B82145A1335J000

Inductors RF chokes, HLBC series Series/Type: B82145A Date: June 2012 a~í~=pÜÉÉí  EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. RF chokes B82145A HLBC series, 6.5 x 12 (mm) HLBC choke (High-Current Large Bobbin Core) Rated inductance 100 ... 10 000 μH Rated current 110 ... 860 mA Construction ■ Large ferrite drum core ■ Winding: enamel copper wire ■ Flame-retardant lacquer coating Features ■ High rated current at high inductance ratings ■ Radial leads in bulk on request (B82145C) ■ Suitable for wave soldering ■ RoHS-compatible Applications ■ Decoupling ■ Interference suppression ■ For energy-saving lamps and entertainment electronics Terminals ■ ■ ■ ■ Central axial leads (B82145A) Radially bent to 5mm lead spacing (B82145C) Base material CuAg0.1 Electroplated with nickel and pure tin Marking Inductance indicated by color bands to IEC 60062 Delivery mode and packing unit ■ Taped and reeled Packing unit: 1250 pcs./reel ■ Bulk packaging for radially bent Packing unit: 200 pcs./polyethylene bag Please read Cautions and warnings and Important notes at the end of this document. 2 06/12 RF chokes B82145A HLBC series, 6.5 x 12 (mm) Dimensional drawing ø6.5 max. 12 max. (IEC 60294) 6±0.5 10±0.25 10±0.25 ø0.8 max. 65±1 53±2 3.5 min. 14.8 max. lacquered Dimensions in mm Minimum lead spacing 15 mm IND0432-V-E n w 30 30 ø360 _ 1 ø30.5±0.15 ø82+1 ø90 Packing Label 30 Dimensions in mm IND0452-V-E n (mm): 72 +1 w (mm): 84 max Please read Cautions and warnings and Important notes at the end of this document. 3 06/12 RF chokes B82145A HLBC series, 6.5 x 12 (mm) Technical data and measuring conditions Rated inductance LR Measured with LCR meter Agilent 4284A or impedance analyzer Agilent 4294A Measuring frequency: 100 PH < LR d 4700 PH= 100 kHz LR > 4700 PH = 10 kHz Measuring current: d 1 mA Measuring temperature: +20 °C Q factor Qmin Measured with precision impedance analyzer Agilent 4294A, +20 °C Rated temperature TR +40 qC Rated current IR Maximum permissible DC current at rated temperature Inductance decrease 'L/L0 d10% (referred to initial value) at IR, +20 qC DC resistance Rmax Measured at +20 qC Resonance frequency fres,min Measured with Agilent 4294A or 8753ES, +20 °C Solderability (lead-free) Sn95.5Ag3.8Cu0.7: +(245 r5) °C, (3 r0.3) s Wetting of soldering area t90% (to IEC 60068-2-20, test Ta) Resistance to soldering heat +(260 r5) °C, 10 s (to IEC 60068-2-20, test Tb) Tensile strength of leads t20 N (to IEC 60068-2-21, test Ua) Climatic category 55/125/56 (to IEC 60068-1) Storage conditions Mounted: –55 °C … +125 °C Packaged: –25 °C … +40 °C, d75% RH Weight Approx. 1.3 g Mounting information When bending the leads, take care that the start-of-winding areas at the face ends (protected by glue and lacquer) are not subjected to any mechanical stress. Please read Cautions and warnings and Important notes at the end of this document. 4 06/12 RF chokes B82145A HLBC series, 6.5 x 12 (mm) Characteristics and ordering codes Tolerance1) fQ IR Rmax fres,min MHz mA : MHz 50 0.796 860 0.70 3.5 B82145A1104J000 150 40 0.796 770 0.90 3.0 B82145A1154J000 220 30 0.796 690 1.10 2.5 B82145A1224J000 330 30 0.796 630 1.30 2.1 B82145A1334J000 470 30 0.796 510 1.90 1.8 B82145A1474J000 680 20 0.796 440 2.50 1.5 B82145A1684J000 1000 60 0.252 370 3.60 1.3 B82145A1105J000 1500 60 0.252 300 5.40 1.0 B82145A1155J000 2200 60 0.252 250 8.00 0.8 B82145A1225J000 3300 60 0.252 200 12.5 0.6 B82145A1335J000 4700 60 0.252 170 18.0 0.5 B82145A1475J000 6800 60 0.252 130 28.5 0.4 B82145A1685J000 10000 50 0.0796 110 35.0 0.35 B82145A1106J000 LR Qmin PH 100 r5% ^ J Ordering code HLBC chokes with diameter 7.5 and 8.5 mm for even higher rated currents available on request. HLBC chokes with temperature range up to +140 qC available on request. 1) Closer tolerances on request. Please read Cautions and warnings and Important notes at the end of this document. 5 06/12 RF chokes B82145A HLBC series, 6.5 x 12 (mm) Inductance L versus DC load current IDC measured with LCR meter Agilent 4284A, typical values at +20 °C Impedance |Z| versus frequency f measured with impedance analyzer Agilent 4294A or S-parameter network analyzer Agilent 8753ES, typical values at +20 °C IND0139-Q 10 7 Ω B82145A |Z| 10 6 IND0140-W 10 5 B82145A μH L 10000 μH 1000 μH 10 5 10000 μH 10 4 100 μH 10 4 1000 μH 10 3 10 3 10 2 100 μH 10 2 10 1 10 0 5 10 10 6 10 7 10 1 _2 10 Hz 10 8 f Q factor versus frequency f measured with impedance analyzer Agilent 4294A, typical values at +20 °C _1 10 0 A 10 1 I DC Current derating Iop/IR versus ambient temperature TA (rated temperature TR = +40 qC) IND0141-R 200 10 IND0552-S-E 1.2 B82145A Iop IR Q 1.0 0.8 100 0.6 100 μH 1000 μH 10000 μH 0.4 0.2 0 4 10 10 5 10 6 0 Hz 10 7 f 0 20 40 60 80 100 ˚C TA 6 06/12 140 Cautions and warnings ■ Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. ■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. ■ Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Please read Cautions and warnings and Important notes at the end of this document. 7 06/12 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdkelectronics.tdk.com/trademarks. Release 2018-10 8 06/12