.3
1.2
1.2
0.0016516
0.0015319
0.0014228
0.0013231
0.0012319
1.5
1.5
1.5
1.4
1.4
295.0
300.0
0.0026714
0.002518
1.2
1.2
0.0029014
0.0027351
1.2
1.2
0.0011483
0.0010716
1.4
1.4
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
R/T characteristics
R/T No.
T (°C)
8307
8323
8328
B25/100 = 3492 K
B25/100 = 3420 K
B25/100 = 3497 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
52.624
38.452
28.401
21.194
15.972
6.4
6.2
6.0
5.8
5.6
48.412
35.644
26.508
19.908
15.092
6.2
6.0
5.8
5.6
5.4
54.036
39.297
28.914
21.509
16.168
6.5
6.3
6.0
5.8
5.6
30.0
25.0
20.0
15.0
10.0
12.149
9.3246
7.2181
5.6332
4.4308
5.4
5.2
5.0
4.9
4.7
11.546
8.9102
6.9338
5.4389
4.2991
5.3
5.1
4.9
4.8
4.6
12.272
9.4026
7.2677
5.6650
4.4511
5.4
5.2
5.1
4.9
4.7
5.0
0.0
5.0
10.0
15.0
3.5112
2.8024
2.252
1.8216
1.4827
4.6
4.4
4.3
4.2
4.1
3.4230
2.7446
2.2153
1.7997
1.4710
4.5
4.4
4.2
4.1
4.0
3.5240
2.8103
2.2568
1.8243
1.4841
4.6
4.5
4.3
4.2
4.1
20.0
25.0
30.0
35.0
40.0
1.2142
1.0000
0.82818
0.68954
0.57703
3.9
3.8
3.7
3.6
3.5
1.2094
1.0000
0.83133
0.69471
0.58346
3.9
3.7
3.6
3.5
3.4
1.2147
1.0000
0.82784
0.68898
0.57637
3.9
3.8
3.7
3.6
3.5
45.0
50.0
55.0
60.0
65.0
0.48525
0.41
0.34798
0.29663
0.25392
3.4
3.3
3.2
3.2
3.1
0.49238
0.41744
0.35548
0.30402
0.26108
3.3
3.3
3.2
3.1
3.0
0.48454
0.40928
0.34728
0.29596
0.25330
3.4
3.3
3.2
3.2
3.1
70.0
75.0
80.0
85.0
90.0
0.21824
0.1883
0.16307
0.14174
0.12362
3.0
2.9
2.8
2.8
2.7
0.22509
0.19481
0.16922
0.14752
0.12904
2.9
2.9
2.8
2.7
2.6
0.21766
0.18777
0.16259
0.14130
0.12323
3.0
2.9
2.8
2.8
2.7
95.0
100.0
105.0
110.0
115.0
0.10818
0.094973
0.08364
0.073881
0.06545
2.6
2.6
2.5
2.5
2.4
0.11325
0.099707
0.088055
0.077996
0.069284
2.6
2.5
2.5
2.4
2.3
0.10783
0.094663
0.083366
0.073639
0.065239
2.6
2.6
2.5
2.5
2.4
120.0
125.0
130.0
135.0
140.0
0.058144
0.051794
0.046259
0.04142
0.037179
2.3
2.3
2.2
2.2
2.1
0.061716
0.055121
0.049359
0.044310
0.039873
2.3
2.2
2.2
2.1
2.1
0.057960
0.051635
0.046121
0.041302
0.037079
2.3
2.3
2.2
2.2
2.1
145.0
150.0
155.0
0.033451
0.030166
0.027264
2.1
2.0
2.0
0.035965
0.032513
0.029456
2.0
2.0
2.0
0.033367
0.030096
0.027207
2.1
2.0
2.0
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
R/T No.
T (°C)
160.0
165.0
8307
G1560
8323
8328
B25/100 = 3492 K
B25/100 = 3420 K
B25/100 = 3497 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
0.024694
2.0
0.026744
1.9
0.024642
2.0
0.022414
1.9
0.024331
1.9
0.022365
1.9
170.0
175.0
180.0
185.0
190.0
0.020385
0.018577
0.016961
0.015514
0.014216
1.9
1.8
1.8
1.8
1.7
0.022180
0.020258
0.018537
0.016993
0.015604
1.8
1.8
1.8
1.7
1.7
0.020340
0.018536
0.016926
0.015484
0.014192
1.9
1.8
1.8
1.8
1.7
195.0
200.0
205.0
210.0
215.0
0.013049
0.011999
0.011051
0.010194
0.0094181
1.7
1.7
1.6
1.6
1.6
0.014354
0.013225
0.012205
0.011280
0.010442
1.7
1.6
1.6
1.6
1.5
0.013030
0.011983
0.011039
0.010186
0.0094136
1.7
1.7
1.6
1.6
1.6
220.0
225.0
230.0
235.0
240.0
0.0087144
0.0080751
0.0074933
0.0069631
0.0064791
1.5
1.5
1.5
1.5
1.4
0.0096796
0.0089857
0.0083531
0.0077754
0.0072471
1.5
1.5
1.4
1.4
1.4
0.0087127
0.0080759
0.0074963
0.0069679
0.0064855
1.5
1.5
1.5
1.4
1.4
245.0
250.0
255.0
260.0
265.0
0.0060366
0.0056316
0.0052602
0.0049193
0.0046059
1.4
1.4
1.4
1.3
1.3
0.0067632
0.0063193
0.0059116
0.0055366
0.0051912
1.4
1.3
1.3
1.3
1.3
0.0060444
0.0056404
0.0052700
0.0049299
0.0046171
1.4
1.4
1.3
1.3
1.3
270.0
275.0
280.0
285.0
290.0
0.0043173
0.0040514
0.003806
0.0035793
0.0033696
1.3
1.3
1.2
1.2
1.2
0.0048728
0.0045787
0.0043069
0.0040553
0.0038222
1.3
1.2
1.2
1.2
1.2
0.0043292
0.0040637
0.0038186
0.0035922
0.0033827
1.3
1.3
1.2
1.2
1.2
295.0
300.0
0.0031753
0.0029952
1.2
1.2
0.0036059
0.0034051
1.2
1.1
0.0031886
0.0030086
1.2
1.2
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
R/T characteristics
R/T No.
T (°C)
8334
8346
8352
B25/100 = 4006 K
B25/100 = 4006 K
B25/100 = 4280 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
99.446
68.925
48.394
34.400
24.743
7.5
7.2
6.9
6.7
6.5
99.149
68.776
48.319
34.363
24.725
7.4
7.2
6.9
6.7
6.5
30.0
25.0
20.0
15.0
10.0
17.998
13.232
9.8289
7.3724
5.5816
6.3
6
5.8
5.7
5.5
17.989
13.228
9.8269
7.3715
5.5812
6.3
6
5.8
5.7
5.5
20.444
14.883
10.940
8.1167
6.0763
6.4
6.3
6.1
5.9
5.7
5.0
0.0
5.0
10.0
15.0
4.2635
3.2846
2.5510
1.9968
1.5746
5.3
5.1
5
4.8
4.7
4.2634
3.2845
2.5510
1.9968
1.5746
5.3
5.1
5
4.8
4.7
4.5881
3.4930
2.6805
2.0726
1.6144
5.5
5.4
5.2
5.1
4.9
20.0
25.0
30.0
35.0
40.0
1.2506
1.0000
0.80487
0.65188
0.53115
4.5
4.4
4.3
4.2
4
1.2506
1.0000
0.80487
0.65188
0.53115
4.5
4.4
4.3
4.2
4
1.2663
1.0000
0.79483
0.63570
0.51148
4.8
4.7
4.5
4.4
4.3
45.0
50.0
55.0
60.0
65.0
0.43528
0.35868
0.29714
0.24741
0.20701
3.9
3.8
3.7
3.6
3.5
0.43528
0.35868
0.29714
0.24741
0.20701
3.9
3.8
3.7
3.6
3.5
0.41392
0.33683
0.27556
0.22660
0.18727
4.2
4.1
4.0
3.9
3.8
70.0
75.0
80.0
85.0
90.0
0.17403
0.14696
0.12465
0.10617
0.090792
3.4
3.3
3.3
3.2
3.1
0.17403
0.14697
0.12465
0.10617
0.090793
3.4
3.3
3.3
3.2
3.1
0.15550
0.12972
0.10869
0.091465
0.077286
3.7
3.6
3.5
3.4
3.3
95.0
100.0
105.0
110.0
115.0
0.077946
0.067168
0.058090
0.050414
0.043904
3
2.9
2.9
2.8
2.7
0.077946
0.067168
0.058089
0.050413
0.043899
3
2.9
2.9
2.8
2.7
0.065567
0.055840
0.047739
0.040960
0.035267
3.2
3.2
3.1
3.0
3.0
120.0
125.0
130.0
135.0
140.0
0.038356
0.033613
0.029545
0.026046
0.023026
2.7
2.6
2.6
2.5
2.4
0.038350
0.033608
0.029542
0.026043
0.023024
2.7
2.6
2.6
2.5
2.4
0.030468
0.026407
0.022960
0.020024
0.017515
2.9
2.8
2.8
2.7
2.6
145.0
150.0
155.0
0.020411
0.018142
0.016167
2.4
2.3
2.3
0.020411
0.018142
0.016166
2.4
2.3
2.3
0.015364
0.013515
0.011920
2.6
2.5
2.5
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 26
117.37
80.884
56.404
39.784
28.369
7.6
7.3
7.1
6.9
6.7
Temperature measurement
B57560G1
Glass-encapsulated sensors
R/T No.
T (°C)
160.0
165.0
8334
G1560
8346
8352
B25/100 = 4006 K
B25/100 = 4006 K
B25/100 = 4280 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
0.014442
2.2
0.014442
2.2
0.010541
2.4
0.012933
2.2
0.012932
2.2
0.0093447 2.4
170.0
175.0
180.0
185.0
190.0
0.011609
0.010444
0.0094167
0.0085086
0.0077040
2.1
2.1
2
2
2
0.011607
0.010442
0.0094136
0.0085056
0.0077005
2.1
2.1
2.1
2
2
0.0083046
0.0073978
0.0066052
0.0059108
0.0053008
2.3
2.3
2.2
2.2
2.2
195.0
200.0
205.0
210.0
215.0
0.0069895
0.0063536
0.0057865
0.0052797
0.0048258
1.9
1.9
1.9
1.8
1.8
0.0069856
0.0063495
0.0057822
0.0052752
0.0048212
1.9
1.9
1.9
1.8
1.8
0.0047638
0.0042900
0.0038710
0.0034997
0.0031700
2.1
2.1
2.0
2.0
2.0
220.0
225.0
230.0
235.0
240.0
0.0044186
0.0040525
0.0037229
0.0034254
0.0031566
1.7
1.7
1.7
1.6
1.6
0.0044138
0.0040476
0.0037178
0.0034201
0.0031511
1.7
1.7
1.7
1.7
1.6
0.0028766
0.0026150
0.0023813
0.0021721
0.0019846
1.9
1.9
1.9
1.8
1.8
245.0
250.0
255.0
260.0
265.0
0.0029132
0.0026925
0.0024920
0.0023096
0.0021434
1.6
1.6
1.5
1.5
1.5
0.0029076
0.0026867
0.0024860
0.0023035
0.0021371
1.6
1.6
1.5
1.5
1.5
0.0018161
0.0016646
0.0015280
0.0014046
0.0012931
1.8
1.7
1.7
1.7
1.6
270.0
275.0
280.0
285.0
290.0
0.0019917
0.0018531
0.0017263
0.0016101
0.0015034
1.5
1.4
1.4
1.4
1.4
0.0019853
0.0018466
0.0017197
0.0016034
0.0014966
1.5
1.4
1.4
1.4
1.4
0.0011921
0.0011005
0.0010173
0.00094163
0.00087267
1.6
1.6
1.6
1.5
1.5
295.0
300.0
0.0014054
0.0013153
1.3
1.3
0.0013986
0.0013083
1.3
1.3
0.00080977 1.5
0.00075230 1.5
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
Mounting instructions
1
Soldering
1.1
Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering
Iron soldering
Bath temperature
max. 260 °C
max. 360 °C
Soldering time
max. 4 s
max. 2 s
Distance from thermistor
min. 6 mm
min. 6 mm
Under more severe soldering conditions the resistance may change.
1.1.1
Wave soldering
Temperature characteristic at component terminal with dual wave soldering
1.2
Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
G1560
should be used. In addition, soldering methods should be employed which permit short soldering
times.
1.3
SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The use of no-clean solder products is recommended. In any case
mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.
SMD NTCs with AgPd termination are not approved for lead-free soldering.
Nickel barrier termination
Figure 1
SMD NTC thermistors, structure of nickel
barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metallization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is tested for all commonly-used soldering methods according to IEC
60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended.
The following test and process conditions apply for nickel barrier termination.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
1.3.1
G1560
Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
215 ±3
3 ±0.3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
245 ±3
3 ±0.3
1.3.2
Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
260 ±5
10 ±1
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
260 ±5
10 ±1
1.3.3
Reflow soldering
Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
Profile feature
Preheat and soak
- Temperature min
- Temperature max
- Time
G1560
Sn-Pb eutectic assembly
Pb-free assembly
Tsmin
Tsmax
tsmin to tsmax
100 °C
150 °C
60 ... 120 s
150 °C
200 °C
60 ... 120 s
Average ramp-up rate
Tsmax to Tp
3 °C/ s max.
3 °C/ s max.
Liquidous temperature
Time at liquidous
TL
tL
183 °C
40 ... 150 s
217 °C
40 ... 150 s
Peak package body temperature
Tp
215 °C ... 260 °C1)
235 °C ... 260 °C
Time above (TP 5 °C)
tp
10 ... 40 s
10 ... 40 s
Average ramp-down rate
Tp to Tsmax
6 °C/ s max.
6 °C/ s max.
max. 8 minutes
max. 8 minutes
Time 25 °C to peak temperature
1) Depending on package thickness.
Notes:
All temperatures refer to topside of the package, measured on the package body
surface.
Number of reflow cycles: 3
Iron soldering should be avoided, hot air methods are recommended for repair
purposes.
Solder joint profiles for silver/nickel/tin terminations
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
1.3.4
G1560
Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
A
B
C
0402/1005
0.6
0.6
1.7
0603/1608
1.0
1.0
3.0
0805/2012
1.3
1.2
3.4
1206/3216
1.8
1.2
4.5
2
Conductive adhesion
An alternative to soldering for silver-palladium terminated components is the gluing of thermistors
with conductive adhesives. The benefit of this method is that it involves no thermal stress. The
adhesives used must be chemically inert.
3
Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4
Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
Tensile strength:
G1560
Test Ua1:
Value of applied force for Ua1 test:
Diameter (d) of
Force with tolerance of ±10%
corresponding round leads
∅ ≤ 0.25 mm
1.0 N
0.25 < ∅ ≤ 0.35 mm
2.5 N
0.35 < ∅ ≤ 0.50 mm
5.0 N
0.50 < ∅ ≤ 0.80 mm
10.0 N
Bending strength: Test Ub:
Two 90°-bends in opposite directions
Value of applied force for Ub test:
Diameter (d) of
Force with tolerance of ±10%
corresponding round leads
∅ ≤ 0.25 mm
0.5 N
0.25 < ∅ ≤ 0.35 mm
1.25 N
0.35 < ∅ ≤ 0.50 mm
2.5 N
0.50 < ∅ ≤ 0.80 mm
5N
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 26
Temperature measurement
B57560G1
Glass-encapsulated sensors
5
G1560
Sealing and potting
Sealing or potting processes can affect the reliability of the component.
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
As thermistors are temperature sensitive components it should be considered that molding can affect the thermal surrounding and may influence e.g. the response time.
Extensive testing is encouraged in order to determine whether overmolding or potting influences
the functionality and/ or reliability of the component.
6
Cleaning
Cleaning processes can affect the reliability of the component.
If cleaning is necessary, mild cleaning agents are recommended. Cleaning agents based on water are not allowed. Washing processes may damage the product due to the possible static or
cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks which might lead to reduced reliability and/ or lifetime.
7
Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
25 °C up to 45 °C
Relative humidity (without condensation):
≤75% annual mean
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