Microwave Ceramics and Modules 2-Pole Filter for W-CDMA
Preliminary Data Sheet
Filter B69812N2147A360
Features SMD filter consisting of coupled resonators with stepped impedances (NdBa)TiO3 (εr = 88 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm) Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 Component drawing Recommended footprint, Marking Page 3 Characteristics Maximum ratings Typical passband characteristic Page 4 Processing information Soldering requirements Delivery mode
ISSUE DATE
28.06.04
ISSUE
P4
PUBLISHER
SAW MWC PD
PAGE
1/4
Microwave Ceramics and Modules 2-Pole Filter for W-CDMA
Preliminary Data Sheet
Filter B69812N2147A360
Component drawing
View from below onto the solder terminals and view from beside
Recommended footprint
Marking
yww
A360
ISSUE DATE
28.06.04
ISSUE
P4
PUBLISHER
SAW MWC PD
PAGE
2/4
Microwave Ceramics and Modules 2-Pole Filter for W-CDMA
Preliminary Data Sheet Characteristics min. Center frequency Insertion loss Passband Amplitude ripple (peak - peak) Standing wave ratio Impedance Power Attenuation at 1920 to 1980 MHz fc αIL B 60 ∆α SWR Z P α 30 35 typ. 2140 1.5
Filter B69812N2147A360
max. 2.0 MHz dB MHz
0.5 1.5 50
1.0 2.0
dB Ω
1.0
W dB
Maximum ratings IEC climatic category (IEC 68-1) Operating temperature Typical passband characteristic - 40/+ 90/56 Top -40 / +85 °C
0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50
attenuation [dB]
1.8 1.83 1.85 1.88 1.9 1.93 1.95 1.98 2 2.03 2.05 2.08 2.1 2.13 2.15 2.18 2.2 2.23 2.25 2.28
DB[S11] DB[S21]
frequency [GHz]
ISSUE DATE
28.06.04
ISSUE
P4
PUBLISHER
SAW MWC PD
PAGE
3/4
Microwave Ceramics and Modules 2-Pole Filter for W-CDMA
Preliminary Data Sheet Processing information Wettability to IEC 68-2-58: ≥ 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) Recommended soldering conditions (infrared):
Temp. [°C] within 10 sec.
Filter B69812N2147A360
Profile for leadfree solder paste reflow 260 (max. 2 sec.) °C 250 (max. 10 sec.) °C
Temp. [°C]
within 10 sec.
215°C±10°C
245°C±5°C
20-40 sec. 40-80 sec.
Time [sec.]
30 sec. 2.5 °C/s 2-3 min.
Time [sec.] > - 5 °C/s
Delivery mode Blister tape acc. to IEC 286-3, PS , grey Pieces/tape: 3000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
ISSUE DATE
28.06.04
ISSUE
P4
PUBLISHER
SAW MWC PD
PAGE
4/4
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