NTC thermistors for
temperature measurement
Miniature sensors
with bendable wires
Series/Type:
B57861S
Date:
December 2010
© EPCOS AG 2010. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Temperature measurement
B57861S
Miniature sensors with bendable wires
Applications
Temperature measurement
Features
Short response time
High measuring accuracy
Tight B value tolerances
available
Epoxy resin encapsulation
PTFE-insulated leads of
silver-plated
nickel wire, AWG 30
Different lead length available
(50 mm and 350 mm)
UL approval (E69802)
S861
Dimensional drawings
Length
50 mm
350 mm
Options
Alternative lead lengths on
request
Delivery mode
Bulk
Dimensions in mm
General technical data
Climatic category
Max. power
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
Please read Cautions and warnings and
Important notes at the end of this document.
(IEC 60068-1)
(at 25 °C)
(in air)
(in air)
P25
∆RR/RR
TR
δth
τc
Cth
Page 2 of 14
55/155/56
60
±1, ±3, ±5
25
approx. 1.5
approx. 15
approx. 22.5
mW
%
°C
mW/K
s
mJ/K
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Electrical specification and ordering codes
R25
Ω
Component length
mm
No. of R/T
characteristic
B25/100
K
B value tolerance = 0.3%, resistance tolerance = ±1%
5k
50
8016
3988 ±0.3%
10 k
50
8016
3988 ±0.3%
30 k
50
8018
3964 ±0.3%
B value tolerance = 1%, resistance tolerance = ±1%
10 k
350
8016
3988 ±1%
B value tolerance = 1.0%, resistance tolerance = ±1%, ±3% or ±5%
2k
50
1008
3560 ±1%
3k
50
8016
3988 ±1%
5k
50
8016
3988 ±1%
10 k
50
8016
3988 ±1%
30 k
50
8018
3964 ±1%
50 k
50
2901
3760 ±1%
100 k
50
2014
4540 ±1%
Ordering code
B57861S0502F045
B57861S0103F045
B57861S0303F045
B57861S0103A039
B57861S0202+040
B57861S0302+040
B57861S0502+040
B57861S0103+040
B57861S0303+040
B57861S0503+040
B57861S0104+040
+ = Resistance tolerance
F = ±1%
H = ±3%
J = ±5%
Reliability data
Test
Standard
Storage in
dry heat
IEC
60068-2-2
Storage in damp
heat, steady state
Rapid temperature
cycling
Long-term stability
(empirical value)
Test conditions
Storage at upper
category temperature
T: 155 °C
t: 1000 h
IEC
Temperature of air: 40 °C
60068-2-78 Relative humidity of air: 93%
Duration: 56 days
IEC
Lower test temperature: 55 °C
60068-2-14 Upper test temperature: 155 °C
Number of cycles: 100
Temperature: 70 °C
t: 10000 h
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 14
∆R25/R25
(typical)
< 2%
Remarks
< 1%
No visible
damage
< 1%
No visible
damage
< 2%
No visible
damage
No visible
damage
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
R/T characteristics
R/T No.
T (°C)
1008
2014
2901
B25/100 = 3560 K
B25/100 = 4540 K
B25/100 = 3760 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
53.104
39.318
29.325
22.03
16.666
6.1
6.0
5.8
5.7
5.5
30.0
25.0
20.0
15.0
10.0
12.696
9.7251
7.5171
5.8353
4.5686
5.4
5.2
5.1
4.9
4.8
5.0
0.0
5.0
10.0
15.0
3.605
2.8665
2.2907
1.8438
1.492
20.0
25.0
30.0
35.0
40.0
7.8
7.6
7.3
7.1
6.9
63.969
46.179
33.738
24.927
18.611
6.7
6.4
6.2
6.0
5.8
23.302
16.77
12.186
8.937
6.6125
6.7
6.5
6.3
6.1
5.9
14.033
10.679
8.198
6.3123
4.9014
5.6
5.4
5.3
5.2
5.1
4.7
4.5
4.4
4.3
4.1
4.9342
3.712
2.8145
2.15
1.6544
5.8
5.6
5.5
5.3
5.2
3.821
3.0027
2.3801
1.9
1.5257
4.9
4.7
4.6
4.5
4.3
1.2154
1.0000
0.82976
0.68635
0.57103
4.0
3.9
3.8
3.7
3.6
1.2819
1.0000
0.78514
0.62031
0.49304
5.0
4.9
4.8
4.7
4.5
1.233
1.0000
0.81679
0.67166
0.55527
4.3
4.1
4.0
3.9
3.8
45.0
50.0
55.0
60.0
65.0
0.48015
0.40545
0.3417
0.28952
0.24714
3.5
3.4
3.3
3.2
3.1
0.39417
0.3169
0.25616
0.20815
0.17
4.4
4.3
4.2
4.1
4.0
0.46095
0.38459
0.32184
0.27068
0.22907
3.8
3.7
3.6
3.5
3.3
70.0
75.0
80.0
85.0
90.0
0.21183
0.18194
0.1568
0.13592
0.11822
3.1
3.0
2.9
2.8
2.8
0.13952
0.11505
0.095302
0.079296
0.066263
3.9
3.8
3.7
3.6
3.5
0.19468
0.16607
0.14221
0.12218
0.10533
3.2
3.1
3.1
3.0
2.9
95.0
100.0
105.0
110.0
115.0
0.1034
0.090741
0.079642
0.070102
0.061889
2.7
2.6
2.6
2.5
2.4
0.055601
0.046843
0.039618
0.033634
0.028658
3.5
3.4
3.3
3.2
3.2
0.09123
0.079284
0.069062
0.06034
0.052886
2.8
2.8
2.7
2.7
2.6
120.0
125.0
130.0
135.0
140.0
0.054785
0.048706
0.043415
0.038722
0.034615
2.4
2.3
2.3
2.2
2.2
0.024505
0.021026
0.018101
0.015633
0.013544
3.1
3.0
3.0
2.9
2.8
0.046482
0.040985
0.036233
0.032101
0.02851
2.5
2.5
2.5
2.4
2.4
145.0
150.0
155.0
0.031048
0.02791
0.025193
2.1
2.1
2.0
0.011769
0.010258
0.0089659
2.8
2.7
2.7
0.025373
0.022633
0.020231
2.3
2.3
2.3
Please read Cautions and warnings and
Important notes at the end of this document.
142
96.615
66.562
46.4
32.708
Page 4 of 14
Temperature measurement
B57861S
Miniature sensors with bendable wires
R/T No.
T (°C)
160.0
165.0
S861
1008
2014
2901
B25/100 = 3560 K
RT/R25
α (%/K)
0.02279
2.0
0.020667
2.0
B25/100 = 4540 K
RT/R25
α (%/K)
B25/100 = 3760 K
RT/R25
α (%/K)
170.0
175.0
180.0
185.0
190.0
0.01878
0.01709
0.015582
0.014227
0.013012
1.9
1.9
1.8
1.8
1.8
195.0
200.0
205.0
210.0
215.0
0.011934
0.010964
0.0101
0.0093191
0.0085949
1.7
1.7
1.7
1.6
1.6
220.0
225.0
230.0
235.0
240.0
0.0079384
0.0073411
0.006798
0.0063087
0.0058623
1.6
1.5
1.5
1.5
1.5
245.0
250.0
0.0054487
0.0050705
1.4
1.4
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 14
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
R/T characteristics
R/T No.
T (°C)
8016
8018
55.0
50.0
45.0
40.0
35.0
96.3
67.01
47.17
33.65
24.26
7.4
7.2
6.9
6.7
6.4
30.24
22.1
6.3
6.1
30.0
25.0
20.0
15.0
10.0
17.7
13.04
9.707
7.293
5.533
6.2
6.0
5.8
5.6
5.5
16.32
12.17
9.153
6.945
5.313
5.9
5.8
5.6
5.4
5.2
5.0
0.0
5.0
10.0
15.0
4.232
3.265
2.539
1.99
1.571
5.3
5.1
5.0
4.8
4.7
4.097
3.183
2.491
1.963
1.557
5.1
4.9
4.8
4.7
4.6
20.0
25.0
30.0
35.0
40.0
1.249
1.0000
0.8057
0.6531
0.5327
4.5
4.4
4.3
4.1
4.0
1.244
1.0000
0.8083
0.6572
0.5373
4.4
4.3
4.2
4.1
4.0
45.0
50.0
55.0
60.0
65.0
0.4369
0.3603
0.2986
0.2488
0.2083
3.9
3.8
3.7
3.6
3.5
0.4418
0.365
0.303
0.2527
0.2118
3.9
3.7
3.7
3.6
3.5
70.0
75.0
80.0
85.0
90.0
0.1752
0.1481
0.1258
0.1072
0.09177
3.4
3.3
3.2
3.2
3.1
0.1783
0.1508
0.128
0.1091
0.0933
3.4
3.3
3.2
3.2
3.1
95.0
100.0
105.0
110.0
115.0
0.07885
0.068
0.05886
0.05112
0.04454
3.0
2.9
2.9
2.8
2.7
0.08016
0.0691
0.05974
0.05183
0.04512
3.0
2.9
2.9
2.8
2.8
120.0
125.0
130.0
135.0
140.0
0.03893
0.03417
0.03009
0.02654
0.02348
2.6
2.6
2.5
2.5
2.4
0.0394
0.0345
0.03032
0.02672
0.02361
2.7
2.6
2.6
2.5
2.5
145.0
150.0
155.0
0.02083
0.01853
0.01653
2.4
2.3
2.3
0.02091
0.01857
0.016537
2.4
2.4
2.3
B25/100 = 3988 K
B25/100 = 3964 K
RT/R25
α (%/K) RT/R25
α (%/K)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 14
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Mounting instructions
1
Soldering
1.1
Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering
Iron soldering
Bath temperature
max. 260 °C
max. 360 °C
Soldering time
max. 4 s
max. 2 s
Distance from thermistor
min. 6 mm
min. 6 mm
Under more severe soldering conditions the resistance may change.
1.2
Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
times.
2
Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
3
Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Tensile strength:
Test Ua1:
Leads
0.25 <
0.35 <
0.50 <
0.80 <
Please read Cautions and warnings and
Important notes at the end of this document.
∅ ≤0.25 mm = 1.0 N
∅ ≤0.35 mm = 2.5 N
∅ ≤0.50 mm = 5.0 N
∅ ≤0.80 mm = 10.0 N
∅ ≤1.25 mm = 20.0 N
Page 7 of 14
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Bending strength: Test Ub:
Two 90°-bends in opposite directions at a weight of 0.25 kg.
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Twisting of leads
The twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the
thermistor body.
4
Sealing and potting
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
5
Cleaning
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are
permissible.
6
Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 14
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
25 °C up to 45 °C
Relative humidity (without condensation):
≤75% annual mean
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