B57861S0502040

NTC thermistors for temperature measurement Miniature sensors with bendable wires Series/Type: Date: B57861S February 2009 © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Temperature measurement Miniature sensors with bendable wires B57861S S861 Applications Temperature measurement Features Short response time High measuring accuracy Tight B value tolerances available Epoxy resin encapsulation PTFE-insulated leads of silver-plated nickel wire, AWG 30 UL approval (E69802) Options Alternative lead lengths on request Delivery mode Bulk Dimensional drawing Dimensions in mm Approx. weight 60 mg General technical data Climatic category Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity (IEC 60068-1) (at 25 °C) 55/155/56 60 ±1, ±3, ±5 25 approx. 1.5 approx. 15 approx. 22.5 (in air) (in air) P25 ∆RR/RR TR δth τc Cth mW % °C mW/K s mJ/K Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 15 Temperature measurement Miniature sensors with bendable wires B57861S S861 Electrical specification and ordering codes R25 Ω No. of R/T characteristic B25/100 K Ordering code B value tolerance = 0.3%, resistance tolerance = ±1% 5k 8016 3988 ±0.3% 10 k 8016 3988 ±0.3% 30 k 8018 3964 ±0.3% B value tolerance = 1.0%, resistance tolerance = ±1%, ±3% or ±5% 2k 1008 3560 ±1% 3k 8016 3988 ±1% 5k 8016 3988 ±1% 10 k 8016 3988 ±1% 30 k 8018 3964 ±1% 50 k 2901 3760 ±1% 100 k 2014 4540 ±1% + = Resistance tolerance F = ±1% H = ±3% J = ±5% B57861S0502F045 B57861S0103F045 B57861S0303F045 B57861S0202+040 B57861S0302+040 B57861S0502+040 B57861S0103+040 B57861S0303+040 B57861S0503+040 B57861S0104+040 Reliability data Test Storage in dry heat Standard IEC 60068-2-2 Test conditions ∆R25/R25 (typical) < 2% Remarks No visible damage Storage in damp heat, steady state Rapid temperature cycling Long-term stability (empirical value) Storage at upper category temperature T: 155 °C t: 1000 h IEC Temperature of air: 40 °C 60068-2-78 Relative humidity of air: 93% Duration: 56 days IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature: 155 °C Number of cycles: 100 Temperature: 70 °C t: 10000 h < 1% No visible damage No visible damage No visible damage < 1% < 2% Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 15 Temperature measurement Miniature sensors with bendable wires B57861S S861 R/T characteristics R/T No. T (°C) 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 105.0 110.0 115.0 120.0 125.0 130.0 135.0 140.0 145.0 150.0 155.0 1008 2014 2901 B25/100 = 3560 K B25/100 = 4540 K B25/100 = 3760 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 53.104 39.318 29.325 22.03 16.666 12.696 9.7251 7.5171 5.8353 4.5686 3.605 2.8665 2.2907 1.8438 1.492 1.2154 1.0000 0.82976 0.68635 0.57103 0.48015 0.40545 0.3417 0.28952 0.24714 0.21183 0.18194 0.1568 0.13592 0.11822 0.1034 0.090741 0.079642 0.070102 0.061889 0.054785 0.048706 0.043415 0.038722 0.034615 0.031048 0.02791 0.025193 6.1 6.0 5.8 5.7 5.5 5.4 5.2 5.1 4.9 4.8 4.7 4.5 4.4 4.3 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.1 3.0 2.9 2.8 2.8 2.7 2.6 2.6 2.5 2.4 2.4 2.3 2.3 2.2 2.2 2.1 2.1 2.0 142 96.615 66.562 46.4 32.708 23.302 16.77 12.186 8.937 6.6125 4.9342 3.712 2.8145 2.15 1.6544 1.2819 1.0000 0.78514 0.62031 0.49304 0.39417 0.3169 0.25616 0.20815 0.17 0.13952 0.11505 0.095302 0.079296 0.066263 0.055601 0.046843 0.039618 0.033634 0.028658 0.024505 0.021026 0.018101 0.015633 0.013544 0.011769 0.010258 0.0089659 7.8 7.6 7.3 7.1 6.9 6.7 6.5 6.3 6.1 5.9 5.8 5.6 5.5 5.3 5.2 5.0 4.9 4.8 4.7 4.5 4.4 4.3 4.2 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.5 3.4 3.3 3.2 3.2 3.1 3.0 3.0 2.9 2.8 2.8 2.7 2.7 63.969 46.179 33.738 24.927 18.611 14.033 10.679 8.198 6.3123 4.9014 3.821 3.0027 2.3801 1.9 1.5257 1.233 1.0000 0.81679 0.67166 0.55527 0.46095 0.38459 0.32184 0.27068 0.22907 0.19468 0.16607 0.14221 0.12218 0.10533 0.09123 0.079284 0.069062 0.06034 0.052886 0.046482 0.040985 0.036233 0.032101 0.02851 0.025373 0.022633 0.020231 6.7 6.4 6.2 6.0 5.8 5.6 5.4 5.3 5.2 5.1 4.9 4.7 4.6 4.5 4.3 4.3 4.1 4.0 3.9 3.8 3.8 3.7 3.6 3.5 3.3 3.2 3.1 3.1 3.0 2.9 2.8 2.8 2.7 2.7 2.6 2.5 2.5 2.5 2.4 2.4 2.3 2.3 2.3 Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 15 Temperature measurement Miniature sensors with bendable wires B57861S S861 R/T No. T (°C) 160.0 165.0 170.0 175.0 180.0 185.0 190.0 195.0 200.0 205.0 210.0 215.0 220.0 225.0 230.0 235.0 240.0 245.0 250.0 1008 2014 2901 B25/100 = 3560 K B25/100 = 4540 K B25/100 = 3760 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 0.02279 2.0 0.020667 2.0 0.01878 0.01709 0.015582 0.014227 0.013012 0.011934 0.010964 0.0101 0.0093191 0.0085949 0.0079384 0.0073411 0.006798 0.0063087 0.0058623 0.0054487 0.0050705 1.9 1.9 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.5 1.5 1.5 1.5 1.4 1.4 Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 15 Temperature measurement Miniature sensors with bendable wires B57861S S861 R/T characteristics R/T No. T (°C) 55.0 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 105.0 110.0 115.0 120.0 125.0 130.0 135.0 140.0 145.0 150.0 155.0 8016 8018 B25/100 = 3988 K B25/100 = 3964 K RT/R25 α (%/K) RT/R25 α (%/K) 96.3 67.01 47.17 33.65 24.26 17.7 13.04 9.707 7.293 5.533 4.232 3.265 2.539 1.99 1.571 1.249 1.0000 0.8057 0.6531 0.5327 0.4369 0.3603 0.2986 0.2488 0.2083 0.1752 0.1481 0.1258 0.1072 0.09177 0.07885 0.068 0.05886 0.05112 0.04454 0.03893 0.03417 0.03009 0.02654 0.02348 0.02083 0.01853 0.01653 7.4 7.2 6.9 6.7 6.4 6.2 6.0 5.8 5.6 5.5 5.3 5.1 5.0 4.8 4.7 4.5 4.4 4.3 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.2 3.1 3.0 2.9 2.9 2.8 2.7 2.6 2.6 2.5 2.5 2.4 2.4 2.3 2.3 30.24 22.1 16.32 12.17 9.153 6.945 5.313 4.097 3.183 2.491 1.963 1.557 1.244 1.0000 0.8083 0.6572 0.5373 0.4418 0.365 0.303 0.2527 0.2118 0.1783 0.1508 0.128 0.1091 0.0933 0.08016 0.0691 0.05974 0.05183 0.04512 0.0394 0.0345 0.03032 0.02672 0.02361 0.02091 0.01857 0.016537 6.3 6.1 5.9 5.8 5.6 5.4 5.2 5.1 4.9 4.8 4.7 4.6 4.4 4.3 4.2 4.1 4.0 3.9 3.7 3.7 3.6 3.5 3.4 3.3 3.2 3.2 3.1 3.0 2.9 2.9 2.8 2.8 2.7 2.6 2.6 2.5 2.5 2.4 2.4 2.3 Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 15 Temperature measurement Miniature sensors with bendable wires B57861S S861 Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 15 Temperature measurement Miniature sensors with bendable wires B57861S S861 Mounting instructions 1 1.1 Soldering Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Dip soldering Bath temperature Soldering time Distance from thermistor max. 260 °C max. 4 s min. 6 mm Iron soldering max. 360 °C max. 2 s min. 6 mm Under more severe soldering conditions the resistance may change. 1.2 Leadless NTC thermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content should be used. In addition, soldering methods should be employed which permit short soldering times. 2 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 3 Robustness of terminations (leaded types) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The bending radius should be at least 0.75 mm. Tensile strength: Test Ua1: Leads 0.25 < 0.35 < 0.50 < 0.80 < ∅ ≤0.25 mm = 1.0 N ∅ ≤0.35 mm = 2.5 N ∅ ≤0.50 mm = 5.0 N ∅ ≤0.80 mm = 10.0 N ∅ ≤1.25 mm = 20.0 N Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 15 Temperature measurement Miniature sensors with bendable wires B57861S S861 Bending strength: Test Ub: Two 90°-bends in opposite directions at a weight of 0.25 kg. Torsional strength: Test Uc: severity 2 The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body. The bending radius of the leads should be approx. 0.75 mm. Two torsions of 180° each (severity 2). When subjecting leads to mechanical stress, the following should be observed: Tensile stress on leads During mounting and operation tensile forces on the leads are to be avoided. Bending of leads Bending of the leads directly on the thermistor body is not permissible. A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet. The bending radius should be at least 0.75 mm. Twisting of leads The twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the thermistor body. 4 Sealing and potting When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. 5 Cleaning If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are permissible. 6 Storage In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 15 Temperature measurement Miniature sensors with bendable wires B57861S S861 The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: Relative humidity (without condensation): 25 °C up to 45 °C ≤75% annual mean