B81123C1332M

Film Capacitors EMI Suppression Capacitors (MKP) Series/Type: B81123 Date: June 2020 © TDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. EMI suppression capacitors (MKP) B81123 Y1 / 500 V AC Typical applications Y1 class for interference suppression "Line to ground" applications Double insulation Dimensional drawing Climatic Max. operating temperature: 110 °C Climatic category (IEC 60068-1:2013): 40/110/56 Construction Dielectric: polypropylene (MKP) Internal series connection Plastic case (UL 94 V-0) Epoxy resin sealing (UL 94 V-0) Features Self-healing properties RoHS-compatible AEC-Q200D compliant Dimensions in mm Lead spacing ±0.4 15, 22.5 Terminals Parallel wire leads, lead-free tinned Standard lead lengths: 6 1 mm Special lead lengths available on request Marking Manufacturer's logo, lot number, date code, rated capacitance (coded), cap. tolerance (code letter), rated AC voltage, series number, sub-class (Y1), dielectric code (MKP), climatic category, passive flammability category, approvals. Delivery mode Bulk (untaped) Taped (Ammo pack or reel) For taping details, refer to chapter "Taping and packing". Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 19 Lead diameter d1 0.8 B81123 Y1 / 500 V AC Marking example (position of marks may vary): Approvals Approval marks Notes: Standards EN 60384-14:2014/A1:2016 IEC 60384-14:2013/AMD1:2016 Certificate UL 60384-14:2014, CSA E60348-14 E97863 ENEC-01093 Effective January 2014, only for EMI supression capacitors:  UL 60384-14:2014 certification replaces both UL 1414:2000 and UL 1283:2005 standards.  CSA C22.2 No.1:2004 and CSA C22.2 No.8:2013 are replaced by CSA E60384-14:2013.  References like 1414, 1283 are removed from the capacitor marking. Capacitors under UL 1414:2000, UL 1283:2005 produced during or before 2013, are accepted under UL scope. Capacitors under CSA C22.2 No.1:2004 / CSA C22.2 No.8:2013 produced during or before 2013, are accepted under UL scope. Overview of available types Lead spacing 15 mm 22.5 mm CR (μF) 0.0010 0.0015 0.0022 0.0033 0.0047 0.0056 0.0068 0.010 Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 19 B81123 Y1 / 500 V AC Ordering codes and packing units Lead spacing mm 15 22.5 CR μF 0.0010 0.0015 0.0022 0.0033 0.0047 0.0056 0.0068 0.010 Max. dimensions w×h×l mm 5.0 × 10.5 × 18.0 6.0 × 11.0 × 18.0 7.0 × 12.5 × 18.0 8.5 × 14.5 × 18.0 9.0 × 17.5 × 18.0 7.0 × 16.0 × 26.5 8.5 × 16.5 × 26.5 10.5 × 18.5 × 26.5 Ordering code (composition see below) B81123C1102M*** B81123C1152M*** B81123C1222M*** B81123C1332M*** B81123C1472M*** B81123C1562M*** B81123C1682M*** B81123C1103M*** Ammo pack pcs./MOQ 4680 3840 3320 2720 2560 2320 1920 1560 Reel Untaped pcs./MOQ 5200 4400 3600 2800 2800 2400 2000 1600 pcs./MOQ 4000 4000 4000 2000 2000 2520 2040 2160 MOQ = Minimum Order Quantity, consisting of 4 packing units. Composition of ordering code + = Capacitance tolerance code: M = ±20% Please read Cautions and warnings and Important notes at the end of this document. *** = Packaging code: 289 = Straight terminals, Ammo pack 189 = Straight terminals, Reel 003 = Straight terminals, untaped (lead length 3.2 ±0.3 mm) 000 = Straight terminals, untaped (lead length 6 1 mm) Page 4 of 19 B81123 Y1 / 500 V AC Technical data Reference standard: IEC 60384-14:2013/AMD1:2016 / UL 60384-14:2014/A1:2016. All data given at T = 20 °C, unless otherwise specified. Max. operating temperature Top,max Dissipation factor tan δ (in 10-3) at 20 °C (upper limit values) Insulation resistance Rins or time constant τ = CR  Rins at 20 °C, rel. humidity ≤ 65% (minimum as-delivered values) DC test voltage +110 °C at 1 kHz at 100 kHz 30 000 MΩ 1.0 5.0 4800 V, 2 s The repetition of this DC voltage test may damage the capacitor. Special care must be taken in case of use several capacitors in a parallel configuration. Passive flammability category B Maximum continuous AC voltage VAC at Top ≤ 85 °C 750 V (50/60 Hz) Rated AC voltage 500 V (50/60 Hz) (UL 60384-14:2014) Maximum continuous DC voltage VDC 3000 V at Top ≤ 85 °C 1.5% / °C derating when 85 °C < Top ≤ 110 °C Operating AC voltage Vop at high Top ≤ 110 °C Vop = VAC (continuously) temperature Top ≤ 110 °C Vop = 1.25  VAC (1000 h) Damp heat test Limit values after damp heat test Please read Cautions and warnings and Important notes at the end of this document. 56 days / 40 °C / 93% relative humidity Capacitance change ΔC/C ≤ 5% Dissipation factor change Δ tan δ ≤ 5.10-3 (at 1 kHz) ≤ 1.0  10-3 (at 100 kHz) Insulation resistance Rins ≥ 50% of minimum as-delivered values or time constant τ = CR  Rins Page 5 of 19 B81123 Y1 / 500 V AC Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/μs. "k0" represents the maximum permissible pulse characteristic of the waveform applied to the capacitor, expressed in V2/μs. Note: The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the capacitor. dV/dt and k0 values Lead spacing dV/dt in V/μs k0 in V2/μs 15 mm 22.5 mm 1 000 700 000 3 000 2 100 000 Impedance Z versus frequency f (typical values) Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 19 B81123 Y1 / 500 V AC Testing and Standards Test Reference Electrical IEC parameters 60384-14:2013/ AMD1:2016 Conditions of test Voltage Proof: Between terminals: 4000 V AC, 1 min Terminals and enclosure: 4000 V AC, 1 min Insulation resistance, Rins Capacitance, C Dissipation factor, tan δ Robustness IEC Tensile strength (test Ua1) of termina- 60068-2-21:2006 Wire diameter Tensile tions force 0.5 < d1 ≤ 0.8 mm 10 N 0.8 < d1 ≤ 1.25 mm 20 N Solder bath temperature at Resistance IEC to soldering 60068-2-20:2008, 260 ±5 °C, immersion for test Tb, 10 seconds heat method 1A Performance requirements Within specified limits Capacitance and tan δ within specified limits ΔC/C0 ≤ 5% tan δ within specified limits Rapid IEC change of 60384-14:2013/ temperature AMD1:2016 TA = lower category temperature No visible damage TB = upper category temperature ΔC/C0 ≤ 5% Five cycles, duration t = 30 min. tan δ within specified limits Vibration IEC 60384-14:2013/ AMD1:2016 Bump IEC 60384-14:2013/ AMD1:2016 Test FC: vibration sinusoidal No visible damage Displacement: 0.75 mm Accleration: 98 m/s2 Frequency: 10 Hz ... 500 Hz Test duration: 3 orthogonal axes, 2 hours each axe Test Eb: Total 4000 bumps with No visible damage ΔC/C0 ≤ 5% 400 m/s2 mounted on PCB tan δ within specified limits 6 ms duration Climatic sequence IEC 60384-14:2013/ AMD1:2016 Please read Cautions and warnings and Important notes at the end of this document. Dry heat Tb / 16 h Damp heat cyclic, 1st cycle +55 °C / 24 h / 95% ... 100% RH Cold Ta / 2 h Damp heat cyclic, 5 cycles +55 °C / 24 h / 95% ... 100% RH Page 7 of 19 No visible damage ΔC/C0 ≤ 5% Δ tan δ ≤ 0.008 for C ≤ 1 μF Δ tan δ ≤ 0.005 for C > 1 μF Voltage proof Rins ≥ 50% of initial limit B81123 Y1 / 500 V AC Test Reference Damp heat, IEC steady 60384-14:2013/ state AMD1:2016 Impulse test Endurance IEC 60384-14:2013/ AMD1:2016 Passive IEC flammability 60384-14:2013/ AMD1:2016 Conditions of test Test Ca 40 °C / 93% RH / 56 days 3 impulses Tb / 1.7 VR / 1000 hours, 1000 VRMS for 0.1 s every hour Flame applied for a period of time depending on capacitor volume Performance requirements No visible damage ΔC/C0 ≤ 5% Δ tan δ ≤ 0.008 for C ≤ 1 μF Δ tan δ ≤ 0.005 for C > 1 μF Voltage proof Rins ≥ 50% of initial limit No visible damage ΔC/C0 ≤ 10% Δ tan δ ≤ 0.008 for C ≤ 1 μF Δ tan δ ≤ 0.005 for C > 1 μF Voltage proof Rins ≥ 50% of initial limit B Mounting guidelines 1 Soldering 1.1 Solderability of leads The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. Solder bath temperature 235 ±5 °C Soldering time 2.0 ±0.5 s Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane Evaluation criteria: Visual inspection Please read Cautions and warnings and Important notes at the end of this document. Wetting of wire surface by new solder ≥90%, free-flowing solder Page 8 of 19 B81123 Y1 / 500 V AC 1.2 Resistance to soldering heat Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1. Conditions: Series Solder bath temperature Soldering time MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C coated uncoated (lead spacing >10 mm) MFP MKP (lead spacing >7.5 mm) MKT boxed (case 2.5 × 6.5 × 7.2 mm) MKP (lead spacing ≤7.5 mm) MKT uncoated (lead spacing ≤10 mm) insulated (B32559) 10 ±1 s 5 ±1 s